AUDIO PCB LAYOUT GUIDELINES

92HD81/83
SINGLE CHIP PC AUDIO SYSTEM CODEC+SPEAKER AMPLIFIER+CAPLESS HP+LDO

1.

General Requirements: 1.1. Audio components (i.e. HDA CODEC and audio jacks) must be placed as close together as possible, preferably on the same side of PCB. 1.2. Microphones (Digital or Analog) must be placed as far away from noise-producing components as possible. Recommend a minimum 6 inch distance from hard drives, fans, speakers, disc drives, etc. 1.2.1. For Digital Microphones, the best placement is in the top of the LCD bezel. This allows the microphones to be located away from noise sources and directly in the vocal path. 1.2.2. For array microphones, system designers should follow the spacing and placement guidelines set forth in Microsofts Mic Array guidelines document located here: http://www.microsoft.com/whdc/device/audio/micarrays.mspx Failure to follow the guidelines in this document may result in poor array microphone performance. 1.3. Route as many analog traces as possible on same layer as audio components (4-7 mil width). Maintain at least one ground plane between audio signals and any other digital signals. 1.4. Audio circuit and jacks should not be in close proximity to the following noisy components: 1.4.1. IR Blaster minimum distance 2 inches; signal traces must be on separate layers from the audio circuit and avoid parallel runs to any analog audio signals 1.4.2. Switching power regulators and associated inductors minimum distance 3 inches recommended. Minimum distance 1.5 inches required. 1.4.3. USB Jacks If USB jacks placed next to audio jacks, extreme care must be taken with the signal routing. Highly recommend cutting AGND in this case. USB signal traces and USB power must be on separate layers from the audio circuit and avoid parallel runs to any analog audio signals. 1.4.4. IEEE1394 Jacks If IEEE1394 jacks placed next to audio jacks, extreme care must be taken with the signal routing. Highly recommend cutting AGND in this case. IEEE1394 signal traces must be on separate layers from the audio circuit and avoid parallel runs to any analog audio signals. 1.4.5. Media Card Readers If Media Card Reader sockets placed next to audio jacks, extreme care must be taken with the signal routing. Highly recommend cutting AGND in this case. Media Card signal traces and power must be on separate layers from the audio circuit and avoid parallel runs to any analog audio signals. Grounding: 2.1. IDT always recommends separate Analog and Digital ground planes for the optimum audio performance. 2.1.1. AGND should be implemented on ALL ground layers. 2.1.2. AGND shapes should be exactly the same on all ground layers 2.1.3. All analog signals should always remain over AGND. Never route analog signals across the AGND-DGND moat. 2.1.4. All digital signals should always remain over DGND. Never route digital signals across the AGND-DGND moat. 2.1.5. The AGND-DGND moat should be minimum 5 mils wide, recommend 10 mils. 2.1.6. AGND should be directly tied to DGND in the copper using a minimum 100 mil wide trace. Recommend using the DAP pad under the codec to tie AGND and DGND together.

2.

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2.2.

Thermal pad under codec MUST be connected to ground. 2.2.1. Codec needs to have multiple thermal vias (minimum 8, recommend 12) which have a continuous connection to all GND planes (AGND and DGND) for proper heat dissipation.

2.2.2. 2.2.3. 2.2.4. 2.2.5. 2.2.6.

Thermal land on motherboard should be as big as possible. Target the size of the amplifier package minus 20 mils as a minimum. Via-to-thermal land area should be approximately 4%. Via to via spacing should be 1.5 mm from the center of the vias.. Via diameter = 10-13 mils Vias need to be thermal vias i.e., 360 deg of contact around the via

3.

Codec: 3.1. DVDD_CORE, VREFFILT, V-, CAP2, CAP+/CAP-, and VREG components are close to codec (within 200 mils). Recommend that these components are on the same layer as the codec. 3.2. SDATA_IN series resistor is close to codec (within 300 mils) 3.3. BITCLK AC termination is close to codec (within 300 mils) 3.4. SDATA_OUT AC termination is close to codec (within 300 mils) 3.5. HDAudio signals meet Intel required guidelines for trace impedance. (Varies depending on PCB stackup). 3.6. DVDD bulk capacitors are close to codec (within 300 mils) 3.7. AVDD bulk capacitors are close to codec (within 300 mils) 3.8. PVDD bulk capacitors are close to the codec (within 300 mils) 3.9. DVDD, DVDD_IO, AVDD, PVDD decoupling capacitors are close to codec (within 200 mils) 3.10. SENSE_A and SENSE_B components (pullup resistors and stabilizing capacitors) are close to codec (within 500 mils) 3.11. Ensure proper trace width to AVDD (minimum 20 mils from source) 3.12. Ensure proper trace width to DVDD (minimum 20 mils from source) 3.13. PVDD is expected to consume 1.5A from the 5V rail when powering 4-ohm speakers. PVDD is expected to consume 0.75A from the 5V rail when powering 8-ohm speakers. Ensure proper power rail capability and power trace width to PVDD (minimum 40 mils from source).

4.

Internal Analog Microphones: 4.1. If a microphone preamplifier is used, the internal analog microphone signals should be routed differentially to the preamplifier (4mil width with 4mil parallel trace spacing, with a minimum of 10mil spacing from all other signals). 4.2. Any differential-to-single-ended microphone preamplifier should be placed as close as possible to the audio codec (within 500 mils). 4.3. If a microphone preamplifier is not used, the analog microphone signal should be 4 mils wide with a minimum 20 mils spacing to all other signals. Avoid parallel routing with digital switching and high-speed signals such as USB, 1394, etc. 4.4. For stereo analog microphones, minimum space between signals should be 10 mils.

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5.

Line In/Microphone In Jack: 5.1. Ensure EMC components (L's and C's) are located close to jack (within 200 mils) 5.2. VREFOUT from codec must provide proper power to microphone bias circuit (minimum 10 mils). This trace must be referenced to ground. This signal must be on a layer adjacent to a ground plane. 5.3. Traces should be 5 mils wide and routed 10 mils apart. Also, maintain 10 mils separation from any other signals. 5.4. Ensure that line in/microphone traces are referenced to ANALOG ground. These signals must be on a layer adjacent to an ANALOG ground plane. Headphone Jack: 6.1. Ensure EMC components (L's and C's) are located close to jack (within 200 mils) 6.2. LEFT and RIGHT headphone output traces must be 5 mils. Recommend 7-10 mils. 6.3. Ensure that headphone traces are referenced to ANALOG ground. These signals must be on a layer adjacent to an ANALOG ground plane.

6.

7.

Internal Speaker Output: 7.1. Speaker traces are differential by nature and do NOT need to be referenced to ANALOG ground. These signals may route across the AGND-DGND moat as necessary and may be referenced to DIGITAL ground. If the speaker connector over a digital ground plane, it is recommended to NOT extend the analog ground plane underneath the speaker traces. Simply maintain a digital ground plane reference. 7.2. Speaker trace width needs to be designed to insure that there is limited power drop across output traces (typically <10% of rated output power). Typical trace is 40 mils. Use the attached trace resistance calculator to determine the expected power loss. Please see the attachment icon or screen at the bottom of your Acrobat Reader window to access the trace calculator. Acrobat Reader 7.0 or higher is required. To download: http://www.adobe.com/products/ 7.3. Speaker connector EMC components (C's) should be located close to speaker connector (within 200 mils)

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