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BurrBrown Products

from Texas Instruments


OPA132
IVC102
DAC8831

DAC
DAC8830
SDI
SCLK
CS
V
REF
DGND
V
OUT
AGND
S
e
r
i
a
l
I
n
t
e
r
f
a
c
e
Input
Register
DAC Latch
RFB
INV
AGNDF
AGNDS
DGND
DAC
DAC Latch
Input
Register
DAC8831
DAC8831
Functional Block Diagram
DAC8830
Functional Block Diagram
+

+V
V
OPA277
OPA704
OPA727
SDI
SCLK
LDAC
V
OUT
V
O
V
DD
R
FB
R
INV
V
REF
F V
REF
S
S
e
r
i
a
l
I
n
t
e
r
f
a
c
e
a
n
d
C
o
n
t
r
o
l
L
o
g
i
c
V
DD
CS

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1
2
3
4
8
7
6
5
V
DD
DGND
SDI
SCLK
V
OUT
AGND
V
REF
CS
D
A
C
8
8
3
0
1
2
3
4
5
6
7
14
13
12
11
10
9
8
RFB
V
OUT
AGNDF
AGNDS
V
REF
S
V
REF
F
CS
V
DD
INV
DGND
LDAC
SDI
NC
SCLK
D
A
C
8
8
3
1
DAC8831
Thermal Pad
(1)
I
N
V
D
G
N
D
L
D
A
C
S
D
I
N
C
V
O
U
T
A
G
N
D
F
A
G
N
D
S
V
R
E
F

S
V
R
E
F

F
2 3 5 6 4
13 12 10 9 11
14
1
V
DD
RFB
SCLK
CS
8
7
NOTE: (1) Exposed thermal pad in the QFN package
must be connected to analog ground.

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BIT14 BIT13, . . . ,1 BIT15 (MSB) BIT0
DAC
Updated
t
Delay
t
Lead
t
wsck
t
td
t
wsck
t
Lag
t
DSCLK
t
su t
ho
CS
SCLK
SDI
t
sck
--- Don't Care
DAC
Updated
Dont Care
t
Delay
t
Lead
t
wsck
t
td
t
wsck
t
Lag
t
DSCLK
t
su t
ho
CS
SCLK
SDI
LOW LDAC
DAC
Updated
Dont Care
t
Delay
t
Lead
t
wsck
t
td
t
wsck
t
Lag
t
DSCLK
t
su t
ho
CS
SCLK
SDI
HIGH
LDAC
Case1: LDAC tied to LOW
Case2: LDAC Active
t
DLADC
t
WLDAC
t
sck
t
sck
BIT 15 (MSB) BIT 14 BIT 13, . . . ,1 BIT 0
BIT 15 (MSB) BIT 14 BIT 13, . . . ,1 BIT 0

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8192 0 65536 57344 49152 40960 32768 24576 16384


Digital Input Code
T
A
= +25_C
V
REF
= 2.5 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
I
N
L
(
L
S
B
)
8192 0 65536 57344 49152 40960 32768 24576 16384
Digital Input Code
T
A
= +25_C
V
REF
= 2.5 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
D
N
L
(
L
S
B
)
8192 0
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
65536 57344 49152 40960 32768 24576 16384
Digital Input Code
I
N
L
(
L
S
B
)
T
A
= 40_C
V
REF
= 2.5 V
8192 0 65536 57344 49152 40960 32768 24576 16384
Digital Input Code
T
A
= 40_C
V
REF
= 2.5 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
D
N
L
(
L
S
B
)
8192 0 65536 57344 49152 40960 32768 24576 16384
Digital Input Code
T
A
= +85_C
V
REF
= 2.5 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
I
N
L
(
L
S
B
)
8192 0 65536 57344 49152 40960 32768 24576 16384
Digital Input Code
T
A
= +85_C
V
REF
= 2.5 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
D
N
L
(
L
S
B
)

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8192 0 65536 57344 49152 40960 32768 24576 16384
Digital Input Code
T
A
= +25_C
V
REF
= 5 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
I
N
L
(
L
S
B
)
8192 0 65536 57344 49152 40960 32768 24576 16384
Digital Input Code
T
A
= +25_C
V
REF
= 5 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
D
N
L
(
L
S
B
)
0.75
0.50
0.25
0
0.25
0.50
L
i
n
e
a
r
i
t
y
E
r
r
o
r
(
L
S
B
)
Reference Voltage (V)
0 2 4 6 5 3 1
INL
DNL
0.75
0.50
0.25
0
0.25
0.50
L
i
n
e
a
r
i
t
y
E
r
r
o
r
(
L
S
B
)
Supply Voltage (V)
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
V
REF
= 2.5 V
DNL
INL
60 40 20 0 20 40 60 80 140 120 100
Temperature (_C)
V
REF
= 2.5 V
Bipolar Mode
Unipolar Mode
1.25
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
G
a
i
n
E
r
r
o
r
(
L
S
B
)
60 40 20 0 20 40 60 80 140 120 100
Temperature (_C)
V
REF
= 2.5 V
Bipolar Mode
Unipolar Mode
0.50
0.25
0
0.25
0.50
Z
e
r
o

C
o
d
e
E
r
r
o
r
(
L
S
B
)

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8192 0
300
250
200
150
100
50
0
65536 57344 49152 40960 32768 24576 16384
Digital Input Code
R
e
f
e
r
e
n
c
e
C
u
r
r
e
n
t
(

A
)
V
REF
= 2.5 V
8192 0
300
250
200
150
100
50
0
65536 57344 49152 40960 32768 24576 16384
Digital Input Code
R
e
f
e
r
e
n
c
e
C
u
r
r
e
n
t
(

A
)
V
REF
= 2.5 V
0 1 2 3 4 5
Digital Input Voltage (V)
V
DD
= 5 V
V
DD
= 3 V
800
700
600
500
400
300
200
100
0
S
u
p
p
l
y
C
u
r
r
e
n
t
(

A
)
60 40 20 0 20 40 60 80 140 120 100
Temperature (_C)
V
DD
= 5 V
V
LOGIC
= 5 V
V
DD
= 3 V
V
LOGIC
= 3 V
V
REF
= 2.5 V
5
4
3
2
1
0
S
u
p
p
l
y
C
u
r
r
e
n
t
(

A
)
2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7 6.0
Supply Voltage (V)
V
REF
= 2.5 V
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
S
u
p
p
l
y
C
u
r
r
e
n
t
(

A
)
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.5 4.0 5.0
Reference Voltage (V)
V
DD
= 5 V
V
DD
= 3 V
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
S
u
p
p
l
y
C
u
r
r
e
n
t
(

A
)

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5V/div
0.1V/div
Time (0.5ms/div)
LDAC
V
OUT
V
REF
= 2.5V
Time (0.5 s/div) m
V = 2.5V
REF
LDAC
V
OUT
5V/div
0.1V/div
Time (0.2 s/div) m
V = 2.5V
REF
LDAC
V
OUT
5V/div
1V/div
Time (0.2ms/div)
V
REF
= 2.5V
LDAC
V
OUT
5V/div
1V/div
Time (50ns/div)
V
REF
= 2.5 V
SDI
V
OUT
5V/div
20mV/div

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8192 0 65536 57344 49152 40960 32768 24576 16384


Digital Input Code
T
A
= +25_C
V
REF
= 1.5 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
I
N
L
(
L
S
B
)
8192 0 65536 57344 49152 40960 32768 24576 16384
Digital Input Code
T
A
= +25_C
V
REF
= 1.5 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
D
N
L
(
L
S
B
)
8192 0 65536 57344 49152 40960 32768 24576 16384
Digital Input Code
T
A
= 40_C
V
REF
= 1.5 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
I
N
L
(
L
S
B
)
8192 0 65536 57344 49152 40960 32768 24576 16384
Digital Input Code
T
A
= 40_C
V
REF
= 1.5 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
D
N
L
(
L
S
B
)
8192 0 65536 57344 49152 40960 32768 24576 16384
Digital Input Code
T
A
= +85_C
V
REF
= 1.5 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
I
N
L
(
L
S
B
)
8192 0 65536 57344 49152 40960 32768 24576 16384
Digital Input Code
T
A
= +85_C
V
REF
= 1.5 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
D
N
L
(
L
S
B
)

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8192 0 65536 57344 49152 40960 32768 24576 16384
Digital Input Code
T
A
= +25_C
V
REF
= 3 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
I
N
L
(
L
S
B
)
8192 0 65536 57344 49152 40960 32768 24576 16384
Digital Input Code
T
A
= +25_C
V
REF
= 3 V
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
D
N
L
(
L
S
B
)
60 40 20 0 20 40 60 80 140 120 100
Temperature (_C)
V
DD
= 3 V
V
REF
= 2.5 V
Bipolar Mode
Unipolar Mode
1.00
0.75
0.50
0.25
0
0.25
0.50
0.75
1.00
G
a
i
n
E
r
r
o
r
(
L
S
B
)
0.75
0.50
0.25
0
0.25
0.50
L
i
n
e
a
r
i
t
y
E
r
r
o
r
(
L
S
B
)
Reference Voltage (V)
0.5 1.5 2.5 3.5 3.0 2.0 1.0
DNL
INL
60 40 20 0 20 40 60 80 140 120 100
Temperature (_C)
V
DD
= 3 V
V
REF
= 2.5 V
Bipolar Mode
Unipolar Mode
0.50
0.25
0
0.25
0.50
0.75
Z
e
r
o

C
o
d
e
E
r
r
o
r
(
L
S
B
)
8192 0
300
250
200
150
100
50
0
65536 57344 49152 40960 32768 24576 16384
Digital Input Code
R
e
f
e
r
e
n
c
e
C
u
r
r
e
n
t
(

A
)
V
REF
= 1.5 V

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Time (50ns/div)
V
REF
= 2.5 V
SDI
V
OUT
5V/div
20mV/div
8192 0
300
250
200
150
100
50
0
65536 57344 49152 40960 32768 24576 16384
Digital Input Code
R
e
f
e
r
e
n
c
e
C
u
r
r
e
n
t
(

A
)
V
REF
= 1.5 V
Time (0.5ms/div)
LDAC
V
OUT
V
REF
= 2.5V
5V/div
0.1V/div
Time (0.5 s/div) m
V
REF
= 2.5V
LDAC
V
OUT
5V/div
0.1V/div
Time (0.2ms/div)
V
REF
= 2.5V
LDAC
V
OUT
5V/div
1V/div
Time (0.2ms/div)
V = 2.5V
REF
LDAC
V
OUT
5V/div
1V/div

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R R
12Bit R2R Ladder Four MSBs Decoded into
15 Equal Segments
2R 2R 2R 2R
S0 S1 S11
2R
V
OUT
E15
2R
E2
2R
E1
V
REF

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DAC
DAC8830
SDI
SCLK
CS
DGND
V
OUT
0.1 F
V
O
= 0 to +V
REF
AGND
S
e
r
i
a
l
I
n
t
e
r
f
a
c
e
Input
Register
DAC Latch
V
DD
V
REF
+5 V +2.5 V
OPA277
OPA704
OPA727
+
0.1 F 10 F

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0.1 F
V
DD
+5 V
RFB
INV
AGNDF
AGNDS
DAC
DAC Latch
Input
Register
DAC8831
+V
V
SDI
SCLK
LDAC
V
OUT
R
FB
R
INV
V
REF
S V
REF
F
S
e
r
i
a
l
I
n
t
e
r
f
a
c
e
a
n
d
C
o
n
t
r
o
l
L
o
g
i
c
CS
+2.5 V
+
0.1 F 10 F
DGND
V
O
= 0 to +V
REF
OPA277
OPA704
OPA727
V
OUT_UNI
+
D
2
16

V
REF
)V
GE

)V
ZSE
)INL

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0.1 F
V
DD
+5 V
RFB
INV
AGNDF
AGNDS
DAC
DAC Latch
Input
Register
DAC8831
+V
V
SDI
SCLK
LDAC
V
OUT
R
FB
R
INV
V
REF
S V
REF
F
S
e
r
i
a
l
I
n
t
e
r
f
a
c
e
a
n
d
C
o
n
t
r
o
l
L
o
g
i
c
CS
+2.5 V
+
0.1 F 10 F
DGND
V
O
= V
REF
to +V
REF
OPA277
OPA704
OPA727
V
OUT_BIP
+

V
OUT_UNI
)V
OS
(2 )RD) *V
REF
(1 )RD)
1 )

2)RD
A

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PACKAGE OPTION ADDENDUM


www.ti.com 24-Jan-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (C) Top-Side Markings
(4)
Samples
DAC8830IBD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC
8830I
DAC8830IBDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC
8830I
DAC8830IBDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC
8830I
DAC8830IBDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC
8830I
DAC8830ICD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC
8830I
DAC8830ICDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC
8830I
DAC8830ICDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC
8830I
DAC8830ICDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC
8830I
DAC8830ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC
8830I
DAC8830IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC
8830I
DAC8830IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC
8830I
DAC8830IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC
8830I
DAC8831IBD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC8831I
DAC8831IBDG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC8831I
DAC8831IBDR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC8831I
DAC8831IBDRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC8831I
DAC8831IBRGYR ACTIVE VQFN RGY 14 3000 Green (RoHS
& no Sb/Br)
Call TI Level-2-260C-1 YEAR -40 to 85 BKE
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jan-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (C) Top-Side Markings
(4)
Samples
DAC8831IBRGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS
& no Sb/Br)
Call TI Level-2-260C-1 YEAR -40 to 85 BKE
DAC8831IBRGYT ACTIVE VQFN RGY 14 250 Green (RoHS
& no Sb/Br)
Call TI Level-2-260C-1 YEAR -40 to 85 BKE
DAC8831IBRGYTG4 ACTIVE VQFN RGY 14 250 Green (RoHS
& no Sb/Br)
Call TI Level-2-260C-1 YEAR -40 to 85 BKE
DAC8831ICD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC8831I
DAC8831ICDG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC8831I
DAC8831ICDR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC8831I
DAC8831ICDRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC8831I
DAC8831ICRGYR ACTIVE VQFN RGY 14 3000 Green (RoHS
& no Sb/Br)
Call TI Level-2-260C-1 YEAR -40 to 85 BKE
DAC8831ICRGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS
& no Sb/Br)
Call TI Level-2-260C-1 YEAR -40 to 85 BKE
DAC8831ICRGYT ACTIVE VQFN RGY 14 250 Green (RoHS
& no Sb/Br)
Call TI Level-2-260C-1 YEAR -40 to 85 BKE
DAC8831ICRGYTG4 ACTIVE VQFN RGY 14 250 Green (RoHS
& no Sb/Br)
Call TI Level-2-260C-1 YEAR -40 to 85 BKE
DAC8831ID ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC8831I
DAC8831IDG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC8831I
DAC8831IDR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC8831I
DAC8831IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC8831I
DAC8831IRGYR ACTIVE VQFN RGY 14 3000 Green (RoHS
& no Sb/Br)
Call TI Level-2-260C-1 YEAR -40 to 85 BKE
DAC8831IRGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS
& no Sb/Br)
Call TI Level-2-260C-1 YEAR -40 to 85 BKE
DAC8831IRGYT ACTIVE VQFN RGY 14 250 Green (RoHS
& no Sb/Br)
Call TI Level-2-260C-1 YEAR -40 to 85 BKE
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jan-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (C) Top-Side Markings
(4)
Samples
DAC8831IRGYTG4 ACTIVE VQFN RGY 14 250 Green (RoHS
& no Sb/Br)
Call TI Level-2-260C-1 YEAR -40 to 85 BKE

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
Only one of markings shown within the brackets will appear on the physical device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.


OTHER QUALIFIED VERSIONS OF DAC8830, DAC8831 :

Enhanced Product: DAC8830-EP, DAC8831-EP



NOTE: Qualified Version Definitions:

Enhanced Product - Supports Defense, Aerospace and Medical Applications


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