DI-182 Design Idea TOPSwitch-HX

Standard 65 W Notebook Adapter Which Meets Requirements for Energy Star 2.0 (ES 2.0)
Application
Notebook

Device
TOP259EN

Power Output
65 W

Input Voltage
90 265 VAC

Output Voltage
19 V 5%

Topology
Flyback

Design Highlights Very compact, low part-count Low prole eSIP-7C Single-Inline package Same thermal impedance characteristics as standard TO-220 package Allows lower overall height and smaller board footprint Clip mounted eSIP package easily passes shock and vibration test to IEC60068 Highly energy efcient Very low no-load input power: <250 mW at 230 VAC High average efciency: >87.5% meeting ENERGY STAR v2.0 draft requirements (measured at the end of cable: 1.8 m, 18 AWG, 100 m impedance) 132 kHz operation allows small transformer (EE28) Internal current-limit reduction vs line-voltage increase removes need for secondary side current limiting used to meet powerlimited source requirements Accurate hysteretic thermal shutdown protection Timed over-load protection with automatic recovery Meets CISPR-22/EN55022 B conducted EMI limits

Operation The power supply design shown in Figure 1 utilizes the TOP259EN. The TOPSwitch-HX products integrate a 700 V MOSFET with a multi-function PWM controller in one device. The optimized combination of switching MOSFET and integrated driver present for low switching loss enable a highly efcient and compact 65 W notebook power supply able to safely operate in a sealed enclosure up to an ambient temperature of 40 C. The bridge rectier BR1, at the input of the power supply, recties the line input; electrolytic capacitor C2 lters the input. Fuse F1 protects against catastrophic failure. Common mode EMI is ltered by L1, L2, L3, C3, and C11. Common-mode choke L2 lters lower frequencies while L3 lters higher frequencies. Differential ltering is provided by the leakage inductance of L2 and X capacitor C1. As C1 has a capacitance greater than 0.1 F, discharge resistors R1 and R2 are required to discharge C1 after removal of AC. To reduce differential EMI generation C5 provides decoupling for the primary switching current.
C11 2.2 nF 250 VAC C12 1 nF R16 100 V 33 C14 C13 470 F 470 F 25 V 25 V D6 MBR20100CT R10 C10 VR1 22 F 301 1N5248B 1% 50 V 18 V D5 BAV 19WS R11 2 M C8 100 nF 50 V RTN

C4 2.2 nF 1 kV BR1 3KBP08M R6 33 R3 2.0 M R7 5.1 M

T1 1 EE28 FL1 R5 100 k 1/2 W 3

19 V, 3.42 A

FL2

D1 DL4937

L3 12 mH L2 200 H C2 120 F 400 V

R4 2.0 M

R8 6.8 M C5 100 nF 400 V

R22 C19 20 k 470 pF 50 V R12 5.1 k D3 BAV19WS TOPSwitch-HX U1

D V TOP259EN CONTROL C

R18 680

R1 R2 2.2 M 2.2 M F1 4A L
S X

C9 100 nF 25 V

U3B ISP817C

U3A ISP817C

C1 330 nF 275 VAC

R19 C17 68.1 k 100 nF R15 6.8 C7 47 F 16 V R21 1 k U2 LM431 2%

E N 90 - 265 VAC L1 Ferrite Bead C3 470 pF 250 VAC R9 14 k 1%

C6 100 nF 50 V

R20 10 k 1%
PI-5023-071408

Figure 1: Schematic of a 65 W Notebook Adapter Power Supply Using TOPSwitch-HX TOP259EN.

www.powerint.com

July 2008

The TOP259EN, with its integrated multi-mode controller, is used in a yback conguration. It maintains output regulation by changing the duty cycle as a function of the control pin current. To maintain high efciency across the whole load range, the multimode controller changes between pulse width modulation and xed on-time variable frequency control. To provide constant output overload power with changing line voltage, as line voltage increases, resistors R7, R8, and R9 reduce the internal current limit of the TOP259EN. This allows the supply to limit the output overload power to <100 VA at high line, while still delivering the rated output at low line. The primary sides output overvoltage protection (OVP) senses the bias-winding voltage using Zener diode VR1. This is used to provide both open-loop protection and output-overload protection under a single-fault condition. Resistors R10 and R11 with capacitor C8 determine the delay before shutdown is triggered. This prevents false triggering during startup and load transients. The value of R12 selects the hysteretic shutdown behavior of U1. Capacitor C9 helps to lter high frequency noise that may appear on the V pin. The output is rectied by diode D6 which has an RC snubber (C12 and R16) to dampen leakage inductance ringing and reduce radiated EMI. The output is ltered by capacitors C13 and C14. Feedback is derived from the output via optocoupler U3A. Resistor R18 sets the DC gain. Shunt regulator U2 has an accurate internal voltage reference, and with resistors R19 and R20, sets the output voltage to 19 V. Diode D3 prevents loading of the V pin by the OVP circuit and also isolates the line sense circuit from the OVP circuit.

Key Design Points Verify that the maximum drain voltage does not exceed 650 V at high line and maximum overload. Adjust the values of C4 and R5 as necessary. Resistor R6 dampens high frequency ringing and improves EMI. Select the value of VR1 such that it does not falsely trigger OVP. VR1 should be chosen above the bias-winding voltage measured under low line and full load conditions. If latching OVP is desired, select R12 as 20 . U1 does not require an insulating pad for reduced EMI. It has a tab connected to the electrically quiet source.
PI-5049-032508

80 70 60 50 40
QP AV

dBV

30 20 10 0 -10 -20 0.15 1.0 10.0 100.0

MHz
Figure 3. Conducted EMI, EN55022 B Limits. Measurements Made at 230 VAC With 5.6 Resistive Load (Output Grounded).

Transformer Parameters
Core Material
PI-5048-032508

EE28, TDK or equivalent, gapped for ALG of 299 nH/t Vertical 10 pin, pin 6 to pin 10 are to be removed Bias: 5T 3, 30 AWG Primary 1: 17T 2, 26 AWG Shield: 1T Cu foil, 1 mil thick Secondary: 6T 4, 26 AWG-TIW Shield: 1T Cu foil, 1 mil thick Primary 2: 17T 2, 25 AWG Bias (45), Primary-1 (32), Shield (1NC), Secondary (FL1FL2), Shield (1NC), Primary-2 (21)

320 280

Bobbin

Input Power (mW)

240 200 160

Winding Details

Winding Order

120 80 40 0

Primary Inductance 343 H, 5% at 132 kHz Primary Resonant Frequency Leakage Inductance 1.1 MHz (minimum) 4 H (maximum)

90

115

140

165

190

215

240

265

Input Voltage (VAC)

Figure 2. No Load Input Power vs. Line Voltage.

Table 1. Transformer Parameters. (AWG = American Wire Gauge, TIW = Triple Insulated Wire, NC = No Connection)

Power Integrations 5245 Hellyer Avenue San Jose, CA 95138, USA. Main: +1 408-414-9200 Customer Service Phone: +1-408-414-9665 Fax: +1-408-414-9765 Email: usasales@powerint.com On the Web www.powerint.com A 07/08

Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. The products and applications illustrated herein (transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations' patents may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm. The PI logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, EcoSmart, Clampless, E-Shield, Filterfuse, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. 2008, Power Integrations, Inc.

DI-182