1.a. Make a plot of bonding energy versus melting temperature for the metals listed in Table Using this plot, approximate the bonding energy for copper, which has a melting temperature of 10!"#. b. $riefly cite the main differnces between ionic,covalent and metallic bonding. %ive its relation with the materials properties and its examples
&. 'teel alloy is known to contain (!.) wt* +e, ).0 wt* ,i, , 1* wt* of #r and 0.! wt* #. -a. /hat is the approximate eutectoid temperature of this alloy0 -b. /hat is the proeutectoid phase when this alloy is cooled to a temperature 1ust below the eutectoid0 -c. #ompute the relative amounts of the proeutectoid phase and pearlite. 2ssume that there are no alterations in the positions of other phase boundaries with the addition of ,i . d..'how the changes in crystal structure during cooling process from 1000 o # to room temperature.
Figure 1 Figure !" a. $y using +igure 1 aboves, /hich materials has the highest 'trength, explain your answer by comparing the strength of each materials. b. /hich materials has the highest toughness, explain your answer using the data of figure 1 c. +rom figure & aboves, which materials have the highest stiffness, explain your answer by calculating the Modulus 3lasticity -3. of each materials -in 2rbitrary units.. d. 'how in +igure & aboves, which materials has the highest ductility0 3xplain your answer using the stress4strain diagram. !. a. . 'how in figure 5 belows the composition of 3utectoid, 6ypoeutectoid and hyper eutectoid, and shows their microstructure at room temperature b.. 'how the #ast 7ron 4#arbon #omposition range, and types of cast 7ron from their graphite microstructure, and their specific properties. c.+or an 7ron4#arbon 2lloy of composition 1.8 wt* #4(.8 wt * +e, make schematic sketches of the microstructure that would be observed for conditions of very slow cooling at the temperatures of 9 a. 1&00 o # b. 1180 o # and c. at room temperature, calculate the precetage of each phases. 8. :lease show an applications, and cite at least one reason for your choice of application each materials listed belows9 1. :lain #arbon 'teel, &. $rass, 5.%ray #ast 7ron !. 'tainless 'teel 8.Titanium 2lloy, ). Magnesium, ;.Tool 'teel, . 2luminium - $y using datas from 'ection 11.&, in table 11.141148, and figure 11.&(, and 'ection 11.5 ,in table 11.)4table 11.10., +igure 5.