S+C RS152 Sensonor STIM210 Gyro Module Sample

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices
of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
2014 by SYSTEM PLUS CONSULTING, all rights reserved.
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Electronic Costing & Technology Experts
www.systemplus.fr
21 rue la Nou Bras de Fer
44200 Nantes France
Phone : +33 (0) 240 180 916 email : info@systemplus.fr
March 2014 Version 1 Written by Romain Fraux
Sensonor STIM210 Gyro Module
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Glossary
1. Overview / Introduction 4
Executive Summary
Reverse Costing Methodology
2. Company Profile 7
Sensonor Profile
STIM210 Specifications
3. Physical Analysis 15
Synthesis of the Physical Analysis
Physical Analysis Methodology
3.1 Module 18
Module View, Dimensions & Pin-out
Module Opening
3.2 Electronic Board 24
Top Side Components Markings
Top Side Components Identification
Bare Dies Connections
Bottom Side Components Markings
Bottom Side Components Identification
3.3 Digital ASIC 36
View, Dimensions & Marking
Delayering, Process Identification
Cross-Section
3.4 Mixed-Signal ASIC 48
Delayering, Process Identification
Cross-Section
3.5 MEMS Gyroscope 59
Bond Pads & Bond Pads Opening
MEMS Cap Removed
MEMS Sensing Area
MEMS Gyro Principle
MEMS Cross-Section: Structure
MEMS Cross-Section: Masses
MEMS Cross-Section: Electrode
MEMS Cross-Section: Buried Connections
MEMS Cross-Section: Getter
4. Manufacturing Process Flow 96
Global Overview
Digital ASIC Front-End Process & Wafer Fab Unit
Mixed-Signal ASIC Front-End Process & Wafer Fab Unit
MEMS Process Flow & Wafer Fab Unit
Module Assembly Process Flow & Assembly Unit
5. Cost Analysis 119
Synthesis of the cost analysis
Main steps of economic analysis
Yields Hypotheses
5.1 Digital ASIC 124
Front-End Cost
Probe Test & Dicing Cost
Wafer Cost & Die Cost
5.2 Mixed-Signal ASIC 129
Front-End Cost
5.3 MEMS Gyroscope 134
Front-End Cost
Front-End Cost per process steps
5.4 BOM Cost 143
Electronic Board BOM Cost
Housing BOM Cost
Material Cost Breakdown
5.5 Module Assembly & Test Cost 149
Electronic Board Assembly Cost
Housing Assembly Cost
Final Test & Calibration Cost
5.6 Module Cost & Price 157
STIM210 Module Cost
STIM210 Module Estimated Price
Contact 161
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This full reverse costing study has been conducted to provide insight on technology data,
manufacturing cost and selling price of the STIM210 Multi-Axis Gyro Module supplied by Sensonor.
MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in
term of reliability. They are now accepted in high-reliability environments, and are even starting to
replace FOGs and other technologies in tactical applications.
With a bias instability of 0.5/h and 10/h bias error over the operating temperature range, the
Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is
available without export control (ITAR-free).
The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit
microcontroller which provides flexibility in device configuration.
The MEMS gyros are associated with ASIC dies and are mounted on a silicon plate directly
connected to the housing of the module, allowing to reduce the mechanical strain.
The Sensonor gyroscope dies use a butterfly structure with two masses operating in an anti-phase
movement and asymmetric beams allowing themto bend both transversely and laterally.
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The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
Package is analyzed and measured
The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking
Setup of the manufacturing process.
Costing
analysis
Setup of the manufacturing environment
Cost simulation of the process steps
Selling price
analysis
Supply chain analysis
Analysis of the selling price
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5
44.8mm
Global view of the STIM210 Gyro Module
38.6mm
2
1
.
5
m
m
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The die marking includes:
SWA17C1
E0512X8PCL2
ASIC Die Marking
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10
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The die marking includes:
IMEGO
ASIC Die Marking
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Sensonor Gyro Process Synthesis
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Reverse costing analysis represents the best cost/price evaluation given the publically available
data, and estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a
+/- 10% correction on the manufacturing cost (if all parameters are cumulated)
These results are open for discussion. We can reevaluate this circuit with your information.
Please contact us:

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