1

CONTENTS
S.no CHAPTER PAGENO

1. CHAPTER: 1 Introduction 3
1.1 Description of IR Music Transmitter & Receiver 4
1.2 Specifications 4-5

2. CHAPTER: 2 Fundamentals 6
2.1 How IR Music Transmitter & Receiver Works 7
2.2 List of Figures 8
2.2.1 Circuit Diagram of IR Music Transmitter & Receiver 8
2.2.2 PCB Layout of IR Music Transmitter & Receiver 9
2.2.3 Block Diagram of IR Music Transmitter & Receiver 10-11
2.2.4 Description of the Project 12-13
2.3 List of Components 14
2.4 Datasheet 15
2.4.1 npn general purpose amplifier 15-16
2.4.2 pnp General purpose transistor 17
2.4.3 IC 741 Operational amplifier 17-18
2.4.4 IC LM386 19-21
2.5 PCB Manufacturing process 22
2.6 PCB Designing 23-27

3. CHAPTER :3 28
3.1 Result 29
3.2 Conclusion 30
3.3 Future Enhancement 31
3.4 Applications 32
3.5 Advantages & Disadvantages 33
3.6 References 34


2





LIST OF FIGURES :

FIGURES Page No

Circuit Diagram
Transmitter 8
Receiver 8
PCB layout
Transmitter 9
Receiver 9
Block Diagram
Transmitter 10
Receiver 10














3

















CHAPTER 1
INTRODUCTION








4



INTRODUCTION

1.1 DESCRIPTION OF IR MUSIC TRANSMITTER & RECEIVER

The main idea behind the project is to generate musical notes by infrared
radiations. The infrared radiations are transmitted and received by IR
LED and Phototransistor respectively.
This project emphasizes the way by which music is generated and driven
by IR rays. This circuit uses a popular melody generator IC UM66 that
can continuously generate musical notes. The melody produced is heard
through the receivers loudspeaker.
For maximum sound transmission the IR LEDs should be oriented
towards IR phototransistor.
It can be used in wireless music systems, mobile gadgets and cc cameras.

1.2 Specifications :

1.2(a) Infrared (IR) LED - As normal PN junction diode provide current
as the output when subjected to forward bias, in the same way an IR led
gives IR radiation at its output in forward bias. Infrared light is
electromagnetic radiation with a wavelength longer than that of visible
light, measured from the nominal edge of visible red light at 0.7
micrometers, and extending conventionally to 300 micrometers. These
wavelengths correspond to a frequency range of approximately 430Hz to
1THz, and include most of the thermal radiation emitted by objects near
room temperature. Microscopically, IR light is typically emitted or
absorbed by molecules when they change their rotational or irrational
movements.

5

1.2(b) Photo Diode A photodiode is a type of photo detector, capable
of converting light into either current or voltage, depending upon the
mode of operation. Photodiode works on the principle of
photoconductivity. When light is absorbed by a semiconductor material,
the number of free electrons and electrons holes changes and raises its
electrical conductivity, this phenomenon is called photoconductivity. To
cause excitation, the light that strikes the semiconductor must have
enough energy to raise electrons across the band gap Photoconductivity
may also be defined as an electrical property of Light Emitting Diode
(LED) which is the fact that a LED produces a voltage difference across
its leads when it is subjected to light, as if it was in photo-cell, but with
much lower output current. In other words, the voltage generated by the
LED cannot be, in any way, used to generate electrical power from the
output voltage, it can barely be detected. This is why we used an Op-Amp
(operational Amplifier) to accurately detect very small voltage changes.
Photoconductivity is a phenomenon in which a material becomes more
electrically conductive due to the absorption of electromagnetic radiation
such as visible light, ultraviolet light, infrared light, or gamma radiation.
Photodiodes are similar to regular semiconductor diodes except that they
may be either exposed to (detect UV or X-rays) or an optical fiber
connection to allow light to reach the sensitive part of the device.










6












CHAPTER 2
FUNDAMENTALS










7





2.1 HOW IR MUSIC TRANSMITTER & RECEIVER WORKS

TRANSMITTER
The IR music transmitter works off a 9V battery. Figure (1) shows the
circuit of the IR music Transmitter. It uses popular melody generator IC
U M-66 (IC1) that can continuously generate musical tones. The output
of IC1 is fed to the IR driver stage (Built across the transistors T1 and T2)
to get the maximum range. Here the red LED (LED1) flickers according
to t he musical tones generated by UM66 IC, indicating modulation. IR
LED2 and LED3 are infrared transmitting LEDs. For maximum sound
transmission these should be oriented towards IR phototransistor L14F1
(T3).
RECEIVER
The IR music receiver uses popular op-amp IC A741 and audio-
frequency amplifier IC LM386 along with phototransistor L14F1 and
some discrete components(Fig. 2).The melody generated by IC UM66 is
transmitted through IR LEDs, received by phototransistor T3 and fed to
pin 2 of IC A741 (IC2). Its gain can be varied using pot meter VR1. The
output of IC A741 is fed to IC LM386 (IC3) via capacitor C5 and pot
meter V- R 2 .The melody produced is heard through the receivers
loudspeaker. Pot meter VR2 is used to control the volume of Loudspeaker
LS1 (8-ohm, 1W).





8




2.2 LIST OF FIGURES :
2.2.1. Circuit Diagram:
[a] Transmitter:
Fig: 1

[b] Receiver:
Fig: 2

9

2.2.2. PCB Layout:
[a] Transmitter:
Fig: 3
[b] Receiver:
Fig: 4




10

2.2.3. Block Diagram:

[a] Transmitter:
Fig: 5


+9v



















3.3 v
regulator
Melody
Generator
Transistor
Driver
Stage - 1

Transistor
Driver
Stage - 2

IR LED
LED Music
Flicker
Indicator

11

[b] Receiver:
Fig: 6


+9V



















Photo
Transistor
Audio
Amplifier
stage-1
Audio
Amplifier
stage-2

Loud
Speaker
Gain
Control

Gain
Control

12

2.2.4 Description of the Prjoect

Using this circuit, audio musical notes can be generated and can be heard up
to a distance of 10 meters. The receiver can be placed at a maximum
distance of 1 meter from the transmitter with our any considerable noise
interference. The circuits of transmitter and receiver are quite simple and
can be placed and carried any where easily. The small apparatus provided
with the infrared communication function is in many cases operated by a
battery incorporated inside so that it is convenient when a user carries it
during movement, and it is preferable that power consumption be minimized
also to lengthen the continuous operation possible time of IR emission is
optimized. Here there is no use of any modulation technique when working
with the IT rays. Hence there is no use of necessity of carrier generation.
This makes the transmitter and receiver designs much simpler. However the
communication distance can be improved by using Far IR LEDs. The range
of communication can be increased to about 250 meters by using far IR
LEDs. In the apparatus provided with a conventional communication
function, however, the infrared light with a constant intensity is constantly
radiated regardless of the communication distance. This project emphasizes
the way by which music is generated and driven by IR rays and gives an
explanation to the one of the methods of receiving IR rays without
considerable noise interference.
The circuit can be divided into two parts: IR music transmitter and receiver.
The IR music transmitter works off a 9V battery, while the IR music
receiver works off regulated 9V to 12V. Fig. 1.1 shows the circuit of the IR
music transmitter. It uses popular melody generator IC UM66 (IC1) that can
continuously generate musical tones. The output of IC1 is fed to the IR
driver stage (built across the transistors T1 and T2) to get the maximum
range. Here the red LED (LED1) flickers according to the musical tones
generated by UM66 IC, indicating modulation. IR LED2 and LED3 are
infrared transmitting LEDs. For maximum sound transmission these should
be oriented towards IR phototransistor L14F1 (T3). The IR music receiver
uses popular op-amp IC A741 and audio-frequency amplifier IC LM386
along with phototransistor L14F1 and some discrete components. The
melody generated by IC UM66 is transmitted through IR LEDs, received by
phototransistor T3 and fed to pin2 of IC A741 (IC2). Its gain can be varied
using potential meter VR1. The output of IC A741 is fed to IC LM386
13

(IC3) via capacitor C5 and potential meter VR2.The melody produced is
heard through the receivers loudspeaker. Potential meter VR2 is used to
control the volume of loudspeaker LS1 (8-ohm, 1W). Switching off the
power supply stops melody generation.
The electrical signal from your music player is converted into an invisible
infrared light signal by the infrared light emitting diode (IR LED) in the
transmitter circuit. To transmit this over a longer distance, a brighter IR
LED is needed or an invisible light is to be focused using lens. The invisible
infrared light signal must hit the photo transistor in the receiver. The photo
transistor in the receiver converts this invisible infrared light signal into an
electrical signal. Then, the amplifier in the receiver circuit takes this
electrical signal and makes it larger using energy from the battery. Finally,
this larger electrical signal drives the speaker which turns electrical energy
into sound energy.















14

2.3 LIST OF COMPONENTS
S.No. Name Of The Component Quantity
1. IC UM-66(IC1) 1
2. IC LM741 (IC2) 1
3. IC LM386 (IC3) 1
4. RED LED(1) 1
5. IR LED(2 & 3) 2
6. Resistance R1 & R11 (1 K) 2
7. Resistance R2(4.7 K) 1
8. Resistance R3(22 K) 1
9. Resistance R4(82 ohm) 1
10. Resistance R5 & R12(10 ohm) 2
11. Resistance R6 & R7(10 K) 2
12. Resistance R8 & R13(15 K) 2
13. Resistance R9(100K) 1
14. Resistance R10(680 ohm) 1
15. Capacitor C1(1uF,16V) 1
16. Capacitor C2,C4,C8 & C10(220 uF, 25V) 4
17. Capacitor C3,C5,C7 & C9(0.1 uF) 4
18. Capacitor C6(10 uF,16V) 1
19. Transistor BC547(T1) & SK140/BD140(T2) 2
20. IR Phototransistor L14F1(T3) 1
21. Zener diode 3.3V 1/4W 2
22.
23.
24.
Speaker (8 ohm, 1W)
Preset VR1 (1M) & VR2 (10K)
9V battery
1
2
2
15

2.4 DATASHEET
2.4.1 NPN General Purpose Amplifier
Absolute Maximum Ratings TA=25C :-

Symbo
l
Par
ame
ter
Value Units
VCEO
Collector-Emitter Voltage 3
0
V
VCES
Collector-Base Voltage 3
0
V
V
EBO Emitter-Base Voltage 5
.
0
V
IC Collector Current - Continuous 5
0
0
m
A
TJ,
Tstg
Operating and Storage Junction
Temperature Range
-55 to
+150
C

NOTES:
1) These ratings are based on a maximum junction temperature of 150 degrees C.
2) These are steady state limits. The factory should be consulted on applications
involving pulsed or low duty cycle operations.
Thermal Characteristics TA=25C :-

Symbol Characteristic M
ax
Units
BC548 / A / B /
C
PD Total Device Dissipation
Derate above 25 C
6
2
5
5
.
0
m
W
mW
/ C
R JC
Thermal Resistance, Junction to
Case
8
3.
3
C/
W
R JA
Thermal Resistance, Junction to
Ambient
2
0
0
C/
W

Electrical Characteristics TA = 25C :-



16



OFF CHARACTERISTICS
V(BR)CE
O
Collector-Emitter Breakdown
Voltage
IC = 10 mA, IB = 0 30 V
V(BR)CB
O
Collector-Base Breakdown
Voltage
IC = 10 A, IE = 0 30 V
V(BR)CE
S
Collector-Base Breakdown
Voltage
IC = 10 A, IE = 0 30 V
V(BR)EB
O
Emitter-Base Breakdown
Voltage
IE = 10 A, IC = 0 5.0 V
ICBO Collector Cutoff Current VCB = 30 V, IE = 0
VCB = 30 V, IE = 0, TA
= +150 C
15
5.0
nA
A

ON CHARACTERISTICS
hFE DC Current Gain VCE = 5.0 V, IC = 2.0
mA 548
548A
548B
548C
110
110
200
420
800
220
450
800

VCE(sat) Collector-Emitter Saturation
Voltage
IC = 10 mA, IB = 0.5
mA IC = 100 mA, IB =
5.0 mA
0.25
0.60
V
V
VBE(on) Base-Emitter On Voltage VCE = 5.0 V, IC = 2.0
mA VCE = 5.0 V, IC =
10 mA
0.58 0.70
0.77
V
V




Symbol Parameter Test Conditions Min Max Units
17

2.4.2 PNP General Purpose Transistor

General Description:-
FEATURES :-
1. Low current (max. 100 mA).
2. Low voltage (max. 65 V).
DESCRIPTION :-
PNP transistor in a TO-92; SOT54 plastic package.
NPN complements: BC546 and BC547.

2.4.3 LM741 Operational Amplifier

General Description


The LM741 series are general purpose operational amplifiers which
feature improved performance over industry standards like the LM709.

They are direct, plug-in replacements for the 709C, LM201, MC1439 and
748 in most applications. The amplifiers offer many features which make
their application nearly foolproof: overload protection on the input and
output, no latch-up when the common mode range is exceeded, as well as
freedom from oscillations. The LM741C is identical to the
LM741/LM741A except that the LM741C has their performance
guaranteed over a 0C to+70C temperature range, instead of 55C to
+125C.

Electrical Characteristics

Note 1: Absolute Maximum Ratings indicate limits beyond which
damage to the device may occur. Operating Ratings indicate conditions
for which the device is functional, but do not guarantee specific
performance limits.

18

NOTE 2: For operation at elevated temperatures, these devices must be
derated based on thermal resistance, and Tj max. (Listed under Absolute
Maximum
Ratings). Tj = TA + (jA PD).



Note3: For supply voltages less than 15V, the absolute maximum input
Voltage is equal to the supply voltage.


Note 4: Unless otherwise specified, these specifications apply for VS =
LM741C/LM741E,


Note 5: Calculated value from: BW (MHz) = 0.35/Rise Time(s).


Connection Diagrams

Metal Can Package Dual-In-Line or S.O. Package






Thermal
Resistance
Cerdip (J) DIP (N) HO8 (H) SO-8 (M)

jA (Junction
to Ambient)
100C/W 100C/W 170C/W 195C/W

jC (Junction
to Case)
N/A N/A 25C/W N/A
19

2.4.4 LM386 Low Voltage Audio Power Amplifier

General Description

The LM386 is a power amplifier designed for use in low voltage
consumer applications. The gain is internally set to 20 to keep external
part count low, but the addition of an external resistor and capacitor
between pins 1 and 8 will increase the gain to any value from20 to 200.
The inputs are ground referenced while the output automatically biases to
one-half the supply voltage. The quiescent power drain is only 24 mill
watts when operating from a 6 volt supply, making the LM386 ideal for
battery operation.


Features

Battery operation
Minimum external parts
Wide supply voltage range: 4V12V or 5V18V
Low quiescent current drain: 4mA
Voltage gains from 20 to 200
Ground referenced input
Self-centering output quiescent voltage
Low distortion: 0.2% (AV = 20, VS = 6V, RL = 8W, PO =
125mW, f = 1kHz)
Available in 8 pin MSOP package

Applications

AM-FM radio amplifiers
Portable tape player amplifiers
Intercoms
TV sound systems
Line drivers
Ultrasonic drivers
Small servo drivers
Power converters




20

Parameter Conditions Min Typ Max Units
OperatingSupply Voltage
(VS)
LM386N1,3,LM386M1,
LM386MM
1LM386N-4
4
5
12
18
V
V
Quiescent Current (IQ) VS = 6V, VIN = 0 4 8 mA
Output Power (POUT)
LM386N-1, LM386M-1,
LM386MM-1LM386N-
3LM386N-4
VS = 6V,
RL=8 =10%
VS = 9V, RL =
THD =10%,VS =
16V, RL = 32 ,
THD = 10%
250
500
700
325
700
1000
mW
mW
mW
Voltage Gain (AV) VS = 6V, f = 1 kHz
10 F from Pin1to8
26 dB
Bandwidth (BW) VS = 6V, Pins 1 and
8 Open
300 khz
Total
HarmonicDistortion(THD)
VS = 6V, RL =
8W,POUT=125mW
f = 1 kHz, Pins1and 8
Open
0.2 %
Power Supply Rejection
Ratio (PSRR)




Input Resistance (RIN)
Input Bias Current
(IBIAS) VS = 6V, Pins 2
and 3 Open
VS = 6V, f = 1
kHz,CBYPASS=10
F Pins 1 and 8
Open, Referred to
Output
50





50
250
dB





kW
nA


Absolute Maximum Ratings
Note 1: All voltages are measured with respect to the ground pin, unless otherwise
specified.

Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the
device may occur. OperatingRatingsindicateconditions,for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics
state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not guaranteed for parameters where no limit is
given, however, the typical value is a good indication of device performance.

Note 3: For operation in ambient temperatures above 25C, the device must be
derated based on a 150C maximum junction temperature and 1) a thermal resistance
21

of 107C/W junction to ambient for the dual-in-line package and 2) a thermal
resistance of 170C/W for the small outline package



Top View

LM 386 PIN OUT



LM 386 Audio Amplifier



22

2.5 PCB manufacturing process:
2.5(a) Design Specification
It is an important process in the fabrication of electronic equipment. The design of
PCBs (Printed circuit board) depends on circuit requirements like noise immunity,
working frequency and voltage levels etc. High power PCBs requires a special design
strategy. The fortification process to the printed circuit board will determine to a large
extent the price and reliability of the equipment. A common target aimed is the
fabrication of small series of small series of highly reliable professional quality PCBs
with low investment.
The layout of a PCB has to incorporate all the information of the board before one can
go on the artwork preparation. This means that a concept which clearly defines all the
details of the circuit and partly defines the final equipment is prerequisite before the
actual layout can start.
2.5(b) Board types
The two most popular PCB types are:
1.] Single Sided Boards ~
The single sided PCBs are mostly used in entertainment electronics where
manufacturing costs have to be kept at a minimum. However in industrial electronics
cost factors cannot be neglected and single sided boards should be used wherever a
particular circuit can be accommodated on such boards.
2.] Double Sided Boards ~
Double sided PCBs can be made with or without plated through holes. The production
of boards with plated through holes is fairly expensive. Therefore plated through hole
boards are only chosen where the circuit complexities and density of components does
not leave any other choice.


23

2.6 PCB Designing:
After the accomplishment of circuit designing, next step that follows is PCB making.
Among the various discoveries and development to bring electronics to the level it has
reached until now, PCB has definitely contributed in a significant manner as a means
to inter-connect electronic components. The design of PCB can be considered as the
last step in the electronic circuit design as well as the first major step in the production
of PCBs. Intimate knowledge of all implication is required. The designing of PCB
consist of designing of layout followed by generation or preparation of artwork. The
layout therefore includes all the relevant aspects and details of the PCB design. The
various steps involved in PCB making are as follows:
a) Layout Planning
b) Component Hole
c) Graphic Layout
d) Etching
e) Drilling
f) Component Mounting
g) Soldering

2.6(a) Layout Planning
The layout of PCB must incorporate all the information that clearly defines all details
of the circuit and partly of the final equipment. A detail circuit diagram is an
important prerequisite. Layout planning takes care of component layout as well as
their interconnection. The layout should be developed in the direction of signal flow
as far as possible, so that one achieves shortest possible interconnections. Among the
components, the larger ones are placed first and the space between is filled with
smaller ones. Components requiring input/output connections come near the
connectors. In designing the interconnection, which are usually done with pencil,
actual space requirement in the artwork must be considered. The end of the layout
designing is the pencil sketched component and conductor drawing, which is called
layout sketch. Beside the component outline, component holes and interconnecting
pattern, the layout sketch should also include information on:
24

2.6(b) Component holes
Usually in a given PCB cost of the holes required is of one particular diameter and
this diameter is mentioned once in the layout sketch. Holes of different diameter are
shown with a code in the actual layout sketch. The code must explain outside the
layout area. For e.g. we have used two kinds of holes are of 0.8mm and 1.1mm.0.8
mm for all the components except jumpers and IC base. For jumpers and IC based we
drilled 1mm holes. Changing of our track from large to small and then back to large
again is known as necking. This is often required when we have to go between IC
or component pads. This allows having nice big low impedance tracks, but still has
the flexibility of route between tight spots.
In practice, the current flowing through it and the maximum temperature rise of the
track that can be tolerated will dictate track width. Every track will have a certain
amount of resistance, so the track will dissipate heat just like a resistor. The wider the
track, the lower is the resistance.
2.6(c) Graphic Layout
The Graphic layout or the Artwork is the basic circuit design that is required on the
PCB. The circuit connections and the components are together setup in a particular
design which is printed on the Circuit Board.
2.6(d) Etching (Patterning)
Copper over the entire substrate, sometimes on both sides, (creating a blank PCB)
then removing unwanted copper after applying a temporary mask (e.g. by chemical
etching), leaving only the desired copper traces. A few PCBs are made by adding
traces to the bare substrate (or a substrate with a very thin layer of copper) usually by
a complex process of multiple electroplating steps.
1.] Chemical etching
Inexpensive ingredients, and with proper use and maintenance, literally never wears
out. The real beauty of this mixture of hydrogen peroxide, sulphuric acid, copper
sulphate and organic stabilizers is that excess copper can be removed by simple
precipitation, after which, the bath is ready to consume more copper. In addition,
25

during operation, the etch ant is self agitating. The bubbles and heat evolve during
etching, so thoroughly stir up the bath the etch ant works almost as well in a simple
dip (immersion) tank as it does in a far more expensive spray etcher. Screen printing
ink is used according to the type of etch ant used. For acid etching, an acid resistive
ink is used, which is soluble in alkaline solution
2.6(e) Drilling
Drilling can be done using a CNC machine or manually.
1.] Manual Drilling ~
With the laminate stack formatted as detailed above, manual drilling is a
straightforward, if somewhat mind-numbing process. Items to consider include: When
using a conventional drill press, hole placement accuracy can be improved and drill
breakage minimized through the use of a sensitive drilling or finger chuck. Small
format, precision high-speed drill presses, ideal for PCB fabrication, is also available
from a number of sources.
If available, position a work lamp on a flexible mount as close to the work surface as
possible. Minimize burr formation, and outlast HSS bits almost 10 to 1. The carbide
drills are easier to break and must be handled carefully. Always use drill bits that have
been fitted with depth setting rings. This will allow you to set the plunge depth stop
on your drill press to a single value that will work for all bit diameters.
2.] Through-holes ~
Load the largest diameter bit to be used into the drill chuck, making sure that the
depth ring is pressed firmly against the ends of the chuck jaws when they are fully
tightened. Using a piece of scrap backing materials as a gauge, adjust the spindle
travel stop on your drill press to a depth that insures that the entire tip of the drill bit
penetrates at least half of the materials thickness. Under no circumstances allow a
PCB drill bit to drill into the table of your drill press. PCB bits are specially designed
to drill copper clad and will shatter if plunged into cast iron, steel, or aluminum.

26

Starting with largest diameter drill bit, drill all the through holes, stopping
periodically to insure that the drill bit has not snapped off and that the spindle travel
stop has not slipped.
As you drill each hole size check off that diameter on the drilling chart. This is a good
bookkeeping technique that will help you keep track of your progress and insure that
no holes size is missed.
Hold the stack up to the light for visual inspection. Ascertain that all of the holes have
been drilled through and that none are blocked by drill debris. If some debris is seen,
remove by carefully pushing a smaller diameter bit through the hole.

2.6(f) Component Mounting
From the greatest variety of electronic components available, which runs into
thousands of different types 1, is often a perplexing task to know which is right for a
given job. There could be damage such as hairline crack on PCB. If there are, then
they can be repaired by soldering a short link of bare copper wire over the affected
part. This holds the component in position ready for soldering. Some components will
be considerably larger. So it is best to start mounting the smallest first and progressing
through the largest. Next will be probably the resistor, small signal diodes or other
similar size components. Some capacitors are also very small but it would be best to
fit it afterwards. Although transistors and integrated circuit are small items there are
good reasons for leaving the soldering of these until the last step. All the components
before mounting are rubbed with sand paper so that oxide layer is removed from the
tips. Now they are mounted according to the component layout.
2.6(g) Soldering
This is the operation of joining the components with PCB after this operation the
circuit will be ready to use to avoid any damage or fault during this operation
following care must be taken. A longer duration contact between soldering iron bit
and components lead can exceed the temperature rating of the device and cause partial
or total damage of the device. Hence, before soldering we must read the maximum
soldering temperature and soldering time for device.
27

The wattage of soldering iron should be selected as maximum as permissible for that
soldering place. To protect the device by leakage current of iron its bit should be
earthed properly.
We should select soldering wire with proper ratio of Pb and Tn to provide the suitable
melting temperature. Proper amount of good quality flux must be applied on the
soldering point to avoid dry soldering.















28








CHAPTER 3









29


3.1 RESULT
The IR Musical Transmitter & Receiver we designed is working properly. By doing
the project we got a lot of experience with the electronics components & more over
we learn the PCB designing.


















30

3.2 CONCLUSION

IR ray communication is very easy to understand and simple to implement. It finds
various applications in short distance field of communications. It is one of the best
ways of building wireless gadgets.



















31

3.3 FUTURE ENHANCEMENT

In future there is scope of building virtual environment using the principles of IR ray
transmission and reception. Virtual gaming which also employs IR reception
techniques is still in research process which is soon going to rule the world of gaming.


















32

3.4 APPLICATIONS

1. Wireless Music Systems.
2. Mobile gadgets.
3. CC cameras.
4. Remote controls.
5. Infrared lasers are used in communications.
















33

3.5 [a] ADVANTAGES

1. Highly sensitive
2. Two stage Gain control
3. Very low noise
4. Low cost and reliable circuit
5. Can transmit up to 10 meter

3.5 [b] DISADVANTAGES

1. Not for long distance
2. Work in fixed range
3. Noise if object between transmitter and receiver











34

3.6 REFERENCES
1. www.google.com
2. www.wikipedia.org
3. www.pdfmachine.com
4. www.efymag.com
5. www.electronicsforu.com


















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