3D INDUSTRIAL IMAGING

We make invisible objects visible!

3DIIs commitment to provide others with a clear insight
through our innovative solutions and imaging software
3D Industrial Imaging Co., Ltd.
#301-2 Institute of Computer Technology
Seoul National University
Seoul, South Korea 151-742

Tel: +82 70 8766 2390
Fax: +82 28 777 555
E-mail: threedii@gmail.com
Web: http://www.3dii.kr
3D Industrial Imaging (3DII) develops, distributes, and sells X-ray imaging software and
specialized defect inspection software for non-destructive testing (NDT).

3DII also provides innovative solutions regarding visual processing and process control to its
valuable customers, manufacturers and research institutes.

3DII is very interested in not only being a business partner but also being a partner for challenging
projects utilizing 2D or 3D X-ray inspection systems and visual processing. 3DIIs software skills
and experience will lead your business to success in future projects.


VX-FAMILY SOFTWARE

VX3D VXPI
VXEI VX2D
VX3D is 3DIIs software platform for the visualization
and analysis of CT data. VX3D offers intuitive
visualization solutions, such as auto cropping, clipping,
and zoom cube functions. VX3D also provides users with
various measurement tools and powerful reporting
functions for 2D or 3D data analysis.

VX3D was specially developed for practical and industrial
CT applications. VX3D is able to perform defect analysis
for industrial purposes by adding optional modules, such
as VXPI (porosity detection module) and VXEI
(electronic chip inspection module).
Key Features
2D and 3D visualization of volume data
Provides various tools for 2D or 3D measurement:
Poly-line lengths, distances, angles, areas, etc.
Profile function for density information
Reporting tools
No limit on data quantity (depending on system
memory)
GPU-accelerated optimization
Clipping function for analyzing the inside of an object
in any desired direction
Zoom cube function for analyzing the volume of
interest
Auto cropping function for reducing the
rendering time
Currently available add-on modules:
VXPI (porosity detection module)
VXEI (electronic chip inspection module)




VXPI is an automatic porosity detection module based
on 3D X-ray CT imaging data, which can be used as an
add-on module of VX3D or as stand-alone software.
VXPI is able to provide information on the size, volume,
location, and density of inclusions and cavities and can
detect defects, such as shrinkage cavities, gas pores,
and foreign materials in aluminum, magnesium, iron,
zinc, and plastic.

VXPI can be used for defect analysis of metallic cast
parts (aluminum, magnesium, iron, and zinc) as well as
plastic cast parts using 3D X-ray CT imaging data.
Customized setup for identifying defects is available
depending on the manufacturers quality requirements
for casting components.


Add-on module of VX3D
Ultra fast speed using GPU computation
Less than 3 seconds to analyze a 512x512x512
pixel file (256Mb)
Applicable to in-line inspection systems
Detects shrinkage cavities, gas pores, and foreign
materials
Color-coded visualization of the size of cavities
Easy to use
Customized setup available
Stand-alone software available








VXEI is an electronic chip inspection module based on
3D CT X-ray imaging data, which can act as VX3Ds
add-on module or as stand-alone software. Based on
the ball shape, location, and volume information, VXEI is
able to detect defects, including open solder joints,
missing solder joints, solder bridges, and abnormal
solder balls (big, small, or head-in-pillow shapes).

VXEI can be used for the non-destructive automated
inspection of solder joints in various types of packages,
such as BGA, PoP, and SoC, in semiconductors and
electronic chips.

Once the X-ray image evaluation environment of VXEI is
customized to the manufacturers standards and
requirements, VXEI can identify defects automatically
through a very simple process.


Add-on module of VX3D
Ultra fast speed using GPU computation
Less than 2 seconds to analyze a 12mmx14mm
PoP chip
Applicable to in-line inspection systems
Detects open solder joints, missing solder joints,
solder bridges, and abnormal shapes (big, small, or
head-in-pillow)
Automated alignment correction of the chip axis
Easy to control and adjust parameters
Customized setup available
Stand-alone software available








VX2D is 3DIIs 2D X-ray imaging software for measuring
and analyzing 2D slice data. VX2D offers various
measurement tools and can export the measurement
information to Excel. VX2D also enables users to
perform more advanced analyses using various filtering
functions.

The Ball Void Detection Module is an optional module of
VX2D for the automated X-ray analysis of solder balls.
Supported image formats: *.bmp, *.jpg, *.raw
Exports the measurement information to Excel
3D surface plot function for creating a 3D image
based on density information
Unit conversion function
Various image filtering functions: Gaussian,
brightness/contrast, sharpness, edge detection filters,
etc.
Ball Void Detection Module can inspect the following
features:
Missing solder balls
Void size
Void percentage
Number of void