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Diagonal 6mm (Type 1/3) CCD Image Sensor for CCIR B/W Video Cameras
Description
The ICX405AL is an interline CCD solid-state
image sensor suitable for CCIR B/W video cameras
with a diagonal 6mm (Type 1/3) system. Compared
with the conventional product ICX055BL, basic
characteristics such as sensitivity, smear, dynamic
range and S/N are improved drastically.
This chip features a field period readout system and
an electronic shutter with variable charge-storage
time.
This chip is suitable for applications such as surveillance
cameras, automotive cameras, etc.
Features
High sensitivity (+4dB compared with the ICX055BL)
Low smear (20dB compared with the ICX055BL)
High D range (+3dB compared with the ICX055BL)
High S/N
Low dark current
Excellent antiblooming characteristics
Continuous variable-speed shutter
No voltage adjustment
(Reset gate and substrate bias need no adjustment.)
Reset gate:
5V drive
Horizontal register: 5V drive
Pin 1
1
14
7
Pin 9
30
Device Structure
Interline CCD image sensor
Image size:
Diagonal 6mm (Type 1/3)
Number of effective pixels: 500 (H) 582 (V) approx. 290K pixels
Total number of pixels:
537 (H) 597 (V) approx. 320K pixels
Chip size:
5.59mm (H) 4.68mm (V)
Unit cell size:
9.8m (H) 6.3m (V)
Optical black:
Horizontal (H) direction : Front 7 pixels, rear 30 pixels
Vertical (V) direction
: Front 14 pixels, rear 1 pixel
Number of dummy bits:
Horizontal 16
Vertical 1 (even fields only)
Substrate material:
Silicon
Super HAD CCD is a trademark of Sony Corporation. The Super HAD CCD is a version of Sony's high performance CCD HAD (HoleAccumulation Diode) sensor with sharply improved sensitivity by the incorporation of a new semiconductor technology developed by Sony
Corporation.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
E00608E78
ICX405AL
NC
GND
V1
V2
V3
V4
Vertical Register
VOUT
NC
ICX405AL
Note)
Horizontal Register
10
11
12
13
14
15
GND
SUB
VL
RG
NC
H1
H2
Pin Description
Pin No.
Symbol
: Photo sensor
16
VDD
Note)
Description
Pin No.
Description
Symbol
V4
VDD
Supply voltage
V3
10
GND
GND
V2
11
SUB
Substrate clock
V1
12
VL
GND
GND
13
RG
NC
14
NC
NC
15
H1
VOUT
16
H2
Signal output
V1, V3 SUB
50 to +15
50 to +0.3
40 to +0.3
0.3 to +20
10 to +18
H1, H2 GND
Against VL
40 to +8
Against GND
Unit
Ratings
10 to +6
V1, V3 VL
0.3 to +28
0.3 to +15
to +15
H1 H2
6 to +6
14 to +14
Storage temperature
30 to +80
Operating temperature
10 to +60
H1, H2 V4
1 +24V (Max.) when clock width < 10s, clock duty factor < 0.1%.
3
Remarks
ICX405AL
Bias Conditions
Symbol
Item
Supply voltage
VDD
Typ.
Max.
Unit
14.55
15.0
1
15.45
VL
Substrate clock
Min.
SUB
Remarks
1 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL
power supply for the V driver should be used.
2 Do not apply a DC bias to the substrate clock pin, because a DC bias is generated within the CCD.
DC Characteristics
Symbol
Item
Supply current
Min.
Typ.
Unit
IDD
Max.
5
Remarks
mA
Unit
Waveform
diagram
VVT
14.55
15.0
15.45
0.05
0.05
0.2
0.05
VVL1, VVL2,
VVL3, VVL4
8.0
7.0
6.5
VV
Vertical transfer clock
voltage
Typ.
VVH3, VVH4
Min.
VVH1, VVH2
Item
6.3
7.0
8.05
VV = VVHn VVLn (n = 1 to 4)
Symbol
Remarks
0.25
0.1
VVH4 VVH
0.25
0.1
VVHH
0.3
High-level coupling
VVHL
0.3
High-level coupling
VVLH
0.3
Low-level coupling
VVLL
Horizontal transfer
clock voltage
VVH3 VVH
0.3
Low-level coupling
VH
4.75
5.0
5.25
VHL
0.05
0.05
4.5
5.0
5.5
VRGLH VRGLL
0.4
Low-level coupling
VRGL VRGLm
0.5
Low-level coupling
VRG
Reset gate clock
voltage
VRGH
Substrate clock voltage
VDD
+0.3
VDD
+0.6
VDD
+0.9
VSUB
21.0
22.0
23.5
ICX405AL
Item
Min.
Typ.
Max.
Unit
CV1, CV3
1500
pF
CV2, CV4
1000
pF
CV12, CV34
820
pF
CV23, CV41
330
pF
CV13
100
pF
CV24
100
pF
CH1, CH2
47
pF
CHH
22
pF
CRG
pF
CSUB
270
pF
R1, R3
100
R2, R4
150
RGND
68
RH
10
RRG
50
Remarks
V1
V2
CV12
R1
R2
RH
RH
H2
H1
CV1
CHH
CV2
CV41
CV23
CH1
CH2
CV13
CV24
CV4 RGND CV3
R4
R3
CV34
V4
V3
RRG
RG
CRG
ICX405AL
II
M
VVT
M
2
10%
0%
tr
twh
0V
tf
V3
VVHH
VVH1
VVHH
VVH
VVHL
VVHL
VVH3
VVHL
VVL1
VVH
VVHH
VVHH
VVHL
VVL3
VVLH
VVLH
VVLL
VVLL
VVL
VVL
V2
V4
VVHH
VVHH
VVH
VVH
VVHH
VVHH
VVHL
VVHL
VVH2 VVHL
VVH4
VVL2
VVHL
VVLH
VVLH
VVLL
VVLL
VVL
VVL4
VVL
ICX405AL
twh
tf
90%
twl
VH
10%
VHL
twh
tf
VRGH
twl
Point A
VRG
RG waveform
VRGLH
VRGL
VRGLL
VRGLm
H1 waveform
10%
VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from
Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and
VRGLL.
VRGL = (VRGLH + VRGLL)/2
Assuming VRGH is the minimum value during the interval twh, then:
VRG = VRGH VRGL
Negative overshoot level during the falling edge of RG is VRGLm.
(5) Substrate clock waveform
100%
90%
M
VSUB
10%
0%
VSUB
(A bias generated within the CCD)
tr
twh
M
2
tf
ICX405AL
Symbol
VT
Vertical transfer
clock
tr
tf
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
2.3 2.5
0.5
0.5
V1, V2,
V3, V4
Horizontal
transfer clock
Readout clock
twl
twh
During
imaging
During
H1
parallel-serial
conversion
H2
41
38
42
5.6
12
15
10
RG
11
Substrate clock
SUB
0.012
0.012
75
During
readout
79
6.5
4.5
ns 2
0.012
1.5 2.0
15
15
0.012
5.6
250 ns 1
15
37
Unit Remarks
0.5
s
ns
0.5
When draining
charge
ICX405AL
(Ta = 25C)
Symbol
Min.
Typ.
Max.
Unit
Measurement method
Sensitivity
1080
1350
Saturation signal
Vsat
1000
Smear
Sm
mV
mV
98
dB
SH
20
Zone 0 and I
25
Zone 0 to II'
Dark signal
Vdt
mV
Ta = 60C
Vdt
mV
Ta = 60C
Flicker
Lag
Lag
0.5
115
6
9
H
8
V
10
H
8
Zone 0, I
Zone II, II'
V
10
582 (V)
Ignored region
Effective pixel region
Remarks
Ta = 60C
ICX405AL
250
50
[mV]
2. Saturation signal
Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with the
average value of the signal output, 200mV, measure the minimum value of the signal output.
3. Smear
Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to
500 times the intensity with the average value of the signal output, 200mV. When the readout clock is
stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure
the maximum value (VSm [mV]) of the signal output and substitute the value into the following formula.
Sm = 20 log
1
YSm
1
10
200
500
10
ICX405AL
FLD
V1
Light
Strobe light
timing
Y signal output 200mV
Output
11
Ylag (lag)
RG
H1
H2
XV4
XSG2
XV3
XSG1
XV1
XV2
XSUB
13
12
11
8
9
10
22/20V
14
15
16
5
6
17
4
CXD1267AN
18
22/16V
0.1
1/20V
100k
1/35V
0.1
100k
6
5
ICX405
(BOTTOM VIEW)
V4
19
V3
H1
H2
16 15 14 13 12 11 10
RG
V1
V2
NC
20
GND
VL
NC
GND
NC
SUB
15V
VOUT
12
VDD
Drive Circuit
3.3/20V
0.01
1500p
3.9k
2SK523
100
3.3/16V
1M
[A]
CCD OUT
7.0V
ICX405AL
ICX405AL
Relative Response
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
400
500
600
700
800
900
1000
V1
2.5
V2
Odd Field
V3
V4
31.1
0.3
V1
V2
Even Field
V3
V4
Unit : s
13
14
CCD
OUT
V4
V3
V2
V1
HD
BLK
VD
FLD
582
581
625
1
2
3
4
5
620
15
2 4 6
1 3 5
2 4 6
1 3 5
315
582
581
2 4 6
1 3 5
335
2 4 6
1 3 5
ICX405AL
340
330
325
320
310
25
20
10
15
SUB
V4
V3
V2
V1
RG
H2
H1
BLK
HD
15
10
500
1
2
3
5
495
490
ICX405AL
5
7
1
2
3
15
16
1
2
3
10
1
2
3
30
25
20
ICX405AL
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
2) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W
soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering
tool, use a thermal controller of the zero cross On/Off type and connect it to ground.
3) Dust and dirt protection
Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and
dirt. Clean glass plates with the following operation as required, and use them.
a) Perform all assembly operations in a clean room (class 1000 or less).
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
e) When a protective tape is applied before shipping, just before use remove the tape applied for
electrostatic protection. Do not reuse the tape.
4) Installing (attaching)
a) Remain within the following limits when applying a static load to the package. Do not apply any load more
than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited
portions. (This may cause cracks in the package.)
Cover glass
50N
50N
1.2Nm
Plastic package
Compressive strength
16
Torsional strength
ICX405AL
b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the
package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for
installation, use either an elastic load, such as a spring plate, or an adhesive.
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated
voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,
and indicated values should be transferred to the other locations as a precaution.
d) The notch of the package is used for directional index, and that can not be used for reference of fixing.
In addition, the cover glass and seal resin may overlap with the notch of the package.
e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be
generated by the fragments of resin.
f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference)
5) Others
a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition
exceeding the normal using condition, consult our company.
b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD
characteristics.
d) This package has 2 kinds of internal structure. However, their package outline, optical size, and strength
are the same.
Structure A
Structure B
Package
Chip
Metal plate
(lead frame)
Cross section of
lead frame
The cross section of lead frame can be seen on the side of the package for structure A.
17
18
1.2
2.5
8.4
2.5
Plastic
GOLD PLATING
42 ALLOY
0.90g
AS-C2.2-03(E)
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
DRAWING NUMBER
0.3
0.46
1.27
9.2
0.69
V
H
0.3
10.3
12.2 0.1
PACKAGE STRUCTURE
2.5
0.5
16
9.5
1.2
6.1
A
D
B'
11.4 0.1
1.27
3.1
5.7
8
11.6
16
2.5
2-R0.5
9. The notches on the bottom of the package are used only for directional index, they must
not be used for reference of fixing.
8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5.
7. The tilt of the effective image area relative to the bottom C is less than 50m.
The tilt of the effective image area relative to the top D of the cover glass is less than 50m.
6. The height from the bottom C to the effective image area is 1.41 0.10mm.
The height from the top of the cover glass D to the effective image area is 1.94 0.15mm.
3. The bottom C of the package, and the top of the cover glass D
are the height reference.
11.43
Unit: mm
3.35 0.15
3.5 0.3
0 to 9
0.25
Package Outline
ICX405AL
Sony Corporation