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IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 31, NO. 2, JUNE 2008
Re
Micro-channel width.
Fin width.
Orthogonal coordinate system.
Greek Symbols
Normalized design variables,
respectively.
Micro-channel aspect ratio.
Density.
Dynamic viscosity.
Kinematic viscosity.
NOMENCLATURE
Cross section area of micro-channel.
Surface area of substrate base.
Specific heat.
Hydraulic diameter.
Friction factor.
Convective heat transfer coefficient.
Height of heat sink.
Micro-channel depth.
Thermal conductivity.
Entry length.
Length of heat sink.
Width of heat sink.
Height of heat sink.
Number of micro-channels.
Number of dimensions in design space.
Pressure.
and
Subscripts
max
Liquid.
Inlet.
Outlet.
Substrate.
Maximum value.
avg
Average value.
I. INTRODUCTION
Perimeter.
Pumping power.
Heat flux.
Manuscript received December 21, 2006; revised August 15, 2007. This work
was recommended for publication by Associate Editor S. Bhavnani upon evaluation of the reviewers comments.
The authors are with the Department of Mechanical Engineering, Inha University, Incheon 402-751, Korea (e-mail: kykim@inha.ac.kr).
Digital Object Identifier 10.1109/TCAPT.2008.916791
ECENT developments in micro electromechanical systems (MEMS) and advanced very large-scale integration
(VLSI) technologies and devices associated with micro miniaturization have led to significant improvement in packing
densities. These developments have helped satisfy growing
demand for higher dissipation of heat flux from electronic
devices. However, it has been observed that operation of most
electronic devices is strongly influenced by their temperature
and their surrounding thermal environment. Micro-channel
heat sink, as an integrated part of silicon based electronic
device, is a potential solution to this problem. Sophisticated
fabrication processes have yielded economically competitive
micro-channels having a high surface area to volume ratio.
The potential of micro-channel heat sinks as heat transfer devices has motivated many researchers to analyze micro-cooling
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IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 31, NO. 2, JUNE 2008
Momentum
(3)
Energy
(4)
where
(5)
is the fluid temperwhere represents the velocity vector,
ature, and
and
are the substrate temperature and thermal
conductivity, respectively.
A numerical model is formulated to solve the 3-D conjugate
heat transfer in micro-channels using commercial code CFX
5.7 [25]. The code uses finite volume discretization of governing differential equations and the solution is based on the
SIMPLE algorithm [26]. In the numerical solution, the convective terms are discretized using a first-order upwind scheme
for all equations. Due to symmetry of the problem, half of the
single micro-channel is selected for computation, as shown in
Fig. 2. A hexahedral mesh is generated in the specified domain
through ICEM 5.7 [25] and a 401 61 16 grid is used for
the current simulation cases. Grid independency is checked by
taking different grids: it was found that for a 501 71 21 grid
the change in the highest temperature in the substrate was only
0.03% while for a 301 41 11 grid the difference in highest
temperature attained was roughly 2%. A finite volume solver is
used under the following boundary conditions.
The average velocity can be obtained from (6), (7), and (8) as
follows:
(9)
Substituting (1) into (9) we obtain
(10)
where the pumping power should be realistic and can be taken
as being in a range of 0.01 to 0.8 considering the capacity of
state-of-the-art micro pumps [14]. For comparison of the results
with experimental data, the thermal resistance is calculated as
(11)
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where
where
and
are the chip surface temperatures at the inlet
and outlet, respectively.
IV. OPTIMIZATION TECHNIQUES
Fig. 3 represents the various steps involved in the optimization algorithm. Design points are selected using a four-level full
factorial design. Two design variables, and , are chosen for
the optimization methodology, where is defined as
and is defined as
. Hence, 16 design points chosen
from four-level full factorial design assisted with 4 more design points are used to construct the surrogates. These levels
are equally spaced within the design range for all variables. Design space is specified performing some preliminary calculations within the geometric constraints discussed in Section II
to obtain minimum of thermal resistance. The design space is
given in Table I. Design variables are normalized from 0 to 1
to construct surrogate models. Objective functions are calculated by solving NavierStokes and heat conduction equations
at specified design points and optimized using surrogate models.
In the current study, thermal resistance
is the foremost consideration for optimization and is the objective function for the
surrogate based optimization i.e.,
.
Three surrogate models, response surface approximation
(RSA), Kriging (KRG), and radial basis neural network
(RBNN), are applied to predict the optimal design point. In
RSA [27], a least square curve fitting by regression analysis
is performed on the data obtained by computational fluid dynamic (CFD) calculations using NavierStokes equations. The
following polynomial function is fitted to obtain the response
surface function. If the regression coefficients are s, the
polynomial function becomes
TABLE I
DESIGN VARIABLES AND DESIGN SPACE
(13)
where is the number of design variables, and s are the design variables. For a second order polynomial model, used in
the current study, the number of regression constants is
.
(15)
where
ables
is the number of dimensions in the set of design variis the standard deviation of the population, and is
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IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 31, NO. 2, JUNE 2008
(16)
where is the coefficients of the linear combination, g is the set
of radial basis functions (typically Gaussian), and is the set of
errors with equal variance, . Due to its linear nature, RBNN
has simpler mathematics and lower computational cost as compared to back-propagation neural network (BPNN) [29]. RBNN
is a two layer network that consists of a hidden layer of the radial
basis function and a linear output layer. The design parameters
for this function are spread constant (SC) and a user defined
error goal (EG). The SC value is selected such that it should
not be so large that each neuron does not respond in the same
manner for the all inputs, and that it should not be so small that
the network becomes highly sensitive for every input within the
design space. EG or mean square error goal selection is also important. A very small error goal will produce over-training of the
network while a large error goal will affect the accuracy of the
model. The allowable error goal is decided from the allowable
error from the mean input responses. Cross-validation [22] is
performed to check the quality of constructed surrogates. These
surrogate methods are implemented using MATLAB [30].
Fig. 4. Comparison of numerically predicted fully developed velocity profiles
with analytical results: (a) on z middle plane and (b) on y middle plane.
(17)
Kawano et al. [5]. Fig. 5 shows a comparison of the numerically calculated inlet thermal resistance and outlet thermal resistance with available experimental results [5] for a wide range of
Reynolds number. The present results show appreciable agreement with the experimental results, with most of the predictions
lying within the experimental uncertainties (indicated by error
bars in the figure). The present model underpredicts the inlet
thermal resistance only for a low Reynolds number. One of the
possible reasons for this underprediction may be heat loss to
the ambient by the solid substrate, as discussed by Qu and Mudawar [17]. Moreover, the low Reynolds number conditions are
unreliable because of the larger temperature-induced viscosity
gradients near the inlet portion [5]. Further validation of the numerical model is done with experimental results of Tuckerman
and Pease [1] for three different cases of different channel depth
and heat flux, as given in Table II. In light of the numerical reproduction of these experimental results by Toh et al. [19] and
Liu et al. [8], the present model shows good agreement with the
experimental results, even for higher heat flux.
Before carrying out the actual optimization, the effect of
the design variables on the thermal resistance and friction
constant is assessed. Figs. 6 and 7 show the variations of the
thermal resistance and friction constant with changes in the
design variables. Convective thermal resistance is defined
as
1
, where
is the convective heat
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TABLE II
COMPARISON OF THERMAL RESISTANCES BETWEEN
COMPUTATIONAL AND EXPERIMENTAL RESULTS
Fig. 6. Variation of (a) thermal resistance and (b) friction constant with design
variable .
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IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 31, NO. 2, JUNE 2008
Fig. 7. Variation of (a) thermal resistance and (b) friction constant with design
variable .
TABLE III
OPTIMAL POINTS (NORMALIZED) PREDICTED BY DIFFERENT SURROGATES
AND CORRESPONDING CFD CALCULATED VALUES
(18)
The KRG model is prepared with the help of toolbox (DACE)
[34] in MATLAB. Correlation function parameters are adjusted
carefully to ensure consistent performance of the model. The
acceptable variance of the method was kept at 3.93 10 .
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Fig. 10. Temperature contours on the middle yz plane: (a) for [1] case and (b)
for optimum case.
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