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A
B
C D
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Fig. 7 Indentation traces on the following: A Cu
5
Zn
8
; B Ni
5
Zn
21
;
C AuZn
3
; D AgZn
3
; E solder.
Fig. 8 Plots of load vs. depth for 50-mN maximum load indentations per-
formed on Cu, solder, and IMCs.
Wang -- 12-10:Layout 1 11/10/10 2:39 PM Page 253
can be attributed to the combination of
ionic/covalent bonding in intermetallic com-
pounds, which may result in a higher mod-
ulus than that obtained from a simple rule
of mixtures of the components (Ref. 26). It
should be noted that although AgZn
3
and
AuZn
3
are intermetallic compounds, they
do exhibit some extent of plasticity.
Hardness is often used to explain the
brittleness of a material. The indication is
that Cu
5
Zn
8
and Ni
5
Zn
21
have the poten-
tial for brittle behavior (crack initiation)
when the soldered joints were deformed by
stress. AgZn
3
and AuZn
3
, with a lower
hardness and modulus, are actually rather
soft and ductile and not a likely source of
crack initiation. Actually, cracks were found
located at the Cu
5
Zn
8
layer, and the inter-
face between AuZn
3
and Ni
5
Zn
21
layer, as
shown in Fig. 9.
Mechanical Properties of Soldered Joints
Figure 10 shows the results of the me-
chanical properties of the QFP and CR mi-
crojoints. According to Fig. 10, it is found
that the joints on the Au/Ni/Cu substrate ex-
hibit higher shear and
pull force than that on
the Cu substrate, while
the joints on the Sn-
plated/Cu substrate
show lower shear and
pull force than that on
the Cu substrate.
It is known that Sn (Zn
for Sn-Zn solders) at the
solder/Cu interface re-
acts rapidly with Cu to
form Cu-Sn (Cu-Zn for
Sn-Zn solders) IMCs,
which weaken the sol-
dered joints (Refs.
2425). Therefore, Ni is
used as a diffusion bar-
rier layer to prevent the
rapid interfacial reac-
tions between the solder and Cu layer in
electronic devices. In this study, it was found
that the application of Au/Ni/Cu substrate
can really enhance the soldered joints. It
was also found that Sn-plated/Cu substrate
can improve the solderability however, it
may deteriorate the soldered joints.
Conclusions
1) Sn-9Zn-0.25Ag-0.2Ga-0.002Al-0.15
Ce solder shows better solderability on Sn-
plated Cu substrate than that of pure Cu
and Au/Ni/Cu; while the application of
Au/Ni/Cu pads may deteriorate the sol-
derability. A mechanical property test in-
dicated that the application of Au/Ni/Cu
substrate enhanced the soldered joints.
2) Cu
5
Zn
8
and AgZn
3
intermetallic
compounds form at the interface between
Sn-9Zn-0.2Ga-0.002Al-0.25Ag-0.15Ce sol-
der and Cu substrate, while AuZn
3
and
AuAgZn
2
were present at the interface be-
tween the solder and Au/Ni/Cu substrate.
When the Sn-plated Cu substrate was used,
the Cu
5
Zn
8
layers and the remnants Sn
layer constituted a sandwich structure at the
interface.
3) Cu
5
Zn
8
and Ni
5
Zn
21
may be the
crack initiation point when the soldered
joint was deformed by stress due to the
high hardness and modules. On the other
hand, Sn-9Zn-0.25Ag-0.2Ga-0.002Al-
0.15Ce solder is soft and exhibits signifi-
cant plasticity, while AgZn
3
and AuZn
3
also exhibit a little plasticity.
Acknowledgments
The paper was sponsored by the K.C.
Wang MagnaFund, Ningbo University. The
authors would also like to acknowledge the
support from the Talent Project Fund (019-
B00228104700), and Dr. Jun Huang for the
nanoindentation measurements.
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DECEMBER 2010, VOL. 89 254-s
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A B
Fig. 9 A Cracks in the interface between solder and Cu substrate; B cracks in the interface between solder and Au/Ni/Cu substrate.
Fig. 10 Mechanical properties of the QFP and CR microjoints.
Wang -- 12-10:Layout 1 11/10/10 2:40 PM Page 254
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