Document Name: Europa Board epair !or" Instruction Last e#ised $n: %irst elease Document &: '()*+,-.)**+ E/: + Appro#ed By: '( (0erry 'uo1 2A /en"ates0 Pandit 3a4le of Contents + Purpose555555555555555555555555555555555556 6 (cope5555555555555555555555555555555555556 - e# History555555555555555555555555555555555776 , Document eferences555555555555555555555555555577- 8 3erms 9 Definitions5555555555555555555555555555577- : Product Information5555555555555555555555555555577- ; e<or" Process =ap55555555555555555555555555555- > Critical Components Information5555555555555555555555577, . Component List for $rder In Ad#ance ?@niAue Part ListB555555555555778 +* Board epair Process 2ualification555555555555555555555578 ++ Board epair Notes5555555555555555555555555555577 8 +6 (pecial epair Processes57755555555555555555555555557: +- (+6*+ $pen 3race Inspection5555555555555555555555555; Research In Motion Confidential Page 1 of 9 Created By: Bing Han Document Is No Longer Controlled After Printed Document Name: Europa Board epair !or" Instruction Last e#ised $n: %irst elease Document &: '()*+,-.)**+ E/: + Appro#ed By: '( (0erry 'uo1 2A /en"ates0 Pandit 1. PropCsito: Este documento tiene por objeto proporcionar una instruccin de trabajo para la reparacin del modelo Europa. It should not be used as detailed board repair procedure. 67 Alcance This document applies to GRS and outsourcing facilities solder repair. -7 e# History e# & Description of C0ange =odified Date Edited By Appro#ed By 1 Initial Revision Uploaded Nov 20, 2007 Bing Han Sherry Guo Venkatesh Pandit Research In Motion Confidential Page 2 of 9 Created By: Bing Han Document Is No Longer Controlled After Printed Document Name: Europa Board epair !or" Instruction Last e#ised $n: %irst elease Document &: '()*+,-.)**+ E/: + Appro#ed By: '( (0erry 'uo1 2A /en"ates0 Pandit ,7 Document eferences: IPC-A-610 IPC-7711A SMT-00025-001 GRS-01431-001 Acceptability of Electronic Assemblies Rework of Electronic Assemblies PCB Assembly Lead-Free Rework Procedure Procedure for Control of Moisture Sensitive Components QA-RMA-2005001 Qualifcation Requirement by a Third Party for Repairing Blackberry PCB Assembly 87 3erms 9 Definitions B'A: L'A: 2%N: =(D: Ball Grid Array Land Grid Array Quad Flat No Lead Moisture Sensitive Device :7 Product Information LeadedDLead)%ree (older Paste PCB =aterial %inis0 Ne< Process Lead-Free SAC305 FR-4 OSP 0201 ;7 e<or" Process =ap Research In Motion Confidential %ig)+ Page 3 of 9 Created By: Bing Han Document Is No Longer Controlled After Printed Document Name: Europa Board epair !or" Instruction Last e#ised $n: %irst elease Document &: '()*+,-.)**+ E/: + Appro#ed By: '( (0erry 'uo1 2A /en"ates0 Pandit %ig)6 >7 Critical Components Information ef epair Desig Le#el Part & 3ype %ine Pitc0E @nderfilledE =(D Le#el Heat (ensiti#e U301 U602 U603 U604 U801 U1103 C916 MIC1201 4 4 4 4 4 4 3 4 ANA-00338-001 QFN DIG-00157-004 BGA DIG-00176-004 BGA ANA-00496-002 BGA ANA-00401-001 QFN ANA-00399-002 BGA CAP-07008-001 CAP XDR-00010-001 Unique Y Y N Y Y Y N N N Y Y N N N N N 3 3 3 3 2a 3 2 2 N N N N N N Y Y Note: %ollo< '()*+,-+)**+ Procedure for Control of =oisture (ensiti#e Components to 0andle moisture sensiti#e components7 Research In Motion Confidential Page 4 of 9 Created By: Bing Han Document Is No Longer Controlled After Printed Document Name: Europa Board epair !or" Instruction Last e#ised $n: %irst elease Document &: '()*+,-.)**+ E/: + Appro#ed By: '( (0erry 'uo1 2A /en"ates0 Pandit .7 Component List for $rder In Ad#ance ?@niAue Part ListB ef Desig Part & ef Desig Part & SH1302 SH1303 SH1304 SH1305 SH1306 SH1307 SH1308 SH1309 SH1310 SH1311 Note HDW-15191-001 HDW-15200-001 HDW-15192-001 HDW-15162-002 HDW-15193-001 HDW-15164-001 HDW-15194-001 HDW-15198-001 HDW-15195-001 HDW-15199-003 SH1312 U401 U602 U603 S1002 HDW-15196-001 ANA-00435-001 DIG-00157-004 DIG-00176-004 CON-00147-001 30is list is for I= internal prior material order only7 Its accuracy is not guaranteed7 All material order must comply <it0 acti#e B$=7 +*7 Board epair Process 2ualification Le#el Component /isual Inspection F)ay Inspection %unction 3est Cross)(ection 4 Note U801 Y Y If necessary Y This component may change due to manufacturing process change, material constraints or any other unpredictable changes; Board Repair Process Qualifcation will comply with QA-RMA-2005001: Qualifcation Requirement by a Third Party for Repairing Blackberry PCB Assembly ++7 Board epair Notes All solder repair operation must follow IPC-7711A Rework of Electronic Assemblies; Baking process for boards from mass production line should follow the requirements of SMT-00025-001, Section 9.0 ; all feld return boards must be baked 33 hours @ 90 C degree before board repair; Ear Jack S1201 has special instruction for inspection prior to S1201 repair. Refer to Section 13-S1201 Open Trace Inspection; C916 should be discharged before rework; Any hot air applied repair must ensure the underfll areas temperature is not higher than 200 C degree. Heat shield should be applied if necessary; Use as much solder iron for Shield Can placement; Research In Motion Confidential Page 5 of 9