Introduction to packaging

Manjunath.M.S
MEMS Packaging
General Packaging process
Die Attach
Wafer saw
Vacuum Mount
Curing
Wafer Mount
Curing & die shear
Pick and Place
Epoxy dispensing
Wirebond Process
Sealing/ Encapsulation
Testing/Calibration/Shipping
Curing & die shear
Wirebond
Ball Shear test
Wire Pull test
Mold Compound dispensing
Curing
Laser welding
Semi Automatic Wafer Dicing Machine
Make M/s. MTI Cut
Model EC-400
Mode Semi Automatic
SPECIFICATIONS
Motor : DC motor (110V) with variable speed up to 3,000 rpm.
Accuracy : 0.0025 mm moving resolution and 0.01 mm position accuracy.
Cutting Blades : 4" dia x 0.35 mm thick fully sintered diamond blade
Control mode : Manual control / PC control
Range 3 dimensions : X-axis: 8" Y-axis:4" Z-axis:4"
The MTI Cut Wafer Dicer is semiautomatic machine, suitable to dice wafer.
Maximum size of wafer 4.
Wafer material Silicon, Glass etc
Blade width 0.35mm,
Device pitch min 2.5mm.
Semi Automatic Die attach & wirebonding
Machine
Bond head
Microscope
Motorized Wire-Spool
Fiber Optic Illuminator
Wedge bond 17-75
Ribbon max. 25x250
Ball & bump bond 17-50
Axis control Motorized Z & Y, Manual X
Ultrasonic system PLL control 62kHz transducer
Ultrasonic power 0 2 Watt output
Specifications:
Heater Stage
Control - Puck
6,5 TFT Touch Panel
Ultrasonic power 0 2 Watt output
Bond time 15 2,000 msec.
Bond force 15 150 cN
Heater stage
controller
Built-in, 250C max
Semi Automatic Die attach Machine
Epoxy vacuum pump
1. pick-up tool
1.
Semi Automatic Wirebonding Machine
Bond head
Control - Puck
Microscope
Motorized Wire-Spool
Fiber Optic Illuminator
Wedge bond 17-75
Ribbon max. 25x250
Ball & bump bond 17-50
Axis control Motorized Z & Y, Manual X
Ultrasonic system PLL control 62kHz transducer
Ultrasonic power 0 2 Watt output
Bond time 15 2,000 msec.
Specifications:
Heater Stage
6,5 TFT Touch Panel
Bond force 15 150 cN
Heater stage
controller
Built-in, 250C max
TPT Wirebonder is semiautomatic machine to establish connectivity between die and
substrate
Wire material Au (25) & Cu, Al (33)
Bonding type Ball bonding, Wedge bonding & Ball Bump
Minimum bond pad size 80x80, pad pitch of 90,
Distance btw 1
st
& 2
nd
Bond btw 1-5mm length
Metallization thickness of min 100nm of material Au/Al with a bond pad
appropriate seed layer.
Laser Dicing Machine
Make M/s. Miyachi Unitek
Model LW70AE
Mode Semi Automatic
Type Nd-YAG Laser
Laser Welding machine has capability of Spot and Seam welding MEMS packages made
of metals and alloys such as SS304/304L/316/321, Kovar, Invar etc
Tool Specifications:
Type Delta BDMS four (4) axis
Enclosure 40"W x 26"D x 40"H
XY Table 6" x 6"
Power Supply 220VAC, 50 Hz
Work Holding 5" rotary stage with 3-
jaw chuck & Collets
Work Holding
Capacity
50mm diameter parts
Laser Specifications:
Type Nd-YAG
Coolant Water Cooled
Power Supply 400 VAC, 3 - phase
Max Avg Power 70W
Max Pulse Energy 70J
Pulse Duration 0.25-30ms
Wavelength 1064nm
Pulse repetition 1-200Hz
Thermocompression Bonding:
A process which involves the use of force, time, and heat to join the two materials.
The wire (heated in some cases) is pressed against the hot surface (at 300
0
C or more)
at high force for a limited period of time to achieve the bond.
Wire Bonding Types
Thermosonic Bonding:
A process which involves the use of force, time, ultrasonics and heat to join two materials.
The wire (heated in some cases) is pressed against the hot surface (at 150 deg. C or less)
at low force and vibrated for a limited period of time to achieve the bond.
Wirebonding Temperature Ultrasonic energy Wire Pad
Thermocompression 300-500
o
C No Au Al, Au
Thermosonic /Ultrasonic 100-150
o
C Yes Au Al Au
Pressure calibrators
Make DH-Budenberg Make DH-Budenberg
Pressure Calibrator (Hydraulic and Pneumatic):
Hydraulic Pressure Calibrator(0-1200bar) and Pneumatic Calibrator (-1 to
100bar) with data acquisition system are available for pressure transducer
calibration and characterization.
Make DH-Budenberg
Type Hydraulic
Model DHB 42/501
Range 0 to 1200 bar
Make DH-Budenberg
Type Pneumatic
Model DHB 42/041
Range -1 to 100 bar
Hot and Cold Chamber
Make M/s. Vtsch
Model VCL7003
Mode Automatic
Tool Specifications:
Test space volume 34 Lts
Temperature Range for
temperature tests
-70
0
C to +180
0
C
Temperature Range for
climatic tests
+10
0
C to +95
0
C
Humidity range 10% r.h to 98% r.h
Data capture Simpati, Software Package
This Hot and Cold Enclosure / Test Chamber is used for evaluating
device quality, reliability and identify manufacturing flaws on MEMS
devices.