5.

DIFFERENT ENVIRONMENT TESTS FOR RELIABILITY

Test using stress beyond the design limit of the product, is successful at uncovering
faults in both product design & the manufacturing process and ensures the overall
robustness of the product. The benefits of overstress test includes following:
Early detection of latent faults
Reduced total engineering time and cost
Higher reliability
Greatly reduced manufacturing screening costs
ifferent overstress test are as following:
H!"T #Highly !ccelerated "ife Test$
H!%% #Highly !ccelerated %tress %creen$
&E'%T #&ulti Environment 'ver %tress Test$
(EE evaluation Engineering, )*enefits and cost of overstress testing+, Edmond ".
,yser, www.evaluationengineering.com-archive-articles-.//0halt.htm1
5.1 DEFINITIONS
Broadband Vibration: 2ibration that contains energy over a broad fre3uency range
#i.e. 4/ to ./,/// H5$ is 6nown as broadband vibration.
Correctie Action !CA": ! change implemented in a design or process to eliminate a
product wea6ness is 6nown as corrective action. 7orrective actions may include
changes in parts or material sources, product design, and production process changes.
De#tr$ct Li%it !DL": The stress level where one or more of the product8s operating
characteristics are no longer within specification is 6nown as destructive limit. The
product does not recover once the stresses are reduced. !lso, 6now as a hard failure. 9t
includes :pper estruct "imit #:"$ and "ower estruct "imit #""$.
&''er De#tr$ct Li%it !&DL": 9t is the point at which the product does not return
after the stress is decreased.
Lo(er De#tr$ct Li%it !LDL": 9t is the point at which the product does not return
after the stress is increased.
F$nctiona) Te#t: ! test of the product that measures functionality, product operation,
and critical parameters to determine if product fails to perform to specifications or
degradation has occurred within the product. ;unctional testing is to be performed
throughout the environmental stresses of H!"T.
O'erationa) Li%it !OL": The stress level prior to where one or more of the product8s
operating characteristics are no longer within specification. The product recovers
when the stress is reduced. !lso 6now as asoft failure. 9t includes :pper 'perating
"imit #:'"$ and "ower 'perating "imit #"'"$.
&''er O'eratin* Li%it !&OL": 9t is the point at which the product stops operating
or specification is no longer being met, but returns to normal after the stress
#temperature$ is decreased.
Lo(er O'eratin* Li%it !LOL": 9t is the point at which the product stops operating
or specification is no longer being met, but returns to normal after the stress
#temperature$ is increased.
Vibration O'eratin* Li%it !VOL": 9t is the point at which the product stops
operating or specification is no longer being met, but returns to normal after the
vibration level is decreased.
Vibration De#tr$ct Li%it !VDL": 9t is the point at which the product does not return
after the vibration level is decreased below the operating limit.
+o(er S'ectra) Den#it, !+SD": ! measurement of the amplitude and fre3uency
content of a random vibration spectrum, e<pressed in units of g4-H5. 9t also
commonly referred to !cceleration %pectral ensity #!%$.
-$a#i.Rando% Vibration: 9t is a non=periodic vibration that possesses all
fre3uencies within a band limit and having a continuously varying amplitude and
phase that is specified as a probability that it will e<ceed a given value during a time
interval.
Re'etitie S/oc0 Vibration !RS": 9t is a vibration originating from a repeated shoc6
impulse e<citation. Typically created from pneumatic hammers impacting a vibration
table to which test samples are attached.
Root Ca$#e Ana),#i# !RCA": 9t is the process of identifying the true cause of a
wea6ness. 9t includes fully understanding of what failed and why.
Si1 De*ree o2 Freedo% Vibration !3DOF": 2ibration that has simultaneous
acceleration energies in three translations and three rotations is 6nown as si< degree of
freedom vibration.
Ste' Stre##in*: !n e<perimental process of se3uentially increasing a stress level to
identify product limitations is 6nown as step stressing.
+roo2.o2 4Screen !+OS": ! process of showing that screen does not damage good
hardware and the screen is effective in finding all of the defects present in a product.
5ALT !5i*/), Acce)erated Li2e Te#t": 9t was developed by r. Grebb ,. Hobbs of
hobbs Engineering 7orporation. ! process that utili5es a step stress approach in
sub>ecting products to varied accelerated stresses to discover design limitations of the
product. H!"T is intended to discover the stress limits of a product and identify
product wea6nesses.
5ASS !5i*/), Acce)erated Stre## Screen": 9t was developed by r. Grebb ,. Hobbs
of hobbs Engineering 7orporation. 9n H!%% highest possible stresses are used in
order to reduce the time of the screen. The screen must be proven using the ?roof=of=
%creen process prior to using it in manufacturing. (. @ualmar6 corporation )H!"T
Guidelines+, http:--www.3ualmar6.com-?;-H!"TAguideline.pdf )H!%% guidelines+
http:--www.3ualmar6.com-?;-H!%%Aguideline.pdf and 0.+ summary of H!"T and
H!%% results at an accelerated reliability test center+ by &i6e %ilverman, 7.R.E, 'ps
! "a 7arte, ""7,
www.opsalacarte.com-pdfs-TechA?apers-S$%%ar,A5ALTA5ASS.pdf 1
5.6 5ALT Te#t:
E7$i'%ent Re7$ire%ent#
The e3uipment re3uired to perform H!"T testing must be capable of producing
thermal and vibration energy stresses as defined limit. The e3uipment must also create
these stresses in a combined environment within the same chamber at the same time.
5ALT Te#t +roced$re
H!"T test includes following steps.
.$ Temperature#thermal$ step stress
4$ Rapid temperature#thermal$ transition
0$ 2ibration step stress
B$ 7ombined environment stress test
1" Te%'erat$re #te' #tre##: Temperature %tep %tress shall begin at ambient #defined
as 4/C7 to 0/C7$.9t includes cold step stress and hot step stress.
a" Co)d #te' #tre##: 7old step stress is performed because it is usually the least
destructive of all stimuli applied. Generally the cold step stress begin at 4/ 7 and
temperature is decreased in ./ 7 steps until the lower operating and destruct limit are
determined. Dhen possible, modifications are made to the product as the failures are
encountered to increase these limits and rugged the product. 9f modification cannot be
made because the failure is not easily correctable, thermal barrier is used so that
sensitive areas are 6eeping at a lower stress level than the rest of the product while the
temperature is decreased. The dwell time at each step is appro<imately ./ minutes to
allow time to component temperatures to stabili5e plus the time need to chec6 the
functionality of the product under test.
b" 5ot #te' #tre##: Generally the hot step stress begins at 4/ 7 and temperature is
increased in ./ 7 steps until the upper operating and destruct limit are determined.
Dhen possible, modifications are made to the product as the failures are encountered
to increase these limits and rugged the product. 9f modification cannot be made
because the failure is not easily correctable, thermal barrier is used so that sensitive
areas are 6eeping at a lower stress level than the rest of the product while the
temperature is increased. The dwell time at each step is appro<imately ./ minutes to
allow time to component temperatures to stabili5e plus the time need to chec6 the
functionality of the product under test.
Fi*$re.5.1 Te%'erat$re #te' #tre##
6" Ra'id te%'erat$re tran#ition: uring this phase, continuous cold and hot ramps
are applied to the product as fast as the chamber and product would allow. The
temperature e<tremes chosen are based on the operating limits determined during the
temperature step stress.
! minimum of five thermal cycles are performed unless a destructive failure is
encountered. The thermal transitions are performed at the ma<imum attainable rate of
change. The minimum thermal cycle temperature range is within ./C7 of both the
lower thermal operating limit and the upper thermal operating limit as discovered
during temperature step stress. The dwell time is a minimum of five minutes.
;unctional testing of the sample is conducted on a continuous basis throughout the
transition #ramp$ portions of the e<posure, where possible, to determine whether there
are thermal rate sensitive issues.
Fi*$re.5.6 Ra'id te%'erat$re tran#ition
8" Vibration #te' #tre##: 2ibration step stress process begin at 0=E Grms and
increased in 0=E Grms increments until the operating and destruct limit are
determined. Dhen possible, modifications are made to the product as the failures are
encountered to increase these limits and rugged the product. 9f modification cannot be
made because the failure is not easily correctable, epo<y or RT2 is used between the
body of the component and board-product surface or between two ad>acent
components to help remove stress from the leads of the component so that the rest of
the product can be ta6en to a higher level of vibration. The dwell time at each step is
appro<imately ./ minutes. The product is functionality tested at each dwell.
Fi*$re.5.8 Vibration #te' #tre##
5" Co%bined eniron%ent #tre## te#t: !fter the individual stimuli are applied, the
product is sub>ected to a combined environment of vibration and thermal stress with
fast temperature transition rates. ! minimum of five combined environment cycles is
re3uired unless a destructive failure is encountered prior to completion of the five
cycles. The thermal profile for the combined environment test is performed by cycling
between the thermal operational limits. The minimum dwell period at each thermal
e<treme is ten minutes. The starting vibration level for the five re3uired cycles is
determined by dividing the ma<imum vibration level applied during vibration step
stress by five. The vibration level is increased by the same number during each
subse3uent thermal cycle. Therefore, if the sample e<perienced a destruct failure at 0E
Grms during the vibration step stress, the initial test cycle would be conducted at a
vibration level of F Grms. The vibration level would be increased by F Grms after
each complete thermal cycle G 7ycle .: F Grms, 7ycle 4: .B Grms, 7ycle 0: 4. Grms,
7ycle B: 4H Grms, 7ycle E: 0E Grms.
Fi*$re.5.9 Co%bined eniron%ent #tre## te#t
:. @ualmar6 corporation )H!"T Guidelines+,
http:--www.3ualmar6.com-?;-H!"TAguideline.pdf ;
:/tt':<<(((./obb#en*r.co%<'a'er#<5ALTand5ASS.+aradi*%.doc and 6
summary of H!"T and H!%% results at an accelerated reliability test center+ by &i6e
%ilverman, 7.R.E, 'ps ! "a 7arte, ""7,
www.opsalacarte.com-pdfs-TechA?apers- S$%%ar, A 5ALT A 5ASS .pdf;
Fi*$re.5.5 5ALT %ar*in di#coer, c$re
5.8 5ASS TEST
!n important first step to setting up the H!%% is the completion of H!"T on the
product. The H!%% limit will be set based on the operational and destruct limits
found in H!"T. ?rior to setting up H!%%, it is important that corrective action has
been implemented on all H!"T failures. (Highly !ccelerated "ife Testing=Testing
with a different purpose by Ieill oertenbach, @ualmar6 7orporation, 9E%T, 4///
proceeding, ;eb=4///, pp=.=H1
5ASS Dee)o'%ent inc)$de# t/e 2o))o(in* 'roce##e#:
E3uipment Re3uirements
;i<ture esign
?rofile esign#screening process$
?roof of %creen
()H!%% guidelines+ http:--www.3ualmar6.com-?;-H!%%Aguideline.pdf1
5ASS 'roce##:
E7$i'%ent: The e3uipment used to H!%% is similar to that used in H!"T, although
often a larger chamber is used to accommodate production 3ualities.
Fi1t$re: To support both vibration and thermal re3uirements, fi<ture is necessary to
perform screening on one or multiple units. The product fi<ture needs to be able to
withstand the fatigue damage caused by the repeated stresses that will occur over the
fi<ture8s lifetime. The fi<ture needs to be lightweight, rigid, and have low thermal
mass. @uic6 release clamps are often used instead of nuts and bolts for securing the
product.
uring H!%% stresses are applied simultaneously. Typically the product is sub>ected
to continuous vibration while temperature is ramped between its limits, with short
dwell at the e<tremes.
Screenin* 'roce##: There are two parts of screen. .$ ?recipitation screen. 4$
etection screen.
The typical levels chosen )rule of thumb+ are H/J of the cumulative range of the
upper and lower thermal operating limits.
K L ##"'" = :'"$M .4/$ - 4.
Dhere K L margin temperature subtracted from both the "'" and :'".
E<ample: for :'" of .//C7 and "'" of =E/C7 e3ual .E/C7 range, use HEC7 and
=0EC7.
2ibration set point levels should be established to obtain a product response e3ual to
E/J of the " product response, but within the '" product response, found during
H!"T, as measured on the product. 9f the E/J value e<ceeds the '", then use
appro<imately H/J of the '" as the set point.
1" +reci'itation #creen: This screen stresses the product beyond its operational
limit and near the destruct limit found in H!"T. !s the product is being
product at this point.
6" Detection #creen: uring this screen product is stressed to near the
operational limit found in H!"T. Here product is being functionally tested.
!ny hard failures induced during precipitation screen will be detected.
Fi*$re.5.5 +reci'itation and detection #creen 2or 5ASS 'ro2i)e
+roo2.o2.Screen !+oS": The goal of the ?o% is to demonstrate that the screen will be
reliably find defects without inducing failure or significantly reduce the life of the
product. ?roof=of=%creen is a two step process. The first step is screen effectiveness to
determine how effective the screen is in detecting manufacturing flaws. This is done
by precipitating and detecting latent defects. The second step is life valuation to prove
that the screen has not removed significant life from the screened products.
Fi*$re.5.3 =enera) 5ASS 'ro2i)e
Fi*$re.5.> 5ASS 'ro2i)e o2 'reci'itation and detection #creen
:5i*/), Acce)erated Li2e Te#tin*.Te#tin* (it/ a di22erent '$r'o#e b, Nei)) Doertenbac/?
-$a)%ar0 Cor'oration? IEST? 6@@@ 'roceedin*? Feb.6@@@? ''.1.A? and :B5ASS *$ide)ine#C
/tt':<<(((.7$a)%ar0.co%<+DF<5ASSD*$ide)ine.'d2? and B 5ALT AND 5ASS
T5E ACCE+TED -&ALITY AND RELIABILITY +ARADI=MC B, =re** E. 5obb#?Ma,.
6@@A? 5obb# En*ineerin*;
1
5.9 S&MMARY
?oor reliability, low &T*; and customer dissatisfaction are often the result of
design or process wea6nesses in product, even if they have successfully passed
3ualification test at the design phase. The best method to find these problems 3uic6ly
is to use H!"T and H!%%. H!"T has been applied almost every type of electrical and
electromechanical product, and many purely mechanical product as well.
uring the H!"T process, a product is sub>ected to progressively higher stress
levels brought on by thermal dwells, rapid thermal transitions, vibration and
combined environment. The stress level for each stimuli applied is raised in small
steps well beyond the field environment. H!"T is primarily a design ruggedi5ation
process.
9n order to improve the product8s reliability and increase its &T*;, the root
cause of each failure discovered in H!"T must be determined and corrective action
ta6en to eliminate them. 'nce corrective action have been ta6en, the product8s
operating and destruct limits can be used to develop an effective H!%% for
manufacturing which will 3uic6ly detect wea6 lin6s without removing appreciable
amount of life from the product. This H!%% process will ensure that the reliability
gains achieved through H!"T will be maintained in future production.