Beruflich Dokumente
Kultur Dokumente
& S U L L I VA N
Report released by
Secretary
Department of Electronics & Information Technology
Ministry of Communications & Information Technology
Government of India
IESA is the premier trade body representing the Indian Electronic System Design and Manufacturing ESDM industry and has represented it since
2005. It has over 200 members - both domestic and multinational enterprises. IESA is committed towards building global awareness for the Indian
ESDM industry and supporting its growth through focused initiatives in developing the ecosystem. This is through publishing credible data,
networking events and alliances with other international associations IESA works closely with the Government as a knowledge partner on the
sector, both at the centre and at the state level.
www.iesaonline.org
The material in this publication is copyrighted. No part of this book can be reproduced either on paper or on electronic media without permission
in writing from the publisher. Requests for permission to reproduce portions of it should be sent to the IESA at the above address.
First print: January 2014
Published by:
India Electronics & Semiconductor Association, Bangalore
Edited by:
Debanjan Sinha, IESA
Designed by:
Cocoon Creative Concepts, Bangalore
COPYRIGHT
All content included in this study, such as text, graphics, logos, images, data compilations, etc. is the property of India Electronics & Semiconductor
Association (IESA). The study is for customers internal use and not for general publication or disclosure to third parties. No part of this study may
be given, lent, resold, or disclosed to non-customers or exploited for any commercial purposes. Furthermore, the Study in its entirety or any part
cannot be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electronic, mechanical, photocopying, recording,
or otherwise, without the prior written consent of IESA.
Acknowledgements
The research report on the Indian ESDM industry will be incomplete without acknowledging the contribution of all the
individuals associated with this exercise. These individuals have been untiring in their efforts to bring in their wealth of
experience and knowledge base to add value to the exercise. The research exercise could leverage their acumen and count on
their unwavering support till the stage of its completion.
India Electronics & Semiconductor Association and Frost & Sullivan would wish to thank them wholeheartedly for their valuable
time and guidance whenever we needed them.
MESSAGE
The India ESDM industry presents a huge opportunity and is expected to
emerge as a vital contributor to the nations economy. While we continue to dominate
the high-end semiconductor design space, we are also seeing a major shift in focus
from just design to end-to-end product conception and manufacturing to truly
dominate the global ESDM industry.
The Department of Electronics and Information Technology (DeitY),
Government of India has been actively working towards reviving indigenous
manufacturing in a big way. IESA has also played a prominent role in supporting the
Government in its initiatives.
In order to realize the vision of the ESDM industry, we would need to promote
the opportunities presented by the ESDM industry to attract investments in the sector.
As the electronic products have a pervasive role in all industry verticals, it is desirable
that the industry reports on the market opportunities in key products are carried out,
which would serve as useful reference to the various stakeholders, and, thereby, help
them in taking informed decisions on their plans of investing in India.
The IESA - Frost & Sullivan Report 2014 on the Indian ESDM MarketAnalysis of Opportunity and Growth Plan is a right step in this direction. This report
includes an extensive study and analysis of the top 25 high priority electronic
products and their related components in the Indian ESDM industry. This report also
gives insightful information on resolving the current challenges and the
recommendations to move ahead.
I congratulate DeitY and IESA for putting together this important and timely
report for the benefit of all the stakeholders of the Indian ESDM industry. I am sure it
will help us in achieving our vision of taking India to global leadership in the ESDM
industry.
(KAPIL SIBAL)
Message
With the Indian ESDM industry is expected to touch the USD 400 billion
mark in the coming decade, the Government of India has identified the
electronics hardware manufacturing sector as a major thrust area for the
country. IESA has done a commendable job of catalysing the growth of the
domestic ESDM industry and is relentlessly working towards this objective.
Taking cognizance of the demands of the economy and the industry, the
Government of India has taken a number of steps to promote the Indian
ESDM industry.
The Department of Electronics & Information Technology (DeitY) and IESA,
as the Knowledge Partner to the Government, have brought out the report on
Indian ESDM Market Analysis of Opportunity and Growth Plan. This report
identifies the top 25 electronics product markets with large opportunities and
draws a roadmap for their growth. It also identifies the major components
used in these products and evaluates strategies to promote their ecosystem
in India.
I am sure that this credible report would be extremely valuable for decision
makers both in the government and the industry. I congratulate DeitY and
IESA for their excellent work in putting together this informative and timely
report.
(J. Satyanarayana)
New Delhi
January 02, 2014
W-11/68/2013-IPHW
January 06, 2014
Message
The Indian ESDM industry is poised for exponential growth. India, as one
of the biggest markets for electronics products, is at a crucial juncture
today. With companies from the world over vying for their share of the pie,
Indian companies today have the opportunity to dominate the global ESDM
landscape by catering to this enormous local demand. Product innovation
and manufacturing are the keys to capturing the market and establishing
market leadership.
In this regard, the IESA-Frost & Sullivan Report on Indian ESDM Market
Analysis of Opportunity and Growth Plan could not have come at a better
time. With awareness about domestic manufacturing at a new high, Indian
decision makers and the investors are looking for credible data on various
products and components that make up the ecosystem. The IESA-F&S
Report conducts an extensive study and SWOT analysis of the top 25 high
priority electronic products and their related components.
This Data is also invaluable for the industry and the investors looking to
capitalize on the opportunities available in the Indian ESDM industry. The
recommendations in the report will also help us to leapfrog the challenges
and quickly respond to market dynamics.
It is indeed heartening to note the single-minded focus that IESA brings
to promote the growth of the Indian ESDM industry through its various
initiatives.
I complement IESA in bringing out this timely report.
Yours Sincerely
New Delhi
January 06, 2014
Table of Contents
Foreword 15
Preface
17
Executive Summary
19
33
39
45
49
53
59
65
71
75
79
85
91
97
101
107
113
117
121
125
129
135
141
145
151
157
163
Appendix 167
Foreword
The Indian electronics system design and manufacturing (ESDM) industry is at a huge inflection point.
From being predominantly consumption driven, the Indian ESDM industry has a major potential to
become a design led manufacturing industry. Concerted efforts from both the Government and the
industry are required to propel the Indian ESDM industry into one of the critical GDP contributors
in the near future.
The Indian Electronics and Semiconductor Association (IESA), a premier representative body for the
ESDM industry in India commissioned a full-fledged research in its efforts to map the current status
and future opportunities in the industry. The objective of the report was to establish the current
status of all the value chain components in the ESDM industry and identify the growth trends. This
exhaustive report developed by IESAs consulting partner, Frost & Sullivan, and released in early
2013 is the only authentic detailed report on the overall ESDM industry in India. As a next step, there
was the pertinent need to identify the high growth product markets within the overall electronics
industry and do a deep dive evaluation of the existing ecosystem for these products. This study
would help identify the appropriate initiatives needed for further developing the ecosystem for
these high priority products.
The Department of Electronics and Information Technology (DeitY) has been very active in
formulating and announcing various policy measures aimed at developing the ESDM industry in
India. To ensure the effective implementation of these policies and for directing the focus in the right
direction, this extended analysis of the top 25 high priority electronic products was commissioned
by IESA.
The report on the ecosystem SWOT analysis of the top 25 high priority products covers the following
product markets:
1.
Mobile Phones
2.
3. Notebooks
4. Desktops
17. CFL
5.
Digital Cameras
6.
7.
8.
4W EMS
9.
LCD Monitors
22. Tablets
10. Servers
25. 2W Ignition
Preface
IESA is today recognized as the most credible voice of the Indian ESDM industry. As
the knowledge partner to the Government of India and the foremost trade body
representing the interests of over 200 member companies in the Indian ESDM
landscape, IESA regularly undertakes research and publication activities. The IESAFrost & Sullivan annual report on the Indian ESDM industry is one such report that
is much awaited and widely referred by decision makers in the government as well
as the industry.
The IESA- Frost & Sullivan report 2014 is the seventh publication since its inception
in 2005. This year we have conducted an extensive study and SWOT analysis on
the Top 25 high priority electronic products and their related components in the
Indian ESDM industry. As we aggressively promote indigenous manufacturing
and reduction of our dependence on imports, this report aims to uncover the
challenges associated with manufacturing these top 25 electronic products and
associated components domestically.
The findings of the report are interesting. And as always, we have proposed a range
of measures to overcome these challenges and kick-start high-value addition
manufacturing activities in a big way in India.
We sincerely hope that you will find these facts and statistics beneficial for strategic
decision making and join us in taking the right steps to further enrich the Indian
ESDM industry.
Executive Summary
The Indian electronics system design and manufacturing (ESDM) industry is one of the fastest growing sectors in the country.
Witnessing uninterrupted growth, the ESDM industry in India is globally renowned for its consumption potential. Changing
global landscapes in electronics design and manufacturing capabilities, and cost structures have turned the attention of global
companies towards India. Companies from around the world are looking to build local capabilities in India not just to serve the
resident market but also to cater to overseas markets.
This has resulted in the development of indigenous capabilities across the ESDM value chain in India. The different segments
within the ESDM industry are at varying stages of development. Similarly, various electronics applications markets such as
telecom electronics, automotive electronics, consumer electronics and industrial electronics, are at different stages of ecosystem
development. The focus is currently on providing the necessary impetus to take advantage of the dormant capabilities across the
various electronics markets and developing the missing links so as to make the local ESDM sector globally competitive.
The Indian ESDM industry was estimated to be $68.31 billion in 2012. The impressive guidance between 2011 and 2015 for this
industry is expected to result in a Compound Annual Growth Rate (CAGR) of 9.88 percent. The corresponding size of the industry
by 2015 is anticipated to be $94.2 billion. The following chart illustrates the total ESDM industry market growth:
94.20
90
84.16
Revenues ($ Billion)
80
75.61
70
60
59.01
64.61
68.31
2011
2012
50
40
30
20
10
0
2010
2013
2014
2015
The ESDM industry in India comprises the following four key components:
1. Electronic Products
2. Electronic Components
3. Semiconductor Design
4. Electronics Manufacturing Services (EMS)
Of the above, the first two represent products while the remaining highlight the services opportunities catering to the domestic
and export markets.
19
64.85
60
TM: 11.5%
57.14
50.61
50
40
39.21
TDM (Low/Med
value add) : 12.3%
44.81
41.91
30
20
10
4.12
15.27
3.74
15.44
3.55
17.07
3.62
10.55
11.54
11.89
13.46
14.67
2011
2012
22.68
4.35
18.33
15.57
0
2010
19.47
3.9
2013
2014
2015
Note: Total market or TM refers to the domestic electronics consumption in India which therefore includes all locally manufactured and locally consumed
products as well as imports.
Total domestic market or TDM refers to the domestic production that caters to domestic demand. Value addition is classified into two broad categories:
1. Low/Medium Value Add: Includes negligible sourcing, minimal design activity, EMS, SKD and CKD assembly; corresponds to value addition of upto 50%
(<20% being low value add and 20%-50% being medium value add)
2. High Value Add: Includes high local sourcing, high levels of indigenous design and complete system manufacturing; corresponds to a value addition
of >50%.
20
National Policy on Electronics (NPE): The objective of the NPE is to create an ecosystem for a globally competitive
ESDM sector in the country by attracting investment of about USD 100 billion and generating employment for around 28 million
people at various levels. The ultimate aim of the policy is for the Indian ESDM sector to develop core competencies in strategic and
core infrastructure sectors like telecommunications, automobile, avionics, industrial, medical, solar, information and broadcasting,
railways, intelligent transport systems, etc.
National Manufacturing Policy (NMP): The government has brought out the NMP to increase the growth of the
manufacturing sector to 12 to 14 percent over the medium term and enable manufacturing to contribute at least 25 percent to
the National GDP by 2022.
Modified Special Incentive Package Scheme (MSIPS): The MSIPS aims to offset cost disabilities and attract
investments in the India ESDM sector through an INR 10,000 crore corpus. Subject to certain investment thresholds, subsidies to the
tune of 20 per cent for SEZ units and 25 per cent for non-SEZ units will be given on capital expenditure along with reimbursement
of excise/CVD.
Setting up semiconductor fabrication units: The Government of India has received the applications of two
consortia (IBM, Jaypee Group, TowerJazz; STMicroelectronics, HSMC) to establish 2 semiconductor wafer fabrication units in Gujarat
and Noida with the aim of operating at 20 nm process node within two years of initial operations and reaching a capacity of at least
40,000 WSPM of at least 300 mm size. Various incentives are being offered by the government to this effect: 25 per cent subsidy
on capital expenditure and growth capital expenditure, reimbursement of CVD and excise duty, exemption from basic customs
duties and 200 per cent deduction on R&D activities, among other incentives such as reimbursement of training costs, deduction
for income tax and various forms of viability gap funding.
Electronic Manufacturing Clusters (EMCs): The government is offering financial support for the development
of EMCs. For greenfield EMCs, assistance will be given up to 50 per cent of the project cost subject to a ceiling of INR 50 crore for
every 100 acres of land. For brownfield EMCs, assistance will be given up to 75 percent of the project cost subject to a ceiling of
INR 50 crore.
Electronics Development Fund (EDF): The EDF aims to create an ecosystem of R&D in electronics in India which
will promote IP generation and large scale manufacturing, while simultaneously fostering the growth of the ESDM ecosystem. The
focus of EDF will largely revolve around small and medium enterprises (SME) in line with the goal of promoting innovation and job
creation.
21
The chart below captures the salient features of the various government initiatives to promote the Indian ESDM sector.
To attract
investment of
USD 100 billion
and generate
employment of
28 million
NPEs mission
is to promote
manufacturing
and R&D across
the value chain,
especially in
strategic
electronics
Aim to reach
20nm process
node within 2 years
of initial phase,
and reach at least
40,000 WSPM of
300 mm
25% subsidy on
capex; CVD and
excise reimbursed;
BCD exempted;
200% R&D
deduction; etc.
IBM, Jaypee,
and TowerJazz;
and STMicro
electronics and
HSMC got approval
in principle
to establish 2
semiconductor
fabs
Financial support
will be offered for
development of
EMCs to aid growth
of ESDM through
innovation and
entrepreneurship
NPEs vision is
to create
a globally
competitive ESDM
ecosystem to
meet the countrys
needs and serve
the international
market.
MSIPS makes
available a corpus
of INR 10,000
crore to attract
investment in
ESDM
20% Capex
subsidy for SEZ
units; 25% Capex
subsidy for non-SEZ
units and CVD/
excise
reimbursed
EDF is a planned
scheme of DEITY to
create ecosystem
of electronics R&D
and promote IP
generation
Brownfield: 75 per
cent of project cost
subject to ceiling of
INR 50 crore
Scope of policy
includes:
nanoelectronic,
semiconductor
fab, solar, LED,
LCD, passive
components,
and EMS
Greenfield: 50
percent of project
cost subject to
ceiling of INR 50
crore for every 100
acres of land
22
Revenue
% of
Total
Product
Revenue
% of Total
Mobile Phones
38.85%
Base Stations
1.61%
FPD TV
7.91%
Power Supplies
1.28%
Notebooks
5.54%
1.13%
Desktops
4.39%
1.06%
Digital Camera
2.73%
Routers/Switches
1.05%
2.65%
Car Radio
1.02%
CFL
1.00%
LCD Monitors
2.02%
0.66%
Servers
1.72%
Energy Meters
Digital Instrument
Clusters
Smart Cards
Total of Top 10
Products
70.60%
2.46%
2.33%
Total of Top 20
Products
0.58%
0.52%
80.52%
Mobile Phones
FPD TV
Notebooks
Desktops
Digital Camera
4W EMS
LCD Monitors
Servers
Base Stations
Power Supplies
Routers / Switches
Car Radio
CFL
Energy Meters
Smart Cards
Base Year: 2011 Source: IESA-Frost & Sullivan
Beyond just these top 20 products, it is also essential to identify as high priority those product markets that are currently not
amongst the top 20 in their contribution to the overall revenues, but have growth trends in excess of even these top 20, thus
indicating their potential to be significant product markets by 2015. Identifyingfive such products with significant CAGR trends and
providing them the necessary impetus for ecosystem development is also important for the growthof the ESDM industry. The chart
below highlights five such products across industry segments that have the potential, and hence, deserve the thrust.
Indian Electronics Market: Top 5 Products by with Highest CAGR (till 2015)
Industrial Electronics
Automotive Electronics
Telecommunications
IT/OA
23
Consolidated SWOT Analysis of the Ecosystem for the High Priority 25 Product Markets
STRENGTHS
OPPORTUNITIES
Strong Design and R&D Capability in Select Products Auto electronics, industrial etc.
SWOT
WEAKNESS
THREATS
24
Mobile Phone
Memory (22%)
Display (19%)
FPD TV
Display( 50%)
ICs ( 15%)
Notebooks
Display (18%)
Processor (15%)
Component 3
Application Processor /
System on Chip (15%)
Electromechanicals (
15%)
Motherboard (12%)
Desktop
Processor (15%)
Monitor (15%)
Motherboard (12%)
HDD (10%)
Digital Camera
Lens (30%)
Battery (10%)
Inverter, UPS
Transformer(50%)
Heat sink(10%)
Microcontroller(5%)
Memory Cards,
Drives
EMS 4 W
Mechanicals - Pump,
Injectors (40-50%)
Microcontroller (10%)
LCD Monitor
Display( 50%)
ICs ( 10%)
Power ( 5%)
10
Servers
Processor (25%)
Electromechanicals (
15%)
Memory (25%)
Motherboard (15%)
HDD (12%)
11
BTS
IC (40%)
Antenna (10%)
12
Power Supplies
Transformer (30-40%)
Power Semiconductor
Rectifier diodes
13
IC (MPU,Memory,Tuner) PCB
14
15
Product
Component 1
Component 2
Analogs+Sensors (20%)
Component 4
Camera
Power ( 5%)
HDD (10%)
Fusing Roller
Transformer
PCB
Plastics and
Mechanicals
Lens and scanner
Processor (10%)
Memory (10%)
Electromechanicals
PCB ( 10%)
Power ( 10%)
Transformer (10-15%)
LCD Display and
backlight (15%)
Transistor (10%)
Microcontroller (10%)
LCD (7%)
Power supplies
16
Car Radio
ICs ( 30%)
17
CFL Lamps
Capacitor (20%)
Electromechanicals (
20%)
Glass tube (20%)
18
Energy Meters
Transformer (20%)
19
Digital
Instrument
Cluster
PCB (15%)
20
Smart cards
ICs (62.5%)
21
GPON ONT
PETG/Polycarbonate
body (20%)
Optical Module (35-40%) System on Chip (15%)
22
Tablet
Display (38%)
Memory (10%)
Battery (10%)
23
LED Lights
LED (25%)
Driver (20%)
Heatsink (15%)
24
Payment
Terminals
25
2 W Ignition
Communication Module
LCD/TFT Display (16%)
(16%)
Power semiconductor
Microcontrollers (20%)
(20%)
Software OS (10%)
Power Supply (8%)
Antenna ( wire or
printed) (7.5%)
Memories (5%)
Processor (10%)
Thermal interface
material (7%)
Printers (16%)
Processor (14%)
Transformer (10%)
The percentage in brackets in the table above indicates the contribution of each component to the overall product bill of materials
(BoM). The most common components that are within the top 4 BoM contributors across these 25 products are the following:
Power devices and semiconductors
Processor
Memory
Printed circuit board (PCB)
LCD display
Transformer
25
Semiconductors: As observed, 3 of these top 5 key components (power semiconductor, memory and processor) include
semiconductor chips and devices. Currently, the absence of a local fab implies complete reliance on imports for these components.
The FAB initiative that is expected to usher atleast 2 semiconductor fabs in India in the foreseeable feature shall help in making
these core chips available locally. Given the numerous applications that require processing capability, creating an India-specific
processor design, and fabricating them in local chips shall ensure a significant contribution to the local value addition.
Absence of Fab
STRENGTHS
RECOMMENDATIONS
Source: IESA-Frost & Sullivan
Printed Circuit Board (PCB): India has a good number of PCB manufacturers in the country. However the local capability
is restricted to producing single, dual and multi layered PCBs of upto 8-12 layers. The PCBs needed in most of the 25 high priority
products, especially in telecom, consumer and automotive applications, require complex multi-layered PCBs that are not available
locally, thus necessitating imports. Building on the existing capability, special initiatives need to be targeted to encourage
indigenous design and manufacturing of multi-layered PCBs of upto 64+ layers. This will ensure local sourcing of PCBs for product
manufacturers, thus contributing to higher value addition; this shall also meet the requirements of the local EMS players who
source PCBs in bulk.
PCB Ecosystem Assessment
CHALLENGES
PCB manufacturing capability
exists locally
Strengths in single, dual layers
Capability to do multiple
layers too for less complex
applications
Export market exists
STRENGTHS
RECOMMENDATIONS
Source: IESA-Frost & Sullivan
26
STRENGTHS
RECOMMENDATIONS
Source: IESA-Frost & Sullivan
Transformers: Transformers belong to the larger family of wound components. This is a market that is dominated by small
scale indigenous manufacturers as it requires limited infrastructure and inexpensive labour. Consumer and industrial electronics
segments drive the demand for transformers and, owing to cost advantage, transformers are predominantly imported from China,
Taiwan and South Korea. Reliance on import for raw materials, specifically copper, is a major handicap for Indian transformer
manufacturers in achieving faster turnaround time as well as lower production costs.
Transformer Ecosystem Assessment
CHALLENGES
Huge consumption demand
End use product
manufacturing through OEMS
and EMS exists
Local design know how and
manufacturing technology
skills exists
STRENGTHS
RECOMMENDATIONS
Source: IESA-Frost & Sullivan
27
Mobile phones
Offering incentives to develop India as a hub for mobile phones batteries
Developing policies to address the disability costs associated with local manufacturing through
- exemption of CVD on imported capital equipment and excise duty on capital equipment sourced locally;
- levying of a tax equivalent to CST on imported mobile phones;
- basic customs duty and CVD exemption from on all imported capital equipment for manufactureof mobile phone parts and
components.
Developing India-specific certifications to ensure quality of products. This would also act as a non-tariff barrier that would
incentivize local manufacturing.
Flat panel TV
Encouraging domestic assembly, including low value add activities,to boost local sourcing and generate employment in the
long run.
Setting up a center for excellence for LCD and LED displaysto encourage indigenous development
Providing incentives under the MSIPs scheme to bring FPD panel assembly activity into India.
Digital Cameras
Need for Duty restructuring - The CENVAT for digital cameras is around 16% and an excise cess of 2% against an import duty of
10% makes it more expensive to assemble or manufacture locally.
The component ecosystem and technology leadership for this segment being non-existent in India, focus can be on developing
batteries for digital cameras rather than the product itself.
28
LCD Monitor
Encouraging LCD manufacturing by offering preferential excise duty rates and facilitating easier reimbursement of tax credit.
Investing in R&D for new display technologies to hedge against any investment made in TFT LCD display fabrication.
Encouraging local sourcing of electromechanical components, SMPS transformers and the plastic enclosures used in the
assembly of LCD monitors by offering tax credits for vendors who source these components locally.
Encouraging competencies in the manufacture of LCD displays, especially for tablet and laptop applications. This would require
investment in generation 5 fabs, which are mostly being used for these end user applications. Also, generation 5 fabs are
growing at only 3 percent a year while higher generation fabs are clocking almost 26 percent annual growth. This could mean
that relocationof a generation 5 fab to a brownfield location could be done at an affordable level of investment.
Power supplies
The component duty currently ranges between 12.36 to 16.85 percent which is considered high for the industry especially since
the Indian market is a price sensitive market. Offering subsidies for manufacturers who manufacture in bulk volumes.
Ensuring continual availability of copper through the year at subsidized prices to reduce the overall cost of the components.
Setting up regional level testing labs for testing imported goods.
29
Routers/switches
Creation of funds for local technology know-how development and incentivizing local IP generation
Focusingon promoting local manufacturing of components such as complex PCBs for routers by either offering preferential
excise duty rates for the manufacturing of complex PCB designs or offering greater rates of CENVAT.
Prioritizing /inviting investment in PCBs manufacturing under the MSIPS scheme and offer associated benefits to those investors.
CFL
Reducing VAT for CFL manufacturing to zero per cent across all states
Developing ISI certifications to standardise manufacturing of CFLs in the country.
Energy meters
Development of standards for manufacturing of smart meters, create a R&D fund for innovations in smart meters, and also create
opportunities for manufacturing of key individual components such as communication modules and transceivers.
Incentivizing export duty and establishing India as an export hub by encouraging product modifications suiting international
requirements
Setting up an R&D fund for smart meters to encourage SME manufacturers to invest in innovation
Incentivize manufacturing of communication modules and transceivers
Global marketing support for cash-strapped SME suppliers
Smart cards
Incentivizing software development and customization services
Creation of indigenous standards that are application specific with the aim to ensure higher security in the smart cards consumed
in the country.
Setting up of subsidized testing facilities for EMV compliance
The Indian ecosystem has enormous skillset availability in the software and integration part of smart cards which could be
incentivized through offering appropriate R&D deductions.
Encouraging local sourcing of plastic (PETG) by offering preferential excise rates when raw materials are locally sourced.
GPON ONT
Creating supportive policies like reduced excise duties to encourage domestic manufacturing.
Tablets
Repealing the levy of SAD individual electronic components or individual components of LCD monitors and motherboards.
Incentivizing the manufacture of motherboard and LCD monitors by exempting their individual components from basic customs
duty and excise duty, or offering preferential excise duty.
Simplifying the reimbursement process for claiming tax credit on input duty paid
Creating a centre of excellence for tablets to consolidate the different design efforts in the private and public sectorsto develop
world-class commercial Made in India tablets.
LED Lighting
Restrictive tax structure with a high VAT of 14.5 percent obstructs LED lighting penetration. Reduction in the VAT and a uniform
VAT structure across all states will increase penetration.
Mandating BIS technical specifications to standardize manufacturing processes and products. Imported LED lamps should also
be tested rigorously to prevent dumping of goods in the local market.
30
The chart below illustrates some common recommendations beyond the specific observations product-wise listed above for
ecosystem development of the high priority products.
Developing and
Mandating Indigenous
Standards for
all Products and
Components
Reduction in Excise
Duties; Increase in
Abatement rate
Common
Recommendations
Provision of subsidies /
Low interest loans to
SME Manufacturers
Conclusions
The top 25 high priority products are significant contributors to the overall electronics consumption in India. Providing a favourable
environment for developing the ecosystem for these in the country can contribute to high value adding local manufacturing of
these products. Continuing domestic consumption, changing global supply chain dynamics and the slew of policy measures to
support indigenous manufacturing are positively influencing local electronics design and manufacturing; and the time now is
most opportune. Ensuring hassle-free implementation of the new initiatives and taking corrective measures on restrictive policies
shall go a long way in building confidence in the Indian business environment among global companies and usher manufacturing
investments into the country. Having identified the 25 high priority products and also studied the ecosystem SWOT for each
of these, the next steps entail addressing the challenges for ecosystem development for these 25 products, which implies
addressing the issues for 80 percent of the electronics market in India. Developing the ecosystem for local design, development
and manufacturing for 80 percent of the electronics market locally will suffice to make India a prominent leader in the $1.8 trillion
global electronics market.
31
The chart below captures the key messages from the research on the ecosystem SWOT of the high priority 25 products:
Key Messages: 25 High Priority Products Ecosystem SWOT
Top 25 high priority products account for 82% of overall electronics consumption in India.
The top 5 alone account for 60% of the overall electronics consumption.
69% of local consumption of the top 25 priority products currently met through imports.
Local production to cater to the same 31% local demand in 2015 too in the absence of intervention.
Inadequate components/raw materials ecosystem, convoluted tax and duty structure, debilitating FTAs, inadequate
domestic product standards, lack of local IP, procedural hurdles in availing policy benefits are the challenges
to the ecosystem development for the priority products.
Power electronics/supply, Processor, LCD Display, Memory and PCB feature among the top 4 components
contributing to the product BoM across majority of the top 25 high priority products. Initiatives are needed
to build ecosystem for these components locally.
Effective and speedy policy implementations, incentivizing component ecosystem, restructuring tax/duty structures,
imposing non tariff trade barriers, developing indigenous standards are some of the measures identified to promote
ecosystem development for the high priority 25 products.
Strategic Recommendations
Aim to meet 50 percent of demand for 25 high priority products by local high value added manufacturing by 2018
Address >20 percent of the disability cost in producing the high priority products locally by normalizing duty structure and cost of
working capital
Provide subsidies / low interest loans to address working capital issues for SME manufacturers.
Focus on Energy meters, 2W EMS, LED lighting, payment terminals, inverters/UPS, CFL and smart cards for the short term. Existing
moderate value addition, high demand potential,and existing indigenous IP/design capability make them viable targets.
Focus on developing key components rather than the product itself for the following products - Mobile phones (battery/adaptor), FPD
TV (LCD panels), laptops (battery) and digital camera (battery) products where feasibility to develop a key component is more viable
and recommended than the product itself.
Focus on developing ecosystem for key components PCB, Memory, Processor, LCD Displays, Power Devices and Transformers.
Provide a single window system for quick clearance of applications under the MSIPS and EMC policies.
Skill Development Council to focus on developing skill sets needed in the ecosystem for the 25 high priority products.
32
This report provides a comprehensive ecosystem assessment of the top 25 electronic products that account for 82 percent of the
overall electronic products consumption and provides directions on steps needed to create viable ecosystems for these priority
products. The report also evaluates critical components that make up the bill of materials (BoM) of the high priority products
and provides similar prescriptive recommendations on the measures to create and build local ecosystems for these contributing
components. Research indicates according immediate priority and attention to a limited set of 10 products and components
including Energy Meters, Inverters & UPS, Smart Phones, LED Lighting, Smart Cards, Payment Terminals, 2W EMS, PCB, LCD Displays
and Transformers leveraging upon their existing ecosystem strengths shall result in marked increase in indigenous electronics
manufacturing in the next 2 years itself. Current limitations to high value addition and steps needed to improve the local ecosystem
for these 10 products/components are illustrated below.
ENERGY METERS
OPPORTUNITY SIZE
TM ($ B)
TDM ($ B)
2012
0.3
0.35
2015
0.3
0.35
Transformer
LCD Display
Super Cap
Strengths
High consumption demand
Product design capability
Anti tamper technology
design IP
Opportunities
Government policies like
R-APDRP
Focus on energy
conservation
India as export hub
Smart meters
Weakness
Import for critical
components
Complex tendering system at
utilities departments
Threats
Companies that use reference
designs and launch cheap
products
STRATEGIC
RECOMMENDATIONS
1. A regional level single point testing laboratory to conduct all tests for the local and imported meters.
2. Incentivizing the export duty can boost exports
3. With an expected shift towards smart meters, preparing for the future by investing in R&D especially in development
of relays by leveraging R&D tax credits
4. Notification of Preference Market Access
5. Notification of safety standards by Department of Electronics and IT
6. Product Specifications also need to be defined to prod indigenous manufacturing
33
INVERTERS, UPS
OPPORTUNITY SIZE
TM ($ B)
TDM ($ B)
2012
1.11
0.95
2015
1.56
1.37
Power Semi
Heat Sink
Microcontroller
Strengths
Robust domestic demand
Manufacturing ecosystem
exists
Expertise and supporting
industries strength
Opportunities
Surging demand for banking,
education sector
Policies such as MSIPS
Export potential
Weakness
Lack of subsidies for SMEs
Lack of design expertise for
high power rating UPS
Lack of scale
Threats
Established ecosystem in
China
Infrastructure inadequacy
STRATEGIC
RECOMMENDATIONS
1. Excise duty should be lowered to 6 per cent at least; reimbursement of tax credit should be made easier
2. Design and manufacturing of UPS of higher rating (> 10KVA) encouraged by allocating R&D funds from EDF corpus
3. Formalize practicum programs between industry and engineering institutions to promote grassroots level interest
in design and technical activities
4. Developing port and logistics infrastructure to facilitate copper imports, leading to shorter lead times
5. Export incentives should be given for the export of inverters; extension of the zero duty EPCG is beneficial in this
regard
SMART PHONES
OPPORTUNITY SIZE
TM ($ B)
TDM ($ B)
2012
17.41
3.84
2015
23.67
4.09
Display
Application
Processor / SoC
Camera
STRATEGIC
RECOMMENDATIONS
Strengths
Replacement Demand and
Rural Demand
Local chip design strengths
Application develeopment
strengths
EMS capabilities
Opportunities
Impending 4G roll out
Gaining prominence of
local OEMs
India as export hub
Policies such as MSIPS
Weakness
Reliance on import for chip,
display and PCB
Negligent product design
capabilities
Limited skill set
Debilitating tax structure
Threats
Established ecosystem in
China
Infrastructure inadequacy
Emergence of other low cost
manufacturing destinations
34
OPPORTUNITY SIZE
TM ($ B)
TDM ($ B)
2012
0.17
0.04
2015
0.44
0.20
Driver Circuit
Heat Sink
Thermal interface
STRATEGIC
RECOMMENDATIONS
Strengths
High consumption demand
Product design and R&D
capability
Local EMS capability in LED
light manufacturing
Opportunities
Increasing adoption in Govt,
commercial and industrial
sectors
Policies such as MSIPS
Companies positioning India
as export hub for ME
Weakness
Lack of testing facilities
High Initial cost
Absence of national technical
standards Lack of incentives
to attract major firms
Threats
Established ecosystem in
China
Preference for trading over
manufacturing
Debilitating duty structure
1. Reduction and a uniform VAT structure across all states will increase penetration.
2. Exemption for capital goods for LED light manufacturers
3. More testing facilities to be established spread across the three regions in the country. Setting up of design houses
both for product and components.
4. Increase product awareness.
5. DEITY to mandate technical specifications . Government support to mandate new/ secondary roads to be replaced
with LED fittings.
6. Setting up of a brownfield cluster under EMC at Hyderabad with infrastructure including Test Lab, Tool room etc
7. Setting up fund for LED driver and controls R&D and innovation.
8. Provision of low interest loans for LED lighting SME manufacturers for working capital
9. Setting up LED fab to have complete backward integration
10. Mandating LED Lighting usage in Street lighting, railways etc by Government
SMART CARDS
OPPORTUNITY SIZE
TM ($ B)
TDM ($ B)
2012
0.21
0.13
2015
0.52
0.57
PETG
Software OS
Antenna
Strengths
Robust demand from Govt
and Banking
S/W, on card and off card
technology capabilities
R&D focus
Opportunities
Anticipated high demand
from Govt projects
Escalating manufacturing
costs in China
PMA for smart cards
Weakness
Reliance on import for chip
No local IP
Expertise in security and
anti-theft technologies
Threats
Inability to penetrate IP
strengths of US and France
companies
Infrastructure inadequacy
STRATEGIC
RECOMMENDATIONS
1. Leveraging export subsidies and considering product manufacturing under the EPCG scheme will benefit
manufacturers in importing machinery at subsidized prices and exporting huge volumes.
2. Inverted duty structure needs to be amended
3. More India specific application oriented standards need to be evolved, like SCOSTA
4. Setting up of a fund for R&D in smart cards and providing the same for SMEs
5. Make Use of contactless cards mandatory in banks
35
PAYMENT TERMINAL
OPPORTUNITY SIZE
TM ($ B)
TDM ($ B)
2012
0.11
0.0058
2015
0.22
0.011
LCD/TFT
Processor
Printers
STRATEGIC
RECOMMENDATIONS
Strengths
Growing consumption
demand
Presence of local design
houses
Huge retail market favouring
uptake
Availability of raw materials
like sheet metal, plastics
Opportunities
Increasing transactions using
PoS; Emerging e-tail
Significant rise in debit/credit
cards usage, micro ATMs
Financial inclusion programs
Weakness
Reliance on import for critical
components
High certification costs and
lack of testing labs
Penetration levels still low
Threats
Capital intense nature high
costs for EMV and PCI-PTS
certifications
Established manufacturing
ecosystem in China
1. Funds allocation for providing domain training in the payment Industry for people in the manufacturing sector of
POS and payment enabling products.
2. Funds to enable the Indian IT entrepreneurs to develop the EMV Kernel targeting various emerging platforms
including Android.
3. Setting up of Accredited Labs for EMV Certification and PCI-PTS test facilities and provide easy, cost effective and
product amortizable testing access to device manufacturers.
4. Current excise is 14% while customs duty is 12%. Reduction in sales, VAT and excise duty would attract more
manufacturers to consider local manufacturing.
5. Encouragement for the usage of no frills debit cards with no surcharge and creating awareness about usage of the
same is pertinent. Tax rebate to merchants if at least 50 per cent of his transactions in value terms are through cards
needs to be mooted.
EMS 2W
OPPORTUNITY SIZE
TM ($ M)
TDM ($ M)
2012
210.4
210.4
2015
308.1
308.1
Power Semi
CDI Capacito
Transformer
STRATEGIC
RECOMMENDATIONS
Strengths
Mature product market
Established ecosystem
Design IP held in India
Excellent R&D, testing ,
manufacturing processes
Skillset availability
Opportunities
Untapped rural market for
2 wheelers
ECU replacement for CDI
Policies such as MSIPS
Weakness
Reliance on import for chip,
display and PCB
Exports currently low
Market getting
commoditized
Threats
Emission norms making
current products obsolete
High utility costs in
manufacturing units
impacting production
1. Export-friendly policies and support structure to boost the Exports (a) To utilize Extension of Interest Subvention
Scheme (b) An additional interest subvention of 2% for those exporters who repay on a timely basis (c) Exports be
brought back under priority sector lending and a separate cap be put on exports, within 40% norms
2. Extension of Focus Product Scheme to drive exports
3. Setting up of incubation center for automotive electronics within a cluster under EMC scheme at Chennai or Pune.
4. Reliance on imports for most of the critical components chips, displays and PCBs - to be checked by developing
domestic semiconductor ecosystem and upgrading the PCB making capabilities
5. An ECU for 2W (ECUs only used in 4W presently) is being conceptualized may make CDIs redundant in 4-5 years
time - thus to provide product development support in the form of R&D exemptions for domestic companies along
with providing preferential excise duty, greater CENVAT rate
36
Transformers
Incentivising component imports by providing tax rebates for local manufacturers.
Setting up of local design houses and leveraging R&D tax credit will attract global OEMs
to invest in local manufacturing of components.
Streamlining continual availability of copper through the year at subsidized prices.
Preferential excise duties of 2 %; facilitate quicker reimbursement of tax credits
Offering greater CENVAT credit for local sourcing
Developing infrastructure to facilitate copper imports, leading to shorter lead times
Promote establishment of manufacturing clusters using EMC and MSIPS policies; solicit
investment from VCs too
LCD Display
Relocation of a brownfield Gen 5 fab
Offering of preferential excise duties or offering greater rates of CENVAT
credit
Hike in import duty of finished panel imports
Fund to encourage local display technology development
37
38
Only Assembly
Top 4 Components
Component Ecosystem
23.67
21.19
20
15
19.41
17.41
16.35
15.28
TM: 9.7%
TDM (overall): 2.3%
TDM (Low/Med
value add) : 2.3%
TDM (High value
add): NA
10
HVA-TDM : TM
4.23
4.5
0
2010
2011
3.88
3.84
2012
2013
3.88
4.09
2014
2011
0%
2013
0%
2015
0%
2015
39
TM Volumes
(Million units)
2010
165.93
49.91
92.69
2011
182.00
54.60
101.40
2012
197.74
47.72
88.63
2013
216.17
48.15
89.41
2014
240.92
50.43
93.66
2015
269.46
53.26
98.91
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
The mobile phone value chain comprises various component and subsystem suppliers, technology licensors and application
developers and the downstream service providers and retailers. The advent of smart phones has catapulted the value of the core
chips including the processor and memory. It has also brought to prominence the value of the software in a mobile phone. It is
interesting to note that in most current mobile phones, the value of manufacturing of mobile components is equal to the value of
manufacturing of the mobile phone itself.
The mobile phone value chain is depicted in the figure below.
Component and
Sub-system Suppliers
System
Integrators
Downstream
Baseband
RF transceiver
Core Chips
Application
processor
Power
Management
Display
Memory
Battery
Camera
Peripherals
Connectivity
Electro
Mechanicals
Operating
System
Mobile
Phones
N/W
Operators
Consumers
Retailers
Software
Applications
40
Category
Product
Local Supply
Core Chips
Only Sales
Offices; Total
Imports
Battery
Imports; Local
Supply
Display
Only Sales
Offices, Total
Imports
Components
and Sub
systems
Company Names
Level of
Local Value
Add
Remarks
No
Qualcomm,
Mediatek, Nvidia,
NA
Yes
Adit Infotech,
Maxotel, Celltalk,
JPW, AR Industries
etc
Medium
Local
Local IP
Manufacturing Capability
No
Yes
No
No
Samsung, AUO,
Chimei Innolux, LG
, Sony, Numerous
Chinese suppliers
NA
Peripherals
Partial
(Adaptors
manufactured
locally)
Yes
Yes
High
Electro
Mechanicals
Yes
Yes
Yes
Perlos
High
Software
Yes
Yes
Yes
OEM
Yes
Yes
Nokia, Samsung, LG
Low
EMS
Yes
Yes
Flextronics,
Foxconn
Low
Mobile
Phones
High
Analysing the mobile phone value chain in India, it is observed that the presence of a sustained and growing demand for mobile
phones is a key strength for the industry apart from an established EMS ecosystem for mobile phone manufacturing. However
the current limitation is that the EMS vendors are engaged only in box level assembly. Critical challenges include inadequacy
of feeding industries as most components / raw materials are currently imported. The import of chipsets and display,the most
crucial components, presents a huge void in the ecosystem and contributes significantly to the disability costs for mobile phone
manufacturing.
Rising costs of manufacturing in China is seen as an opportunity for some of the indigenous manufacturers who are currently
outsourcing their design and manufacturing to China to instead invest in local facilities. The possibility of Chinese mobile phone
manufacturers themselves looking at investing in Indian manufacturing facilities is yet another huge opportunity for the ecosystem
to develop. Policy initiatives such as MSIPS are expected to boost manufacturing investments while the prevailing tax structure is
seen as debilitating and needing immediate corrective measures.
41
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
Component SWOT
The component ecosystem for mobile phones is extremely diverse in line with the wide range of prices of mobile phones. While
components such as display, battery, memory and core chips are common for price point mobiles, the cost and capacity of these
components vary depending on the features and applications supported by the mobile phones. The top 4 components that
contribute to majority of the mobile phone bill of materials (BoM) irrespective of the phone type or price are:
1. Memory
2. Display
3. Application Processor / System on Chip (SoC)
4. Camera
2 of the top 4 components for mobile handsets are semiconductor devices. The absence of fabrication facilities in India forces
reliance on imports of these components. However, there is design acitivity that happens locally in the SoC and processor space
as the key suppliers of these chipsets have huge captive design centers in the country. Even complete design tape outs have been
generated for some of these chips from the local design centers.
The second most expensive component is displays;this is yet another component that doesnt have a supporting ecosystem
locally. Globally the displays market is dominated by a handful of Korean and Taiwanese companies. Technology competitiveness
acts as a high entry barrier which has ensured that globally the competition remains niche. The constantly evolving touch reflexes
and the demand trend for high resolution in mobile phones make it difficult to build new capability in India. Further more the local
demand volumes for such devices do not justify such an investment.
Camera is the fourth component for which there is currently negligible ecosystem in India from the design as well as the
manufacturing perspective. Optics are the most crucial element of mobile camera design and this expertise is not well recognized
in India, leading to the heavy reliance on imports.
Of all the components of the Mobile BoM, it is thus the electromechanicals, peripherals, battery and software that have higher
probability of increased local value addition; however, the contribution of these to the mobile BoM is tertiary in nature.
42
Major Suppliers
Local Supply
/ Imports
Local Manufacturing/
Design/Assembly
Local
Capacities
Challenges to Local
Manufacturing
Memory
Toshiba, Samsung,
Hynix, Micron
Imports
NA
NA
Imports
NA
NA
Qualcomm,
Samsung, Mediatek,
Nvidia, Allwinner
Imports
Negligible a few
suppliers have
design centres in
India
NA
Toshiba,
STMicroelectornics,
Omnivision, Sharp
Imports
NA
NA
Display
Samsung, AUO,
Chimei Innolux, LG
, Sony, Numerous
Chinese suppliers
Application
Processor
Camera
Strategic Conclusions
General
For local manufacturing to become cost competitive compared to destinations like China, it is essential for the Government to offer
fiscal sops that help in equalizing the disability costs associated with local manufacturing. These, amongst others, include:
Differential duty regimes for locally manufactured and imported handsets
Levying a tax equivalent to CST on imported mobile phones
Trade barrier to imports; Countries such as China and Brazil have been able to successfully grow their local mobile phone
industry through similar practices. Since mobile phones are not part of the ITA list, trade barriers can be imposed to grow local
manufacturing
IP development
There are numerous captive and third party design houses contributing to chip design for mobile devices. However, none of
the IP is realized locally as all the patenting is done overseas. Through support for fabless companies, encouragement needs
to be provided for IP generators to develop mobile SoCs and mobile processor designs whose IPs are realized in India. This will
contribute to incremental value addition and revenue generation opportunities through licensing.
Component ecosystem
All imported capital equipment for manufacturing of mobile phone parts and components should be completely exemptedfrom
CVD. Likewise capital equipment sourced locally should be exempt from excise duty. This would encourage the manufacturing of
mobile phones parts and would promote the growth of the component ecosystem.
Product manufacturing
Despite numerous indigenous brands claiming to do their own design and development, in reality, most of these brands source
designs from Taiwan/China and develop their products. This does not contribute to actual value addition. Hence, the sops and
incentives offered need to be linked to value addition generation so as to ensure total ecosystem growth.China has been able
to bring in foreign investment and attract all leading mobile phone manufacturers to set up facilities in China by mandating
standards and certifications such as the CCC (compulsory China certification mark) for all the mobile phones that are sold in China.
Similar non-tariff barriers can be imposed in India which favour or necessitate local manufacturing.
43
Current Limitation
a. Lack of import barriers
Tax Structure
Value Addition
Component
Ecosystem
44
a. Reliance on imports
Very low
Top 4 Components
Component Ecosystem
Not Available
6.40
6.00
TDM (Low/Med
value add) : 54.9%
3.55
3.00
4.62
4.00
1.00
TM: 23.7%
5.50
5.00
2.00
2.74
1.75
0
0.67
0.39
2010
2011
3.30
1.59
1.06
2012
HVA-TDM : TM
2.36
2013
2014
2011
0%
2013
0%
2015
0%
2015
45
TM Volumes
(Million units)
2010
2.90
0.65
2011
4.80
1.17
2012
6.48
1.93
2013
8.98
3.09
2014
11.50
4.94
2015
14.38
7.41
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
Domestic assembly is a low value-add activity as LCD panels are imported and only final leg assembly is performed here. The
import-heavy nature of the FPD TV market has resulted in it being vulnerable to volatile currency conditions. For FPDTVs, 2012 was
a turbulent period when increasing raw material costs and depreciation of the rupee added pressure to the prevailing conditions.
This trend has continued much into 2013 as the rupee has reached never-before lows of INR 64 against the US $. This has resulted
in increase in prices of FPD TVs by 5 to 15 per cent from different manufacturers.
Import duty on LCD panels was eliminated in the 2012-13 Budget, which led to anticipation of increased domestic assembly.
However, Indias Free Trade Agreements (FTAs) with countries such as Thailand are proving to be a restricting factor, as some key
manufacturers have built up capacity for FPD TV manufacturing in these locations and the FTA allows them free access to the
Indian market.
The value chain for FPD TV market is depicted in the chart below.
Component and
Sub-system Suppliers
Driver IC
Downstream
Manufacturing / Assembly
Core Chips
BLUE
Glass Substrate
Polarizer
Core
Components
General
Trade
OEMs
Consumers
Modern
Trade
Color Filter
Chemicals
PCB, Passives
Other
Components
Liquid Crystal
46
Category
Product
Local
Supply
Local
Manufacturing
Local IP
Capability
Company Names
Level of Local
Value Add
Remarks
Display
No
No
No
NA
Imported as
part of finished product
No
Himax Technologies,
Orise Technology,
Sitronix Technology,
Raydium
Semiconductor
NA
Imported as
part of finished product
ICs
Components
and Sub systems
No
No
Electro
mechanicals
No
Yes
No
Medium
Power components
No
Yes
No
Medium
OEM
No
No
No
NA
Indigenous
players
Yes
No
Videocon, Onida
Low
FPD TV
Through
design capability exists
there is no
local relation
of IP
Through
design capability exists
there is no
local relation
of IP
No local manufacturing
value addition
Low manufacturing value
addition
FPD TV manufacturing is very technology intense and dynamic. Apart from continuous advancements in panel component
technologies, the FPD panel manufacturers themselves are moving towards 8.5 and 10 generation fabs. The sophistication in
infrastructure and the supply channels required for FPD TV manufacturing require decades of development. It is improper to
expect such ecosystem development in India within a few years to bring in FPD TV manufacturing.
The SWOT chart below captures the analysis for the FPD TV market.
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
47
Component SWOT
The core top 4 components within the FPD TV BoM are:
1. Display
2. ICs
3. Electromechanicals
4.
Power components
These 4 components together constitute roughly 80 to 85 per cent of the BoM of FPD TVs, with displays and ICs accounting for
nearly two-thirds of the total BoM by themselves. There is totally nil indigenous capability of these 2 critical components in India.
Korea, Taiwan and Japan dominate the global market for capacity and supply of the core components for FPD TVs. The proposed
and on-going expansion plans of the key suppliers of these components indicate the lack of requirement to set up manufacturing
facilities in new destinations like India.
Strategic Conclusions
General
Despite the high domestic volumes and the opportunities for exports, the possibility of ushering FPD TV manufacturing into India
is a distant dream.
Product manufacturing
The focus can rather be on encouraging more domestic assembly, even if it is a low value add activity, as it can potentially result
in local sourcing and employment generation in the long run. One element within the FPD TV value chain that can be promoted
for indigenous activity is the panel assembly. Incentives under the MSIPs scheme are favourable to bring in FPD panel assembly
activity into India and this needs to be encouraged for the contribution it can make to local value addition. There are several
disability costs today that make imports of panels more attractive and these needs to be addressed through corrective tax and
duty reforms.
Current Limitation
Tax Structure
48
Value Addition
& Component
Ecosystem
a. No activity at all
Financial and
other Incentives
N/A
Low No Sourcing
Top 4 Components
Component Ecosystem
35000
3000
2973
2713
2500
2480
2287
2107
TM: 9.4%
TDM (overall): NA
TDM (Low/Med
value add) : NA
2000
1500
HVA-TDM : TM
1000
500
0
2010
2011
2012
0
2013
0
2014
2011
0%
2013
0%
2015
0%
2015
49
TM Volumes
(Million units)
2010
3.63
0.00
0.00
2011
4.07
0.00
0.00
2012
4.56
0.00
0.00
2013
5.15
0.00
0.00
2014
5.83
0.00
0.00
2015
6.65
0.00
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
The laptops sold in the Indian market are all imported as finished products into the country. Since the laptop is a closed-box
product, even low value added assembly at the market destination doesnt make business sense. Hence, laptops are imported
pre-configured into the country. However, the absence of a supporting ecosystem for electronics manufacturing and the fact that
volumes are not growing fast enough have been strong enough reasons for companies to not invest in manufacturing facilities in
the country.
The laptops value chain is depicted in the figure below.
Component and
Sub-system Suppliers
Keyboard /
Touchpad
Downstream
Assemblers
Input / Output
LCD screen;
speakers
Enterprises
Motherboard;
Memory; Processor
CPU
Laptops
Consumers
50
Components and
Sub systems
Laptops
Product
Local Supply
Local
Manufacturing
Local IP
Capability
Company
Names
Level of Local
Value Add
Remarks
Processor
Only Sales
Offices; Total
Imports
No
No
Intel, AMD
NA
Display
Imports
No
No
Samsung
NA
Motherboard
Imports /
Local Supply
Yes
No
Pegatron,
ECS, Gigabyte, MSI,
Foxconn
NA
HDD
Imports
No
No
Seagate,
Thoshiba
NA
Software
Yes
NA
No
Dell, Intel,
Microsoft
Med
OEM
Yes
No
No
HP, Dell,
Lenovo, Acer,
HCL
NA
EMS
No
No
No
NA
The Indian laptop market exhibits great local demand, which will also be well sustained in the medium term. However, since the
market is import heavy, it is subject to the vagaries of currency fluctuation which creates business uncertainties for laptop vendors
and price uncertainties for consumers. Government procurement of laptops will drive the market in the short term, while any
increase in the computing power of tablets or the emergence of a disruptive form factor in the portable space could eat into the
market for laptops fairly quickly.
The SWOT chart below captures the analysis for the laptops market.
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
Limited IP generation
Import heavy market pushes Indian market behind on
global product launch timelines
51
Component SWOT
The biggest contribution to the BoM in terms of dollar value in a laptop is accounted for by the display and the processor, which
account for 15 per cent each. Next comes the motherbaord and the HDD, which alongwith the display and processor,could account
for almost two-thirds of the total BoM of a laptop. In short, the top 4 components that contribute to majority of the laptop bill of
materials (BoM) are:
1. Display
2. Processor
3. Motherboard
4. HDD
Since laptops are imported in finished product form for the most part, none of these components are locally sourced.
Strategic Conclusions
General
The reimbursement process for claiming tax credit on input duty paid should be made easier and faster so that companies do not
have to contend with uncertainties of receiving reimbursement. This would encourage companies to invest in manufacturing with
confidence and peace of mind. The reimbursement process could be moved to an online portal for greater convenience.
IP development
A large amount of design activity is carried out at the established IT firms such as HCL and Infosys and the captive design centres
of Intel and AMD, but there is no local IP held in the country. Encouraging the growth of fabless design companies and software
development firms through start-up capital seeding and, possibly through the mooted EDF corpus, could lead to the generation of
indigenous IP in the short to medium term. The application of regional language software could provide opportunities considering
the expected penetration of computing and connectivity in semi-urban and rural areas; the idea of setting up central government
grants for such software development activity at the NITs should be considered.
Component ecosystem
The manufacturing of motherboards and LCD displays for laptops should be incentivized by exempting their individual components
from basic customs duty and excise duty, or offering preferential excise duty. Likewise, sheet metal fabrication and plastic moulding
are fairly mature technologies in India; hence, the manufacturing of laptop enclosures could also be incentivized too.
Product manufacturing
The challenges that are inherent to the assembly of laptops is that all of the supporting industries need to be present in close
proximity so that the finished product can be assembled optimally and shipped to market destinations in its finished form.
Unlike desktops, it doesnt make sense for laptops to be shipped in knocked-down unit fashion and then assembled at market
destinations. Considering that the Indian laptop market is import heavy and a fairly sizeable one too, it causes considerable stress
on the countrys import bill. Hence, it would be wise to look elsewhere in the electronics ecosystem to address this issue; tablets,
for example. However, if a decision to invest in the manufacturing of laptops is indeed taken, then the electronics ecosystem
for laptops should be incentivized in a holistic manner to foster the growth of all the supporting industries that are needed to
manufacture/assemble laptops in one location.
Current Limitation
Tax Structure
Value Addition
52
Only assembly
Top 4 Components
Component Ecosystem
2000
1943 0
1973 0
1968
1978
1993
2008 0
TDM (Low/Med
value add) : 0.4%
1500
1000
TM: 0.4%
TDM (overall): 0.4%
1973
1943
1968
1978
1993
2008
HVA-TDM : TM
500
2011
0%
2013
0%
2015
0%
0
2010
2011
2012
2013
2014
2015
53
TM Volumes
(Million units)
2010
5.95
5.95
0.00
2011
6.20
6.20
0.00
2012
6.41
6.41
0.00
2013
6.66
6.66
0.00
2014
6.92
6.92
0.00
2015
7.20
7.20
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
Assembly of desktops is a widespread activity in India, and more than 60 per cent of the desktops sold in country are locally
assembled. Companies like Dell, HCL, and Wipro assemble almost all of their desktops within the country. Acer and HP also assemble
the majority of their desktops locally. Since desktops have to transported by sea, transportation of disassembled modules and
assembly of final goods at the destination is preferable to importing final goods as finished products.
There is no indigenous IP held with regard to desktops. However, since desktops are designed based on open architecture, assembly
at destination is made easier which also shortens the time-to-market. Also, some organizations, such as banks, have rigorous
purchasing processes that might require pre-shipment inspection and pre-delivery testing which is made easier if assembly
happens locally. Local value addition is limited to the assembly, testing, and packaging of desktops though, and in some instances,
local sourcing of certain components. However, in the last few years, local sourcing of components is reported to be on the wane
because of a convoluted duty structure that increases business complexity for manufacturers importing individual components for
assembly; for example, import for finished mother boards attracts only CVD while import of individual components for motherboard
manufacturing attracts CVD and an SAD of 4 per cent that will be refunded after raising a reimbursement claim for the same. This
increases upfront costs for manufacturers apart from the uncertainty over the reimbursements. This is particularly relevant during
times of currency depreciation when costs can increase drastically for such imports. Such factors discourage entities from making
significant investments in manufacturing facilities considering the relatively thin margins that this industry operates on.
India possesses considerable competency in design; substantial design activity is carried out in IT firms such as Infosys, Wipro
and HCL. These design activities range from basic motherboard design to high-end server design. However, most of their work
is executed for MNCs and there is possibly no local IP held. CPU testing is also carried out fairly extensively in India, as is final
configuration, testing, and delivery to customers. With respect to design alone, even though design development of desktop
happens in parts and on different teams, the contribution of Indian talent could possibly be pegged at 15 per cent of overall
design. The reputation of Indian design talent is considerable but the country lacks an institutionalized process to metamorphose
it into tangible IP that could contribute to the economy. The overall value addition in terms of dollar value is about $ 6 (inclusive of
margin), though the amount of activity in terms of resources used is fairly high.
54
Downstream
Assemblers
Input / Output
Monitors;
Speakers
Motherboard;
Memory; Processor
Enterprises
CPU
Desktops
CPU
CD Drive; Printer;
Modem
Consumers
Government
Operating System
Software
Applications
The MNCs currently import units in L6 configuration which doesnt contain the CPU, memory and hard disk; the balance comprises
of power supply, motherboard, etc. and arrives in pre-fabricated from outside India. The final configuration of desktops happens
in India. However, indigenous companies HCL and Wipro perform grounds up assembly of desktops, with either local sourcing or
the import of individual components depending on availability and business ease. Entities present in the unorganized market in
India also perform grounds up assembly; they account for about 60 per cent of the consumer market. The enterprise business for
desktops is completely handled by the organized sector, i.e., large MNCs and indigenous companies.
55
Table below captures the capability in India across the desktop value chain.
Product
Local Supply
Local
Manufacturing
Local IP
Capability
Company
Names
Level of Local
Value Add
Remarks
Processor
Imports
No
No
Intel, AMD
NA
Monitor
Imports/
Local Supply
Yes
No
TPV, LG,
Samsung
Low
Motherboard
Imports/
Local Supply
Yes
No
Pegatron, ECS,
Gigabyte, MSI,
Foxconn
Low
Hard disk
Imports
No
No
Seagate,
Toshiba
NA
OEM
Yes
No
Low
Integrators
Yes
No
NA
Low
Category
Components
and Sub
systems
Desktops
Currently, local manufacturing is not competitive globally due to a number of disability factors. In the light of latent manufacturing
strength for certain products, inclusion of those products under ITA-1 has constrained the growth of local manufacturing due to
the availability of imported goods. Also, domestic volumes are not growing fast enough for entities to invest in manufacturing
on a large scale. MNCs invested in assembly facilities early on as they needed to be closer to their market; this also indicates their
confidence in the manufacturing capability present in the country. However, the absence of a business environment in which local
manufacturing can thrive has led to the suppression of local manufacturing capabilities.
The SWOT chart below captures the analysis for the desktop market.
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
56
Component SWOT
The biggest contribution to the BoM in terms of dollar value in a dektop is accounted for by the monitor which costs US$80
approximately (excluding software costs). Next comes the processor which costs anywhere between US$60 and 110, followed by
the hard disk and the motherboard that both cost in the range of US$40. On the motherboard, the semiconductor components
and the PCB are most critical. Considering a BoM of US$40 for the motherboard, it can be estimated that the chipset costs about
US$12, the PCB costs about US$6.5, and that the overall semiconductor cost is about US$20 including the peripheral chips.
In short, the top 4 components that contribute to majority of the desktop bill of materials (BoM) are:
1. Processor
2. Monitor
3. Motherboard
4. Hard disk
The motherboard is being manufactured in India, and indigenous players in particular source about 20 to 25 per cent of their
requirements locally. Monitors are being made by LG and Samsung; HCL also manufactures monitors locally. Of course, processors
for desktops are sourced from either Intel or AMD. The top suppliers for hard disks are Seagate and Toshiba. However, the situation
with regard to hard disk is slightly on the balance currently due the shift in technology and enterprise business models, i.e., the
shift towards cloud computing and centralized servers, and the movement in technology towards solid state drives. Hence, entities
are presently thinking twice before investing in manufacturing facilities for mechanical hard drives and there are also questions
about consumer adoption of mechanical hard drives in the future, given the advantages of using solid state drives.
With regard to value addition, the major activities that happen are either soldering or testing of components and the financial
value of these activities is quite less. Over all, the manufacturing value added is about 10 per cent, including margins.
Strategic Conclusions
General
The levying of SAD should be repealed at the very least on individual components of LCD monitors and motherboards. Also,
the reimbursement process should be made easier and faster so that companies do not have to contend with uncertainties of
receiving reimbursement. The reimbursement process should be moved to an online portal and there should be no restrictions
on the number of times reimbursements can be claimed. Also, reimbursements should be directly transferred to merchants bank
accounts. The increased liquidity and trust factor arising from these measures could help companies transact more or make greater
investments. The present rate of abatement should also be raised from 25 per cent to reflect the rise in costs of doing business.
SAD could be levied on finished product imports of motherboard and LCD monitors, for which a nascent manufacturing ecosystem
exists in India.
IP development
A large amount of design activity is carried out at the established IT firms such as HCL and Infosys and the captive design centres
of Intel and AMD, but there is no local IP held in the country. Encouraging the growth of fabless design companies and software
development firms through start-up capital seeding and possibly through the mooted EDF corpus could lead to the generation of
indigenous IP in the short to medium term. The application of regional language software could provide opportunities considering
the expected penetration of computing and connectivity in semi-urban and rural areas; the idea of setting up central government
grants for such software development activity at the NITs should be considered.
Component ecosystem
The manufacturing of motherboards and LCD monitors should be incentivized by exempting their individual components from
basic customs duty and excise duty, or offering preferential excise duty. Decrease in tax revenues could be offset a little through
smaller hikes in sales tax or through offering greater rates of CENVAT credit on excise duties.The Indian manufacturing ecosystem
possesses competencies in the manufacturing of these products, which incidentally also are the top two BoM contributors
to desktops in terms of dollar value. These products also have applications in almost every electronics product. Once local
manufacturing of these products is encouraged by exempting them from/ granting them preferential excise duties, it is very
possible that investment will flow in and spur organic growth of the value chain. Likewise, sheet metal fabrication and plastic
moulding are fairly mature technologies in India; hence, the manufacturing of cabinets and enclosures for use in desktops could
also be incentivized through preferential excise duties and exemption from additional duties.
57
Product manufacturing
The assembling of desktops is already being carried out both by global OEMs and by indigenous players like HCL and Wipro. India
has held back from discussing the ITA II due to the fact that the government recognizes the need for encouraging the growth
of the nascent manufacturing capabilities in the country. If India were not to sign the ITA II, it could potentially push companies
into investing in high-value added manufacturing in the country. Coupled with the wholesome basket of policy initiative being
enacted by the government, this could also lead to the flourishing of downstream activities and lead to the establishment of a
thriving product ecosystem.
Current Limitation
Tax Structure
Value Addition
Component Ecosystem
58
a. Reliance on imports
b. Demand volumes
Local Manufacturing/Assembly
Volumes and Growth
Nil
Top 4 Components
Component Ecosystem
59
1.8
TM: 18.9%
1.4
1.4
TDM (overall): NA
TDM (Low/Med
value add) : NA
1.2
1.2
1.0
0.8
1.6
1.6
0.9
0.66
0.6
HVA-TDM : TM
0.4
2011
0%
2013
0%
2015
0%
0.2
0
2010
2011
2012
0
2013
2014
2015
TM Volumes
(Million units)
2010
2.10
NA
NA
2011
3.00
NA
NA
2012
4.20
NA
NA
2013
5.00
NA
NA
2014
6.25
NA
NA
2015
7.50
NA
NA
Base Year: 2011 Source: IESA-Frost & Sullivan
60
Industry SWOT
The digital camera value chain comprises of various component and subsystem suppliers, assemblers and the downstream
retailers and consumers. The lens technology and manufacturing process is the most crucial element in the manufacture of a
digital camera. Japan holds the highest number of patents in this regard and hence presents a formidable barrier to exploring that
segment in terms of design or manufacturing. The coating technology on the lens involves a high level precision and currently
India does not have the skill set availability to implement this process. Also the quality and availability of raw material varies from
country to country and currently India does not possess the right quality-availability mix required to manufacture the components
of a camera. The digital camera value chain is depicted in the figure below.
Component and
Sub-system Suppliers
Assemblers
Downstream
Image Sensor
Motor Driver
Image Processor
Memory
Digital Camera OEM
Capacitor
Consumers
Digital Camera EMS
Battery pack
Lens
Audio interface
Peripherals
LCD controller
61
There are no manufacturers of digital cameras in the country and India is flooded with competition from foreign manufacturers.
Besides the top 3 players who control almost 95 per cent of the market in India, there are other foreign players with varying
capabilities. All of them import the digital camera as a finished product resulting in no local value addition. From an Indian
ecosystem standpoint, with regard to components, all the core chips, LCD display, battery pack, sensors, lens etc., are imported
while only a limited amount of local capability exists for the peripherals and LCD drivers.
The table below captures the capability in India across the digital camera value chain.
Category
Components
and Sub
systems
Product
Local Supply
Local
Manufacturing
Local IP
Capability
Company Names
Level of
Local Value
Add
Remarks
Image sensor
Imports
No
No
Samsung, Canon,
Toshiba, AOF
NA
Memory
Imports
No
No
NA
Battery Pack
Imports
No
No
NA
Lens
Imports
No
No
AOF, Canon,
Tamron, Olympus
NA
Image Processor
Imports
No
No
Canon, Sony,
Toshiba
NA
NA
LCD Controller,
Capacitor,
peripherals
Imports
No
No
AOF, Unorganized
players
OEM
Yes
No
No
NA
EMS
No
No
No
NA
NA
Local manufacturing
capability exists, but no
OEM prefers to do any
kind of assembly activity
locally
Digital
Camera
62
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
Component SWOT
The component ecosystem for digital camera is extremely diverse in line with the wide range of prices of digital cameras. While
components such as lens, image sensors, battery pack, processors, memory, etc., are common for all types of cameras, the cost and
capacity of these components vary depending on the features and applications supported by the camera. The top 4 components
that contribute to majority of the Digital camera bill of materials (BoM) irrespective of the type or price are:
1. Lens
2. Image processor
3. Image sensor
4. Battery
Currently most of the digital cameras are imported as finished goods. The top players possess established manufacturing
infrastructure in countries like China, Japan, and Korea. OEMs such as Canon possess manufacturing competencies across all
stages of the value chain. Other players outsource parts of their manufacturing to contract manufacturers in China and other Asian
countries.
63
Strategic Conclusions
General recommendations
The CENVAT for digital cameras is around 16% and an excise cess of 2% against an import duty of 10% makes it more expensive to
assemble or manufacture locally. Over and above, the current situation in India is such that the FTA with Thailand and Japan makes
it easy for most OEMs to import them as finished goods,thus making it inutile to develop an ecosystem for the same.
IP Development - Design
The biggest challenge in terms of component manufacturing is the lack in design and skillset availability to develop lens and
coating technology. From a design perspective, a well laid ecosystem in neighbouring countries restricts Indias chances of building
indigenous capability, especially when the volumes do not warrant the need for local design.
Product manufacturing
Unless there is a renewal with the FTA, not much can be done with the product market. Developing an entire ecosystem for digital
camera manufacturing is not very viable with Japan holding most patents for lens technology, the highest BoM component of a
camera. Also, the tax limitations of excise duty higher than import duty make the situation difficult for product manufacturing.
Hence it is best suited to divert the available resources towards other areas that would offer greater and faster returns on investment.
Current Limitation
Tax
Structure
Value
Addition
a. Reliance on imports
b. Demand Volumes
c. Lack of high quality raw materials
Component
Ecosystem
Policy
Initiatives
64
Top 4 Components
Component Ecosystem
65
1565
1400
1200
1000
1415
1289
1189
1112
1124
0
TM: 8.9%
TDM (overall): 9.7%
TDM (Low/Med
value add) : 9.7%
800
600
949
970
1033
1127
1242
1372
HVA-TDM : TM
400
2011
0%
200
2013
0%
2015
0%
0
2010
2011
2012
2013
2014
2015
TM Volumes
(Million units)
2010
7.72
7.19
0.00
2011
7.92
7.34
0.00
2012
8.67
8.16
0.00
2013
9.63
9.12
0.00
2014
10.81
10.27
0.00
2015
12.20
11.58
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
66
Industry SWOT
The domestic manufacturing of inverters possesses medium value addition; all the electronics components are mostly imported.
Various companies present in the Indian industry leverage their local competencies and global supply to serve the domestic
market. India is more or less self-sufficient in the manufacturing of inverters. The most valuable component inside of an inverter is
the transformer and India possesses considerable capabilities for their manufacture. Such capabilities could enable the country act
as an export hub to countries such as Philippines, Vietnam, Sri Lanka etc.
With regard to UPS, some companies possess local competencies and choose to take advantage of it after considering their global
supply chain options as well. Lower power UPS (5 to 10 KVA) are mostly imported from China, and in some cases from Europe. Some
manufacturing of lower power UPS happens domestically as well. Higher power UPS are imported invariably from Europe or their
home bases. These mostly arrive in the finished product form, or in some cases may arrive in knocked-down units too wherein they
are assembled locally. The more critical technological requirements of higher power UPS require companies to source from their
home bases and R&D facilities.
Component and
Sub-system Suppliers
Assemblers
Transformer
Power devices /
MOSFET
Heat sink
Microcontroller
Capacitors
Resistors
Downstream
Consumers
Inverters / UPS
Cooling system
Inductors
Enterprises
PCB
Power module
Power connectors
67
The table below captures the capability in India across the inverters and UPS value chain.
Category
Components
and Sub
systems
Product
Local
Supply
Local
Manufacturing
Local IP
Capability
Transformer
Yes
Yes
Power devices/
Mosfet
Partial
Heat sink
Level of Local
Value Add
Remarks
No
High
No
No
NA
Partial
Yes
No
NA
Microcontroller
Partial
No
No
NA
Other active
and passive
components
Yes
Yes
No
High
Enclosures
Yes
Yes
No
High
MNCs
Yes
Yes, low to
medium value
addition
No
Low to
Medium
Depending on technology
requirements, make or import decision
is made
Indigenous
players
Yes
Medium value
addition
Partial
High
Inverters/UPS
Company
Names
India doesnt possess end-to-end capabilities of designing UPS with higher power ratings. With regard to manufacturing, robust
design expertise is an imperative for higher power UPS; the product lifecycle is high (approximately 4 years), the investment
needed is huge, as is the risk of implementation. Also, it is not economical to set up manufacturing of higher power UPS due to the
relatively small market size.
68
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
Component SWOT
Many companies in the Indian electronics ecosystem import transformers and heat sinks from overseas though they are
manufactured in India since indigenous players are unable to compete with the cost of importedproducts. The same trend is
observed in PCB supply too. All semiconductor components are imported from East Asia.
The top 4 components that contribute to majority of the inverter/UPS bill of materials (BoM) irrespective of the phone type or price
are:
1. Transformer
2. Power semiconductors
3. Heat sink
4. Microcontroller
69
Strategic Conclusions
General
Information technology is a prime driver of the inverter and UPS market. Opportunities for UPS will open wherever there is a need
for unlimited power at constant frequencythis indicates that all critical applications in the corporate sector will need UPS to
fulfil their purpose. Also, usage of UPS is directly related to productivity which can act as a driver across industries. It would be of
great benefit to the economy of the country if we possessed holistic manufacturing competency of such a product. Hence, local
manufacturing should be encouraged by lowering excise duty and making the process of reimbursement of tax credit easier and
quicker to promote business confidence.
IP development
The government should seek to gain expertise in the design and manufacturing of UPS of high power rating (> 10 KVA) by investing
appropriately in R&Dthe EDF corpus could be an appropriate way of implementing this measure, especially considering the
need for higher capacity UPS for cloud servers and large scale enterprise operations. Alternatively, the government could formalize
practicum programs between industry and engineering institutions, which could lead to innovative design solutions and IP
generationthis could also help develop interest in core design activities among students.
Component ecosystem
The country does possess competencies in the manufacturing of PCB transformers. However, Indian manufacturers find it difficult
to compete with cheaper Chinese products. Indigenous manufacturers also do not possess enough scale to compete with the
Chinese who are able to price their products lower due to their economies of scale. The government could aid local players in
this regard by offering preferential excise duties and facilitating quicker reimbursement of tax credits. Also, the manufacturing of
transformers involves the import of copper, which affects lead time. Developing port and logistics infrastructure could go a long
way in decreasing the lead times of manufacturers and making indigenous products more attractive in the marketplace for OEMs.
Product manufacturing
The steady demand from the PC market and frequent power outages will continue to drive the market for home UPS and inverters.
Also, niche areas like cloud computing require reliable power supply to fulfil their performance guarantees and hence requite
quality UPS of higher power ratings. Export incentives should be given for the export of inverters since the country possesses a
holistic product ecosystem, and export opportunities are available in destinations like Sri Lanka, Philippines, Africa, etc. To this
effect, the extension of the zero duty EPCG benefit to all sectors could be a huge boost in this regard as it would aid manufacturers
in capacity expansion.
Current Limitation
Tax Structure
Component
Ecosystem
Value addition
70
Nil
Nil
Top 4 Components
Component Ecosystem
Low to medium; Huge local market; High growth potential; Critical role
played in end user applications
a. Focus on eliminating grey market through levying CVD and
eliminating dumping, ensuring reliability of products in the market
Memory cards and USB drives Market: TM, TDM Forecasts (2010-2015)
1.6
1.59
1.4
TM: 11.7%
1.40
1.2
1.24
1
0.8
1.10
1.02
0.93
TDM (Low/Med
value add) : NA%
TDM (High value
add): NA
0.6
HVA-TDM : TM
0.4
2011
0%
0.2
2013
0%
2015
0%
2010
2011
2012
0
2013
0
2014
2015
71
TM Volumes
(Million units)
2010
48.20
0.00
0.00
2011
55.70
0.00
0.00
2012
63.07
0.00
0.00
2013
74.64
0.00
0.00
2014
88.60
0.00
0.00
2015
106.09
0.00
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
The Indian electronics ecosystem possesses no competencies with regard to the manufacturing of flash memory. Fabrication
of memory chips and the assembly of flash memory cards is a highly complex and intricate process that requires considerable
investment. Almost all of the global flash memory suppliers are based in East Asia and the US, countries that possess mature
semiconductor fabrication capabilities: Samsung, Toshiba, Micron Technology and Hynix, among others are prominent makers
of flash memory. Since assembly of flash memory cards and drives is an intricate process and the finished products are not bulky
as well, all of the flash memory cards and drives consumed in the Indian market are imported as finished products. An additional
challenge to setting up flash memory fabrication facilities in India is that the business model revolves around low margins and
high volumes. Considering the excess global capacity of flash memory fabrication, it does not present an attractive business case
for investment in the Indian electronics ecosystem. However, manufacturers are investing capital in upgrading their equipment
to implement smaller process nodes at the global level. Costs and power required per chip can then be reduced and memory
densities can be increased. It is expected that 32+ GB configurations will comprise about 60 per cent of flash memory shipments,
beginning 2014.
The value chain of memory cards and USB drives is depicted in the figure below.
Component and
Sub-system Suppliers
USB connector plug
Microcontroller
Crystal oscillator
LEDs
Write protection
switch
Secondary
memory chip
Drive casing
Assemblers
Memory cards
/ USB drives
Downstream
Consumer
Electronics
Personal
data storage
72
Local
Supply
Local
Manufacturing
Local IP
Capability
Company
Names
Level of Local
Value Add
Remarks
Flash memory
chip
No
No
No
Samsung,
Toshiba, Hynix
NA
Microcontroller
No
No
No
NA
No
No
No
NA
No
No
No
NA
LEDs
No
No
No
NA
Casing
No
No
No
NA
OEM
No
No
No
Category
Components
and Sub
systems
Crystal
oscillator
USB connector
plug
Memory cards
/ USB drives
Cree, Nichia
Sandisk,
Kingston,
Transcend
NA
Piracy has long been a bugbear of the flash memory market. Imposing CVD on flash memory products would counteract the effect
of the grey market. It is expected that the resulting increase in prices would not affect the demand for branded products due to the
guarantee of reliable data storage and performance.
The SWOT chart below captures the analysis for the flash memory market.
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
73
Component SWOT
The components that make up a memory card or a USB drive are all mounted on the circuitry or the PCB itself due to the small size
of the products. The cost of manufacturing a memory card or a USB drive is quite low due to the scale achieved by flash memory
suppliers and advances in technology. All of these capabilities are present in East Asia on a large scale which acts against any
potential decisions to invest in local manfacturing capabilities. Also, due to the small size of these products and the complexity of
assembly, it is prudent to assemble memory cards and USB drives at the location of flash memory manufacturing and transport
them as finished products to market destinations. The flash memory chip accounts for nearly 80 per cent of the BoM.
In short, the top 4 components that contribute to majority of the bill of materials (BoM) are:
1. Flash memory chip
2. Microcontroller/ASIC
3. Crystal oscillator
4. USB connector
Strategic Conclusions
General
The government should impose CVD on memory cards and drives to discourage the import of unbranded products and ensure
safety of customer data.
IP development
Considering the semiconductor design strength of the country and the critical nature of memory storage, the government should
utilize the mooted EDF corpus to encourage design activity in this field. This would give the country a foothold in a valuable stage
of a ubiquitous electronics product globally. The licensing of such IP would seed a great amount of design activity and overall
economic activity. This could also be achieved on a smaller scale through a formalized practicum program wherein fabless design
companies tie with nearby engineering colleges.
Component ecosystem
East Asian countries have already achieved scale in the manufacturing of flash memory chips and they also possess the necessary
capabilities to assembly memory cards and USB drives. Advances in memory technology and the scale achieved by flash memory
manufacturers have led to very affordable prices for these products.
Product manufacturing
Considering the low margins and the magnitude of investment required to set up a flash manufacturing facility, it seems logical to
divert the available resources towards other areas that would offer greater and faster returns on investment.However, due to the
critical nature of memory storage and the fact that it would add vital functionality to the products it is incorporated in, it would
be prudent to deliberate on the merits of attracting investment in a flash memory fabrication facility, while assessing the other
available opportunities for investment in the electronics ecosystem.
Current Limitation
Tax Structure
Value Addition
74
a. No measures present to
counteract grey market in
flash memory
a. Absence of flash
manufacturing facilities and
associated assembly activities
Top 4 Components
Component Ecosystem
Electronics imported
High; emission norms getting stricter and EMS aids in better engine
performance
a. Focus on product IP and design
1.34
1.2
1.0
1.22
0.99
0.96
TM: 7.9%
1.12
1.04
0.8
0
0
0.6
0.4
0.2
0.5
0.43
0
0.64
0.55
0.75
0.87
HVA-TDM : TM
2011
0%
2013
10%
2015
25%
0
2010
2011
2012
2013
2014
2015
75
TM Volumes
(Million units)
2010
3.04
1.37
0.00
2011
3.30
1.65
0.00
2012
3.66
1.94
0.00
2013
4.14
2.36
0.00
2014
4.76
2.90
0.00
2015
5.47
3.56
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
Almost 50 per cent of the total demand is met through imports, while the rest are assembled locally by companies like Bosch, Denso
and MagnetiMarelli. These companies presently conduct testing and development of EMS software which equates to a medium
level of value addition with regard to manufacturing in the country. These companies are also making substantial investments in
the expansion of their local EMS capabilities, which will increase the level of value addition with regard to manufacturing of EMS
in India.
The 4W EMS value chain is depicted in the figure below.
Component and
Sub-system Suppliers
System Integrators
Downstream
Mechanicals - Pumps
and Injectors
Analogs & Sensors
4W EMS
OEMs
MCU
76
Local
Supply
Local
Manufacturing
Local IP
Capability
Company Names
Level of
Local Value
Add
Fuel Pump
Yes
Yes
Yes
Bosch, Kayne
High
Fuel Injector
Yes
Yes
Yes
Bosch, Kayne
High
MCU
Imports
No
No
Infineon, ST
Microelectronics,
Freescale, Renesas
None
None
Category
Components
and Sub
systems
Semiconductor ecosystem
missing
Analogs and
Sensors
Imports
No
No
ST Microelectronics,
Infineon, IR, Onsemi,
Freescale
OEM
Yes
Yes
No
Bosch, Denso,
Magneti Marelli
Low
EMS
No
No
No
NA
NA
4W EMS
Remarks
The SWOT chart below captures the analysis for the 4W EMS market.
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
Component SWOT
The top 3 components that contribute to the majority of the 4W EMS bill of materials (BoM) are:
Mechanicals: pumps and injectors
Analogs and sensors
Microcontrollers
Analogs, sensors and microcontrollers are imported components since the Indian electronics ecosystem doesnt possess the
relevant competencies needed for the manufacturing of these components domestically. These are imported by companies such
as STMicroelectronics, Infineon, Freescale, Fujitsu, and the like. Pumps and injectors are sourced locally through companies such as
Bosch and Kayne that possess domestic manufacturing capacity.
77
Strategic Conclusions
General:
The need for an efficient fuel management system in vehicles has seen this product segment chart tremendous growth. To
accentuate the growth of the product market further, using the EMC policy, an automotive electronic cluster could be set up in
south India, preferably near the Bangalore-Chennai corridor, since the area already is home to significant automotive manufacturing
activity.
IP development:
India already holds the IP of one of the critical components, i.e. the fuel injector and pump. However, the IP right of the entire
technology is still held by the global offices of the OEM which are shared with their local offices.
Component ecosystem:
Nearly 95 per cent of the electronics and raw materials required are imported from countries such as Japan, Thailand, Korea, etc. The
country needs to develop the electronics ecosystem along with the remaining raw materials to gain value as this product segment
holds tremendous growth opportunities. This could be achieved by attracting investment through the MSIPS policy. Coupled
with preferential excise duties or greater rates of CENVAT, this could provide impetus for electronics manufacturing in the country,
especially in the area of microcontrollers since the Indian electronics ecosystem possesses considerable design competencies as
well. The setting up of the two semiconductor fabs in the country would prove to be a great enabler in this regard.
Product manufacturing:
Bosch, Denso and MagnettiMarelli, manufacture the most critical component in the BoM, the fuel injector and pump, with around
40-50 per cent being locally designed and manufactured as well.
Current Limitation
78
Top 4 Components
Component Ecosystem
79
1245
1200
1008
1000
800
200
907
816
0
490
397
0
0
TDM (Low/Med
value add) : 14.0%
756
600
400
TM: 11.2%
1121
636
558
827
725
HVA-TDM : TM
2011
0%
2013
0%
2015
0%
0
2010
2011
2012
2013
2014
2015
TM Volumes
(Million units)
2010
6.00
3.15
0.00
2011
6.80
4.08
0.00
2012
7.86
4.90
0.00
2013
9.31
5.88
0.00
2014
10.89
7.05
0.00
2015
12.74
8.46
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
The TFT LCD (thin film transistor-liquid crystal display) industry is very capital-intensive. Typically, the cost of a new TFT LCD fab
is about US$ 3 billion. This is because such a fab would contain expensive process equipment and also critical material handling
equipment that work with the process equipment. The penetration rate of LCD panels has outstripped that of traditional
displays. LCD panels were exempted from basic customs duty beginning 2012, and this is expected to attract investment in local
manufacturing of LCD monitors. However, it is important to be cognisant of the present stage of evolution of display technology
and its relevance to the Indian context.
Globally, LCD fabrication has gone through an evolution of nearly 9 generations since the first generation. The major difference in
generation technology is the size of the mother glass that is used at the beginning of the manufacturing process. The size of the
mother glass used in generation 1 was about 30cm x 40cm, and could make one 15 panel. Presently, the size of the mother glass
used in hybrid generation 8.5 fabs is approximately 220 x 250 cm, and the glass thickness is less than 1mm.
80
Assemblers
Backlight units
Polarizer
Colour filter
Array glass
substrate
Bridge Rectifier
Filter Capacitor
SMPS
Transformer
Schottky
Diodes
Output Filter
Capacitor
Fuse
Downstream
OEMs
Consumers
LCD monitors
Enterprises
Government
Power IC
Opto-isolator
The progression through fab generations in the TFT LCD industry also involves increases in production efficiency. For example, 32
LCD TV panels were originally designed to be manufactured in generation 6 fabs. But presently more than 70 per cent of them are
produced in generation 8 fabs and generation 6 fabs now produce LCD monitor panels. Also, the usage of 0.5 mm glass substrates
in generation 6 and newer fabs has introduced production flexibility; both laptop and monitor panels can now be made in these
fabs, instead of having to concentrate production on one end user application alone.
81
The table below captures the capability in India across the LCD monitor value chain.
Product
Local
Supply
Local
Manufacturing
Local IP
Capability
Company
Names
Level of Local
Value Add
Remarks
Display
No
No
No
NA
Electromehcanicals
No
Yes
No
Medium
NA
Medium
Category
Components
and Sub systems
Himax
Technologies, Orise
Technology, Sitronix,
Raydium,
Semiconductor
ICs
No
No
No
Power components
No
Yes
No
OEM
No
No
No
LG,
Samsung,
AOC
NA
Indigenous
players
Yes
No
Moser Baer,
iBall, Intex
Low
Low manufacturing
value addition
LCD monitors
Generation 5 fabs now mostly produce tablet PC panels; 89 per cent of notebook PC panels are also made in Gen 5 fabs. Generations
5 to 7 currently produce LCD monitor panels.
The SWOT chart below captures the analysis for the tablets market.
STRENGTHS
OPPORTUNITIES
82
SWOT
THREATS
Well established manufacturing ecosystem in East Asia
Capital intensive nature of setting up TFT LCD fabs
Emergence of new display technology that could hinder
return on investment
Infrastructural deficiencies that could delay investment
and implementation
Component SWOT
The biggest contribution to the BoM in terms of dollar value in an LCD monitor is accounted for by the display panel which could
cost up to 50 per cent of the total BoM approximately. Next come the electromechanical components,that could cost 15 per cent
of the BoM, and then the ICs and power components that account for the remaining 15 per cent.In short, the top 4 components
that contributes to majority of the LCD monitor bill of materials BoM are:
1. Display
2. Electromechanicals
3. ICs
4. Power
The bigger players in the market mostly import LCD monitors as finished products and do not need to source locally as the basic
duty on these are exempt as well.
Strategic Conclusions
General
Tax structures should be amended to encourage LCD manufacturing through preferential excise duty rates and easier
reimbursement of tax credit. Since finished product imports are also exempt from basic customs duty due to trade agreements,
the government should explore the option of bringing local sourcing of LCDs under the Preferential Market Access Scheme.
IP development
Investing in R&D for new display technologies should also be considered to hedge against investment made in TFT LCD display
fabrication. Samsung has already been pulling out investments in new TFT LCD generations and has begun investing in R&D for
implementing new AMOLED display technology. This would lead to indigenous IP being created in the country, which could make
India a world leader in those technologies, much like how Japan and Korea have a monopoly on cutting-edge display technology
currently.
Component ecosystem
The Indian ecosystem does possess competencies in the manufacturing of electromechanical components, SMPS transformers
and the plastic enclosures used in the assembly of LCD monitors. The manufacturing of these components should be incentivized,
especially since they are relevant to the product ecosystems of other electronics products as well. Local sourcing of these
components should be encouraged through tax credits for vendors who source these components locally. Simultaneously, the
government could encourage local manufacturers to tie up with engineering colleges and institutes in the vicinity through a
formalized practicum program, so that engineering students could contribute to design of these components.
Product manufacturing
Competencies in the manufacturing of LCD displays,especially for tablet and laptop applications (assuming the supporting
ecosystem for these products are incentivized as well, so that LCD manufacturing can feed into them), could be encouraged. This
would require investment in generation 5 fabs, which are mostly being used for these end user applications79 per cent of tablet
displays and 89 per cent of laptop displays are manufactured in generation 5 fabs. Also, generation 5 fabs are growing at only
3 per cent a year while higher generation fabs are clocking almost 26 per cent annual growth. This could mean that relocating
a generation 5 fab to a brownfield location could be done at an affordable level of investment, instead of the typical $ 3 billion
needed for a new fab.
83
Current Limitation
Value Addition
Policy Initiatives
84
Top 4 Components
Component Ecosystem
1085
1000
TM: 11.2%
956
853
800
709
677
TDM (Low/Med
value add) : 15.4%
769
600
400
HVA-TDM : TM
200
0
2011
0%
2013
0%
74
80
87
102
119
141
2015
0%
2010
2011
2012
2013
2014
2015
85
TM Volumes
(Million units)
2010
0.11
0.02
0.00
2011
0.12
0.02
0.00
2012
0.14
0.03
0.00
2013
0.16
0.03
0.00
2014
0.19
0.04
0.00
2015
0.22
0.05
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
The current ecosystem for servers involves local assembly; however, it is limited to SKD assembly or packaging and local testing.
This translates into value addition of not more than 5 per cent. However one opportunity for extra value addition lies in the sheet
metal fabrication of server cabinets, just as in desktops. This can definitely be carried out in India; however, different grades of steel
will have to be used to adhere to the criticalities of IT equipment. This is most definitely an opportunity in the Indian electronics
ecosystem for servers.
A lot of design activity happens in the captive design centres of global MNCs like Intel, Dell, HP, etc. However, this doesnt translate
into any local IP since all IP is held at the base of operations of MNCs. Assembly is carried out at the market destination for preshipment inspection and pre-delivery testing, if those are required.
In the last few years, local sourcing of components has been on the wane because of a convoluted duty structure that increases
business complexity for manufacturers importing individual components for assembly; for e.g., import for finished mother boards
attracts only CVD while import of individual components for motherboard manufacturing attracts CVD and an SAD of 4 per cent
that will be refunded after raising a reimbursement claim for the same. This increases upfront costs for manufacturers and also
increases uncertainty for them due to reimbursement claims that they need to make. This is particularly relevant during times
of currency depreciation when import costs can increase drastically. Such factors discourage entities from making significant
investments in manufacturing facilities considering the relatively thin margins that this industry operates on.
The server industry might undergo vertical integration in the future. Infrastructure software players are re-architecting their
products to support the dynamism of on-demand service oriented architecture. If on-demand becomes a dominant trend in the
future, one can expect that the software providers who align themselves to this trend would gain power in the value chain. On the
other hand, major systems vendors such as IBM and HP may partner with independent software suppliers or develop their own
stack of software.
86
Downstream
Assemblers
Motherboard;
Memory; Processor
CPU
Hard disk /
Cabinet
Enterprises
Consumers
Servers
Government
Operating System
Software
Applications
The table below captures the capability in India across the servers value chain.
Category
Components
and Sub
systems
Servers
Product
Local Supply
Local
Manufacturing
Local IP
Capability
Company
Names
Level of Local
Value Add
Remarks
Processor
Imports
No
No
Intel, AMD
NA
Motherboard
Imports/Local
Supply
Yes
No
Pegatron, ECS,
Gigabyte, MSI,
Foxconn
Low
Local motherboard
assembly used to be
operational; shut down now
Hard disk
Imports
No
No
Seagate,
Toshiba
NA
Memory
Imports
No
No
OEM
Yes
No
NA
Low
87
Currently, local manufacturing is not competitive globally due to a number of disability factors. In the light of latent manufacturing
strength for certain products, inclusion of those products under the ITA I agreement has constrained the growth of local
manufacturing due to the availability of imported goods. Also, domestic volumes are not growing fast enough for entities to invest
in manufacturing on a large scale. MNCs invested in assembly facilities early on as they needed to be closer to their market; this also
indicates their confidence in the manufacturing capability present in the country. However, the absence of a business environment
in which local manufacturing can thrive has led to the suppression of local manufacturing capabilities.
However, the advent of cloud computing has definitely thrown a spanner in the works in the server market. Cloud computing
offers many advantages to organizations. The cloud allows organization to optimize costs while offering performance guarantees.
However, organizations could possibly implement private and hybrid clouds, which would still require purchase of dedicated
servers.
The SWOT chart below captures the analysis for the servers market.
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
88
Component SWOT
The biggest contribution to the BoM in terms of dollar value in a server is accounted for by the processor which costs anywhere
between $ 60 to 110 approximately. Next comes the motherboard and the hard disk which cost about $ 40 each, followed by
the memory module that costs around $ 30. On the motherboard, the semicondcutor components and the PCB are most critical.
Considering a BoM of $ 40 for the motherboard, it can be estimated that the chipset costs about $ 12, the PCB costs about 6.5, and
that the overall semiconductor cost is about $ 20 including the peripheral chips.
In short, the top 4 components that contribute to majority of the server bill of materials (BoM) are:
1. Processor
2. Memory
3. Motherboard
4. HDD
Processors are sourced from either Intel or AMD. The top suppliers for hard disks are Seagate and Toshiba. However, the situation
with regard to hard disk is slightly in the balance currently due the shift in technology and enterprise business models, i.e., the shift
towards cloud computing and centralized servers, and the movement in technology towards solid state drives.
Strategic Conclusions
General
The levying of SAD should be repealed on individual electronic components, or at the very least, individual components of
motherboards. Also, the reimbursement process should be made easier and faster so that companies do not have to contend with
uncertainties of receiving reimbursement. The present rate of abatement should also be raised from 25 per cent to reflect the rise
in costs of doing business. SAD could be levied on finished product imports of motherboard for which a nascent manufacturing
ecosystem exists in India.
IP development
A large amount of design activity is carried out at the established IT firms such as HCL and Infosys and the captive design centres
of Intel and AMD, but there is no local IP held in the country. Encouraging the growth of fabless design companies and software
development firms through start-up capital seeding, and possibly through the mooted EDF corpus, could lead to the generation of
indigenous IP in the short to medium term. The application of regional language software could provide opportunities considering
the expected penetration of computing and connectivity in semi-urban and rural areas; the idea of setting up central government
grants for such software development activity at the NITs should be considered.
Component ecosystem
The manufacturing of motherboards should be incentivized by exempting individual components from basic customs duty and
excise duty, or offering preferential excise duty. Decrease in tax revenues could be offset a little through smaller hikes in sales tax
or through offering greater rates of CENVAT credit on excise duties.The Indian manufacturing ecosystem possesses competencies
in the manufacturing of motherboards, which is a top BoM contributor in terms of dollar value. It also has applications in almost
every electronics product. Once local manufacturing is encouraged by exempting from/ granting preferential excise duties, it is
very possible that investment will flow in and spur organic growth of the value chain. Likewise, sheet metal fabrication and plastic
moulding are fairly mature technologies in India; hence, the manufacturing of cabinets and enclosures could also be incentivized
through preferential excise duties and exempting them from additional duties, for use in servers.
Product manufacturing
The assembling of servers is already being carried out by global OEMs and indigenous players like HCL and Wipro. India has held
back from discussing the ITA II due to the fact that the government recognizes the need for encouraging the growth of the nascent
manufacturing capabilities in the country. If India were to sign the ITA II, it could potentially push companies into investing in
high-value added manufacturing in the country. Coupled with the wholesome basket of policy initiative being enacted by the
government, this could also lead to the establishment of a thriving product ecosystem.
89
Current Limitation
Tax Structure
Value Addition
Component
Ecosystem
90
a. Reliance on imports
b. Demand volumes
Top 4 Components
Component Ecosystem
91
1.35
1.26
1.2
1.0
1.08
0.98
TDM (Low/Med
value add): NA%
0.88
0.8
0.72
0.6
HVA-TDM : TM
0.4
0.2
0
0
0
2010
2011
2012
0
2013
0.18
0.09
2014
2011
0%
2013
0%
2015
0%
2015
TM Volumes
(Million units)
2010
0.120
0.000
0.209
2011
0.110
0.000
0.240
2012
0.080
0.000
0.252
2013
0.120
0.000
0.272
2014
0.140
0.000
0.289
2015
0.150
0.000
0.309
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
The BTS value chain consists of BTS suppliers, EMS partners, sub-part suppliers and telecom operators. Almost all the leading
suppliers of BTS globally, namely NSN, Ericsson, Alcatel Lucent, Huawei and ZTE, supply BTS in CBU form to Indian telecom
operators by directly importing BTS units to the installation sites anywhere across the country. For the export market, a gamut of
activities arecarried on by the OEMs, their EMS partners and the sub-part suppliers.
92
Downstream
System Integrators
ICs
Discretes
Semiconductors
Passives
Metals
Interconnex
Antenna
OEM
Electro-mechanicals
BTS
Customers
EMS Partner
Power Supplies
packaging
Operating System
Software
Applications
There is some low value added assembly-cum-manufacturing of GSM BTS happening in Indian through manufacturing plants
situated in Tamil Nadu. However, the entire production of these plants is exported to markets across Europe. The board with key
components already mounted is imported while succeeding activities such as PCB assembly, casing mounting, etc. are carried
out locally. While import of the critical components is unavoidable, some 25 to 30per cent of the BoM, comprising of the antenna,
interconnectors, power supplies, metal casing, packaging materials, etc., are sourced locally from domestic sub-part suppliers.
Local suppliers either source the raw materials locally or import them to match the specification of OEMs. In some cases, OEMs
may provide the local suppliers with the reference designs for the manufacturing of sub-parts/systems. As for components, all
the semiconductors and electro-mechanicals are imported into the country while local players ensure the supply of packaging
material, metal parts, antennae, power supplies, interconnectors, etc. The amount of design activity that happens in the country
for BTS manufacturing is small.
93
The table below captures the capability in India across the BTS value chain.
Product
Local
Supply
Company
Names
ICs
Imports
No
No
TI, Freescale,
NXP, ST
Microelectronics
NA
Power
Amplifier
Imports
No
No
Power wave,
Ericsson, NSN,
Huwaei
NA
Power
Supplies
Yes
Yes
Yes
High
Antenna
Yes
Yes
No
High
Interconnex
Yes
Yes
No
High
Metals,
Packaging
Yes
Yes
No
High
OEM
No
No
NSN, Huawei,
ZTE, Alcatel
Lucent, Erricson
Low
EMS
No
No
Sanmina
Low
Category
Components
and Sub
systems
BTS
Local
Local IP
Manufacturing Capability
Remarks
Huawei and ZTE possess large-scale manufacturing bases in neighbouring China. The recent rise of Vietnam and Africa as
emerging destinations for low cost manufacturing is seen as a credible threat to Indias dream of becoming a global manufacturing
destination. Most of the BTS MNCs have established R&D centres in India; however, the intellectual output from the design and
R&D activities carried out is held at their global headquarters. The recent policy initiatives are expected to attract investments into
the local BTS sector given the enormous demand and export potential.
The SWOT chart below captures the analysis for the BTS market.
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
94
Component SWOT
The BTS consists of thousands of components and almost half of the product cost is contributed by electronics used in the BTS. The
top 4 components that contribute to majority of the BTS bill of materials (BoM) are:
1. ICs
2. Power Amplifier
3. Power Supplies
4. Antenna
The BTS value chain in India lacks the presence of a well-endowed ecosystem for manufacturing of both components and the
end product. The electronic components of BTS are exempt from import duty (under ITA-1) which could act as a restraint against
investment in the Indian component ecosystem.
Strategic Conclusions
General:
BTS are exempt from customs duty for import of electronic components used in its manufacturing anywhere in the world, being
part of the ITA- 1 list of products. Also, suppliers have raised concerns about the high in-land freight charges in India, which accounts
for about 15 to 17 per cent at present, which is exceptionally high compared to the freight charges of importing BTS globally.
Decreasing the in-land freight costs from 17 per cent to about 3 to 4 per cent would reduce costs for indigenous manufacturing
and encourage local value addition.
IP development:
Irrespective of the presence of numerous captive and third party design houses in the country, along with individual design
centres of the global BTS OEMs, none of the IP is realized locally as all the patenting is done overseas. Although a good percentage
of design related work is carried out here, probable lack of Governmental support and encouragement has led India to lose out
on patent filing.
Component ecosystem:
In the domestic BTS manufacturing ecosystem, parts and sub-parts such as the antennas, interconnectors, power supplies, metal
casing, packaging materials, etc., are sourced from local suppliers, and these contribute around 25 to 30 per cent of the total BTS
BoM. A closer look at the component composition of BTS indicates that only the electronic components are imported into the
country, besides a few electro-mechanical parts. However, the setting up of semiconductor fabs in the country is a positive step
towards becoming self-sufficient with regard to semiconductor manufacturing. This factor could incentivize manufacturing of
electronic components and other downstream activities that feed into the manufacturing of BTS.
Product manufacturing:
The local PCB industry not only serves the domestic market but also serves the export market; around 24 per cent of the total PCBs
manufactured annually is exported. Indian PCB manufacturers have also enhanced their capabilities from single 2-layered PCBs
to 16-24 multiple-layered PCBs. However, local sourcing of PCBs is not considerable because the PCBs needed are too complex
for Indian PCB manufacturers. Competency should be built so that local sourcing of the required PCBs can be done. Domestic
manufacturers should also be encouraged to build their capabilities to design and develop power supplies and antennas used in
the BTS from scratch to the final product indigenously. The MSIPS, EMC and NMP policies serve as a holistic guideline for suppliers
to take cognizance of, and apply for appropriate subsidies.
95
Current Limitation
Tax Structure
Value Addition
Policy Initiatives
96
Top 4 Components
Component Ecosystem
0.43
0.41
0.57
0.55
0.52
0.66
0.63
0.60
0.51
0.47
0.44
0.48
0.3
HVA-TDM : TM
0.2
0.1
2011
78%
2013
78%
2015
77%
0
2010
2011
2012
2013
2014
2015
97
TM Volumes
(Million units)
2010
200
154.55
NA
2011
220
220.00
NA
2012
242
170.00
NA
2013
267.9
242.00
NA
2014
294.7
187.00
NA
2015
324.2
267.89
NA
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
The power supplies value chain comprises of various material and component suppliers, subsystem suppliers and the downstream
segments like IT, ITeS, etc. The Indian market witnesses a huge unorganized market for power supplies comprising a number of small
local players who execute local assembly activities. The electronic components are imported while the rest of the components are
locally sourced and assembled. This contributes to high value addition in the indigenous manufacturing of power supplies. India
meets around 70 per cent of the local demand through local manufacturing. The remaining 30 per cent is imported majorly as
finished goods and either sold at lower prices since they do not undergo safety certifications or tested locally and sold at a higher
price.
The power supplies value chain is depicted in the figure below.
Component and
Sub-system Suppliers
Assemblers
Downstream
Transformer
Power supply
Copper wires
Capacitor
Rectifiers
Consumer
IT / ITes
IC
Mosfets
Mechanical
Components
Rubber
Plastic,
Sheet Metal
98
Components
and Sub
systems
Product
Local Supply
Capacitors
Only Sales
Offices; Total
Imports
Local
Local IP
Level of Local
Company Names
Manufacturing Capability
Value Add
No
No
Koshin, STM,
Infineon
NA
Majorly local
Transformer supply, partially
imported
Yes
No
Pulse magnetic,
Many local
players
NA
Rectifier
diodes
Partially
Imported, Partial
local supply
Yes
No
Many small
players
High
PCB
Local supply
Yes
No
AT&S, Derg
electronics, Many
local players, EMS
High
Mosfets/
Switching
devices
Local supply
Yes
No
Many local
players
OEM
Yes
No
High
EMS
Yes
No
Delta Electronics,
many small
players
High
Power
supplies
Remarks
Though design capability exists
there is no local realization of IP,
Lack of infrastructure
The challenge that the industry is currently facing is the component customs duty which is around 12.36 to 16.85 per cent.
Mechanical components are locally sourced though. Although huge opportunities lie ahead, especially with the booming IT and
ITeS sector, local manufacturing largely caters only to local demand. There are very minimal exports with respect to this product.
Lack of scalable manufacturing capacity deprives the ecosystem of export opportunities.
The SWOT chart below captures the analysis for the power supplies market.
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
99
Component SWOT
The top 4 components that contribute to majority of the power supplies bill of materials (BoM) are:
1. Transformer
2. Power semiconductor
3. Rectifier diodes
4. PCB
The transformer, the most expensive component in an external adapter, is majorly sourced locally with a number of local players
offering the same. Local transformer manufacturers are largely dependent on imported copper. The presence of large manufacturing
capacities in China, Hong Kong, Taiwan etc.,make it more attractive for manufacturers to import transformers than source them
locally. The ICs, capacitors, rectifiers and MOSFETs are also predominantly imported. The PCBs, mechanical components, plastic,
sheet metal, rubber etc., are locally sourced and are available at competitive prices and reputable quality.
Strategic Conclusions
General
The component duty currently ranges between 12.36 to 16.85 per cent, which is considered high for the industry especially since
India is a price sensitive market. Offering subsidies for indigenous manufacturers through capital subsidies and preferential excise
duties would prove to be very beneficial since the ecosystem possesses considerable competencies already.
IP development
Around 30 per cent of the power supplies are imported as finished goods, of which around 15 per cent of them are sold in the local
market without safety certifications and testing. This necessitates the need for a policy initiative to prevent dumping of power
supplies which would bolster the quality of power supplies available in the Indian market. Regional level testing labs should be
established and testing for imported goods should be mandated. The proliferation of unbranded products in the market calls for
CVD to be levied to prevent dumping in the local market.
Component ecosystem
Lack of volume capacities forces some manufacturers to import transformers from the neighbouring countries. The Indian
Government could aid in ensuring continual availability of copper through the year at subsidized prices. This will reduce the overall
cost of the components, thus making it price competitive.
Product development
Power supplies is a high growth market due to the increasing demand for laptops, mobiles etc. Hence the market also possesses
considerable export potential. However, export subsidies should be offered only after standardizing safety regulations and
certification. Considering the low margins needed to set up the ecosystem for some of the critical components, it seems logical
to leverage the EPCG scheme, which would help exporters to import machinery and equipment at affordable rates and produce
quality products for the export market.
Current Limitation
Tax structure
Value
Addition
a. Reliance on imports
Component
Ecosystem
Policy
Initiatives
100
b. Demand Volumes
Medium
Top 4 Components
Component Ecosystem
101
0.95
0.9
TM: 27.5%
0.8
0.7
0.6
0.5
TDM (Low/Med
value add) : 54.9%
0.62
0.52
0.5
0.4
0.1
HVA-TDM : TM
0
0
0.17
0.36
0.3
0.2
0.75
0.14
0.52
0.37
0.25
0.18
2011
0%
2013
0%
2015
0%
0
2010
2011
2012
2013
2014
2015
2010
15.50
4.50
2011
10.50
4.00
2012
18.40
5.70
2013
23.52
8.70
2014
30.08
14.00
2015
39.35
21.00
Base Year: 2011 Source: IESA-Frost & Sullivan
102
Industry SWOT
STB value chain comprises various component and subsystem suppliers, technology licensors and software developers apart from
the downstream players comprising the cable operators, multi system operators (MSO) and retailers.
The STB value chain is depicted in the figure below.
Component and
Sub-system Suppliers
System
Integrators
Downstream
Memory
MPU
Core Chips
Tuner
RCA Cable
PCB, Passive
Component
Core
Components
Set Top
Boxes
Power Supply
CAS
Operating
System
Cable
Operators
Consumers
MSO
External
Components
Software
Applications
The leading suppliers of STBs in India are, Huawei, Pace, Cisco, Chang Hong, Skyworth, Hathway, HUMAX, Technicolor, Echostar and
MCBS, whose customers are the major DTH and Cable MSOs, namely, DishTV, Airtel, Tata Sky, Hathway, Incable, WWIL, etc. Most of
these suppliers are already operating from their sales office in the country. The after sales support activities of the companies are
outsourced to local companies like Carbon and SS Mobile.
The domestic STB manufacturing sector has received the much needed fillip recently with active participation from companies
such as Videocon, Beetel, Mybox, Bharat Electronics and Indieon technologies. Beetel started importing free-to-air STBs as early as
2004 and continues to supply to Airtel, a service provider. Another DTH operator, Videocon, initially imported STBs to meet their
captive demand, but started in-house manufacturing of STBs through their subsidiary Trend Electronics in 2008. Mybox, established
in 2008, is a Govt. recognized R&D centre, which designs and develops STBs in-house. Even Indieon Technologies, started in 2008,
contract manufacturers STB from different EMS companies and also fulfils the rest of the demand by importing components and
assembling in its plant. Some global EMS companies in India, like Jabil Circuits, manufacture STBs primarily for their European
clients, with a very small percentage being supplied to local service providers. Jabil, Dixon, Quad, Nainko, andKortek Electronics are
some of the EMS companies manufacturing STBs in India. For the Doordarshan free-to-air service, STBs are manufactured in India
by contract manufacturers, but they have very little expertise in making conditional access system (CAS) boxes.
The ecosystem for STB manufacturing in India is fairly developed when compared to other high priority products. Nearly 40-45
per cent of the BoM for STB can be locally sourced or there is localization capability. However the most critical challenge for local
manufacturers is to keep their cost of production at a level that makes them competitive on par with global suppliers. Currently,
there are various fiscal and supply chain related factors that prevent STB manufacturers from pricing their products lower than
global competition.
103
Local capabilities in product design and IP are also abundant. With the product being developed with standard features and
specifications, possessing local IP is not seen a great differentiator any longer. Local IP and design capabilities help in reducing the
product cycle time and also in rapid technological advancements. Apart from local manufacturers holding IP, there are a few third
party design houses like Tata ELXI that provide complete design service solutions for overseas STB OEMs.
The table below captures the capability in India across the STB value chain.
Category
Company
Names
Level of
Local Value
Add
Remarks
No
NXP, STM
NA
Yes
Yes
VMC, Axiom
High
Only
Predominantly
Imports
No
No
Multiple
Suppliers
NA
Imported
No
No
Cisco, Nagara
vision
Low
Yes
Yes
Yes
Multiple
Suppliers
High
RCA Cables
Partial Imports
Yes
Yes
Multiple
Suppliers
High
Remote
Control
Imported
Yes
Minimal
Multiple
Supplier
Low
High
Local Supply
IC
Only Sales
Offices; Total
Imports
No
External
Power Supply
Yes
PCB
CAS
Plastic ,
Components Sheet Metal,
Packaging
and Sub
Material
systems
Smart Card
Yes
Yes
Yes
G&D,
Oberthur,
Sagem,
Sharon
Solutions
Passive
Components
Imported
No
No
Multiple
Suppliers
Low
High
Low
OEM
Yes
Yes
Yes
Videocon,
myBox
Technologies,
Indeon
Technologies
EMS
Yes
Yes
Jabil Circuits,
Kortek
Set Top
Boxes
104
Local
Local IP
Manufacturing Capability
Product
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
Cheaper imports
Component SWOT
The component ecosystem for STB is partially developed in India. There are certain components in which India has selfsufficiency,and afew others where this is no local capability. The top 4 components that contribute to majority of the STB bill of
materials (BoM) are:
1. ICs (MCU, Memory, Tuner etc.)
2. Printed Circuit Board (PCB)
3. External Power Supply
4. Plastics and Mechanicals
Of the top 4 components, there is local capability and complete local sourcing of the external power supply in STBs. Companies
such as VMC and Axiom provide the power supplies needed for STB. These companies are also engaged in exports. Beyond the
top 4 components, there is local ecosystem and supply of sheet metal, plastics, packaging material or gift box and smart card (pay
tv). All these cumulatively account for approximately 40per cent of the overall BoM. The most critical components of the BoM are
the IC and tuner ICs, which are completely imported. NXP Semiconductor, STMicroelectronics and Renesas Technologies are some
of the suppliers of these ICs. PCBs for STB are predominantly imported as local suppliers do not provide 2 layered PCB of 0.5 mm
thickness desired for STB manufacturing. The PCBs are typically sourced from multiple Chinese vendors.
The other significant component, the CAS, is currently supplied by foreign players. Companies such as Cisco (which acquired NDS),
Nagara Vision and Irdeto dominate and control the market through their licenses that are used by the various STB manufacturers.
Indian manufacturers will be able to achieve cost competitiveness if local sourcing of CAS is possible. The ongoing initiative of
DeitY to develop indigenous CAS will help in addressing this challenge.
105
Strategic Conclusions
General
Hiking the import duty for STBscan curbimports and promote local manufacturing of STBs. The 2012-13 Budget did see a hike in
the customs duty but it has been found to not be sufficient in this regard. Countries such as China and Brazil are known to have
high tariff rates for STB imports as a measure of promoting local manufacturing; this needs to be emulated by India too.
The existing business model for STB in the country involves the cable operators and MSO who package the STB as part of their
offerings to customers. They do not pay VAT and hence are constrained from issuing Form C. This results in local manufacturers
having to pay CST equivalent to local VAT (~12.5per cent) making the landed cost for locally manufactured products high and thus
costlier than imports. The remedial measure sought is the issuance of Form C without affecting the existing business model which
is highly possible with Government intervention.
Product manufacturing
The DTH industry and cable operators are plagued by huge operational challenges. This is due to lack of financial assistance from
the Government. The industry also pays multiple taxes such as service tax, entertainment tax, licence fee and VAT. The support
system in countries like China and Korea is extremely industry friendly; this is reflected in the high level of exports from these
countries. Today, the suppliers in these countries are tied up with financial institutions like EXIM banks, which offer long term credit
over three to five years at an extremely low interest rate. No such financing is available in India as this is not treated as a capital
goods industry. The STB market needs to be made a priority sector and low interest special loans need to be made available to both
manufacturers as well as the DTH service providers.
Current Limitation
Tax Structure
106
Value Addition
& Component
Ecosystem
Financial
Incentives
Local Manufacturing/Assembly
Volumes and Growth
Top 4 Components
Component Ecosystem
Negligible
Low; Small local market; Huge investment required; Market shifting to enterprise
segment
a. It would not be wise to offer incentives for manufacturing of inkjet and laser
printers and MFDs
b. Offer greater CENVAT credit for local sourcing of components for dot matrix
printers; raise import duties simultaneously
107
756
700
TM: 16.1%
630
600
545
500
400
396
TDM (Low/Med
value add) : 24.2%
474
417
300
HVA-TDM : TM
200
100
0
0
28
2010
42
49
61
76
2011
2012
2013
2014
2011
0%
2013
0%
99
2015
0%
2015
TM Volumes
(Million units)
2010
2.56
0.18
0.00
2011
2.78
0.28
0.00
2012
3.22
0.33
0.00
2013
3.71
0.42
0.00
2014
4.38
0.53
0.00
2015
5.25
0.69
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
The business conducted by enterprises, especially in the ITeS and BFSI sectors, calls for robust documentation which are fulfilled
satisfactorily by MFDs. The rising number of entities in the SOHO (Small Office Home Office) segment has also led to the purchase
of affordable MFDs or laser printers. Global vendors and distributors are also targeting these segments. To this effect, OEMs are
working closely with channel partners to expand their market reach and optimize their distribution strategy.
108
LCD displays
Memory
Network ports
Transformer
Power supplies
Motors and
drives
Drum and
roller
Downstream
Enterprises
Printers /
MFDs
Consumers
Government
Lens and
scanner
Cabinet and
casing
Printheads
Cabling and
filters
109
The table below captures the capability in India across the printers and MFDs value chain.
Category
Components
and Sub
systems
Local
Local IP Company Level of Local
Manufacturing Capability Names
Value Add
Product
Local Supply
Photosensitive
drum
Part of finished
product import
No
No
NA
Fusing Roller
Part of finished
product import
No
No
NA
Transformer
Imports/Local
Supply
Yes
No
Low
Part of finished
product import
No
No
NA
Imports/Local
Supply
Yes
No
Low
Cabinet, casing,
and cabling
Imports/Local
Supply
Yes
No
Low
OEM
No
Yes, only
assembly of dot
matrix
No
EMS
No
No
No
Printers and
MFDs
TVSE, WeP
Remarks
Low
Nil
The printers and MFD market possess high entry barriers. Primary among them is that established players have entrenched market
shares (overall, the top 4 players possess cumulative market share of 90 per cent). Newcomers would either have to differentiate
themselves uniquely or contend with making lower margins and possessing enough working capital to stay in business until
they break even. Also, distribution channels of the bigger players are more or less well established and newcomers would find
it difficult to match the reach of bigger players. Also, competing with the strong brand equity of the bigger players would be
a daunting proposition. However, due to the depreciating value of the India Rupee, bigger players have been increasing prices
recently, which would not appeal to the value conscious nature of Indian consumers, in both the enterprise and home segments.
Newcomers such as Pantum have entered the A4 market with a product portfolio of laser printers aimed at the home segment and
the small business segment. Also, companies such as Ricoh and Canon that normally operate in the A3 market have entered the
A4 market too. This indicates a trend towards offering greater value to the home and SOHO segment which are demanding greater
functionality at lower prices in light of increasing independence from print.
110
STRENGTHS
OPPORTUNITIES
Established trade
relationships
customer
channels
and
SWOT
WEAKNESS
THREATS
Import-heaviness of industry-latest
introduced after global launch
products
are
Component SWOT
A printer or MFD is made up of a number of components and the value chain for the manufacturing or assembly of these
components is nearly absent in India. Almost 90 per cent of the printers and MFDs sold in the Indian market are imported in the
form of finished products. A few components such as transformers, cabling, cabinets and PCBs could be sourced locally if there
were local assembly capabilities. These components are possibly being sourced locally for the local assembly of dot matrix printers
by indigenous players like TVSE and WeP.
The top 4 components that contribute to the majority of bill of materials (BoM) are:
1. Photosensitive Drum
2. Fusing Roller
3. Transformer
4. Lens and scanner
111
Strategic Conclusions
General
It has been observed that companies have been entering the A4 market space offering affordable laser printing products. This
indicates that the companies are betting on these products gaining acceptance in the home segment, and possibly the SOHO
segment too. However, a trend towards m-tickets and e-tickets and other such modes of display on electronic devices might act
against the growth of the A4 market. It is quite possible that, in combination with the trend towards cloud printing, the home
segment could witness consolidation of printing needs among users in a specific area or group. This could also lead to consolidation
of functionalities at the printing node which could be satisfied by MFDs and its future version. The enterprise segment though, has
a stated and compulsory need for specialized, state-of-the-art, and reliable printing solutions. This could be satisfied by high-end
laser printers and MFDs alike depending on the enterprises needs.
IP development
Almost all of the design activity in the printers and MFD happens at the headquarters of the global OEMs, which is Japan for
the most part. The design activity that does happen in India is mostly concerned with software, not core hardware design that
contributes most of the value to the overall design of the product.
Component ecosystem
Some of the components used in the manufacturing of dot matrix printers, such as transformers, PCBs and cabling, are currently
being manufactured in India. Dot matrix printers are still being used on a large scale in both urban and rural areas by the retails
sector and by SMBs. Hence, the government could incentivize local value addition through preferential excise duties and greater
CENVAT credit for suppliersthese components possess a larger relevance in the electronics ecosystem too outside of the dot
matrix printer product ecosystem.
Product manufacturing
Considering that the Indian print market is relatively small compared to the global market, possesses no export opportunities, and
requires considerable investment to build manufacturing capabilities, it would not be a wise option to incentivize manufacturing
of printers and MFDs in India. However, dot matrix printing still holds sway in the Indian market, with indigenous players also being
present in the market. Considering the shift towards high-end laser printing and MFDs space, the government could offer these
tax credits on R&D activity in these areas. The government could also facilitate the formation of joint ventures between indigenous
players and global OEMs to take advantage of latent manufacturing capabilities; there could be export opportunities to the Middle
East, Sri Lanka and Africa due to Indias geographical location.
Current Limitation
a. Relatively small market does
not justify investment in local
manufacturing/assembly
Market / Value chain
b. No export opportunities
c. Shift towards MFDs which possess
complex design
d. Shift to e-based output (e-tickets,
etc.)
112
Nil
Nil
Top 4 Components
Component Ecosystem
Absent
TM: 9.6%
0.65
0.59
0.6
0.5
0.50
0.47
TDM (Low/Med
value add): NA%
0.47
0.4
0.3
HVA-TDM : TM
0.2
2011
0%
0.1
2013
0%
2015
0%
2010
2011
2012
2013
0
2014
2015
113
TM Volumes
(Million units)
2010
0.030
0.00
0.00
2011
0.033
0.00
0.00
2012
0.033
0.00
0.00
2013
0.044
0.00
0.00
2014
0.050
0.00
0.00
2015
0.059
0.00
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
The Router/Switches value chain in India consists of only the supplier and the end-user, with all the major global OEMs being
present in the Indian market. World-leader Cisco, leads the Indian market followed by Avaya, Juniper, HP, Huawei, Pointred, AlcatelLucent, ZTE, etc. All of the domestic market is served by imports from the global manufacturing bases of these OEMs.
The Router/Switches value chain is depicted in the figure below.
Component and
Sub-system Suppliers
System Integrators
Downstream
Software and OS
Memory
EMS companies
Customers
Processor
Electromechanicals
114
Category
Components
and Sub
systems
Product
Local
Supply
Local
Manufacturing
Local IP
Capability
Software
and OS
Imports
No
No
Processor
Imports
No
No
Memory
Imports
No
Company
Names
Level of
Local Value
Add
NA
NA
No
Toshiba,
Samsung,
Micron, Hynix
NA
NA
NA
Electromechanicals
Router/
Switches
Remarks
OEM
No
No
No
Cisco, Avaya,
HP, Juniper,
Huawei,
Pointred, etc.
EMS
No
NA
NA
NA
However, the abundantly available indigenous skilled manpower has seen establishment of captive R&D centres in the country by
global suppliers like Cisco, Huawei, NSN, etc., who employ thousands of engineers and post-graduates in different fields of R&D. For
instance, The Cisco ASR 901 Router developed by Ciscos engineering team in India received numerous industry awards. However,
the IP of product was not registered in the country, a practise seen with all other players, since it is easier to file patents for products
in the same series in one location where the preceding patents were filed, which invariably is their global headquarters. The SWOT
chart here captures the analysis for Router/Switches market.
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
115
Component SWOT
The top 4 components that contribute to majority of the Router/Switch bill of materials (BoM) are:
1. Software and Operating System
2. Processor
3. Memory
4. Electro Mechanicals
The Indian electronics manufacturing ecosystem does not presently possess competencies in the manufacturing of the above
components. Even though the country possesses excellent software development capabilities, the source code and IP created are
registered in the global offices of the suppliers, thus creating no real value addition in the country. In a router/switch, the software
and OS account for about 50 per cent of the total BoM, and the system installation and software uploading is strictly done by
suppliers personnel at the premises of the customers.
Strategic Conclusions
General:
Efforts are needed to boost the demand of routers and switches in the country which will ensure domestic manufacturing of the
same by both global as well as domestic telecom players as opposed to them being imported in the country as is the present
scenario. Also, the Government can formulate supportive policies and incentives in the areas of transfer pricing and royalty
withholding to make them more conducive and also towards bringing down the inbound freight charges to offset these policy
handicaps to encourage domestic manufacturing in India.
IP development:
A majority of the global suppliers of routers conduct their design and development activities associated with routers in their Indian
design centres. However, the patents for the same are filed in their global headquarters for it holds large financial value from the
scope of licensing. India can make an effort to make patent laws more friendly and rewarding by giving R&D sops, reducing patent
fees, etc.
Component ecosystem:
Lack of availability of local raw materials and the concern for the quality of the available raw materials has been a major reason
for the import of this product in the country. The manufacturing of routers is a highly complex process and requires 24-60 layered
PCB assemblies, which is currently not within the competencies of the Indian electronics manufacturing ecosystem. Indias PCB
manufacturing capabilities are very nascent. To encourage domestic manufacturing of such complex processes, the government
should either offer preferential excise duty rates for such complex processes or alternatively offer greater rates of CENVAT to
encourage investment. Also, the government could prioritize, or call for, investment in such PCB manufacturing under the MSIPS
scheme and offer associated benefits to those investors.
Product manufacturing:
The product complexity limits its domestic manufacturing by both the local and global players. However, investments can be made
under the MSIPS or EMC initiatives to gain benefits.
Tax Structure
Value Addition
Policy Initiatives
116
Current Limitation
Top 4 Components
Component Ecosystem
Entirely missing
0.6
0.55
TM: 10.9%
0.50
0.5
0.46
0.44
0.42
0.4
TDM (Low/Med
value add) : 68.4%
0.3
0.2
0
0.1
0
0.042
0.044
2010
2011
0
0.125
0.083
2012
2013
HVA-TDM : TM
0.165
2014
0.21
2011
0%
2013
0%
2015
0%
2015
117
TM Volumes
(Million units)
2010
3.34
3.33
0.00
2011
3.63
0.36
0.00
2012
4.03
0.72
0.00
2013
4.64
1.16
0.00
2014
5.33
1.60
0.00
2015
6.15
2.15
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
The car radio industry presently caters to the domestic demand mostly through imports. Thus, leading OEMs such as Sony,
Panasonic, Pioneer, Kenwood, etc., are involved only in marketing activities in the country. The value chain consists of importers and
domestic manufacturers. Domestic manufacturers, such as Nippon, Audiotronix, and Visteon, import raw materials and execute
low level assembly of standard car radios. However, they import high-end systems in CBU form from countries like China, Thailand
and Vietnam, much like the importers. Several after-market non-branded car radios are imported from China and sold thru retail
market, which constitutes only 10-15% of the total market. Most of the car owners prefer branded car radios, and Japanese brands
rule the after-market radios segment. The growing trend of factory fitted car radios is expected to make the factory fitted car radio
market share equal tothat of after-market (dealer fitment) radios by 2016.
The Car Radio value chain is depicted in the figure below.
Component and
Sub-system Suppliers
System Integrators
Importers
Downstream
Passives
OEMS
Semiconductors
Car Radio
PCB
Aftermarket
Electromechanicals
118
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
Component SWOT
The top 4 components that contribute to majority of the car radio bill of materials (BoM) are:
1. ICs
2. Electromechanical components
3. PCB
4. Power
The component ecosystem for car radios has been reliant on imports. Most of these components are imported in CBU form. Even
for the amount of assembly activity that does happen in the country, the components other than ICs are imported from China or
Taiwan due to their cost competitiveness. The Indian electronics ecosystem does possess competencies in the manufacturing of
PCBs though; this could be taken advantage of to further promote assembly activity in the country. With enough impetus in this
regard, the ecosystem could potentially gain competencies in activities higher up in the value chain.
Strategic Conclusions
General
Although considered a very niche product market, the growing demand of automobiles in Tier-2 and Tier-3 cities along with the
second hand market has sustained the demand of car radios. The use of basic entertainment systems in cars has prompted many
OEMs to start assembling them locally. Also, the excise duty is at par with other products and there is zero import duty on import of
electronic components. Offering preferential excise duties and imposing BCD on the components that have indigenous presence
could promote domestic manufacturing activity.
IP development
India has capability in design services, thus generating indigenous design activity and holding IP in the country should be the
prime area of focus. Offering car radios with features based on the local needs, such as regional language interfaces, local on-board
content, etc., could be a game changer
119
Component ecosystem
Of the top four components, India possesses a good chance of elevating itself as a global supplier of PCBs. The country already is
manufacturing and exporting almost 20 to30 per cent of the total production of PCBs across the world. However, the volumes and
the subsequent price points in comparison with China is a major hindrance as is the ability of Indian PCB makers to handle complex
products that require more than 24 layers. Government support in the form of lower excise duties and rebates for up-gradation of
capital equipment will make a positive impact.
Product manufacturing
Carrying out measures such as offering preferential excise duties, imposing BCD on components with indigenous capabilities,
and creating local design and content, could entrench the manufacturing of car radios in the medium term. With greater design
capability, the country could even be a forerunner in the design and manufacturing of futuristic on-board entertainment platforms
in cars that succeed car radios.
Current Limitation
Value Addition
Component Ecosystem
Policy Initiatives
120
Top 4 Components
Component Ecosystem
0.9
0.8
0.76
0.7
0.64
0.6
0.53
0.5
0.4
0.39 0.37
0.45 0.43
0.84
0.72
0.60
0.50
0.3
HVA-TDM : TM
0.2
2011
96%
2013
94%
2015
94%
0.1
0
2010
2011
2012
2013
2014
2015
121
TM Volumes
(Million units)
2010
375.00
354.17
0.00
2011
450.00
425.00
0.00
2012
562.50
531.25
0.00
2013
708.75
669.38
0.00
2014
885.94
836.72
0.00
2015
1089.70
1029.16
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
The CFL value chain comprises various component and subsystem suppliers, assemblers and the downstream retailers and
consumers. Three types of players exist in Indian market: manufacturer-cum-importers, importer-cum-assemblers and importercum-traders. The first category comprises of big brands that belong to well-known manufacturers of lighting products. These
suppliers import both ready-to-use CFLs and raw material such as cut glass tubes, tri-band phosphor and electronic components
in the ballast. Most of these companies have their own production facilities where about 90 per cent of the manufacturing process
is carried out. The second category is a mix of well-known brands and tier 2 players who import parts of CFL and assemble locally.
While the first and the second category are ISI certified, the third category represents the unorganized traders who import and sell
non-certified products.
Component and
Sub-system Suppliers
Assemblers
Downstream
Glass tube
Filament
Burner
Residential
Phosphor coating
PCB
CFL - OEM
Capacitor
Commercial
Ballast
Transformer
CFL - EMS
Government
Transistor
Industrial
Burner
Capsule
Base
122
Product
Local
Supply
Local
Manufacturing
Local IP
Capability
Company
Names
Level of Local
Value Add
Remarks
Ballast
Yes
Yes
No
Associated
Lighting, Future
electronics
High
Burner
Yes
Yes
No
Total
Imports
No
No
Many Chinese
players
NA
Base
Yes
Yes
No
Many local
players
High
PCB
Yes
Yes
No
Many local
players
High
OEM
Yes
Only ISI
Yes, High Value
certifications,
Add Assembly
No IP
Philips, Bajaj,
Surya
High
EMS
Yes
Only ISI
Yes, High Value
certifications,
Add Assembly
No IP
Many tier 2, 3
companies
High
Components Phosphor
Coating
and Sub
systems
CFL
High
China holds 90% phosphor reserves
whereas India holds 1-2% of the same
The country is largely dependent on China and other countries for the import of tri-band phosphor, an important element for
manufacturing of CFLs. Having captured almost all of worlds demand, China has now started restricting mining of rare earth
and tri-band phosphor. There has been an increase in the price of tri-band phosphor to more than US$ 420 per kg, an increase of
nearly US$ 40,,besides imposing an export duty of US$ 50 per kg. Priceshave been rising on a very frequent basis and India, being a
major importer,has been severely impacted. This has forced CFL manufacturers in India to increase prices. The CFL industry in India
contributes to high value added manufacturing though. BIS standardization, ISI certifications and anti-dumping duty have made
the industry very robust. Except for the electronic circuits, phosphor and filament imports, all of the other components are locally
developed and assembled either by OEMs or through EMS.
The SWOT chart below captures the analysis for the CFL market.
STRENGTHS
OPPORTUNITIES
Growing replacement demand from ICL to CFL still
prevalent in the rural areas
Escalating manufacturing and labour costs in China
driving manufacturers to invest in facilities in India
India as a export hub for servicing ME, North Africa and
Europe countries
Complete customized product design can be
outsourced
SWOT
WEAKNESS
THREATS
123
Component SWOT
The component ecosystem for CFL is quite simple with the components common across all wattage type lamps. The top 4
components that contribute to majority of the CFL bill of materials (BoM) are:
1. Capacitor
2.
Glass tube
3. Transformer
4. Transistor
India has design and skillset availability to design the electronic components but does not have the infrastructure to develop the
same. Although raw materials like copper are present, the country is dependent on enamel imports for manufacturing locally.
Volume and cost issuesare challenges that the country faces. The volume demand is so high that it is difficult for local manufacturers
to cater to such volumes, and hence turn to imports which also works out to be cheaper. In countries like China, Taiwan etc.,,
component manufacturing takes place on a large scale and hence orders are also fulfilled within a very short turnaround time.
Strategic Conclusions
General recommendations
It is noted that the VAT for CFL manufacturing varies from state to state. Although some of the states have brought down the VAT
to zero per cent, other states as wellneed to bring it down to zero per cent to bring about a uniform reduced lamp cost.
IP development
Although there is no IP development, presence of ISI certifications ensures standardised manufacturing of CFLs in the country.
The greatest challenge faced by manufacturers in India is the severe documentation process involved in the ISI certification for the
bulbs. Such processes can be made available through the internet to ensure easy access and adoption.
Component ecosystem
In order to address the challenges of using tri-band phosphor, immediate actions need to be taken by the government both at
the central and state levels. By approaching bodies like WTO or Energy conservation bodies, the issue can be taken up with China
in protecting the interest of CFL manufacturers. The current 2 to 3 percent reserves of tri-band phosphor that India has should be
tapped and explored for local manufacturing.
Product manufacturing
The most urgent need is to bring about a regulation that will ensure safe disposal and recycling of CFLs. Recycling facilities should
be set up by manufacturers and the entire recycling mechanism should be funded through taxes levied on the manufacturer. The
government could incentivize the setting up of recycling facilities through a capital subsidy for the manufacturers for an initial
period of 3 years. It would be ideal for state governments to come forward in offering land at subsidized rates for setting up of the
same.
The current CFLs are designed for a life of 5000 hours. A regulation on increasing the life of CFLs to about 15000 hours will help
CFLs last for about 3 to 4 years,and also cut down the issue of mercury recycling issue.. This could be enabled by electronic circuit
improvements.
Current Limitation
124
Tax
Structure
Value
Addition
Component
Ecosystem
Policy
Initiatives
Top 4 Components
Component Ecosystem
0.35
0.30
0.28 0.28
0.29 0.29
0.30 0.30
0.31 0.31
0.33 0.33
0.25
TDM (Low/Med
value add) : NA
0.20
0.15
HVA-TDM : TM
0.10
0.05
2011
100%
2013
100%
2015
100%
0
2010
2011
2012
2013
2014
2015
125
TM Volumes
(Million units)
2010
22.41
22.41
0.7
2011
23.75
23.75
0.72
2012
25.41
25.41
0.75
2013
27.19
27.19
0.78
2014
29.87
29.87
0.82
2015
32.85
32.85
0.87
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
The energy meters value chain comprises various component and subsystem suppliers, assemblers and the downstream consumers.
The outstanding fact is that almost the entire local demand is met through local manufacturing with some companies doing a
considerable level of exports to countries like UK and Australia. The Indian market is flooded with a number of players who are into
product manufacturing with one foreign player being one of the top 5 players and the remaining being local manufacturers. All
the top competitors do high local value addition with only the electronics parts being imported.
The energy meters value chain is depicted in the figure below.
Component and
Sub-system Suppliers
Assemblers
Downstream
Transformer
Power supply
Copper wires
Memory
Microprocessor
System on chip
Utilities
Government
LCD driver
Microcontroller
Super capacitor
Sheet metal
Housing /
Packaging
Plastic
126
Company Names
No
No
Texas Instruments,
STM, Freescale
NA
Only Sales
Offices; Total
Imports
No
No
Texas Instruments,
STM, Freescale
NA
Bare boards
Locally
developed
Yes
Yes
High
Passive
components
Locally done
Yes
Yes
High
OEM
Yes
Yes
Securemeters,
Landis+gyr, L&T
High
EMS
Yes
Yes
Flextronics,
Foxconn, Jabil
High
Category
Components
and Sub
systems
Product
Local Supply
System on
chip
Only Sales
Offices; Total
Imports
Active
components
Energy Meters
Local
Manufacturing
Level of Local
Value Add
Remarks
Though design capability
exists there is no local
realization of IP, No
semiconductor fabs
Though design capability
exists there is no local
realization of IP, No
semiconductor fabs
In the Energy meters value chain, the main challenge is that the country is highly dependent on advanced electronics imports for
which we do not have a capability in the country. Although chip design for energy meters is carried out by some of the leading
semiconductor players in India, the country doesnt have the manufacturing capability of the same. India, with an expertise in this
segment for two decades, is one of the very few countries that have developed anti-tamper metering devices. With the design
capability of the engineers and a robust technology, Indian meters are looked upon as best in class devices in the global industry.
The presence of numerous companies that take reference designs from semiconductor suppliers and build products on them
without any R&D efforts are a threat to the core suppliers. With no IP capability, they become a huge hindrance in the tendering
system where companies with real IP and design capability are forfeited due to the low cost meters offered by these companies.
The SWOT chart below captures the analysis for the energy meter market.
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
127
Component SWOT
The component ecosystem for energy meters is quite simple with a certain set of components that are present across all types of
Energy meters. The top 4 components that contribute to majority of the Energy meters bill of materials (BoM) irrespective of the
type or price are:
1.
System on chip
2.
Current transformer
3.
4.
Super capacitor
It is to be noted that all the top 4 components constitute about 60 per cent of the product value. Semiconductor companies like
Texas Instruments and Freescale do chip design at their design houses in Bangalore and Noida. Copper for transformers is available,
but we are dependent on countries like Germany for the capsule, giving rise to a volume and cost issues and making it easier to
import the same. An important factor to be noted is the turnaround time. Although there are a few good quality local suppliers of
capacitors and resistors, manufacturers predominantly import to benefit from the faster turn-around time when dealing with high
volume suppliers from overseas.
Strategic Conclusions
General
In terms of tendering process, tenders must be evaluated both on technical and financial aspects in order to produce standardized,
robust meters. In due course, such processes can be made internet friendly to cut down high documentation processes which is
highly challenging to the manufacturers. A regional level single-point testing laboratory can conduct all tests, which can save time
and deliver authenticity. Also, the imported meters can be tested to check if they meet Indian standards thereby enhancing safety
and environmental protection.
Development of standards for communication and band allocation is one of the top priorities in this market. Involvement of
regulatory bodies and WPC for band allocation and creating standards (like the ones adopted in Europe, Korea, Japan) will help
strengthen the product ecosystem at a large scale.
Component Ecosystem
With the evolution of smart meters, itis the most opportune time for Government to bring about standards for manufacturing of
smart meters, create a R&D fund for innovations in smart meters and also create opportunities for manufacturing of components
like communication module, transceiver etc., which are key to the smart meters.
IP development
The Indian energy meters market is competitive enough with design strengths at a product and component level especially in
the electromechanical parts. With an expected shift towards smart meters, preparing for the future by investing in R&,especially in
development of relays by leveraging R&D tax credits, will lead to the establishment of the entire product ecosystem.
Product development
Given our strengths in high value add energy meter manufacturing, product modifications suiting international requirement can
be effected to drive exports in huge volumes. Incentivizing export duty can boost exports as Indian meters are one of the most cost
competitive having anti-tampering features incorporated.
Current Limitation
a. Reliance on imports
Component
Ecosystem
b. Demand Volumes
c. Price factor
Policy
Initiatives
128
Local Manufacturing/Assembly
Volumes and Growth
Top 4 Components
Component Ecosystem
High
129
0.18
0.16
0.15 0.15
0.19 0.19
0.16 0.16
0.14
0.12
0.12 0.12
0.12 0.12
0.10
0.08
HVA-TDM : TM
0.06
0.04
0.02
2011
100%
2013
100%
2015
100%
0
2010
2011
2012
2013
2014
2015
0.13
0.12
0.12
0.10
0.14
0.14
0.11
0.11
0.10 0.10
0.10
0.09
0.08
0.08
0.10
TDM (Low/Med
value add) : 0
TDM (High value
add): 9.3%
0.07
0.06
HVA-TDM : TM
0.04
2011
100%
0.02
2013
100%
2015
100%
0
2010
2011
2012
2013
2014
2015
130
TM Volumes
(Million units)
2010
6.33
6.33
0.00
2011
6.54
6.54
0.00
2012
8.60
8.60
0.00
2013
9.70
9.70
0.00
2014
11.20
11.20
0.00
2015
12.60
12.60
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
TM Volumes
(Million units)
2010
3.04
2.89
0.00
2011
3.30
2.34
0.00
2012
3.66
2.64
0.00
2013
4.14
3.04
0.00
2014
4.76
3.50
0.00
2015
5.47
4.02
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
131
Industry SWOT
Leading manufacturers of ICs in India are Pricol, Visteon, Minda, Continental and Stoneridge. While both analog and digital IC
for 2W are entirely manufactured in India, about 35 per cent of 4W digital ICs that are mostly used in high-end carsare imported.
Pricol & Visteon are the dominant players in the instrument clusters market in India. Pricol, with seven manufacturing plants across
the country, also has its own design and testing facilities. Denso has recently acquired a 51 per cent stake in Pricol Components
to manufacture ICs in India at Pricols two plants, in Coimbatore and Manesar. Visteon also has three design centres and four
manufacturing facilities in the country.
The digital ICs value chain is depicted in the figure below.
Component and
Sub-system Suppliers
System Integrators
Downstream
Digital ICs
OEMs
MCU
Stepper Motor
PCB
LCD
The table below captures the capability in India across the digital instrument clusters value chain.
Category
Components
and Sub
systems
Digital ICs
132
Product
Local
Supply
Local
Manufacturing
Local IP
Capability
Company
Names
Level of Local
Value Add
Stepper
Motor
Import
No
No
Sonce Boz,
VID, Switec
NA
NA
MCU
Import
No
No
Fujitsu,
Freescale,
Renesas
LCD
Import
No
No
Chinese
companies
NA
PCB
Local
supply
Yes
Yes
Many small
companies
High
OEM
Yes
Yes- High
Value Add
Assembly
Yes
INEL,
Varroc
High
EMS
No
NA
NA
NA
NA
Remarks
None
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
Component SWOT
The top 4 components that contribute to majority of the digital ICs bill of materials (BoM) are:
Stepper motor
PCB
Microcontroller
LCD display
Except for PCBsthere are indigenous players that manufacture PCBsthe other components are imported since there are no
indigenous capabilities present in the Indian electronics ecosystem for the manufacturing of these components. Microcontrollers
are sourced from companies such as Freescale and Fujitsu while LCD displays are easily sourced from a lot of Chinese companies
that manufacture small LCD displays. Stepper motors are sourced from overseas from companies such as VID and Sonceboz.
133
Strategic Conclusions
General:
This is a mature product market which only relies on less than 30% import of digital ICs for high end cars, and has seen exceptional
growth all through these years. With constant innovation, technology change and aesthetics, the market holds great scope for
exports and as global automotive hub. The industry can gain if provided with export-friendly policies and support structure from
the Government.
IP development:
The enormous availability of design and software skills in the country can be leveraged as the IP for instrument clusters is not held
locally in India; global OEMs possess design, testing and manufacturing facilities in the country though. Government can promote
the development of IP locally by setting up an R&D corpus and promoting tax exemption in R&D activities for these companies.
Component ecosystem:
The country is entirely reliant on import of the most critical parts used in manufacturing of digital ICs. The Indian electronics
ecosystem already possesses a fair amount of competency with regard to the manufacturing of PCBs and smaller sized LCD
displays. The manufacturing of these components could be further incentivized through preferential excise duties or offering
greater rates of CENVAT credit.
However, the other important components such as microcontrollers and stepper motors are imported. With the setting up of
semiconductor fabs and the existing semiconductor design competencies in India, the manufacturing of microcontrollers could
present a justifiable business case for willing investors.
Product manufacturing:
The MSIPS and EMC policies could be taken advantage of to set up an automotive electronics manufacturing cluster near the
Bangalore-Chennai area; Bangalore possesses the desired design expertise while a lot of automotive manufacturing happens in
and around the Chennai region.
Current Limitation
Market/ Value
chain
134
Nil
Top 4 Components
Component Ecosystem
135
0.57
0.52
TM: 25.4%
0.5
0.44
TDM (Low/Med
value add) : NA
0.4
0.1
0.31
0.3
0.2
0.27
0.23
0.21
0.2
0.13
0.1
HVA-TDM : TM
0.16
0.4
0
0
2010
2011
2012
0
2013
2011
62%
2013
70%
2015
100%
2014
2015
TM Volumes
(Million units)
2010
550
300
0.00
2011
600
375
0.00
2012
670
450
0.00
2013
620
540
0.00
2014
680
621
0.00
2015
650
714
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
136
Industry SWOT
The smart cards value chain comprises various material and component suppliers, system integrators, and the downstream
segments like government, IT, transportation, banking etc. The Indian market is currently dominated by around 5 to 6 players who
hold the majority of the market share for smart cards. All the top players in this product market have their own manufacturing
facilities locally where assembly activity is carried out. The electronics components are imported while the on-card and off-card
technologies are done locally. The software and integration part is carried out in-house and the plastic sheets are partially imported
and partially sourced locally.
The smart cards value chain is depicted in the figure below.
Component and
Sub-system Suppliers
Assemblers
Downstream
PETG
Plastic body
PVC
Government
Memory
Microprocessor
IT / ITes
Banking
Chipset
Connector
Substrates
Telecom
OS
Softwares
RoM Softwares
137
The table below captures the capability in India across the Smart cards value chain.
Category
Components
and Sub
systems
Product
Local Supply
Local
Manufacturing
Local IP
Capability
Company Names
Level of
Local Value
Add
NA
Chipset
Imports
No
No
NXP,
STMicroelectronics,
Infineon,
Renaissance, Atmel
Antenna
substrates
Imports
No
No
NA
Software
Local
Yes
Yes
In-house
High
Plastic
body
Partial
Imports,
Partial Local
supply
Yes
No
OEM
Yes
Yes
No
EMS
No
No
No
Smart cards
Madras Security
Printers, Manipal
Press, Syscom,
Bayer, United Tech
Star
Syscom, VCT,
Oberthur, MSS,
Gemalto, Oberthur,
G&D
No
High
Remarks
High
NA
The challenges that the industry is currently facing is demand. Most of the announced new projects will take a few years to be
operational and therefore capacity building will gradually rise when volumes go high. With respect to product design, the country
lacks intellectual property in this field and most of it is owned by French and US companies on a technology front. The foreign
companies dominate the patent environment with respect to chip and antenna substrates design. In spite of these challenges,
smart cards still continue to be a high value add product which are also exported by the top players.
The SWOT chart below captures the analysis for the smart cards market.
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
138
Component SWOT
The component ecosystem for Smart cards is quite simple across all types. The top 4 components that contribute to majority of
the smart cards bill of materials (BoM) are:
1. IC
2. PETG/Polycarbonate body
3. Software OS
4. Antenna (wire or printed)
It is noted that India possesses design capabilities for the chip at the local design centres of MNCs such as NXP, Infineon and
STM. However, lack of chip fabrication facilities results in negligible value addition contribution from design. Plastic is the second
most expensive component in a smart card which is partially sourced locally and majorly imported from China, HongKong etc.
Although there are numerous players in India who provide equally competitive PETG at competitive prices, many players still prefer
to import owing to volume issues. Printing and personalization is thoroughly local. We do have personalization capabilities but lack
of demand prohibits from exploring the same.
Strategic Conclusions
General
Smart cards are a high growth market possessing a huge export potential. Leveraging export subsidies and considering product
manufacturing under the EPCG scheme will benefit manufacturers in importing machinery at subsidized prices and exporting
huge volumes. Large presence of unbranded products in the grey market calls for a consideration of CVD tax on finished goods
imports to prevent dumping of the same.
Component ecosystem
Plastic (PETG),one of the major raw materials in smart cards,is available in plenty locally. In spite of this, many manufacturers still
prefer to import from the neighbouring countries. The PETG available locally is price and quality competitive. The government
should encourage sourcing of such components locally by bringing smart cards under Preferential Market Access (PMA).
Product development
The ecosystem for smart cards is currently at a modest level with large amounts of local sourcing and manufacturing by a number
of global OEMS and indigenous players. Chip, which is the most important component of a smart card, is majorly imported and
all other components are available locally. Smart cards adoption is increasingly growing with its massive adoption in social and
commercial applications in telecom, transport, driving license (DL) & registration certificate (RC), access control and Government
projects. To cater to such demands at a quicker rate, investments in local chip fabrication facilities would be required. At least
4 dedicated chip fabrication units for smart cards manufacturing will ensure constant high local value addition and volume
shipment. Such a situation in the long term will facilitate export activities as well. The coupled strength of software, design and
chip fabrication gives rise to an uninterrupted ecosystem with export opportunities to the neighbouring countries.
139
Current Limitation
Value Addition
Component
Ecosystem
140
Top 4 Components
Component Ecosystem
244.3
207.9
200
150
100
HVA-TDM : TM
54.7
50
6.3 0
1.3
0
9.3
3.0
2010
2011
23.0
0
5.5
0
4.6
2012
2013
0
26.0
2014
48.9
2011
0%
2013
0%
2015
0%
2015
141
TM Volumes
(Million units)
2010
0.10
0.02
0.00
2011
0.16
0.05
0.00
2012
0.40
0.08
0.00
2013
1.00
0.10
0.00
2014
4.00
0.50
0.00
2015
5.00
1.00
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
Touted as one of the technologies that can boost broadband penetration in the country, the GPON value chain is quite elaborate,
consisting of the R&D, design and technology licensors, the manufacturers, the sub-part suppliers and the consumers. The major
suppliers of GPON hardware in the country are Alphion, Huawei, NSN and Alcatel Lucent, along with CDOT and ITI, BEL, VMC
Systems, Sai Infosystems, SM Creative, UTL and Tejas Networks.
The GPON value chain is depicted in the figure below.
Component and
Sub-system Suppliers
System Integrators
Downstream
Memories
Semiconductors
System on Chip
Optical Module
GPON ONT
Customers
Power Supplies
Mechanical Items
142
Local Supply
Local
Manufacturing
Local IP
Capability
Company
Names
Level of Local
Value Add
Optical Module
Imports
No
No
Delta, Ligent,
Source
Photonics
NA
No
Broadcom,
PMC Sierra,
Marvel, Lantiq
NA
High
NA
Category
System on Chip
(SoC)
Components
and Sub
Power supplies
systems
Imports
No
Yes
Yes
Yes
VMC, Acme
Tele, GE Power
Memories
Imports
No
No
Micron, Hynix,
Samsung
Mechanical
items cables,
etc.
Yes
Yes
Yes
OEM
Imports as
well as local
supply
EMS
No
GPON
Yes
Remarks
Low
Alphion,
Huawei, NSN,
Alcatel Lucent,
Teracom,
Utstarcom
Yes
Low
The SWOT chart here captures the analysis for the GPON ONT market.
STRENGTHS
OPPORTUNITIES
WEAKNESS
SWOT THREATS
143
Component SWOT
GPON consists of both hardware and software. With regard to hardware, there are a large number of PCB manufacturers in India
who supply boards pre-loaded with ICs, resistors, capacitors, optical modules, etc. With over 60 per cent of BoM entirely imported,
domestic manufacturing of the products does not make for a viable business proposition as the volume demand is heavily skewed.
On the other hand, large volume orders that are fulfilled by the Chinese and Taiwanese companies allow them to price their
product at a much lesser value due to economies of scale. Sourcing of power supplies is however done in India from companies
such as VMC, Acme Tele, GE Power, etc.
The top 4 components that contribute to majority of the GPON ONT bill of materials (BoM) are:
1. Optical module
2. System on Chip
3. Power supplies
4. Memory
Strategic Conclusions
General:
The GPON technology and its advantages over other competing technologies have overseen its domestic development in the
country. Although the domestically manufactured price points are still higher than imported units, supportive policies like reduced
excise duties for the domestic manufacturers will promote the local industry.
IP development:
India has advanced itself with the design, development and manufacturing of GPON hardware as well as software technology.
With the help of CDOT, the Government undertaking, India has filed 5 Patents and the licenses to use the indigenous technology
to develop the product has been already granted to seven of the domestic telecom equipment manufacturing companies.
Component ecosystem:
Of the top 4 components, the electronic and semiconductor components are entirely imported while the power supplies are sourced
from India. Considering that telecom sector serves critical functionalities, it is desirable that the Indian electronics ecosystem
develop manufacturing competencies in this area to become self-sufficient to an extent. This could possibly be achieved through
the setting up of the two semiconductor fabs, possibly devoting capacity towards the manufacturing of electronics components
needed for GPON ONT.
Product manufacturing:
The MSIPS and EMC policies could be taken advantage of to set up a telecom electronics manufacturing cluster near the BangaloreChennai area or in Delhi-NCR region.
Current Limitation
Market / Value
chain
144
Top 4 Components
Component Ecosystem
145
688
CAGR (2011 - 2015)
TM: 33.0%
600
500
400
289
220
200
100
21
190
140
469
353
265
200
2010
2011
2012
TDM (Low/Med
value add) : 35.3%
TDM (High value
add): NA
300
453
2013
2014
HVA-TDM : TM
2011
0%
2013
0%
2015
0%
2015
TM Volumes
(Million units)
2010
0.10
0.00
0.00
2011
1.10
0.70
0.00
2012
1.00
1.05
0.00
2013
1.60
1.47
0.00
2014
2.64
2.06
0.00
2015
4.22
2.88
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
146
Industry SWOT
The tablet market has huge potential for both domestic consumption and export opportunities. Parallels can be drawn with the
mobile phones market; Nokia saw the great potential in the Indian market and set up local manufacturing value addition in Tamil
Nadualbeit, mostly box assembly and packagingwhich helped the local economy tangibly. They also manufactured Made for
India mobile phones by closely studying the dynamics of the local market and these products also gained widespread acceptance
in certain export markets. Likewise, the table market could also present huge potential in this regard. Given that tablets have
a disruptive form factor and are poised to be a mainstay in the electronics product industry and the daily lifestyle of people,
the government should definitely incentivize local value addition in the manufacturing of tablets. The tablet as an educational
tool could have phenomenal spinoff applications and create disruptive innovation in the delivery of education as we know it.
However, the manufacturing of tabletslike the manufacturing of laptop and desktopshas already been commoditized by
East Asian nations. Instead of trying to compete with such entrenched capabilities, there could be a case for investing in futuristic
manufacturing techniques like flexible electronics, and the like. Since the country already possesses considerable design skills,
Indian electronics design could lead the world in that particular field if the lead were taken on such innovative and futuristic
techniques.
The tablets value chain is depicted in the figure below.
Component and
Sub-system Suppliers
Touchscreen
display
Assemblers
Downstream
Input / Output
USB / Ethernet
ports
Enterprises
Motherboard;
Memory; Processor
Battery
Processing module
Tablets
Consumers
147
The table below captures the capability in India across the tablets value chain.
Category
Local IP
Capability
Company Names
No
Imports
Imports
Product
Local Supply
Display
Memory
Battery
Local
Manufacturing
Level of Local
Value Add
Remarks
No
Samsung, Sharp,
AOU
NA
No
No
Toshiba, Samsung,
Micron, Hynix
NA
No
No
Samsung, LG,
NA
Though design
capability exists there is
no local realization of IP
NA
Though design
capability exists there is
no local realization of IP
NA
Processor
No
No
all-Winner,
Freescale,
Qualcomm,
Rockchip,
Marvel, Nvidia;
Samsung and
Apple proprietary
processor
OS
No
NA
No
Apple, Google,
Microsoft,
Blackberry
Apps
Yes
NA
Yes
OEM
No
No
No
EMS
Yes
No
Components
and Sub
systems
Tablets
High
Nokia, Samsung
NA
Low
Recently, companies have begun coming out with tablet-hybrids: phablets, offering functionality and appearance of a phone and
a tablet like the Samsung Galaxy Note, and tablet-laptop hybrids like Microsofts Surface Pro. These devices have found takers
among the demographic segment that prefers convergence in functionality to owning multiple devices. The tablet-laptop hybrids
are yet to receive mass appeal. The relative lack of manufacturing and assembly activities, if not addressed, could add greatly to
the countrys import due to the exponential growth forecast for the market. It is highly imperative that tablet manufacturing and
assembly be addressed by government policies, especially the aspect of the National Policy on Electronics that envisages the
setting up of Electronics Manufacturing Clusters. With regard to tablets, there is huge potential for an EMC to be set.
148
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
Component SWOT
The biggest contribution to the BoM in terms of dollar value in a tablet is accounted for by the display which could cost up to US$
80 approximately. Next come the processor, memory modules and the battery, that could cost anywhere between US$ 15 to 20. In
short, the top 4 components that contribute to majority of the tablet bill of materials (BoM) are:
1. Display
2. Memory
3. Battery
4. Processor
Since tablets are imported in finished product form for the most part, none of these components are locally sourced. As is the
case for laptops and desktops, the Indian electronics ecosystem possesses very nascent capabilities in manufacturing, such as
PCB assembly and box assembly and packaging. However, with the advent of the semiconductor fab units and government
policies such as M-SIPS and the intention to set up EMCs, the country could potentially witness the development of a wholesome
manufacturing ecosystem for tablets.
149
Strategic Conclusions
General
The reimbursement process for claiming tax credit should be made easier and faster so that companies do not have to contend
with uncertainties of receiving reimbursement.The reimbursement process should be moved to an online portal, there should be
no restrictions on the number of times reimbursement can be claimed in a particular period of time, and reimbursements should
be directly transferred to merchants bank accounts.
IP development
There is a lot of on-going independent design activity on tablets across various private independent design houses as well as
public sector enterprises. The lack of visibility into these various activities and the absence of financial support, in some instances
results in the design efforts not culminating into a commercial product. There is a pertinent need to setup a centre of excellence
for mobile and tablets within one of the proposed EMCs to consolidate all of these design efforts and create a platform for taking
these designs from lab to fab. Leveraging the strengths of the local EMS industry, these indigenous designs can see the day of light
as Made in India tablets that could have wide appeal in the export market too.
Component ecosystem
The manufacturing of motherboards and LCD displays for tablets should be incentivized by exempting individual components
from basic customs duty and excise duty or offering preferential excise duty. Sheet metal fabrication and plastic moulding are fairly
mature technologies in India; hence, the manufacturing of tablet enclosures could also be incentivized too. It is also important to
note that the pace of technological change in the IT industry is rapid, and hence there is a need to ensure that investment in a
particular technology is sustainable in the medium to long term. For e.g., shift to SSDs, flexible electronics, etc.
Product manufacturing
The tablet industry in India has certain competencies in assembly that could be leveraged to make it a favourable destination
for value-added assembly of tablet computers for both domestic and export markets. Since this is a fairly new product market,
developing design competencies will gradually lead to organic development of the product ecosystem, especially since nascent
manufacturing capabilities are present along with a holistic policy basket for the electronics ecosystem. Organic development of
the product ecosystem will be inevitable once design activities and component manufacturing gain traction, since the demand
for tablets is projected to grow steeply in the next few years and hence the business case for making indigenous investment will
be fairly straightforward.
Current Limitation
Tax Structure
Value Addition
Ecosystem
150
Local Manufacturing/Assembly
Volumes and Growth
Top 4 Components
Component Ecosystem
c. Attract leading manufacturers to invest in India and have a co-benefit of reduced cost
d. Appropriate fiscal incentives (tax, duty, tariff ) to manufacture in India
e. Set up testing facilities and labs at a national level
151
0.45
0.40
TM: 38.4%
0.35
0.32
TDM (Low/Med
value add) : NA
0.30
0.25
0.23
0.20
0.15
0.10
0.05
0.20
0.17
0.14
0.12
HVA-TDM : TM
0.09
0.09
0.04
0.03
0.06
2011
33%
2013
39%
2015
45%
0
2010
2011
2012
2013
2014
2015
TM Volumes
(Million units)
2010
7.03
2.11
0.00
2011
10.20
3.06
0.00
2012
14.79
5.20
0.00
2013
21.45
8.48
0.00
2014
31.10
13.57
0.00
2015
45.09
20.35
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
152
Industry SWOT
LED Lighting value chain comprises various material suppliers, component and subsystem suppliers, assemblers and the
downstream retailers, distributors and consumers. The industry in India is highly fragmented, with a large number of small players,
and is also capital intense, with a high level of entry and exit barriers especially to setup infrastructure. Most of the components
required for manufacturing LEDs are imported. In order to get white light from LEDs, yellow phosphor has to be used as a coating,
which is an expensive rare earth metal currently imported from China. Rare earth export restrictions applied by China have had
companies exploring other rare earth sources such as Indiaand also attempt recycling. The number of patents filed in the LED
lighting space has increased steadily year-on-year, from approximately 600 in 2000 to over 2,500 in 2010.
The LED Lighting value chain is depicted in the figure below.
Component and
Sub-system Suppliers
Assemblers
Heat Sink
Thermal Interface
Material
Driver
Downstream
Residential
Housing
Testing
Certification
Licensors
Commercial
LED
PCB
Government
Lens
Optics
Diffusers
Industrial
153
The Indian LED lighting market is a complex network of more than 350 players including assemblers, traders, distributors, resellers
and importers along with an equally big unorganized sector which has a share of around 55 per cent of the entire LED lighting
market. As LED is a highly expensive technology, in the absence of an ecosystem in the country, not many lighting suppliers in India
have been able to manufacture LED light source in India. Heat sink and drivers are manufactured in India whereas the light source
with lens, reflector and chip is entirely imported.
The table below captures the capability in India across the LED lighting value chain.
Category
Components
and Sub
systems
Level of
Company Names Local Value
Add
Product
Local Supply
Local
Manufacturing
Local IP
Capability
LED
No
No
Philips Lumileds,
Cree, Nichia,
Osram, Epistar
NA
No semiconductor fabs,
No IP realization
Heat Sink
Yes
No
OEMs, Lot of
Chinese players
High
Design registrations is
encouraged, but no IP
realization
Driver
Yes
No
High
Design registrations is
encouraged, but no IP
realization
Optics (lens,
reflectors,
diffusers)
Imported
Yes
No
Yes
No
Remarks
NA
OEMs. Lot of
EMS players,
unorganized
players
High
PCB
Locally done
OEM
Yes
Philips, Havells,
Osram, Wipro
High
EMS
Yes
Instapower,
Promptec, VIN
High
LED Lighting
Design registrations is
encouraged, but no IP
realization
The semiconductors, reflectors and lens are entirely imported as their manufactureinvolves high level of technology and expertise.
The critical challenge is that there are no semiconductor fabs to manufacture the semiconductor material or develop the ICs. The
bigger players either import the individual components or assemble locally in-house or through a contract manufacturer. There are
some traders and small players in the unorganized market who import the entire LED light as a finished product.
154
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
Component SWOT
The component ecosystem for LED Lighting is extremely diverse in line with the wide range of prices of LED Lights. While
components such as driver, heat sink, LED, reflectors, lens, etc., are common for all types of lights, the cost and capacity of these
components vary depending on the wattage and efficiency of the light. The top 4 components that contribute to majority of the
LED Light bill of materials (BoM) irrespective of the type or price are:
1. LED
2. Driver circuit
3. Heat sink
4. Thermal interface material
The light source/ LED are entirely imported and India currently does not have LED fabrication facilities. This is due to lack of
infrastructure and incentives and high investment costs. Driver circuits and heat sink are very well manufactured locally by a lot
of players. Lack of IP protection and skill training prohibits the market from carrying out indigenous activities. Aluminium, an
important raw material for heat sink, is very expensive. In order to promote local manufacturing, the government should offer
incentives on raw materials purchase for domestic manufacturing.
155
Strategic Recommendations
General
Restrictive tax structure with a high VAT of 14.5 per cent obstructs LED lighting penetration. Reduction and a uniform VAT structure
across all states will increase penetration. Exemption for capital goods for LED light manufacture will encourage manufacturers to
enhance the manufacturing ecosystem
IP development
With approval from the Ministry, 3 more testing facilities are to be established in three regions in the country. Setting up of
design houses, both for product and components, will create a labour pool and also enhance design capabilities locally. Product
awareness across the value chain is an immediate necessity to promote adoption and penetration and thus bypass the volume
issue for manufacturing.
Component ecosystem
Considering the market size of Led lighting in India, local design activity of driver circuits, heat sink and LED can be incentivized
by granting R&D credit. Photometry is a crucial part in product development and can be encouraged through academia-industrial
collaborations. With a large presence of local PCB development, thr driver circuit board itself has the potential to be indigenized.
Grant of tax credit for local sourcing will further strengthen high value addition in the value chain.
With the growing shift from CFL to LED, especially in the B2B segment, there is going to be a tremendous demand for this market.
LED chips being the most expensive component in the product, there arises a need for setting up LED wafer fabs in the country.
LED wafer fabs, along with the testing facilities, will not only prevent the import of sub-standard light fittings but also increase the
local value addition.
Product development
DeitYmust mandate technical specifications in order to manufacture standardized lamps. The imported LED lamps (finished
goods) also must be tested to prevent dumping. The Government could extend support to mandate new or secondary roads
to be replaced with LED fittings. All Government projects can include self-ballasted LED lamps. The Ministry of Power (MoP)can
provide at least one LED lamp under the electricity to all villages scheme. These initiatives will bypass the volume issue and lead
to constant high value add manufacturing which can be considered for exports in the long term.
Current Limitation
Tax Structure
Value Addition
Component
Ecosystem
Policy Initiatives
156
Local Manufacturing/Assembly
Volumes and Growth
Low Mostly finished good imports, local manufacturers source some materials
locally while most components are imported
Top 4 Components
Component Ecosystem
157
0.22
0.20
TM: 18.9%
TDM (overall): 17.4%
0.18
TDM (Low/Med
value add) : 17.4%
0.16
0.15
0.10
0.14
0.10
011
HVA-TDM : TM
0.05
0
0.005
2010
0
0.0058
2011
0
0.007
2012
0
0.008
2013
0
0.011
0
0.009
2014
2011
0%
2013
0%
2015
0%
2015
TM Volumes
(Million units)
2010
0.50
0.025
0.00
2011
0.58
0.029
0.00
2012
0.70
0.035
0.00
2013
0.80
0.04
0.00
2014
0.90
0.045
0.00
2015
1.10
0.055
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
158
Industry SWOT
The Payment terminal value chain comprises various component and subsystem suppliers, assemblers and the downstream
retailers and consumers. While local manufacturing is restricted to just assembly activities, the country is highly reliant on imports
for all the electronics components in the product. The cost of investment involved in component manufacturing and also the EMV
certification act as huge barriers for local manufacturers to explore local value addition.
The Payment Terminals value chain is depicted in the figure below.
Component and
Sub-system Suppliers
Downstream
Assemblers
Processor
Processor Module
ROM
Dial Up
Communication
Module
GPS
Retailers
Payment
Terminals - OEM
Banking/Financial
Licensors
Battery Circuits
Displays
Interfaces
Utilities
Payment
Terminals - EMS
Certification
Licensors
Government
Printers
Operating System
Software
Applications
159
In this product market, prominent players like Ingenico and Verifone together account for 95 per cent of market share. The
remaining is accounted for by very small local manufacturers like Visiontek, Analogix who offer customization services to serve
applications like utilities reading, transport, bill generation etc., which do not require an EMV certification. This is because the cost
of certification is huge and is unaffordable for smaller manufacturers. The indigenous manufacturers import all of the electronics
components required and execute assembly activities while packaging and integration, and casing manufacturing is done locally.
There are design houses present in Bangalore which develop product design and also have IP capability. The very minimal local
sourcing in this product market results in a very minimal local value addition. With regard to components, the electronic modules,
processors, communication modules, interfaces, battery circuits, displays and printers are imported. Local capability exists for the
casing, packaging and integration. The table below captures the capability in India across the Payment Terminals value chain.
Product
Local Supply
Local
Manufacturing
Local IP
Capability
CPU Module
Only Sales
Offices; Total
Imports
No
Components Communication
and Sub
Module and
systems
Interfaces
Only Sales
Offices; Total
Imports
Battery Circuits
Category
Level of Local
Value Add
Remarks
No
NA
No
No
NA
Only Sales
Offices; Total
Imports
No
No
NA
Displays and
Printers
Only Sales
Offices; Total
Imports
No
No
NA
Integration
and Casing
(Packaging)
Developed
locally
Yes
No
High
Yes
Yes, at
product
design
level
Ingenico,
Verifone,
G&D, HCL,
Visiontek,
Analogix
Low
Yes
Yes, at
product
design
level
Flextronics,
SGS, Kanes
Low
OEM
Payment
Terminals
EMS
Company
Names
The proportion of the retail market that employs POS systems is still less than 15 per cent. The use of plastic money is still nascent
and the conversion rate is very high;this acts as a huge opportunity for POS installations. The first step to encourage the use of
plastic money is to create awareness amongst the citizens to have banking facilities and hence own a transaction card. Also, it is
noted that there is lack of standards which necessitates manufacturers to make customized terminals for clients. Lack of client
demand leads to a volume issue, hence manufacturers are unable to manufacture in mass thus leading to many cheaper product
imports.
160
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
Component SWOT
The component ecosystem for payment terminals is diverse in accordance to the application segments it caters to. The cost of
certain components varies depending on the application that it performs. Modules such as processor, communication and battery
circuits are common for all types of systems whereas the high end terminals may have smart chips, Bluetooth, GPS, etc. The top 4
components that contribute to majority of the payment terminals bill of materials (BoM) irrespective of the type or price are:
1. Communication module
2. LCD/ TFT
3. Printers
4. Processor
Analysing the payment terminals component value chain in India, it is observed that sustained and growing demand for POS
systems is a key strength for the industry. Key strengths include design capability, EMS services and also PCB development, but
the critical challenge is that there is no feeding industry present and most of the components are imported. This creates a lack
of basis or fundamentals for developing the local manufacturing for this market. Huge investment costs to set up foundry, fabs
and certifications acts as a major challenge for local manufacturers. Another major challenge is the volume; the demand is very
high and outstrips the indigenous manufacturing capacity. Hence, the market is import-heavy and incidentally importing in large
volumes from China and Taiwan also presents cheaper acquisition costs for companies.
Strategic Conclusions
General
The current customs duty for terminals is 12 per cent on 80 per cent of the product price against a 14 per cent excise duty on the
product price. This makes it economical for OEMs to import rather than produce locally especially when there is lack of incentives for
component sourcing. Reduction in sales, VAT and excise duty would attract more manufacturers to consider local manufacturing.
A notable issue is that although the Indian Governments gives a tax rebate of SAD for local manufacturers, the complexity of the
process is a major challenge. Making the whole system as an Internet Online portal (similar to Income Tax) and creating awareness
of the same would act as a boon to manufacturers. Allocation of funds by the Government for providing domain training in the
payment industry would be of great help for people in the manufacturing sector of POS and payment enabling products.
CONFIDENTIAL IESA COPYRIGHT
161
IP development
EMV certifications, which are a mandate for PoS system authorization incurs huge cost. This is a huge roadblock for local
manufacturers. This is where the need for an expansion of a national switch like NPCI comes in. The expansion will act as huge
clearing houses and will abrogate the current VISA/ Master/ Maestro certifications thereby reducing the cost for local PoS system
manufacturers. The brand name of the NPCI switch is called RuPay which currently is applicable only for ATM cards, and few debit
cards is much cheaper when compared to the EMV costs. Their expansion to all debit cards, credit cards and merchant sites will
encourage manufacturers to invest in local manufacturing and also help the entire value chain (banks, merchants and customers)
to move towards plastic money.
Any certification like EMV/ product or component import is very complex. The number of processes and signatory documents
involved is too complex thus making it difficult for manufacturers to consider this option. Simplification of the process by hosting
the certification online with upload of scanned documents will make the process simple and easy to adopt. With software
development being one of our core strengths, allocation of funds by the government to enable the Indian IT entrepreneurs to
develop the EMV Kernel targeting various emerging platforms including Android will help in strengthening the ecosystem.
The end customers requirements are very niche and are very specific to this market, thus creating a volume issue for manufacturers.
Manufacturers are unable to produce in bulk due to this customization issue. Lack of standards or policies for product design paves
way for cheaper product imports as substitutes. Devising an appropriate manufacturing standard will help in manufacturing of
quality products and will forfeit the volume issue.
Component ecosystem
India is largely dependent on imports for most of the critical electronic components which constitute about 60% of the BoM value.
Incentivising component imports by providing tax rebates for local manufacturing and encourage fabless design companies by
providing seed capital will promote higher local value addition. Setting up local design houses and leveraging R&D tax credit will
attract global OEMs to invest in local manufacturing of components.
Product development
The Micro ATMS once established will quicken the process to a plastic economy. The Indian cash economy has to be encouraged to
get converted to plastic economy. Encouragement for the usage of no frills debit cards with no surcharge and creating awareness
about usage of the same is pertinent. Tax rebate to merchants, if at least 50 per cent of transactions in value terms are through cards,
needs to be mooted. The NPCI (National Payment Corporation of India) must be brought to force thereby creating an infrastructure
for RuPay as clearing houses and ultimately enabling the use of plastic money and necessitating a PoS implementation.
The government has to initiate steps to fund and encourage the indigenous development of EMV Kernel and setup EMV and
PCI-PTS test facilities to help the indigenous product manufacturers. Setting up of labs is an urgent need to prevent dumping of
sub-standard devices. The Indian government should consider setting up of Accredited Labs for EMV Certification and PCI-PTS test
facilities which are easy and cost effective for device manufacturers.
Current Limitation
Tax Structure
Value Addition
Component
Ecosystem
Policy
Initiatives
162
a. Reliance on imports
b. High demand volumes makes it
cheaper while importing
Done in India
Local Manufacturing/Assembly
Volumes and Growth
Top 4 Components
Component Ecosystem
280.7
255.8
250
210.4 210.4
200
231.0
308.1
280.7
255.8
TDM (Low/Med
value add) : 0
231.0
190.8 190.8
150
HVA-TDM : TM
100
50
2011
100%
2013
100%
2015
100%
0
2010
2011
2012
2013
2014
2015
163
TM Volumes
(Million units)
2010
13.23
13.23
0.00
2011
15.03
15.03
0.00
2012
16.83
16.83
0.00
2013
19.02
19.02
0.00
2014
21.30
21.30
0.00
2015
23.86
23.86
0.00
Base Year: 2011 Source: IESA-Frost & Sullivan
Industry SWOT
The 2W ignition value chain is quite elaborate as this product is manufactured in the country with high value addition activities
undertaken by different stakeholders. With players like Denso, INEL (India Nippon Electricals) and Varroc present in the country
and their manufacturing facilities dedicated to serving the local demand, India is in a dominant position with regard to the CDI
manufacturing ecosystem.
The 2W ignition value chain is depicted in the figure below.
Component and
Sub-system Suppliers
System Integrators
Downstream
Microcontrollers
Power
Semiconductors
Semiconductors
Diodes, ASICs
Capacitor, Resistor
Connectors
2W Ignition
OEMS
PCB
Transformer
Plastic casing
with Potting
chemical
164
Product
Local
Supply
Local
Manufacturing
Local IP
Capability
Company Names
Level of Local
Value Add
Microcontrollers
Imports
No
No
Microchip, Renesas
NA
Power
Semiconductors
Imports
No
No
IR, Onsemi
NA
Passives
Imports
No
No
Samsung,
Panasonic,
NA
Transformer
Yes
Yes
Yes
Many small
companies
High
Yes
Yes
Yes
Many small
companies
High
Connectors
(water-proof )
Yes
Yes
Yes
Molex, Besmac,
Vinay, Motherson
High
OEM
Yes
Yes high
value added
manufacturing
Yes
High
EMS
No
No
No
NA
NA
Category
Components
and Sub
systems
CDI
Remarks
The SWOT chart below captures the analysis for the 2W ignition market.
STRENGTHS
OPPORTUNITIES
SWOT
WEAKNESS
THREATS
165
Component SWOT
Companies in the 2W Ignition space are focusing their efforts on localising the sourcing of raw materials to keep the cost of the
product low.
The top 4 components that contribute to majority of the 2W ignition bill of materials (BoM) are:
1. Microcontrollers
2. Power semiconductors
3. CDI capacitors
4. Transformers
Microcontrollers and power semiconductors are still imported from East Asia; companies like Fujitsu, Freescale and Onsemi are
prominent suppliers. Transformers and CDI capacitors are manufactured and also designed locally.
Strategic Conclusions
General:
The India 2-wheeler industry has been witnessing robust growth for an extended period of time. Since the market has matured,
the domestic manufacturers can gain a great deal by exporting CDIs. The industry can gain if provided with export-friendly policies
and support structure from the Government.
IP development:
Barring the IP capability of electronics components that are used in CDIs, the Indian OEMs hold IP rights of the other locally
sourced components such as the transformers, the connectors, the potting chemicals, etc.
Component ecosystem:
Barring the electronic components, all the other raw materials used in CDIs are sourced from India. By fostering the growth of the
Indian electronics manufacturing ecosystem, the manufacturing of 2W ignition units could be completely indigenized. Considering
the top 4 components, CDI capacitors and transformers are already being indigenously sourced with numerous small and big
players manufacturing varieties of transformers across the country. For the electronics component sourcing, the declaration of the
setting of the semiconductor fab in the country hits the right note.
Product manufacturing:
The MSIPS and EMC policies could be taken advantage of to set up an automotive electronics manufacturing cluster near the
Bangalore-Chennai area or in Delhi-NCR region.
Current Limitation
Tax Structure
None
Value Addition
None
Component
Ecosystem
Policy Initiatives
166
Appendix
Definitions
TM: Total Market: Total consumption of electronics in India, in whatever form (can be purchased locally,
imported as part of CKD or SKD, imported as a complete product), by whatever source
(Sources are directly from product company offices in India, distributor sales, direct imports
etc) and in whichever currency (US$ or Indian rupee).
TDM:
Total Domestic Market: Total domestic manufacturing including CKD assembling that caters
to domestic market consumption; does not include exports.
ESDM Industry Size: Electronics TM + Electronics TE + Electronic Component Market Revenues from Local
Manufacturing + Semiconductor Design Market Revenues + EMS Services Revenues
HVA:
High local value addition: Value addition > 50%; high level of local sourcing, high level of
indigenous design, complete system manufacturing.
MVA:
Medium local value addition: Value addition 20%-50%; EMS, CKD Assembling, sourcing of
minimal components.
LVA:
Low local value addition: Value addition <20%; SKD Assembling, no local sourcing, no local
design influence.
Acronyms
ASIC:
ASSP:
BTS:
CAGR:
CBU:
CDI:
EMS:
IC:
Integrated Circuit
IP:
Internet Protocol
LCD:
MCU: Microcontroller
MPU:
Microprocessor
STB:
TM:
Total Market
TDM:
TAM:
UPS:
167
Tax and Duty Structure for the High Priority Products and Components
168
No
Product
CUSTOMS TARIFF
No./HS Code
Basic
Duty
Mobile Phones
CVD
Edu.
Cess on
Addl.
Duty
Edu.
Cess on
Total
Duty
Spl.
Addl.
Duty
(SAD)
TOTAL
DUTY
Excise
Duty
CST
VAT
(%)
(%)
(%)
(%)
(%)
(%)
(%)
(%)
(%)
85171210/85171290
0.00%
1.00%
3.00%
3.00%
0.00%
1.07%
12.00%
4.00%
4 to 12.5%
FPD TV
85287116-19
10.00%
12.00%
3.00%
3.00%
4.00%
29.57%
12.00%
4.00%
4 to 12.5%
Notebooks
84714110
0.00%
12.00%
3.00%
3.00%
4.00%
17.42%
12.00%
4.00%
4 to 12.5%
Desktops
84713010
0.00%
12.00%
3.00%
3.00%
4.00%
17.42%
12.00%
4.00%
4 to 12.5%
Digital Camera
85258020
10.00%
12.00%
3.00%
3.00%
4.00%
29.57%
12.00%
4.00%
4 to 12.5%
Inverters and
UPS
85044010
10.00%
12.00%
3.00%
3.00%
4.00%
29.57%
12.00%
4.00%
4 to 12.5%
Memory cards
and USB drives
85421020
7.50%
16.32%
3.00%
3.00%
4.00%
31.70%
4.00%
4 to 12.5%
4W EMS
84129030
7.50%
12.00%
3.00%
3.00%
4.00%
26.53%
12.00%
4.00%
4 to 12.5%
LCD Monitors
84716030
0.00%
10.00%
3.00%
3.00%
4.00%
15.18%
4.00%
4 to 12.5%
10
Servers
84714120
0.00%
12.00%
3.00%
3.00%
4.00%
17.42%
12.00%
4.00%
4 to 12.5%
11
Base Stations
85176100
0.00%
12.00%
3.00%
3.00%
4.00%
17.41%
12.00%
4.00%
4 to 12.5%
12
Power Supplies
85044029
7.50%
12.00%
3.00%
3.00%
4.00%
26.53%
12.00%
4.00%
4 to 12.5%
13
85287100
10.00%
12.00%
3.00%
3.00%
4.00%
29.34%
12.00%
4.00%
4 to 12.5%
14
Printes and
MFDs
844332
0.00%
12.00%
3.00%
3.00%
4.00%
17.42%
12.00%
4.00%
4 to 12.5%
15
Routers/
Switches
85176290
0.00%
12.00%
3.00%
3.00%
4.00%
17.41%
12.00%
4.00%
4 to 12.5%
16
Car Radio
85255010
7.50%
16.32%
3.00%
3.00%
4.00%
31.70%
12.00%
4.00%
4 to 12.5%
17
IPPBX
85177090
0.00%
12.00%
3.00%
3.00%
4.00%
17.42%
12.00%
4.00%
4 to 12.5%
18
Energy Meters
90283010/ 90283090
10.00%
12.00%
3.00%
3.00%
4.00%
29.57%
12.00%
4.00%
4 to 12.5%
19
Digital
Instrument
Clusters
91040000
10.00%
12.00%
3.00%
3.00%
4.00%
29.57%
12.00%
4.00%
4 to 12.5%
20
Smart Cards
85235220/ 85235210
0.00%
6.00%
3.00%
3.00%
0.00%
6.43%
12.00%
4.00%
4 to 12.5%
21
2W Ignition
85111000
7.50%
12.00%
3.00%
3.00%
4.00%
26.53%
12.00%
4.00%
4 to 12.5%
22
Tablets
84713090
0.00%
12.00%
3.00%
3.00%
4.00%
17.42%
12.00%
4.00%
4 to 12.5%
23
LEDLighting
94054090
10.00%
12.00%
3.00%
3.00%
4.00%
29.57%
6.00%
4.00%
4 to 12.5%
24
GPON ONT
85177090
0.00%
12.00%
3.00%
3.00%
4.00%
17.41%
12.00%
4.00%
4 to 12.5%
25
Payment
Terminals
84713000
0.00%
12.00%
3.00%
3.00%
4.00%
17.41%
12.00%
4.00%
4 to 12.5%
26
PCB
85340000
0.00%
12.00%
3.00%
3.00%
4.00%
17.42%
12.00%
4.00%
4 to 12.5%
27
LCD Display
Panel
85312000
0.00%
12.00%
3.00%
3.00%
4.00%
17.41%
12.00%
4.00%
4 to 12.5%
28
Transformer
85041090
7.50%
12.00%
3.00%
3.00%
4.00%
26.53%
12.00%
4.00%
4 to 12.5%
29
Semiconductor
IC
85426000
7.50%
16.32%
3.00%
3.00%
4.00%
31.70%
4.00%
4 to 12.5%
Notes
169
Notes
170
171