Waste mapping in a SME electronics manufacturer

Katri Pivrinta
1
*

, J enni Yl-Mella
2
and Eva Pongrcz
2
University of Oulu, Department of Process and Environmental Engineering,
FIN-90014 UNIVERSITY OF OULU, PO Box 4300,
1
Chemical Process Engineering Laboratory
2
Mass and Heat Transfer Process Laboratory

Abstract
This article discusses the present state of waste management and waste minimization potential of
a Finnish medium sized electronics company. The target company is introduced and the present
state of waste management is mapped. Possibilities of waste minimization and resource use
optimization potential are illustrated based on the mapping observations.
Keywords: waste mapping, waste minimization, resources use optimization

1 Introduction

The aim of this practical exercise work was to conduct a waste audit in a medium sized
electronics company. The use of the tools provided by the Envirowise programme was
recommended. The Envirowise waste mapping guide (Envirowise 1999) was a useful tool when
performing the audit. The target company and its present state of waste management were
surveyed. The audits were executed during May 2004. Four personal audits were performed,
during which the factory premises were mapped and the environmental manager and floor
workers were interviewed. The observations made during personal audits were documented, and
recommendations for waste minimization were made.

2 Presentation of the target company
2.1 Company information
The target company was a medium sized Finnish company that offers management of electronic
and electromechanical products and systems. Their services include research and development,
prototype and zero-series, material sourcing, SMD (made by machines) and HMD (hand made)
assemblies and cable harness manufacturing. The companys primary customers are
telecommunications-, electronics-, automation-, and instrumentation industries. As the company
is specialized in electromechanical assembly, close co-operation with its subsidiaries has been
developed.

2.2 Description of the process
The process of electronic modules manufacturing begins at SMD assembly lines. There the
components to be placed on the circuit board are joined by lead paste as the bonding agent (in
about 80-90 % of the products), using assembling machines. Lead is the main joining material,

Corresponding author, E-mail: kluomaa@paju.oulu.fi

however, some amounts (10-20 % of the products) of zinc paste is also used as bonding agent.
Lead-free components are not readily available, thus it is not yet possible to switch to lead-free
production.

The first stage in the SMD assembly is pressing the paste through steal stencils. Components are
placed on the pressed pads of lead paste. The steal stencil is automatically cleaned by the
machine, periodically pressing the paste during the work. The steal stencils are cleaned first by
hand using isopropanol or other solvents, and next in a special washing machine.

After placing the components on the circuit board, the circuit board is checked to see if the
product corresponds to the commission. If accepted, the circuit board is sent to the reflow oven
where the lead paste is melted in high temperature and thus the components are affixed to the
circuit board. Another inspection is administered after this step. After the SMD assembly, the
modules go to HMD assembly to finish the electronic modules, where the components are
attached to the circuit board manually. A final inspection is performed after HMD assembly, and
the products are tested. Finally the assembled components are packed and transported to the
customer.

2.3 Present state of waste management
The company is already employing good recycling practices. Office paper, cardboard, ordinary
plastics, ESD (Electro Static Discharge) plastic, lead and zinc paste, wasted circuit boards,
frames of the circuit boards and other hazardous wastes are collected separately. Classified office
paper is sent for destruction.

The largest waste fractions of the factory are cardboard, ESD plastic (plastic that is used to
prevent electrostatic discharge) and ordinary plastic wastes. Because of its high price, ESD
plastic is re-used. The rest of the separately collected wastes are delivered for recycling.
Hazardous waste, such as lead paste and solvents, are treated by a certified hazardous waste
management company.

Mixed wastes from staff areas and office space are sent to the municipal landfill site. As this
waste fraction contains paper and plastics, the company has decided on separate collection of
energy waste, to be burnt with energy recover. Followed, the company is committed to employ
an environmental management system, and obtain an ISO 14000 standard. This is partly due to
stakeholder demand.

The company has a well working system of component utilization as well: excess components
left over from one custom contract are labelled and stored to be used in association with a future
custom work. Also, modules from the SMD assembly line are transported to other departments
by re-usable plastic racks, thus the product is well protected without the need of an intermediate
packaging material.

3 Waste minimization potential
3.1 Warehouse
It has been noticed that recoverable material was improperly placed in the collection receptacles.
To ensure an efficient recovery of material and resources use optimization, it is paramount that
recoverables are uncontaminated.

As in the winter time the working environment has to maintain a tolerable ambient temperature,
it is essential to avoid losses of heat by unnecessary door openings. Lever gear doors are to be
used only when moving material. It has also been observed that ambient temperature was
somewhat high, of 23 C, a few degrees decrease in heat can save considerable amounts of
energy and money, while actually providing a better working environment. It is recommended
to keep a temperature of 19-21 C.

3.1 Assembly lines
In the SMD and HMD assembly line areas, it was also observed that the separate waste
collection receptacles were not well marked, thus recovered material wasnt unmixed. It is
recommended that the staff is educated about the use of these containers to avoid cross-
contamination and ensure a high quality recoverable material.

Unnecessarily high temperature was also observed at the assembly lines, as the assembling
machines work at high operating temperatures (excess of 100 C), and there are some heat losses
to ambient air. This can be compensated by reducing the heating of these areas, which can save
money as well as ensure better comfort of the workers.

Volatile organic evaporations were also detected. Volatile organic compounds containing
solvents (decafluoropentane, trans-dichloroethylene, ethanol, tetrafluoroethane, isopropanol) are
used for cleaning circuit boards. As these compounds are irritating and hazardous, personal
protective equipment use and good ventilation is recommended. Personnel ought to be education
about the dangers of neglecting the use of protective gear.

Finally, it was remarked that some of the chemicals were stored incorrectly. Proper storage of
chemicals is necessary to ensure safety, as well as promotes resources use optimization.

4 Other premises
The general observation of personnel areas gave the image that there is the lack of
environmentally conscious behaviour from the staff. There seems to be no need to use paper
cups, if a coffee room with dishwasher is available, also it might be recommendable to place a
bio-waste collection container in the coffee room. On a positive side, the exploitation of natural
lightning via windows is praiseworthy.

5 Discussion
In our target company there is good existing recycling system, where most of the recyclable
waste fractions are recovered. Steps have also been taken towards waste minimisation, and the
general attitude of company management toward waste minimization was very positive. A good
example on this is the use of reusable racks at the packaging. There are, however, practices yet to
be improved. For one, there is a potential for energy consumption reduction, as temperatures in
the building were higher than necessary. This is partly due to the high operating temperatures
employed by the assembling machines. The optimal ambient temperature could be 19-21 C,
thus savings could be achieved by utilizing the escaping heat from the machines.

Education and awareness rising within the personnel will be inevitable, to make employees
aware of their responsibilities towards waste minimisation. By education and motivation, it is
also possible to improve the quality of collected recyclables. Better marking of separate recovery
container will be essential.

Instructions are also called for in the handling of chemicals and the use of protective gear, in
order to ensure safe working conditions and thus avoid resources loss through injury. To ensure a
safer working environment, and reduce releases to the atmosphere, replacing harmful chemicals
is to be considered, in order to achieve waste minimization through reduction of hazard. If this is
not applicable, better ventilation will be necessary to increase safety and prevent releases of
harmful chemicals to the environment.

6 Conclusions
This exercise work demonstrated that it is possible to conduct waste audits in a factory even
within a short timeframe and without prior knowledge of the production process. The use of
Envirowise guides is to be commended, however, in order to make a full audit, all the input and
output streams would have to be mapped. This was not applicable during this short audit;
notwithstanding, some recommendations were possible to be made, which can result in resources
use optimization and money savings. The general conclusion is that waste minimization requires
commitment from the company management, and awareness of the workers.


References

Envirowise (1999) Waste Mapping, Your route to more profit, Environmental Technology Best
Practice Program, ET219 Guide.


Article reference:
Pivrinta K, Yl-Mella J & Pongrcz E (2004) Waste mapping in a SME electronics
manufacturer. In: Pongrcz E (ed.) Proceedings of the Waste minimization and Resources Use
Optimization Conference, J une 10
th
2004, University of Oulu, Finland. Oulu University Press:
Oulu. p. 33.-37.