LG Color Monitor Service Manual

COLOR MONITOR
SERVICE MANUAL
Website:http://biz.LGservice.com
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : LP69G
MODEL: M198WA (M198WA-BMH.A**MLP)
M228WA (M228WA-BMH.A**MLP)
*( ) **Same model for Service
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CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTION ...........................................................................................3
SPECIFICATION........................................................................................7
DISASSEMBLY........................................................................................14
ADJUSTMENT ........................................................................................16
SERVICE OSD.........................................................................................22
TROUBLE SHOOTING............................................................................23
BLOCK DIAGRAM...................................................................................29
EXPLODED VIEW ...................................................................................32
REPLACEMENT PARTS LIST ............................................................... 34
SVC. SHEET ...............................................................................................
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WARNING FOR THE SAFETY-RELATED COMPONENT.
There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturers
specified parts to prevent electric shock, fire or other
hazard.
Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
Must mount the module using mounting holes arranged
in four corners.
Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
Make certai n that treatment person s body are
grounded through wrist band.
Do not leave the module in high temperature and in
areas of high humidity for a long time.
The module not be exposed to the direct sunlight.
Avoid contact with water as it may a short circuit within
the module.
If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
If you want to replace with the new backlight (CCFL) or
i nverter ci rcui t, must di sconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
PRECAUTION
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
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SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen ci rcumstances create confl i ct
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test hi gh vol tage onl y by measuri ng i t wi th an
appropri ate hi gh vol tage meter or other vol tage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cotton-
tipped stick or comparable non-abrasive applicator;
10% (by vol ume) Acetone and 90% (by vol ume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semi conductor (sol i d-state) devi ces can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
ci rcui ts and some fi el d-effect transi stors and
semi conductor "chi p" components. The fol l owi ng
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immedi atel y before handl i ng any semi conductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "anti-
static" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conducti ve foam, al umi num foi l or comparabl e
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)
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General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Al l ow the sol deri ng i ron ti p to reach normal
temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Al l ow the sol deri ng i ron ti p to reach a normal
temperature (500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the mel ted sol der wi th an anti -stati c
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the repl acement transi stor l eads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
ci rcui t board to prevent excessi ve component
temperatures.
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Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"l i ft-off" the board. The fol l owi ng gui del i nes and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern si de of the ci rcui t board. (Use thi s
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp kni fe. (Remove onl y as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
i nvol ves the i nstal l ati on of a j umper wi re on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the i nsul ated j umper wi re i s
dressed so the it does not touch components or sharp
edges.
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1. Application range
This specification is applied to 19"/22" Wide Monitor TV
used LP69G chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Power Voltage : Standard input voltage (100~240V@,
50/60Hz)
*Standard Voltage of each products is marked by models.
(2) Specification and performance of each parts are followed
each drawi ng and speci fi cati on by part number i n
accordance with BOM.
(3) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
3.1 Performance : LGE test method followed
3.2 Demanded other specification
Safety : CE, IEC Specification
EMC : CE, IEC
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4-1. General Specification
4.1.1 TV
4. General Specification(TV)
No Item Specification Remark
1 Video input applicable system NTSC, NTSC 4.43
2 Receivable Broadcasting System PAL N/M, NTSC M CHILE
3 RF Input Channel VHF : 2 ~ 13
UHF : 14 ~ 69 PAL N/M, NTSC
CATV : 1 ~ 125
4 Input Voltage AC 100-240V, 50Hz/60Hz
5 Market CHILE
6 Tuning System FS PAL N/M, NTSC
7 Operating Environment Temp : 10C~ 35C
Humidity : 20% ~ 80%
8 Storage Environment Temp : -10C ~ 60C non condensing
Humidity : 5%~90% non condensing
9 Display LCD Module
- 8 -
No. Item Min Typ. Max Unit Remark
1. Type TFT Color LCD Module
2. Active Display area 410.4 (H) x 256.5 (V) mm
3. Outline dimension 427.2 (H) x 277.4 (V) x17.0 (D) mm Typ
4. Pixel pitch 0.285mm (H) x 0.285mm (V) x RGB mm
5. Color arrangement RGB vertical stripe
6. Color Depth 16.7M color
7. Electrical Interface LVDS
8. Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)
9. Operating Mode Normally White
10. Back light Unit 4 CCFL (4 lamps)
11. R/T R.T : 1.3ms + R.T : 3.7ms Typ.
No. Item Specification Remark
1 Supported Sync. Type Separate Sync., Digital
2 Operating Frequency Analog Horizontal 28 ~ 83kHz
Vertical 56 ~ 75 Hz
Digital Horizontal 28 ~ 83kHz
Vertical 56 ~ 75 Hz
3 Resolution(M198WA) Analog Max. 1440 x 900 @ 75Hz
Recommend 1440 x 900 @ 60Hz
Digital Max. 1440 x 900 @ 60Hz
Resolution(M228WA) Analog Max. 1680 x 1050 @ 60Hz
Digital Max. 1680 x 1050 @ 60Hz
4 Input Voltage Voltage :100 - 240 Vac, 50 or 60Hz
5 Inrush Current Cold Start : 50 A Hot : 120 A
6 Operating Condition Sync (H/V) Video LED Wattage
Power S/W On
On mode
On/On Active Blue 60W Max.
On/On Active Blue 50W Typ.
Sleep mode
Off/On
Off Amber 1W
On/Off
Power S/W Off Off mode - Off Off 1W
7 MTBF 50,000 HRS with 90% Confidence level Lamp Life : 50,000 Hours(min)
8 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)
9 Operating Environment Temp : 10C ~ 35C
Humidity : 20% ~ 80%
10 Storage Environment Temp : -10C ~ 60C non condensing
Humidity : 5% ~ 90% non condensing
4.1.2 RGB/DVI
4-2. Module Specification(LPL LM190WX1-TLC1, P/N:EAJ36290801 (ZBD)) - M198WA
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4-3. Optical characteristic specifications
4.3.1 Optical Characteristic - M198WA
Min Typ Max
1 Viewing Angle R/L 75/75 88/88
<CR10> U/D 70/70 85/85
2 Luminance
RGB-PC 250 300
PSM:Dynamic, CSM: 6500K
Luminance Full White (100IRE)
(cd/m
2
) AV/TV
200 250
PSM:Dynamic, CSM:Cool
Component Full White (100IRE)
White Luminance Uniformity 75
3 Contrast Ratio CR RGB-PC/ At DFC Mode
AV/TV/ 500 850 Typ. 3000:1, Min. 2400:1
Component
4 CIE Color Coordinates WHITE Wx 0.313
Wy 0.329 In RGB-PC input
RED Rx 0.639
Ry 0.342 PSM : Dynamic
GREEN Gx 0.297 CSM : 6500K
Gy 0.615 White
BLUE Bx 0.146 (100 IRE)
By 0.068
WHITE Wx 0.285
Wy 0.293 In AV/Component/TV input
RED Rx 0.639
GREEN Gx 0.297 CSM : Cool
Gy 0.615 White
BLUE Bx 0.146 (85 IRE)
By 0.068
Typ.
+0.03
Typ.
+0.015
Typ.
-0.03
Typ.
-0.015
No. Item Min Typ. Max Unit Remark
1. Type TFT Color LCD Module
2. Active Display area 473.76 (H) x 296.1 (V) mm
3. Outline dimension 493.7 (H) x 320.1 (V) x16.5 (D) mm Typ
4. Pixel pitch 0.282mm (H) x 0.282mm (V) x RGB mm
5. Color arrangement RGB vertical stripe
6. Color Depth 16.7M color
7. Electrical Interface LVDS
8. Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)
9. Operating Mode Normally White
10. Back light Unit 4 CCFL (4 lamps)
11. R/T R.T : 1.3ms + R.T : 3.7ms Typ.
4-2. Module Specification(LPL LM220WE1-TLA1, P/N:EAJ33945801 (ZBD)) - M228WA
- 10 -
4.3.1 Optical Characteristic - M228WA
Min Typ Max
1 Viewing Angle R/L 70/70 80/80
<CR10> U/D 60/70 75/85
2 Luminance
RGB-PC 250 300
PSM:Dynamic, CSM: 6500K
Luminance Full White (100IRE)
(cd/m
2
) AV/TV
200 250
PSM:Dynamic, CSM:Cool
Component Full White (100IRE)
White Luminance Uniformity 75
3 Contrast Ratio CR RGB-PC/ At DFC Mode
AV/TV/ 500 800 Typ. 3000:1, Min. 2400:1
Component
4 CIE Color Coordinates WHITE Wx 0.313
Wy 0.329 In RGB-PC input
RED Rx 0.635
GREEN Gx 0.292 CSM : 6500K
Gy 0.611 White
BLUE Bx 0.147 (100 IRE)
By 0.070
WHITE Wx 0.285
Wy 0.293 In AV/Component/TV input
RED Rx 0.635
GREEN Gx 0.292 CSM : Cool
Gy 0.611 White
BLUE Bx 0.147 (85 IRE)
By 0.070
Typ.
+0.03
Typ.
+0.015
Typ.
-0.03
Typ.
-0.015
4-4. Model Specification
No Item Specification Remark
1. Market CHILE
2. Broadcasting system PAL N/M, NTSC M
3 RF Input Channel VHF : 2 ~ 13
UHF : 14 ~ 69 NTSC
CATV : 1 ~ 125
4. CVBS Input (1EA) PAL N/M, NTSC 3 System(Rear) :PAL50/60, NTSC
5. S-Video Input (1EA) PAL N/M, NTSC 3 System(Rear) :PAL50/60, NTSC
6. Component Input (1EA) Y/ Pb/Pr 480i/480p/576i/576p/720p/1080i
7. RGB Input (1EA) RGB-PC Max 1440 * 900@75Hz-M198WA
Max 1680 * 1050@60Hz-M228WA
RGB-DTV 480p, 576p, 720p, 1080i
8. DVI Input (1EA) DVI-PC Max 1440 * 900@60Hz-M198WA
Max 1680 * 1050@60Hz-M228WA
DVI-DTV 480p, 576p, 720p, 1080i
9. Audio Input (3 EA) CVBS, PC Audio, Component L/R Input
- 11 -
6. RGB Input (PC)-M198WA
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)
1 720*400 31.468 70.08 28.321
2 640*480 31.469 59.94 25.175
3 640*480 37.5 75 31.5
4 800*600 37.879 60.317 40.0
5 800*600 46.875 75.0 49.5
6 1024*768 48.363 60.0 65.0
7 1024*768 60.123 75.029 78.75
8 1152*864 67.500 75.000 108.0
9 1280*1024 63.981 60.02 108.0
10 1280*1024 79.976 75.035 135.0
11 1440*900 55.5 59.90 88.750
12 1440*900 55.935 59.887 106.50
13 1440*900 70.635 74.984 136.75
5. Component Video Input (Y, PB, PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
1. 720*480 15.73 59.94 13.500 480i
2. 720*480 15.75 60.00 13.514 480i
3. 720*576 15.625 50.00 13.500 576i
4. 720*480 31.47 59.94 27.000 480P
5. 720*480 31.50 60.00 27.027 480P
6. 720*576 31.25 50.00 27.000 576P
7. 1280*720 44.96 59.94 74.176 720P
8. 1280*720 45.00 60.00 74.250 720P
9. 1280*720 37.50 50.00 74.25 720P
10. 1920*1080 33.72 59.94 74.176 1080i
11. 1920*1080 33.75 60.00 74.250 1080i
12. 1920*1080 28.125 50.00 74.250 1080i
*M228WA
1 720*400 31.468 70.08 28.321
2 640*480 31.469 59.94 25.175
3 640*480 37.5 75 31.5
4 800*600 37.879 60.317 40.0
5 800*600 46.875 75.0 49.5
6 1024*768 48.363 60.0 65.0
7 1024*768 60.123 75.029 78.75
8 1152*864 67.500 75.000 108.0
9 1280*1024 63.981 60.02 108.0
10 1280*1024 79.976 75.035 135.0
11 1680*1050 64.674 59.883 119.0
12 1680*1050 65.290 59.954 146.25
- 12 -
8. DVI input (PC)-M198WA
1 720*400 31.468 70.08 28.321
2 640*480 31.469 59.94 25.175
3 640*480 37.5 75 31.5
4 800*600 37.879 60.317 40.0
5 800*600 46.875 75.0 49.5
6 1024*768 48.363 60.0 65.0
7 1024*768 60.123 75.029 78.75
8 1152*864 67.500 75.000 108.0
9 1280*1024 63.981 60.02 108.0
10 1280*1024 79.976 75.035 135.0
11 1440*900 55.5 59.90 88.750
12 1440*900 55.935 59.887 106.50
1. 720*480 31.47 59.94 27.000 480P
2. 720*480 31.50 60.00 27.027 480P
3. 720*576 31.25 50.00 27.000 576P
4. 1280*720 37.5 50.00 74.250 720P
5. 1280*720 44.96 59.94 74.176 720P
6. 1280*720 45.00 60.00 74.250 720P
7. 1920*1080 33.72 59.94 74.176 1080i
8. 1920*1080 33.75 60.00 74.250 1080i
9. 1920*1080 28.125 50.00 74.250 1080i
7. RGB input ( DTV )
* M228WA
1 720*400 31.468 70.08 28.321
2 640*480 31.469 59.94 25.175
3 640*480 37.5 75 31.5
4 800*600 37.879 60.317 40.0
5 800*600 46.875 75.0 49.5
6 1024*768 48.363 60.0 65.0
7 1024*768 60.123 75.029 78.75
8 1152*864 67.500 75.000 108.0
9 1280*1024 63.981 60.02 108.0
10 1280*1024 79.976 75.035 135.0
11 1680*1050 64.674 59.883 119.0
12 1680*1050 65.290 59.954 146.25
- 13 -
9. DVI input (DTV)
1. 720*480 31.47 59.94 27.000 480P
2. 720*480 31.50 60.00 27.027 480P
3. 720*576 31.25 50.00 27.000 576P
4. 1280*720 37.5 50.00 74.250 720P
5. 1280*720 44.96 59.94 74.176 720P
6. 1280*720 45.00 60.00 74.250 720P
7. 1920*1080 33.72 59.94 74.176 1080i
8. 1920*1080 33.75 60.00 74.250 1080i
9. 1920*1080 28.125 50.00 74.250 1080i
DISASSEMBLY
- 14 -
1. Push down slightly to disassembly it.
2. After push the cable management like above fig.(Downward),
Disassembly the Cable management with pulling it upward.
3. Disassembly Cable Holder.
Disassembly Stand base.
Remove base body Like a picture. Push 2 letches Like a picture.
Push the button.
Hold the stand base.
# 1
# 4
# 2
# 5
# 3
# 6
- 15 -
# 7
# 9
# 8
# 10
Pull base body to separate from set during pressing 2 letches.
Remove the screws.
# 11
Pull the connector.
Disassembly back cover.
1. Remove the screws.
2. Disassembly Hinge Cover.
- 16 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to 19"/ 20"/ 22" LCD
Monitor TV which is manufactured in TV (or Monitor) Factory
or is produced on the basis of this data.
2. Specification
1) The adj ustment i s accordi ng to the order whi ch i s
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment : Free Voltage
3) Magnetic Field Condition : Nil.
4) Input signal Unit : Product Specification Standard
5) Reserve after operation : Above 30 Minutes
6) Adjustment equipments : Color Analyzer(CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, SVC remote controller
3. Main PCB check process
* APC - After Manual-Insult, executing APC
3.1. Download
1) Execute ISP program Mstar ISP Utility and then click
Config tab.
2) Set as below, and then click Auto Detect and check
OK message.
If display Error, Check connect computer, jig, and set.
3) Click Connect tab.
If display Cant , Check connect computer, jig, and set.
4) Cl i ck Read tab, and then l oad downl oad
file(XXXX.bin) by clicking Read.
5) Click Auto tab and set as below
6) click Run.
7) After downloading, check OK message.
3.2. ADC Process
* If a scaler IC changed for PCB repairing, it is need to do
ADC process at all times.
(1) PC input ADC
1) Auto RGB Gain/Offset Adjustment
- Convert to PC in Input-source
- Signal equipment displays
Output Voltage : 700 mVp-p
Impress Resolution XGA (1024 x 768 @ 60Hz)
Model : 60 in Pattern Generator
Pattern : 29 in Pattern Generator (MSPG-925
SERISE)
[gray pattern that left & right is black and center is
white signal (Refer below picture)].
- Adjust by commanding AUTO_COLOR _ADJUST
(0xF1) 0x00 0x02 instruction.
2) Confirmation
- We confi rm whether 0x8B,0x8C address of
EEPROM 0xB4 is 0xAA or not.
- If 0x8B,0x8C address of EEPROM 0xB4 isnt
0xAA, we adjust once more.
- We can confirm the ADC values from 0x00~0x05
addresses in a page 0xB4
* Manual ADC process using Service Remocon. After
enter Service Mode by pushing INSTART key,
execute Auto-RGB by pushing key at Auto-
RGB.
(2) COMPONENT input ADC
1) Component Gain/Offset Adjustment
- Convert to Component in Input-source
- Signal equipment displays
Impress Resolution 480P
MODEL : 212 in Pattern Generator
(480p Mode, Y : 100%, Pb/Pr : 75%)
PATTERN : 08 in Pattern Generator
(MSPG-925 SERISE)
<Adjustment pattern (PC)>
- 17 -
<Adjustment pattern (COMPONENT)>
- Adjust by commanding AUTO_COLOR_ADJUST
(0xF1) 0x00 0x02 instruction.
2) Confirmation
- We confi rm whether 0x8D,0x8E address of
EEPROM 0xB4 is 0xAA or not.
- If 0x8D,0x8E address of EEPROM 0xB4 isnt
0xAA, we adjust once more.
- We can confirm the ADC values from 0x00~0x05
addresses in a page 0xB4.
3.3. Function Check
(1) Check display and sound
- Check Input and Signal items. ( cf. work instructions)
1) TV
2) AV (CVBS/ S-Video)
3) COMPONENT (480P)
4) RGB (PC : 1024 x 768 @ 60hz)
5) DVI
6) PC Audio In and H/P Out
* Display and Sound check is executed by Remote
controller.
4. Total Assembly line process
4.1. Adjustment Preparation
(1) Above 30 minutes H/run in RF no signal
(2) 15 Pin D-Sub Jack is connected to the signal of Pattern
Generator.
4.2. Confirm color coordinate of RGB
* Check White Balance
- Set Input to RGB.
- Input signal : (1024 x 768 @ 60Hz), Full white 255/255
gray level (100 IRE, Model : 60, Pattern : 4
at MSPG925L)
- Set CSM : 6500k
- Confirm whether x = 0.3130.03, y = 0.3290.03 or not.
- Confirm whether luminance over 200cd/m
2
- Set CSM : 9300k
* Check sRGB
- Set Input to RGB.
- Input signal : (1024 x 768 @ 60Hz)
Full white 255/255 gray level (100 IRE, Model : 60,
Pattern : 4 at MSPG925L)
- Set CSM : sRGB
- Confirm whether luminance = 18050 cd/m
2
4.3. Confirm color coordinate of AV
(1) Set Input to AV
(2) Input signal : CVBS, NTSC @ 60Hz
Full white 216/255 gray level (85 IRE, Model : 202,
(3) Set PSM : Dynamic / CSM : Cool
(4) Confirm whether x = 0.2850.03, y = 0.2930.03 or
not.
4.4. Confirm color coordinate of component
(1) Set Input to COMPONENT.
(2) Input signal : 480P
Full white 216/255 gray level (85 IRE Model : 212,
(3) Set PSM : Dynamic / CSM : Cool
(4) Confirm whether x = 0.2850.03, y = 0.2930.03 or
not.
4.5. Confirm Auto adjustment operation.
(1) Input 1 Dot on/off & Rectangle Pattern at Model 60
(1024 x 768@60Hz).
(2) Confirm adjustment operation by changing Clock,
Phase, H/V Position.
(3) Check Clock, Phase by pressing AUTO Key after
varying the Clock & the Phase
4.6. Other quality
- Confirm that each items satisfy under standard
condition that was written product spec.
(1) AV
1) Select input AV (S-video) and whether picture is
displayed or not
2) Sel ect i nput AV (CVBS) and whether pi cture i s
displayed or not.
(2) TV
- Select input TV and check below item
* In Gumi Factory
04 - Stero Sound check
63 - Dual Sound check
(3) RGB
*M198WA
- Select input RGB model 112(1440*900@60hz), 64 Gray
Scale pattern and whether picture is displayed or not
*M208WA / M228WA
- Select input RGB model 122(1680*1050@60hz), 64Gray
Scale pattern and whether picture is display or not
(4) COMPONENT
- Select input COMPONENT and whether picture is
displayed or not.
(5) DVI
*M198WA
- Select input DVI model 112(1440*900@60hz), 64 Gray
Scale pattern and whether picture is displayed or not
*M208WA / M228WA
- Select input DVI model 122(1680*1050@60hz), 64Gray
pattern and whether picture is displayed or not.
4.7. DPM operation confirmation
- Check if Power LED Color and Power Consumption operate
as standard.
(1) Set Input to RGB and connect D-sub cable to set.
(2) Measurement Condition : 230V@ 50Hz (Analog)
(3) Confirm DPM operation at the state of screen without
Signal
4.8 DDC EDID Write
1) Connect D-sub Signal Cable to D-Sub Jack.
2) Connect HDMI Signal Cable to DVI Jack.
3) Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
4) Check whether written EDID data is correct or not. (refer
to Product spec).
(1) M198WA EDID DATA
1) ANALOG DATA 128Byte
2) DIGITAL DATA 256Byte
4.9. HDCP SETTING
(High-Bandwidth Digital Contents Protection)
1) Connect D-sub Signal Cable to D-Sub Jack.
2) Input HDCP key with HDCP-key- in-program.
3) HDCP Key value is stored on EEPROM(AT24C64)
which is E00~F20 addresses of 0xBC~0xBE page.
4) AC off/ on and on HDCP button of MSPG925 and
confirm whether picture is displayed or not of using
MSPG925.
5) HDCP Key value is different among the sets.
4.10. Outgoing condition Configuration
1) After all function test., press IN-STOP Key by SVC
Remote controller. And Make Ship Condition.
2) When pressing IN-STOP key by SVC remocon, Green
and red LED are bl i nked al ternati vel y. And then
Automatically turn off. (Must not AC power OFF during
blinking)
- 18 -
ADH ADL LEN
BC 00 128
BC 80 128
BE 00 33
- 19 -
4.11. Internal pressure
- Confirm whether is nomal or not when between power
board's ac block and GND is impacked on 1.5kV(dc) or
2.2kV(dc) for one second.
4.12 Option data setting (SVC OSD setting)
(1) Tool Option
*M198WA-BMH- Tool Option 7809
*M208WA/M228WA-BMH Tool Option 7810
* Area Option (M198WA/M208WA/M228WA-BMH) Change by suffix
: Area Option : South America - S.Am
No. Item Condition Remark
1 2HR-OFF 1 0 : 2 Hour off option -OFF
1 : 2 Hour off option -ON
2 FACTORY-MODE 0 0 : EEPROM Write Protection On
1 : EEPROM Write Protection Off
3 CHANNEL-MUTE 1
RAM Delay
1 Clock Phase 7
2 DQS0 Phase 2
3 DQS1 Phase 2
4 DQS2 Phase 2
5 DQS3 Phase 2
Power Off History
1 Last Power 0
2 Remocon 0
3 Key 0
4 Sleep Timer 0
5 RS232 0
6 Off Timer 0
7 Auto Off 0
8 2Hour Off 0
9 Reset 0
ETC
1 DFC Control 1
2 Exit Key 0
3 PWM DIM 255
4 Dimming Ctl. 255
5 DEBUG ON 0
6 UART ON 3
7 AGC TAKEOVER 16
8 AGC EData 0
9 AGC BData 0
10 VID Lev 96
11 SOG Level 4
M198WA-BTH REMARK
Resolution 1 WXGA+
Module 0
TV 1
VIDEO 1
COMPONENT 1
PC-RGB 1
DVI 1
HDMI 0
M208WA-BMH / M228WA-BMH REMARK
Resolution 2 WSXGA
Module 0
TV 1
VIDEO 1
COMPONENT 1
PC-RGB 1
DVI 1
HDMI 0
- 20 -
5. Adjustment Command
5.1. Adjustment Commands(LENGTH=84)
5.2 EEPROM DATA READ
(1) Signal Table
(2) Command Set
* Purpose : To read the appoi ntment Address of
E2PROM by 128(80h)-byte
5.3. E2PROM Data Write
(1) Signal Table
LEN : 84h+Bytes
CMD : 8Eh
ADH : E2PROM Slave Address(A0,A2,A4,A6,A8), Not
00h(Reserved by BufferToEEPROM)
ADL : E2PROM Sub Address(00~FF)
Data : Write data
(2) Command Set
* Purpose
1) EDID write : 16-byte by 16-byte, 8 order (128-byte)
write(TO 00 7F of EEPROM Page A4).
2) FOS Default write : 16-mode data (HFh, HFl, VF, STD,
HP, VP, Clk, ClkPh, PhFine) write.
3) Random Data write : write the appointment Address of
E2PROM.
5.4. VRAM Read
1) Send CMD(70h) to read Video RAM value from MICOM
And save its value to 128-Bytes Buffer(Common Buffer
for the use of EDID)
2) Delay 500ms ( Time to Wait and Read Video RAM from
MICOM)
3) Be transmitted the contents of MICOMs 128-bytes
Buffer to PC. (128th Data is the CheckSum of 127-bytes
data : Thats OK if the value of adding 128-bytes Data is
Zero)
FACTORY ON E0 00 00 Factory mode on
FACTORY OFF E2 00 00 Factory mode off
EEPROM ALL INIT. E4 00 00 EEPROM All clear
EEPROM Read E7 00 00 EEPROM Read
EEPROM Write E8 00 data EEPROM Write by some
values
COLOR SAVE
(R/G/B cutoff, Drive, EB 00 00 Color Save
Contrast, Bright)
H POSITION 20 00 00 100 They have different range
V POSITION 30 00 00 100 each mode, FOS Adjustment
CLOCK 90 00 00 100
PHASE 92 00 00 100
R DRIVE 16 00 00 FF Drive adjustment
G DRIVE 18 00 00 FF
B DRIVE 1A 00 00 FF
R CUTOFF 80 00 00 7F Offset adjustment
G CUTOFF 82 00 00 7F
B CUTOFF 84 00 00 7F
BRIGHT 10 00 00 3F Bright adjustment
CONTRAST 12 00 00 - 64 Luminance adjustment
AUTO_COLOR_ F1 00 02 Auto COLOR Adjustment
ADJUST
CHANGE_COLOR F2 00 0,1,2,3 0: COOL
_TEMP 1: NORMAL
2: WARM
3: USER
FACTORY_DEFAULT F3 00 00 Factory mode off
& II_SW is 1
& Input change to TV
AUTO_INPUT F4 00 0,1,2,4 0 : TV
CHANGE 1 : AV1
2 : AV2
3 : Component
4 : RGB
5 : DVI
ADR VAL Description
CMD
(hex)
Adjustment Contents
128 Bytes
Delay 100ms
EEPROM READ E7 A0 0 0-Page 0~7F Read
80 0-Page 80~FF Read
A2 0 1-Page 0~7F Read
Adjustment contents CMD(hex) ADH(hex) ADL(hex) Details
EEPROM WRITE E8 94 16-Byte Write
84+n n-byte Write
Adjustment contents CMD(hex) ADH(hex) Details
- 21 -
ADJUSTMENT
Windows EDID V1.0 User Manual
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Dont need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup
a) Copy UserPort.sys file to
c:\WINNT\system32\drivers folder
b) Run Userport.exe
c) Remove all default number
d) Add 300-3FF
e) Click Start button.
f) Click Exit button.
2. EDID Read & Write
1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture,
Serial Number
a) Input User Info Data
b) Click Update button
c) Click Write button
- 22 -
Figure 1. Cable Connection
220
IBM
Compatible PC
PARALLEL PORT
Power inlet (required)
Power LED
ST Switch
Power Select Switch
(110V/220V)
C
o
n
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V-Sync On/Off Switch
(Switch must be ON.)
F
F
A
A
B
B
C
C
15
10
5
5
6 9
1
1
1
14
13
25
6
5V
5V
5V
4.7K
4.7K
4.7K
74LS06
74LS06
OFF ON
OFF
ON
11
Video Signal
Generator
SERVICE OSD
Tool Option 7809
Area Option S.Am
2HR-OFF 1
FACTORY-MODE 0
CHANNEL-MUTE 1
RAM Delay
ETC
BLUEBIRD3 - LP69G
Version 3.00 070502
UTT
M198WA WXGA+ LPL 19W
0
Power Off History
Tool Option 7810
Area Option S.Am
2HR-OFF 1
FACTORY-MODE 0
CHANNEL-MUTE 1
RAM Delay
ETC
BLUEBIRD3 - LP69G
Version 3.00 070502
UTT
M198WA WSXGA+ LPL 22W
0
Power Off History
Description of operation
- Tool Option : Adjust Tool Option
- Area Option : Adjust Area Option
(S.Am : South America)
- 2HR OFF : If no key input is made for 2 hours, Sets the Power off
- Factory-Mode : Adjust Factory-Mode On/Off
- Channel-Mute: Adjust Channel-Mute On/Off
- RAM Delay : Adjust RAM Delay
- Power Off History : Adjust Power Off History
- ETC
- 23 -
TROUBLESHOOTING GUIDE
1. NO POWER (LED INDICATOR OFF) : [A] Process
Check 15V or
ST_5V of Power B/D.
Fail
Check 15V or
ST_5V of Power B/D.
Check Output of
IC1100, IC1101.
Check short of
IC100, Q307.
Pass
Pass
Pass
Pass
Re-soldering of Change
defect part of IC100, Q307.
Change IC1100, IC1101.
Check Output of
IC1102, IC1103.
Check short of
IC100, TU600, IC500.
defect part of IC100, TU600,
IC500.
Change LED Assy.
Check Output of
IC1104, IC1105.
Check LED Assy.
Check P304 Connector.
Check short of
IC100, IC400.
defect part of IC100, IC400.
Fail
Fail
Fail
Fail
Fail
Fail
Fail
Pass
Pass
Pass
Pass
5V 15V
- 24 -
2. NO RASTER : [B] Process
Check LED status
On Display Unit.
Fail
Repeat A PROCESS.
Fail
Check Panel Link Cable
or Module.
Change Panel Link Cable
or Module.
Check Inverter
Connector or inverter.
Change Inverter Connector
or Inverter.
Change IC100
Check Output
of R305
Check the LVDS Output
of IC100
Check Input source Cable
and Jack.
Change Module.
Change R305
Pass
Pass
Pass
Pass
Pass
Fail
Fail
Fail
Fail
- 25 -
3. NO RASTER ON RGB SINGAL
Repeat [A, B] process.
Check the input/ output
of R708, R709
Fail
Check the J701.
Fail
Fail
Re-soldering or change the
defect part, Check the
X100.
Check
the input/output
of R128, R131, R136.
Check the input/output of
IC100.
Check input source cable
and jack.
Re-soldering or Change the
defect part.
Pass
Pass
Pass
Pass
X100
- 26 -
4. No Raster on Component Signal
of R901.
Fail
Check the J900.
Fail
Pass
X100.
Check the input/output
of R125.
Check the input/output of
IC100.
and jack.
Re-soldering or Change the
defect part.
Pass
Pass
Fail
X100
- 27 -
5. No Raster on DVI Signal
Pass
of R100.
Fail
X100.
and jack.
Pass
6. No Raster on AV(Scart in
Video, S-Video) Signal
7. No Rasteron TV(RF) Signal
and jack.
Fail
Check short of
IC100, Q307.
Fail
Fail
Fail
Pass
Check 5V of TU600.
Re-Soldering or change the
defect part.
Check
the input/output of
L804, L1002,L1003,
L1004.
Change L804, L1002,
L1003, L1004.
Check Output of
IC1104, IC1105.
X100.
Pass Pass
Pass
Pass
Pass
X100
X100
- 28 -
8. No sound
Check the input Sourse.
Fail
Pass
Change the source input.
Check input/Output
ofIC100.
Pass
Re-soldering of Change the
X100
of IC500
the defect part.
Check the Speaker
Check the Speaker wire.
Change Speaker.
Pass
Pass
Fail
Fail
Fail
X100
- 29 -
D
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BLOCK DIAGRAM
- 30 -
DESCRIPTION OF BLOCK DIAGRAM
1. Power Supply Block (LIPS)
This Block Generates DC Voltage (5V,15V) to Main Control system from AC Power (100-240 V, 50/60 Hz, 1.0A)
2. DC/DC Converter block
DC/DC Converter convert the input 5V,15V to proper 1.8V,2.5V,3.3V,5V,10.5V for Main control system.
For shooting heat trouble, we use the DC/DC converting IC
3. Scaler + Video/Audio decorder (Scaler IC, LGE9689/9789AD-LF)
It is composed of LGE9689/9789AD-LF.
It includes AD Converter, LVDS/TMDS Transmitter, Micom, and Audio processor.
1) Video Signal - CVBS/S-Video/Component/RGB/DVI(TMDS)
This Block Selects input Video signals (like CVBS, Y/C, SCART RGB) and output RGB signal.
On decoding, We can control signal like Contrast, Brightness, Sharpness, Color, tint signals including Adaptive
Comb Filter.
2) Audio Signal
This block analyzes audio input signal through A/V Jack and PC audio and Tuner IF.
The analyzed signals transmitted to audio amplifier (YDA138)
On decoding, We can control signal like Bass, treble.
4. Flash Memory(MX25L4005A)
This is composed of MX25L4005A.
This store the source data of micom.
5. Tuner
Micom controls this IC through IIC line.
Tuner makes CVBS and transmits IF signal to LGE9689/9789AD-LF.
6. Audio Amplifier (YDA138)
This block is composed of YDA138 and peripheral device.
The function of the audio amplifier is that to amplify audio L / R signal transmitted from audio decoder.
The audio signal is amplified according to pre-defined DC volume control curve.
Also, headphone amplifier is included at this IC.
- 31 -
EMI
COMPONENTS
LINE
100 ~ 240V
INPUT RECTIFIER
AND FILTER
ENERGY
TRANSFER
OUTPUT RECTIFIER
AND FILTER
15V
5V
GND
SIGNAL
COLLENT-
ION
PHOTO
-COUPLER
ISOLATION
HVDC
100KHz
PRIMARY SECONDARY
50 ~ 60Hz
PWM
CONTROL
CIRCUIT
LIPS Board Block Diagram
Operation description_LIPS
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.
2. Input rectifier and filter.
This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.
This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to
adjust the duty cycle during different AC input and output loading condition to achieve the dcoutput stabilized, and also
the over power protection is also monitor by this part.
5. Photo-Coupler isolation.
This part function is to feed back the DC output changing status through a photo transistor to primary controller to
achieve the stabilized DC output voltage.
6. Signal collection.
This part function is to collect the any change from the DC output and feed back to the primary through photo
transistor.
EXPLODED VIEW
- 32 -
3
0
0
2
0
0
1
2
0
5
1
0
3
2
0
3
3
0
5
0
0
3
1
0
5
2
0
4
2
0
4
3
0
5
3
0
4
1
0
4
0
0
9
4
0
9
0
0
9
5
0
9
1
0
9
3
0
9
2
0
- 33 -
EXPLODED VIEW PARTS LIST
120 EAB32761501 Speaker,Full Range, L07030A-027 ND35 3W 16OHM 85DB 300HZ 30 X 70 X 22 SOLDER SUNLINK COMPANY
200 EAJ36290801 LCD,Module-TFT, LM190WX1-TLC1 DRIVER 19INCH 1440X900 300CD COLOR 72% 16/10 850:1 5ms, MAGNA source D-IC, OKI gate D-IC, TLI T-con, 160/160, P7 LG PHILIPS LCD
EAJ33945801 LCD,Module-TFT, LM220WE1-TLA1 DRIVER 22.0INCH 1680X1050 300CD COLOR 72% 16/10 800:1 160/160 5ms 4LAMPS LG PHILIPS LCD
300 ABJ32323201 Cabinet Assembly, M198W. 19" M198W CABINET ASSY BLACK
ABJ32411701 Cabinet Assembly, M228WA M228WA_CABINET ASS'Y 21" M228WA CABINET ASS'Y (22")
310 MES35944701 Indicator, MOLD PMMA NON MX8W PMMA NON MX8W Model IR lens
320 MES35721501 Indicator, MOLD PMMA LED M198W PMMA NON M198W LED LENS
330 MBG35721401 Button, MOLD ABS HF-350 POWER M198W ABS 1KEY M198W POWER KNOB (BK)
400 ACQ32323322 Cover Assembly,Rear, m198wa BB3 19" M198WA BACK COVER ASSY_7KEY_SOUTH AMERICA_W/SVC LABEL
ACQ32411823 Cover Assembly,Rear, M228WA M228WA BACK_COVER ASS'Y ETC M228WA BACK COVER ASSY _SOUTH AMERICA VERSION(WITH SVC LABEL)
410 ADV31008062 Frame Assembly, M198WA-BTH LP69G(BB3) 19" METAL FRAME ASSY M198WA BB3, NON EU
ADV31008064 Frame Assembly, M228WA-BTH LP69G(BB3) ETC METAL FRAME ASSY M228WA BB3,NON EU
420 MEY35721301 Knob, MOLD ABS HF-350 SUB 7KEY M198W M198W TACT KNOB BK
430 MGJ35722501 Plate,Shield, PRESS SBHG 0.6T FRAME EGI M198W LAMP WIRE SHIELD (0.6T)
500 EBR35410101 PCB Assembly,Sub, LED & P/SW T.T LP69G M198WA/M208WA/M228WA AEUGLPX BRAND
510 6871TPT318G PCB Assembly,Power, PLLM-M602C POWER T.T CMO L225W 22"Wide Scaler Dimming FREQENCY CHANGE LG INNOTEK CO., LTD
520 EBU35388016 Main Total Assembly, M198WA-BMH for Chile BRAND LP69G
EBU35388018 Main Total Assembly, M228WA-BMH for Chile BRAND LP69G
530 EBR35409501 PCB Assembly,Sub, CONTROL T.T LP69G M198WA/M208WA/M228WA AEUGLPX BRAND
600 MKJ33981413 Remote Controller, COMPLEX LP69B LS1R W/O TXT , W/O PIP , CONTINENT OF ASIA
900 AAN31022505 Base Assembly, STAND m228w/22ls4r CL81 m228w/22ls4rHINGE COVER ASSY
910 MAZ35721601 Bracket, MOLD ABS HF-350 COVER M198W - ABS M198W STAND BODY (BLACK)
920 AAN32323501 Base Assembly, BASE M198W- M8W MODEL STAND BASE ASSY
AAN32323502 Base Assembly, BASE M228W- M8W MODEL STAND BASE ASSY& METAL BASE
930 MCK30233401 Cover, MOLD HIPS 51SF LS1R HIPS 51SF LS1R-holder cable management
940 MCK30246601 Cover, MOLD ABS 380 15LS1R ABS, HF-380 15LS1R-Cover hinge L
950 MCK30246901 Cover, MOLD ABS 380 15LS1R ABS, HF-380 15LS1R Cover hinge R
Description Part No. No.
* Note: Safety mark
LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
A1 MFL37805907 ManualPRINTING USER - BRAND M198W
A2 6410TEW011A Power CordIMO LP-22 & H05VV-F 0.7
or 6410TEW001C Power CordSP-28 IS-14 H05VV-F 3GX
A3 130-013B "Battery,ManganeseR03( STC) 1.5V 1"
A4 68509F0003A "Cable,AssemblyD-SUB TO D-SUB UL20"
or 6850TD9007D "Cable,Assembly6850TD9007D D-SUB C"
A5 68509J0004A "Cable,AssemblyDVI-D TO DVI-D UL20"
A6 6852TAZ006P "Cable,AssemblyKCA-ST-3-0010 STERE"
A7 SAB30693407 S/W PackageM198WA/M208WA/M228WA c
C1001 0CC331CK41A "Capacitor,Ceramic,ChipC1608C0G1H3"
C101 0CK104CK56A "Capacitor,Ceramic,Chip0603B104K50"
C1012 0CK563CK56A "Capacitor,Ceramic,ChipC1608X7R1H5"
C1100 0CE477EH618 "Capacitor,AL,RadialKMG5.0TP25VB47"
C1101 0CE107WF6DC "Capacitor,AL,ChipMVK6.3TP16VC100M"
C1102 0CK474DH56A "Capacitor,Ceramic,ChipC2012X7R1E4"
C1111 0CK474DH56A "Capacitor,Ceramic,ChipC2012X7R1E4"
C1118 0CK272CK46A "Capacitor,Ceramic,Chip0603B272J50"
C1122 0CK226FF67A "Capacitor,Ceramic,ChipEMK325BJ226"
C1148 0CE475WJ6DC "Capacitor,AL,ChipMVK4.0TP35VC4.7M"
C1153 0CK105CD56A "Capacitor,Ceramic,ChipC1608X7R1A1"
C119 0CE106WFKDC "Capacitor,AL,ChipMVK4.0TP16VC10M"
C122 0CK224CF56A "Capacitor,Ceramic,Chip0603B224K16"
- 34 -
REPLACEMENT PARTS LIST
DATE: 2007. 06. 20.
CAPACITORs
ACCESSORY
C163 0CK475CC94A "Capacitor,Ceramic,ChipC1608Y5V0J4"
C165 0CK225DD66A "Capacitor,Ceramic,ChipLMK212JB225"
C313 0CK475CC94A "Capacitor,Ceramic,ChipC1608Y5V0J4"
C4000 0CN1040K949 "Capacitor,Ceramic,AxialCH UP050 F"
C4001 0CN1040K949 "Capacitor,Ceramic,AxialCH UP050 F"
C500 0CK225DH94A "Capacitor,Ceramic,ChipC2012Y5V225"
C501 0CE476WH6DC "Capacitor,AL,ChipMVK8.0TP25VC47M"
C504 0CK474DK56A "Capacitor,Ceramic,ChipUMK212BJ474"
C507 0CK475EF56A "Capacitor,Ceramic,ChipC3216X7R1C4"
C510 0CE337WH6DC "Capacitor,AL,ChipMVK10TP25VC330M"
C512 0CK105DH56A "Capacitor,Ceramic,ChipC2012X7R105"
C513 0CE337WH6DC "Capacitor,AL,ChipMVK10TP25VC330M"
C521 0CK474DK56A "Capacitor,Ceramic,ChipUMK212BJ474"
- 35 -
C609 0CH5151K416 "Capacitor,Ceramic,Chip0805N151J50"
C708 0CK474CH94A "Capacitor,Ceramic,Chip0603F474Z25"
D1101 0DR340009AA "Diode,SchottkyMBRS340 525MV 40V 4"
D500 0DS181009AA "Diode,SwitchingKDS181 1.2V 85V 30"
D712 0DSON00138A "Diode,SchottkyMMBD301LT1G 600MV 3"
D713 0DSON00138A "Diode,SchottkyMMBD301LT1G 600MV 3"
D714 0DD184009AA Diode AssemblyKDS184 KDS184 TP KE
D715 0DD184009AA Diode AssemblyKDS184 KDS184 TP KE
ZD1000 0DZ560009GB "Diode,ZenerBZT52C5V6S-(F) 5.6V 5."
ZD2001 0DZ560009CF "Diode,ZenerMTZJ5.6B 5.6V 5.45TO5."
IC100 EAN33715803 "IC,Video ProcessorsLGE9689AD-LF 3"
IC103 0IMMRAL026C "IC,EEPROMAT24C64AN-10SU-2.7 64KBI"
IC1100 0IMCRAU004A "IC,LDO Voltage RegulatorS1117-33P"
IC1101 0IPMG78346A "IC,LDO Voltage RegulatorAZ1085S-A"
IC1102 0IMCRMZ001A "IC,DC,DC ConverterMP1583DN-Z,LF 4"
IC1104 0IPMG00107A "IC,LDO Voltage RegulatorAZ1117H-2"
IC1105 0IPMGRH001G "IC,LDO Voltage RegulatorBA33BC0FP"
IC1107 0ISS780500H "IC,Voltage RegulatorKA78M05RTM 7T"
IC400 EAN32205201 "IC,DDR SDRAMHY5DU281622FTP-5 128M"
IC500 EAN33643401 "IC,Audio AmplifierYDA138-EZ(D-3)"
- 36 -
DIODEs
ICs
IC701 0IMMR00014A "IC,EEPROMM24C02-RMN6TP 2KBIT 256X"
IC702 0IMMR00014A "IC,EEPROMM24C02-RMN6TP 2KBIT 256X"
L1104 61409B0002A "Coil,ChokeDBF-1030A 30uH - 2.5A 1"
L1000 6210TCE001A "Filter,BeadHB-1S2012-080JT 8OHM 2"
L1113 6210TCE001G "Filter,BeadHH-1M3216-501JT 500OHM"
L1114 6200J00005E "Filter,BeadHH-1M2012-601JT 600OHM"
L1002 0LC0233002A "Inductor,Multilayer,ChipFI-B2012-"
Q1102 0TR387500AA "TR,Bipolar2SC3875S(ALY) NPN 5V 60"
Q302 0TR150400BA "TR,Bipolar2SA1504S(ASY) PNP -5V -"
Q307 EBK32753101 FETSI4925BDY P-CHANNEL MOSFET -30
AR400 0RJ1000C687 "Resistor,ArrayRCA86TRJ100R 100OHM"
R1000 0RJ0752D477 "Resistor,ChipMCR03EZPF750 75OHM 1"
R1002 0RJ4703D677 "Resistor,ChipMCR03EZPJ474 470KOHM"
R1009 0RJ9101D677 "Resistor,ChipMCR03EZPJ912 9.1KOHM"
R101 0RJ1004D477 "Resistor,ChipMCR03EZPF105 1MOHM 1"
R102 0RJ1000D677 "Resistor,ChipMCR03EZPJ101 100OHM"
R1021 0RJ0152D677 "Resistor,ChipMCR03EZPJ150 15OHM 5"
R108 0RH0000D622 "Resistor,ChipMCR10EZHJ000 0OHM 5%"
R1104 0RJ1001D677 "Resistor,ChipMCR03EZPJ102 1KOHM 5"
R1115 0RJ6801D477 "Resistor,ChipMCR03EZPF682 6.8KOHM"
R1116 0RJ1053D477 "Resistor,ChipMCR03EZPF1053 105KOH"
R1130 0RJ1500D477 "Resistor,ChipMCR03EZPF151 150OHM"
R1150 0RX0102K665 "Resistor,Metal Oxide FilmRSD02F4J"
- 37 -
COILs & FILTERs & INDUCTORs
TRANSISTORs & FETs
RESISTORs
R1153 0RJ1053D477 "Resistor,ChipMCR03EZPF1053 105KOH"
R140 0RJ0000D677 "Resistor,ChipMCR03EZPJ000 0OHM 5%"
R303 0RH2001D622 "Resistor,ChipMCR10EZHJ202 2KOHM 5"
R305 0RH0000D622 "Resistor,ChipMCR10EZHJ000 0OHM 5%"
- 38 -
R4000 0RN6801F409 "Resistor,Metal FilmRN-96T1F6K80 6"
C1 6631900109A "Harness,Single(FOOSUNG)DCE153B-23"
C2 6631900011H "Harness,SingleSMH200 SMH200 450mM"
C3 6631900022P "Harness,SingleSMH200-3P SMH200-3P"
C4 6631T20023A "Harness,SingleSMH200-11 SMH200-11"
J701 6630TGA004H "Connector,DSUBKCN-DS-0-0089 D-SUB"
P1101 6602T20008K "Connector,WaferSMW200-11P 11P 2.0"
P1104 6630TGA005J "Connector,DSUBQH01121-HWK-PF DVI"
P2001 6602T20009E "Connector,WaferSMAW200-06P 6P 2.0"
P300 6630V90219A "Connector,WaferSMW200-28C 28P 2.0"
P304 6602T20009E "Connector,WaferSMAW200-06P 6P 2.0"
P306 6602T20009B "Connector,WaferSMAW200-03P 3P 2.0"
P4000 6602T20009B "Connector,WaferSMAW200-03P 3P 2.0"
P500 6602T20009C "Connector,WaferSMAW200-04P 4P 2.0"
- 39 -
CONNECTORs
J1000 6612F00099A "Jack,PhonePEJ024-01 1P 4P STRAIGH"
J1001 6612J10026A "Jack,RCARCA-359HA-00A-01G 14.0MM"
J1002 6612F00024C "Jack,DINPSJ014-01 SOCKET 4P ANGLE"
J1003 6612F00099A "Jack,PhonePEJ024-01 1P 4P STRAIGH"
J900 6612J10031B "Jack,RCAPPJ209-01 14.0MM 1RX3C AN"
SW2001 140-058E "Switch,TactTHVV502GBC 1C1P 12VDC"
SW4000 140-058B "Switch,TactEVQPB205K 1C1P 15VDC 0"
B1 MAY36479301 BoxBOX SW 508 141 410 2 COLOR M19
IC102 SAA30949101 "S/W,Firmware3.00 9614 CENTRAL AND"
IC2001 6712SCA232A Receiver ModuleTSOP34838SO1 2.7TO
LED2001 0DLGP0080AA "LED,DIPGP34052ME/P507-ZSY-50-HB R"
P1 400-C02Q PackingCOMPLEX 47LC DW -
P2 MFZ34905701 PackingMOLD EPS M198W EPS Brand L
TU600 EBL35311204 "Tuner,Tuner/ModulatorTAFT-H003F N"
X100 6202VDT002B CrystalSX-1 14.31818MHZ 30PPM(16P
- 40 -
SWITCHs
OTHERs
JACKs
- 41 -
PRINTED CIRCUIT BOARD
MAIN (TOP)
- 42 -
MAIN (BOTTOM)
- 43 -
CONTROL
LED & P/SW
- 44 -
SCHEMATIC DIAGRAM
1. MSTAR
- 45 -
2. PANEL & CONNECTOR
- 46 -
3. DDR
- 47 -
4. AMP
- 48 -
5. TUNER
- 49 -
6. D-SUB & DVI
- 50 -
7. SCART & DAC
- 51 -
8. JACK
- 52 -
9. POWER
- 53 -
10. CONTROL KEY
- 54 -
11. IR + LED + POWER
Jun. 2007
P/NO : MFL38456749 Printed in Korea

LG Color Monitor Service Manual

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