MindTrik

Technologies

IP/SoC Design Service & Consultancy

India

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MindTrik at a glance

A semiconductor design service firm, founded by young skilled & experienced RF, Analog
& Digital IP/SoC Design and marketing professionals with 45 years of collective
experience. Design services exclusively available for cellular, broadband and SoC design
houses for varied range of wireless standards like IEEE 802.11a/b/g and 802.15.4g.
We are experts in RF, Mixed Signal and Digital IP designs having extensive experience in
RF/Analog design from RF Switch to complex Mixed Signal Transceiver SoC. We are
possible potential technology partners to the SoC design companies, in the development
of complex SoCs to make progress efficiently and time-to-market.

Technology Expertise
Turnkey IP/SoC Design, Layout and Testing
Process: RFCMOS, CMOS, BiCMOS, GaAs, SiGe, InGaP/GaAs
Platform: Industry Standard EDA Tools
Packaging Solution: IC Packaging and Assembly (Third Party Solution)

Target IP Store
RF/Analog IPs
Front End Module
PA
LNA
Switch
Attenuator
Mixer

Digital IPs
Digital PLL
SERDES

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Mission & Vision

Create strong ecosystem for chip design in central India with extensive focus on
IP/SoC design services and consulting for broad range of market applications.

To attain best of industry practices in IP/SoC design and become Indias one of the
prominent IP/SoC design service provider company with high values for its
employees and aiming ultimate customer satisfaction, beyond horizons.

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Core Strength & Competencies

Our People
Synchronized to Organizations Vision
Accept Challenges
Thinks Beyond
Excellent Executioner
Our Strategy
Conventional & Non-conventional Methods
Dynamic Planning & Execution
Time-to-Market Planning
Competitive Cost
Managing Customer Relationships
Our Expertise
RF and Analog IP Design: Design, Layout, DRS and LVS
Mixed Signal IP Design: Design, Layout, DRS and LVS
Digital ASIC IP and FPGA Design: RTL Development, Synthesis, Functional
Verification & Physical Design

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Skills and Expertise

Skilled RF, Analog & Digital IP Design team with experience in complete
specifications to tape-out/Signoff process for better implementation of design for
broad range of wireless systems/products for varied wireless IEEE standards.
Exposure in tape-outs on different technologies like RFCMOS, CMOS, SiGe BiCMOS,
GaAs pHEMT, GaAs MESFET, GaAs HBT.
For Technology Nodes: CMOS 130nm/65nm/28nm
GaAs 0.5um/0.25um/0.15um
Design Expertise in RF Designs including IPs like Front End Module (FEM), Low
Noise Amplifier (LNA), Power Amplifiers (PAs), Attenuators, Switches, Mixer etc for
the frequency range of DC to 10 GHz and Analog IPs like Op-amp, Filter etc.
Provide design and consulting services in ASIC digital domain and extend services
in FPGA development for communication protocols, DSP systems, and custom
applications.
Exposure of Device characterization, RF IC Testing and Board Design Solutions.

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Our Offerings
RF & Analog IP/SoC Design
Custom Layout & ASIC Solution
Digital FPGA & ASIC Design
Device Characterization & RF IC Testing
Manpower Outsourcing
Board Design Solution

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Service Portfolio
o

IP Design Solution

SoC/ System Design Solution

IP Licensing

Manpower Outsourcing

Feasibility Analysis
RF, Analog Design & Layout
Mixed Signal Design & Layout
Digital ASIC/ FPGA Design & Functional Verification
Device Characterization and RF IC Testing
Board Design Solution
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RF & Analog IP/SoC design

We have a team of people experience in RF/Analog IP/SoC design & Development.
Our team has past experience in complex high frequency SoC design which includes
design of ZigBee, BT/WLAN Transceiver starting from deciding specs to tapeOut.
Our team also have experience in designing individual blocks like LNA, PA, Mixer,
FEM, Front End (PA, Mixer, Switch), SPDT, Digital Attenuator, Complex filters and
PLL for various applications like, GSM, CDMA, CATV, Wi-Fi, ZigBee, WLAN, Internet
of Things(IoT).

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RFIC Testing and Device Characterization

We have a team of people experience in RFIC testing and characterization for
various IPs.
Our Technical Head has past experience in testing of 1W/2W multiband RF
Power amplifier, 0.5-5GHz SPDT switch, D-PHY PLL, troubleshooting CMTS
up converter board, WCDMA Power Amplifier, CATV amplifier and done
wafer level testing of various blocks which includes many LNA, PA, Switch etc.

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Digital FPGA/ASIC Design

We offers FPGA design services and ASIC design services from concept
through specification writing, high-level ASIC/FPGA design, ASIC/FPGA
development and integration, and verification using test benches. MindTrik helps
you to meet the most stringent requirements for FPGA/ASIC development using
systematic design methodologies for project and team management.
ASIC Design
- RTL Design & Synthesis
- Functional Verification
- Physical Design
FPGA Development
- RTL Design & Synthesis
- Functional Verification
- FPGA Implementation

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Engagement Model

Design Service Provider

Complete Specs to Tape-Out Solution
Turnkey or Offshore Development
Custom Design for Complex IP/SoCs

Technology Partnering
With EDA Companies and Fabs
Product Design Houses
IP/SoC Licensing Solution

Manpower Outsourcing

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IP Licensing & Deliverables

IP Licensing
Kindly refer next chart IP Roadmap for list of IPs which we are developing

and scheduled to release.

Flexible IP licensing model with reasonable cost in industry (without royalty)
& low cost options (with royalty),
Customizable solution for customer specific requirements,
Application Notes & Technical Support,

RF/Analog IP Deliverables

Digital IP Deliverables

IP Specifications & Understanding

IP Specifications & Understanding

Circuit & Layout Information and Data

Synthesizable RTL Files & Layout Data

GDSII Data

GDSII Data
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Semiconductor Target Market

Consumer Electronics

Specific Industrial Application

Automotive Industry
Wi-Fi/BT Products

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Corporate Differentiation
Aiming industrys best and lowest price for IP licensing with flexible model and
support for customer specific modifications of available IPs,
Experienced, strong technical leader and handful team in most challenging field of
RF VLSI and chip design on variety of processes like RFCMOS, CMOS, BiCMOS, GaAs,
SiGe, InGaP targeting Wi-Fi/ZigBee/Bluetooth & Internet of Things (IoT) applications,
willing to expand as quickly as needed;
Extensive experience in Industry standard EDA tools like Cadence, Agilent ADS, and
Mentor Graphics such that we can support in development of various RF/Analog
IP/SoCs targeting broad range of applications,
We can provide cost economic IC packaging solutions with best of packaging
vendors across USA to customers need the support. We are having decent experience
in packaging solutions from LFCSP package for switch to complex 100-pin QFN
packaging considering appropriate package selection, bonding diagram, epoxy use,
minimum wire lengths and Die attach pad etc. parameters. We can Here, packaging
vendor either can be suggested by customer itself or we can suggest them appropriate
one.
We can support Digital IP development used in Mixed Signal Transceivers for WiFi/ZigBee/Bluetooth applications.
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Technical Team Experience

IC Design includes Design, Simulations, Layout, Chip Integration, Tapeout, (Pre- Silicon),
IC Packaging, Prototype Design, Testing & Measurement (Post-Silicon).
Head with successful project management, execution and scheduling.
Experience on Analog IC Layout Design on 130nm, 65nm, 28nm CMOS & 0.5um, 0.25um,
0.15um GaAs/InGaP/HBT Processes.
RF/Analog Design experience of RF CMOS Transceiver SoC, Front End Module, RF Power
Amplifiers, Low Noise Amplifiers, PLL, Voltage Regulators and many more.
Worked on RF CMOS 130nm Transceiver SoC Design Project based on IEEE
802.15.4g for 3 successful tape-outs.
Layout design and verification of a fully-integrated low power RFCMOS Transceiver
operating at 915.9 MHz 929.7 MHz. The device parameters have been compliant to the
IEEE 802.15.4g standard. Complete design was implemented on RF CMOS 130nm LP
Process technology.
For this Transceiver SoC, layout Design, DRC and LVS of RF Power Amplifier, Mixer,
Operational Amplifier, Low Noise Amplifier, Band Pass Filter, Band Gap Reference, level
shifter, RF Attenuator, LC Oscillator, Buffer Amplifiers, Divider, Decoder with top level
integration was accomplished.
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Technical Team Experience

Wi-Fi, WLAN & Bluetooth Front End Design on 130nm and 65nm.
Worked on 1watt, 2W Power Amplifier design on GaAs/InGaP HBT process.
Design and testing of SPDT and DPDT switches on 0.5um GaAs pHEMT process using Win
PS50-70 process for frequency range on 500MHz to 6GHz.
Design of High Power, High Efficiency Power Amplifier for IoT and Front End Applications
using 0.15um and 0.25um GaAs pHEMT process.
Design of High Power, High Efficiency Power Amplifier for IoT and Front End Applications
using 0.5um GaAs HBT process.
Worked on four LNA designs for frequency of 0.7-1.1GHz (Cellular band), 1.7-2.2GHz
(PCS Band), 2.2-2.5GHz (WCDMA Band) and broad-band LNA 0.4 - 4GHz on 0.5um E/D
pHEMT process.
Worked on WiMax Power amplifier Design on InGaP/GaAs process and WCDMA
Power Amplifier design on 0.18um SiGe BiCMOS process.
Worked on 0.18um CMOS IBM CIMG7SF process D-PHY design. Done layouts for
Multiplexer, Frequency Divider and dual mod counter and IQ modulator with complete DRC
and LVS clean using Cadence Virtuoso Layout tool.
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Technical Team Experience

Work on complex Up-Converter PCB modification and testing project.
Layout Design and verification of RF Power Amplifier, Low Noise Amplifier on RF CMOS
65nm LP Process from TSMC for Bluetooth Front End Module (2.4GHz) and Wi-Fi Front End
Module 2.4GHz.
Layout Design and DRC of Low Noise Amplifiers, Power Amplifier, Front End Module for the
frequency range of 2GHz to 5GHz and 10GHz to 12GHz. The process for the designs is
0.5um pHEMT WIN PS50-70.
Layout Design of Power Amplifier on 0.25um technology from WIN Foundry.
Experience in Digital ASIC Design, RTL development, optimization and verification for ASIC
& FPGAs.
Designed multiple ASIC Digital blocks for CMOS 130nm Transceiver Design Project based
on IEEE 802.15.4g. Development of part of H.264 Video Standard with the knowledge of
complete Video CODEC flow, Image Segmentation algorithms, AHB Bridge, OFDM Module
and JPEG Decoder module.
Managed and delivered the RF prototype board development for four RF chips in two
consecutive tape-outs within crucial deadline including managing IC packaging, component
procurement and vendor interactions.
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Technical Team Experience

Tools Exposure:
Cadence ADE, Virtuoso spectre/spectre RF circuit simulator/Virtuoso Layout Editor/Assura
DRC for layout design /check
Cadence IC Editor
Agilents Advanced Design System for RF Design (2009U1/2011)
Mentor Graphics DRC/LVS/xRC Tools
Synopsys DC, Cadene SoC Encounter, Xilinx ISE and Altera Quartus

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Why MindTrik
Expertise in semiconductor design and project execution, management skills,
Young motivated team aiming for high employee values and vision for ultimate
customer satisfaction,
Professionals with analytical view on shortcomings, challenges and issues during
project execution,
Low cost design solutions,
Well connected with highly skilled design professionals/consultants across
semiconductor industry,

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Business Venture with More Possibilities

Thank You

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