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1OUT
1IN
1IN +
GND
VCC
2OUT
2IN
2IN +
TL022M . . . U PACKAGE
(TOP VIEW)
NC
1OUT
1IN
1IN +
VCC
10
NC
VCC +
2OUT
2IN
2IN +
OUT
D
D
D
D
D
D
TL022M . . . JG PACKAGE
TL022C . . . D OR P PACKAGE
(TOP VIEW)
D
D
IN
The TL022C is characterized for operation from 0C to 70C. The TL022M is characterized for operation over
the full military temperature range of 55C to 125C.
AVAILABLE OPTIONS
TA
VIOmax
AT 25C
25 C
0C to 70C
55C to 125C
PACKAGE
SMALL OUTLINE
(D)
CERAMIC DIP
(JG)
PLASTIC DIP
(P)
5 mV
TL022CD
TL022CP
5 mV
TL022MJG
TL022MU
The D package is available taped and reeled. Add the suffix R to the device type (i.e. TL022CDR).
TL022C, TL022M
DUAL LOW-POWER OPERATIONAL AMPLIFIERS
SLOS076 SEPTEMBER 1973 REVISED SEPTEMBER 1990
schematic
OUT
Common to Both
Amplifiers
Each Amplifier
VCC +
To Other
Amplifier
IN
IN +
VCC
To Other Amplifier
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
TL022C
TL022M
UNIT
18
22
18
22
30
30
15
15
unlimited
unlimited
55 to 125
65 to 150
65 to 150
300
JG or U package
D or P package
NOTES: 1.
2.
3.
4.
260
All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC .
Differential voltages are at IN+ with respect to IN .
The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
The output may be shorted to ground or either power supply. For the TL022M only, the unlimited duration of the short circuit applies
at (or below) 125C case temperature or 75C free-air temperature.
DISSIPATION RATING TABLE
PACKAGE
TA 25C
POWER RATING
DERATING
FACTOR
DERATE
ABOVE TA
TA = 70C
POWER RATING
TA = 125C
POWER RATING
680 mW
5.8 mW/C
33C
464 mW
JG
680 mW
8.4 mW/C
69C
672 mW
210 mW
680 mW
8.0 mW/C
65C
640 mW
675 mW
5.4 mW/C
25C
432 mW
135 mW
TL022C, TL022M
DUAL LOW-POWER OPERATIONAL AMPLIFIERS
SLOS076 SEPTEMBER 1973 REVISED SEPTEMBER 1990
MAX
15
UNIT
V
15
TEST CONDITIONS
PARAMETER
MIN
25C
TYP
1
VIO
VO = 0,,
RS = 50
IIO
VO = 0
IIB
VO = 0
VICR
Common-mode input
voltage range
VO(PP)
Maximum peak-to-peak
output voltage swing
RL = 10 k
25C
20
RL 10 k
Full range
20
AVD
Large-signal
g
g
differehtial
voltage amplification
RL 10 k,,
VO = 10 V
25C
60
Full range
60
B1
Unity-gain bandwidth
25C
CMRR
Common-mode rejection
j
ratio
VIC = VICRmin,,
RS = 50
25C
60
Full range
60
kSVS
Supply
y voltage
g sensitivity
y
(VIO /VCC)
VCC = 9 V to 15 V,,
RS = 50
Vn
Equivalent
E
i l t input
i
t noise
i
voltage
AVD = 20 dB,
dB
B = 1 Hz,
Hz
IOS
25C
ICC
Supply
y current ((both
amplifiers)
VO = 0
0,
No load
25C
130
PD
Total dissipation
(both amplifiers)
VO = 0,
0
No load
Full range
MIN
TYP
MAX
7.5
25C
15
Full range
80
200
25C
100
Full range
25C
12
12
250
13
50
12
26
20
80
72
25C
26
86
200
30
200
dB
50
130
mA
250
250
7.5
3.9
7.5
V/V
nV/Hz
6
250
250
3.9
150
150
50
nA
MHz
72
60
30
nA
dB
0.5
60
mV
66
72
UNIT
20
Full range
Full range
13
12
Full range
25C
100
250
0.5
25C
40
100
400
Full range
f = 1 kHz
TL022M
MAX
6
6
A
mW
All characteristics are measured under open-loop conditions with zero common-mode input voltage unless otherwise specified. Full range for
TL022C is 0C to 70C and for TL022M is 55C to 125C.
Rise time
Overshoot factor
SR
TEST CONDITIONS
MIN
VI = 20 mV,
mV
RL = 10 k
k,
See Figure 1
VI = 10 V,
RL = 10 k,
See Figure 1
TYP
0.3
MAX
UNIT
s
5%
0.5
V/s
TL022C, TL022M
DUAL LOW-POWER OPERATIONAL AMPLIFIERS
SLOS076 SEPTEMBER 1973 REVISED SEPTEMBER 1990
Output
VI
Input
+
0V
INPUT VOLTAGE
WAVEFORM
CL = 100 pF
RL = 2 k
TEST CIRCUIT
TYPICAL CHARACTERISTICS
TOTAL POWER DISSIPATION
vs
SUPPLY RATE
Total Power Dissipation mW
PPD
D
10
No Load
No Signal
TA = 25C
7
4
2
1
0.7
0.4
0.2
0.1
4
6
8 10 12 14 16
|VCC | Supply Voltage V
Figure 2
18 20
27-Feb-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
TL022CD
ACTIVE
SOIC
75
CU NIPDAU
Level-1-260C-UNLIM
TL022CDE4
ACTIVE
SOIC
75
CU NIPDAU
Level-1-260C-UNLIM
TL022CDE4
ACTIVE
SOIC
75
CU NIPDAU
Level-1-260C-UNLIM
TL022CDE4
ACTIVE
SOIC
75
CU NIPDAU
Level-1-260C-UNLIM
TL022CDR
ACTIVE
SOIC
CU NIPDAU
Level-1-260C-UNLIM
TL022CDR
ACTIVE
SOIC
CU NIPDAU
Level-1-260C-UNLIM
TL022CDR
ACTIVE
SOIC
CU NIPDAU
Level-1-260C-UNLIM
TL022CDRE4
ACTIVE
SOIC
CU NIPDAU
Level-1-260C-UNLIM
TL022CDRE4
ACTIVE
SOIC
CU NIPDAU
Level-1-260C-UNLIM
TL022CDRE4
ACTIVE
SOIC
CU NIPDAU
Level-1-260C-UNLIM
TL022CP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
TL022CP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
TL022CP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
TL022CPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
TL022CPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
TL022CPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
TL022CPSR
ACTIVE
SO
PS
CU NIPDAU
Level-1-260C-UNLIM
TL022CPSR
ACTIVE
SO
PS
CU NIPDAU
Level-1-260C-UNLIM
TL022CPSR
ACTIVE
SO
PS
CU NIPDAU
Level-1-260C-UNLIM
TL022CPSRE4
ACTIVE
SO
PS
CU NIPDAU
Level-1-260C-UNLIM
TL022CPSRE4
ACTIVE
SO
PS
CU NIPDAU
Level-1-260C-UNLIM
TL022CPSRE4
ACTIVE
SO
PS
CU NIPDAU
Level-1-260C-UNLIM
(1)
Lead/Ball Finish
Addendum-Page 1
27-Feb-2006
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDI001A JANUARY 1995 REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
0.260 (6,60)
0.240 (6,10)
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.015 (0,38)
Gage Plane
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.430 (10,92)
MAX
0.010 (0,25) M
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
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