Panasonic KX TG1100FX

ORDER NO.
KM40603004CE
Telephone Equipment
KX-TG1100FXS
KX-TG1100FXT
KX-TG1102FXS
KX-TGA110FXS
KX-TGA110FXT
Digital Cordless Phone
Silver Version
Titanium Black Version
(for Central Europe)
2006 Panasonic Communications Co., Ltd. All

rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Page
10 THINGS TO DO AFTER REPLACING IC
39
1.1. Suggested PbF Solder
10.1. Base Unit
39
1.2. How to recognize that Pb Free solder is used
10.2. Handset
39
2 FOR SERVICE TECHNICIANS
11 RF SPECIFICATION
40
3 CAUTION
11.1. Base Unit
40
4 OPERATING INSTRUCTIONS
11.2. Handset
40
4.1. Battery
12 HOW TO CHECK THE HANDSET SPEAKER
40
4.2. Location of Controls
13 FREQUENCY TABLE (MHz)
41
4.3. Connections
14 BLOCK DIAGRAM (BASE UNIT)
42
4.4. Guide to Settings
15 CIRCUIT OPERATION (BASE UNIT)
43
4.5. For Service Hint
11
15.1. Outline
43
12
15.2. Power Supply Circuit
44
5.1. Base Unit
12
15.3. Telephone Line Interface
45
5.2. Handset
13
15.4. Transmitter/Receiver
45
5.3. Charger Unit
14
15.5. Pulse Dialling
45
5 DISASSEMBLY INSTRUCTIONS
6 ASSEMBLY INSTRUCTIONS
15
16 BLOCK DIAGRAM (HANDSET)
46
6.1. Warning When Constructing the Base Unit
15
17 CIRCUIT OPERATION (HANDSET)
47
6.2. How to Replace the Handset LCD
16
17.1. Outline
47
7 TROUBLESHOOTING GUIDE
17
17.2. Power Supply Circuit/Reset Circuit
47
7.1. Check Power
18
17.3. Charge Circuit
47
7.2. Check Battery Charge
19
17.4. Battery Low/Power Down Detector
47
7.3. Check Link
20
7.4. Check Handset Transmission
22
7.5. Check Handset Reception
22
19 SIGNAL ROUTE
49
7.6. Check Caller ID
22
20 CPU DATA (BASE UNIT)
50
7.7. Bell Reception
22
18 CIRCUIT OPERATION (CHARGER UNIT)

20.1. IC2 (BBIC)
8 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND
21 CPU DATA (HANDSET)
48
48
50
52
23
21.1. IC4 (BBIC)
52
8.1. Check Point (Base Unit)
23
22 ENGINEERING MODE
54
8.2. The Setting Method of JIG (Base Unit)
28
22.1. Base Unit
54
8.3. Adjustment Standard (Base Unit)
30
22.2. Handset
56
8.4. Check Point (Charger Unit)
32
8.5. Adjustment Standard (Charger Unit)
32
23.1. PREPARATION
58
CHARGER UNIT)
23 HOW TO REPLACE THE FLAT PACKAGE IC
58
33
23.2. FLAT PACKAGE IC REMOVAL PROCEDURE
58
9.1. Check Point (Handset)
33
23.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
59
9.2. The Setting Method of JIG (Handset)
36
23.4. BRIDGE MODIFICATION PROCEDURE
59
9.3. Adjustment Standard (Handset)
38
24 CABINET AND ELECTRICAL PARTS (BASE UNIT)
60
9 TROUBLESHOOTING BY SYMPTOM (HANDSET)
25 CABINET AND ELECTRICAL PARTS (HANDSET)
61
30.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
71
26 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
62
30.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
71
27 ACCESSORIES AND PACKING MATERIALS
63
30.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
27.1. KX-TG1100FXS/FXT
63
71
27.2. KX-TG1102FXS
64
28 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
31 SCHEMATIC DIAGRAM (BASE UNIT)
72
32 SCHEMATIC DIAGRAM (HANDSET)
74
65
33 SCHEMATIC DIAGRAM (CHARGER UNIT)
76
28.1. Base Unit
65
34 CIRCUIT BOARD (BASE UNIT)
77
28.2. Handset
65
34.1. Component View
77
28.3. Charger Unit
65
34.2. Flow Solder Side View
78
29 REPLACEMENT PARTS LIST
35 CIRCUIT BOARD (HANDSET)
66
79
29.1. Base Unit
66
79
29.2. Handset
67
80
29.3. Charger Unit
68
29.4. Accessories and Packing Materials
68
81
29.5. Fixtures and Tools
68
81
30 FOR SCHEMATIC DIAGRAM
71
36 CIRCUIT BOARD (CHARGER UNIT)
81
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)

Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
PbF solder has a melting point that is 50F ~ 70 F (30C ~ 40C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700F 20 F (370C 10C).
Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent
solder splash or damage to the PCB.
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100F (600C).
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturers specific instructions for the melting points of their products and any precautions for using their product with other
materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and
1.0 mm.
1.2.
How to recognize that Pb Free solder is used
(Example: Handset P.C.B.)
Marked
PbF
30
31
1
100
IC4
50
51
IC3
81
80
IC2
4
(Component View)
Note:
The location of the PbF mark is subject to change without notice.
2 FOR SERVICE TECHNICIANS

ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil and ground them.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
3 CAUTION
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufactures Instructions.
4 OPERATING INSTRUCTIONS
4.1.
Battery
4.1.1.
Battery Installation
4.1.2.
Battery Charge
4.2.
Location of Controls
4.2.1.
Base Unit
4.2.2.
Handset
4.2.3.
Charger (KX-TG1102 only)
4.3.
Connections
4.3.1.
Base Unit
4.3.2.
Charger (KX-TG1102 only)
Note:
Never install telephone wiring during a lightning storm.
Do not connect the AC adaptor to a ceiling-mounted AC outlet, as the weight of the adaptor may cause it to become
disconnected.
4.4.
4.4.1.
Guide to Settings
Base Unit
Cross Reference:
For Service Hint (P.11)
4.4.2.
Handset
Cross Reference:
For Service Hint (P.11)
10
4.5.
For Service Hint
11
5 DISASSEMBLY INSTRUCTIONS
5.1.
Base Unit
Shown in Fig.1
2
To Remove
Cabinet Cover
Main P.C. Board
Remove
Screws (2.6 12)..........(A) 2
Solders
Main P.C. Board
12
5.2.
Handset
Shown in Fig.3
4
5
To Remove
Cabinet Cover
Main P.C. Board
Remove
Screws (2 8)..........(B) 2
Follow the procedure.
Screw (2 8)..............(C ) 3
Tape and Solders
Main P.C. Board
13
5.3.
Charger Unit
Shown in Fig.6
7
To Remove
Cabinet Cover
Main P.C. Board
Remove
Screws (2.6 14)..........(D) 2
Solders
Main P.C. Board
14
6 ASSEMBLY INSTRUCTIONS
6.1.
Warning When Constructing the Base Unit

CHG terminal is properly fit in the cabinet.
OK
NG
Rib
CHG terminal comes out of rib by pulling black lead wire when opening the cabinet and turning
the PCB over. The terminal cannot have enough elastic force, cannot have good contact with
handset, and it will result in charge problem.
15
6.2.
How to Replace the Handset LCD
16
7 TROUBLESHOOTING GUIDE
Flow Chart
Cross Reference:
Check Power (P.18)
Bell Reception (P.22)
Check Battery Charge (P.19)
Check Link (P.20)
Check Handset Transmission (P.22)
Check Handset Reception (P.22)
SIGNAL ROUTE (P.49)
Check Caller ID (P.22)
17
7.1.
7.1.1.
Check Power
Base Unit
Is the AC Adaptor inserted into AC outlet? (Check AC Adaptors specification.)
Note:
Cross Reference
BBIC is IC2.
Power Supply Circuit (P.44)
7.1.2.
Handset
Note:
Cross Reference
Power Supply Circuit/Reset Circuit (P.47)
BBIC is IC4.
18
7.2.
7.2.1.
Check Battery Charge

Base Unit
Cross Reference:
7.2.2.
Handset
Note:
Cross Reference:
BBIC is IC4.
Check Power (P.18)

Charge Circuit (P.47)
7.2.3.
Charger Unit
Cross Reference:
19
7.3.
7.3.1.
Check Link
Base Unit
Cross Reference:
Check Point (Base Unit) (P.23)
Note:
(*1) Refer to TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND CHARGER UNIT) (P.23).
20
7.3.2.
Handset
Cross Reference
Power Supply Circuit/Reset Circuit (P.47)
Check Point (Handset) (P.33)
Note:
(*1) Refer to TROUBLESHOOTING BY SYMPTOM (HANDSET) (P.33).
21
7.4.
Check Handset Transmission
Cross Reference:
SIGNAL ROUTE (P.49)
7.5.
Check Handset Reception
Cross Reference:
HOW TO CHECK THE HANDSET SPEAKER (P.40).
SIGNAL ROUTE (P.49)
7.6.
Check Caller ID
Cross Reference:
SIGNAL ROUTE (P.49)
7.7.
7.7.1.
Bell Reception
Handset
Cross Reference:
Note:
Telephone Line Interface (P.45)
BBIC is IC4.
Check Link (P.20)

HOW TO CHECK THE HANDSET SPEAKER (P.40)
22
8 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND

CHARGER UNIT)
If your unit has below symptoms, follow the instructions in remedy column. Remedies depend on whether you have DECT tester
(*1) or not.
Note:
(*1) A general repair is possible even if you dont have the DECT tester because it is for confirming the levels, such as Acoustic
level in detail.
(*2) Refer to Check Point (Base Unit) (P.23)
8.1.
Check Point (Base Unit)
Please follow the items below when BBIC or EEPROM is replaced.

Note:
After the measuring, suck up the solder of TP.
*: PC Setting (P.28) is required beforehand.
The connections of simulator equipments are as shown in Adjustment Standard (Base Unit) (P.30).
Items
Adjustment
Point
-
Procedure
(A)
2.65V Supply
Confirmation
1. Confirm that the voltage between TP187 and GND is 2.65V 0.2V.
(B)
4.0V Supply
Confirmation
1. Confirm that the voltage between TP91 and GND is 4.0V 0.2V.
(C)
VBACK Status
Confirmation
1. Confirm that the voltage between J102 and GND is 0V 0.4V.
23
Check or
Replace Parts
IC2, Q8, C23,
C24, C25,
C31, C26,
C27, C38,
R33, R36, D5,
C41, R41,
R42, Q9, C40,
D4, X1, C32,
C33, C36, C37
D4, C40, Q9,
R41, R42,
C41, D5, C75,
C78, C69,
C66, C67,
C76, IC3
IC2, Q8, C23,
C24, C25,
C31, C26,
C27, C38,
R33, R36, D5,
C41, R41,
R42, Q9, C40,
D4, R33, X1,
C32, C33
Items
(D)*
BBIC Confirmation
Adjustment
Point
-
Procedure
1. BBIC Confirmation (Execute the command getchk).
2. Confirm the returned checksum value.
Check or
Replace Parts
IC2, X1, C32,
C33
Connection of checksum value and program number is shown below.
(E)* BBIC Clock Adjustment

(Important)
TP1
1. Execute the command deactmac.

2. Execute the command conttx.
IC2, IC3, L1,

C48, X1, C32,
C33, L5
3. Input Command rdeeprom 00 00 02, then you can confirm the current value.
(F)* Hookswitch Check with

DC Characteristics
4. Adjust the frequency of TP1 executing the command setfreq 00 xx (where xx

is the value) so that the reading of the frequency counter is 10.368000MHz
10Hz.
1. Connect J1 (Telephone Socket) to Tel-simulator which is connected with 600
.
2. Set line voltage to 48V at on-hook condition and line current to 40mA at offhook condition of normal telephone.
IC2, R7, R8,

R9, R10, R77,
Q2, Q3, D2,
C1, C2
3. Execute the command hookoff.

4. Confirm that the line current is 40mA 5mA.
5. Execute the command hookon.
(G)* DTMF Generator Check
6. Confirm that the line current is 0mA + 2mA.

1. Connect J1 (Telephone Socket) to DTMF tester.
2. Execute the command hookoff and dtmf_up.
3. Confirm that the high frequency (1477.06Hz) group is -6.5dBm ~ -9.5dBm.
4. Execute the command dtmf_lo.
5. Confirm that the low frequency (852.05Hz) group is -9.0dBm ~ -12.0dBm.
(H)*
Transmitted Power
Confirmation
Remove the Antenna before starting steps from 1 to 5.

1. Configure the DECT tester (CMD60) as follows;
<Setting>
Short TP10 and GND
(After the checking, disconnect the wiring between them.)
Test mode: FP
Traffic Channel: 5
Traffic Slot: 4
Mode: Loopback
IC2, R32, C22,

R23, C80,
C14, C13, Q6,
R22, R21,
R19, R20,
C12, D2, C1,
C2, R77, D3,
R12, Q2, R7,
R8, R9, R10,
Q3
IC2, IC3, L1,
C43, C78,
C75, C69,
C48, C72,
C66, C67,
C76, C57,
C73, L3, DA1,
R66, R67,
C55, C56,
R78, R79,
C54, C58,
C86, R38
PMID: 00000
2. Execute the command testmode.
3. Initiate connection from DECT tester. (set up connect)
4. Execute the command ANT 1.
(I)*
Modulation Check and

Adjustment
ANT
5. Confirm that the NTP value at ANT is 20dBm ~ 25dBm.

Follow steps 1 to 3 of (H) above.
4. Confirm that the B-Field Modulation is 340kHz/div ~ 402kHz/div using data
type Fig31.
5. Adjust the B-Field Modulation if required. (Execute the command readmod
and wrtmod xx, where xx is the value.)
24
IC2, IC3, L1,

C43, C78,
C75, C69,
C48, C72,
C66, C67,
C76, C57,
C73, L3, DA1,
R66, R67,
C55, C56,
R78, R79,
C54, C58,
C86, R38
Items
Adjustment
Procedure
Point
(J)* Frequency Offset Check
Follow steps 1 to 3 of (H).
4. Confirm that the frequency offset is -50kHz ~ +50kHz.
(K)*
Sensitivity Receiver
Confirmation

4. Set DECT tester power to -88dBm.
5. Confirm that the BER is < 1000ppm.
(L)*
Timing Confirmation

4. Confirm that the Timing accuracy is < 2.0ppm.
(M)*
RSSI Level
Confirmation

5. Execute the command readrssi.
6. Confirm: 25 < returned value < 43 (hex) (34 F (hex))
25
Check or
Replace Parts
IC2, IC3, L1,
C43, C78,
C75, C69,
C48, C72,
C66, C67,
C76, C57,
C73, L3, DA1,
R66, R67,
C55, C56,
R78, R79,
C54, C58,
C86, R38
IC2, IC3, L1,
C43, C78,
C75, C69,
C48, C72,
C66, C67,
C76, C57,
C73, L3, DA1,
R66, R67,
C55, C56,
R78, R79,
C54, C58,
C86, R38
IC2, IC3, L1,
C43, C78,
C75, C69,
C48, C72,
C66, C67,
C76, C57,
C73, L3, DA1,
R66, R67,
C55, C56,
R78, R79,
C54, C58,
C86, R38
IC2, IC3, L1,
C43, C78,
C75, C69,
C48, C72,
C66, C67,
C76, C57,
C73, L3, DA1,
R66, R67,
C55, C56,
R78, R79,
C54, C58,
C86, R38
Items
(N)*
Receive Audio Check

and Adjustment
Adjustment
Point
ANT
J1
Procedure
<Setting>
Test mode: FP
Mode: Normal
PMID: 00000
3. Initiate connection from DECT tester.
5. Execute the command openau.
.
7. Set line voltage to 48V and line current to 40mA.
8. Connect DECT tester to Tel-simulator.
Check or
Replace Parts
IC2, C21, R31,
C20, C11,
R18, R16, D3,
R12, Q2, R7,
R8, Q3, R9,
R10, D2, C1,
C2, R77, IC3,
L1, C43, C78,
C75, C69,
C48, C72,
C66, C67,
C76, C57,
C73, L3, DA1,
R66, R67,
C55, C56,
R78, R79,
C54, C58,
C86, R38
9. Input audio signal (200mVrms/1kHz tone) to Tel-simulator.

<DECT tester setting>
Scramble: On
AF Gen. to ADPCM: Off
AF Meter Input: ADPCM
AF Gen. Frequency: 1000Hz
AF Gen. Level: 200mVrms
10. Confirm hearing tone: 300mVrms 100mVrms
11. Adjust audio level if required. (Make sure current value using getmicgain. And
then execute the command setmicgain xx, where xx is the value.)
(O)* Transmit Audio Check
and Adjustment
ANT
J1
12. Confirm that the B-field audio distortion with DECT tester is < 5%.
<Setting>
Test mode: FP
Mode: Normal
PMID: 00000
5. Execute the command openau.
.
8. Input audio signal (30mVrms/1kHz tone) to DECT tester.
Scramble: On
IC2, R32, C22,

R23, C80,
C14, C13,
R22, R21, Q6,
R18, R19,
R20, C12, D2,
C1, C2, R77,
R16, D3, R12,
Q2, R7, R8,
R9, R10, Q3,
IC3, L1, C43,
C78, C75,
C69, C48,
C72, C66,
C67, C76,
C57, C73, L3,
DA1, R66,
R67, C55,
C56, R78,
R79, C54,
C58, C86, R38
AF Gen. to ADPCM: On
AF Meter Input: AF Voltm
9. Confirm hearing tone: 330mVrms 100mVrms.
10. Adjust audio level if required. (Make sure current value using getspkrgain.
And then execute the command setspkrgain xx, where xx is the value.)
(P)
Charging Check
11. Confirm that the audio distortion at 600R of Tel-simulator is < 5%.
1. Connect Charge Contact 12/2W resistor between charge+ and charge-.
2. Measure and confirm voltage across the resistor is 2.3V 0.2V.
26
D4, R43, R44
Items
(Q)*
Audio Check
Adjustment
Point
-
Procedure
1. Link with Handset.
3. Input -45dBm/1kHz to MIC of Handset.
Measure the Level at Line I/F and distortion level.
4. Confirm that the level is -9 2dBm and that the distortion level is < 5% at TEL
Line (600 Load).
5. Input -20dBm/1kHz to Line I/F.
Measure the level at Receiver of Handset and distortion level
(*Receive volume set to second position from minimum).
6. Confirm that the level is -23 2dBm and that the distortion level is < 5% at
Receiver (Volume Middle, 150 Load).
27
Check or
Replace Parts
8.2.
The Setting Method of JIG (Base Unit)
8.2.1.
8.2.1.1.
Preparation
Equipment Required
DECT tester: Rohde & Schwarz, CMD 60 is recommended.

Frequency counter: it must be precise to be able to measure 1Hz (precision; 4ppm).
Hewlett Packard, 53131A is recommended.
DC power: it must be able to output at least 1A current under 9V.
Digital multi-meter (DMM): it must be able to measure voltage and current.
Oscilloscope
8.2.1.2.
JIGs and PC
EEPROM serial JIGs

1. I2C PCB: PQZZTCD420BX
2. RS232C cable: PQZZ1CD705BX
3. Clip cable: PQZZ2CD705BX
4. DC cable: PQZZ3CD705BX
PC which runs in DOS mode
Batch file CD-ROM for setting: PQZZTG1100FX
8.2.2.
8.2.2.1.
PC Setting
Connections
Connect the AC adaptor to J2 (base unit).

Connect the RS232C cable to the Serial Port of PC.
Connect the DC cable to the DC Power.
Connect the Clip cable GND.
Connect the Clip cable SCL and SDA.
Note:
*: Com port names may vary depending on what your PC calls it.
28
8.2.2.2.
PC Setting
Note:
***** varies depending on the country.
See the table below for frequently used commands.
Command name
rdeeprom
Function
Read the data of EEPROM
readid
writeid
setfreq
hookoff
hookon
Getchk
Wreeprom
InitBsPIN.bat
Read ID (RFPI)
Write ID (RFPI)
adjust Frequency of RFIC
off-hook mode on Base
on-hook mode on Base
Read checksum
write eeprom
Initial Base PIN to 0000
Example
Type rdeeprom 00 00 FF, and the data from address 00 00 to FF is
read out.
Type readid, and the registered ID is read out.
Type writeid 00 18 E0 0E 98, and the ID 0018 E0 0E 98 is written.
Type setfreq nn nn.
Type hookoff.
Type hookon.
Type getchk.
Type wreeprom 01 23 45. 01 23 is address and 45 is data to be written.
Type initBsPIN
29
Adjustment Standard (Base Unit)
MIC
6.3V47F
30
AF
OSC
Q5
R15
R14
Q4
R11
C9
S1
Q1
D1
RLY1
JMP5
R25
C15
R13
D8
D7
C60
R8
C6
D3
C77
D2
C4
R77 C3
R92
C7
R74
R5
C5
R3
R53
Q3
R2
R70
R73
R4
R1
R6
R82
C74
R81
SA1
JMP2
C16
R20
C62
Q11
D10
R9
R54
C49
KXTCD150H/KXTG1100H
C12
J1
Q8
C103
C24
X1
C33
C32
16
17
R61
C31
R30
C20
C19
C18
C30
C29
C25
D4
C36
R57
C35
C34
C40
C97
C23
R59
D5
JMP1
R35
D11
R72
R71
JMP4 JMP3
C10
R26 R10
Q7
R91 R24
R27
D6 C79
C14
R23
C13
R22
R32
C80
R21
C22
B
R16
C11
Q6 C
R18
R17
E
R56
C51
R19
R55
R28
C17
D12
D13
L2
R12
B C E
Q2
R7
C1
C2
C63
JMP8
JMP7
JMP6
R85
64
C37
32 33
C43
11
R52
R33
C27
C47
C81
IC3
58
C87
C91
Q10
C92
D9
C90 C95
C107
C106
R67 C105
C48
R89
L1
IC1
C38
R36
C50
C94
C93
C68
L4 R38
C53
PQUP11175W
C26
49
48
R58
C101
C5
A201
L59
R68
18
A202
C89
R88
C88
R87
C72
C67 C86
C66
28 C56
C76
DECT Tester
CMD60
(H) (I) (J) (K) (L) (M)
C59
C71
CN4
R44
R43
L
DA1
R79
C73
R78
C70
L3
ANT
C57 C83
C55
L83
L85
R66 1
C58
R42
R41
C102
Q9
C100
C98
PbF
IC2
R29
R31
C21
C28
L5
C41
C42
J2
C96
C78
C69
(H) - (M) is referred to Check Point (Base Unit) (P.23)
Dummy
Handset
150
SP
AF VOLT
METER
OSC
Component View
C84
C82
Note:
8.3.1.
When connecting the Simulator Equipments for checking, please refer to below.
8.3.
R90
31
LOOP
Simulator
GND
TP45
OSC
AF VOLT
METER
CHARGE
TP39
TP45
(*1) Refer to Connections (P.28)
TP3
TP3
(A) - (P) is referred to Check Point (Base Unit) (P.23)
Note:
AF
OSC
BELL
Simulator
600
Call - ID
Simulator
(G) DTMF
Tester
Digital
Volt Meter
Flow Solder Side View
TP50
TP40
TP40
TP5
TP97
TP82
TP90
TP101
TP89
TP101
DC POWER
6V
GND
TP2
2
TP187
TP187
Digital
Volt Meter
GND
(A)
(C)
(B)
TP91
TP91
C99
Digital
Volt Meter
GND
TP188
TP1
CHARGE
GND
(*1) Digital
Volt Meter
I2C PCB
(JIG)
VBACK
SDA
SCL GND
PC
(D) (E) (F) (G)

(H) (N) (O)
GND
VBACK
SCL
SDA
+2.65V
PbF
8.3.2.
TP10
GND
GND
TP10
GND
TP1
12
2w
CHARGE+
(H)
Frequency
Counter
(E)
Digital
Volt Meter
(P)
8.4.
Check Point (Charger Unit)

Items
(A)
Charging Check
Adjustment
Point
-
Procedure
Check or
Replace Parts
D1, R1, R2
1. Connect Charge Contact 12/2W resistor between charge+ and charge-.

2. Measure and confirm voltage across the resistor is 2.7V 0.2V.
Note:
The connection of adjustment equipment are as shown in Adjustment Standard (Charger Unit) (P.32).
8.5.
Adjustment Standard (Charger Unit)
8.5.1.
Flow Solder Side View
R2
R1
TP3
TP4
PbF
(A)
Digital Volt Meter
12/2W
TP1
TP2
PQUP11205Z
Note:
(A) is referred to Check Point (Charger Unit) (P.32)
32
9 TROUBLESHOOTING BY SYMPTOM (HANDSET)

If your unit has below symptoms, follow the instructions in remedy column. Remedies depend on whether you have DECT tester
(*1) or not.
Note:
(*1) A general repair is possible even if you dont have the DECT tester because it is for confirming the levels, such as Acoustic
level in detail.
(*2) Refer to Check Point (Handset) (P.33)
9.1.
Check Point (Handset)
Please follow the items below when BBIC or EEPROM is replaced.

Note:
*: PC Setting (P.36) is required beforehand.
The connections of simulator equipments are as shown in Adjustment Standard (Handset) (P.38).
Items
(A)
4.0V Supply
Confirmation
Adjustment
Point
-
Procedure
1. Confirm that the consumption current is < 200mA, that is, there is no short
circuit.
2. Confirm that the voltage between TP4V and GND is 4.1V 0.2V.
(B)
VBACK Status
Confirmation
1. Confirm that the voltage between VBACK and GND is 0V 0.4V.
(C)*
BBIC Confirmation
1. BBIC Confirmation (Execute the command getchk).

2. Confirm the returned checksum value.
Check or
Replace Parts
IC4, F1, R21,
R4, C1, L2,
D1, C15, C33,
C34, C14, Q1,
R111, R2,
C26, X1, C16,
C17
IC4, F1, R21,
R4, C1, L2,
D1, C15, C33,
C34, C14, Q1,
R111, R2,
C26, X1, C16,
C204
IC4, X1, C16,
C204
Connection of checksum value and program number is shown below.
(D) Charge Control Check &

Charge Current Monitor
Check
1. Apply 6V between TP20(+) and TP21(-) with current limit of PSU to 250mA.
2. Confirm that the charge current is ON/OFF.
3. SW to decrease current limit of PSU to 100mA.
(E)* Charge Detection (OFF)

Check
4. Confirm that the charge current is stable.

1. Stop supplying 6V to TP20(+) and TP21(-).
2. Execute the command charge.
3. Confirm that the returned value is 00 (hex).
33
IC4, D2, L4,

L5, Q2, Q3,
R6, C26, F1,
R21, R4, C1
IC4, D2, L4,
L5, Q2, Q3,
R6, C26, F1,
R21, R4, C1
Items
Adjustment
Point
(F)* Battery Monitor Check &
Adjustment (Important)
Procedure
1. Apply 2.3V 0.005V between TP3(+) and TP4(-) with DC power.
2. Execute the command deactmac to stabilize the value.
3. Then, execute the command readbatt. The returned value is XX.
Check or
Replace Parts
IC4, D2, L4,
L5, Q2, Q3,
R6, C26, F1,
R21, R4, C1
4. Confirm that XX is between 98 and A8.

98 < XX < A8 (Hex)
(G)
Battery Low
Confirmation (Important)
(If XX is out of range, change BBIC)

1. Apply 2.40V between TP3(+) and TP4(-).
2. Confirm that there is no Speaker sound (Battery low alarm).
3. Apply 2.20V between TP3(+) and TP4(-).
(H)* BBIC Clock Adjustment

(Important)
TP19
4. Confirm that there is Speaker sound (Battery low alarm).

1. Apply 2.6V between TP 3(+) and TP 4(-) with DC power.
2. Execute the command deactmac.
IC4, F1, R21,

R4, C1, R103,
R110, D102,
Q104,
BUZZER
IC4, L3, C57,
IC3, X1, C16,
C204
3. Execute the command conttx.

4. Input Command rdeeprom 00 01 01", then you can confirm the current value.
(I)*
Transmitted Power
Confirmation
TP15
5. Adjust the frequency of TP19 executing the command setfreq 00 xx (where xx

is the value) so that the reading of the frequency counter is 10.368000MHz
10Hz.
Remove the Antenna before starting steps from 1 to 5.
IC4, IC3, C54,
L3, C57,
R112, R18,
<Setting>
C61, C58
Test mode: PP
RFPI: 0102030405
Traffic Channel: 5
Traffic Slot: 4
Mode: Loopback
3. Execute the command regcmd60.
(J)* Modulation Check and

Adjustment
TP15
(K)*
Frequency Offset
Confirmation
(L)*
Sensitivity Receiver
Confirmation
(M)*
Timing Confirmation
(N)*
RSSI Level
Confirmation
5. Confirm that the NTP value at A201 (TP15) is 20dBm ~ 25dBm.

Follow steps 1 to 4 of (I) above.
5. Confirm that the B-Field Modulation is 340kHz/div ~ 402kHz/div using data
type Fig31.
IC4, IC3, C54,

L3, C57,
R112, R18,
C61, C58
6. Adjust the B-Field Modulation if required. (Execute the command Readmod

and Writemod xx, where xx is the value.)
IC4, IC3, C54,
5. Confirm that the frequency offset is -50kHz ~ +50kHz.
L3, C57,
R112, R18,
C61, C58
IC4, IC3, C54,
L3, C57,
R112, R18,
6. Confirm that the BER is < 1000ppm.
C61, C58
IC4, IC3, C54,
5. Confirm that the Timing accuracy is < 2.0ppm.
L3, C57,
R112, R18,
C61, C58
IC4, IC3, C54,
L3, C57,
R112, R18,
6. Execute the command readrssi.
C61, C58
7. Confirm: 25 < returned value < 43 (hex) (34 F (hex))
34
Items
(O)*
Receive Audio Check

and Confirmation
Adjustment
Point
TP15
Procedure
<Setting>
Test mode: PP
Mode: Normal
Check or
Replace Parts
IC4, C67, C68,
D7, D6, IC3,
C54, L3, C57,
R112, R18,
C61, C58
RFPI: 0102030405
5. Execute the command openaudio.
6. Confirm that the value of EEPROM address F3F is 02. (If the value is not
02 (by User), set 02 and power off and power on, and return to clause 2.)
7. Input audio signal (50mVrms/1kHz tone) from DECT tester.
Scramble: On
AF Gen. to ADPCM: On
AF Meter Input: AF Voltm
8. Confirm hearing tone: 300mVrms 250mVrms (Just check Audio path)
(P)*
Transmit Audio Check

and Confirmation
TP15
9. Confirm that the audio distortion with DECT tester is < 5%.
<Setting>
Test mode: FP
Mode: Normal
RFPI: 0102030405
5. Execute the command openaudio.
6. Confirm that the value of EEPROM address F3F is 02. (If the value is not
02 (by User), set 02 and power off and power on, and return to clause 2.)
7. Input audio signal (30mVrms/1kHz tone) to DECT tester.
Scramble: On
AF Gen. to ADPCM: Off
AF Meter Input: ADPCM
8. Confirm hearing tone: 300mVrms 250mVrms (Just check Audio path)
(Q)
Audio Check and

Confirmation
9. Confirm that the audio distortion with DECT tester is < 5%.
1. Link to BASE which is connected to Line Simulator.
3. Input -45dBm/1KHz to MIC and measure Line output level.
4. Confirm that the level is -9 2dBm and that the distortion level is < 5% at TEL
Line (600 Load).
5. Input -20dBm/1KHz to Line I/F and measure Receiving level at SP+ and SP-.
6. Confirm that the level is -23 2dBm and that the distortion level is < 5% at
Receiver. (vol = middle, 150 Load)
35
IC4, C8, R7,

R8, C6, C7,
C5, R5, R1,
C4, IC3, C54,
L3, C57,
R112, R18,
C61, C58
9.2.
The Setting Method of JIG (Handset)
9.2.1.
9.2.1.1.
Preparation
Equipment Required
DECT tester: Rohde & Schwarz, CMD 60 is recommended.

Frequency counter: it must be precise to be able to measure 1Hz (precision; 4ppm).
Hewlett Packard, 53131A is recommended.
DC power: it must be able to output at least 1A current under 2.4V for Handset, 9V for JIG.
Digital multi-meter (DMM): it must be able to measure voltage and current.
Oscilloscope
9.2.1.2.
JIGs and PC
EEPROM serial JIGs

1. I2C PCB: PQZZTCD420BX
2. RS232C cable: PQZZ1CD705BX
3. Clip cable: PQZZ2CD705BX
4. DC cable: PQZZ3CD705BX
PC which runs in DOS mode.
Batch file CD-ROM for setting: PQZZTG1100FX
9.2.2.
9.2.2.1.
PC Setting
Connections
Connect the DC Power or Battery to TP3 and TP4 (Handset).

Connect the RS232C cable to the Serial Port of PC.
Connect the DC cable to the DC Power.
Connect the Clip cable GND.
Connect the Clip cable SCL and SDA.
Note:
*: Com port names may vary depending on what your PC calls it.
36
9.2.2.2.
PC Setting
Note:
***** varies depending on the country.
See the table below for frequently used commands.
Command name
rdeeprom
Function
Read the data of EEPROM
readid
writeid
setfreq
Getchk
Wreeprom
Read ID (RFPI)
Write ID (RFPI)
adjust Frequency of RFIC
Read checksum
write eeprom
Example
Type rdeeprom 00 00 FF, and the data from address 00 00 to FF is
read out.
Type readid, and the registered ID is read out.
Type writeid 00 18 E0 0E 98, and the ID 0018 E0 0E 98 is written.
Type setfreq nn nn.
Type getchk.
Type wreeprom 01 23 45. 01 23 is address and 45 is data to be written.
37
Adjustment Standard (Handset)
38
R26
C68
4.0V
VBACK
SDA
SCL
TP6
(*1) Refer to Connections (P.36)
C67 D7
OSC
AF
Volt Meter
150
REV+
TP2
TP2
(A) - (P) is referred to Check Point (Handset) (P.33)
BUZ
REVTP1
C66
C201 C203
C202
(C) (E) (F) (H)

(I) (O) (P)
C34
4.0V
C60
Digital
(A)
Volt Meter
GND
TP19
Frequency
(H)
Counter
GND
C57
L3
Digital
(B)
Volt Meter
VBACK
REV
TP19
Note:
D4
PC
VBACK+
GND
D6
R27
IC3
GND
TP15
GND
(D) Oscilloscope
C5
GND
C21
PQUP11406Z
D3
LED102
D102
SCL
IC2
C15
C116
C27
TP102
TP101
TP1
SDA
R5
R1
C3
GND
R11
Q104
A201
Current
Probe
C204 C26 C28 C29 C8

8
C22
Q4
C14
C54
C62
R18
R112
R17
C65
TP15
C71
(D)
TP6
R6
R101
R2
TP22
81
80
D1
R4
50
51
R102
Q1
R111
LED101
R110
C7 R8
R7 C30
IC4
1
100
L2
TP17
R21
C32
GND
TP16
C64 C61 C56 C55
DC
6V
L5
F1
MIC+
Q3
C4
C6
Q2
30
31
C20
KX-TG1100/KX-TGA110
BAT
TP17
C108
(D) (E)
TP5
C16 C23
BATT
TP23
TP23
DECT Tester
CMD60
(I) (J) (K) (L)

(M) (N) (O) (P)
C58
6.3V47 F
C1
C24
R12
MIC-
D5
L4
R19
D2
X1
BATTERY+
C18
+ MIC+
BATTERY-
TP22
Batt Low Check

2.3V
Power Key
PbF
MIC-
TP5
600
AF
OSC
DC POWER
2.30 - 2.60V
Talk Key
R113
AF
Generator
Dummy Base
Unit
LOOP
Simulator
AF VOLT
METER
OSC
(F) (G)
9.3.
C33
TP16
R103
10 THINGS TO DO AFTER REPLACING IC

Cautions:
Since this page is common to each country, it may not apply to some models in your country. The contents below are the
minimum adjustments required for operation.
10.1. Base Unit

Before doing the following adjustment, be sure to do PC Setting (P.28) in The Setting Method of JIG (Base Unit).
BBIC
EEPROM
IC
Programs for Voice processing, interface for RF and
EEPROM
Adjustment parameter data
(country version batch file, default batch file, etc.)
Necessary Adjustment
1. Clock adjustment: Refer to Check Point (E). (*1)
1. Default batch file: Execute the command Default4KB.
2. Country version batch file: Execute the command
1100XXvYY. (*2)
3. Clock adjustment: Refer to Check Point (E). (*1)
Note:
(*1) Refer to Check Point (Base Unit) (P.23)
(*2) XX: country code, YY: revision number
XX and YY vary depending on the country version. You can find them in the batch file, PQZZ- mentioned in JIGs and PC
(P.28).
10.2. Handset
Before doing the following adjustment, be sure to do PC Setting (P.36) in The Setting Method of JIG (Handset).
BBIC
EEPROM
IC
Programs for Voice processing, interface for RF and
EEPROM
Necessary Adjustment
1. Clock adjustment: Refer to Check Point (H). (*3)
2. 4.0 V setting and battery low detection: Refer to Check Point
(A), (F) and (G). (*3)
1. Default batch file: Execute the command Default.
Adjustment parameter data

(country version batch file, default batch file, etc.)
2. Melody Initialize batch file; Execute the Command D45MFA.

3. Country version batch file: Execute the command
110XXvYY. (*4)
4. Clock adjustment: Refer to Check Point (H). (*3)
5. 4.0 V setting and battery low detection: Refer to Check Point
(A), (F) and (G). (*3)
Note:
(*3) Refer to Check Point (Handset) (P.33)
(*4) XX: country code, YY: revision number
XX and YY vary depending on the country version. You can find them in the batch file, PQZZ- mentioned in JIGs and PC
(P.36).
39
11 RF SPECIFICATION
11.1. Base Unit
Item
TX Power
Modulation
Frequency Offset
RX Sensitivity
Timing Accuracy
RSSI Level
Value
More than 20 dBm ~ 25 dBm
340 kHz/div ~ 402 kHz/div
-50 kHz ~ +50 kHz
< 1000 ppm
< 2.0 ppm
34 hex F hex
Refer to -. *
Check Point (Base Unit) (H)
Check Point (Base Unit) (I)
Check Point (Base Unit) (J)
Check Point (Base Unit) (K)
Check Point (Base Unit) (L)
Check Point (Base Unit) (M)
*: Refer to Check Point (Base Unit) (P.23)
11.2. Handset
Item
TX Power
Modulation
Frequency Offset
RX Sensitivity
Timing Accuracy
RSSI Level
Value
More than 20 dBm ~ 25 dBm
340 kHz/div ~ 402 kHz/div
-50 kHz ~ +50 kHz
< 1000 ppm
< 2.0 ppm
34 hex F hex
Refer to -. **
Check Point (Handset) (I)
Check Point (Handset) (J)
Check Point (Handset) (K)
Check Point (Handset) (L)
Check Point (Handset) (M)
Check Point (Handset) (N)
**: Refer to Check Point (Handset) (P.33)
12 HOW TO CHECK THE HANDSET SPEAKER

1. Prepare the digital voltmeter, and set the selector knob to ohm meter.
2. Put the probes at the speaker terminals as shown below.
40
13 FREQUENCY TABLE (MHz)

Channel No
1
2
3
4
5
6
7
8
9
10
BASE UNIT
Transmit Frequency
Receive Frequency
1897.344
1897.344
1895.616
1895.616
1893.888
1893.888
1892.160
1892.160
1890.432
1890.432
1888.704
1888.704
1886.976
1886.976
1885.248
1885.248
1883.520
1883.520
1881.792
1881.792
Note:
Channel No. 10: In the Test Mode on Base Unit and Handset.
41
HANDSET
Transmit Frequency
Receive Frequency
1897.344
1897.344
1895.616
1895.616
1893.888
1893.888
1892.160
1892.160
1890.432
1890.432
1888.704
1888.704
1886.976
1886.976
1885.248
1885.248
1883.520
1883.520
1881.792
1881.792
to AC Adaptor
to Tel_Line
A
B
J2
J1
42
2.65V
Reg.
4.0V
Reg.
Limit
Resistor
2.65V
4.0V
VUNREG
CHARGE
CONTACT
BBIC
Interface
Bridge
Rect
IC1
EEPROM
Hook
Switch
6
5
SCL
SDA
DTXAF
DTXAF
HOOK
Audio
41
40
27
26
61
TXAF 28
RXAF 24
14 BLOCK DIAGRAM (BASE UNIT)
CPU
Analog
Front End
D/A
A/D
DSP
ADPCM
Codec Filter
Speech Decoding
Speech Encoding
BBIC
IC2
BMC
16
18
30
11
63
64
6
9
5
XTAL
10
IC3
5
12
4 31
19
10.368
MHz
RF Module
SYEN
RSSI
SYRI
TXDA
RXDA
ANT1
ANT2
KX-TG1100/1102 BLOCK DIAGRAM (BASE UNIT)
RF
Interface
Burst Decoding
Burst Building
15 CIRCUIT OPERATION (BASE UNIT)

15.1. Outline
Base Unit consists of the following ICs as shown in BLOCK DIAGRAM (BASE UNIT) (P.42).
DECT BBIC (Base Band IC): IC2
Handling all the audio, signal and data processing needed in a DECT base unit
Controlling the DECT specific physical layer and radio section (Burst Module Controller section)
ADPCM codec filter for speech encoding and speech decoding (DSP section)
Echo-cancellation and Echo-suppression (DSP section)
Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)
DTMF receiver (DSP section)
Clock Generation for RF Module
ADC, DAC, timer, and power control circuitry
All interfaces (ex: RF module, EEPROM, LED, Analog Front End, etc.)
RF Module: IC3
PLL Oscillator
Detector
Compress/Expander
First/Second Mixer
Amplifier for transmission and reception
EEPROM: IC1
Temporary operating parameters (for RF, etc.)
Additionally,
Power Supply Circuit (+4.0V, +2.65V output)
Crystal Circuit (10.368MHz)
Charge Circuit
Telephone Line Interface Circuit
43

The power is supplied to the DECT BBIC, RF Module, EEPROM, Relay Coil, LED and Charge Contact from AC Adaptor (+6V)
as shown in Fig.101. The power supply is as follows:
<Fig.101>
44
15.3. Telephone Line Interface

<Function>
Bell signal detection
Clip signal detection
ON/OFF hook circuit
Audio circuits
Bell & Clip (: Calling Line Identification Presentation: Caller ID) signal detection:
In the standby mode, Q2 is open to cut the DC loop current and decrease the ring load.
When ring voltage appears at the TP3 (A) and TP40 (B) leads (when the telephone rings), the signal is transferred as follows;
A C4 R2 R29 IC2 (DLP) [BELL & CLIP]
B C3 R1 R30 IC2 (DLP) [BELL & CLIP]
ON/OFF hook circuit:
In the standby mode, Q2 is open, and connected as to cut the DC loop current and to cut the voice signal. The unit is
consequently in an off-hook condition.
When IC2 detects a ring signal or press the TALK Key onto the handset, Q3 turns on and then Q2 turns on, thus providing an
off-hook condition (active DC current flow through the circuit) and the following signal flow is for the loop current.
A D2 Q2 R8 Q6 R19 R20 D2 B [OFF HOOK]
Audio circuits:
Refer to SIGNAL ROUTE (P.49).
15.4. Transmitter/Receiver
Base Unit and Handset mainly consist of RF Module and DECT BBIC.
Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency.
Signal Path:
*Refer to SIGNAL ROUTE (P.49).
15.4.1. Transmitter Block

The voice signal input from the TEL LINE interface goes to RF Module (IC3) through DECT BBIC (IC2) as shown in BLOCK
DIAGRAM (BASE UNIT) (P.42)
The voice signal passes through the analog part of IC2 where it is amplified and converted to a digital audio stream signal. The
burst switch controller processes this stream performing encryption and scrambling, adding the various other fields to produce
the GAP (Generic Access Profile) standard DECT frame, assigning to a time slot and channel etc.
In IC3, the carrier frequency is changing, and frequency modulated RF signal is generated and amplified, and radiated from
antenna. Handset detects the voice signal or data signal in the circuit same as the following explanation of Receiver Block.
15.4.2. Receiver Block

The signal of 1.9 GHz band (1.881792 GHz ~ 1.897344 GHz) which is input from antenna is input to IC3 as shown in BLOCK
DIAGRAM (BASE UNIT) (P.42).
In IC3, the signal of 1.9 GHz band is demodulated, and goes to IC2 as GAP (Generic Access Profile) standard DECT frames.
It passes through the decoding section burst switch controller where it separates out the frame information and performs deencryption and de-scrambling as required. It then goes to the DSP section where it is turned back into analog audio. This is
amplified by the analog front end, and goes to the TEL LINE Interface.
15.5. Pulse Dialling

During pulse dialing the hookswitch (Q2,Q3) is used to generate the pulses using the HOOK control signal, which is set high
during pulses. To force the line impedance low during the pause intervals between dial pulses, the PULSE_DIAL signal turns
on Q7.
45
16 BLOCK DIAGRAM (HANDSET)
ANT
42
EARPIECE
D/A
41
46
45
MIC
A/D
Speech
Decoding
Burst
Decoding
Speech
Encoding
Burst
Encoding
12 RXDA
16 TXDA
48 RSSI
Analog
Front
End
ADPCM
Codec
Filter
RF
Interface
DSP
BMC
TP5 +
CHARGE
CONTACTS
13 SYEN
4
RF
Module
5
IC3
12
10
33 XTAL
CHARGE
CIRCUIT
CHARGE 38
CHARGE DETECT 27
10.368
MHz
31
TP6
6
SCL 67
SDA 66
EEPROM
IC2
Battery+
BATTERY
TERMINAL
23 SYRI
19
ON SWITCH
26
34
VDDBAT 36
SWITCHED
SUPPLY
53~55, 59, 60
ROWS
SWITCH 28
Battery-
KEYPAD
17~21
CPU
COLUMNS
4.0V
D3
VDDLR 37
4.0V
IC4
LCD
14 Seg
Display
pin 2, 5~9
COM 0~5
segment 0~29
RINGER
70
BBIC
pin1, 90~100, 87, 78~84,
72~76, 61, 62, 56~58
Q104
88
4.0V
LED101
LED102
KX-TGA110 BLOCK DIAGRAM (HANDSET)
Q4
46
17 CIRCUIT OPERATION (HANDSET)

17.1. Outline
Handset consists of the following ICs as shown in BLOCK DIAGRAM (HANDSET) (P.46).
DECT BBIC (Base Band IC): IC4
All data signals (forming/analyzing ACK or CMD signal)
All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD)
RF Module: IC3
PLL Oscillator
Detector
Compress/Expander
Amplifier for transmission and reception
EEPROM: IC2
Temporary operating parameters (for RF, etc.)
17.2. Power Supply Circuit/Reset Circuit

Circuit Operation:
When power on the Handset, the voltage is as follows;
BATTERY (2.2 V ~ 2.6V: TP3) 4.0V IC3 (6, 25), D3 IC4 (37) IC4 (39, 63) (2.65V)
The Reset signal generates R19, C23 and 2.65V.
17.3. Charge Circuit

Circuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;
DC+ (5.5V ~ 6V) D4 R43, R44 CHARGE+ (Base) CHARGE+ (Handset) L4 Q2 F1 BATTERY+... Battery...
BATTERY- R21 GND L5 CHARGE- (Handset) CHARGE- (Base) GND DC- (GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q2 of Handset.
Refer to Fig.101 in Power Supply Circuit (P.44).
17.4. Battery Low/Power Down Detector

Circuit Operation:
Battery Low and Power Down are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
Battery Low
Battery voltage: V (Batt) < 2.3V
The BBIC detects this level and
starts flashing and battery alarm starts ringing.
Power Down
Battery voltage: V (Batt) < 2.2V
The BBIC detects this level and power down.
47
18 CIRCUIT OPERATION (CHARGER UNIT)

The power supply is as shown.
48
19 SIGNAL ROUTE
49
20 CPU DATA (BASE UNIT)

20.1. IC2 (BBIC)
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
Description
VDD
VSS
PA_Driver_Amp
TX/RX SW
RX_Data
PLL_Strobe
PLL_Data
PLL_Clk
TX_Data
(NO USE)
RF_System_Clk
VDD
VSS
RESETQ
VDDPM
VSSO
LOAD
XTAL
VDDLR
LRB
VDDA
VSSA
Audio_Out_N
Audio_Out_P
Bandgap_Ref
Differential_Line_P
Differential_Line_N
Audio_In_N
ADC_Ref
RSSI
AD2(MPCINP)
AD3
(NO USE)
(NO USE)
(NO USE)
(NO USE)
VDD
VSS
Supply_EEP
Serial_Data(I2C)
Serial_Clk(I2C)
MODE
(NO USE)
(NO USE)
VBACK
(NO USE)
(NO USE)
VDD
(NO USE)
(NO USE)
(NO USE)
(NO USE)
VSS
VDD
KEY_IN
(NO USE)
PULSE_CTRL
(NO USE)
(NO USE)
(NO USE)
HOOK_CTRL
(NO USE)
I/O
D.O
D.O
D.I
D.O
D.O
D.O
D.O
D.O
D.O
A.I
D.O
D.I
A.I
A.I
A.I
A.I
A.O
A.O
A.I
A.I
A.I
A.I
A.I
A.I
A.I
A.I
D.I
D.I
D.I
D.I
D.O
D.I/O
D.O
D.I
D.O
D.O
A.I
D.I
D.I
D.I
D.I
D.I
D.I
D.I/O
D.I/O
D.I/O
D.I/O
D.I/O
D.O
D.I/O
Hi
PA_ON
TX
Data
Latch
Normal
(I_PU)
(I_PU)
(I_PU)
(I_PU)
(Fixed)
(Fixed)
No Key
Q7_ON
Make
-
50
Hi-z
-
Low
PA_OFF
RX
Data
Normal
Reset
(Fixed)
(Fixed)
(I_PD)
(Fixed)
(Fixed)
(Fixed)
(Fixed)
Key
(I_PD)
Q7_OFF
(I_PD)
(I_PD)
(I_PD)
Break
(I_PD)
Remarks
10.368 MHz
for Bell Clip
for Bell Clip
for Polarity
for Polarity
-
Pin
63
64
Description
ANT1
ANT2
I/O
D.O
D.O
Hi
ANT1_ON
ANT2_ON
Note:
I_PU; Internal Pull-Up, I_PD; Internal Pull-Down
51
Hi-z
-
Low
ANT1_OFF
ANT2_OFF
Remarks
-
21 CPU DATA (HANDSET)

21.1. IC4 (BBIC)
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
Description
LCD_SEGMENT
LCD_COMMON
VDD
VSS
LCD_COMMON
LCD_COMMON
LCD_COMMON
LCD_COMMON
LCD_COMMON
PA_SW
T/R SW
RX_DATA
SYEN
SYDA
SYCL
TX_DATA
KEY_IN
KEY_IN
KEY_IN
KEY_IN
KEY_IN
(NO USE)
Reference clock
VDD
VSS
POWER_SW
CHARGE_DET
DCDCDRV
DCDCCMR
RESET
VSSO
LOAD
XTAL
VDDPM
VDDLO
VDDBAT
VDDLR
CHARGE_START
VDDA
VSSA
LSRN
LSRP
BANDGAP_REF
MICS
MICP
MICN
Reference Voltage
RSSI
P0.4
AD4N
AD4P
(NO USE)
KEY_STRB
KEY_STRB
KEY_STRB
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
KEY_STRB
KEY_STRB
LCD_SEGMENT
LCD_SEGMENT
I/O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.I
D.O
D.O
D.O
A.O
D.I
D.I
D.I
D.I
D.I
D.O
D.O
A.I
A.I
D.O
A.I
A.I
A.I
A.I
A.O
A.O
A.I
A.O
A.O
A.O
A.O
A.O
A.I
A.I
A.O
A.I
D.I
A.I
A.I
D.I
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
Hi
PA ON
Transmit
No Key
No Key
No Key
No Key
No Key
SW OFF
Charge
Non Active
Active
Active
Active
Active
Active
-
52
Hi-z
-
Low
PA OFF
Recieve
Key_In
Key_In
Key_In
Key_In
Key_In
SW_ON
No_charge
Active
Non_Active
Non_Active
Non_Active
Non_Active
-
Remarks
for charge
-
Pin
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
Description
VDD
VSS
VDD for EEPROM
I2DAT
I2CLK
MODE
R2
RINGER
VBACK/P0.7
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
VDDLI
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
VSS
VDD
LCD_SEGMENT
LED_ON
Power Select
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
LCD_SEGMENT
I/O
D.O
D.I/O
D.I/O
D.I
D.I
D.O
D.I
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
D.O
Hi
RINGER_ON
LED_ON
Low Power
-
53
Hi-z
-
Low
RINGER_OFF
LED_OFF
High Power
-
Remarks
-
22 ENGINEERING MODE
22.1. Base Unit
Note:
(*1) Refer to For Service Hint (P.11).
54
Note:
*: When you enter the address, please refer to the table below.
Desired Number (hex)
0
1
.
.
.
9
Input Keys
0
1
.
.
.
9
Desired Number (hex)

A
B
C
D
E
F
Input Keys
[R] + 0
[R] + 1
[R] + 2
[R] + 3
[R] + 4
[R] + 5
ex.)
Items (*2)
C-ID (FSK) sensitivity
C-ID (DTMF) sensitivity
Frequency
ID
Bell length
PULSE Dial speed
(10PPS -> 20PPS)
Address
0A1D~0A1E
Default Data
00 6D
0A 2D
34
00 00~00 01
00 20~00 24
00 60
Given value
0F 12
0F 06
0F 07
0F 0A
New Data
(3dB up)
(6dB up)
00 A4
00 E7
(3dB up)
(6dB up)
38
3C
-
64 (10sec) (*1)
1E (3sec)
28 (40msec) (*1) 14 (20msec)
3C (60msec) (*1) 1E (30msec)
4A (740msec) (*1) 2C (440msec)
14 (2sec)
-
Remarks
When hex changes from 006D to 00A4 or
00E7, gain increases by 3dB or 6dB.
When hex changes from 34 to 38 or 3C, gain
increases by 3dB or 6dB.
Use these items in a READ-ONLY mode to confirm
the contents. Careless rewriting may cause serious
damage to the computer system.
This is time until bell stops ringing. (Unit: 100ms)
This is pulse make time. (Unit:1ms)
This is pulse break time. (Unit:1ms)
This is inter-digit time in pulse mode. (Unit:10ms)
(*1)
Bell length
PULSE Dial speed
(10PPS -> 20PPS)
64 (hex) = 100 (dec) 100 100msec = 10000msec (10sec)

28(hex) = 40(dec) 40 1msec = 40msec
3C(hex) = 60(dec) 60 1msec = 60msec
4A(hex) = 74(dec) 74 10msec = 740msec
(*2)
Items
C-ID (FSK) sensitivity
C-ID (DTMF) sensitivity
Frequency
ID
Bell length
PULSE Dial speed
(10PPS -> 20PPS)
Description
FSKGain_shiftgain
Foutgains:HPFilter Foutgains
Setting value of FREQ_TRIM_REG
ID
Time until it stops bell.
Pulse MakeTime and BreakTime.
bMakeTime:Pulse MakeTime Unit: 1ms
bBreakTime:Pulse Break Time Unit: 1ms
Inter-digit time in Pulse mode.
Unit:10ms
55
22.2. Handset
Note:
(*1) Refer to For Service Hint (P.11).
56
Note:
*: When you enter the address, please refer to the table in Note: (P.55) of ENGINEERING MODE.
ex.)
Items (*4)
Sending level
Receiving level
Battery Low
Frequency
ID
Address
Default Data
New Data
0F 35
0F 37
0F 04
00 00~00 01
00 30~00 34
Adjusted value
Adjusted value
9A
00 60
Given value
Given value
Given value
-
Possible Adjusted
Value MAX (hex)
30
70
-
Possible Adjusted
Value MIN (hex)
00
40
-
Remarks
(*1)
(*2)
(*3)
(*1) When adding 01 (hex) to default value, sending level

increases by 1.0dB.
(*2) When reducing 01 (hex) from default value, receiving

level increases by 1.0dB.
ex.)
ex.)
Item
Sending level
Default Data
1C
-9.0dBm
New Data
1D
1B
-8.0dBm
-10.0dBm
Item
Receiving level
Default Data
5B
-23.0dBm
New Data
5A
5C
-24.0dBm
-22.0dBm
(*3) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the
Handset.
(*4)
Items
Sending level
Receiving level
Battery Low
Frequency
ID
Description
Analog Front End MIC Setting for Handset Mode
Analog Front End LSR Setting for Handset Mode
ADC value for battery low detection
Setting value of FREQ_TRIM_REG
International Portable Part Equipment Identities
57
23 HOW TO REPLACE THE FLAT PACKAGE IC

Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount),
a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
23.1. PREPARATION
PbF (: Pb free) Solder
Soldering Iron
Tip Temperature of 700F 20F (370C 10C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
Flux
Recommended Flux: Specific Gravity 0.82.
Type RMA (lower residue, non-cleaning type)
Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free) (P.4).
23.2. FLAT PACKAGE IC REMOVAL PROCEDURE

1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the land with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
58
23.3. FLAT PACKAGE IC INSTALLATION PROCEDURE

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering

foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
23.4. BRIDGE MODIFICATION PROCEDURE

1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
59
24 CABINET AND ELECTRICAL PARTS (BASE UNIT)
60
25 CABINET AND ELECTRICAL PARTS (HANDSET)
Note:
(*1) The rechargeable Ni-MH battery P03P (HHR-4EPT or HHR-55AAAB) is available through sales route of Panasonic.
(*2) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.16).
(*3) Attach the spacer (No. 117) to the exact location described above.
61
26 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
62
27 ACCESSORIES AND PACKING MATERIALS

27.1. KX-TG1100FXS/FXT
63
27.2. KX-TG1102FXS
64
28 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND

DIODES
28.1. Base Unit
28.2. Handset
28.3. Charger Unit
65
29 REPLACEMENT PARTS LIST

1. RTL (Retention Time Limited)
Ref.
No.
Note:
The marking (RTL) indicates that the Retention Time is
limited for this item.
After the discontinuation of this assembly in production,
the item will continue to be available for a specific period
of time. The retention period of availability is dependant
on the type of assembly, and in accordance with the
laws governing part and product retention. After the end
of this period, the assembly will no longer be available.
4. ISO code (Example: ABS-94HB) of the remarks column

shows quality of the material and a flame resisting grade
about plastics.
5. RESISTORS & CAPACITORS
Unless otherwise specified;
All resistors are in ohms () K=1000, M=1000k
All capacitors are in MICRO FARADS (F)P=F
*Type & Wattage of Resistor
29.1. Base Unit

29.1.1. Cabinet and Electrical Parts
PQGG10245U7
1
2
3
PQGG10245U9
PQQT23107Z
PQKM10586W3
PQKM10586W2
PQJT10203Z
PQKF10581Z2
7
8
PQHA10023Z
PQGT18687Z
PQGT18687X
GUIDE, CHARGE TERMINAL

POM-HB
CABINET
COVER
(for
KX- PS-HB
TG1100FXS) (for KX-TG1102FXS)
CABINET
COVER
(for
KX- PS-HB
TG1100FXT)
RUBBER PARTS, FOOT CUSHION
NAME PLATE (for KX-TG1100FXS)
(for KX-TG1102FXS)
NAME PLATE (for KX-TG1100FXT)
(*1) When replacing IC1 and IC2, data need to be written to

it with PQZZTG1100FX.
3. The S mark means the part is one of some identical parts.

For that reason, it may be different from the installed part.
PQKE10356Z2
PQKF10581Z3
Remarks
Note:
Components identified by the

mark indicates special
characteristics important for safety. When replacing any of
these components, only use specified manufactures parts.
Part No.
5
6
Part Name & Description
29.1.2. Main P.C.Board Parts
2. Important safety notice
Ref.
No.
Part No.

GRILLE
(for
KX-TG1100FXS)
(for KX-TG1102FXS)
GRILLE (for KX-TG1100FXT)
LABEL, ATTENTION
CABINET
BODY
(for
KXTG1100FXS) (for KX-TG1102FXS)
CABINET
BODY
(for
KXTG1100FXT)
CHARGE TERMINAL
Remarks
ABS-HB
ABS-HB
PS-HB
PS-HB
66
Ref.
No.
PCB1
Part No.
PQWPG1100FXH
IC1
IC2
Q9
PQWICD150EH
C2HBAK000012
C0CBAYF00016
Q2
Q3
Q6
Q7
Q8
B1ACGP000007
PQVTBF822T7
2SD1994A
B1ABCE000009
B1ADGE000004
D2
D3
D4
D5
DA1
B0EDER000009
PQVDRLZ20A
B0JAME000095
MA2Z74800L
B0DDCM000001
J1
J2
K2LB102B0053
PQJJ1B4Y
L1
L3
PQLQR4D4R7K
G1C4N7Z00007
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
R16
R18
R19
R20
R21
R22
R23
R24
R25
R26
R27
R28
R29
R30
R31
R32
R38
R41
R42
ERJ3GEYJ155
ERJ3GEYJ155
ERJ3GEYJ224
ERJ3GEYJ184
ERJ3GEYJ224
ERJ3GEYJ184
ERJ3GEYJ104
ERJ3GEYJ272
ERJ3GEYJ103
ERJ3GEYJ472
ERJ3GEYJ133
ERJ3GEYJ392
ERJ12YJ220
ERJ12YJ560
ERJ3GEYJ104
ERJ3GEYJ333
ERJ3GEYJ680
PQ4R18XJ100
ERJ3GEYJ391
ERJ3GEYJ103
ERJ3GEYJ681
ERJ3GEYJ751
ERJ3GEYJ101
ERJ3GEYJ101
ERJ3GEYJ101
ERJ3GEY0R00
ERJ3GEYJ330
ERJ3GEYJ101
ERJ3GEYJ221

MAIN P.C.BOARD ASSY (RTL)
(ICs)
IC (EEPROM) (*1)
IC (BBIC) (*1)
IC
(TRANSISTORS)
TRANSISTOR(SI)
TRANSISTOR(SI)
TRANSISTOR(SI)
TRANSISTOR(SI)
TRANSISTOR(SI)
(DIODES)
DIODE(SI)
DIODE(SI)
DIODE(SI)
DIODE(SI)
DIODE(SI)
(JACKS)
JACK, MODULATOR
JACK, DC
(COILS)
COIL
COIL
(RESISTORS)
1.5M
1.5M
220K
180K
220K
180K
100K
2.7K
10K
4.7K
13K
3.9K
22
56
100K
33K
68
10
390
10K
680
750
100
100
100
0
33
100
220
Remarks
S
S
Ref.
No.
R43
R44
R54
R57
R59
R61
R66
R67
R78
R79
R82
L5
Part No.
ERJ1WYJ330
ERJ1WYJ330
ERJ3GEYJ184
ERJ3GEYJ103
ERJ3GEYJ471
ERJ2GEJ470
ERJ3GEYJ180
ERJ3GEYJ151
ERJ3GEYJ151
ERJ3GEYJ180
ERJ3GEYJ184
ERJ2GE0R00
C1
C2
C3
C4
C7
C11
C12
C13
C14
C15
C16
C18
C19
C20
C21
C23
C24
C25
C26
C27
C28
C29
C30
C31
C32
C33
C34
C35
C36
C37
C38
C40
C41
C42
C48
C53
C54
C56
C58
C59
C66
C67
C69
C72
C73
C83
C94
C96
C97
C98
C100
C101
C105
C106
L58
ECKD2H681KB
ECKD2H681KB
ECQE2223KF
ECQE2223KF
PQCUV1A225KB
ECUV1C223KBV
PQCUV1C474KB
ECUV1A105KBV
PQCUV1C474KB
ECEA1HKA100
PQCUV1H154KR
ECUV1H100DCV
ECUV1H100DCV
ECUV1C104KBV
ECUV1H100DCV
ECUV1C104KBV
ECUV1C104KBV
ECEA1CKS100
ECUV1C104KBV
ECUV1C104KBV
ECUV1C683KBV
ECUV1C683KBV
ECJ0EB1H182K
ECJ0EB1A104K
ECUV1H270JCV
ECUV1H1R0CCV
ECUV1C104KBV
ECUV1C333KBV
ECUV1C104KBV
ECUV1C104KBV
ECUV1C104KBV
ECEA1CK101
ECEA0JKA101
ECUV1H030CCV
ECUV1H330JCV
ECUV1H100DCV
ECUV1H060DCV
ECUV1H100DCV
ECUV1H100DCV
ECUV1H100DCV
ECUV1H020CCV
ECUV1A475KB
ECUV1H100DCV
ECUV1H0R5CCV
ECUV1H100DCV
ECJ1VC1H1R5C
ECUV1H0R5CCV
ECUV1H100DCV
ECUV1H100DCV
PQCUV1H0R5CC
ECUV1H100DCV
ECUV1H100DCV
ECUV1H030CCV
ECUV1H030CCV
ECUV1H020CCV
E1
E2
IC3
S1
PQSA10132Z
PQSA10182Z
PQLP10268Z
K0H1BB000018

33
33
180K
10K
470
47
18
150
150
18
180K
0
(CAPACITORS)
680P
680P
0.022
0.022
2.2
0.022
0.47
1
0.47
10
0.15
10P
10P
0.1
10P
0.1
0.1
10
0.1
0.1
0.068
0.068
0.0018
0.1
27P
1
0.1
0.033
0.1
0.1
0.1
100
100
3P
33P
10P
6P
10P
10P
10P
2P
4.7
10P
0.5P
10P
1.5P
0.5P
10P
10P
0.5P
10P
10P
3P
3P
2P
(OTHERS)
ANTENNA, SUB
ANTENNA, MAIN
RF UNIT
SPECIAL SWITCH, TACTILE
Remarks
Ref.
No.
SA1
X1
Part No.
J0LF00000026
H0D103500003
Remarks
VARISTOR (SURGE ABSORBER)

CRYSTAL OSCILLATOR
29.2. Handset
S
S
Ref.
No.
101
101
102
103
Part No.
PQGP10311Z1
PQGP10311Z3
PQHS10737Z
PQKM10722Z1
103
PQKM10722Z3
104
105
106
PQHS10738Z
PQBC10375Z1
PQSX10310W
106
PQSX10310Z
107
108
109
110
111
PQJT10204Z
PQJT10205Z
PQHG10684Z
L0DACD000002
PQKF10582YE
111
PQKF10582Y8
112
113
114
115
115
116
PQJC10056Y
PQJC10077Z
PQJC10076Z
PQGT18689Z
PQGT18689X
PQHX11393Z
117
118
PQHS10561Y
PQKK10134XP
118
PQKK10134XD

PANEL, LCD (for KX-TGA110FXS)
PANEL, LCD (for KX-TGA110FXT)
TAPE, DOUBLE SIDE
CABINET
BODY
(for
KXTGA110FXS)
CABINET
BODY
(for
KXTGA110FXT)
SPACER, LCD
PUSH BUTTON, NAVI
KEYBOARD
SWITCH
(for
KXTGA110FXS)
KEYBOARD
SWITCH
(for
KXTGA110FXT)
TERMINAL (L)
TERMINAL (R)
RUBBER PARTS, RINGER
BUZZER
CABINET
COVER
(for
KXTGA110FXS)
CABINET
COVER
(for
KXTGA110FXT)
BATTERY TERMINAL
BATTERY TERMINAL (-)
BATTERY TERMINAL (+)
NAME PLATE (for KX-TGA110FXS)
NAME PLATE (for KX-TGA110FXT)
PLASTIC PARTS, BATTERY COVER
SHEET
SPACER, BATTERY COVER
LID, BATTERY COVER (for KXTGA110FXS)
LID, BATTERY COVER (for KXTGA110FXT)
Remarks
AS-HB
AS-HB
ABS-HB
ABS-HB
ABS-HB
ABS-HB
ABS-HB
ABS-HB
ABS-HB

Note:
(*1) When replacing IC2 and IC4, data need to be written to

it with PQZZTG1100FX.
(*2) When replacing the Handset LCD, see How to
Replace the Handset LCD (P.16).
67
Ref.
No.
PCB100
Part No.
PQWPGA110FXR
IC2
IC4
PQWICA115EXR
C2HBAY000009
Q1
Q2
Q3
Q4
Q104
B1CFMC000010
B1ADGE000004
UNR9216J0L
PSVTDTC143X
B1ABGE000006
D1
D3
D6
D7
D102
LED101
LED102
B0JCME000035
MA2Z74800L
MA8047
MA8047
MA111
B3ADB0000064
B3ADB0000064
L2
L3
G1C470M00025
PQLQR4D4R7K

(ICs)
IC (EEPROM) (*1)
IC (BBIC) (*1)
(TRANSISTORS)
TRANSISTOR(SI)
TRANSISTOR(SI)
TRANSISTOR(SI)
TRANSISTOR(SI)
TRANSISTOR(SI)
(DIODES)
DIODE(SI)
DIODE(SI)
DIODE(SI)
DIODE(SI)
DIODE(SI)
LED
LED
(COILS)
COIL
COIL
Remarks
S
S
S
Ref.
No.
L4
L5
F1
Part No.
G1C100MA0072
G1C100MA0072
PQLQR2M5N6K
R1
R2
R4
R5
R6
R7
R8
R18
R19
R21
R101
R102
R103
R110
R111
R112
ERJ2GEJ222
ERJ8BQJR30
ERJ3GEYJ103
ERJ2GEJ331
ERJ3GEYJ332
ERJ2GEJ331
ERJ2GEJ331
ERJ2GEJ330
ERJ2GEJ153
ERJ6RSJR10V
ERJ2GEJ820
ERJ2GEJ103
ERJ2GEJ102
PQ4R18XJ150
ERJ2GEJ560X
ERJ3GEYJ2R2
C1
C3
C4
C5
C6
C7
C8
C14
C15
C16
C18
C20
C21
C22
C23
C24
C26
C27
C28
C29
C30
C32
C33
C34
C54
C57
C58
C61
C67
C68
C204
F1K1C2250005
ECJ0EB1A104K
ECJ0EB1A104K
PQCUV0J475MB
ECJ0EC1H100D
ECJ0EB1A104K
ECJ0EC1H100D
EEE0JA331P
EEE0JA331P
ECJ0EC1H010C
ECJ0EB1A104K
ECJ0EB1A104K
ECJ0EB1A104K
ECJ0EB1A104K
ECJ0EB1A104K
ECJ0EB1A104K
ECJ0EB0J105K
ECJ0EB1A104K
ECJ0EB1A104K
ECJ0EB1A104K
ECJ0EB1A104K
ECJ0EB1H101K
F1K0J1060020
F1K0J1060020
ECJ0EC1H220J
ECJ0EC1H330J
F1G1HR75A561
ECUV1A105KBV
ECJ0EC1H100D
ECJ0EC1H100D
ECJ0EC1H180J
MIC
E101
E102
E103
E104
E105
E106
E107
E108
IC3
D2
X1
L0CBAY000006
PQHS10467Z
L0AD02A00021
L5ACAYY00002
PQHS10740Z
PQHX11388Z
PQHR11226Z
PQHR11225Z
PQSA10193Z
PQLP10268Z
D4ED1270A014
H0D103500006

COIL
COIL
COIL
(RESISTORS)
2.2K
0.3
10K
330
3.3K
330
330
33
15K
0.1
82
10K
1K
15
56
2.2
(CAPACITORS)
2.2
0.1
0.1
4.7
10P
0.1
10P
330
330
1P
0.1
0.1
0.1
0.1
0.1
0.1
1
0.1
0.1
0.1
0.1
100P
10
10
22P
33P
0.75P
1
10P
10P
18P
(OTHERS)
MICROPHONE
COVER, SP NET
SPEAKER
LIQUID CRYSTAL DISPLAY (*2)
TAPE, DOUBLE SIDE
COVER, LCD COVER SHEET
TRANSPARENT PLATE, LCD PLATE
GUIDE, LCD HOLDER
ANTENNA
RF UNIT
VARISTOR (SURGE ABSORBER)
CRYSTAL OSCILLATOR
Remarks
Ref.
No.
200-1
200-2
200-3
200-4
200-5
200-6
200-7
200-8
200-9
PQLV30018ZS4
Ref.
No.
PCB200
Part No.
PQWPA142ESCH
D1
B0JAME000085
CN1
PQJJ1B4Y
R1
R2
ERJ1WYJ220
ERJ1WYJ270
GRILLE
CABINET BODY
GUIDE, CHARGE TERMINAL CASE
CHARGE TERMINAL
CUSHION, URETHANE FORM
WEIGHT
CABINET COVER
NAME PLATE
RUBBER PARTS, FOOT CUSHION
Remarks
ABS-HB
PS-HB
POM-HB
PS-HB

(DIODE)
DIODE(SI)
(JACK)
JACK
(RESISTORS)
22
27
Remarks
29.4. Accessories and Packing

Materials
Note:
(*1) You can download and refer to the Operating
Instructions (Instruction book) on TSN Server.
29.4.1. KX-TG1100FXS/FXT
Ref.
No.
A1
A2
A3
A4
P1
Part No.
PQLV19CEX
PQJA10075Z
PQQX15249Z
PQQT23002Z
PQPP10100Z
P2
PQPP10084Z
P3
P4
PQPK15241Z
PQPD10726Y

AC ADAPTOR
CORD, TELEPHONE
INSTRUCTION BOOK (*1)
LABEL, WEEE
PROTECTION COVER (for
Unit)
PROTECTION
COVER
Handset)
GIFT BOX
CUSHION
Remarks
Base
(for
29.4.2. KX-TG1102FXS
PMMA-HB
ABS-HB
Ref.
No.
A1
A2
A3
A4
A5
P1
Part No.
PQLV19CEX
PQLV200CEX
PQJA10075Z
PQQX15249Z
PQQT23002Z
PQPP10100Z
P2
PQPP10084Z
P3
PQPP10086Z
P4
P5
PQPK15252Z
PQPD10667Z
Remarks
AC ADAPTOR (for Base Unit)

AC ADAPTOR (for Charger Unit)
CORD, TELEPHONE
INSTRUCTION BOOK (*1)
LABEL, WEEE
PROTECTION COVER (for Base
Unit)
PROTECTION
COVER
(for
Handset)
PROTECTION COVER (for Charger
Unit)
GIFT BOX
CUSHION
29.5. Fixtures and Tools

Note:
(*1) See The Setting Method of JIG (Base Unit) (P.28),
and The Setting Method of JIG (Handset) (P.36).

Part No.
PQGG10155YJ
PQKM10591YC
PQKE10356Z2
PQJT10206Z
PQHX10991Z
PQMH10426X
PQKF10586Z2
PQGT18766W
PQHG316Y
29.3. Charger Unit

Ref.
No.
200
Part No.
(*2) When replacing the Handset LCD, see How to

Replace the Handset LCD (P.16).
Remarks
CHARGER UNIT
68
Part No.
PQZZTCD420BX
PQZZ1CD705BX
PQZZ2CD705BX
PQZZ3CD705BX
PQZZTG1100FX
PQZZ430PIR
PQZZ430PRB

I2C PCB (*1)
RS232C CABLE (*1)
CLIP CABLE (*1)
DC CABLE (*1)
BATCH FILE CD-ROM (*1)
TIP OF SOLDERING IRON (*2)
RUBBER OF SOLDERING IRON (*2)
Remarks
69
Memo
70
30 FOR SCHEMATIC DIAGRAM

30.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. This schematic diagram may be modified at any time with the development of new technology.
30.2. Handset (SCHEMATIC DIAGRAM (HANDSET))

Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
2. The schematic diagrams may be modified at any time with the development of new technology.
30.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))

Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. This schematic diagram may be modified at any time with the development of new technology.
71
31 SCHEMATIC DIAGRAM (BASE UNIT)
L2
TP3
NC
R77
NC
NC
C1
0V ON-HOOK
+0.7V DC OFF-HOOK
TP45
D2
Q2
(1)
NC
NC
100K
R8
C60
NC
NC
R70
TP40
JMP2
R73
R7
C2
D8
NC
JMP7
2.7K
C6
NC
NC
R85
+60V DC ON-HOOK
+10V DC OFF-HOOK
SA1
60v
DC
NC
NC
D7
JMP6
C77
NC
J1
TP39
NC
C63
LINE VOL TAGE 60V DC
JMP1
680P/500V
TP5
680P/500V
Q3
NC
JMP3
Q11
NC
OPTION4
RLY1
NC
9
R1
K0.022
C4
1.5M
R2
K0.022
1.5M
K2.2u
R9
C7 10K
R72
R71
180K
R4
180K
R6
4
10
4.7K
NC
7
2
C3
NC
C62
NC
220K
C5
R3
220K
R5
NC
NC
R74
R10
NC
NC
NC
JMP4
JMP5
JMP8
+2.65V
NC
TP2
Q1
NC
(2)
NC
R54
NC
180K
C49
R53
D1
C19
D10P
D10P
100
R30
100
(3)
NC
(4)
(5)
C74
R81
NC
R82
180K
R29
C18
NC
(6)
(7)
(8)
+2.65V
SDA
SCL
TP90 +5.5V
2
3
4
A0
VCC
A1
WP
A2
SCL
(9)
(10)
(11)
(12)
7
6
5
GND SDA
32K_EEPROM
470
R59
NC
C100
D10P
6.3V100
C99
C41
C96
+5.5V
C89
NC
NC
R68
NC
NC
R90
C90 NC
C3P
2 CHARGE+
1 CHARGE-
, NC: No Components
72
NC
C92
NC
C91
NC
33
C107
33
R44
Q10
NC
NC
C42
C95 N.M
NC
R89
R43
CN4
C3P
C106
D9
R41
R42
100
VOUT
ADJ VOUT
220
C40
16V100
TP89
(13)
(14)
2
VIN
D10P
1
3
+4.0V
TP91
Q9
D4
DC_PLUG 2
GND 1
IC1
1
+4.0V DC
TP101
J2
J101
1
J102
1
J103
1
J104
1
J105
1
3
2
S1
4
1
+2.65V
NC
R58
73
RX-DATA
GND
GND
GND
TXDA
RSSI
VCC_OC
GND
SYCL
C101
RF_UNIT
IC3
D10P
4.7uH
GND
PAON
PSEL
GND
GND
RXDA
GND
GND
24
23
22
21
20
19
18
17
1V
NC
NC
C87
L59
NC
NC
C86
1
K4.7
C76
ANT
NC
C2P
D10P
C73
C84
A202
C2P
C67
C66
L3
4.7nH
R79
18
NC
C82
A201
C0.5P
C72
C1.5P
150
R78
(3)
NC
NC
NC C70
C83
C58
C71 NC
TP10
D10P
R66
R87
L83
C57
R67
D10P
FREQ 10.368MHZ
NC
R38
32
31
30
29
28
27
26
25
DA1
C88
33
GND
A_1
GND
GND
GND
GND
GND
VCC_PA
C55 NC
C54
J33P
1
2
3
4
5
6
7
8
SYDA
SYEN
RXDSG
SYRI
GND
GND
GND
GND
C59
C56 D10P
NC
C81
C6P
C48
9
10
11
12
13
14
15
16
NC
C47
L5
18
NC
TP188
D10P
D5
C78
+2.65V
NC
C102
TX-AF
NC
150
C105 C3P
K1.0
1608size
C13
R26
10K
NC
D12
NC
R92
C15
10
R24
R28
NC
D13
NC
R91
33K
R22
NC
K0.15
C17
50V10 750
C16
Q7
C93
NC
K0.47
(2)
390
C0.5P
68
C68
C80
NC
C69
R23
C14
C21
NC
R21
100K
NC
C51
R56
22
R19
R16
13K
C94
56
NC
NC
D3
D6
NC
NC
C43
R32
R20
K0.47
C12
C11
K0.022
R17
R12
NC
R57 NC
10K
NC
Q6
C98
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
K0.033
C34
NC
Q8
R18
3.9K
C79
C0.5P
(13)
(14)
D10
TP50
D10P
45:VBACK/P1.5
46:VSS(DSPCLK)
47:P1.4(TONE)
D11
C10
0V ON-HOOK
+9.8V DC OFF-HOOK
C53
IC2
NC
R13
NC
Q5
NC
K0.1
BBIC
VSSO
VDDPM
RESETQ
VSS
VDD
SYRI
PAON
TXDA
SYCL
SYDA
SYEN
RXDA
RXDSG
DRON
VSS
VDD
10.368MHz
R35
C22
C9
NC
R14
K0.1
C35
(7725:R33 N.M./R52 0ohm)

(7795:R33 1K/R52 N.M.)
K0.1
C36
TP187
NC
C103
+2.65V DC
C32
K0.1
NC
J27P
X1
100
NC
R15
NC
C1P
47
TP82
R11
C33
R61
C29
K0.068
TP97
NC
D10P
VDD
C97
PX.0
PX.1
PX.2
PX.3
VDD
VSS
SUPEEP
I2DAT
I2CLK
MODE
R2
R1
C30
K1800P
(4)
(5)
K0.1
C31
R31 C20
Q4
C37
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
NC
K0.1
NC
AD3
AD2(MPCINP)
ADRSSI
ADREF
AIN
DLN
DLP
BREF
AOP
AON
VSSA
VDDA
LRB
VDDLR
XTAL
LOAD
K0.1
C25
6.3V10
(1)
NC
C38
R33
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49 DSPIN/P1.0
50 DSPOUT/P1.1
51 DSPCLK/P1.2
52 DSPFRM/P1.3
53 VSS
54 VDD
55 P0.0
56 P0.1
57 P0.2
58 P0.3
59 P0.4
60 P0.5
61 P0.6
62 P0.7
63 ANT1
64 ANT2
K0.068
C28
(6)
(7)
(8)
NC
C23
+2.65V
C50
R36
NC
C27
K0.1
R52
K0.1
C26
(9)
(10)
(11)
(12)
K0.1
C24
0V ON-HOOK
+3.9V DC OFF-HOOK
R25
R27
680
R55
NC
D10P
RX-AF
L58
NC
L85
NC
TX-DATA
L1
TP1
R88
NC
NC
L4
10.368MHZ burst
peak
+3.1V
KX-TG1100/1102 SCHEMATIC DIAGRAM (BASE UNIT)
, NC: No Components
32 SCHEMATIC DIAGRAM (HANDSET)

4.1V DC
0V
2
(2)
Q1
10k
R2 0.3
(3)
G
R4
100m
G R111 56
BATTERY-
10u
10
3216size
C34
(1)
C33
10u
3216size
L2
47u
C14
F1
5.6n
BATTERY+
R21
4.0V
4.0V
D1
C15
BATT
330u
6.3
2.4V
Frequency 324kHz
330u
6.3
4.3V
R6
3.3k
(4)
Q2
D4
NC
(5)
(6)
2.65V
C1
L5
2.2u
D2
10u
E
Q3
D5
NC
CHARGE-
L4
CHARGE+
TP5
TP6
SDA
IC2
SCL
GND
3
4
0V
A0
VCC
A1
WP
A2
SCL
VSS
SDA
8
7
6
5
(7)
EEPROM
PX2
PX1
PX0
PL2
PL1
PL0
PL4
PL3
G
100n
10
C22
VBACK+
VBACK
4.0V
C27
100n
10
LCD Back Light LED
R11 NC
PL12
PL11
PL10
PL9
PL8
PL7
PL6
PL5
PX4
PX3
TP22
C3
100n G
10
CN2
11
CN2
12
CN2
13
CN2
14
CN2
15
CN2
16
CN2
17
CN2
18
CN2
19
CN2
20
CN2
21
CN2
22
CN2
23
CN2
24
CN2
25
CN2
26
CN2
27
CN2
28
CN2
29
CN2
30
CN2
31
CN2
32
CN2
33
CN2
34
CN2
35
CN2
36
CN2
PX0
PX1
PX2
PX3
1
PL26
PL25
PY1
S6
LEFT
S2
TALK
2
S25
R
PL23
PL21
S17
0
1
PL24
PL22
S4
3
1
S22
BOOK
S11
UP
2
S23
INT
S9
PROG
PY0
1
PL20
PL19
PL27
S1
DOWN
S16
*
S5
REDIAL
S3
6
S21
RIGHT
G
G
S18
#
2.65V 0V
(20)
(21)
(22)
(23)
R19
S20
4
C23
100n
10
PY2
PL28
S7
CANCEL
(16)
(17)
(18)
(19)
15k
10
CN2
PL29
S15
7
S24
9
C32
CN2
S19
1
100p
50
CN2
S13
5
C18
100n
10
PL30
TP23
CN2
PY3
PL31
S14
8
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
(24)
(25)
(26)
(27)
PL18
PL17
PL16
PL15
PL14
PL13
PL12
PL11
PL10
PL9
PL8
PL7
SYRI
PL32
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
PY0
PY1
PY2
PY3
PY4
CN2
S8
2
PL33
BBIC
PAON
RXDSG
RXDA
SYEN
SYDA
SYCL
TXDA
CN2
2.65V
C20
100n
10
PY4
2
0V
IC4
PL31
PL32
PL33
PL34
PL35
CN2
PY4
PL34
2.65V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
PL35
P0.5/AD4N/DSPFR
P0.4/ADBAT/DSPCLK
ADRSSI
ADREF
MICN
MICP
MICS
BREF
HOP
HON
VSSA
VDDA
CHARGE_START/P0.2
VDDLR
VDDBAT
VDDLO
VDDPM
XTAL
LOAD
VSSO
0V 2.65V
0V
PL29
PL30
CN2
PL18
PL19
PL20
PL21
PL22
PL23
PL24
PL25
PL26
PL27
PL28
PSEL
CN2
PX4
Q4
G
10
R102 10k
PL13/P1.1
PL14/P1.2
PL15/A11/SCLK
PL16/A10
VSS4
VDD4
PL17/CSRAQ
P0.0/RXD/BMCTEST1
P0.1/TXD/BMCTEST0
PL18
PL19
PL20/OERAQ
PL21/WRRAQ
PL22/CSRAQ/PWM
PL23/BSEL2
PL24/D7
PL25/D6
PL26/D5
PL27/D4
PL28/D3
PL29/D2
PL30/D1
VDD1
VSS1
PL31/D0
PL32/A0
PL33/A1
PL34/A2
PL35/A3
DRON
RXDSG
RXDA
SYEN
SYDA
SYCL
TXDA
PY0
PY1
PY2
PY3
PY4
PAON/TXSWON
SYRI
VDD2
VSS2
ONSW
CDT
DCDCDRV
DCDCCMR
RESETQ
PL17
C21 100n
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
PL12/P1.0
PL11/A9/MTSR
PL10/A8/MRST
VDDLI
PL9/A13
PL8/A14
PL7/BSEL1
PL6/BSEL0
PL5/A15
VBACK/P0.7
R1/P1.6
R2/P1.7
MODE
I2CLK
I2DAT
SUPEEP
VSS3
VDD3
PL4/A12
PL3/A7
PX4
PX3
PL2/A6
PL1/A5
PL0/A4
PX2
PX1
PX0
P0.3/DSPIN
P0.6/AD4P/
DSPOUT
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
LED101
82
PL13
PL14
PL15
PL16
R101
LED102
(28)
PL6
PL5
PL4
PL3
PL2
PL1
PL0
NC: No Components
74
D3
(1)
(2)
(3)
4.0V
R103
(7)
1k
NC
C116
TP101
D102
(5)
(6)
R110 15
NC
C108
(4)
TP102
Q104
G
R8
330
R5
MIC+
C4
100n
10
330
MIC
1
C6 10p
2.2k
MICG
1.8V DC IN TALK MODE
C58
D7
RX-AF
A201
TP2
G
1
4.0V
TP15
R12 NC
4.0V
SYCL
R113 NC
27
PSEL
IC3
VCC_OC
GND12
RF_UNIT
GND4
GND11
SYCL
RXDA
SYDA
GND10
SYEN
GND9
C65 NC
29
30
28
GND15
GND16
GND17
31
A_1
RSSI
11
C203 NC
C202 NC
C54 22p
10
C201 NC
SYEN
C60 NC
Frequency 10.368MHz
SYDA
C66 NC
1V
PAON
25
24
23
22
C55 NC
TXDA
26
21
20
G
G
19
18
17
C71 NC
16
GND13
GND8
R18 33
RSSI
(27)
GND3
15
VCC_PA
GND7
R17 NC
GND14
GND2
GND6
TXDA
GND1
GND5
14
13
GND18
TX-DATA
SYRI
S10
POWER
RXDSG
(24)
(25)
(26)
GND19
R112 2.2
TP17
12
TP16
32
X1
C61 1u
C67
10p
50
C68
10p
50
6.3
1u
TP1
D6
18p
NC
1p
R27
C204
C16
C24
(20)
(21)
(22)
(23)
100n
C26
R26 NC
C62 NC
(16)
(17)
(18)
(19)
R1
G
C64 NC
C28 100n
330
R7
4.7u
C5
2125size
C29 100n
C56 NC
C8 10p
100n
C7 10
0.75p
50
C30 100n
TX-AF
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
RXDSG
G
PAON
PSEL
RXDA
RSSI
(28)
TP19
L3
4.7u
C57
33p
50
SYRI
NC: No Components
KX-TGA110 SCHEMATIC DIAGRAM (HANDSET)
75
33 SCHEMATIC DIAGRAM (CHARGER UNIT)

R1
TP3
22
TP4
D1
R2
DC_PLUG 2
pinL
27
TP1 Charge_plus
TP2 Charge_minus
J1
SCHEMATIC DIAGRAM (CHARGER UNIT)
76
77
Q5
R15
R14
Q4
R11
R7
R25
C15
R13
C60
R8
C6
D3
C77
D2
C4
R77 C3
R92
C7
R74
R5
C5
R3
R53
Q3
R2
R70
R73
R4
R1
R6
R82
C74
R81
C16
R20
C62
Q11
D10
R9
R54
C49
KXTCD150H/KXTG1100H
C12
J1
C24
C25
16
17
R61
C31
R30
C20
C19
C18
C30
C29
C33
C32
Q8 Collector
(2.65V)
Q8
C103
X1
D4
C36
R57
C35
C34
C40
C97
C23
R59
D5
JMP1
R35
D11
R72
R71
JMP4 JMP3
C10
R26 R10
Q7
R91 R24
R27
D6 C79
C14
R23
C13
R22
R32
C80
R21
C22
B
R16
C11
Q6 C
R18
R17
E
R56
C51
R19
R55
R28
C17
D12
D13
R12
B C E
Q2
C1
C2
L2
D8
D7
SA1
JMP2
64
C37
32 33
IC2
C26
49
48
R58
C101
C43
11
C81
IC3
58
C87
L59
R68
18
C89
R88
C88
A202
C72
C67 C86
C66
R87
C76
28 C56
CN4
R44
R43
C59
C71
R90
B
(4.0V)
RF VOLTAGE
IC3
(RF Module)
KX-TG1100/1102 CIRCUIT BOARD (BASE UNIT) Component View
C91
Q10
C92
D9
C90 C95
C107
C106
R67 C105
C48
R89
L1
IC1
C47
IC2
(BBIC)
R52
R33
C27
C38
R36
C50
C94
C93
C68
L4 R38
C53
PQUP11175W
R29
R31
C21
C28
L5
C70
C5
4
A201
L
DA1
R79
R78
C73
L3
ANT
C57 C83
C55
L83
L85
R66 1
C58
R42
R41
C102
Q9
C100
C98
PbF
C41
C42
J2
C96
Q9 Q9
(5.5V)(4.0V)
C78
C69
C9
S1
Q1
D1
C63
JMP8
JMP7
JMP6
R85
X1
(BBIC: 18
RESET
10.368MHz) (BBIC: 14)
C84
C82
RLY1
JMP5
34 CIRCUIT BOARD (BASE UNIT)
TP45
CHARGE
TP39
TP3
TP50
TP40
78
TP5
TP97
TP82
Q9 input
(5.5V)
TP90
TP2
2
TP187
TP101
TP89
C99
Q9 output
(4V)
TP91
CHARGE
TP10
KX-TG1100/1102 CIRCUIT BOARD (BASE UNIT) Flow Solder Side View
TP188
TP1
RF clock
(BBIC: 11 10.368MHz)
GND
VBACK
SCL
SDA
+2.65V
PbF
C1
TP5
F1
R5
R1
R6
MIC- MIC+
79
IC2
D3
4.0V
4V
D102
C5
D4
TP6
IC3
TP19
C57
L3
BUZ
C67 D7
R26
C68
C33
R103
TP16
C34
VBACK
VBACK+
TP22
C3
GND
SDA
SCL
GND
KX-TGA110 CIRCUIT BOARD (HANDSET) Component View
TP2: SP+
(BBIC: 41)
TP2
TP1: SP1
(BBIC: 42)
C66
C201 C203
C202
VDD
(2.65V)
C116
LED102
REV
C60
IC4
(BBIC)
C21
PQUP11406Z
D6
R27
TP1
C15
TP102
TP101
C54
C62
R18
R112
R17
C65
A201
R101
Q104
LED101
TP15
IC3
(RF Module)
GND
GND
C204 C26 C28 C29 C8
C27
R2
R11
D1
Q4
PbF
C22
81
80
TP17
C14
C108
R4
50
51
R102
L2
R110
C7 R8
R7 C30
IC4
Q1
R111
C58
C71
TP4
BATTERY-
L5
R12
C24
1
100
C20
KX-TG1100/KX-TGA110
R113
Q3
C4
C6
Q2
30
31
TP23
BATT
BATT
C64 C61 C56 C55
R21
D5
C16 C23 C32
R19
L4
X1
C18
D2
TP3
BATTERY+
35 CIRCUIT BOARD (HANDSET)
INT
MIC
CANCEL
DOWN
REDIAL
80
UP
POWER
RIGHT
LEFT
TALK
PROG
BOOK
36
PbF
1
KX-TGA110 CIRCUIT BOARD (HANDSET) Flow Solder Side View
36 CIRCUIT BOARD (CHARGER UNIT)

J1
D1
PbF
PQUP11205Z
B
CIRCUIT BOARD (CHARGER UNIT) Component View
R2
R1
TP3
TP4
PbF
TP1
TP2
PQUP11205Z
CIRCUIT BOARD (CHARGER UNIT) Flow Solder Side View
81
I.N./I
KXTG1100FXS
KXTG1100FXT
KXTG1102FXS
KXTGA110FXS
KXTGA110FXT

Panasonic KX TG1100FX

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Copyright:

Verfügbare Formate

Panasonic KX TG1100FX

Hochgeladen von

Copyright:

Verfügbare Formate

ORDER NO.

2006 Panasonic Communications Co., Ltd. All

KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT

1.1. Suggested PbF Solder

10.1. Base Unit

1.2. How to recognize that Pb Free solder is used

2 FOR SERVICE TECHNICIANS

11.1. Base Unit

12 HOW TO CHECK THE HANDSET SPEAKER

4.2. Location of Controls

13 FREQUENCY TABLE (MHz)

14 BLOCK DIAGRAM (BASE UNIT)

4.4. Guide to Settings

15 CIRCUIT OPERATION (BASE UNIT)

4.5. For Service Hint

15.2. Power Supply Circuit

5.1. Base Unit

15.3. Telephone Line Interface

5.3. Charger Unit

15.5. Pulse Dialling

16 BLOCK DIAGRAM (HANDSET)

6.1. Warning When Constructing the Base Unit

17 CIRCUIT OPERATION (HANDSET)

6.2. How to Replace the Handset LCD

17.2. Power Supply Circuit/Reset Circuit

7.1. Check Power

17.3. Charge Circuit

7.2. Check Battery Charge

17.4. Battery Low/Power Down Detector

7.3. Check Link

7.4. Check Handset Transmission

7.5. Check Handset Reception

7.6. Check Caller ID

20 CPU DATA (BASE UNIT)

7.7. Bell Reception

18 CIRCUIT OPERATION (CHARGER UNIT)

20.1. IC2 (BBIC)

8 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND

21 CPU DATA (HANDSET)

21.1. IC4 (BBIC)

8.1. Check Point (Base Unit)

8.2. The Setting Method of JIG (Base Unit)

22.1. Base Unit

8.3. Adjustment Standard (Base Unit)

8.4. Check Point (Charger Unit)

8.5. Adjustment Standard (Charger Unit)

23 HOW TO REPLACE THE FLAT PACKAGE IC

23.2. FLAT PACKAGE IC REMOVAL PROCEDURE

9.1. Check Point (Handset)

23.3. FLAT PACKAGE IC INSTALLATION PROCEDURE

9.2. The Setting Method of JIG (Handset)

23.4. BRIDGE MODIFICATION PROCEDURE

9.3. Adjustment Standard (Handset)

24 CABINET AND ELECTRICAL PARTS (BASE UNIT)

9 TROUBLESHOOTING BY SYMPTOM (HANDSET)

KX-TG1100FXS / KX-TG1100FXT / KX-TG1102FXS / KX-TGA110FXS / KX-TGA110FXT

25 CABINET AND ELECTRICAL PARTS (HANDSET)

30.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))

26 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)

30.2. Handset (SCHEMATIC DIAGRAM (HANDSET))

27 ACCESSORIES AND PACKING MATERIALS

30.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))

28 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES

31 SCHEMATIC DIAGRAM (BASE UNIT)