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Four years after setting up a manufacturing site in Chengdu, Texas Instruments, the world's largest
semiconductor company, already considers the city its strategic focus in China.
TI announced it will expand its manufacturing capacity in Chengdu with a 300 mm wafer bumping facility,
at the Nov 6 opening ceremony for its seventh assembly and testing facility. That 33,260 -square-meter
facility in Chengdu Hi-Tech Zone is now in production.
TI has manufacturing operations throughout the world. Its 300 mm operations include the industry's first
300 mm analog wafer fabrication plant in Richardson, Texas, as well as a DMOS6 wafer fab in Dallas
and bump operations in the Philippines and Dallas.
Many other IT giants have invested in Chengdu and the Chengdu High -tech Comprehensive Bonded
Zone is home to a number of leading IT companies, including Intel, Dell, Lenovo, Foxconn and Molex.
Shandong University,
Forty percent of those companies are foreign-invested and 33 are Fortune 500 companies.
Since semiconductor giant Intel Corp set up a chip packaging and testing factory in the city in 2003,
Chengdu has become a magnet for international IT companies.