Beruflich Dokumente
Kultur Dokumente
of Transmission Lines
R. B. Wu
Motivation
Chi A
Chip
Build up layer
Stacked via
Chip B
R. B. Wu
Coaxial cable
Microstrip lines
Triplate lines
R. B. Wu
current density
G
G
Js
= x H
= H y ( z , t ) z
x =0
x =0
G
G
Js
= ( x ) H
= H y ( z , t ) z
z
y
x=d
x=d
P
Power
fl :
flow
G G G
P( z, t ) = transverse E H dS
V ( z , t ) = E x ( z , t )dx = d E x ( z , t )
0
plane
V ( z, t ) I ( z, t )
dydx
x = 0 y = 0
d
w
= V ( z, t ) I ( z, t )
=
I ( z , t ) = J s ( z, t )dy = w H y ( z , t )
0
R. B. Wu
Ex =
V
I
; Hy =
d
w
V
d I
=
z
w t
I
w V
=
z
d t
V
I
= L
z
t
I
V
= C
z
t
L C =
R. B. Wu
L C =
Electric line
Magnetic line
G
G
E ( x, y , z , t ) = v ( z , t )e ( x, y )
G
G
H ( x, y , z, t ) = i ( z, t )h ( x, y )
R. B. Wu
V
dI
= L
z
dt
I
dV
= C
z
dt
R. B. Wu
G
G D
H =
t
G
G
G
v H d A v H
A
G G
G G
d
E d A =
B dS
dt S ABCD
di ( z , t )
v( z + z , t ) v( z , t ) = L2 D z
dt
v
i
= L2 D
z
t
ABCDA
z +z
G d
G G
d A = w
D dS
z
dt
i ( z , t ) i ( z + z, t ) = id ;
G G d
d
d
id = w
D dS = dv = C z v ( z, t )
S
V
z
dt
dt
dt
i
v
= C
z
t
ABCDA
G
G
B
E =
t
G G
G G
d
v ABCDA E d A = dt SABCD B dS
v ( z + z , t ) v ( z , t ) = L z
di ( z , t )
dt
v
i
= L
z
t Wu
R.B.
= 0;
z 2 c 2t 2
c=
1
L C
= z ct
2u
=0
z
ct
=
+
solution : u = f ( ) + g ( )
u ( z , t ) = f ( z ct ) + g ( z + ct )
right - moving left - moving
R. B. Wu
t=0
z
t=t
ct
t=2t
2ct
R. B. Wu
f ( z) + g ( z) = F ( z)
cf ( z ) + cg ( z ) = 0
choose f = g =
u ( z, t ) =
1
F ( z)
2
1
[F ( z ct ) + F ( z + ct )]
2
R. B. Wu
L
V
=
= Z0
C
I
1
z
=
= vp
t
C L
) + g (t + )
1
I ( z, t ) =
f ( t ) g ( t + )
Z
V ( z, t ) = f t
z
vp
z
vp
z
vp
z
vp
R. B. Wu
1
1
=
L C
L C0
C0
c
=
C
reff
reff
L
L C0
1
=
=
=
C
C C0 c C C0
cC
microstrip line
r =
eff
C
C0
R. B. Wu
Numerical Techniques
Calls for numerical techniques
Empirical Formulas
Deduce from vast measurement or simulation results
Graphical Techniques
Very rough, but can yield intuitive feeling
R. B. Wu
C =
( B A)
Coaxial cable
C =
B ' = e B ; A' = e A
C =
2
ln( B '/ A ')
ln B ' ln A '
R. B. Wu
R. B. Wu
r
2d
x1 =
1
2d/r
2d
2d
+ 1, x2 =
1
r
r
C =
=
=
R. B. Wu
k2 +1
2k
2
xb 2
+ y = b 2
1
k
k 1
d = b
V+ =
2k
k2 +1
d d 2 a2
; a=b 2
k=
2
k 1
k 1
a
L
L
d + d 2 a2
ln
= V C =
=
2
a
V+ V ln d + d 2 a 2
C =
cosh 1 ( d a )
) a
R. B. Wu
r
d
C
1
2
ln
2d
r
1
2
R. B. Wu
10
Numerical Techniques
Geometry of lines:
width, separation,
thickness height
thickness,
height,
substrate, etc.
CAP1
CAP2 - microstripp
C2D
Electrical parameters:
capacitance matrix [C]
Inductance matrix [L]
CAP3 triplate
CAPG general
layered
B
Basedd on integral
i t
l equation
ti formulation
f
l ti
and method of moments
Employ exact integration formulae
Four versions are available
W. T. Weeks, Calculation of coefficients of capacitance of multiconductor
transmission lines in the presence of a dielectric interface, IEEE Trans.
Microwave Theory Tech., vol. 18, pp. 35-43, Jan. 1970.
R. B. Wu
CAP2 Example
R. B. Wu
11
Commercial Software
R. B. Wu
http://web.appwave.com/Products/Microwave_Office/Feature_Guide.php?bullet_id=9
Empirical Formula
Microstrip line example
R. B. Wu
12
Graphical Technique
C =
Q
C =
V
Q Q1 + Q2 + " + Qm
=
V
V1 + V2 + " + Vn
=
1
n
j =1
Vj
Qi +Q2 +"+Qm
Cij
j =1
i =1
Qi
Vj
1
n
j =1
1
Cij
i =1
Qi
Vj
if curvilinear square
m
n
Cij , C
, Z0
n
m
e.g., m = 26 , n = 4
Z 0 0.154 377
R. B. Wu
13