Beruflich Dokumente
Kultur Dokumente
1. Product profile
1.1 General description
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)
plastic packages.
Table 1.
Product overview
Type number
Package
Configuration
Package
configuration
NXP
JEITA
JEDEC
BAS16
SOT23
TO-236AB
single
small
BAS16H
SOD123F
single
BAS16J
SOD323F
SC-90
single
BAS16L
SOD882
single
leadless ultra
small
BAS16T
SOT416
SC-75
single
ultra small
BAS16VV
SOT666
triple isolated
BAS16VY
SOT363
SC-88
triple isolated
very small
BAS16W
SOT323
SC-70
single
very small
BAS316
SOD323
SC-76
single
very small
BAS516
SOD523
SC-79
single
1.2 Features
n High switching speed: trr 4 ns
n Low leakage current
n Repetitive peak reverse voltage:
VRRM 100 V
1.3 Applications
n High-speed switching
n General-purpose switching
n Low capacitance
n Reverse voltage: VR 100 V
n Small SMD plastic packages
BAS16 series
NXP Semiconductors
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
100
Per diode
VR
reverse voltage
IR
reverse current
trr
[1]
VR = 80 V
[1]
0.5
ns
2. Pinning information
Table 3.
Pin
Pinning
Description
Simplified outline
Graphic symbol
anode
not connected
cathode
3
1
2
006aaa764
2
006aaa144
cathode
anode
[1]
006aab040
001aab540
BAS16L
1
cathode
anode
[1]
006aab040
Transparent
top view
BAS16VV; BAS16VY
1
anode (diode 1)
anode (diode 2)
anode (diode 3)
cathode (diode 3)
cathode (diode 2)
cathode (diode 1)
3
001aab555
3
006aab106
[1]
BAS16_SER_5
2 of 20
BAS16 series
NXP Semiconductors
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
BAS16
SOT23
BAS16H
SOD123F
BAS16J
SC-90
SOD323F
BAS16L
SOD882
BAS16T
SC-75
SOT416
BAS16VV
SOT666
BAS16VY
SC-88
SOT363
BAS16W
SC-70
SOT323
BAS316
SC-76
SOD323
BAS516
SC-79
SOD523
4. Marking
Table 5.
Marking codes
Type number
Marking code[1]
BAS16
A6*
BAS16H
A1
BAS16J
AR
BAS16L
S2
BAS16T
A6
BAS16VV
53
BAS16VY
16*
BAS16W
A6*
BAS316
A6
BAS516
[1]
BAS16_SER_5
3 of 20
BAS16 series
NXP Semiconductors
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per diode
VRRM
100
VR
reverse voltage
100
IF
forward current
BAS16
[1]
215
mA
BAS16H
BAS16L
[2]
215
mA
BAS16T
[1]
155
mA
[1][3]
200
mA
BAS16W
[1]
175
mA
BAS16J
BAS316
BAS516
[1]
250
mA
500
mA
tp = 1 s
tp = 1 ms
tp = 1 s
0.5
BAS16VV
BAS16VY
IFRM
tp 0.5 s;
0.25
IFSM
square wave
Ptot
[4]
Tamb 25 C
[1]
250
mW
BAS16H
Tamb 25 C
[2][5]
380
mW
830
mW
550
mW
250
mW
[1]
170
mW
[1][3]
180
mW
250
mW
[1]
200
mW
400
mW
500
mW
[6]
[5][6]
[7]
BAS16J
Tamb 25 C
[5][6]
[7]
BAS16L
Tamb 25 C
[2][5]
[6]
BAS16T
Tsp 90 C
BAS16VV
Tamb 25 C
[5][8]
BAS16VY
Tsp 85 C
[1][3]
[8]
BAS16W
Tamb 25 C
BAS316
Tsp 90 C
[1][6]
BAS516
Tsp 90 C
[1][5]
[6]
BAS16_SER_5
4 of 20
BAS16 series
NXP Semiconductors
Table 6.
Limiting values continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per device
Tj
junction temperature
150
Tamb
ambient temperature
65
+150
Tstg
storage temperature
65
+150
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
[3]
[4]
Tj = 25 C prior to surge.
[5]
[6]
[7]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[8]
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
in free air
[1]
500
K/W
[2][3]
330
K/W
[3][4]
150
K/W
BAS16J
[3][4]
230
K/W
BAS16L
[2][3]
500
K/W
BAS16VV
[2][3]
700
K/W
410
K/W
625
K/W
BAS16
330
K/W
BAS16W
300
K/W
BAS16
BAS16H
[5]
[3][4]
[5]
BAS16W
Rth(j-t)
BAS16_SER_5
[1]
5 of 20
BAS16 series
NXP Semiconductors
Table 7.
Symbol
Parameter
Rth(j-sp)
Conditions
BAS16H
[6]
BAS16J
[6]
Min
Typ
Max
Unit
70
K/W
55
K/W
350
K/W
[5][7]
260
K/W
BAS316
[6]
150
K/W
BAS516
[6]
120
K/W
BAS16T
BAS16VY
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
[3]
[4]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[5]
[6]
[7]
7. Characteristics
Table 8.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IF = 1 mA
715
mV
IF = 10 mA
855
mV
IF = 50 mA
IF = 150 mA
1.25
Per diode
VF
IR
Cd
[1]
forward voltage
reverse current
diode capacitance
VR = 25 V
30
nA
VR = 80 V
0.5
VR = 25 V; Tj = 150 C
30
VR = 80 V; Tj = 150 C
50
1.5
pF
f = 1 MHz; VR = 0 V
BAS16; BAS16H;
BAS16J; BAS16L;
BAS16T; BAS16VV;
BAS16VY; BAS16W;
BAS316
BAS516
trr
VFR
pF
[2]
ns
[3]
1.75
[1]
[2]
[3]
BAS16_SER_5
6 of 20
BAS16 series
NXP Semiconductors
006aab132
103
IF
(mA)
mbg704
102
IFSM
(A)
102
10
10
1
(1)
(2)
(3)
(4)
101
101
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
VF (V)
10
102
103
104
tp (s)
(2) Tamb = 85 C
Tj = 25 C; prior to surge
(3) Tamb = 25 C
(4) Tamb = 40 C
Fig 1.
Fig 2.
006aab133
102
IR
(A)
10
(1)
(2)
0.8
Cd
(pF)
0.6
101
0.4
(3)
102
103
0.2
104
(4)
105
0
0
20
40
60
80
100
VR (V)
12
VR (V)
16
f = 1 MHz; Tamb = 25 C
(2) Tamb = 85 C
(3) Tamb = 25 C
(4) Tamb = 40 C
Fig 3.
Fig 4.
BAS16_SER_5
7 of 20
BAS16 series
NXP Semiconductors
8. Test information
tr
tp
t
D.U.T.
10 %
+ IF
IF
RS = 50
SAMPLING
OSCILLOSCOPE
V = VR + IF RS
trr
t
Ri = 50
(1)
90 %
VR
mga881
input signal
output signal
(1) IR = 1 mA
Input signal: reverse pulse rise time tr = 0.6 ns; reverse voltage pulse duration tp = 100 ns; duty cycle = 0.05
Oscilloscope: rise time tr = 0.35 ns
Fig 5.
450
1 k
RS = 50
90 %
OSCILLOSCOPE
D.U.T.
VFR
Ri = 50
10 %
t
tp
tr
input signal
output signal
mga882
Input signal: forward pulse rise time tr = 20 ns; forward current pulse duration tp 100 ns; duty cycle 0.005
Fig 6.
9. Package outline
3.0
2.8
1.7
1.5
1.1
0.9
1.2
1.0
1
0.55
0.35
0.45
0.15
2.5 1.4
2.1 1.2
3.6
3.4
1.9
Dimensions in mm
Fig 7.
0.48
0.38
0.15
0.09
04-11-04
0.70
0.55
0.25
0.10
Dimensions in mm
Fig 8.
04-11-29
BAS16_SER_5
2.7
2.5
8 of 20
BAS16 series
NXP Semiconductors
1.35
1.15
0.80
0.65
1
0.30
0.22
2.7
2.3
0.50
0.46
0.62
0.55
0.5
0.3
1.8
1.6
1.02
0.95
0.65
0.30
0.22
Dimensions in mm
Fig 9.
0.55
0.47
0.25
0.10
0.40
0.25
04-09-13
Dimensions in mm
03-04-17
0.95
0.60
1.8
1.4
3
0.45
0.15
0.6
0.5
5
4
0.3
0.1
1.75 0.9
1.45 0.7
1.7
1.5
1.3
1.1
pin 1 index
1
0.30
0.15
0.25
0.10
1
04-11-04
2.2 1.35
2.0 1.15
0.45
0.15
1.1
0.8
0.45
0.15
2.2 1.35
2.0 1.15
3
0.3
0.2
2
0.4
0.3
0.25
0.10
Dimensions in mm
0.25
0.10
1.3
1.3
06-03-16
Dimensions in mm
04-11-04
BAS16_SER_5
04-11-08
2.2
1.8
pin 1
index
0.65
0.18
0.08
0.27
0.17
Dimensions in mm
1.1
0.8
5
Dimensions in mm
0.5
9 of 20
BAS16 series
NXP Semiconductors
1.35
1.15
0.65
0.58
0.45
0.15
2.7
2.3
0.85
0.75
1.1
0.8
1.65 1.25
1.55 1.15
1.8
1.6
2
0.40
0.25
0.25
0.10
Dimensions in mm
0.34
0.26
03-12-17
0.17
0.11
Dimensions in mm
02-12-13
Package
Description
Packing quantity
3000
4000
8000
10000
BAS16
SOT23
-215
-235
BAS16H
SOD123F
-115
-135
BAS16J
SOD323F
-115
-135
BAS16L
SOD882
-315
BAS16T
SOT416
-115
-135
BAS16VV
SOT666
-315
-115
[2]
-115
-135
[3]
-125
-165
BAS16VY
SOT363
BAS16W
SOT323
-115
-135
BAS316
SOD323
-115
-135
BAS516
SOD523
-315
-115
-135
[1]
For further information and the availability of packing methods, see Section 14.
[2]
[3]
BAS16_SER_5
10 of 20
BAS16 series
NXP Semiconductors
11. Soldering
3.3
2.9
1.9
solder lands
solder resist
3
1.7
solder paste
occupied area
0.6
(3)
0.7
(3)
Dimensions in mm
0.5
(3)
0.6
(3)
1
sot023_fr
1.4
(2)
solder lands
4.6
solder resist
2.6
occupied area
Dimensions in mm
1.4
sot023_fw
BAS16_SER_5
11 of 20
BAS16 series
NXP Semiconductors
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2)
1.65 0.95
0.6 (2)
solder paste
occupied area
0.5
(2)
0.6
(2)
Dimensions in mm
sod323f_fr
BAS16_SER_5
12 of 20
BAS16 series
NXP Semiconductors
1.3
R0.05 (8)
0.7
solder lands
solder resist
0.6 0.7
(2) (2)
0.9
solder paste
occupied area
0.3
(2)
Dimensions in mm
0.4
(2)
sod882_fr
solder lands
solder resist
1
0.85
2
solder paste
0.5
(3)
occupied area
Dimensions in mm
0.6
(3)
1.3
sot416_fr
BAS16_SER_5
13 of 20
BAS16 series
NXP Semiconductors
2.75
2.45
2.1
1.6
solder lands
0.4
(6) 0.25
(2)
0.538
2
1.7 1.075
0.3
(2)
placement area
0.55
(2)
solder paste
occupied area
0.325 0.375
(4) (4)
Dimensions in mm
1.7
0.45
(4)
0.6
(2)
0.5
(4)
0.65
(2)
sot666_fr
solder lands
2.35 1.5
0.4 (2)
0.6 0.5
(4) (4)
solder resist
solder paste
0.5
(4)
0.6
(2)
0.6
(4)
occupied area
Dimensions in mm
1.8
sot363_fr
BAS16_SER_5
14 of 20
BAS16 series
NXP Semiconductors
1.5
solder lands
0.3 2.5
4.5
solder resist
occupied area
1.5
Dimensions in mm
1.3
preferred transport
direction during soldering
1.3
2.45
5.3
sot363_fw
2.35
0.6
(3)
1.3
0.5
(3)
solder paste
occupied area
Dimensions in mm
0.55
(3)
sot323_fr
BAS16_SER_5
15 of 20
BAS16 series
NXP Semiconductors
4.6
2.575
1.425
(3)
solder lands
solder resist
occupied area
1.8
3.65 2.1
09
(2)
Dimensions in mm
preferred transport
direction during soldering
sot323_fw
1.65 0.95
0.6 (2)
solder paste
occupied area
2.2
0.5
(2)
0.6
(2)
Dimensions in mm
sod323_fr
BAS16_SER_5
16 of 20
BAS16 series
NXP Semiconductors
5
2.9
1.5 (2)
solder lands
solder resist
occupied area
1.2
2.75
(2)
Dimensions in mm
preferred transport
direction during soldering
sod323_fw
1.2
solder paste
occupied area
0.7
(2)
0.8
(2)
Dimensions in mm
sod523_fr
BAS16_SER_5
17 of 20
BAS16 series
NXP Semiconductors
Revision history
Document ID
Release date
Change notice
Supersedes
BAS16_SER_5
20080825
BAS16_4
BAS16H_1
BAS16J_1
BAS16L_1
BAS16T_1
BAS16VV_BAS16VY_3
BAS16W_4
BAS316_4
BAS516_1
Modifications:
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Table 5 Marking codes: marking code amended for BAS16W
Table 6 Limiting values: for BAS16, BAS16T, BAS16W and BAS516 change of
VRRM maximum value from 85 V to 100 V
Table 6 Limiting values: for BAS16, BAS16L, BAS16T, BAS16W and BAS516 change of
VR maximum value from 75 V to 100 V
BAS16_4
20011010
Product specification
BAS16_3
BAS16H_1
20050415
BAS16J_1
20070308
BAS16L_1
20030623
Product specification
BAS16T_1
19980120
Product specification
BAS16VV_BAS16VY_3
20070420
BAS16VV_BAS16VY_2
BAS16W_4
19990506
Product specification
BAS16W_3
BAS316_4
20040204
Product specification
BAS316_3
BAS516_1
19980831
Product specification
BAS16_SER_5
18 of 20
BAS16 series
NXP Semiconductors
Product status[3]
Definition
Development
This document contains data from the objective specification for product development.
Qualification
Production
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
BAS16_SER_5
19 of 20
BAS16 series
NXP Semiconductors
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information. . . . . . . . . . . . . . . . . . . . . 10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.