Totsuka, N., et al., U.S. Patent 5,395,687; assignors to Kawasaki Steel Corp.

and Furukawa
Aluminum Co.
Yoshitake, N., et al., U.S. Patent 5362,333; assignors to Henkel Corp.

HOT-DIP COATING
A method for hot-dip coating of
steel consisting of a pretreatment in a
fluoride containing gas prior to coating
with aluminum or zinc was patented by
Yoshino et al. Tasaki et al. patented a
method for producing a brown-coated
article comprising hot-dipping a zincmanganese
alloy followed by heat
treatment. A method for providing a
colored protective coating on a ferrous
strip by hot dipping with tin won a
patent for Carey and Hesske. Gagne
obtained a patent for a zinc-bismuthlead-aluminum
alloy for after-fabrication hot-dip galvanizing. A method to
reduce oxidation of a substrate freshly
coated with a molten metal was devised by Chapman. Gerenrot et al. received a patent for a galvanizing flux.
Kim and Park described a process
for minispangling
hot-dip galvanized
sheet steel by spraying a solution of
mono-ammonium
phosphate at high
pressure onto the molten strip. A meniscus-type method for hot-dipping of
steel strip won a patent for Flinchum et
al. Jasper obtained a patent for a
method of continuous hot-dip aluminizing a steel alloy strip. A batch coating pot garnered a patent for Knupfer.
Isobe et al. patented a method for
preparing a galvanized steel strip with
minimal coating defects. An apparatus
for galvanizing
linear materials was
the subject of a patent granted to Maitra et al. Carey and Zamanzadeh (I and
II) received a pair of patents relating to
hot-dip, weather-resistant,
terne-coated
stainless steel.
A method for controlling
coating
weight on a hot-dipped steel strip using
a wiping nozzle was patented by Sato
et al. Wilkinson and Nagel received a
patent for a lance for submerged injection of feed compositions into a molten
bath. Devices for molten metal plating
were the subject of patents granted to
Oyagi and Nakano, and to Chun et al.

Carey, J.F., and N.R. Hesske, U.S. Patent

5,397,652; assignors to Louis Berkman Co.
Chapman, R.D., U.S. Patent 5,451,429; assignor
to BOC Group plc
Chun, J-H., et al., U.S. Patent 5.43 1,3 15; assignors to Massachusetts Institute of Technology
Flinchum, C., et al., U.S. Patent 5.399.376; assignors to Armco Steel Co.
Gagne, M., U.S. Patent 5,445,791; assignor to
Noranda Inc.
Gerenrot, Y., et al., U.S. Patent 5,437,738
Isobc, M., et al., U.S. Patent 5,433,796; assignors to Kawasaki Steel Corp.
Jasper, J.C., U.S. Patent 5,447,754; assignor to
Armco Inc.
Kim, J-S., and J-R. Park, Plating and Surface
Finishing, 82(3):70; 1995
Knupfer, P., U.S. Patent 5,354,970; assignor to
Inductotherm Corp.
Mama, K.K., et al., U.S. Patent 5,364,661; assignors to Allied Tube & Conduit Corp.
Oyagi,
Y., and H. Nakano,
U.S. Patent
5,393,344; assignors to Nippon Steel Corp.
Sato, T., et al., U.S. Patent 5,384,166; assignors
to NKK Corp.
Tasaki, H., et al., U.S. Patent 5,364,478; assignors to Nippon Mining & Metals Co. Ltd.
Wilkinson, M.A., and C.J. Nagel, U.S. Patent
5,443,572; assignors to Molten Metal Technology Inc.
Yoshino, A., et al., U.S. Patent 5,399,211; assignors to Daidousanso Co. Ltd.

ELECTROFORMING
Tang et al. described a pulse-reversal plating process for electroforming
of nickel without internal stress. A
method of electroforming gold jewelry
articles was patented by Iacono and
Catanzaro. Kato et al. obtained a patent
for a method and apparatus for manufacturing metal foil using an anodized
film. A process for electroforming endless belts won a patent for Swain et al.
Dewitt et al. received a patent for an
apparatus for producing
metal foil.
Processes for producing copper foils
were the subject of patents granted to
Apperson et al., to Clouser et al., and
to DiFranco et al.
Pilz showed how to calculate the
parameters of perforated shields for
electroforming
applications. An electroforming tool with heat transfer fins
was devised by Kitano. Herbert et al.
patented a method for parting an electroform using dendritic growth. Electroforming mandrels were the subject
of two patents issued to Matyi et al. (I
and II).

Dewitt, R.D., et al., U.S. Patent 5,393,396, assignors to Gould Inc.

DiFranco, D.F., et al., U.S. Patent 5.431.803;
assignors to Gould Electronics Inc.
Herbert, W.G., et al,, U.S. Patent 5,385,660;
assignors to Xerox Corp.
Iacono, S.J., and R.S. Catanzaro, U.S. Patent
5,393,405; assignors to Ultralite Technology
Inc.
Kato, H., et al., U.S. Patent 5,441,627; assignors
to Furukawa Electric Co. Ltd. and Circuit
Foil Japan Co. Ltd.
Kitano, M., U.S. Patent 5,397,229; assignor to
FET Engineering Inc.
Matyi, E.F., et al. (I), U.S. Patent 5,389,227;
assignors to Xerox Corp.
Matyi, E.F., et al. (II), U.S. Patent 5,395,499;
assignors to Xerox Corp.
Pilz, U., Plating and Surjke Finishing, 82(12):
56; 1995
Swain, E.A., et al., U.S. Patent 5,451,311; assignors to Xerox Corp.
Tang, P.T., AESF SUR/FIN 95, Baltimore, June
1995, Session L, p. 529

COMPOSITE
ELECTRODEPOSITS
The friction and wear characteristics
of electrodeposited copper composites
with inclusions of graphite, molybdenum disulfide, and PTFE were reported by Bhalla et al. Ramesh Bapu
and Mohan prepared composites
of
nickel-PTFE
from a Watts bath. The
properties of nickel deposits with boron nitride inclusions for use as hightemperature lubricants were addressed
by Pushpavanam
and Natarajan, and
also by Ramesh Bapu. Berkh et al. (III)
discussed the mechanism of codeposition of nickel-phosphorus
with silicon
carbide.
Popova et al. investigated
mass
transfer effects in the copdeposition of
iron-nickel
with silicon dioxide. A
mathematical model for the same system was described by Ramusubramanian et al. Berkh et al. (I and II) reported
on composite
coatings
of
chromium-nickel
with aluminum oxide. Dispersion coatings of nickel-cobalt-phosphorus
with boron nitride
were characterized by Furukawa et al.
Dixon et al. patented a method for
improving the electromagnetic
shielding performance of composite materials by electroplating.

References
References

References

Carey, J.F., and M. Zamanzadeh (I), U.S. Patent

5,395,702; assignors to Louis Be&man Co.
Carey, J.F., and M. Zamanzadeh (II), U.S. Patent
5,395,703; assignors to Louis Berkman Co.

Apperson, R.D., et al., U.S. Patent 5,403,465;

assignors to Gould Inc.
Clouser, S.J., et al., U.S. Patent 5,421,985; a.signors to Gould Inc.

38

Berkh, O., et al. (I), Plating and Surface Finishing, 82(1):54; 1995
Be&h, O., et al. (II), Plating and Surface Finishing, 82(2):72; 1995
Berkh, 0.. et al. (III), Plating and Surjke Finishing, 82( 11):62; 1995

METAL FINISHING

??

FEBRUARY

1996