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COMPONENT ID CERTIFICATION TEST

(DVD-64C)

v2.0
This test consists of fifty multiple-choice questions. All questions are from the IPC
Component Identification training video (DVD-64C).
Each question has only one most correct answer. Circle the letter corresponding to
your selection for each test item.
If you want to change an answer, erase your choice completely.
You should read through the questions and answer those you are sure of first. After
your first pass through the test, then go back and answer the questions that you were
not sure of. If two answers appear to be correct, pick the answer that seems to be the
most correct response.
When you are finished, check to make sure you have answered all of the questions.
Turn in the test materials to the instructor.
The passing grade for this test is 70% (35 or more correct answers).
Good luck!

COMPONENT ID CERTIFICATION TEST

(DVD-64C)

1. Through-hole components
a. have leads that are soldered directly onto lands on the surface of a circuit board
b. have leads that are inserted through mounting holes on the circuit board
c. are always semiconductors
d. all of the above
2. Components that can amplify or interpret a signal are called
a. active components
b. discrete components
c. passive components
d. metallized components
3. Passive components
a. always have axial leads
b. always have radial leads
c. interpret signals
d. cannot change an electrical signal except to reduce it in size or delay it
4. A group of interconnected elements assembled into a single package is
a. a surface mount component
b. a discrete component
c. an integrated circuit
d. a through-hole component
5. A listing of the components and quantities for an electronic assembly is found on the
a. assembly drawing
b. router
c. assembly instructions
d. bill of materials
6. The assembly drawing
a. lists component part numbers and quantities
b. shows the components and their locations on the circuit board
c. details the exact process steps in assembly
d. provides an engineering drawing of each component
7. The letters and numbers used to identify components on circuit boards are called
a. reference designators
b. manufacturers part numbers
c. numerical values
d. color bands
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COMPONENT ID CERTIFICATION TEST

(DVD-64C)

8. Components may be identified by


a. reference designator
b. part number
c. value and tolerance
d. all of the above
9. Components requiring negative and positive connections have
a. terminations
b. capacitance
c. polarity
d. resistance
10. The positive lead of a component is called the
a. anode
b. cathode
c. diode
d. electrode
11. Proper orientation means
a. the component is placed next to the proper reference designator
b. pin 1 of the component is in the same position as the pin 1 hole on the circuit board
c. components have correct negative and positive connections
d. components are placed far enough away from magnetic fields

12. Identify this component:


a. dual-in-line package (DIP)
b. Pin Grid Array (PGA)
c. capacitor
d. single-in-line package (SIP)

13. Identify this component:


a. DIP
b. PGA
c. capacitor
d. SIP

COMPONENT ID CERTIFICATION TEST

14. On this component, identify the location of pin 1:


a. the first pin clockwise from the notch
b. the first pin counter-clockwise from the notch
c. upper right hand corner
d. upper left hand corner
15. The most common reference designator for an IC is the letter
a. I
b. C
c. U
d. L

16. Identify this component:


a. IC can
b. resistor network
c. SIP
d. polarized capacitor

17. Identify this component:


a. IC can
b. DIP
c. SIP
d. PGA
18. Identify the axial-leaded resistor:

a.
b.
c.
d.
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(DVD-64C)

COMPONENT ID CERTIFICATION TEST


19. Resistors are measured in
a. microfarads
b. amps
c. ohms
d. megahertz
20. Resistor color bands are used to
a. identify the manufacturer of the resistor
b. calculate the value and tolerance of the resistor
c. give the resistor a stylish look
d. all of the above
21. A unit of electrical capacitance is called a
a. henry
b. volt
c. watt
d. farad

22. Identify this component:


a. radial capacitor
b. axial capacitor
c. diode
d. inductor
23. The negative lead on a polarized capacitor is called the
a. square land
b. anode
c. cathode
d. pin 1 lead
24. Identify the diode:
a.
b.
c.
d.
5

(DVD-64C)

COMPONENT ID CERTIFICATION TEST

25. Identify this component:


a. transistor
b. LED
c. resistor
d. polarized capacitor

26. Identify this component:


a. transistor
b. LED
c. resistor
d. diode
27. Identify this component:
a. radial capacitor
b. filter
c. crystal
d. inductor
28. An example of a coiled component is a
a. transformer
b. torroid
c. inductor
d. all of the above

29. Identify this component:


a. inductor
b. connector
c. filter
d. diode
30. Crystals are measured in
a. farads
b. hertz
c. henries
d. watts

(DVD-64C)

COMPONENT ID CERTIFICATION TEST

31. Identify the crystal:

a.
b.
c.
d.
32. Sockets, headers and jumpers are examples of
a. polarized components
b. front panel switches
c. connecting hardware
d. resistor networks
33. Surface mount components
a. are larger than their through-hole counterparts
b. are smaller than their through-hole counterparts
c. have few electronic functions than their through-hole counterparts
d. are inserted through mounting holes on the surface of the circuit board
34. Surface mount components come from the manufacturer
a. on tape and reel
b. in tubes
c. in waffle trays
d. all of the above

35. Identify this type of surface mount lead:


a. J-lead
b. I-lead
c. gull wing
d. L-lead

(DVD-64C)

COMPONENT ID CERTIFICATION TEST

36. Identify this type of surface mount lead:


a. J-lead
b. I-lead
c. gull wing
d. L-lead
37. Lead pitch is the
a. angle of the lead
b. shape of the lead
c. termination point of the lead
d. distance between the center of one lead to the center of the next lead

38. What do we call this type of leadless connection:


a. castellation
b. termination
c. ball grid array
d. flat lead

39. Identify this component:


a. QFP
b. PLCC
c. BGA
d. flat pack

40. Identify this component:


a. QFP
b. PLCC
c. BGA
d. flat pack

(DVD-64C)

COMPONENT ID CERTIFICATION TEST


41. The solder connections on a leadless chip carrier are called
a. terminations
b. L-leads
c. flat leads
d. castellations

42. Identify this component:


a. QFP
b. BGA
c. LCC
d. flat pack

43. Identify this component:


a. SOIC
b. VSOP
c. SOL-J
d. TSOP

44. Identify this component:


a. SOIC
b. VSOP
c. SOL-J
d. TSOP
45. Part numbers for chip components are usually marked on the
a. body of the component
b. tape reel
c. circuit board
d. all of the above

(DVD-64C)

COMPONENT ID CERTIFICATION TEST


46. Identify this component:
a. crystal
b. MELF resistor
c. chip resistor
d. molded tantalum capacitor

47. Identify this component:


a. crystal
b. MELF resistor
c. chip resistor
d. molded tantalum capacitor

48. Identify this component:


a. chip component
b. MELF
c. molded tantalum capacitor
d. none of the above

49. Identify this component:


a. MELF
b. molded tantalum capacitor
c. SOT
d. QFP
50. DPAKs house
a. small transistors or diodes
b. higher powered transistors or diodes
c. light emitting diodes
d. all of the above

10

(DVD-64C)

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