Caldon Soundtrack User Manual

CALDON ULTRASONICS
SoundTrack
User Manual
Manual IB0133 Rev. 13
IB0133 Rev. 13
SoundTrack User Manual
Caldon is a trademark of Cameron International Corporation (Cameron).

LEFM is a registered trademark of Cameron.
Modbus is a registered trademark of Modbus Organization, Inc.
Copyright 2012 Cameron International Corporation (Cameron). All information contained
in this publication is confidential and proprietary property of Cameron. Any reproduction or use of
these instructions, drawings, or photographs without the express written permission of an officer
of Cameron is forbidden.
All Rights Reserved.
Printed in the United States of America
Manual No. IB0133, Rev. 13
June 2012
IB0133 Rev. 13
A complete range of support services are offered. For additional information or assistance on the
application, operations, or servicing of the SoundTrack, write or call, or visit www.c-a-m.com.
CAUTION
NO OPERATOR ACCESS IS PERMITTED IN THE UNIT. SERVICE SHOULD
ONLY BE PERFORMED BY QUALIFIED PERSONNEL.
IF THE EQUIPMENT IS USED IN A MANNER NOT SPECIFIED BY THE
MANUFACTURER, THE PROTECTION PROVIDED BY THE EQUIPMENT MAY
BE IMPAIRED.
IB0133 Rev. 13
CONTENTS
1
INTRODUCTION ..........................................................................................................................................1
1.1
1.2
System Description............................................................................................................................ 1
Principles of Operation...................................................................................................................... 1
SPECIFICATIONS ........................................................................................................................................3
2.1
SoundTrack Model Number .............................................................................................................. 3
2.1.1 Model Number .................................................................................................................................................3

2.1.2 Wafer Part Code...............................................................................................................................................3
2.1.3 Transmitter Part Code ......................................................................................................................................4
2.2
2.3
2.4
Transmitter......................................................................................................................................... 5
Environment (Transmitter and Wafer) .............................................................................................. 6
Approvals........................................................................................................................................... 6
2.4.1 Approvals Transmitter...................................................................................................................................6

2.4.2 Approvals Wafer ...........................................................................................................................................6
2.5
2.6
Transmitter Figures............................................................................................................................ 7
Wafer Figures & Dimensions .......................................................................................................... 11
INSTALLATION .........................................................................................................................................13
3.1
3.2
Wafer ............................................................................................................................................... 13
Transmitter Unit .............................................................................................................................. 14
3.2.1 Electromagnetic Interference .........................................................................................................................14
3.3
3.4
Field Terminations........................................................................................................................... 15
Power Up ......................................................................................................................................... 18
OPERATION................................................................................................................................................19
4.1
Commissioning................................................................................................................................ 19
4.1.1 Diagnostics Check..........................................................................................................................................19

4.1.2 Interface Detection .........................................................................................................................................19
4.2
Theory of Operation ........................................................................................................................ 20
4.2.1
4.2.2
4.2.3
4.2.4
Sound Velocity Measurement ........................................................................................................................20

Fluid Attenuation Measurement.....................................................................................................................20
Density Calculation........................................................................................................................................20
Viscosity Calculation .....................................................................................................................................21
4.3
4.4
4.5
4.6
Acoustic Processing Unit (APU)..................................................................................................... 21

Fault Detection ................................................................................................................................ 21
Backplane ........................................................................................................................................ 21
Remote Data Communications........................................................................................................ 22
MAINTENANCE .........................................................................................................................................23
5.1
5.2
5.3
5.4
Introduction ..................................................................................................................................... 23
General Inspections - Preventative Maintenance Procedures.......................................................... 23
Power Supply Voltage Troubleshooting and Maintenance ............................................................. 25
Wafer Inspection and Transducer Cables ........................................................................................ 29
5.4.1
5.4.2
5.4.3
5.4.4
5.4.5
Wafer Inspection ............................................................................................................................................29

Transducer Cable Inspection Checks .............................................................................................................29
Transducer Installation Procedure..................................................................................................................30
Analog Input Alignment.................................................................................................................................31
Analog Output Verification............................................................................................................................32
June 2012
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Table of Contents
IB0133 Rev. 13
5.4.6 Analog Output Scaling...................................................................................................................................32

6
TROUBLESHOOTING AND DIAGNOSTICS FOR THE ULTRASONICS........................................35
6.1
6.2
Diagnostics ...................................................................................................................................... 35
Path Troubleshooting....................................................................................................................... 36
6.2.1 Path Reject Status...........................................................................................................................................36
6.3
Troubleshooting Acoustic Signals................................................................................................... 37
6.3.1 Oscilloscope Setup .........................................................................................................................................37

6.3.2 Observed Waveform ......................................................................................................................................37
6.3.3 Selecting Transducer Signal Waveforms .......................................................................................................38
6.4
Reprogramming the Transmitter ..................................................................................................... 40
6.4.1 Modbus ID and Baud Rate .............................................................................................................................40

7
RECOMMENDED SPARE PARTS...........................................................................................................41
7.1
7.2
Domestic (US and Canada) ............................................................................................................. 41

International..................................................................................................................................... 41
Table of Contents
Page ii
June 2012
IB0133 Rev. 13
INTRODUCTION
1.1 System Description

The Caldon SoundTrack consists of a wafer to be mounted between pipe flanges and a transmitter for
processing signals. It utilizes ultrasonic technology to infer the density and viscosity of the liquid passing
through the wafer. The primary application is to detect the passing of an interface between two similar
liquids in a pipeline.
SoundTrack continuously verifies that it is performing properly and initiates warnings and alarms when
unsatisfactory conditions are detected. Easy-to-interpret diagnostic information simplifies troubleshooting.
1.2 Principles of Operation

SoundTrack consists of two major components, the transmitter and the wafer. Within the transmitter is an
acoustic processing unit (APU) that sends and receives electronic signals to and from the acoustic
transducers in the wafer. The APU processes data received from the acoustic transducers in the wafer. The
acoustic transducers, in turn, transmit and receive acoustic signals through the process liquid in the wafer.
By measuring the duration of time required for an acoustic signal to cross the diameter, it is possible to
determine the velocity of sound through the liquid within the pipeline.
The velocity of sound in a liquid is directly related to the density of that liquid. By measuring the process
liquid velocity of sound and temperature, it is possible to determine the relative density of the liquid. In this
way, the SoundTrack sensor can identify a density change generally associated with the passing of an
interface between two different liquids in a pipeline.
As sound passes through a liquid, there is a slight rarefaction and compaction of the molecules of the
liquid. This process causes viscous shearing that absorbs acoustic energy. SoundTrack utilizes a patented
technique that precisely measures the energy loss of acoustic pulses through the fluid, thereby allowing the
approximate kinematic viscosity to be determined. Changes in the measured kinematic viscosity can be
used to detect the passing of an interface between two different liquids in a pipeline.
In summary, SoundTrack processes ultrasonic information to determine two significant characteristics of a
liquid relative density and kinematic viscosity. This allows SoundTrack to distinguish changes in process
liquid properties that are undetectable by many other instruments.
June 2012
Page 1
Introduction
IB0133 Rev. 13
Introduction
Page 2
June 2012
IB0133 Rev. 13
SPECIFICATIONS
2.1 SoundTrack Model Number

Each SoundTrack has a Model Number and Part Code that completely defines the construction and features
of the wafer and transmitter. The following subsections define the Model Number and part codes.
2.1.1
Model Number
ST-T 6- 150- EX
Meter Type
Enclosure Type
T = Transmitter
GP = NEMA 4X
W = Wafer
EX = Explosion Proof
Wafer Size, Inches
ANSI Flange Rating
150
300
600
900
2.1.2
Wafer Part Code

H SW 0 6 8 N A B 1 6 0 0 0 C
H = Hydrocarbon Product Line
0 = Standard / C = Custom
Product Type:
2 = LEFM220C
4 = LEFM240C
S = SoundTrack
E = LEFM200E
Transducer Frequency (10*MHz)

Nominal Transducer Size:
B = 1"
Flange Class:
A = ANSI Class 150 RF
B = ANSI Class 300 RF
C = ANSI Class 600 RF
D = ANSI Class 900 RF
W = Wafer
Size (Inches)
Schedule:
4 = Sch. 40
S = Standard
8 = Sch. 80
June 2012
Material:
N = Nickle Plated Carbon Steel
Page 3
Specifications
IB0133 Rev. 13
2.1.3
Transmitter Part Code

HSTG2 1 6 1 AB0 0 0 0C
H = Hydrocarbon Product Line
0 = Standard / C = Custom
Product Type:
2 = LEFM220C
4 = LEFM240C
S = SoundTrack
E = LEFM200E
Serial Options
0 = IR Board
8 = RS-485 / No IR Board
N = No IR Board
B = IR Board / RS-485
T = Transmitter
Analog Output Options

0 = None
1 = A/O 1
2 = A/O 2
3 = A/O 1, A/O 2
4 = A/O 3
5 = A/O 1, A/O 3
6 = A/O 2, A/O 3
7 = A/O 1, A/O 2, A/O 3
8 = A/O 4
9 = A/O 1, A/O 4
A = A/O 2, A/O 4
B = A/O 1, A/O 2, A/O 4
C = A/O 3, A/O 4
D = A/O 1, A/O 3, A/O 4
E = A/O 2, A/O 3, A/O 4
F = A/O 1, A/O 2, A/O 3, A/O 4
Enclosure Type
G = NEMA 4X
X = Explosion Proof, Al
S = Explosion Proof, SS
Power Supply
1 = 120 VAc
2 = 240 VAc
3 = 24 VDc
Transducer Frequency (10*MHz)
Analog Input Options
0 = None
1 = A/I 1
2 = A/I 2
3 = A/I 1, A/I 2
4 = A/I 3
5 = A/I 1, A/I 3
6 = A/I 2, A/I 3
7 = A/I 1, A/I 2, A/I 3
8 = A/I 4
9 = A/I 1, A/I 4
A = A/I 2, A/I 4
B = A/I 1, A/I 2, A/I 4
C = A/I 3, A/I 4
D = A/I 1, A/I 3, A/I 4
E = A/I 2, A/I 3, A/I 4
F = A/I 1, A/I 2, A/I 3, A/I 4
Specifications
Page 4
June 2012
IB0133 Rev. 13
2.2 Transmitter
Material:
Explosion Proof
NEMA4X
Aluminum
Stainless Steel
Net Weight:
NEMA 4X - 30 lbs. (13.6 kg)

Explosion Proof - 120 lbs. (54.5 kg)
(See following figures for dimensions)
Weight
Power Requirements
Voltage Supply Required: 24 VDC or,
120 VAC, 50/60 Hz or,
240 VAC, 50/60 Hz
Current Draw:
24 VDC 3.0 Amps

120 VAC 0.8 Amps
230 VAC 0.6 Amps
Power Consumption:
20W (80W with heaters active)
Cable Lengths
Standard:
Extended Range:
15 feet (approximately 5 meters); lengths up to 200' (61 meters)

can be ordered
Special cables can be used for runs up to 1000. Contact
Cameron Measurement Systems Engineering Division to discuss
the needs of the application.
Pulse Outputs/Communications
Pulse Output:
Alarm Status:
Serial Communications:
0-5 V
5V Normal, 0V Alarm
RS-232 (typical, RS-422 or RS-485 options available) Modbus
Protocol, see Caldon Modbus Specifications
Analog Outputs:
4-20mA or 0-20mA (max load 650 Ohms), up to 4 total.
Analog Inputs:
4-20mA, 0-20mA, RTD, or Frequency, up to 3 total.

Meter Body Temperature RTD is standard.
June 2012
Page 5
Specifications
IB0133 Rev. 13
2.3 Environment (Transmitter and Wafer)

Storage Temperature
Wafer:
Transmitter:
-40 to 200F (-40 to 93C)

-40to 140F (-40 to 60C)
Operating Temperatures (See Approvals)
2.4 Approvals
2.4.1
Approvals Transmitter
Hazardous Area Approvals: (USA and Canada)
Class I Div I Groups C and D, Conforms to UL Std 1203, Std UL 61010-1, CSA Std 22.2 No.
30, CSA Std 22.2 No. 61010.1
2.4.2
Approvals Wafer
Hazardous Area Approvals: (USA and Canada)
Class I Div I Groups C and D, Conforms to CSA Std C22.2 No.30-M1986, CSA Std C22.2
No.142-M1987, ANSI/UL Std No.508, UL Std No.1203
The temperature limit of the wafer assembly is dependent on the temperature limits for the
components used to connect the wafer to the electronics and may limit the temperature limits for the
assembled wafer. See the wafer nameplate for the temperature limit of the system as assembled.
Specifications
Page 6
June 2012
IB0133 Rev. 13
2.5 Transmitter Figures
MOUNTING
BRACKETS
(Use inch bolts/hardware)
Figure 2-1: Transmitter Unit - NEMA 4X Enclosure
June 2012
Page 7
Specifications
IB0133 Rev. 13
Figure 2-2: Transmitter Unit - NEMA 4X with Door Open

Specifications
Page 8
June 2012
IB0133 Rev. 13
MOUNTING
BRACKETS
(Use inch bolts/hardware)
Figure 2-3: Transmitter Unit - NEMA 7 Enclosure
June 2012
Page 9
Specifications
IB0133 Rev. 13
Figure 2-4: Transmitter Unit NEMA 7 with Door Open
Specifications
Page 10
June 2012
IB0133 Rev. 13
2.6 Wafer Figures & Dimensions

Nominal Pipe
Size
in
In
(mm)
In
Thickness Wafer (mm)
lbs
Approximate
Weight
kg
Diameter Wafer
10
12
16
18
20
24
13.25
(337)
2
(50.8)
50
23
16.50
(419)
2
(50.8)
82
37
19.75
(502)
2
(50.8)
123
56
22.75
(579)
2
(50.8)
157
71
25.25
(641)
2
(50.8)
189
86
26.37
(670)
2
(50.8)
241
110
31.75
(806)
2
(50.8)
199
136
34.37
(873)
2
(50.8)
348
158
41.00
(1041)
2
(50.8)
522
237
Figure 2-5: Wafer Dimensions

(Bolt Hole Pattern Determined by Pipe Size, Flange Rating, and ASME B16.5)
June 2012
Page 11
Specifications
IB0133 Rev. 13
Specifications
Page 12
June 2012
IB0133 Rev. 13
INSTALLATION
Steps for Installation:

1.
Install wafer, Section 3.1.
2.
Install transmitter, Section 3.2.
3.
Run cable, make terminations, Section 3.3.
4.
Power up transmitter, Section 3.4.
3.1 Wafer
The SoundTrack wafer has raised faces for mating with flanges (compliant with ANSI B16.5). It should be
installed between similar flanges with suitable gaskets using bolts and nuts or studs and nuts. There is no
need for supports or mounting pads.
Flow can pass through the wafer in either direction. There is no requirement for flow conditioning upstream
or downstream. The wafer can be mounted adjacent to elbows, reducers, manifolds or other disruptions so
long as there is no flashing or cavitation.
If the SoundTrack wafer is installed in a horizontal pipe run, it should be positioned so that the junction box
(J-Box) is on top or bottom of the wafer (see Figure 2-5). This places the acoustic transducers so that
neither is directly on top or bottom.
Positioning of the transducers on the top or bottom of the wafer is not desirable because of the possibility of
air, water or deposits being present in the pipeline. Air will result in loss of acoustic signal, degrading meter
performance. Water results in an erroneous density and viscosity indication. The SoundTrack wafer can
be positioned in non-horizontal pipe runs. In all installations, the liquid must be free of entrained air (less
than 2%) for best operation.
The wafer contains:
Two acoustic transducers that transmit and receive ultrasonic pulses passed through the fluid.
An RTD temperature transducer.
The wafer is designed to permit removal of the acoustic and temperature transducers while the pipeline is
under pressure.
July 2007
Page 13
Installation
IB0133 Rev. 13
3.2 Transmitter Unit

The SoundTrack transmitter is designed to be used under a wide variety of process and environmental
conditions. Durable construction permits conventional installation practices. The transmitter should be
installed in an environment consistent with the ratings of the enclosure (i.e., NEMA 4X or NEMA 7). All
wiring to and from the transmitter must be put in grounded metal conduit. All supply power terminations
must use the terminal blocks indicated in Table 3-7. No ventilation is required, other than that necessary to
meet the ambient temperature requirements.
For installation, simply uncrate the delivered transmitter (please note the weight of your transmitter in
Section 2.0). Use the indicated mounting points/brackets for mounting the transmitter. Select
bolts/hardware appropriate for the units weight. Consider site seismic requirements.
Use inch bolts/hardware (or equal) on all mounting points for the Explosion Proof (NEMA 7)
transmitter. Cover bolts are metric (M12 x 1.75 x 50 mm) (Use 19 mm Socket/Wrench).
Use inch bolts/hardware (or equal) on at least the 2 top and 2 bottom mounting points for the
NEMA 4X transmitter.
The transmitter should be mounted at a convenient working height. (Try having the bottom of the
transmitter 4 feet (1.2 meters) from the ground.) While an installation in direct sun is acceptable, an
installation in the shade will increase the life of all components.
The wiring should be brought to the transmitter in shielded conduit that meets site environment
specifications. Sensor signal and power terminations should be made according to Table 3-1 through Table
3-8. Explosion Proof enclosures must be installed with rigid conduit with stopping boxes / seal fittings
installed within 3 inches (75 mm) of the enclosure.
3.2.1 Electromagnetic Interference
The transmitter contains components that may be sensitive to strong externally generated fields and poor
grounding. To avoid electromagnetic interference, the transmitter should be located at least 10 feet from
other devices that develop strong magnetic fields (for example, electric motors, transformers, etc). Further,
elimination of ground potentials between the transmitter and the wafer is strongly recommended (with the
exception of galvanically protected pipelines).
Installation
Page 14
July 2007
IB0133 Rev. 13
3.3 Field Terminations

The following tables illustrate the connections for the SoundTrack Transmitter including the transducers,
analog inputs/outputs, pulse output, serial communicating connections, and power connection.
Typical installations require the supplied cable to be wired from the wafer junction box to the transmitter
terminals. Transducer connections are wired to TB-1 and RTD connections to TB-2. See Figure 2-2 or
Figure 2-4 for locations of transmitter terminal blocks (TB-1 to TB-5). Refer to Table 3-1 for wiring
diagram.
The appropriate power should be wired to the power terminals (see Figure 2-2 or Figure 2-4, and Table
3-7). Additional analog outputs and serial communications can be wired per Table 3-2 and Table 3-3,
respectively.
The following installation instructions are for backplanes with a green circuit board. If a blue circuit
board is installed, refer to the wiring Table 3-4 through Table 3-6.
The following figures illustrate mounting and wiring for the transmitter unit and the wafer:
Cable Identification
wire
cable/wire name
color
XDCR - 1 Up +
Black
"Up" Transducer XDCR - 1 Up Shield Clear
XDCR - 1 Up Red
XDCR - 1 Dn +
Black
"Down" Transducer XDCR - 1 Dn Shield Clear
XDCR - 1 Dn White
RTD +
Black
Black
Temperature Analog Input RTD +
RTD Green
Instrument
From Transmitter
To Wafer
terminus
TB1-1
TB1-2
TB1-3
TB1-4
TB1-5
TB1-6
TB2-1
TB2-2
TB2-5
terminus
J-Box TB1-1
J-Box TB1-2
J-Box TB1-3
J-Box TB1-4
J-Box TB1-6
J-Box TB1-7
J-Box TB1-5
Table 3-1: Transmitter to Wafer

Analog Output
Specific Gravity
Viscosity
Temperature
Direct Gain
July 2007
Signal Description
4-20 mA + (high)
Shield
4-20 mA (low)
4-20 mA + (high)
Shield
4-20 mA (low)
4-20 mA + (high)
Shield
4-20 mA (low)
4-20 mA + (high)
Shield
4-20 mA (low)
Page 15
terminus
TB3-1
TB3-2
TB3-3
TB3-4
TB3-5
TB3-6
TB3-7
TB3-8
TB3-9
TB3-10
TB3-11
TB3-12
Installation
IB0133 Rev. 13
Table 3-2: Analog Output Customer Connection Locations (Located on Backplane)

Description
TX
GND RX
5V
-
Terminus DB9
Transmit
TB4-1
2
GND/Shield
TB4-2
5
Receive
TB4-3
3
+5V DC
TB4-4
Table 3-3: RS-232 Output

The following installation instructions are for backplanes with a blue circuit board. If a green circuit
board is installed, refer to Table 3-1 through Table 3-3 for the wiring tables.
The following figures illustrate mounting and wiring for the transmitter unit and the wafer:
Cable Identification
wire
Instrument cable/wire name
color
XDCR - 1 Up +
Black
"Up" Transducer XDCR - 1 Up Shield Clear
XDCR - 1 Up Red
XDCR - 1 Dn +
Black
"Down" Transducer XDCR - 1 Dn Shield Clear
XDCR - 1 Dn White
RTD +
Black
Black
Temperature Analog Input RTD +
RTD Green
From Transmitter
To Wafer
terminus
TB1-1
TB1-2
TB1-3
TB1-13
TB1-14
TB1-15
TB2-1
TB2-2
TB2-5
terminus
J-Box TB1-1
J-Box TB1-2
J-Box TB1-3
J-Box TB1-4
J-Box TB1-6
J-Box TB1-7
J-Box TB1-5
Table 3-4: Transmitter to Wafer

Analog Output
Specific Gravity
Viscosity
Temperature
Direct Gain
Signal Description
4-20 mA + (high)
Shield
4-20 mA (low)
4-20 mA + (high)
Shield
4-20 mA (low)
4-20 mA + (high)
Shield
4-20 mA (low)
4-20 mA + (high)
Shield
4-20 mA (low)
terminus
TB4-1
TB4-2
TB4-3
TB4-4
TB4-5
TB4-6
TB4-7
TB4-8
TB4-9
TB4-10
TB4-11
TB4-12
Table 3-5: Analog Output Customer Connection Locations (Located on Backplane)
Installation
Page 16
July 2007
COM
COM3
IB0133 Rev. 13
Termination
RS-232*
BPL-S1, S2 = RS232
RS-422/485 Full Duplex**

BPL-S1, S2 = RS-485
E6, E7 jumpered 2-3
BPL-TB3-11
Transmit (Tx)
A, Noninverting Receive
(+Rc)
BPL-TB3-12
Ground (GND)
B, Inverting Receive
(-Rc)
BPL-TB3-13
Receive (Rc)
Z, Inverting Transmit
(-Tx)
Z, Inverting Transmit/Receive
(- Data)
BPL-TB3-14
+5 Volts
Y, Noninverting Transmit
(+Tx)
Y, Noninverting
Transmit/Receive (+Data)
BPL-TB3-15
COM4
RS-485 Half Duplex**

BPL-S1, S2 = RS-485
E6, E7 jumpered 1-2
Ground
BPL-TB3-16
Transmit (Tx)
A, Noninverting Receive
(+Rc)
BPL-TB3-17
Ground (GND)
B, Inverting Receive
(-Rc)
BPL-TB3-18
Receive (Rc)
Z, Inverting Transmit
(-Tx)
Z, Inverting Transmit/Receive
(- Data)
BPL-TB3-19
+5 Volts
Y, Noninverting Transmit
(+Tx)
Y, Noninverting
Transmit/Receive (+Data)
BPL-TB3-20
Ground
Table 3-6: RS-232, 422/485 Serial Communications

*RS-232 selected when S1 (COM3) and S2 (COM4) on the transmitter backplane are positioned toward
RS-232.
**RS-422/484 are selected when S1 (COM3) and S2 (COM4) on the transmitter backplane are positioned
toward RS-485. Jumpering E6 (COM3) and E7 (COM4) on the transmitter backplane to positions 1-2
selects half duplex mode (RS-485). Jumpering E6 (COM3) and E7 (COM4) on the transmitter backplane
to positions 2-3 selects full duplex mode RS-422/485).
July 2007
Page 17
Installation
IB0133 Rev. 13
Power Connectivity
120 VAC
24 VDC
240 VAC
Description
LINE
Neutral
Ground/Earth
+24 VDC
24 VDC Return
Ground/Earth
LINE 1
LINE 2
Ground/Earth
terminus
1
2
3
1
2
3
1
2
3
Table 3-7: Power Connections

(Only one type of power should be connected)
Description
Terminus
Status 5V Normal, 0V Alarm TB5-5
GND
TB5-7
Table 3-8: Status Output
3.4 Power Up
Upon completion of wiring the unit is ready for start-up. Turn on site power and verify that the correct
voltage (per transmitter nameplate) is found on the transmitter power terminals. If proper power is not
verified refer back to Section 3.3 for wiring. Once the proper power is verified, turn on the unit at the
power breaker switch, CB1. The three green and 2 red LEDs at the top of the APU should light up (See
Figure 5-1). If the LEDs do not light up properly, contact your Caldon representative.
Installation
Page 18
July 2007
IB0133 Rev. 13
OPERATION
4.1 Commissioning
The SoundTrack measures the sound velocity and viscous attenuation of the fluid in the pipeline. The
acoustic properties are then used to infer the density and viscosity of the fluid. The resulting values of
density and viscosity are indicators of these properties, not absolute measurements. During the initial
commissioning of the SoundTrack, care should be taken to determine how these indications match with
the expected properties in the line.
It is not unusual for the indicated viscosity or density to not exactly match the independently measured
properties. The SoundTrack is NOT BROKEN in these cases. The relationships used to calculate these
values are empirical and are dependent on the fluids (particularly crudes). In cases where it is necessary
for the SoundTracks indication to more closely match the actual properties of the fluid, calibration
software can be used in conjunction with site samples to refine the empirical relationship. Contact your
Caldon representative for more information on the SoundTrack Calibration Software.
4.1.1 Diagnostics Check
Once the SoundTrack is installed and powered up and the line is filled with fluid, the next step in
commissioning is to check the meter diagnostics. The meter diagnostics can be checked in three ways:
1. LEFMLink Cameron supplies a general diagnostics tool called LEFMLink. This tool reads and
logs SoundTrack data from to a PC. This software is available from Cameron at no charge and
can be downloaded from the web site, www.c-a-m.com.
2. SoundTrack Calibration Program If you are using the SoundTrack Calibration Program, you
can read diagnostic information while entering fluid information into the database. See the
SoundTrack Calibration Program Manual for more information.
3. Directly from the device using Modbus. See the Modbus manual for more information.
Once the diagnostic information is available, check the following:
1. Percent Rejects should be 0%.
2. Status should be normal.
3. Gain Up / Dn should be between 40 and 70 dB.
4. Temperature should be reading a value close to line conditions.
5. Echo Mode box is checked as true.
If the system fails any of the above checks verify that the wiring is correct and all the wires are firmly
connected in the terminals. Startup problems are most commonly due to wiring problems. Refer back to
Section 3.3 for wiring details.
If a computer is not available for diagnostics, check that the status indicator (TB-5-5 (+) and TB-5-7
(Ground)) measures 5V. If there is a problem then the status indicator will measure 0V.
4.1.2 Interface Detection
After the system has passed the initial diagnostics check, it is ready to setup for interface detection. If
the SoundTrack Calibration software is being used, set it up and start using it at this time.
Set up to monitor the viscosity and density using either analog outputs or Modbus. Monitor the
performance of the SoundTrack during a known interface. This will establish a baseline for the system.
July 2007
Page 19
Operation
IB0133 Rev. 13
Many systems may not have a sharp change from one product to another (extended interface due to
product mixing). However, most systems will have a characteristic shape that can be used to aid the
operator in detection of an interface.
Once the system is characterized, the operator can set limits to control the SoundTrack. This control is
dependent on the users system, contact Caldon if assistance in required in setting up your system.
4.2 Theory of Operation

The SoundTrack uses sound velocity and fluid attenuation to infer the density and viscosity of the fluid
in the line.
4.2.1 Sound Velocity Measurement
The SoundTrack uses the time of flight of an acoustic signal to calculate the velocity of sound of the
fluid. The APU board in the transmitter triggers the transducer to generate an acoustic pulse. That pulse
travels through the fluid at the speed of sound in that fluid. A transducer on the opposite side of the pipe
collects the pulse. The APU then calculates the time the pulse is in transit. This time is then used
calculate the velocity of sound as follows:
Length
C fluid
tdown t non _ fluid
4.2.2 Fluid Attenuation Measurement
The APU uses automatic gain control to measure the fluid attenuation. There are two modes of
operation to calculate the attenuation of the fluid. In the standard mode, Pulse-Echo mode, the acoustic
signal travels across the pipe once (Direct Mode) and then echoes back across the pipe a second time.
The signal gain (strength) is measured for both modes.
Direct Mode
Firing
Transducer
Receiving
Transducer
Echo Mode
Firing /
Receiving
Transducer
Signal
Reflects
The attenuation of the fluid is the difference between the echo and direct mode gains corrected for
reflection losses.
If the echo mode is not functioning then the attenuation is calculated from the direct mode data and a
historical correction term that was calculated when the SoundTrack was working in Echo Mode.
4.2.3 Density Calculation
The density is calculated by first calculating a general product identification density (PID).
PID = f(Cf, T, P)
Where, Cf = Sound Velocity of Fluid, T = Temperature, and P = Pressure.
Operation
Page 20
June 2012
IB0133 Rev. 13
The PID is then used to select one of ten product curves to calculate the actual density.
= f(Cf, T, P)
The calculated density can then be adjusted by a slope and offset to adjust for a site calibration. The
SoundTrack Calibration software can be used to adjust these curves.
4.2.4 Viscosity Calculation
The viscosity calculation uses the fluid attenuation (Ha) to select a viscosity curve to representative of a
specific fluid type. Each curve is used to calculate viscosity from attenuation, sound velocity, and
temperature. There are eleven possible curves to select from. Sound velocity is generally used for
lighter fluids and attenuation is used for heavier fluids.
Once the viscosity is calculated it can then be adjusted by a slope and offset to adjust for site conditions.
This adjustment can be performed simply with the SoundTrack Calibration software.
4.3 Acoustic Processing Unit (APU)

The acoustic processing unit transmits and receives ultrasonic pulses and measures their transit times
and gains. From process data it computes viscosity, sound velocity, and relative density, and generates
outputs. The acoustic processing unit is a specialized board proprietary to Caldon designed to achieve
high sampling rates and stable ultrasonic signals.
The APU performs all control and timing for the generation and measurement of acoustic pulses. The
APU has a microprocessor programmed to perform the following functions:
Provide gain control for each ultrasonic transducer based upon acoustic signal strength
Compute viscosity and density
Generate analog outputs
Setups and Data to/from the APU are provided by a serial link (Modbus, i.e. LEFMLink).
4.4 Fault Detection

The APU performs the following automatic fault detection:
Checks data quality for ultrasonic transducers and evaluates data against thresholds. The data is
evaluated based on SNR (signal to noise ratio), cross-correlation tests, and signal statistics.
Occasional rejected or bad data does not influence the operation. However, if the ultrasonic path
continues to fail, the SoundTrack sensor will alert operators with the ALARM status and an error
code.
The APU outputs status via Modbus. The status may be one of the following:
NORMAL status.
ALARM status: Path has no acoustic signal or is rejecting data due to low SNR, irregular
statistics or failing cross-correlation tests. Viscosity and density are set to minimum value.
The status is also output on TB-5-5. Normal operation, 5V. Alarm Operation, 0V.
4.5 Backplane
The backplane provides the interface between the electronics, the wafer, and customer terminations. The
backplane uses plug-in interface adapters to protect the electronics and provide easy repair and
replacement. Analog inputs plug into MB1 4, analog output plug into MB5 8, and the status bit is
isolated using MB9 (See Figure 5-6).
July 2007
Page 21
Operation
IB0133 Rev. 13
4.6 Remote Data Communications

The SoundTrack sensor has one communication port using the Modbus protocol. See the Modbus
manual for more detail.
Operation
Page 22
June 2012
IB0133 Rev. 13
MAINTENANCE
WARNING: NO OPERATOR ACCESS IS PERMITTED IN THE UNIT. SERVICE
SHOULD ONLY BE PERFORMED BY QUALIFIED PERSONNEL.
5.1 Introduction
The purpose of this section is to provide procedures for troubleshooting and maintenance tasks which
personnel can perform on each SoundTrack. These procedures may be incorporated into the customers
standard maintenance program.
This section includes procedures for maintaining the SoundTrack that are designed for a trained
maintenance technician to perform. These procedures may require the maintenance person to reference
schematics, system connection diagrams, and construction outlines in Section 1.
5.2 General Inspections - Preventative Maintenance Procedures

This procedure covers the inspection of the electronics unit, transducers, metering sections, and cables.
WARNING
DO NOT OPEN WHEN ENERGIZED!
BEFORE INSPECTING COMPONENTS
OPEN THE SOUNDTRACK CIRCUIT BREAKER
TO AVOID ELECTRICAL SHOCK.
CAUTION
WEAR AN ESD PROTECTIVE
WRIST STRAP TO AVOID
DAMAGING ANY COMPONENTS
June 2012
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Maintenance
IB0133 Rev. 13
Enclosure Inspection
Perform the following inspections on each enclosure:
a. Verify electronic unit enclosure has suffered no structural damage. Report any damage to proper
maintenance supervisor.
b. Remove dust, dirt, and other soiling from enclosure. If necessary, remove power to the
SoundTrack by opening circuit breaker CB1.
c. Inspect access cover gaskets. Clean gaskets and mating surfaces on enclosure with water if they
are dirty; remove any corrosion from mating surfaces. Verify gaskets compress when cover is
installed and fastened to enclosure.
d. Inspect door latch mechanism.
e. Lubricate door hinges with lubricant specified on enclosure.
f. Inspect enclosure mounting and fastening hardware.
Internal Electronics Inspection
a. If necessary, remove power to the SoundTrack by opening circuit breaker CB1.
b. Put on an ESD (Electrostatic Discharge) protective wrist strap. Connect ESD protective wrist
strap to a known ground; any part of enclosure structure is an acceptable ground.
c. Inspect cable entry points to assure that cable insulation is undamaged. Inspect cables that cross
hinges to assure that cable insulation is undamaged.
d. Inspect cable connections for tightness. Clean connections if fouled or corroded with electronic
contact cleaning fluid.
e. Inspect all internal connections and terminals for tightness, clean connectors and terminals if
fouled or corroded with electronic contact cleaning fluid.
f. Inspect fuses to assure that they are not damaged or discolored. Replace any damaged or blown
fuses.
g. Inspect display panel components (if supplied) and devices for damage. Replace any damaged
components. Check all connectors to see that each is properly seated. Check that all devices are
securely mounted.
h. Inspect acoustical processing unit (APU) components and devices for damage. Check that the
printed circuit boards are properly seated. Check that devices are securely mounted. Clean dust
and grime from the surface of all components using compressed air or a PC parts cleaner.
i.
Caution: Heater located behind the backplane, allow surface to cool.
j. Clean dust and grime from all surfaces of the enclosure interior walls using compressed air or a
PC parts cleaner.
Maintenance
Page 24
July 2007
IB0133 Rev. 13
5.3 Power Supply Voltage Troubleshooting and Maintenance

With the unit energized and the system software executing, verify by looking at the top edge of the APU
cards that the following indicator lights are on:
Green LED, Normal State ON indicates +5 VDC
power supply is operating
Top Edge of Board
Green LED, Normal State ON indicates +12 VDC

Green LED, Normal State ON indicates -12 VDC
Red LED, Normal State ON indicates +150 VDC
Red LED, Normal State ON (flashing at high rate)
indicates transmit pulse is operating normally
DIP Switch for Troubleshooting
TP4, Test Point 4, Test point for received ultrasonic

signal for each path
TP3, Test Point 3, Test point used for external

trigger of an oscilloscope
Figure 5-1: APU LED Indicators
If any of the power supply voltage lights are not on, please check the backplane voltage (See terminal
block on Figure 5-2, See Table 5-1). If the power supplies are functioning properly, then the APU fuses
may need to be replaced. If not, then the power supply should be tested and possibly replaced.
June 2012
Page 25
Maintenance
IB0133 Rev. 13
The following table provides the specified backplane voltages.

Table 5-1: Required Backplane Test Voltages
Terminal
TB8-1
TB8-2
TB8-3
TB8-4
Name
5 Volts
+12 Volts
-12 Volts
Ground
Requirement
5 0.1 Volts
+12 0.5 Volts
-12 0.5 Volts
Electrical Ground, 0V
Figure 5-2: APU Backplane Terminal Block to Inspect Voltages
Maintenance
Page 26
July 2007
IB0133 Rev. 13
+5 V (1.5A) F2
150 VDC (0.125A) F1
+12V (0.5A) F7
-12V (0.5A) F10
Figure 5-3: APU Fuse Location (Green Circuit Board)

(Note Figure is displayed sideways)
June 2012
Page 27
Maintenance
IB0133 Rev. 13
+5 V (1.5A) F2 - Very Fast Acting (FF)
150 VDC (0.125A) F1 Very Fast Acting

(FF)
+12V (0.5A) F7 - Very Fast Acting (FF)
-12V (0.5A) F10 Very Fast Acting (FF)
Figure 5-4: APU Fuse Location (Blue Circuit Board)

(Note Figure is displayed sideways)
Maintenance
Page 28
July 2007
IB0133 Rev. 13
5.4 Wafer Inspection and Transducer Cables

5.4.1 Wafer Inspection
Perform the following inspection and maintenance tasks:
a.
Inspect the wafer. Verify wafer has not suffered any damage.
WARNING
b.
Check connectors on transducer cables in J-Box terminal block to verify they are undamaged.
Clean connectors with electronic contact cleaner if fouled or corroded. Verify all mounting
hardware is secure.
5.4.2
Transducer Cable Inspection Checks
WARNING
Inspect transducer cables as follows:
a.
Verify each transducer cable for physical damage. Check connectors on cables at each end to
verify each is undamaged. Clean connector with electronic contact cleaner if fouled or corroded.
Replace any damaged cable or connector.
b.
Reinstall transducer housing covers and J-box cover after completing all inspections.
c.
Disconnect connectors from Electronics. Check continuity and isolation of cables (shield,
positive, negative, earth ground, and impedance of transducers).
d.
Verify cable impedance (positive/negative disconnected from transducer and +/shield/disconnected from electronics) as follows:
e.
Positive to negative
> 10M
f.
Positive to shield
> 10M
g.
Negative to shield
> 10M
h.
Shield to earth ground
> 10M
June 2012
Page 29
Maintenance
IB0133 Rev. 13
i.
Reinstall cables when completed.
5.4.3
Transducer Installation Procedure
The SoundTrack system may require verification when a transducer is replaced or re-coupled.
The transducer should be installed using the following procedures:
Step 1
Step 2
Step 3
Step 4
Step 5
Step 6
Step 7
Maintenance
Power down the SoundTrack and disconnect the transducer to be replaced from the terminals
in the J-Box.
Remove the 1-1/4 plug covering the transducer well and route transducer wires from J-Box
through the wire routing channel and out from the transducer well.
Remove transducer internals. Use a 3/4" O-ratchet to back off the compression screw. The
transducer leads should be pulled through the back of the ratchet.
Verify the transducer housing is clean and free from dirt.
Re-install the transducer intervals with fresh coupling material:
a) Thread the wires of the transducer though the spring assembly and the spacer (if present).
b) Apply 3 drops of silicone lubricant to the transducer face before inserting into the
transducer housing or replace the coupling foil.
c) Insert the transducer and components into the well until the transducer face is against the
bottom of the transducer well.
d) Route the wires though the compression screw and then apply lubricant to the threads.
Screw into the transducer well and tighten. This will load the compression spring.
Route transducer wires back through the wire routing channel to the J-Box and connect the
new transducer to the J-Box terminals.
Re-install the 1-1/4 plug and J-Box cover.
Page 30
July 2007
IB0133 Rev. 13
Figure 5-5: Exploded view of Wafer

5.4.4 Analog Input Alignment
The SoundTrack sensor has one Resistance Temperature Detector (RTD) input. The input signal is
conditioned and powered through an interface module, which is located in the transmitter, MB1. There
are no adjustments on the temperature interface module.
The input is scaled in software to linearly convert the temperature transmitter module voltage (0-5V) to
the maximum and minimum engineering value ranges. The scaling constant can be adjusted through the
RS232 port via Modbus or LEFMLink.
A failed input will typically go to its lowest range. For example, a 0-5V temperature input scaled to 32200F will go to 32F if the input is removed.
If the SoundTrack sensor does not respond to the calibration, then check the following:
a.
Connection to the backplane
b.
Scaling constants in software
c.
Analog Input Interface Module: Temperature (Location M1)
June 2012
Page 31
Maintenance
IB0133 Rev. 13
5.4.5
Analog Output Verification
The SoundTrack sensor may have up to four analog output channels. Each channel has a 4-20 mA range.
There are no adjustments to be performed for the analog outputs. Analog outputs are routed through
isolation modules:
M5
Relative Density
M6
Kinematic Viscosity
M7
Temperature
M8
Direct Mode Acoustic Gain
5.4.6 Analog Output Scaling
The analog outputs are scaled linearly anywhere between their maximum and minimum values.
LEFMLink can be used to set a maximum and minimum scaling to which the output is linearly spanned.
LEFMLink can be used to force output values (as a % of the scaling). This feature may be used to verify
output signals.
Maintenance
Page 32
July 2007
IB0133 Rev. 13
M8 - Direct Mode Gain (4-20mA)
M7 - Output Temperature (4-20mA)

M6 - Output Viscosity (4-20mA)
M5 - Output Density (4-20mA)
M2 - Pressure
M1 - Input Temperature (RTD)
Figure 5-6: Input and Output Connections on the Acoustic Processing Unit Backplane
June 2012
Page 33
Maintenance
IB0133 Rev. 13
Output Specific Gravity (0,4-20mA) Interface Module

Output Temperature (0,4-20 mA) Interface Module
Output Flow or VOS (0,4-20mA) Interface Module

Output Flow (0,4-20mA) Interface Module
Pulse Output Interface Module
Input Fluid Density (0,4-20mA Frequency) Module

Input Fluid Temperature (0,4-20mA or RTD) Module
Input Pressure (0,4-20mA) Interface Module

Input Meter Temperature (0,4-20mA or RTD) Module
Figure 5-7: APU Backplane: Interface Module Location (Typical)

Maintenance
Page 34
July 2007
IB0133 Rev. 13
TROUBLESHOOTING AND DIAGNOSTICS FOR THE ULTRASONICS
6.1 Diagnostics
The SoundTrack Transmitter interfaces to external devices via a serial port or infrared port. The
SoundTrack uses the MODBUS protocol. Cameron provides PC (laptop) software to interface with the
transmitter via MODBUS (LEFMLink). Alternatively, the Caldon MODBUS manual can be used to
select the appropriate registers.
Note: Throughout, the remainder of this manual, values such as path SNR (Signal to Noise Ratio),
gain, etc., are discussed as if the reader is using the Cameron provided software (LEFMLink),
(MODBUS register addresses will not be mentioned, see the Modbus users manual).
For the ultrasonic signals, the most frequently used diagnostic information will be the following:
Rejects (% Unused Data) Range 0 100%, normal operation, 0 5%
Gain (Up/Down) Electronic amplification in dB required to process received ultrasonic signals.
Range 0 88dB, normal operation, 40 dB 80 dB
SNR (Signal-to-Noise-Ratio) Range 0 - 100
The SoundTrack performs the following automatic fault detection:
The APU checks data quality of the ultrasonic signals and evaluates data against pre-set
thresholds. The data is evaluated based on SNR, cross-correlation tests and signal statistics.
Occasionally data will be rejected; however, this will not influence the operation. If the
ultrasonic path continues to reject data, the meter will enter an "ALARM" status.
The APU will output the current status through a digital output and MODBUS.
The meter status (based upon the path status) includes:
"NORMAL" status meter
"ALARM" status Acoustic path failure. Analog output set to minimum; computed relative
density is set to -1 and viscosity is set to -1000.
June 2012
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Troubleshooting and Diagnostics
IB0133 Rev. 13
6.2 Path Troubleshooting

The SoundTrack continuously checks the data quality of the acoustic path. Each time the ultrasonic
signal is sampled, the APU tests the signal as follows:
Verifies paths SNR is higher than its threshold value.
Correlates the Upstream Signal with the Downstream Signal to test for cycle skipping. The
APU rejects data that does not pass this correlation test.
Verifies the statistics of the computed transit time and Delta T are acceptable.
6.2.1 Path Reject Status
When the path status indicates that the Reject Test is failed, it indicates that the percentage of data that
has been rejected has exceeded the SoundTracks thresholds. The following troubleshooting sequence
can be followed to pinpoint the root cause.
1.
2.
3.
4.
5.
6.
7.
Verify that the pipeline (wafer) is full of liquid.

Verify continuity for all cables.
Check all APU power supply voltages. If the LED for any power supply is not lit on the front of
the APU card, then the fuse may be blown, or the power supply has failed. (See Section 5.3).
Check Transmit LED on APU board. If transmit LED on the APU is not lit, then the APU may
need a configuration file, otherwise replace current APU board with a new APU board.
Check the Acoustic Signal
Check path gains (via MODBUS or Caldon Interface Software). If the path gains are high (85db
and higher), then the signals may be too weak to operate. Weak signals can be caused by any of the
following (listed from most likely to least likely)
Line is not full of liquid.
Line pressure is too low for the vapor pressure
Cable/wire from the meter to the transmitter is damaged
Transducer coupling needs to be replaced (with grease couplants only)
Transducer has failed
Determine Which Transducer Has Failed
The transmitter continuously operates each transducer individually in a pulseecho mode. Pulseecho means that a transducer transmits acoustic energy across the liquid, and receives the energy
echoed off the opposing transducer. In pulse-echo mode, the transmitter then computes the gain
for both upstream and downstream transducers.
The gains for the upstream and the downstream pulse-echo tests are normally equal (4 dB).
However, a failed transducer due to wiring, coupling, etc., will show a higher gain (greater than
4dB, typically). Using the direct acoustic path and the pulse-echo paths, follow these steps to
determine which transducer to evaluate:
1. Ensure that the direct path SNR is at least 30.
2. Review the gains for the direct acoustic path (both upstream and downstream). The gains
should be between 40dB and 70dB. Upstream and downstream gain should nominally
be within 3 dB of each other.
3. Review the gains for each pulse-echo path (upstream and downstream). The transducer
with the higher gain should be investigated first.
Page 36
June 2012
IB0133 Rev. 13
Note: There will be situations where the pulse-echo path gains are at the maximum
(~88dB). If this is the case, investigate the cables and the transducers of both
transducers.
If an acoustic signal does not exist (100% rejects), or if SNR has degraded significantly from
installation, then follow checklist below:
1.
Verify the pipeline (wafer) is full of liquid.
2.
Check the transducer impedance. If the transducer impedance is less than 10 M, then replace
transducer.
NOTE: If a meggar is used to test cables/transducers, DO NOT USE voltage over 250V. Do not
use MEGGER w/o Disconnecting Cable from Electronics!
3.
4.
5.
Check the impedance of the transducer cable. If cable impedance is less than 10 M, then
replace/repair cable.
Check continuity of transducer cable. If transducer cable continuity impedance is infinite, then
repair/replace cable.
If a signal is present, the ultrasonic transducer may need to be reseated, or the acoustic coupling
may need to be replaced. See Section 5.4.4.
6.3 Troubleshooting Acoustic Signals

Being able to view and understand acoustic signals is essential when troubleshooting failed acoustic
paths.
6.3.1 Oscilloscope Setup
To observe the waveform from a received transducer signal, connect an oscilloscope to the "Receive"
test point (TP4) on the top edge of the APU card and connect the probe's ground to TP00 (Reference
Figure 5-2). Next, connect the oscilloscope's "external trigger" to the "trigger" test point (TP3) on the
top edge of the APU card. An external trigger level of 2-3 volts is appropriate for most oscilloscopes.
6.3.2 Observed Waveform
With the oscilloscope set to 1 volt/division, and the timebase set to 2 microseconds / division, the
transducer signal waveform should be similar to that shown in Figure 6-1. Note that the time base delay
of the oscilloscope should be set to approximately the expected transit time of the ultrasonic signal (See
T-down from LEFMLink).
In troubleshooting an observed wave form, verify that the peak cycle of the wave form is ~3V.
Preceding random noise should be nominally <0.2 Vpp.
June 2012
Page 37
IB0133 Rev. 13

4
Peak Cycle ~ 3V
3
2
Triggering Cycle Typically 60 - 90% of Peak Cycle
1
Volts
Noise Preceding Ultrasonic

Signal Typicall < 0.2 Vpp
0
240
242
244
246
248
250
252
254
256
258
260
-1
-2
-3
Time (microseconds)
Figure 6-1: Example Transducer Signal Waveform
6.3.3
Selecting Transducer Signal Waveforms
Individual acoustic and echo path waveforms can be viewed by using the Control Selector Switches
(Dip Switches) on the front edge of the APU (Reference Figure 5-2). Use Table 6-1 below to determine
the Dip Switch positions for the different paths.
Dip Switch 2
Down
Up
X
X
X
X
Dip Switch 3
Down
Up
X
X
X
X
Dip Switch 4
Down
Up
X
X
X
X
Dip Switch 5
Down
Up
X
X
X
X
Path Selected for Oscilloscope

Transmitting
Receiving
Path 1 Up
Path 1 Down
Path 1 Down
Path 1 Up
Path 1 Up
Path 1 Up
Path 1 Down
Path 1 Down
Table 6-1: Acoustic Transducer Selection

(Note: X indicates Switch Position)
All Dip Switches should be in the down position if the unit is reset or powered down and back up.
The directions "Up" and "Down" used above are when viewing the top edge of the APU, as when it is
inside the SoundTrack Electronics Cabinet.
Page 38
June 2012
IB0133 Rev. 13
Reset
+5V
(LED)
+12V
(LED)
-12V
(LED)
+150V (LED)
TRANSMIT (LED)
1
2
3
4
5
6
Receive Signal
Control Selector
Switches
(switches shown down)
TP4
Trigger
TP3
Ground
TP00
Figure 6-2: Top Edge of APU Board (Side View)
June 2012
Page 39
IB0133 Rev. 13
6.4 Reprogramming the Transmitter

While it is not likely, there may be a time that the transmitter may need to be reprogrammed.
This would typically occur when an APU Board has been replaced with an inventory item, not
specifically assigned to a given wafer. It is Camerons policy to provide a configuration file for each
wafer. This configuration file includes:
o Pipe Size
o Transducer Frequency
o Acoustic Path Lengths
o Calibration Constants
o Alarm Settings
o Analog Input/Output Scaling
The setup file is critical to the specific wafers performance.
1)
Cameron maintains records and configuration files for all of its delivered meters. The
simplest way to reprogram a transmitter is to use Caldons PC software (LEFMLink). See
the LEFMLink Manual.
Once these steps are complete, the transmitter is reprogrammed.

The transmitter may also be reprogrammed through Modbus using a customer interface, however, it is
not recommended. Given that there are many registers to load, the process will be tedious and prone to
errors.
6.4.1
Modbus ID and Baud Rate
All Caldon transmitters are programmed with Modbus ID set to 1, Baud Rate at 9600 and in RTU Slave
Mode. If the transmitter has been reprogrammed with a different setting and this setting is not known,
simply set DIP Switch Number to 2 to up (TRUE) and toggle the reset switch. Resetting the transmitter
in this mode forces the transmitter to operate with its default communication settings (Slave Address =
1, Baud Rate = 9600, RTU Slave).
When the system is restarted with DIP Switch 2 in the Up position the transmitter WILL NOT
TRANSMIT (No LED 5) without first receiving a setup.
Page 40
June 2012
IB0133 Rev. 13
RECOMMENDED SPARE PARTS
7.1 Domestic (US and Canada)

Qty: 1
Qty: 1
Qty: 2
Qty: 1
Qty: 1
Qty: 1
Qty: 1
Qty: 1
F1 - Littelfuse 274.125 125mA radial lead fuse

F2 - Littelfuse 27201.5 1500mA radial lead fuse
F7/F10 - Littelfuse 274.5 500mA radial lead fuses
Serial Communications Kit (Includes LEFMLink Software)
Transducer (appropriate frequency)
Transducer Grease (small tube)
RTD Interface Module (Input)
0-20 mA Interface Module (Output)
7.2 International
Same as above, except includes:
Qty: 1
APU Board
Note: The APU Board contains electrolytic capacitors. In order to maintain proper operation of
these components they must have a functional test at least once every five (5) years. Contact
Cameron's Measurement Systems division for the specifics of the functional test.
June 2012
Page 41
Recommended Spare Parts
IB0133 Rev. 13
Recommended Spare Parts
Page 42
June 2012
IB0133 Rev. 13
WARRANTY - LIMITATION OF LIABILITY: Seller warrants only title to the products, software,
supplies and materials and that, except as to software, the same are free from defects in
workmanship and materials for a period of one (1) year from the date of delivery. Seller does not
warranty that software is free from error or that software will run in an uninterrupted fashion.
Seller provides all software "as is". THERE ARE NO WARRANTIES, EXPRESS OR IMPLIED,
OF MERCHANTABILITY, FITNESS OR OTHERWISE WHICH EXTEND BEYOND THOSE
STATED IN THE IMMEDIATELY PRECEDING SENTENCE. Seller's liability and Buyer's
exclusive remedy in any case of action (whether in contract, tort, breach of warranty or
otherwise) arising out of the sale or use of any products, software, supplies, or materials is
expressly limited to the replacement of such products, software, supplies, or materials on their
return to Seller or, at Seller's option, to the allowance to the customer of credit for the cost of
such items. In no event shall Seller be liable for special, incidental, indirect, punitive or
consequential damages. Seller does not warrant in any way products, software, supplies and
materials not manufactured by Seller, and such will be sold only with the warranties that are
given by the manufacturer thereof. Seller will pass only through to its purchaser of such items
the warranty granted to it by the manufacturer.
Caldon Ultrasonics
Customer Service & Technical Support
1000 McClaren Woods Drive
Coraopolis, PA 15108 USA
Tel 724-273-9300
The ultrasonic measurement

group of Cameron
www.c-a-m.com

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Manual IB0133 Rev. 13

SoundTrack User Manual

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SoundTrack User Manual

SoundTrack User Manual

SoundTrack Model Number .............................................................................................................. 3

2.1.1 Model Number .................................................................................................................................................3

2.4.1 Approvals Transmitter...................................................................................................................................6

3.2.1 Electromagnetic Interference .........................................................................................................................14

4.1.1 Diagnostics Check..........................................................................................................................................19

Theory of Operation ........................................................................................................................ 20

Sound Velocity Measurement ........................................................................................................................20

Acoustic Processing Unit (APU)..................................................................................................... 21

Wafer Inspection ............................................................................................................................................29

SoundTrack User Manual

5.4.6 Analog Output Scaling...................................................................................................................................32

TROUBLESHOOTING AND DIAGNOSTICS FOR THE ULTRASONICS........................................35

6.2.1 Path Reject Status...........................................................................................................................................36

Troubleshooting Acoustic Signals................................................................................................... 37

6.3.1 Oscilloscope Setup .........................................................................................................................................37

Reprogramming the Transmitter ..................................................................................................... 40

6.4.1 Modbus ID and Baud Rate .............................................................................................................................40

RECOMMENDED SPARE PARTS...........................................................................................................41

Domestic (US and Canada) ............................................................................................................. 41

SoundTrack User Manual

1.1 System Description

1.2 Principles of Operation

SoundTrack User Manual

SoundTrack User Manual

2.1 SoundTrack Model Number

Wafer Part Code

H = Hydrocarbon Product Line

Transducer Frequency (10*MHz)

SoundTrack User Manual

Transmitter Part Code

Analog Output Options

SoundTrack User Manual

NEMA 4X - 30 lbs. (13.6 kg)

24 VDC 3.0 Amps

20W (80W with heaters active)

15 feet (approximately 5 meters); lengths up to 200' (61 meters)

4-20mA or 0-20mA (max load 650 Ohms), up to 4 total.

4-20mA, 0-20mA, RTD, or Frequency, up to 3 total.

SoundTrack User Manual

2.3 Environment (Transmitter and Wafer)

-40 to 200F (-40 to 93C)

Operating Temperatures (See Approvals)

SoundTrack User Manual

2.5 Transmitter Figures

Figure 2-1: Transmitter Unit - NEMA 4X Enclosure

SoundTrack User Manual

Figure 2-2: Transmitter Unit - NEMA 4X with Door Open

SoundTrack User Manual

Figure 2-3: Transmitter Unit - NEMA 7 Enclosure

SoundTrack User Manual

Figure 2-4: Transmitter Unit NEMA 7 with Door Open

SoundTrack User Manual

2.6 Wafer Figures & Dimensions

Figure 2-5: Wafer Dimensions

SoundTrack User Manual

SoundTrack User Manual

Steps for Installation: