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Vcl
380V
Icl
10A
ICC
150mA
10
PowerSO-10
DESCRIPTION
The VB325SP is a high voltage power integrated
circuit made using the STMicroelectronics
VIPower M1-3 technology, with vertical current
flow power darlington and logic level compatible
driving circuit. The enable pin allows to externally
block the switch when the input is on. Built-in
protection circuit for coil current limiting and
collector voltage clamping allows the device to be
used as smart, high voltage, high current interface
BLOCK DIAGRAM
BD
VCC
HVC
VIN
DRIVER
QUASI PROP.
BASE CURRENT
RSENSE
LIMITER
DIAGNOSTIC
OUTPUT
VCC
VR
VF1
VLIM
THERMAL
PROTECTION
REFERENCE
VTH
SN
November 2003
LGND
GND
1/9
VB325SP
ABSOLUTE MAXIMUM RATING
Symbol
HVc
IC
IC(gnd)
VCC
Is
Is(gnd)
VIN
IIN
fIN
VOUT(flag)
IOUT(flag)
Pmax
Es/b
VESD
VESD
VESD
IBD
VBD
Tj
Tstg
VE
IE
Parameter
Collector voltage (Internally limited)
Collector current (Internally limited)
DC current on Emitter Power
Driving stage supply voltage
Driving circuitry supply current
DC current on Ground pin
Input voltage
Maximum Input Current
Logic Input Frequency in Operative Mode
Output Voltage Primary Threshold Current Level
Flag Output Current
Power Dissipation (Tc=25C)
Self Clamped Energy during Output Power Clamping (See figure 2)
ESD voltage (HVc pin)
ESD voltage (Enable pin)
ESD voltage (Other pins)
Input Darlington Base Current
Input Darlington Base Voltage
Operating Junction Temperature
Storage temperature Range
Maximum Enable Voltage
Maximum Enable Current
Value
-0.3 to Vclamp
10
10.5
-0.3 to 7
200
1
-0.3 to VCC + 0.3
100
DC to 150
-0.3 to VCC + 0.3
100
125
275
4
+ 1.5 ; -2
2
150
Internally limited
-40 to 150
-55 to 150
-0.3 to 5.5
150
Unit
V
A
A
V
mA
A
V
mA
Hz
V
mA
W
mJ
KV
KV
KV
mA
V
C
C
V
A
Value
1
51
Unit
C/W
C/W
THERMAL DATA
Symbol
Rthj-case
Rthj-amb
Parameter
Thermal resistance junction-case
Thermal resistance junction-ambient
(MAX)
(MAX)
PIN FUNCTION
No
1-5
2-3-4
6
7
8
9
10
TAB
Name
LGND
GND
E
VCC
BD
INPUT
FLAG
HVC
Function
Signal Ground
Emitter Power Ground
Enable (*)
Logic Supply Voltage
Base Darlington
Logic input channel (Internal Pull Down)
Diagnostic Output Signal (Open Emitter)
Primary Coil Output Driver (Open Collector)
5
4
3
6
7
8
9
E
VCC
BD
INPUT
FLAG
10
1
TAB
HVC
2/9
LGND
GND
GND
GND
LGND
VB325SP
ELECTRICAL CHARACTERISTICS (5.3V < Vbat < 24V; VCC=5V 10%; -40C < Tj < 125C; Rcoil=580m;
Lcoil=3.75mH unless otherwise specified; See note 1)
Symbol
Vcl
Vlcl
Vce(sat)
ICC(stdby)
ICC
Parameter
High Voltage Clamp
Low Voltage Clamp
Power Stage Saturation
Voltage
Stand-by Supply Current
DC Logic Current
Es/b
tON
Turn-on time
tOFF
Turn-off time
ICC(peak)
VCC
Icl
Ic(off)
VINH
VINL
VIN(hyst)
IINH
IINL
IINpd
VdiagH
VdiagL
IdiagTH
IdiagTD
Idiag
Idiag(leak)
VF
Tsd
VEH
VEL
Test Conditions
Icoil=6.5A
Icoil=6.5A; Tj=Tsd
Min
320
30
IC=6A; VIN=4V
Typ
380
40
Max
420
50
Unit
V
V
1.5
11
mA
40
mA
150
mA
5.5
11
5
VCC
0.8
IN=Off
Vb=16V; IC=6.5A; f=100Hz; Load = Coil;
VCC=5.5V
IC=6.5A
-40C < Tj < 125C (See note 2)
IN=Off; VHVC=24V; VCC=5V; Tj=25C
VCC=4.5V
VCC=5.5V
VIN=4V
VIN=0.8V
VIN=4V
REXT=22K; CEXT=1nF (See note 3)
100
4.5
9
0
10
100
30
100
V
A
mA
V
V
V
A
A
A
VCC - 1
VCC
0.5
4.75
4
-0.3
0.4
4.25
4.5
(See figure 1)
IC > IdiagTH; Vdiag=3V
0.5
mA
VIN=Low; VCC=5.5V
10
IC= -1A
L=6mH; IC= 8A
180
Thermal shut-down
intervention
High Level Enable Voltage VIN=VINH; OUT=Off (See Note 4)
Low Level Enable Voltage VOUT free to follow VIN
mJ
15
25
150
2
0.40
V
V
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VB325SP
ELECTRICAL CHARACTERISTICS (continued)
Symbol
IEH
IEL
VBD(off)
VBD(on)
Parameter
High Level Enable Current
Low Level Enable Current
Base Darlington Voltage Off
Base Darlington Voltage On
Test Conditions
VE=5V
VE<0.4V
VE=VEH
VIN=VINH; VE=VEL; IC=6.5A
PRINCIPLE OF OPERATION
Min
Typ
Max
500
- 200
1
1.8
Unit
A
A
V
V
700
650
600
550
Tc=25
C
500
450
E (mJ)
400
350
300
250
Tc=150
200
150
100
50
0
0
10
20
30
40
50
60
L (mH)
4/9
70
80
90
100
110
VB325SP
Figure 3: Self Clamped Inductive Switching
Current Vs. Time
10
T=25
6
T=150
2
0
200
300
400
500
600
700
800
900
1000
+5V
Vbat
1F
100nF
1K
VIN
VCC
BD
HVC
1K
1K
FLAG
1nF
18K
LGND
GND
5/9
VB325SP
Figure 6: Switching time for inductive load
Vbat
Rgen
C
D.U.T
Vgen
Vgen
t
VCC
100V
Vbat
3V
tOFF
tON
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VB325SP
DIM.
MIN.
A
A (*)
A1
B
B (*)
C
C (*)
D
D1
E
E2
E2 (*)
E4
E4 (*)
e
F
F (*)
H
H (*)
h
L
L (*)
(*)
inch
TYP
3.35
3.4
0.00
0.40
0.37
0.35
0.23
9.40
7.40
9.30
7.20
7.30
5.90
5.90
MAX.
MIN.
3.65
3.6
0.10
0.60
0.53
0.55
0.32
9.60
7.60
9.50
7.60
7.50
6.10
6.30
0.132
0.134
0.000
0.016
0.014
0.013
0.009
0.370
0.291
0.366
0.283
0.287
0.232
0.232
1.35
1.40
14.40
14.35
0.049
0.047
0.543
0.545
1.80
1.10
8
8
0.047
0.031
0
2
TYP.
MAX.
0.144
0.142
0.004
0.024
0.021
0.022
0.0126
0.378
0.300
0.374
300
0.295
0.240
0.248
1.27
0.050
1.25
1.20
13.80
13.85
0.053
0.055
0.567
0.565
0.50
0.002
1.20
0.80
0
2
0.070
0.043
8
8
0.10 A B
10
E2
E4
SEATING
PLANE
e
DETAIL "A"
0.25
D
= D1 =
=
=
SEATING
PLANE
A
F
A1
A1
L
DETAIL "A"
P095A
7/9
VB325SP
PowerSO-10 SUGGESTED PAD LAYOUT
14.6 - 14.9
CASABLANCA
10.8- 11
MUAR
6.30
C
A
A
0.67 - 0.73
10
9
9.5
2
3
0.54 - 0.6
8
7
4
5
1.27
Casablanca
Muar
50
50
1000
1000
532
532
C ( 0.1)
10.4 16.4
4.9 17.2
0.8
0.8
REEL DIMENSIONS
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C ( 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
600
600
330
1.5
13
20.2
24.4
60
30.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 ( 0.1)
P
D ( 0.1/-0)
D1 (min)
F ( 0.05)
K (max)
P1 ( 0.1)
24
4
24
1.5
1.5
11.5
6.5
2
End
Start
Top
No components
Components
No components
cover
tape
500mm min
Empty components pockets
saled with cover tape.
500mm min
8/9
VB325SP
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a trademark of STMicroelectronics
2003 STMicroelectronics - Printed in ITALY- All Rights Reserved.
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