SJ-20120320184105-002-Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node Equipment Product Description PDF

ZXMP S325
SDH Based Multi-Service Node Equipment
Product Description
Version 2.20
ZTE CORPORATION
NO. 55, Hi-tech Road South, ShenZhen, P.R.China
Postcode: 518057
Tel: +86-755-26771900
Fax: +86-755-26770801
URL: http://ensupport.zte.com.cn
E-mail: support@zte.com.cn
LEGAL INFORMATION
Copyright 2012 ZTE CORPORATION.
The contents of this document are protected by copyright laws and international treaties. Any reproduction or
distribution of this document or any portion of this document, in any form by any means, without the prior written
consent of ZTE CORPORATION is prohibited.
Additionally, the contents of this document are protected by
contractual confidentiality obligations.

All company, brand and product names are trade or service marks, or registered trade or service marks, of ZTE
CORPORATION or of their respective owners.
This document is provided as is, and all express, implied, or statutory warranties, representations or conditions
are disclaimed, including without limitation any implied warranty of merchantability, fitness for a particular purpose,
title or non-infringement. ZTE CORPORATION and its licensors shall not be liable for damages resulting from the
use of or reliance on the information contained herein.
ZTE CORPORATION or its licensors may have current or pending intellectual property rights or applications
covering the subject matter of this document. Except as expressly provided in any written license between ZTE
CORPORATION and its licensee, the user of this document shall not acquire any license to the subject matter
herein.
ZTE CORPORATION reserves the right to upgrade or make technical change to this product without further notice.
Users may visit ZTE technical support website http://ensupport.zte.com.cn to inquire related information.
The ultimate right to interpret this product resides in ZTE CORPORATION.
Revision History
Revision No.
Revision Date
Revision Reason
R1.1
2012-07-30
Updated the documentation architecture.
R1.0
2012-03-30
ZXMP S325(V2.20) Issued.
Serial Number: SJ-20120320184105-002

Publishing Date: 2012-07-30(R1.1)
SJ-20120320184105-002|2012-07-30(R1.1)
ZTE Proprietary and Confidential
Table of Contents
About This Manual ......................................................................................... I
Chapter 1 System Functions ..................................................................... 1-1
1.1 Service Functions............................................................................................... 1-1
1.1.1 Service Access Types............................................................................... 1-1
1.1.2 Service Access Capacity .......................................................................... 1-2
1.1.3 Multi-Service Functions ............................................................................ 1-2
1.2 System Control and Communication Functions .................................................... 1-3
1.3 Power Supply Function ....................................................................................... 1-4
1.4 Overhead Processing Function ........................................................................... 1-4
1.5 Timing and Synchronization Output Function ....................................................... 1-4
1.6 Alarm Input/Output Function ............................................................................... 1-5
1.7 Alarm Concatenation Function ............................................................................ 1-5
1.8 Tandem Connection Monitoring Function ............................................................. 1-5
1.9 Cross-connect Capacity...................................................................................... 1-6
1.10 Protection Function........................................................................................... 1-7
1.10.1 Equipment Level Protections ................................................................... 1-7
1.10.2 Network Level Protections....................................................................... 1-9
Chapter 2 Technical Specifications .......................................................... 2-1

2.1 Dimension and Weight........................................................................................ 2-1
2.1.1 Cabinet Dimensions and Weights .............................................................. 2-1
2.1.2 Dimensions and Weight of Components .................................................... 2-2
2.1.3 Dimensions and Weight of Boards............................................................. 2-3
2.2 Bearing Requirement of Equipment Room ........................................................... 2-8
2.3 Power Supply Requirements ............................................................................... 2-8
2.3.1 Power Supply Range................................................................................ 2-8
2.3.2 Power Consumption Specifications............................................................ 2-8
2.3.3 Power Consumptions of Typical System Configurations ............................ 2-12
2.4 Environment Requirements............................................................................... 2-14
2.4.1 Grounding Requirements ........................................................................ 2-14
2.4.2 Temperature and Humidity Requirements ................................................ 2-15
2.4.3 Cleanness Requirements........................................................................ 2-15
2.4.4 Application Environment Requirements.................................................... 2-16
2.5 EMC Requirements .......................................................................................... 2-16
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2.5.1 EMS ...................................................................................................... 2-16

2.5.2 EMI ....................................................................................................... 2-19
2.6 Optical Interface Specifications ......................................................................... 2-19
2.6.1 Transmission Code Pattern ..................................................................... 2-19
2.6.2 Optical Modules ..................................................................................... 2-19
2.6.3 Eye Diagram of Optical Transmit Signals ................................................. 2-21
2.6.4 Mean Optical Launched Power................................................................ 2-22
2.6.5 Extinction Ratio ...................................................................................... 2-22
2.6.6 Receiver Sensitivity ................................................................................ 2-22
2.6.7 Receiver Overload.................................................................................. 2-23
2.6.8 Mean Optical Received Power ................................................................ 2-23
2.6.9 Permitted Frequency Deviation of Optical Input Interfaces ........................ 2-23
2.6.10 AIS Rate of Optical Output Interfaces .................................................... 2-23
2.7 Electrical Interface Specifications ...................................................................... 2-23
2.7.1 Code Patterns of Electrical Interface........................................................ 2-23
2.7.2 Permitted Attenuation of Input Interfaces, Frequency Deviation of Input
Interfaces and Bit Rate Tolerance of Output Interfaces ............................ 2-24
2.7.3 Reflection Attenuation of Input/Output Interfaces ...................................... 2-24
2.7.4 Anti-Interference Capability of Input Interfaces ......................................... 2-25
2.7.5 Waveform of Output Interfaces ................................................................ 2-25
2.8 Interface Jitter Specifications............................................................................. 2-30
2.8.1 Jitter and Wander Tolerance of PDH Input Interfaces ................................ 2-30
2.8.2 Jitter and Wander Tolerance of SDH Input Interfaces ................................ 2-31
2.8.3 STM-N Interface Inherent Output Jitter .................................................... 2-33
2.8.4 Mapping Jitter of PDH Tributary............................................................... 2-34
2.8.5 Combined Jitter...................................................................................... 2-34
2.8.6 Jitter Transfer Characteristic of Regenerator ............................................ 2-36
2.9 Clock Specifications ......................................................................................... 2-37
2.10 OA Board Specifications ................................................................................. 2-39
2.11 Ethernet Performance Specifications ............................................................... 2-41
2.11.1 Transparent Transmission Performance Specifications............................ 2-41
2.11.2 VLAN Specifications ............................................................................. 2-42
2.11.3 L2 Switching Specifications ................................................................... 2-43
2.12 RPR Performance Specifications..................................................................... 2-44
2.13 ATM Characteristics........................................................................................ 2-46
2.14 External Interface Standards ........................................................................... 2-49
Appendix A Standards and Recommendations ..................................... A-1

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Glossary .......................................................................................................... I
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IV
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About This Manual

Purpose
This manual is applicable to the Unitrans ZXMP S325 SDH based multi-service node
equipment.
Unitrans ZXMP S325 is a multi-service node equipment with the highest transmission rate
of 2.5 Gbit/s. It can apply to the access network.
Intended Audience
This manual is intended for:
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Planning engineer
Maintenance engineer
What Is in This Manual

This manual contains the following chapters:
Chapter
Summary
Chapter 1, System Functions
Explains about the system functions.
Chapter 2, Technical Specifications
Discusses about the technical specifications.
Appendix A, Standards and
Gives the standards and recommendations that ZXMP
Recommendations
S325 complies with.
Related Documentation
The following documentation is related to this manual:
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Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node Equipment System
Description
Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node Equipment Hardware
Description
Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node Equipment Installation
Manual
Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node Equipment
Maintenance Manual
Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node Equipment Operation
Instructions
Conventions
This document uses the following typographical conventions.
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Typeface
Meaning
Italics
Variables in commands. It may also refers to other related manuals and documents.
Bold
Menus, menu options, function names, input fields, option button names, check boxes,
drop-down lists, dialog box names, window names, parameters and commands.
CAPS
Keys on the keyboard and buttons on screens and company name.

Danger: Indicates an imminently hazardous situation, which if not avoided, will result in
death or serious injury.
Warning: Indicates a hazard that, if not avoided, could result in serious injuries,
equipment damages or interruptions of major services.
Caution: Indicates a potential hazard that, if not avoided, could result in moderate
injuries, equipment damages or partial service interruption.
Note: Provides additional information about a certain topic.
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Chapter 1
System Functions
Table of Contents
Service Functions.......................................................................................................1-1
System Control and Communication Functions ..........................................................1-3
Power Supply Function...............................................................................................1-4
Overhead Processing Function ..................................................................................1-4
Timing and Synchronization Output Function..............................................................1-4
Alarm Input/Output Function.......................................................................................1-5
Alarm Concatenation Function ...................................................................................1-5
Tandem Connection Monitoring Function....................................................................1-5
Cross-connect Capacity .............................................................................................1-6
Protection Function ....................................................................................................1-7
1.1 Service Functions

1.1.1 Service Access Types
Table 1-1 lists the services types supported by ZXMP S325.
Table 1-1 ZXMP S325 Service Access Types
Service Type
SDH services
PDH services
Ethernet services
ATM services
Rate
STM-1 (optical/electrical)
155520 kbit/s
STM-4
622080 kbit/s
STM-16
2488320 kbit/s
E3
34368 kbit/s
T3
44736 kbit/s
E1
2048 kbit/s
T1
1544 kbit/s
FE
10 Mbit/s or 100 Mbit/s
GE
1 Gbit/s
ATMSTM-1
155520 kbit/s
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ZXMP S325 Product Description
1.1.2 Service Access Capacity

The ZXMP S325 provides abundant service interfaces, including STM-4 or STM-1 optical
interfaces, STM-1 electrical interface, E3/T3/E1/T1 PDH electrical interfaces, 10/100
Mbit/s Ethernet interfaces, and ATM interface. Table 1-2 lists the ZXMP S325 service
access capability.
Table 1-2 Service Access Capacity of ZXMP S325
Board/Interface
Number of Board
Maximum
Maximum
Type
Ports (channels
Access Capacity
Access Capacity
per board)
per Subrack
per Subrack with
without Board
Board Protection
Protection
(channel)
Remarks
(channel)
STM-16
without Board
Protection
STM-4
123 or 4
13
without Board
Protection
STM-1(optical)
123 or 4
26
without Board
Protection
STM-1(electrical)
1 or 2
12
10
E3/T3
18
15
E1/T1
21
126
105
10/100 Mbps
36
30
48
without Board
Ethernet interface
(electrical)
100 Mbps
Ethernet interface
Protection
(optical)
ATM interface
24
without Board
Protection
GE optical
16
interface
GE electrical
without Board
Protection
16
interface
without Board
Protection
1.1.3 Multi-Service Functions

The ZXMP S325 can process Ethernet service, ATM service and RPR service. It provides
the following interfaces listed in Table 1-3 for multi-service function.
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Chapter 1 System Functions
Table 1-3 Multi-service Interfaces Provided by the ZXMP S325

Interface Type
FE optical
Processing
Interface Board
Connector
Board
Maximum
Board ID
ID
Type
Integration
Access Capacity
(channel per
per Subrack
board)
(channel)
24
16
36
SFEx6SED
interface
OIS1x4
LC/PC
OIS1x6
TFEx8
EIFEx4
EITFEx6
FE electrical
interface
SFEx6SED
EIFEx4EIFEx6
TFEx8
EIFEx4
RJ45
48
EITFEx6
ATM service
AP1x4
OIS1x4
LC/PC
24
RSEBSED
LC/PC
16
SED
RJ45
16
optical interface
GE optical
interface
GE electrical
interface
1.2 System Control and Communication Functions

The system control and communication functions are carried out by the NCP board. The
functions include:
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Sending configuration commands to MCUs and collecting their performance and

alarm information.
Exchanging network management information between NEs through the embedded
control channel (ECC), and supporting the selection of DCCr, DCCm, and DCCr+m.
Note:
The ECC provides the function of transmitting network maintenance information
through the data communication channel (DCC) which is the physical layer of ECC.
The DCC carries communication data between NEs, including DCC bytes in the
regenerator section (DCCr) and DCC bytes in the multiplex section (DCCm).
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Implementing the connection of orderwire phones between NEs through the section
overhead bytes E1 and E2 in the SDH frame.
Through the Qx interface, it reports to SMCC (Subnet Management Control Center)
the alarm and performance information of this NE and of the subnet which the NE
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belongs to, and receives commands and configurations sent from the SMCC to the
NE and subnet. The Qx interface works for communication between NE and SMCC.
Detecting fan status of the NE. Fan speed can be set to half or full in the EMS. If
the fan stops running when equipment is working, the EMS will report alarm.
Monitoring the board-in-position status and over/under-voltage of the power supply
board.
1.3 Power Supply Function

Power supply for the subracks of the ZXMP S325 is supplied by the power boards.
Distributed power supply mode is employed in the ZXMP S325 to supply power to each
subrack separately. Each subrack is equipped with two power supply boards (PWRA) for
1+1 protection.
1.4 Overhead Processing Function

The overhead processing function of ZXMP S325 is performed by NCP board and optical
line boards.
Optical line boards separate section overheads from payload in SDH data frame and
integrate these overheads into an overhead bus. All the boards (including OCS4 board,
optical line board, and NCP board) read or insert corresponding overhead bytes from or
to the overhead bus.
The ZXMP S325 supports the overhead cross-connect function. The overhead can be
configured to any port as required by the EMS.
1.5 Timing and Synchronization Output Function

The master-slave synchronization mode is adopted between ZXMP S325 equipments. The
OCS16 board or OCS4 board performs timing and synchronization functions, including:
clock source selection, clock source switching, and clock exporting.
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Clock source selection

There are multiple ways to get the clock source, including:
Tracing external timing reference
Locking onto a line clock in a certain direction
Locking onto the internal clock
The system allows configuring ten line clock sources and two external clock sources
at the same time.
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Clock source switching

The clock source switching occurs under any of the following three cases:
The current clock source is lost

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A clock source of higher quality level recovers
The current clock source deteriorates
The system clock supports the synchronous priority switching and SSM
algorithm-based automatic switching.
In complex networks, the application of SSM algorithm-based automatic switching
can optimize the timing and synchronization distribution of the network, reduce the
difficulty of synchronization planning, and avoid timing loops, thus ensuring the optimal
network synchronization.
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Clock exporting
ZXMP S325 supports the export of two channels of 2 Mbit/s or 2 MHz external
reference clock signals. The output interface of external reference clock is supplied
by SAIA or SAIB board (system auxiliary interface board).
1.6 Alarm Input/Output Function

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External alarm input interface

The ZXMP S325 supports the function of external alarm Boolean value input, and the
corresponding physical interface is provided by the SAIA board or SAIB board. The
equipment can access at most four channels of external alarms to detect the alarms
of fans, access control, and ambient temperature.
Alarm output interface

The ZXMP S325 supports two channels of alarm output, and the corresponding
physical interface is provided by the SAIA or SAIB board. The equipment outputs
the alarm signal via the touch point switch, and outputs the alarm ringing signals,
critical alarm, major alarm, and minor alarm signals to the column head cabinet in
the equipment room.
1.7 Alarm Concatenation Function

The ZXMP S325 supports the function of alarm concatenation, and the corresponding
physical interface is provided by the SAIA or SAIB board.
The subrack alarm
concatenation output interface (i.e. the alarm output interface) can directly connect to
that of another ZXMP S325 subrack to implement alarm concatenation of multiple ZXMP
S325 equipments.
1.8 Tandem Connection Monitoring Function

The OCS16 or OCS4 board of ZXMP S325 supports the newly added HP-TCM
(Higher-order Path Tandem Connection Monitoring) function.
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As specified in ITU-T G.707 Recommendation, the tandem connection layer locates

between the multiplex section and the path section. Tandem connection mainly applies to
inter-office communication, especially at the border between different network carriers.
This function is implemented by N1 higher-order path overhead byte. It can detect the
number of B3 block errors received in a carriers networks and the number of B3 block
errors transferred to next carriers network.
1.9 Cross-connect Capacity

Optical line boards and/or electrical tributary boards of ZXMP S325 can cross-connect
signals at AU-4, TU-3, TU-12, and TU-11 levels. In addition, they implement protection
switching via cross-connect matrix.
Configured with OCS16 board, ZXMP S325 can implement higher-order cross-connect of
128128 VC-4, and lower-order cross-connect of 3232 VC-4. Configured with OCS4
board, ZXMP S325 can implement higher-order cross-connection of 6464 VC-4, and
lower-order cross-connect of 3232 VC-4.
OCS16 or OCS4 board of ZXMP S325 can perform the functions of a DXC (Digital
Cross Connect) equipment to implement the pass-through, broadcast, add/drop, and
cross-connect of services.
The pass-through, broadcast, and add/drop modes are subsets of the cross-connect
function. In the equipment, both the tributary electrical interfaces and optical line interfaces
are connected to the cross-connect network and their connections are equivalent.
Therefore, the inter-interface services can be cross-connected in any form, as illustrated
in Figure 1-1.
Figure 1-1 Interfaces of the ZXMP S325 DXC Equipment
As shown in Figure 1-2, the service interworking between the NE T1 and NE T2 can be
achieved on the backbone network through NE A. It can also be implemented through
forming a direct service route through NE A without establishing another line between T1
and T2 or adding equipment.
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Figure 1-2 Application of Cross-Connect between Tributaries
The cross-connect function of ZXMP S325 also supports network maintenance and test
during networking and operation.
1.10 Protection Function

1.10.1 Equipment Level Protections
Power Protection
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Out-of-cabinet power protection

Two groups of -48 V power supplies in the equipment room are connected to the
ZXMP S325 equipment. The external power supply 1+1 protection ensures that the
equipment operates normally when either power group fails.
The power distribution box can provide up to 12 channels of power supply to the
subrack, each two channels as a group. Each group can provide power supply in
the active/standby mode. At most six groups of active/standby power supply can be
provided.
Inside-cabinet power protection

Each subrack of the ZXMP S325 can be configured with two power supply boards,
connected to the active power supply and the standby power supply respectively for
1+1 protection. When the active or standby power supply fails, the power alarm will
be reported to the EMS.
Cross-connect Protection and Clock Protection

Configured with one active OCS16 or OCS4 board and one standby OCS16 or OCS4
board, ZXMP S325 can implement the 1+1 protection for cross-connect and clock. In case
of fault, the system can control the switching between the two OCS16 or OCS4 boards
automatically.
The two OCS16 or OCS4 boards can work in 1+1 hot backup mode. The ZXMP S325 can
also be equipped with one OCS16 or OCS4 board.
When configured with one active and one standby OCS16 or OCS4 boards, and they are
both in position and work normally, only the clock of the active OCS16 or OCS4 board is
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exported to the motherboard. If one OCS16 or OCS4 board fails, the clock is switched to
the other OCS16 or OCS4 board.
1:N Protection for Electrical Service Processor Boards

ZXMP S325 can implement the 1:N (N6) protection for E1/T1 service processor board,
1:N (N5) protection for FE service processor board, and 1:N (N5) protection for
E3/T3/STM-1 electrical service processor board. The system can support at most two
groups of 1:N protections.
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1:N protection for E1/T1 service processor board

The ZXMP S325 can support at most 1:6 protection for E1/T1 service processor board.
The active board can choose any slot among the six tributary board slots, while the
standby board slot has two choices:
The standby board can choose any slot among the six tributary slots
Using this method, the system can implement at most 1:5 tributary protection;
meanwhile, the interface board slot corresponding to the standby board slot need
to be configured with the BIE1x21 board (E1/T1 electrical interface bridge board).
The standby board can choose the dedicated slot for E1/T1 standby board
Using this method, the system can implement at most 1:6 tributary protection;
meanwhile, there is no need to install the BIE1x21 board.
1:N protection for FE service processor board

The ZXMP S325 can support at most 1:5 protection for FE service processor board.
The standby board can choose slot 5/6.
1:N protection for E3/T3/STM-1 (electrical) service processor board

The ZXMP S325 can support at most 1:5 protection for E3/T3/STM-1 (electrical)
service processor board. The standby board can only occupy slot 1, i.e. the first slot
of the six tributary board slots.
Note:
The protection for E1/T1/FE service processor board belongs to the same protection
type, while the protection for E3/T3/STM-1 (electrical) service processor board belongs
to another protection type. One ZXMP S325 subrack can simultaneously support two
groups of protections with different protection types, but cannot simultaneously support
multiple groups of service protections with the same protection type. For example, one
subrack does not simultaneously support two groups of 1:N protections for E1 service
processor board; however, it supports 1:N protection for E1 service processor board and
for E3 service processor board simultaneously.
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1.10.2 Network Level Protections

ZXMP S325 supports the following network protection modes:
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MS chain 1+1 protection

MS chain 1:1 protection
2-fiber unidirectional path protection ring
2-fiber bidirectional path protection ring
2-fiber bidirectional MS protection ring with extra service
2-fiber bidirectional MS protection ring without extra service
STM-4/STM-16 4-fiber bidirectional MS protection ring
DNI (Dual Node Interconnection) protection
Subnet Connection Protection (SNCP), including SNC (I) which is subnet connection
protection with inherent monitoring, and SNC (N) which is subnet connection
protection with no interfered monitoring.
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Chapter 2
Technical Specifications
Table of Contents
Dimension and Weight ...............................................................................................2-1
Bearing Requirement of Equipment Room..................................................................2-8
Power Supply Requirements ......................................................................................2-8
Environment Requirements ......................................................................................2-14
EMC Requirements ..................................................................................................2-16
Optical Interface Specifications ................................................................................2-19
Electrical Interface Specifications .............................................................................2-23
Interface Jitter Specifications....................................................................................2-30
Clock Specifications .................................................................................................2-37
OA Board Specifications...........................................................................................2-39
Ethernet Performance Specifications........................................................................2-41
RPR Performance Specifications..............................................................................2-44
ATM Characteristics .................................................................................................2-46
External Interface Standards ....................................................................................2-49
2.1 Dimension and Weight

2.1.1 Cabinet Dimensions and Weights
Table 2-1 describes dimensions and weights of ZXMP S325 cabinets.
Table 2-1 Dimensions and Weights of ZXMP S325 Cabinets
Dimensions (Height Width Depth) (Unit: mm)
Weight (Unit: kg)
2000 600 300
59
2200 600 300
65
The weight refers to the weight of an empty cabinet.

If a 2600 mm-high cabinet is required on site, you can mount a top box on the top of the cabinet.
Figure 2-1 illustrates the outline dimensions of the 300 mm-deep cabinet.
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Figure 2-1 Dimensions of ZTE Transmission Equipment Cabinet (300 mm Deep)
2.1.2 Dimensions and Weight of Components

The dimensions and weights of the ZXMP S325 components are listed in Table 2-2.
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Chapter 2 Technical Specifications
Table 2-2 Dimensions and Weights of ZXMP S325 Components

Component
Dimensions (Height Width
Weight (Unit: kg)
Remarks
59.00
Weight of an empty
Depth) (Unit: mm)

ZXMP unified 300 mm deep
2000 600 300
cabinet
cabinet
2200 600 300
65.00
Weight of an empty
cabinet
Transmission multifunctional
752 608 520
52.20
Outdoor Power cabinet
800 600 600
51.00
Wall-mounted subrack
245 512 255
3.00
Desktop installation
244.5 495.8 230.0
2.80
221.5 482.6 270
9.00
Includes motherboard,
box
components
ZXMP S325 subrack
fan plug-in box,

dustproof unit)
Power distribution box
132.5 482.6 269.5
7.00
With electronic
components
AC power lightning protection
88.1 482.6 75.0
2.50
88.1 482.6 75.0
2.00
Rectifier unit
43.7 436.0 240.0
5.00
Lightning-proof unit
43.7 445.0 197.8
2.50
Motherboard
214.6 438.4 4.5
1.50
Fan box
PCB90 79 1.6
0.52
Includes structural
unit
DC power lightning protection
unit
parts and hardware
Size after assembly:
circuits
21.5 139.6 244.8

Dustproof unit
13.1 279.6 253
Accounted in
subrack weight
2.1.3 Dimensions and Weight of Boards

The dimensions and weight of boards of ZXMP S325 are listed in Table 2-3.
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Table 2-3 Dimensions and Weight of Boards

Board ID
Board Name
Dimension (mm)
Weight (kg)
NCP
NE control processor
PCB: 160 (height) 210 (depth) 2
0.430
(thickness)
Front panel: 181.5 (height) 25.4
(width)
SAIA
SAIB
PWRA
System auxiliary
interface board (type
(thickness)
A)
Front panel: none
System auxiliary
interface board (type
(thickness)
B)
Front panel: none
Power supply board
PCB: 2 (height) 72 (width) 170
0.160
0.130
0.160
(depth)
Front panel: 25 (height) 74 (width)
PWRB
Power supply board
PCB: 2 (height ) 72 (width) 170
0.690
(depth)
Front panel: 25 (height) 74 (width)
FAN
Fan board
PCB: 90 (height) 79 (width) 1.6
0.520
(thickness)
Size after assembly:
21.5 (height) 139.6 (width) 244.8
(depth)
OCS4
OCS16
STM-1/4 optical line,
cross-connect, and
(thickness)
synchronous-clock
board
(width)
STM-16 optical line,
cross-connect, and
(thickness)
synchronous-clock
board
(width)
OL1/4x4 4x
4-channel STM-
STM-1
1/STM-4 optical line
(thickness)
board
OL1/4x4 3x
0.550
0.460
0.485
0.465
(width)
STM-1
OL1/4x4 2x
0.445
STM-1
OL1/4x4 1x
0.425
STM-1
2-4
SJ-20120320184105-002|2012-07-30(R1.1)
Board ID
Board Name
Dimension (mm)
OL1/4x4 4x
Weight (kg)
0.485
STM-4
OL1/4x4 3x
0.465
STM-4
0.445
OL1/4x4 2x
STM-4
OL1/4x4 1x
0.425
STM-4
OL16x1
1-channel STM-16
optical line board
(thickness)
0.410
Front panel: 181.5 (height )25.4

(width)
LP1x1
1-channel STM-1 line
processor
(thickness)
0.355
Front panel: 181.5 (height )25.4

(width)
OIS1x1
LP1x2
1-channel STM-1
optical interface
(thickness)
board
Front panel: none
processor
(thickness)
0.125
0.375

(width)
OIS1x2
LP4x1
2-channel STM-1
optical interface
(thickness)
board
Front panel: none
processor
(thickness)
0.145
0.360

(width)
OIS4x1
LP4x2
1-channel STM-4
optical interface
(thickness)
board
Front panel: none
processor
(thickness)
0.125
0.380

(width)
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SJ-20120320184105-002|2012-07-30(R1.1)
Board ID
Board Name
Dimension (mm)
Weight (kg)
OIS4x2
2-channel STM-4
0.145
optical interface
(thickness)
board
Front panel: none
4-channel STM-1
optical interface
(thickness)
board
Front panel: none
6-channel STM-1
optical interface
(thickness)
board
Front panel: none
Optical booster
amplifier OBA12
(thickness)
OIS1x4
OIS1x6
OBA12
0.185
0.250
0.490

(width)
OBA14
Optical booster
amplifier OBA14
(thickness)
0.490

(width)
BIS1
STM-1 bridge
interface board
(thickness)
0.105
Front panel: none

ESS1x2
EPE1x2175
EPE1x21120
2-channel STM-1
electrical interface
(thickness)
switching board
Front panel: none
21-channel E1
electrical processor
(thickness)
0.140
0.420

(width)
EPT1x21
21-channel T1
(thickness)
0.400

(width)
EP1EBx21
21-channel E1/T1
(thickness)
0.420

(width)
BIE1x21
21-channel E1/T1
bridge interface
(thickness)
board
Front panel: none
0.090
2-6
SJ-20120320184105-002|2012-07-30(R1.1)
Board ID
Board Name
Dimension (mm)
Weight (kg)
ESE1x2175
21-channel E1
0.160
(thickness)
switching board (75
Front panel: none
)
ESE1x21120
21-channel E1/T1
switching board
EP3x3
3-channel E3/T3
(thickness)
0.400

(width)
BIE3x3
ESE3x3
SFEx6PPP
SFEx6GFP
3-channel E3/T3
electrical bridge
(thickness)
interface board
Front panel: none
3-channel E3/T3
(thickness)
switching board
Front panel: none
Smart fast Ethernet
board
(thickness)
0.115
0.145
0.430

(width)
EIFEx4
EIFEx6
EITFEx6
4-channel electrical
interface board of
(thickness)
fast Ethernet
Front panel: none
6-channel electrical
interface board of
(thickness)
fast Ethernet
Front panel: none
6-channel switching
board of smart and
(thickness)
fast Ethernet
0.150
0.140
0.190
(width)
BIFE
Bridge interface
board of fast Ethernet
(thickness)
0.090
Front panel: none

AP1x4
ATM processor with
4 STM-1 ports
(thickness)
0.430

(width)
2-7
SJ-20120320184105-002|2012-07-30(R1.1)
Board ID
Board Name
Dimension (mm)
Weight (kg)
RSEB
Ethernet processor
0.735
with RPR function
(thickness)
(width)
SED
Enhanced smart
Ethernet board
(thickness)
0.640

(width)
TFEx8
8-channel
transparent board
(thickness)
of fast Ethernet
0.380
(width)
2.2 Bearing Requirement of Equipment Room

When only ZXMP S325 is taken into consideration, the bearing of the equipment room
should be greater than 450 kg/m2.
2.3 Power Supply Requirements

2.3.1 Power Supply Range
Rated working voltage of ZXMP S325: -48 V DC
Range: -40 V DC to -57 V DC
2.3.2 Power Consumption Specifications

Table 2-4 lists power consumptions and weights of boards in the ZXMP S325. The power
consumption of the whole system depends on system configuration. It is less than 250 W
with full configuration.
Table 2-4 Power Consumptions of Boards in ZXMP S325
Board ID
Board Name
Max Power
Max Power
Consumption
Consumption (45
(25 C) (W)
C) (W)
Remarks
NCP
NE control processor
4.37
4.50
SAIA
System auxiliary
2.16
2.22
The impedance of
interface board
clock input/ output

interface is 75
2-8
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Board ID
SAIB
Board Name
System auxiliary
Max Power
Max Power
Consumption
Consumption (45
(25 C) (W)
C) (W)
0.97
1.00
interface board
Remarks
The impedance of
clock input/ output
interface is 120
PWRA
-48 V power supply
3.00
3.09
15.80
16.60
board
PWRB
+24 V power supply

board
FAN
Fan board
8.04
8.28
SFP optical module
0.80
0.82
OCS4
STM-4 optical line,
16.17
16.66
STM-1 application
16.95
17.46
STM-4 application
20.88
21.51
9.60
9.89
7.71
7.94
6.74
6.94
5.78
5.95
11.76
12.11
10.04
10.34
8.32
8.57
6.56
6.76
14.11
14.39
cross-connect, and
synchronous clock
board
OCS16
STM-16 optical line,

cross-connect, and
synchronous clock
board
OL1/4x4 4x
4-channel STM-
STM-1
1/STM-4 optical line
OL1/4x4 3x
board
STM-1
OL1/4x4 2x
STM-1
OL1/4x4 1x
STM-1
OL1/4x4 4x
STM-4
OL1/4x4 3x
STM-4
OL1/4x4 2x
STM-4
OL1/4x4 1x
STM-4
OL16x1
1-channel STM-16
optical line board
2-9
SJ-20120320184105-002|2012-07-30(R1.1)
Board ID
LP1x1
OIS1x1
Board Name
Max Power
Max Power
Consumption
Consumption (45
(25 C) (W)
C) (W)
5.75 (LP1x1 and
5.92 (LP1x1 and
processor
OIS1x1)
OIS1x1)
6.96 (LP1x2 and
7.17 (LP1x2 and
processor
OIS1x2)
OIS1x2)
8.26 (LP4x1 and
8.51 (LP4x1 and
processor
OIS4x1)
OIS4x1)
13.06 (LP4x2 and
13.45 (LP4x2 and
processor
OIS4x2)
OIS4x2)
2.16
2.22
Remarks
1-channel STM-1
optical interface board
LP1x2
OIS1x2
2-channel STM-1
LP4x1
OIS4x1
1-channel STM-4
LP4x2
OIS4x2
2-channel STM-4
OIS1x4
4-channel STM-1
Provides optical
interface for SFEx6,

RSEB, AP1x4 boards
OIS1x6
6-channel STM-1
3.05
3.14
Provides optical
interface for SED

board
OBA12
Optical booster amplifier
3.98
8.98
Use EDFA module with
OBA12
OBA14
Optical booster amplifier
no cooling
4.94
9.94
Use EDFA module with
OBA14
BIS1
STM-1 interface bridge
no cooling
2.59
2.67
2.20 (4.62)
2.26 (4.76)
The numbers in
board
ESS1x2
2-channel STM-1
parentheses are
switching board
consumptions after
switching
2-10
SJ-20120320184105-002|2012-07-30(R1.1)
Board ID
EPE1x2175
Board Name
21-channel E1 electrical
Max Power
Max Power
Consumption
Consumption (45
(25 C) (W)
C) (W)
4.42
4.55
The interface
processor
EPE1x21120
Remarks
impedance is 75
6.12
6.30
The interface
impedance is 120
EPT1x21
21-channel T1 electrical
6.10
6.28
The interface
processor
impedance is 100
EP1EBx21
21-channel E1/T1
7.39
7.61
Has no active devices
BIE1x21
21-channel E1/T1
interface bridge board
and consumption can

be ignored
ESE1x2175
21-channel E1 electrical
0.50 (6.29)
0.51 (6.48)
The interface
interface switching
impedance is 75
board
The numbers in
parentheses are
consumptions after
switching
ESE1x21120
21-channel E1/T1
The interface
impedance is 120
switching board
or 100
The numbers in
parentheses are
consumptions after
switching
EP3x3
3-channel E3/T3
6.96
7.17
3.00
3.09
2.13 (4.13)
2.19 (4.25)
The numbers in
BIE3x3
3-channel E3/T3
bridge board
ESE3x3
3-channel E3/T3
parentheses are
switching board
consumptions after
switching
SFEx6PPP
SFEx6GFP
Smart fast Ethernet

board
19.54
20.13
21.27
21.91
2-11
SJ-20120320184105-002|2012-07-30(R1.1)
Board ID
Board Name
EIFEx4
4-channel Ethernet
Max Power
Max Power
Consumption
Consumption (45
(25 C) (W)
C) (W)
0.43 (2.28)
0.44 (2.35)
Remarks
The numbers in
parentheses are
board
consumptions after
switching
EIFEx6
6-channel Ethernet
EITFEx6
0.05
0.05
Provides electrical
interface for SED
board
board
6-channel FE handover
0.46 (2.90)
0.47 (3.00)
board
The value in the

parentheses is the
value after handover
BIFE
Ethernet interface
bridge board
Has no active devices

and consumption can
be ignored
AP1x4
4-channel ATM
16.52
17.02
26.83
27.63
20.88
21.51
16.80
17.65
processor
RSEB
Ethernet Processor with

RPR Function
SED
Enhanced smart
Ethernet board
TFEx8
8-channel fast
Ethernet transparent
transmission board
The weights of OCS4, OCS16, optical line boards, and optical interface boards include the weights of SFP modules.
Power consumptions of boards shall be higher during equipment startup and in low temperature environment. The
refore, the power capacity provided by the equipment should be 1.5 to 1.8 times the power consumptions listed in
the table.
2.3.3 Power Consumptions of Typical System Configurations

Table 2-5, Table 2-6 and Table 2-7 list the power consumptions of three typical ZXMP S325
configurations.
Table 2-5 ZXMP S325 Power Consumptions (Typical Configuration 1)
S.N.
Board/Part
Unit
Quantity
NCP
Piece
SAIA
Piece
PWRA
Piece
OCS4 (S-4.1)
Piece
2-12
SJ-20120320184105-002|2012-07-30(R1.1)
S.N.
Board/Part
Unit
Quantity
LP41
Piece
OIS4x1 (S-4.1)
Piece
EPE1x21 (75)
Piece
ESE1x21 (75)
Piece
SFEx6 (GFP)
Piece
10
EIFEx4
Piece
11
FAN
Piece
12
3U power distribution box
Set
13
ZJ-Front (Front fixed
Set
subrack including MB
and fan)
14
Tested Power Consumption: 109.38W

S.N.
Board/Part
Unit
Quantity
NCP
Piece
SAIA
Piece
PWRA
Piece
OCS16
Piece
OL1/4x4 (4xS-1.1,LC)
Piece
OL1/4x4 (4xS-4.1,LC)
Piece
EPE1x21 (75)
Piece
ESE1x21 (75)
Piece
SED
Piece
10
EIFEx6
Piece
11
FAN
Piece
12
Set
13
Set
subrack including MB and

fan)
14
Tested Power Consumption: 124.23W
2-13
SJ-20120320184105-002|2012-07-30(R1.1)

S.N.
Board/Part
Unit
Quantity
NCP
Piece
SAIA
Piece
PWRA
Piece
OCS16
Piece
OL16 (L-16.2,LC)
Piece
OL1/4x4 (4xS-1.1,LC)
Piece
OL1/4x4 (4xS-4.1,LC)
Piece
EPE1x21 (75)
Piece
ESE1x21 (75)
Piece
10
SED
Piece
11
EIFEx6
Piece
12
FAN
Piece
13
Set
14
Set
subrack including MB and

fan)
15
Tested Power Consumption: 160.26 W
2.4 Environment Requirements

2.4.1 Grounding Requirements
l
If separate grounding is adopted in the equipment room, the grounding resistance

should meet the following requirements:
The ground resistance of -48 V GND: 4 .
The ground resistance of the system working ground: 1 .
The ground resistance of the lightning protection ground: 3 .
If combined grounding is employed in the equipment room, the ground resistance

should meet the following requirements:
The ground resistance: 1 .
The voltage differences among the lightning protection ground, the system
working ground, and the -48 V GND should be less than 1 V.
2-14
SJ-20120320184105-002|2012-07-30(R1.1)
2.4.2 Temperature and Humidity Requirements

The requirements regarding the working temperature and relative humidity of the ZXMP
S325 are given in Table 2-8.
Table 2-8 Temperature/Humidity Requirements
Index
Specification
Working Temperature (inside desktop,mounted
-5 C ~ +45 C
on wall or transmission cabinet )

Working Temperature inside transmission
-5 C ~ +45 C
multifunctional box
Working Temperature (inside outdoor power
-40 C ~ +45 C
cabinet)
Relative Humidity
5% ~ 95%
In normal conditions, the temperature and humidity are measured at 1.5 m above the floor and 0.4 m
near the equipment.
2.4.3 Cleanness Requirements

Cleanness requirements include requirements for dust and harmful gases in the air. The
ZXMP S325 equipment should operate in the equipment room that meets the cleanness
requirements described below:
l
l
l
The equipment room should be free of explosive, conductive, magnetic-conductive or

corrosive dust.
The density of dust particles with the diameter greater than 5m is no more than 3104
particles/m3.
There should be no corrosive metal or insulation-destructive gas in the equipment,
such as SO2, H2S, NH3, NO2, and so on. The detailed information are listed in Table
2-9.
Table 2-9 Density Limit of Hazardous Gases in the Equipment
Gas
Average (mg/m3)
Maximum (mg/m3)
SO2
0.2
1.5
H2S
0.006
0.030
NO2
0.04
0.15
NH3
0.05
0.15
Cl2
0.01
0.30
The equipment room should be always kept clean, with doors and windows tightly
sealed.
2-15
SJ-20120320184105-002|2012-07-30(R1.1)
2.4.4 Application Environment Requirements

According the application scope of GB 4798 and ZXMP S325, the application environment
requirements are listed as follows:
l
l
l
Product storage environment: 1K5, 1Z1, 1B2, 1C2, 1S3, or 1M3. The storage duration
is 180 days.
Product transportation environment: 2K4P, 2B2, 2C2, 2S3, or 2M3. The transportation duration is 30 days.
Product usage environment: 3K5, 3Z2, 3Z7, 3B2, 3C2, 3S2, or 3M3. The usage
duration is 10 years.
2.5 EMC Requirements

The requirements for electromagnetic compatibility (EMC) include two aspects:
requirements for electromagnetic susceptibility (EMS) and electromagnetic interference
(EMI).
The following three criteria should be followed to judge the test result:
l
Performance A: Continuous phenomenon. Neither error nor alarm is allowed. After

electromagnetic interference, the number of error bits does not exceed the maximum
value of the normal requirement.
Performance B: Transient phenomenon. During the course of an electromagnetic
interference, the degradation of function is allowed and the equipment can work as
expected without the operators intervention.
No loss of frame and synchronization is allowed, and neither pattern out-of-sync, nor
AIS alarm is allowed. The equipment shall work normally after the electromagnetic
interference.
The above does not apply to surge testing where some loss of frame alignment may
be expected. For this test, the EUT shall operate as intended following the cessation
of the exposure.
Performance R: Resistive phenomenon. The interference imposed on the equipment

during the test can cause action of the fuse or other specified device which need to
be replaced or reset so that the equipment can work properly.
2.5.1 EMS
ESD Resistivity
The Electrical Static Discharge (ESD) resistivity indexes of ZXMP S325 are listed in Table
2-10.
2-16
SJ-20120320184105-002|2012-07-30(R1.1)
Table 2-10 ESD Resistivity
Contact Discharge
Air Discharge
Criterion
6 kV
8 kV
Performance criterion B
Be sure to wear an antistatic wrist strap during operating in interface areas.
RF Electromagnetic Field Radiation Resistivity

The indexes of the RF electromagnetic field radiation resistivity of the ZXMP S325 are
listed in Table 2-11.
Table 2-11 RF Electromagnetic Field Radiation Resistivity
Test Frequency: 80 MHz ~ 1000 MHz, 1400 MHz ~ 2000 MHz
Electric Field Intensity
Amplitude Modulation
Criterion
10 V/m
80% AM1 kHz
Performance criterion A
Electrical Transient Burst Resistivity

The indexes of the electrical transient burst resistivity at different ports of ZXMP S325 are
listed in Table 2-12, Table 2-13, and Table 2-14.
Table 2-12 Electrical Transient Burst Resistivity at DC PowerPort
Generator Waveform: 5 ns/50 ns
Test Voltage
Repetition Frequency
Criterion
1 kV
5 kHz
Table 2-13 Electrical Transient Burst Resistivity at AC PowerPort

Test Voltage
Criterion
2 kV
5 kHz
Table 2-14 Electrical Transient Burst Resistivity at Signal Cable and ControlCablePorts
Test Voltage
Criterion
1 kV
5 kHz
Surge Resistivity
The surge resistivity indexes of ZXMP S325 are listed in Table 2-15 to Table 2-18.
2-17
SJ-20120320184105-002|2012-07-30(R1.1)
Table 2-15 Surge Resistivity of DC Power Supply

Generator Waveform: 1.2 s/50 s (8 s/20 s); Internal Impedance: 12
Test Mode
Test Voltage
Criterion
Line to line
0.5 kV
Line to ground
1 kV
Table 2-16 Surge Resistivity of AC Power Supply

Test Mode
Test Voltage
Criterion
Line to ground
1 kV
Line to ground
2 kV
Performance criterion R
Table 2-17 Surge Resistivity of Outdoor Signal Cable

Generator Waveform: 10 s/700 s; Internal Impedance: 40
Test Mode
Test Voltage
Criterion
Line to line
2 kV
Line to ground
Table 2-18 Surge Resistivity of Indoor Signal Cable (10 m)

Test Mode
Test Voltage
Criterion
Line to line
1 kV
Line to ground
RF Field Conductivity Resistivity

The indexes of the RF field conductivity resistivity of ZXMP S325 arelisted in Table 2-19.
Table 2-19 RF Field Conductivity Resistivity
Test Frequency: 0.15 MHz ~ 80 MHz
Test Intensity
Amplitude Modulation
Criterion
3V
80% AM1 kHz
Performance criterion A
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SJ-20120320184105-002|2012-07-30(R1.1)
2.5.2 EMI
Conductive Emission Electromagnetic Interference
The indexes of conductive emission electromagnetic interference of the ZXMP S325 are
Table 2-20 Conductive Emission Electromagnetic Interference
Test Frequency (MHz)
Threshold (dBV)
Quasi-Peak Value
Mean Value
0.15~0.5
79
66
0.5~30
73
60
These indexes satisfy the requirements specified in the international standard of CISPR 22 CLASS
A.
Radiated Emission Electromagnetic Interference

The indexes of radiated emission electromagnetic interference of the ZXMP S325 are listed
in Table 2-21.
Table 2-21 Radiated Emission Electromagnetic Interference
Test Frequency (MHz)
Quasi-Peak Wave Detection Limit (dBV/m)

Test Distance: 10 m
Test Distance: 3 m
30~230
40
50
230~1000
47
57
These indexes satisfy the requirements specified in the international standard of CISPR 22 CLASS
A.
2.6 Optical Interface Specifications

2.6.1 Transmission Code Pattern
ZXMP S325 employs the NRZ scramble code. Specification for the scramble complies
with the 7-class synchronous scrambler specified in the ITU-T Recommendation G.707.
2.6.2 Optical Modules

l
Table 2-22 lists the STM-16 optical modules supported by ZXMP S325.
2-19
SJ-20120320184105-002|2012-07-30(R1.1)
Table 2-22 STM-16 Optical Modules Supported by ZXMP S325

Optical Module
Light Nominal
Transmission
Type
Wavelength
Distance (km)
Connector Type
Service
Capacity
(nm)
(Channel per
board)
S-16.1
1310
15
LC/PC
S-16.2
1550
15
LC/PC
L-16.1
1310
40
LC/PC
L-16.2
1550
80
LC/PC
L-16.2U
1550
150
LC/PC
CWDM nS1-2XX
Compliant with
40
LC/PC
80
LC/PC
the ITU-T Recommendation

G.695
CWDM nL1-2XX
Compliant with
the ITU-T Recommendation
G.695
Optical Module
Light Nominal
Transmission
Type
Wavelength
Distance (km)
Connector Type
Service
Capacity
(nm)
(Channel per
board)
S-4.1
1310
15
LC/PC or SC/PC
123 or 4
L-4.1
1310
40
LC/PC or SC/PC
123 or 4
L-4.2
1550
80
LC/PC or SC/PC
123 or 4
Single-fiber
1310/1550
15
LC/PC or SC/PC
123 or 4
1310/1550
40
LC/PC or SC/PC
123 or 4
bidirectional
optical module
S-4.1
Single-fiber
bidirectional
optical module
L-4.1
2-20
SJ-20120320184105-002|2012-07-30(R1.1)

Optical Module
Light Nominal
Transmission
Type
Wavelength
Distance (km)
Connector Type
Service
Capacity
(nm)
(Channel per
board)
S-1.1
1310
15
LC/PC or SC/PC
123 or 4
L-1.1
1310
40
LC/PC or SC/PC
123 or 4
L-1.2
1550
80
LC/PC or SC/PC
123 or 4
Single-fiber
1310/1550
15
LC/PC or SC/PC
123 or 4
1310/1550
40
LC/PC or SC/PC
123 or 4
bidirectional
optical module
S-1.1
Single-fiber
bidirectional
optical module
L-1.1
2.6.3 Eye Diagram of Optical Transmit Signals

The ZXMP S325 eye diagram conforms to the eye diagram mask of optical transmit signal
as shown in Figure 2-2.
Figure 2-2 Mask of Eye Diagram for Optical Transmit Signal
General transmitter pulse shape characteristics include rise time, fall time, pulse
overshoot, pulse undershoot, and ringing. All these may deteriorate the sensitivity of the
receiver and therefore should be restricted.
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To prevent excessive deterioration of the receivers sensitivity, the waveform of transmit

signal should be limited. Therefore, the eye diagram mask sent at the transmit point S is
specified to regulate the pulse shape of optical transmit signal.
Systems at different STM levels should meet corresponding requirements for different eye
diagram mask shapes. The eye diagram mask parameters are listed in Table 2-25.
Table 2-25 Parameters of Eye Diagram Mask for Optical Transmit Signal
Coordinate Relations of Eye
STM-1
STM-4
STM-16
x1/x4
0.15/0.85
0.25/0.75
x2/x3
0.35/0.65
0.40/0.60
y1/y2
0.20/0.80
0.20/0.80
0.25/0.75
x3x2
0.2
Diagram Mask
2.6.4 Mean Optical Launched Power

The mean optical launched power parameters of the ZXMP S325 STM-N (N=1, 4, 16) are
Table 2-26 STM-N Mean Optical Launched Power (dBm)
Index
STM-1
Mean optical
STM-4
STM-16
S-1.1/
L-1.1/
S-4.1/
L-4.1/L-
S-16.1/
L-16.1/L-16.2
nS1-2XX/
S-1.2
L1.2
S-4.2
4.2
S-16.2
/L-16.2U
nL1-2XX
-15~-8
-5~0
-15~-8
-3~+2
-5~0
-2~+3
0~+5
launched power
(dBm)
2.6.5 Extinction Ratio

The extinction ratios of the ZXMP S325 are listed in Table 2-27.
Table 2-27 Extinction Ratio of STM-N Optical Interfaces
Index
STM-1
Extinction ratio
STM-4
STM-16
S-1.1/S-1.2
L-1.1/L1.2
S-4.1/S-4.2
L-4.1/L-4.2
8.2
10
8.2
10
8.2
(dB)
2.6.6 Receiver Sensitivity

The STM-N receiver sensitivities of ZXMP S325 are listed in Table 2-28.
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Table 2-28 STM-N Receiver Sensitivity (Unit: dBm)

Index
STM-1
STM-4
S-1.1/S-1.2
Receiver sensitivity
-28
STM-16
L-1.1/L-1.2/L-
S-16.1/S-
L-16.
L-16.2/L-16.2U/
1.3
16.2/nS1-2XX
nL1-2XX
-18
-27
-28
-34
-28
(dBm)
BER=110-10
2.6.7 Receiver Overload

The receiver overloads of ZXMP S325 are described in Table 2-29.
Table 2-29 STM-N Receiver Overload
Index
S-1.1/S-1.2
Overload (dBm)
STM-4
STM-1
-8
L-1.1/L-1.2/L-1.3
-10
-8
STM-16
S-16.1/ S-16.2/
L16.1/L-16.2/L-
nS1-2XX
16.2U/ nL1-2XX
-9
BER=110-10
2.6.8 Mean Optical Received Power

The mean optical received power should be greater than the worst sensitivity and less than
the overload of relevant optical boards.
ZXMP S325 conforms to the above specifications.
2.6.9 Permitted Frequency Deviation of Optical Input Interfaces

The permissible frequency deviation of the ZXMP S325 optical input interface is within
20 ppm (1 ppm=110-6).
2.6.10 AIS Rate of Optical Output Interfaces

The AIS rate deviation of the ZXMP S325 optical output interface is within 20 ppm (1
ppm=110-6)
2.7 Electrical Interface Specifications

2.7.1 Code Patterns of Electrical Interface
Table 2-30 lists the code patterns of electrical interface supported by the ZXMP S325.
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Table 2-30 Code Patterns of Electrical Signal

Electrical
Bit Rate (kbit/s)
Signal Type
Code Pattern
Code Pattern Full Name
Abbreviation
E0
64
AMI
Alternate Mark Inversion
T1
1544
B8ZS
Bipolar with 8-Zero Substitution
T3
44736
B3ZS
Bipolar with 3-Zero Substitution
E1
2048
HDB3
High Density Bipolar of order 3
E3
34368
STM-1 (E)
155520
CMI
Code Mark Inversion
2.7.2 Permitted Attenuation of Input Interfaces, Frequency

Deviation of Input Interfaces and Bit Rate Tolerance of Output
Interfaces
The permissible attenuation/frequency deviation of input interface and bit rate tolerances
of the ZXMP S325 output interface signals are listed in Table 2-31.
Table 2-31 Permitted Attenuation/Frequency Deviation of Input Interface, and Signal Bit
Rate Tolerance of Output Interface
Interface Rate
Permitted Attenuation
Permitted Frequency
Permitted Bit Error
(kbit/s)
of Input Interface (dB
Deviation of Input
Tolerance of Output
) (regular square root
Interface (ppm)
Interface (ppm)
attenuation)
1544
0~6, 772 kHz
Within 32
Within 32
2048
0~6, 1024 kHz
Within 50
Within 50
34368
0~12, 17184 kHz
Within 20
Within 20
44736
0~20, 22368 kHz
Within 20
Within 20
155520
0~12.7, 78 MHz
Within 20
Within 20
1 ppm=110-6
2.7.3 Reflection Attenuation of Input/Output Interfaces

The requirements on the reflection attenuation index of an input/output interface of the
ZXMP S325 are described in Table 2-32.
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Table 2-32 Requirements on the Reflection Attenuation Index of an Input/Output

Interface
Interface bit rate (kbit/s)
2048
Input interface
Output interface
34368
Input interface
Output interface
44736
Input interface
Output interface
155520
Input/output
TestFrequencyRange
Reflection Attenuation
(kHz)
(dB)
51.2~102.4
12
102.4~2048
18
2048~3072
14
51~102
102~3072
860~1720
12
1720~34368
18
34368~51550
14
1720~51550
102~3072
860~1720
12
1720~34368
18
34368~51550
14
1720~51550
102~3072
8000~240000
15
interface
2.7.4 Anti-Interference Capability of Input Interfaces

Table 2-33 lists the anti-interference capability of ZXMP S325.
Table 2-33 Anti-interference Capability of ZXMP S325
Interface bit rate (Unit: kbit/s)
Signal-to-noise Ratio (S/N) (Unit: dB)
2048
18
34368
20
2.7.5 Waveform of Output Interfaces

The waveforms of various electrical output interfaces of ZXMP S325 satisfy the template
requirement of ITU-T G.703 Recommendation.
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1544 kbit/s Electrical Interface

The output pulse mask of the 1544 kbit/s electrical interface is shown in Figure 2-3.
Figure 2-3 Output Pulse Mask at the 1544 kbit/s Electrical Interface

The output pulse mask of the 2048 kbit/s electrical interface is shown in Figure 2-4.
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Figure 2-5 illustrates the output pulse mask of the 34368 kbit/s electrical interface.
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illustrates the output pulse mask of 44736 kbit/s electrical interface.
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155520 kbit/s Electrical Interfaces

Masks of pulsescorresponding to a binary 0 and a binary 1 at the 155520 kbit/s electrical
interface are respectively shown in Figure 2-7 and Figure 2-8.
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Figure 2-7 Mask of a Pulse Corresponding to a Binary 0 at the 155520 kbit/s Electrical
Interface
Figure 2-8 Mask of a pulse Corresponding to a Binary 1 at the 155520 kbit/s Electrical
Interface
2.8 Interface Jitter Specifications

2.8.1 Jitter and Wander Tolerance of PDH Input Interfaces
The jitter and wander tolerance of ZXMP S325 PDH input interface is shown in Figure 2-9,
and it meets the requirements listed in Table 2-34.
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Figure 2-9 Jitter and Wander Tolerance of PDH Input Interface
Table 2-34 Jitter and Wander Tolerance of PDH Input Interface

Interface
Rate
UIp-p
A0
Frequency (Hz)
A1
A2
A3
f10
f9
Pseudof8
f1
f2
f3
f4
(kbit/s)
1544
random
Signal
18
0.1
1.2
10
120
6k
40k
0.01
1.66
20
2.4k
18k
100k
215-1
10-5
2048
36.9
1.5
0.2
18
4.88
10-3
34368
618.6
1.5
0.15
100
1k
10k
800k
223-1
44736
18
0.1
1.2
10
600
30k
400k
10-5
2.8.2 Jitter and Wander Tolerance of SDH Input Interfaces

The input interfaces jitter and wander tolerance of the ZXMP S325 SDH terminal
multiplexer satisfies the requirements described in Figure 2-10, Table 2-35, and Table
2-36.
The input interfaces jitter and wander tolerance of the ZXMP S325 SDH regenerator
satisfies the requirements shown in Figure 2-11 and Table 2-37.
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Figure 2-10 Jitter Tolerance of STM-N Terminal Multiplexer Input Interface
Table 2-35 Input Jitter and Wander Tolerance (UIP-P) of SDH Terminal Multiplexer
Interface
A0
A1
A2
A3
A4
STM-1 (E)
2800
311
39
1.5
0.075
STM-1 (O)
2800
311
39
1.5
0.15
STM-4 (O)
11200
1244
156
1.5
0.15
STM-16 (O)
44790
4977
622
1.5
0.15
Table 2-36 Frequency (Hz) of Input Jitter and Wander Tolerance of SDH Terminal Multiplexer
Inter-
f0
f12
f11
f10
f9
f8
f1
f2
f3
f4
1.210-5
1.7810-4
1.610-3
1.5610-2
0.125
19.3
500
3.25k
65k
1.3M
1.210-5
1.7810-4
1.610-3
1.5610-2
0.125
19.3
500
6.5k
65k
1.3M
1.210-5
1.7810-4
1.610-3
1.5610-2
0.125
9.65
1000
25k
250k
5M
1.210-5
1.7810-4
1.610-3
1.5610-2
0.125
12.1
5000
100k
1M
20M
face
STM-1
(E)
STM-1
(O)
STM-4
(O)
STM-16
(O)
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Figure 2-11 Input Jitter Tolerance of STM-N SDH Regenerator
Table 2-37 Input Jitter Tolerances of STM-1, STM-4 and STM-16 Regenerators
STM Interface
f1 (kHz)
f2 (kHz)
A1 (UIP-P)
A2 (UIP-P)
STM-1
65
6.5
0.15
1.5
12
1.2
0.15
1.5
250
25
0.15
1.5
12
1.2
0.15
1.5
1000
100
0.15
1.5
12
1.2
0.15
1.5
STM-4
STM-16
2.8.3 STM-N Interface Inherent Output Jitter

l
STM-N interface inherent output jitter of SDH equipment is defined as the jitter at the
STM-N output interface of the equipment when there is no input jitter. For the ADM
and TM equipment of ZXMP S325, the STM-N interface inherent output jitter satisfies
the requirements listed in Table 2-38.
Table 2-38 STM-N Interface Inherent Output Jitter Specifications of SDH Equipment
STM Interface
Test Filter
Peak-peak Jitter (UI)
STM-1
500 Hz ~ 1.3 MHz
0.3
65 kHz ~ 1.3 MHz
0.1
1 kHz ~ 5 MHz
0.3
250 kHz ~ 5 MHz
0.1
5 kHz ~ 20 MHz
0.5
1 MHz ~ 20 MHz
0.1
STM-4
STM-16
Due to the randomness of jitter, the test value might exceed the specifications. It is acceptable
as long as over 99% test values satisfy the specifications during the test (about 1 to 2 minutes).
The STM-N network interface output jitter of SDH equipment is defined as the output
jitter value measured at the output interface of any STM-N level in the SDH network.
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For ADM and TM equipment of ZXMP S325, the STM-N network interface output jitter
satisfies the requirements listed in Table 2-39.
Table 2-39 STM-N Network Interface Output Jitter Specifications of SDH Equipment
STM Interface
f1 (Hz)
f3 (Hz)
F4 (MHz)
B1 (UIp-p)
B2 (UIp-p)
STM-1 optical
500
65 k
1.3
1.5
0.15
500
65 k
1.3
1.5
0.075
1k
250 k
1.5
0.15
5k
1M
20
1.5
0.15
interface
STM-1 electrical
interface
STM-4 optical
interface
STM-16 optical
interface
Due to the randomness of jitter, the test value might exceed the specifications. It is acceptable
as long as over 99% test values satisfy the specifications during the test (about 1 to 2 minutes).
For REG equipment, when the test filter employs a 12 kHz high-pass filter, the root
mean square caused by jitter should be no more than 0.01 UI.
2.8.4 Mapping Jitter of PDH Tributary

ZXMP S325 The mapping jitter of the PDH tributary interface satisfies the requirements
Table 2-40 Mapping Jitter of PDH Tributary Interface
G.703
Tolerance
Interface
(ppm)
(kbit/s)
High-Pass Filter, 20 dB/10 Octaves
Mapping Jitter of Maximum

Peak Value
f1 (Hz)
f3 (Hz)
f4 (Hz)
f1 ~ f4
f3 ~ f4
1544
22
10
8k
40 k
0.7
2048
50
20
18 k
100 k
To be
0.075
determined
34368
20
100
10 k
800 k
To be
0.075
determined
44736
20
10
30 k
400 k
0.4
0.1
2.8.5 Combined Jitter

In SDH system, generally there are both mapping jitter and pointer adjustment jitter. The
combined jitter of these two jitters is called the combined jitter. The combined jitter of ZXMP
S325 got from various test sequences should satisfy the specifications listed in Table 2-41,
Table 2-42, and Table 2-43.
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Table 2-41 E1/E3 Combined Jitter Specifications

PDH In-
Bit Rate
High-Pass Filter 20 dB/10
terface
Toler-
Octaves
(kbit/s)
ance
Maximum Peak-Peak Value Combined Jitter UIp-p
f1 (Hz)
f3 (Hz)
f4 (Hz)
UIp-p (f1 ~ f4)
UIp-p (f3 ~ f4)
(ppm)
2048
50
20
18 k
100 k
0.4
0.4
0.4
0.075
0.075
0.075
34368
20
100
10 k
800 k
0.4
0.4
0.4
0.75
0.075
0.075
0.075
0.075
Test sequence
Table 2-42 T1 Combined Jitter Specifications

PDH
Bit
High-Pass Filter 20
Inter-
Rate
dB/10 Octaves
face
Toler-
(kbit/s)
ance
f1
f3 (Hz)
f4
(Hz)
UIp-p (f1 ~ f4)
UIp-p (f3 ~
(Hz)
f4)
(ppm)
1544
32
10
8k
40 k
1.3
1.3
1.9
1.9
To be determined
Test sequence
h,
h,
h, pe-
periodic
periodic
riodic
and
and
and can-
regular
added
celled
Table 2-43 T3 Combined Jitter Specifications

PDH
Bit
High-Pass
Inter-
Rate
Filter 20
face
Toler-
dB/10
(kbit/s)
ance
Octaves
(ppm)
44736
20
f1
f3
f4 (
Hz)
UIp-p (f1 ~ f4)
H-
H-
z)
z)
10
30
40
0k
UIp-p (f3 ~
f4)
1.3
1.3
1.3
1.3
To be determined
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SJ-20120320184105-002|2012-07-30(R1.1)
PDH
Bit
High-Pass
Inter-
Rate
Filter 20
face
Toler-
dB/10
(kbit/s)
ance
Octaves
(ppm)
f1
f3
f4 (
Hz)
H-
H-
z)
z)
Test sequence
UIp-p (f1 ~ f4)
UIp-p (f3 ~
f4)
h,
h,
h,
h,
h,
h,
peri-
peri-
peri-
peri-
peri-
peri-
odic
odic
odic
odic
odic
odic
and
and
and
and
and
and
reg-
reg-
can-
reg-
add-
can-
u-
u-
cel-
ular
ed
cel-
lar (
lar (
led (
87-3
87-3
87-3
co-
co-
code
de
de
pat-
pat-
pat-
tern)
tern)
tern)
led
2.8.6 Jitter Transfer Characteristic of Regenerator

The jitter transfer characteristic of the ZXMP S325 SDH regenerator is shown in Figure
2-12. The parameters of the jitter transfer characteristic of regenerator are listed in Table
2-44.
Figure 2-12 Jitter Transfer Characteristic of Regenerator
Table 2-44 Parameters of Jitter Transfer Characteristic of Regenerator

STM-N
STM-1
fc (kHz)
P (dB)
130
0.1
30
0.1
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STM-N
STM-4
STM-16
fc (kHz)
P (dB)
500
0.1
30
0.1
2000
0.1
30
0.1
2.9 Clock Specifications

Timing Principles
The component closest to the SDH network synchronization performance is the clock unit.
ITU-T Recommendations specify three types of clocks:
l
l
l
ITU-T G.811 specifies the primary reference clock.

ITU-T G.812 specifies slave clocks at different levels.
ITU-T G.813 specifies the slave clock of SDH equipment.
All the timings of SDH system should conform to the primary reference clock (PRC)
described in G.811.
Output Jitter
When there is no input jitter, the inherent jitter of the 2 MHz or 2 Mbit/s clock output interface
in ZXMP S325 should not exceed 0.05 UIP-P. The test is conducted at the time interval of
60 s, using a single pole bandpass filter with 20 Hz and 100 kHz turnover frequencies.
Permissible Input Interface Attenuation/Frequency Deviation and Others

The specifications of permissible input interface attenuation/frequency deviation of the
ZXMP S325 clock are listed in Table 2-45.
Table 2-45 Specifications of Permissible Input Interface Attenuation/Frequency
Deviation and Others
Item
Specification
Permissible input
The attenuation characteristic introduced by the input interface signal
interface attenuation
complies with the frequency square root rule. When using cables with
attenuation range of 0 dB ~ 6 dB, no bit error or clock lock loss occurs in
the equipment.
Permissible input
4.6 ppm
interface frequency
deviation
Signal bit rate tolerance of
4.6 ppm
the output interface

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Item
Specification
Output interface
Conforms to the relevant templates specified in ITU-T G.703
waveform
1 ppm=110-6
Switching of Timing Reference Sources

ZXMP S325 is equipped with more than one external timing reference input. When the
selected timing reference fails, the SDH equipment can automatically switch to another
timing reference input using the S1 byte.
Note:
For 2 Mbit/s external timing source, the timing reference failure refers to the signal loss of
synchronous clock input interface; for the timing recovery through STM-N line signals, the
timing reference failure refers to the loss of STM-N signals that bear timing signals, or the
AIS occurrence.
Long-term Phase Variation in Locked Mode

The long-term phase variation in the locked mode is generally expressed by the Maximum
Time Interval Error (MTIE) and Time Deviation (TDEV).
ZXMP S325 satisfies the requirements listed in Table 2-46, Table 2-47, and Table 2-48.
Table 2-46 Wander Limit at Constant Temperature (MTIE)
MTIE Limit
Observation Interval
40 ns
0.1 s<1 s
40 0.1 ns
1 s<100 s
25.25 0.2 ns
100 s<1000 s
Table 2-47 Wander Limit under Temperature Impact (MTIE)

Additional Permissible MTIE Value
0.5 ns
0.1 s<100 s
50 ns
>100 s
Table 2-48 Wander Limit at Constant Temperature (TDEV)

TDEV Limit
3.2 ns
0.1 s<25 s
0.64 0.5 ns
25 s<100 s
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TDEV Limit
6.4 ns
100 s<1000 s
Clock Accuracy in Hold Mode

Once all the timing references are lost, the SDH Equipment Clock (SEC) will enter the hold
mode after transient phase variation. SEC will use the last frequency information saved
before the timing reference signal is lost as its timing reference.
At the same time, the oscillation frequency of the oscillator will slowly wander, but can still
ensure that SEC frequency only has very small frequency deviation from the reference
frequency in a long time. thus, the slip impairment will stay within the permissible
specification.
This mode can be used to deal with external clock interruption faults lasting for several
days.
When SEC loses its reference source and enters the hold mode, the phase error T
between the SEC output signal and SEC input signal should not exceed the following limit
when observation time S is greater than 15 s:
T (S) = [(a1+a2)S+0.5bS2+c] ns
l
l
l
l
a1=50 ns/s, denoting the initial frequency deviation of 510-8.

a2=2000 ns/s, denoting the frequency deviation of 210-6, which is caused by the
temperature change when the clock enters the hold mode. If there is no temperature
change, there will be no a2S in the phase error T.
b=1.1610-4 ns/s2. It is caused by aging, corresponding to 110-8/day frequency
wander.
c=120 ns, including any additional phase deviation that might be generated during the
transition period when entering the hold mode.
ZXMP S325 satisfies the above requirements.
Frequency Accuracy of the Internal Oscillator in Free-Oscillation Mode

The internal oscillator of the SEC works in the free-oscillation mode when the SEC loses
all of the timing references and their memories or the SEC has no hold mode at all. Its
output frequency accuracy must be within a certain accuracy range.
For a reference that conforms to the G.811, the SEC output frequency accuracy should be
no greater than 4.6 ppm for SDH terminal equipment working in the free-oscillation mode,
and no greater than 20 ppm for REG equipment.
ZXMP S325 satisfies all these specifications.
2.10 OA Board Specifications

OA (Optical Amplifier) boards fall into two categories as per their positions in the system:
l
OBA: 1-channel optical booster amplifier

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OPA: 1-channel pre-amplifier
Table 2-49 lists the specifications of OBA board.

Table 2-49 Types and Specifications of OBA Board
Index
Unit
OBA12
OBA14
Remark
Working wavelength
nm
1530~1562
1530~1562
Optical received power range
dBm
-12~+4
-12~+4
Optical launched power (typical
dBm
12
14
dB
9~12.5
11~14.5
Can be directly
value)
Adjustment range of optical
launched power
adjusted.
Output controllable precision
dB
0.5
0.5
Optical launched power in
dBm
<3
<3
Optical interface connector type
LC/PC
LC/PC
Working environment
-10~+60
-10~+60
Eyesafe (APR) mode
temperature
Table 2-50 lists the specifications of OPA board.

Table 2-50 Types and Specifications of OPA Board
Index
Unit
OPA38
Remark
Working wavelength
nm
1550.12
Optical received power range
dBm
-38~-20
Optical launched power (typical
dBm
-12
dB
-15~-9
Can be directly adjusted.
Output controllable precision
dB
0.5
Optical interface connector type
LC/PC
Working environment
-10~+60
value)
Adjustment range of optical
launched power
temperature
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2.11 Ethernet Performance Specifications

2.11.1 Transparent Transmission Performance Specifications
Maximum and Minimum Frame Lengths
The frame lengths that can be processed by the smart fast Ethernet board (SFEx6), the
enhanced smart Ethernet board (SED), the embedded RPR processor board (RSEB), and
the Ethernet transparent transmission board (TFEx8) of ZXMP S325meet the requirements
Table 2-51 Specifications of Frame Length
Ethernet Board
Minimum Frame Length (byte)
Maximum Frame Length

(byte)
SFEx6
64
1522
SED
64
1522 (1600 with Jumbo frame

enabled)
RSEB
64

enabled)
TFEx8
64

enabled)
Board Throughput
l
l
l
l
For the ZXMP S325, when the ports of smart fast Ethernet board (SFEx6) are
configured with 46 VC-12s, the port throughput can reach the line speed of 100
Mbit/s.
When the enhanced smart Ethernet board (SED) is configured with GE services, the
port throughput can reach the line speed of 1 Gbit/s.
When the RSEB board is configured with GE services, the port throughput can reach
the line speed of 1 Gbit/s.
When the ports of Ethernet transparent transmission board (TFEx8) are configured
with 63 VC-12s, the port throughput can reach the line speed of 100 Mbit/s.
Note:
The flow control function of port must be disabled while testing the port throughput.
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Packet Loss Ratio

Packet loss ratio refers to the maximum acceptable packet loss ratio under the prerequisite
that data is normally received. There is no specific criterion for packet loss ratio. However,
it should be as low as possible and close to zero under certain conditions.
Note:
The flow control function of port must be disabled when conducting the packet loss ratio
test.
Delay
Delay refers to the maximum acceptable delay under the prerequisite that data is normally
received. There is no specific criterion for delay. However, it should be as small as possible
under certain conditions.
2.11.2 VLAN Specifications

Specification of VLAN Basic Function
The basic function of VLAN refers to the function of the tag-based VLAN that complies
with the IEEE 802.1Q standard. Through the network management configuration, the
Smart Fast Ethernet board (SFEx6), the enhanced smart Ethernet board (SED), and the
embedded RPR processor board (RSEB) of ZXMP S325 supports this function.
Trunk Specification
Trunk refers to the transmission of large-capacity Ethernet services by binding multiple
Ethernet interfaces. The Ethernet ports in the same Trunk group have the same VLAN
configuration attributes. They cannot interwork with the Ethernet ports that do not belong
to the same Trunk group.
l
l
The SFEx6 board supports two trunk groups at most at the user side, and each group
can support one to four Ethernet ports.
The SED board supports ten trunk groups at most at the user side, and each group
can support one to four Ethernet ports. The SED board supports eight trunk groups
at most at the system side, and each group can support two, four, or eight Ethernet
ports.
The RSEB board can support three trunk groups at most at the user side. When
supporting two trunk groups, one trunk group supports tow Ethernet ports, and the
other trunk group supports four Ethernet ports; when supporting three trunk groups,
each trunk group supports two Ethernet ports.
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Quantity of VLAN IDs

In IEEE 802.1Q standard, a header of four bytes is defined as a VLAN ID. Each port can
belong to multiple VLANs.
The smart fast Ethernet board (SFEx6), the enhanced smart Ethernet board (SED), and
the embedded RPR processor board are able to recognize C-VLAN IDs that comply with
IEEE 802.1Q standards. The range of VLAN ID is 1 to 4094.
VLAN Priority
Under the prerequisite that the QoS function is enabled, when services from multiple
sources are converged at one transmit port, the port can transmit these services according
to the preset VLAN priorities and bandwidths. Once the total traffic exceeds the transmit
bandwidth of the port, the port will discard the services with lower priorities and over
bandwidth limit, to ensure the normal transmission of services with higher priorities.
The SFEx6 board, the SED board, and the RSEB board of ZXMP S325 support the
configurations of VLAN priority and bandwidth proportion.
2.11.3 L2 Switching Specifications

Security Filtering Characteristics
The security filtering characteristics include the static MAC address setting, MAC address
filtering, and broadcast address filtering.
l
Setting of static MAC address

Manually add a MAC address and the information of the corresponding port into the
MAC address list. Only the receive port which has been set can receive the traffic
normally without any packet loss.
The SFEx6 board and the RSEB board of ZXMP S325 support this function by the
configuration of EMS.
MAC address filtering

Filter frames that have a MAC address as the source address or the destination
address by adding the MAC address manually into the MAC address list. The port
that has been set cannot receive any traffic.
Through network management configurations, the SFEx6 board and the RSEB board
of ZXMP S325 support this function.
Broadcast address filtering

A broadcast address is a MAC address of all Fs. It may increase network load and
cause path congestion. Broadcast address filtering can prevent path congestion.
Through network management configurations, the SFEx6 board, the SED board and
the RSEB board of ZXMP S325 support this function.
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Specifications of QoS and Flow Control Function

Both the QoS and flow control are methods of handling congestion. QoS emphasizes
the normal operation of standardized services to maximize the utilization of bandwidth. It
discards packets of the service exceeding the flow standard to handle congestion. The
flow control function suspends transmission to the transmit end to handle congestion and
ensure that the traffic is not discarded.
Through network management configurations, the SFEx6 board, the SED board and the
RSEB board of ZXMP S325 support these two functions.
2.12 RPR Performance Specifications

ZXMP S325 complies with the RPR performance specifications with L2 switching function.
Burst Interval
The burst interval refers to the time interval between the frame bursts of the Ethernet port
at the user side. It is generally defined as the minimum frame interval between Ethernet
frames.
Table 2-52 lists the burst intervals.
Table 2-52 The Minimum Frame Interval between Ethernet Frames
Ethernet Rate (Unit: Mbit/s)
Minimum Frame Interval (Unit: ms)
10
9.6
100
0.96
1000
0.096
The burst interval of ZXMP S325 satisfies the above requirements.
RPR Loop Protection Switching Time

The RPR loop protection switching time is the protection switching time of RPR itself.
The RPR loop protection switching includes two modes: wrapping and steering. The
protection switching time of both these two modes should be less than 50 ms.
The RPR loop protection switching time of ZXMP S325 satisfies the above requirements.
Address Buffering Capability

The address buffering capability refers to the number of MAC addresses that one
port/module/node can buffer. The buffered MAC address can prevent the abandon or
flooding of received frames during the transition.
The ZXMP S325 RPR ring network can buffer no less than 128 k addresses.
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RPR Ring Network Bandwidth

The RSEB board of ZXMP S325 supports the RPR sub-ring bandwidth ranging from 155
Mbit/s to 1.25 Gbit/s.
Service Characteristics
l
Service types
The total number of type-A and type-C services supported by the RSEB board of
ZXMP S325 is 1000. And the number of type-B services supported is eight.
Table 2-53 compares different RPR service types.
Table 2-53 Comparisons of RPR Service Types
RPR
Throughput
Delay
Jitter
Loss of Frame
Constant rate, with
Extremely low,
Extremely low,
Extremely low
guarantee
with guarantee
with guarantee
mechanism
mechanism
Low
Variable
Low
No requirement
No requirement
Medium
No requirement
No requirement
High, depends
Service
Type
A0
A1
Variable rate, with

guarantee
Can be over
configured; has
higher priority than
C
No guarantee;
depends on the
on the network
network situation
situation
Service bandwidth range

ZXMP S325 supports the service bandwidth ranging from 20 kbit/s to 1 Gbit/s.
Service rate limit granularity

ZXMP S325 supports the service rate limit granularity of 20 kbit/s.
Protection between Layers

l
Protection types
The RSEB board provided by ZXMP S325 supports both SDH layer protection and
RPR MAC layer protection. The RPR MAC layer protection supports the wrapping or
steering protection.
Protection configuration
Whether to use RPR MAC layer protection and SDH layer protection simultaneously
can be configured in the EMS. When these two protections are configured to be used
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SJ-20120320184105-002|2012-07-30(R1.1)
simultaneously, delaying the switching time of RPR MAC layer protection can support
the switching between layers and thus guarantee that these two switchings will not
overlap.
l
Protection principle
When network fault occurs, the SDH layer protection will launch first. The delay
of RPR MAC layer protection switching is the waiting time between the service
failure detection and switching launch. During this period, if service recovers, the
switching will not occur.
If the SDH layer protection fails after the delay of RPR MAC layer protection
switching, the RPR MAC layer protection will launch.
When the service recovers and keeps normal after the switching restore time had
passed, the service will return to the previous working path from the protection
path.
The switching restore time is the waiting time between the service recovery and
the service fault status clearance (i.e. the cancellation of protection status).
During this period, if the service fails, the protection will not be cancelled any
more.
Returnable and non-returnable protection switching

The RSEB board supports setting the protection switching to be returnable or
non-returnable. The default configuration is returnable.
The returnable switching indicates that when the working path is faulty, the service will
switch to the protection path; and when the service recovers, the service will switch
back to the previous working path.
The non-returnable switching will not return to the working path even after the service
recovers.
Protection delay
The delay of protection between layers ranges from 0 ms to200 ms. The default value
is 0 ms. The stepping is 10 ms.
Switching restore time

The switching restore time ranges from 0 s to 1440 s. The default value is 10 s.
The stepping unit is second which is configurable. It takes effect only when the
returnable switching" is set.
2.13 ATM Characteristics

Range of VPI/VCI Value
ATM services can be transmitted or received normally only when the VP/VC connection is
within the value range.
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The range of VPI value for network-to-network interface (NNI) is 1 to 4095. The range of
VPI value for user-to-network interface (UNI) is 1 to 255. The range of VCI value is 1 to
16383.
The AP1x4 board of ZXMP S325 meets the value range requirements above.
VP/VC Multicast
l
VP/VC spatial multicast

The VP/VC link transmitting ATM service can be copied to two or more physical
interfaces, and for each interface there is only one ATM link.
VP/VC logical multicast

The VP/VC link transmitting ATM service can be copied to VP/VC links sharing one
physical interface.
The AP1x4 board provided by ZXMP S325 supports both the VP/VC spatial multicast and
logical multicast.
Transmission Priority of ATM Cells

The ATM service has four types:
l
l
l
l
Constant bit rate service (CBR)

Real-time variable bit rate service (rt-VBR)
Non-real-time variable bit rate service (nrt-VBR)
Unspecified bit rate service (UBR)
The ATM services transmission priority is: CBR > rt-VBR > nrt-VBR > UBR. When the
transmission flow of ATM services exceeds the maximum cell flow traffic of the ATM
equipment, the ATM equipment will discard cells according to the priority of services once
the congestion occurs.
The AP1x4 board provided by the ZXMP S325 has the above function.
VP-Ring Protection
The VP-Ring protection adopts the principle of concurrent transmitting and preferred
receiving with alarm supervision. The standby VP connection of the receive direction will
be selected when alarms are found, such as VP-AIS (VP alarm indication signal), LOS
(loss of signal), LOF (loss of frame), OOF (out of frame), and LAIS (line alarm indication
signal). When the alarms disappear and no alarm appear after the switching restore time,
the previous active VP connection will recover automatically.
The AP1x4 board supports the enable and restore of VP-Ring protection after configured
in the network management system.
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Note:
The ATM service type of CBR is recommended for testing the VP-Ring protection
Protection between Layers

The AP1x4 board provided by ZXMP S325 can support the protection of SDH layer and
ATM layer. The protection of ATM layer refers to VP or VC protection.
When network fault occurs, the SDH layer protection will launch first. If the SDH layer
protection fails after the delay of ATM layer protection switching, the ATM layer protection
will be enabled. Once the service recovers, the ATM service will return to the working
connection channel from protection connection after switching restore time.
The delay of protection between layers ranges from 0 s to 10 s. The default value is 500
ms, and the stepping is 100 ms. The switching restore time ranges from 0 min to 30 min.
The default value is 720 s, and the stepping is 100 ms.
The AP1x4 board can be configured in the network management system to enable and
restore the protection between layers.
l
l
Note:
The ATM service type of CBR is recommended for testing the protection between
layers.
The switching restore time refers to the restore time of the ATM layer protection.
ATM Transmission Performance

The ATM transmission performance represents the transmission quality of ATM cells.
The cell transmission quality involves cell transfer delay (CTD), cell delay variation (CDV),
cell loss ratio (CLR), cell error ratio (CER), cell mis-insertion ratio (CMR), and bit error ratio
(BER).
To guarantee the transmission quality of ATM services, the requirements of parameters
specified above are different for ATM services of different types (CBR, rt-VBR, nrt-VBR,
and UBR).
The AP1x4 board supports ATM services of the type CBR, rt-VBR, nrt-VBR, or UBR.
And the cell transmission quality of these services can be supervised with data network
analyzers.
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2.14 External Interface Standards

The external interfaces refer to interfaces that connect the ZXMP S325 with other external
equipment.
The ZXMP S325 external interfaces standards are listed inTable 2-54.
Table 2-54 External Interface Standards of ZXMP S325
Interface Types
Standard
Description
Optical interface (155520
ITU-T G.707
Network node interface for the synchronous digital
kbit/s622080 kbit/s2488320
kbit/s)
hierarchy (SDH)
ITU-T G.957
Optical interfaces for equipments and systems

relating to the synchronous digital hierarchy (SDH)
ITU-T G.691
Optical interfaces for single-channel SDH systems

with optical amplifiers and STM-64 system
ITU-T G.692
Optical interfaces for multi-channel systems with

optical amplifiers
ITU-T G.825
The control of jitter and wander within digital

networks which are based on the synchronous
digital hierarchy (SDH)
Electrical interface (155520
ITU-T G.707
kbit/s)
Network node interface for the synchronous digital

hierarchy (SDH)
ITU-T G.703
Physical/electrical characteristics of hierarchical

digital interfaces
ITU-T G.825

Electrical interface (1544
ITU-T G.703
kbit/s2048 kbit/s34368
kbit/s44736 kbit/s)

digital interfaces
ITU-T G.704
Synchronous frame structures used at 1544,

6312, 2048, 8448, and 44736 kbit/s hierarchical
levels
ITU-T G.825

GB 7611-87
Parameters of digital interface for PCM systems

over telecommunication network
2.048 MHz network clock
ITU-T G.703
synchronous interface

digital interfaces
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Interface Types
Standard
Description
Dual-line interface of orderwire
The frequency range is 300 Hz ~ 3400 Hz. The
phone
modulation method is PCM, and the bit rate is 64

kbit/s.
Ethernet Interfaces
1000BASE-TX, 1000Base-FX, 100BASE-TX,

100Base-FX, and 10Base-T physical interfaces
specified by IEEE 802.3 standard.
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Appendix A
Standards and
Recommendations
Table A-1 lists the ITU-T recommendations and other standards that ZXMP S325 is
compliant with.
Table A-1 Standards and Recommendations Complied by ZXMP S325
Recommendation
Description
Version
ITU-T G.703
Physical/electrical characteristics of hierarchical digital
11/2001
interfaces
ITU-T G.704
Synchronous frame structures used at 1544, 6312, 2048,
10/1998
8448, and 44736 kbit/s hierarchical levels

ITU-T G.705
Characteristics of Plesiochronous Digital Hierarchy (PDH)
10/2000
equipment functional blocks

ITU-T G.706
Frame alignment and cyclic redundancy check (CRC)
04/1991
procedures relating to basic frame structures defined in

Recommendation G.704
ITU-T G.707
Network node interface for the synchronous digital hierarchy
10/2000
(SDH)
ITU-T G.708
Sub STM-0 network node interface for the synchronous
06/1999

ITU-T G.773
Protocol suites for Q-interfaces for management of
03/1993
transmission systems
ITU-T G.774
Synchronous digital hierarchy (SDH) management
02/2001
information model for the network element view

ITU-T G.780
Terms and definitions for synchronous digital hierarchy
07/1999
(SDH) networks
ITU-T G.781
Synchronization layer functions
06/1999
ITU-T G.783
Characteristics of synchronous digital hierarchy (SDH)
10/2000
equipment functional blocks

ITU-T G.784
Synchronous digital hierarchy (SDH) management
07/1999
ITU-T G.785
Characteristics of a flexible multiplexer in a synchronous
11/1996
digital environment
A-1
SJ-20120320184105-002|2012-07-30(R1.1)
Recommendation
Description
Version
ITU-T G.803
Architecture of transport networks based on the synchronous
03/2000

ITU-T G.805
Generic functional architecture of transport networks
03/2000
ITU-T G.806
Characteristics of transport equipment - Description
10/2000
methodology and generic functionality

ITU-T G.810
Definitions and terminology for synchronization networks
08/1996
ITU-T G.811
Timing characteristics of primary reference clocks
09/1997
ITU-T G.812
Timing requirements of slave clocks suitable for use as node
06/1998
clocks in synchronization networks

ITU-T G.813
Timing characteristics of SDH equipment slave clocks (SEC)
06/1998
ITU-T G.823
The control of jitter and wander within digital networks which
03/2000
are based on 2048 kbit/s hierarchy

ITU-T G.824
03/2000
are based on the 1544 kbit/s hierarchy

ITU-T G.825
03/2000
are based on the synchronous digital hierarchy (SDH)

ITU-T G.828
Error performance parameters and objectives for
03/2000
international, constant bit rate synchronous digital paths

ITU-T G.829
Error performance events for SDH multiplex and regenerator
03/2000
sections
ITU-T G.831
Management capabilities of transport networks based on
03/2000
the synchronous digital hierarchy (SDH)

ITU-T G.832
Transport of SDH elements on PDH networks - Frame and
10/1998
multiplexing structures
ITU-T G.841
Types and characteristics of SDH network protection
10/1998
architectures
ITU-T G.842
Interworking of SDH network protection architectures
04/1997
ITU-T G.957
Optical interfaces for equipments and systems relating to
07/1999
the synchronous digital hierarchy (SDH)
A-2
SJ-20120320184105-002|2012-07-30(R1.1)
Glossary
ADM
- Add/Drop Multiplexer
AIS
- Alarm Indication Signal
ATM
- Asynchronous Transfer Mode
BER
- Bit Error Rate
CBR
- Constant Bit Rate
CDV
- Cell Delay Variation
CER
- Cell Error Ratio
CLR
- Cell Loss Ratio
CMR
- Cell Misinsertion Ratio
CTD
- Cell Transfer Delay
DC
- Direct Current
DCC
- Data Communications Channel
DNI
- Dual Node Interconnection
DXC
- Digital Cross Connect
ECC
- Embedded Control Channel
EMC
- Electromagnetic Compatibility
EMI
- Electromagnetic Interference
I
SJ-20120320184105-002|2012-07-30(R1.1)
EMS
- Electromagnetic Susceptibility
EUT
- Equipment Under Test
FE
- Fast Ethernet
GE
- Gigabit Ethernet
ITU-T
- International Telecommunication Union - Telecommunication Standardization
Sector
L2
- Layer 2
LAIS
- Line Alarm Indication Signal
LOF
- Loss Of Frame
LOS
- Loss Of Signal
MAC
- Medium Access Control
MCU
- Micro Control Unit
MS
- Mobile Station
MTIE
- Maximal Time Interval Error
NE
- Network Element
NNI
- Network Node Interface
OA
- Optical Amplifier
OBA
- Optical Booster Amplifier
OOF
- Out Of Frame
OPA
- Optical Pre-Amplifier
II
SJ-20120320184105-002|2012-07-30(R1.1)
Glossary
PCM
- Pulse Code Modulation
PDH
- Plesiochronous Digital Hierarchy
PRC
- Primary Reference Clock
QoS
- Quality of Service
REG
- REGenerator
RPR
- Resilient Packet Ring
SDH
- Synchronous Digital Hierarchy
SEC
- SDH Equipment Clock
SMCC
- Sub-network Management Control Center
SNC
- Sub-Network Connection
SNCP
- Sub-Network Connection Protection
SSM
- Synchronization Status Message
STM
- Synchronous Transport Module
STM-N
- Synchronous Transport Module, level NN=1, 4, 16, 64
TDEV
- Time Deviation
TM
- Terminal Multiplexer
UBR
- Unspecified Bit Rate
UNI
- User Network Interface
VC
- Virtual Channel
III
SJ-20120320184105-002|2012-07-30(R1.1)
VCI
- Virtual Channel Identifier
VLAN
- Virtual Local Area Network
VP
- Virtual Path
VP-AIS
- Virtual Path - Alarm Indication Signal
VPI
- Virtual Path Identifier
nrt-VBR
- non-real time Variable Bit Rate
rt-VBR
- real-time Variable Bit Rate
IV
SJ-20120320184105-002|2012-07-30(R1.1)

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ZXMP S325

SDH Based Multi-Service Node Equipment

Additionally, the contents of this document are protected by

contractual confidentiality obligations.

Updated the documentation architecture.

ZXMP S325(V2.20) Issued.

Serial Number: SJ-20120320184105-002

ZTE Proprietary and Confidential

Chapter 2 Technical Specifications .......................................................... 2-1

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2.5.1 EMS ...................................................................................................... 2-16

Appendix A Standards and Recommendations ..................................... A-1

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About This Manual

What Is in This Manual

Chapter 1, System Functions

Explains about the system functions.

Chapter 2, Technical Specifications

Discusses about the technical specifications.

Appendix A, Standards and

Gives the standards and recommendations that ZXMP

S325 complies with.

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Keys on the keyboard and buttons on screens and company name.

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1.1 Service Functions

10 Mbit/s or 100 Mbit/s

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ZXMP S325 Product Description

1.1.2 Service Access Capacity

per Subrack with

1.1.3 Multi-Service Functions

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Chapter 1 System Functions

Table 1-3 Multi-service Interfaces Provided by the ZXMP S325

1.2 System Control and Communication Functions

Sending configuration commands to MCUs and collecting their performance and

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ZXMP S325 Product Description

1.3 Power Supply Function

1.4 Overhead Processing Function

1.5 Timing and Synchronization Output Function

Clock source selection

Tracing external timing reference

Locking onto a line clock in a certain direction

Locking onto the internal clock

Clock source switching

The current clock source is lost

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Chapter 1 System Functions

A clock source of higher quality level recovers

The current clock source deteriorates

1.6 Alarm Input/Output Function

External alarm input interface

Alarm output interface

1.7 Alarm Concatenation Function

1.8 Tandem Connection Monitoring Function

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ZXMP S325 Product Description

As specified in ITU-T G.707 Recommendation, the tandem connection layer locates