Beruflich Dokumente
Kultur Dokumente
1. General description
The 74HC4017; 74HCT4017 is a 5-stage Johnson decade counter with 10 decoded
outputs (Q0 to Q9), an output from the most significant flip-flop (Q5-9), two clock inputs
(CP0 and CP1) and an overriding asynchronous master reset input (MR). The counter is
advanced by either a LOW-to-HIGH transition at CP0 while CP1 is LOW or a
HIGH-to-LOW transition at CP1 while CP0 is HIGH. When cascading counters, the Q5-9
output, which is LOW while the counter is in states 5, 6, 7, 8 and 9, can be used to drive
the CP0 input of the next counter. A HIGH on MR resets the counter to zero (Q0 = Q5-9 =
HIGH; Q1 to Q9 = LOW) independent of the clock inputs (CP0 and CP1). Automatic code
correction of the counter is provided by an internal circuit: following any illegal code the
counter returns to a proper counting mode within 11 clock pulses. Inputs include clamp
diodes. This enables the use of current limiting resistors to interface inputs to voltages in
excess of VCC.
74HC4017; 74HCT4017
NXP Semiconductors
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74HC4017
74HC4017N
40 C to +125 C
DIP16
SOT38-4
74HC4017D
40 C to +125 C
SO16
SOT109-1
74HC4017DB
40 C to +125 C
SSOP16
SOT338-1
74HC4017PW
40 C to +125 C
TSSOP16
74HC4017BQ
40 C to +125 C
74HCT4017N
40 C to +125 C
DIP16
SOT38-4
74HCT4017D
40 C to +125 C
SO16
SOT109-1
74HCT4017BQ
40 C to +125 C
74HCT4017
4. Functional diagram
13
14
15
CP1
CP0
5-STAGE JOHNSON COUNTER
MR
Q5-9
12
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 Q9
3
Fig 1.
10
11
001aah242
Functional diagram
74HC_HCT4017
2 of 24
74HC4017; 74HCT4017
NXP Semiconductors
CTRDIV10/DEC
14
13
14
15
Q0
Q1
Q2
Q3
Q4
10
Q5
Q6
Q7
Q8
Q9
11
Q5-9
12
CT5
CP1
CP0
MR
&
13
15
001aah239
Fig 2.
Fig 3.
Q
FF
1
CP Q
RD
Q
FF
2
CP Q
RD
CP0
2
4
7
10
1
5
6
9
11
12
001aah240
Logic symbol
CP1
CT = 0
Q
FF
3
CP Q
RD
Q
FF
4
CP Q
RD
Q
FF
5
CP Q
RD
MR
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
Q5-9
001aah243
Fig 4.
Logic diagram
74HC_HCT4017
3 of 24
74HC4017; 74HCT4017
NXP Semiconductors
CP0 INPUT
CP1 INPUT
MR INPUT
Q0 OUTPUT
Q1 OUTPUT
Q2 OUTPUT
Q3 OUTPUT
Q4 OUTPUT
Q5 OUTPUT
Q6 OUTPUT
Q7 OUTPUT
Q8 OUTPUT
Q9 OUTPUT
Q5-9 OUTPUT
Fig 5.
001aah244
Timing diagram
74HC_HCT4017
4 of 24
74HC4017; 74HCT4017
NXP Semiconductors
5. Pinning information
5.1 Pinning
terminal 1
index area
74HC4017
74HCT4017
15 MR
Q0
14 CP0
15 MR
Q0
14 CP0
Q2
13 CP1
Q6
12 Q5-9
Q2
13 CP1
Q6
12 Q5-9
Q7
Q3
Q7
11 Q9
Q3
10 Q4
GND
Q8
GND(1)
11 Q9
10 Q4
Q1
Q1
Q8
16 VCC
GND
Q5
16 VCC
Q5
74HC4017
74HCT4017
001aah241
001aah238
Fig 6.
Fig 7.
Pin description
Symbol
Pin
Q[0:9]
GND
ground (0 V)
Q5-9
12
CP1
13
CP0
14
MR
15
VCC
16
supply voltage
74HC_HCT4017
Description
5 of 24
74HC4017; 74HCT4017
NXP Semiconductors
6. Functional description
Table 3.
Function table[1]
MR
CP0
CP1
Operation
Q0 = Q5-9 = HIGH;
Q1 to Q9 = LOW
counter advances
counter advances
no change
no change
no change
no change
[1]
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
Conditions
Min
Max
Unit
0.5
+7
20
mA
20
mA
25
mA
50
mA
IIK
[1]
IOK
[1]
IO
output current
ICC
supply current
IGND
ground current
50
mA
Tstg
storage temperature
65
+150
Ptot
Tamb = 40 C to +125 C
DIP16 package
[2]
750
mW
SO16 package
[3]
500
mW
(T)SSOP16 package
[4]
500
mW
DHVQFN16 package
[5]
500
mW
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
[3]
[4]
[5]
74HC_HCT4017
6 of 24
74HC4017; 74HCT4017
NXP Semiconductors
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
74HC4017
VCC
supply voltage
2.0
5.0
6.0
VI
input voltage
VCC
VO
output voltage
VCC
t/V
625
ns/V
VCC = 4.5 V
1.67
139
ns/V
83
ns/V
ambient temperature
VCC = 6.0 V
40
+125
VCC
supply voltage
4.5
5.0
5.5
Tamb
74HCT4017
VI
input voltage
VCC
VO
output voltage
VCC
t/V
1.67
139
ns/V
Tamb
ambient temperature
40
+125
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 C
Conditions
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
1.5
1.2
1.5
1.5
VCC = 4.5 V
3.15
2.4
3.15
3.15
VCC = 6.0 V
4.2
3.2
4.2
4.2
VCC = 2.0 V
0.8
0.5
0.5
0.5
VCC = 4.5 V
2.1
1.35
1.35
1.35
74HC4017
VIH
VIL
VOH
HIGH-level
input voltage
LOW-level
input voltage
VCC = 6.0 V
2.8
1.8
1.8
1.8
HIGH-level
VI = VIH or VIL
output voltage
IO = 20 A; VCC = 2.0 V
1.9
2.0
1.9
1.9
IO = 20 A; VCC = 4.5 V
4.4
4.5
4.4
4.4
IO = 20 A; VCC = 6.0 V
5.9
6.0
5.9
5.9
3.98 4.32
3.84
3.7
5.48 5.81
5.34
5.2
74HC_HCT4017
7 of 24
74HC4017; 74HCT4017
NXP Semiconductors
Table 6.
Static characteristics continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VOL
25 C
Conditions
Min
Typ
Max
Min
Max
Min
Max
LOW-level
VI = VIH or VIL
output voltage
IO = 20 A; VCC = 2.0 V
0.1
0.1
0.1
IO = 20 A; VCC = 4.5 V
0.1
0.1
0.1
IO = 20 A; VCC = 6.0 V
0.1
0.1
0.1
0.15
0.26
0.33
0.4
0.16
0.26
0.33
0.4
0.1
1.0
1.0
8.0
80
160
input
capacitance
3.5
pF
II
input leakage
current
ICC
CI
VI = VCC or GND;
VCC = 6.0 V
74HCT4017
VIH
HIGH-level
input voltage
2.0
1.6
2.0
2.0
VIL
LOW-level
input voltage
1.2
0.8
0.8
0.8
VOH
HIGH-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = 20 A
4.4
4.5
4.4
4.4
3.98 4.32
3.84
3.7
IO = 4 mA
VOL
LOW-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = 20 A
0.1
0.1
0.1
IO = 4.0 mA
0.15
0.26
0.33
0.4
VI = VCC or GND;
VCC = 5.5 V
0.1
1.0
1.0
8.0
80
160
CP0 input
25
90
113
123
CP1 input
40
144
180
196
MR input
50
180
225
245
3.5
pF
II
input leakage
current
ICC
ICC
additional
per input pin;
supply current VI = VCC 2.1 V;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V;
IO = 0 A
CI
input
capacitance
74HC_HCT4017
8 of 24
74HC4017; 74HCT4017
NXP Semiconductors
25 C
Conditions
Min
Typ
Max
Min
Max
Min
Max
63
230
290
345
ns
74HC4017
tpd
propagation
delay
[1]
VCC = 2.0 V
VCC = 4.5 V
23
46
58
69
ns
VCC = 5.0 V;
CL = 15 pF
20
ns
VCC = 6.0 V
18
39
49
59
ns
VCC = 2.0 V
61
250
315
375
ns
VCC = 4.5 V
22
50
63
75
ns
VCC = 5.0 V;
CL = 15 pF
20
ns
VCC = 6.0 V
18
43
54
64
ns
VCC = 2.0 V
52
230
290
345
ns
VCC = 4.5 V
19
46
58
69
ns
VCC = 6.0 V
15
39
49
59
ns
VCC = 2.0 V
55
230
290
345
ns
VCC = 4.5 V
20
46
58
69
ns
16
39
49
59
ns
VCC = 2.0 V
19
75
95
110
ns
VCC = 4.5 V
15
19
22
ns
VCC = 6.0 V
13
16
19
ns
VCC = 2.0 V
80
17
100
120
ns
VCC = 4.5 V
16
20
24
ns
VCC = 6.0 V
14
17
20
ns
VCC = 2.0 V
80
19
100
120
ns
VCC = 4.5 V
16
20
24
ns
VCC = 6.0 V
14
17
20
ns
tPHL
tPLH
HIGH to LOW
propagation
delay
LOW to HIGH
propagation
delay
MR to Q[1:9];
see Figure 10
MR to Q5-9, Q0;
see Figure 10
VCC = 6.0 V
tt
tW
transition time
pulse width
[2]
see Figure 10
74HC_HCT4017
9 of 24
74HC4017; 74HCT4017
NXP Semiconductors
Table 7.
Dynamic characteristics continued
GND = 0 V; tr = tf = 6 ns; CL = 50 pF; see Figure 11.
Symbol Parameter
tsu
th
trec
fmax
set-up time
hold time
recovery time
maximum
frequency
25 C
Conditions
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
50
65
75
ns
VCC = 4.5 V
10
13
15
ns
VCC = 6.0 V
11
13
ns
VCC = 2.0 V
50
17
65
75
ns
VCC = 4.5 V
10
13
15
ns
VCC = 6.0 V
11
13
ns
VCC = 2.0 V
17
ns
VCC = 4.5 V
ns
VCC = 6.0 V
ns
VCC = 2.0 V
6.0
23
4.8
4.0
MHz
VCC = 4.5 V
30
70
24
20
MHz
VCC = 5.0 V;
CL = 15 pF
77
MHz
25
83
28
24
MHz
35
pF
VCC = 4.5 V
25
46
58
69
ns
VCC = 5.0 V;
CL = 15 pF
21
ns
VCC = 4.5 V
25
50
63
75
ns
VCC = 5.0 V;
CL = 15 pF
21
ns
22
46
58
69
ns
20
46
58
69
ns
MR to CP0 and
MR to CP1; see Figure 9
VCC = 6.0 V
CPD
power
dissipation
capacitance
VI = GND to VCC;
VCC = 5 V; fi = 1 MHz
[3]
[1]
74HCT4017
tpd
propagation
delay
tPHL
HIGH to LOW
propagation
delay
MR to Q[1:9];
see Figure 10
tPLH
LOW to HIGH
propagation
delay
MR to Q5-9, Q0;
see Figure 10
74HC_HCT4017
VCC = 4.5 V
VCC = 4.5 V
10 of 24
74HC4017; 74HCT4017
NXP Semiconductors
Table 7.
Dynamic characteristics continued
GND = 0 V; tr = tf = 6 ns; CL = 50 pF; see Figure 11.
Symbol Parameter
25 C
Conditions
Min
Typ
Max
Min
Max
Min
Max
15
19
22
ns
16
20
24
ns
16
20
24
ns
10
13
15
ns
10
13
15
ns
ns
VCC = 4.5 V
30
61
24
20
MHz
VCC = 5.0 V;
CL = 15 pF
67
MHz
36
pF
[2]
tt
transition time
see Figure 10
tW
pulse width
VCC = 4.5 V
VCC = 4.5 V
MR (HIGH); see Figure 9
VCC = 4.5 V
tsu
set-up time
th
hold time
VCC = 4.5 V
VCC = 4.5 V
recovery time
trec
MR to CP0 and
MR to CP1; see Figure 9
VCC = 4.5 V
maximum
frequency
fmax
CPD
[1]
power
dissipation
capacitance
[3]
[2]
[3]
74HC_HCT4017
11 of 24
74HC4017; 74HCT4017
NXP Semiconductors
11. Waveforms
VI
CP0 input
VM
GND
tsu
th
tsu
th
VI
CP1 input
VM
GND
001aah245
Fig 8.
Waveforms showing the set-up and hold times for CP0 to CP1 and CP1 to CP0
1/f max
tW
VI
CP0 input
VM
GND
1/f max
VI
CP1 input
VM
GND
tW
trec
VI
MR input
VM
GND
tW
VOH
Q1 - Q9
output
VM
VOL
tPHL
VOH
Q0, Q5 - Q9
output
VOL
VM
tPLH
001aah246
Fig 9.
Waveforms showing the minimum pulse width for CP0, CP1 and MR input; the maximum frequency for
CP0 and CP1 input; the recovery time for MR and the MR input to Qn and Q5-9 output propagation delays
74HC_HCT4017
12 of 24
74HC4017; 74HCT4017
NXP Semiconductors
VI
CP0 input
VM
GND
VI
CP1 input
VM
GND
tPHL
tPLH
VOH
Q1 - Q9
output
VM
VOL
tPLH
tPHL
VOH
Q0, Q5 - Q9
output
VOL
VM
tTLH
tTHL
001aah247
Fig 10. Waveforms showing the propagation delays for CP0, CP1 to Qn, Q5-9 outputs and the output transition
times
Table 8.
Measurement points
Type
Input
Output
VM
VM
74HC4017
0.5 VCC
0.5 VCC
74HCT4017
1.3 V
1.3 V
74HC_HCT4017
13 of 24
74HC4017; 74HCT4017
NXP Semiconductors
VI
tW
90 %
negative
pulse
VM
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VCC
VCC
VI
VO
RL
S1
open
DUT
CL
RT
001aad983
Test data
Type
Input
Load
S1 position
VI
tr, tf
CL
RL
tPHL, tPLH
tPZH, tPHZ
tPZL, tPLZ
74HC4017
VCC
6 ns
15 pF, 50 pF
1 k
open
GND
VCC
74HCT4017
3V
6 ns
15 pF, 50 pF
1 k
open
GND
VCC
Figure 12 shows a technique for extending the number of decoded output states for the
74HC4017; 74HCT4017. Decoded outputs are sequential within each stage and from
stage to stage, with no dead time (except propagation delay).
74HC_HCT4017
14 of 24
74HC4017; 74HCT4017
NXP Semiconductors
CP0
MR
CP0
74HC4017
74HCT4017
CP1
Q0 Q1- - - - Q8 Q9
clock
MR
CP0
74HC4017
74HCT4017
MR
74HC4017
74HCT4017
CP1
Q0 Q1- - - - Q8 Q9
CP1
Q1 - - - - - - Q8 Q9
9 decoded
outputs
8 decoded
outputs
8 decoded
outputs
first stage
intermediate stages
last stage
001aah248
Remark: It is essential not to enable the counter on CP1 when CP0 is HIGH, or on CP0
when CP1 is LOW, as this would cause an extra count.
Figure 13 shows an example of a divide-by 2 through divide-by 10 circuit using one
74HC4017; 74HCT4017. Since the 74HC4017; 74HCT4017 has an asynchronous reset,
the output pulse widths are narrow (minimum expected pulse width is 6 ns). The output
pulse widths can be enlarged by inserting an RC network at the MR input.
74HC4017
74HCT4017
Q5
VCC
Q1
MR
Q0
CP0
divide - by 2
Q2
CP1
divide - by 6
Q6
Q5-9
divide - by 7
Q7
Q9
divide - by 9
divide - by 3
Q3
Q4
divide - by 4
GND
Q8
divide - by 8
divide - by 5
VCC
fin
divide - by 10
fout
001aah249
74HC_HCT4017
15 of 24
74HC4017; 74HCT4017
NXP Semiconductors
SOT38-4
ME
seating plane
A2
A1
c
e
w M
b1
(e 1)
b2
MH
16
pin 1 index
E
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b1
b2
D (1)
E (1)
e1
ME
MH
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches
0.17
0.02
0.13
0.068
0.051
0.021
0.015
0.049
0.033
0.014
0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
95-01-14
03-02-13
SOT38-4
16 of 24
74HC4017; 74HCT4017
NXP Semiconductors
SOT109-1
A
X
c
y
HE
v M A
Z
16
Q
A2
(A 3)
A1
pin 1 index
Lp
1
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
D (1)
E (1)
HE
Lp
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.16
0.15
0.05
0.244
0.041
0.228
0.01
0.01
0.028
0.004
0.012
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
17 of 24
74HC4017; 74HCT4017
NXP Semiconductors
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
A
X
c
y
HE
v M A
Z
9
16
Q
A2
(A 3)
A1
pin 1 index
Lp
L
8
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
D (1)
E (1)
HE
Lp
Z (1)
mm
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
1.00
0.55
8o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT338-1
REFERENCES
IEC
JEDEC
JEITA
MO-150
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
18 of 24
74HC4017; 74HCT4017
NXP Semiconductors
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
c
y
HE
v M A
16
Q
(A 3)
A2
A1
pin 1 index
Lp
L
8
e
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
D (1)
E (2)
HE
Lp
Z (1)
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.40
0.06
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT403-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
19 of 24
74HC4017; 74HCT4017
NXP Semiconductors
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT763-1
16 terminals; body 2.5 x 3.5 x 0.85 mm
A
A1
E
detail X
terminal 1
index area
terminal 1
index area
e1
e
2
y1 C
v M C A B
w M C
Eh
e
16
15
10
Dh
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A(1)
max.
A1
0.05
0.00
0.30
0.18
D (1)
Dh
E (1)
Eh
0.2
3.6
3.4
2.15
1.85
2.6
2.4
1.15
0.85
e
0.5
e1
y1
2.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT763-1
---
MO-241
---
EUROPEAN
PROJECTION
ISSUE DATE
02-10-17
03-01-27
20 of 24
74HC4017; 74HCT4017
NXP Semiconductors
14. Abbreviations
Table 10.
Abbreviations
Acronym
Description
CMOS
DUT
ESD
ElectroStatic Discharge
HBM
MM
Machine Model
TTL
Transistor-Transistor Logic
Revision history
Document ID
Release date
74HC_HCT4017 v.4
20131210
74HC_HCT4017 v.3
74HC_HCT4017_CNV v.2
Modifications:
74HC_HCT4017 v.3
Modifications:
74HC_HCT4017_CNV v.2
74HC_HCT4017
20080108
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Section 3: DHVQFN16 package added.
Section 7: derating values added for DHVQFN16 package.
Section 13: outline drawing added for DHVQFN16 package.
19970829
Product specification
21 of 24
74HC4017; 74HCT4017
NXP Semiconductors
Product status[3]
Definition
Development
This document contains data from the objective specification for product development.
Qualification
Production
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74HC_HCT4017
22 of 24
74HC4017; 74HCT4017
NXP Semiconductors
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
74HC_HCT4017
23 of 24
NXP Semiconductors
74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
18. Contents
1
2
3
4
5
5.1
5.2
6
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended operating conditions. . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Application information. . . . . . . . . . . . . . . . . . 14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21
Legal information. . . . . . . . . . . . . . . . . . . . . . . 22
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Contact information. . . . . . . . . . . . . . . . . . . . . 23
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.