Silicon Wafer Processing

Addison Engineering has an extensive array of

processing capabilities. On our silicon or yours, we can
provide virtually any processing service you may need,
from a simple oxide layer to completely patterned wafers.
Thermal oxide
Ion implant
Epitaxial deposition
Plasma nitride
Photoresist
Wafer bumping

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Silicon Wafer Processing

About Wafers:
In electronics, a wafer (also called a slice or substrate) is a thin slice
of semiconductor material, such as a silicon crystal, used in the
fabrication of integrated circuits and other microdevices.
The wafer serves as the substrate for microelectronic devices built
in and over the wafer and undergoes many microfabrication process
steps such as doping or ion implantation, etching, deposition of various
materials, and photolithographic patterning.

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Silicon Wafer Processing

Formation:
Wafers are formed of highly pure (99.9999999% purity) nearly
defect free single crystal material.
One process for forming crystalline wafers is known as Czochralski
growth invented by the Polish chemist Jan Czochralski.
In this process, a cylindrical ingot of high purity monocrystalline
semiconductor, such as silicon or germanium, is formed by pulling a
seed crystal from a 'melt'.

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Silicon Wafer Processing

Donor impurity atoms, such as boron or phosphorus in the case of
silicon, can be added to the molten intrinsic material in precise
amounts in order to dope the crystal, thus changing it into n-type or
p-type extrinsic semiconductor.

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Silicon Wafer Processing

Thermal oxide:
Oxide
TEOS/PETEOS oxide
Gate oxide
Low temperature oxide
PSG glass
Silicon Nitride
LPCVD
Low Stress
Ultra-low Stress
Polysilicon (undoped)

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Silicon Wafer Processing

Metal deposition
Evaporation
Sputter
Epitaxial deposition
Ion implantation
SOI
oxidation
wafer bonding
Photolithography

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Silicon Wafer Processing

Clean
RCA clean
Mechanical
Ingot slicing
Lap & etch
Wafer thinning
Wafer downsize (diameter cut-down)
Wafer dicing

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Silicon Wafer Processing

Wafer reclaim
Laser marking
Wafer bumping
MEMS - Silicon machining

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Silicon Wafer Processing

Thin Film Processing:
LOW k
Black Diamond
Coral
Spin On
and more
OXIDE: CVD and Thermal
Thick Photoresist & Polymide
High Energy Deep Ion Implant
Nitrides (Si- and O-)

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Silicon Wafer Processing

Low Stress Silicon Nitride
BPSG, PSG, USG
Amorphous Silicon
Diamond Like Carbon
Polysilicon (Doped and Undoped)
METALS: PVD, CVD, Electroplate
Ai, Cu, Au, Cr, Ta, Ti, TiN
TiW, TaN, WN, Ni, Ru
Co, NiSi, TiO2, Pt

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Silicon Wafer Processing

Czochralski Growth:

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Silicon Wafer Processing

Grinding and Slicing:

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Silicon Wafer Processing

Lapping and Etching:

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Silicon Wafer Processing

Polishing and Cleaning:

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Silicon Wafer Processing

Addison Engineering provides Silicon wafers that are
available with a wide range of characteristics (specifications)
to select from.

Thank You

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