Service Manual

Service Manual
F7100

Model : F7100

P/N : MMBD0035501

Date: July, 2004 / Issue 1.0

Table Of Contents
1. INTRODUCTION .................................... 5
1.1 Purpose ................................................. 5
1.2 Regulatory Information .......................... 5
A. Security ............................................. 5
B. Incidence of Harm ............................. 5
C. Changes in Service ........................... 5
D. Maintenance Limitations ................... 5
E. Notice of Radiated Emissions ............ 5
F. Pictures ............................................. 6
G. Interference and Attenuation ............ 6
H. Electrostatic Sensitive Devices ......... 6
1.3 Abbreviations ......................................... 6

2. PERFORMANCE .................................. 8
2.1 H/W Feature .......................................... 8
2.2 Technical Specification .......................... 9

3. TECHNICAL BRIEF ........................... 13

3.1 Transceiver (SI4205-BM, U402) .......... 13
3.2 Power Amplifier Module
(RF3133, U401) .................................... 17
3.3 13 MHz Clock ...................................... 18
3.4 Power Supplies for RF Circuits ............ 18
3.5 Digital Main Processor
(AD6525, U101) ................................... 19
3.6 Analog Main Processor (AD6521, U102)
.............................................................. 23
3.7 Power Management IC
(ADP3522, U202) ................................ 26
3.8 Memory (U201) .................................... 28
3.9 LCD and LCD Backlight ....................... 30
3.10 Keypad Switches and Key Backlight
Illumination ......................................... 33
3.11 Microphone ........................................ 29
3.12 Dual Mode Speaker and MIDI IC ....... 34
3.13 Headset Jack Interface ...................... 36
3.14 Compass ............................................ 37

4. TROUBLE SHOOTING ..................... 38

4.1 RF Components ................................... 38
4.2 RX Trouble ........................................... 39

-3-

4.2.1 Checking Regulator Circuit ......... 40

4.2.2 Checking VCTCXO Circuit ......... 41
4.2.3 Checking Transceiver
Control Signal ............................. 42
4.2.4 Checking Antenna Switch &
Mobile Switch ............................. 43
4.2.5 Checking SAW Filter .................. 44
4.2.6 Checking RX IQ .......................... 45
4.3 TX Trouble ........................................... 46
4.3.1 Checking Regulator Circuit ......... 47
4.3.2 Checking VCTCXO Circuit ......... 48
4.3.3 Checking PLL Control Signal ...... 49
4.3.4 Checking TX IQ .......................... 50
4.3.5 Checking PAM Control Signal .....51
4.3.6 Checking Antenna Switch &
Mobile Switch ............................. 52
4.3.7 Checking Antenna Contact ......... 54
4.4 Power On Trouble ................................ 55
4.5 Charging Trouble ................................. 57
4.6 LCD Trouble ........................................ 59
4.7 Receiver Trouble ................................. 61
4.8 Speaker Trouble .................................. 63
4.9 MIC Trouble ......................................... 65
4.10 Vibrator Trouble ................................. 66
4.11 Key Backlight LED Trouble ................ 68
4.12 SIM Detect Trouble ............................ 69
4.13 Ear Jack Trouble ................................ 70
4.14 Compass Trouble .............................. 73

5. DISASSEMBLY INSTRUCTION ..... 76

5.1 Disassembly ........................................ 76

6. DOWNLOAD AND CALIBRATION

.................................................................... 80
6.1 Download ............................................. 80
A. Download Setup .............................. 80
B. Download Procedure ....................... 81
6.2 Calibration ............................................ 87
A. Equipment List ................................ 87
B. Equipment Setup ............................. 87
C. Test Jig Operation ........................... 88

7. BLOCK DIAGRAM ............................. 90

B. Tx .............................................. 104
C. Rx .............................................. 104
11.3 Means of Test ................................ 105

8. CIRCUIT DIAGRAM ........................... 91

12. AUTO CALIBRATION ................... 107

D. Procedure ....................................... 89

9. PCB LAYOUT ....................................... 96

10. ENGINEERING MODE .................... 99
10.1 BB Test [MENU 1] ......................... 100
10.1.1 LED ..................................... 100
10.1.2 LCD ..................................... 100
10.1.3 Backligh .............................. 100
10.1.4 Buzzer ................................. 100
10.1.5 Vibrator ............................... 100
10.1.6 ADC (Analog to Digital
Converter) ........................... 101
10.1.7 BATTERY ........................... 101
10.1.8 Audio ................................... 101
10.1.9 DAI (Digital Audio Interface)
............................................. 101
10.2 RF Test [MENU 2] ......................... 102
10.2.1 SAR test .............................. 102
10.3 MF Mode [MENU 3] ....................... 102
10.3.1 All auto test ......................... 102
10.3.2 LED ..................................... 102
10.3.3 Backlight ............................. 102
10.3.4 Buzzer ................................. 102
10.3.5 Vibrator ............................... 102
10.3.6 LCD ..................................... 103
10.3.7 Keypad ................................ 103
10.3.8 MicSpkTest ......................... 103
10.3.9 Compass ............................. 103

11. STAND ALONE TEST ................... 104

11.1 Introduction .................................... 104
A. Tx Test ...................................... 104
B. Rx Test ...................................... 104
11.2 Setting Method .............................. 104
A. COM port ................................... 104

-4-

12.1 Overview ........................................ 107

12.2 Requirements ................................ 107
12.3 Menu and settings ......................... 107
12.4 AGC ............................................... 109
12.5 APC ............................................... 109
12.6 ADC ............................................... 109
12.7 Setting ........................................... 109
12.8 How to do calibration ..................... 109

13. EXPLODED VIEW &

REPLACEMENT PART LIST ...... 111
13.1 Exploded View ............................... 111
13.2 Replacement Part
(Mechanic components) ................. 113
(Main components) ......................... 115
13.3 Accessories ................................... 127

1. INTRODUCTION

1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.

1.2 Regulatory Information

A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your companys employees, agents, subcontractors, or person working on your
companys behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it. The manufacturer will not
be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.

C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.

-5-

1. INTRODUCTION

F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the
sign.
Following information is ESD handling:
Service personnel should ground themselves by using a wrist strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
Use a suitable, grounded soldering iron.
Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protective package as
described.

1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC
BB
BER
CC-CV
DAC
DCS
dBm
DSP
EEPROM
ESD
FPCB
GMSK
GPIB
GSM
IPUI
IF
LCD
LDO
LED

Automatic Power Control

Baseband
Bit Error Ratio
Constant Current Constant Voltage
Digital to Analog Converter
Digital Communication System
dB relative to 1 milliwatt
Digital Signal Processing
Electrical Erasable Programmable Read-Only Memory
Electrostatic Discharge
Flexible Printed Circuit Board
Gaussian Minimum Shift Keying
General Purpose Interface Bus
Global System for Mobile Communications
International Portable User Identity
Intermediate Frequency
Liquid Crystal Display
Low Drop Output
Light Emitting Diode

-6-

1. INTRODUCTION

OPLL
PAM
PCB
PGA
PLL
PSTN
RF
RLR
RMS
RTC
SAW
SIM
SLR
SRAM
PSRAM
STMR
TA
TDD
TDMA
UART
VCO
VCTCXO
WAP

Offset Phase Locked Loop

Power Amplifier Module
Printed Circuit Board
Programmable Gain Amplifier
Phase Locked Loop
Public Switched Telephone Network
Radio Frequency
Receiving Loudness Rating
Root Mean Square
Real Time Clock
Surface Acoustic Wave
Subscriber Identity Module
Sending Loudness Rating
Static Random Access Memory
Paeudo SRAM
Side Tone Masking Rating
Travel Adapter
Time Division Duplex
Time Division Multiple Access
Universal Asynchronous Receiver/Transmitter
Voltage Controlled Oscillator
Voltage Control Temperature Compensated Crystal Oscillator
Wireless Application Protocol

-7-

2. PERFORMANCE

2.PERFORMANCE
2.1 H/W Features
Item
Standard Battery

Charging Time
Display
ANT
Ear Phone Jack
PC synchronization
Speech Coding
Data and Fax
Vibrator
Loud Speaker
Voice Recording
C-mike
Receiver
Travel Adaptor
Option

Feature
Li-ion,820mAh
Size : (open) 121.2 X 45.5 X 21mm
(close) 97 X 45.5 X 21mm
Weight : 91g
3Hours
128X160 pixel 65K STN LCD
Internal
Yes
Yes
EFR/FR/HR
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Data Kit

-8-

Comment

2. PERFORMANCE

2.2 Technical Specification

Item

Description

Specification
GSM
TX: 890 + n X 0.2 MHz
RX: 935 + n X 0.2 MHz (n = 1 ~ 124)

Frequency Band

EGSM
TX: 890 + (n 1024) X 0.2 MHz
RX: 935 + (n 1024) X 0.2 MHz (n = 975 ~ 1024)
DCS
TX: 1710 + (n 512) X 0.2 MHz
Rx: 1805 + (n 512) X 0.2 MHz (n = 512 ~ 885)

Phase Error

RMS < 5 degrees

Peak < 20 degrees

Frequency Error

< 0.1 ppm

GSM, EGSM

Power Level

Level

Power

Toler.

Level

Power

Toler.

33 dBm

2dB

13

17 dBm 3dB

31 dBm

3dB

14

15 dBm 3dB

29 dBm

3dB

15

13 dBm 3dB

27 dBm

3dB

16

11 dBm 5dB

25 dBm

3dB

17

9 dBm

5dB

10

23 dBm

3dB

18

7 dBm

5dB

11

21 dBm

3dB

19

5 dBm

5dB

12

19 dBm

3dB

Level

Power

Toler.

Level

Power

Toler.

30 dBm

2dB

14 dBm

3dB

28 dBm

3dB

12 dBm

4dB

26 dBm

3dB

10

10 dBm

4dB

24 dBm

3dB

11

8 dBm

4dB

22 dBm

3dB

12

6 dBm

4dB

20 dBm

3dB

13

4 dBm

4dB

18 dBm

3dB

14

2 dBm

5dB

16 dBm

3dB

15

0 dBm

5dB

DCS

-9-

2. PERFORMANCE

Item

Description

Specification
GSM, EGSM

Output RF Spectrum
(due to modulation)

Offset from Carrier (kHz).

Max. dBc

100

+0.5

200

-30

250

-33

400

-60

600 ~ 1,200

-60

1,200 ~ 1,800

-60

1,800 ~ 3,000

-63

3,000 ~ 6,000

-65

6,000

-71

Offset from Carrier (kHz).

Max. dBc

100

+0.5

200

-30

250

-33

400

-60

600 ~ 1,200

-60

1,200 ~ 1,800

-60

1,800 ~ 3,000

-65

3,000 ~ 6,000

-65

6,000

-73

DCS

GSM, EGSM

Output RF Spectrum
(due to switching transient)

Spurious Emissions

Offset from Carrier (kHz)

Max. (dBm)

400

-19

600

-21

1,200

-21

1,800

-24

Offset from Carrier (kHz)

Max. (dBm)

400

-22

600

-24

1,200

-24

1,800

-27

GSM

Conduction, Emission Status

- 10 -

2. PERFORMANCE

Item

Description

Specification

Bit Error Ratio

RX Level Report Accuracy

GSM, EGSM
BER (Class II) < 2.439% @-102 dBm
DCS
BER (Class II) < 2.439% @-100 dBm
3 dB

10

SLR

8 3 dB

11

12

13

Frequency (Hz)

Max.(dB)

Min.(dB)

100

-12

200

300

-12

1,000

-6

2,000

-6

3,000

-6

3,400

-9

4,000

Frequency (Hz)

Max.(dB)

Min.(dB)

100

-12

200

300

-7

500

-5

1,000

*
0

-5

3,000

-5

3,400

-10

4,000

Sending Response

RLR

2 3 dB

Receiving Response

* Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.
14

STMR

13 5 dB

15

Stability Margin

> 6 dB

16

dB to ARL (dB)

Level Ratio (dB)

-35

17.5

-30

22.5

-20

30.7

-10

33.3

33.7

31.7

10

25.5

Distortion

17

Side Tone Distortion

Three stage distortion < 10%

18

System frequency (13 MHz) tolerance

2.5 ppm
- 11 -

2. PERFORMANCE

Item
19

Description
32.768KHz tolerance

Specification
30 ppm
Full power
< 243 mA (GSM, EGSM) ; < 209 mA (DVS)

20

Power Consumption
Standby
- Normal < 4 mA (Max. power)

21

Talk Time

2h 30m (RF power level 7)

22

Ringer Volume

At least 80 dB under below conditions:

1. Ringer set as ringer.
2. Test distance set as 50 cm

23

Charge Voltage

Fast Charge : < 500 mA

Slow Charge: < 60 mA

24

Antenna Display

25

Battery Indicator

26

Low Voltage Warning

27

Forced shut down Voltage

28

Battery Type

29

Travel Charger

Antenna Bar Number

Power

5
4
3
2
1
0
Battery Bar Number

-85 dBm ~
-90 dBm ~ -86 dBm
-95 dBm ~ -91 dBm
-100 dBm ~ -96 dBm
-105 dBm ~ -101 dBm
~ -105 dBm
Voltage

0
~ 3.62 V
1
3.62 ~ 3.73 V
2
3.73 ~ 3.82 V
3
3.82 V ~
3.62 0.03 V (Call)
3.5 0.03 V (Standby)
3.35 0.03 V
1 Li-ion Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity : 820mAh
Switching-mode charger
Input : 100 ~ 240 V, 50/60 Hz
Output : 5.2 V, 600 mA

- 12 -

3. TECHNICAL BRIEF

3. TECHNICAL BRIEF
3.1 Transceiver (SI4205-BM, U402)
The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage
supply part, and a VCTCXO part.
The Aero I transceiver is the integrated RF front end for multi-band GSM/GPRS digital cellular
handsets and wireless data modems. The integrated solution eliminates the IF SAW filter, external low
noise amplifier (LNAs) for three bands, transmit and RF voltage controlled oscillator (VCO modules),
and other discrete components found in conventional designs.

Figure 3-1 Block Diagram of SI4205

(1) Receiver part

The Aero I transceiver uses a low-IF receiver architecture which allows for the on
chip integration of the channel selection filters, eliminating the external RF image reject
filters and the IF SAW filter required in conventional superheterodyne architectures.

A. RF front end
RF front end consists of Antenna Switch(FL401), two SAW Filters(FL402, FL403)
and dual band LNAs integrated in transceiver (U402).
The Received RF signals(GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are
fed into the antenna or Mobile switch.
The Antenna Switch(FL401) is used to control the Rx and Tx paths. And, the input
signals VC1 and VC2 of a FL401 are directly connected to baseband controller to switch
either Tx or Rx path on.
The logic and current is given below Table 3-1.

- 13 -

3. TECHNICAL BRIEF

Table 3-1 The Logic and current

VC1

VC2

Current

DCS TX

OV

2.5 ~ 3.0V

10.0 mA max

GSM TX

2.5 ~ 3.0V

0V

10.0 mA max

GSM/DCS RX

0V

0V

< 0.1 mA

Three differential-input LNAs are integrated in SI4205. The GSM input supports the GSM 850 (869849 MHz) or E-GSM 900 (925-960MHz) bands. The DCS input supports the DCS 1800 (1805-1880
MHz) band. The PCS input supports the PCS 1900 (1930-1990 MHz) band.
The LNA inputs are matched to the 150 balanced output SAW filters through external LC matching
networks. The LNA gain is controlled with the LNAG[1:0] and LNAC[1:0] bits in register 05h (Figure 32).

Figure 3-2 Block Diagram of Receiver part of SI4205

B. Intermediate frequency (IF) and Demodulation

A quadrature image-reject mixer downconverts the RF signal to a 100KHz intermediate frequency (IF)
with the RFLO from the frequency synthesizer. The RFLO frequency is between 1737.8 to 1989.9
MHz, and is internally divided by 2 for GSM 850 and E-GSM 900 modes. The mixer output is amplified
with an analog programmable gain amplifier (PGA), which is controlled with the AGAIN[2:0] bits in
register 05h (Figure3-2). The quadrature IF signal is digitized with high resolution A/D converters
(ADCs).
The ADC output is downconverted to baseband with a digital 100KHz quadrature LO signal. Digital
decimation and IIR filters perform channel selection to remove blocking and reference interference
signals. The selectivity setting (CSEL=0) or a low selectivity setting (CSEL=1). The low selectivity filter
has a flatter group channelization filter is in the baseband chip. After channel selection, the digital
output is scaled with a digital PGA, which is controlled with the DGAIN [5:0] bits in register 05h.
The amplified digital output signal go through with DACs that drive a differential analog signal onto the
RXIP,RXIN,RXQP and RXQN pins to interface to standard analog ADC input baseband ICs. No

- 14 -

3. TECHNICAL BRIEF

special processing is required in the baseband for offset compensation or extended dynamic range.
Compared to a direct-conversion architecture, the low-IF architecture has a much greater degree of
immunity to dc offsets that can arise from RF local oscillator(RFLO) self-mixing, 2nd order distortion of
blockers, and device 1/f noise.

(2) Transmitter part

The transmit (Tx) section consists of an I/Q baseband upconverter, and offset phase-locked loop
(OPLL) and two output buffers that can drive external power amplifiers (PA), one for the GSM 850
(824-849 MHz) and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800 (1710-1785 MHz)
and PCS 1900 (1850-1910MHz) bands.

Figure 3-3 Block Diagram of Transmitter part of SI4205

A. IF Modulator
The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the
Transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted
sideband rejection and produces a GMSK modulated signal. The baseband software is able to cancel
out differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A converters.
The Tx-Modulator implements a quadrature modulator. A quadrature mixer upconverts the differential
in-phase (TXIP, TXIN) and quadrature (TXQP, TXQN) signals with the IFLO to generate a SSB IF
signal that is filtered and used as the reference input to the OPLL.
The IFLO frequency is generated between 766 and 896 MHz and internally divided by 2 to generate
the quadrature LO signals for the quadrature modulator, resulting in an IF between 383 and 448 MHz.
For the E-GSM 900 band, two different IFLO frequencies are required for spur management.
Therefore, the IF PLL must be programmed per channel in the E-GSM 900 band.

B. OPLL
The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO.
The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by 2
for the GSM 850 and E-GSM 900 bands. The RFLO frequency is generated between 1272 and 1483
MHz. To allow a single VCO to be used for the RFLO, high-side injection is used for the GSM 850 and
E-GSM 900 bands, and low-side injection is used for the DCS 1800 and PCS 1900 bands. The I and Q

- 15 -

3. TECHNICAL BRIEF

signals are automatically swapped when switching bands. Additionally, the SWAP bit in register 03h
can be used to manually exchange the I and Q signals.
Low-pass filters before the OPLL phase detector reduce the harmonic content of the quadrature
modulator and feedback mixer outputs. The cutoff frequency of the filters is programmable with the
FIF[3:0] bits in register 04h (Figure 3-3), and should be set to the recommended settings detailed in
the register description.

(3) Frequency Synthesizer

Figure 3-4 Block Diagram of Frequency Synthesizer part of SI4205

The Aero I transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop
filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs.
The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode. The IF PLL is
used only during transmit mode. All VCO tuning inductors are also integrated. The IF and RF output
frequencies are set by programming the N-Divider registers, NRF1, NRF2 and NIF. Programming the
N-Divider register for either RF1 or RF2 automatically selects the proper VCO. The output frequency of
each PLL is as follows:
fout = N x f
The DIV2 bit in register 31h controls a programmable divider at the XIN pin to allow either a 13 or 26
MHz reference frequency. For receive mode, the RF1 PLL phase detector update rate (f) should be
programmed f = 100 kHz for DCS 1800 or PCS 1900 bands, and f = 200 kHz for GSM 850 and EGSM 900 bands. For transmit mode, the RF2 and IF PLL phase detector update rates are always
f =200 kHz.

- 16 -

3. TECHNICAL BRIEF

3.2 Power Amplifier Module (RF3133, U401)

The RF3133 is a high-power, high-efficiency power amplifier module with integrated power control.
The device is self-contained with 50 input and output terminals. The power control function is also
incorporated, eliminating the need for directional couplers, detector diodes, power control ASICs and
other power control circuitry; this allows the module to be driven directly from the DAC output.
The device is designed for use as the final RF amplifier in GSM 850, E-GSM 900, DCS and PCS
handheld digital cellular equipment and other applications in the 824-849 MHz, 880-915 MHz, 17101785 MHz, and 1850-1910 MHz bands.
On-board power control provides over 37 dB of control range with an analog voltage input
(TX_RAMP); and, power down with a logic low for standby operation (TX_ENABLE).
External control (BAND_SELECT) is used to select the GSM or DCS band with a logic high or low. A
logic low enables the GSM band whereas a logic high enables the DCS band.

Figure 3-5 Functional Block Diagram of RF3133

- 17 -

3. TECHNICAL BRIEF

3.3 13 MHz Clock

The 13 MHz clock(X401) consists of a TCXO(Temperature Compensated Crystal Oscillator) which
oscillates at a frequency of 13 MHz. It is used within the Si4205, analog base band
chipset(U102,AD6521), digital base band chipset(U101, AD6525), and MIDI (U204) chipset.

2V75_VTCXO
X401

R412

OUT VCONT

R413

AFC

100
4

VCC

C437
2.2u
(1608)

GND

15K

C434
1000p

13MHz

Figure 3-6 VCTCXO circuit diagram

3.4 Power Supplies for RF Circuits

Two regulators are used for RF circuits. One is MIC5255 (U410), and the other is one port of ADP3522
(U202).
MIC5255 (U410) supplies power to transceiver (SI4205, U402).One port of ADP3522 supplies power
to VCTCXO (X401).
Main power (VBAT) from battery is used for PAM (RF3133, U401) because PAM requires high power.
Table 3-2 Power suppliers for RF circuits.
Supplier

Voltage

Powers

enabled signal

U410

2.85 V

U402

CLK_ON

U202

2.75 V

X401

Battery

3.4 ~ 4.2 V

U401

VBAT

RF2.85V
U410
5
C438
0.01u
10u

OUT
BYP

1
IN
2
GND
3
EN

CLK_ON

MIC5255-2.85BM5
10u
C457

C456

Figure 3-7 U410 circuit diagram

- 18 -

6.8K
R489

3. TECHNICAL BRIEF

3.5 Digital Main Processor (AD6525, U101)

(1) Architecture Overview

Figure 3-8 Block Diagram of the AD6525 Internal Architecture

The internal architecture of AD6525 is shown in Figure 3-8. AD6525 regroups three main subsystems
connected together through a dynamic and flexible communication by network. It also includes
onboard system RAM (SRAM) and interfaces with external Flash Memory, Baseband converter
functions, and terminal functions like MMI, SIM and Universal System Connector (USC).
The Digital Signal Processing (DSP) subsystem primarily hosts all the speech processing, channel
equalization and channel codec functions. The code used to implement such functions can be stored
in external Flash Memory and dynamically downloaded on demand into the DSPs program RAM and
Instruction Cache.
The microcontroller subsystem supports all the GSM terminal software, including the layer 1, 2 and 3
of the GSM protocol stack, the MMI, and applications software such as data services, test and
maintenance. It is tightly associated with on-chip system SRAM and also includes boot ROM memory
with a small dedicated routine to facilitate the initialization of the external Flash Memory via code
download using the on-chip serial interface to the external Flash Memory interface.
The peripheral subsystem is composed of system peripherals such as interrupt controller, real time
clock, watch dog timer, power management and a timing and control module. It also includes
peripheral interfaces to the terminal functions: keyboard, battery supervision, radio and display. Both
the DSP and the MCU can access the peripheral subsystem via the peripheral bus (PBUS).

- 19 -

3. TECHNICAL BRIEF

For program and data storage, both the MCU subsystem and the DSP subsystem can access the on
chip system SRAM and external memory such Flash Memory. The access to the SRAM module is
made through the RAM Bus (RBUS) under the control of the bus arbitration logic. Similarly, access to
the Flash Memory is through the parallel External Bus (EBUS).

Figure 3-9 Example of System Interconnection of AD6525 External Interfaces

- 20 -

3. TECHNICAL BRIEF

(2) Interconnection with external devices

A. RTC Block Interface
Countered by external crystal oscillator (MC-146, X101).
The X-tal oscillates 32.768 KHz.

B. LCD Module Interface

Controlled by LCD_CS, LCD_RES, ADD01, WR, DATA[0:15], DIM_CNTL, and LCD_ID.
Table 3-3 LCD module interface
Description
LCD_CS

LCD driver chip enable. LCD driver IC has own CS pin

LCD_RES

This pin resets LCD module.

This pin determines whether the data to LCD module are
display data or control data. ADD1 can select 16 bit parallel
bus. ADD1 is also used to address flash memory.

ADD01
WR
DATA[0:15]

Write control.
Parallel data lines. Color LCD driver chip uses the 16 bit data
interface.

LCD_BL

Control signal for white LED(LCD backlight) driver IC.

LCD_ID

Reserved for future use.

C. RF Interface
The AD6525 control RF parts through RF_EN, ANT_SW1/2, PA_EN, PA_BAND, RF_PWR_DWN,
S_EN, S_DATA, AND S_CLK.
Table 3-4 RF interface
GPO

Signal Name

Description

RF_EN

ANT_SW1

Antenna Switch Band Select

11

ANT_SW2

Antenna Switch Band Select

16

PA_EN

17

PA_BAND

PAM Band Select

18

RF_PWR_DWN

Power Down Input

19

S_EN

Serial Enable Input

20

S_DATA

Serial Data Input

21

S_CLK

Serial Clock Input

RF Enable / Disable

PAM Enable / Disable

- 21 -

3. TECHNICAL BRIEF

D. SIM Interface
The AD6525 check status periodically in call mode if SIM card is inserted or not, but the AD6525 don't
check in deep sleep mode.
Interface signals are SIM_DATAOP, SIM_CLK, SIM_RST, SIM_EN
Table 3-5 SIM interface

SIM_DATAOP

Description
This pin receives and sends data to SIM card. This model
support 3.0 volt interface SIM card.

SIM_CLK

Clock 3.25 MHz frequency.

SIM_RST

Reset SIM Block

SIM_EN

Enable SIM Block

E. Key Interface
Key Interface includes 5 column (KEYCOL[0:4]) and 5 row (KEYROW[0:4]). AD6525
detects key press by interrupt.

F. ADP3522(PMIC, U202) Interface

There are 4 signals for PMIC (power management IC) interface.
Table 3-6 PMIC interface
Description
CHRDET

The pin is activated when charger is inserted.

CHG_EN

Enable charging

EOC
GATE_EN

The pin is activated by PMIC when VBAT reaches 4.2V.

Control signal from AD6525 to charge NiMH battery. Not used.

- 22 -

3. TECHNICAL BRIEF

3.6 Analog Main Processor (AD6521, U102)

(1) Block Diagram

Figure 3-10 Functional Block Diagram of AD6521

- 23 -

3. TECHNICAL BRIEF

(2) BB Transmit Section

This section generates in-phase and quadrature BB modulated GMSK signals (BT = 0.3) in
accordance with GSM 05.05 Phase 2 specifications.
The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit
DACs and a matched pair of reconstruction filter.
There are TXIP, TXIN, TXQP, TXQN, and RAMPDAC.

(3) BB Receiver Section

This section consists of two identical ADC channels that process baseband in-phase(I) and
quadrature(Q) input signals.
Each channel consists of a coarse switched capacitor input filter, followed by a high-order sigma-delta
modulator and a lowpass digital filter.
There are RXIP, RXIN, RXQP, and RXQN.

(4) Auxiliary Section

This section contains two auxiliary DACs(AFC DAC, IDAC) for system control.
This section also contains AUX ADC and Voltage Reference
AUX ADC : 6 channel 10 bits
AFC DAC : 13 bits
IDAC : 10 bits

(5) Voiceband Section

Receive audio signal from MIC. Send audio signal to Receiver. The phones use differential
configuration. It interconnects external devices such as main microphone, main receiver, ear-phone
through the VINNORP, VINNORN, VOUTNORP, VOUTNORN, VINAUXP, VINAUXN, VOUTAUXP,
and VOUTAUXN
VINNORP, VINNORN: Main MIC positive/negative terminal.
VOUTNORP, VOUTNORN: Main Receiver positive/negative terminal.
VINAUXP, VINAUXN: ear-phone microphone positive/negative terminal.
VOUTAUXP, VOUTAUXON: ear-phone speaker positive/negative terminal.

- 24 -

3. TECHNICAL BRIEF

2V55_VAN 1V8_VCORE 2V8_VMEM

R101
C107

C180
10u

100K

47n

C108

DVDD1
DVDD2
DVDD3

AVDD1
AVDD2
AVDD3

B2
TDI
B1
TDO
C2
TMS
C1
TCK

A1
G1
K5

F10
A9
J8

47n

ITXP
ITXN
QTXN
QTXP
IRXP
IRXN
QRXP
QRXN

J4
RXON
K4
TXON

U102
AD6521

A10
AFCDAC
H9
RAMPDAC

A6
AUXADC1
A5
AUXADC2
B5
AUXADC3
A4
AUXADC4

BSDI
BSIFS
BSDO
BSOFS
VSDO
VSDI
VSFS

2V8_VMEM

AFC
TX_RAMP

A8
REFCAP
A7
REFOUT

R103
120K
COMPASS_OUT
BAT_TEMP

R105 1K
BOARD_TEMP
C112 C113
MON_VBAT
39p

0.1u

C114
10p

C115 C111
39p

1u
(1608)

C116

R106
82K

39p

CLOSE TO AD6521
H10
VINAUXP
G10
VINAUXN
J10
VINNORP
K10
VINNORN

B4
IDACOUT
A3
IDACREF

C120 100

39p 39p 39p

DGND1
DGND2
A2
J5

B3
J7
B8
G9

AGND4
AGND3
AGND2
AGND1

BUZZER

HEADSET_MIC_P
HEADSET_MIC_N
MIC_P

R109

C122 C123 C124

39p R111

C121

0.1u

C125 100
39p

J6

CLOSE TO AD6521

K8
VOUTNORP
K7
VOUTNORN
K9
VOUTAUXP
K6
VOUTAUXN
NC1
NC2
NC3
NC4

G2
F2
F1
E2
D1
E1
D2

MCLK
MCLKEN
RESET
ARSM
ATSM
ASDO
ASDI
ASFS

TXIP
TXIN
TXQN
TXQP
RXIP
RXIN
RXQP
RXQN

REC_P
REC_N
HEADSET_SPK_P
C126
C129 C130

39p

39p 0.1u

J9
B9
B6
B7

J2
K2
K1
J3
K3
J1
H1
H2

F9
E9
C9
D9
E10
D10
C10
B10

Figure 3-11 Circuit Diagram of AD6521.

- 25 -

MIC_N

3. TECHNICAL BRIEF

3.7 Power Management IC (ADP3522, U202)

Block Diagram

Figure 3-12 Block Diagram of ADP3522.

- 26 -

3. TECHNICAL BRIEF

Table 3-7 LDOs of ADP3522.

Description
VSIM
VCORE
VRTC
VAN

2.85V (is provided to Sim card)

1.8V (is provided to the AD6525 & AD6521s digital core)
2.0V (is provided to the RTC and Backup Battary)
2.55V (is provided to the AD6521 I/O and used as microphone bias)

VTCXO

2.75V (is provided to VCTCXO)

VMEN

2.8V (is provided to Flash)

Power on sequence
If a battery is inserted, the battery powers the 6 LDOs.
Then if PWRONKEY is detected, the LDOs output turn on.
REFOUT is also enabled, Reset signal is generated and send to the AD6525.

LDO block
There are 6 LDOs in the ADP3522.

Charging Process
1. Check charger is inserted or not.
2. If ADP3522 detects that Charger is inserted, the CC-CV charging starts.
3. Exception: When battery voltage is lower than 3.2V, the trickle charge (low current charge mode)
starts firstly. After the battery voltage reaches to 3.2V, the CC-CV charging starts.

Battery charging block

It can be used to charge Lithium Ion and/or Nickel Metal Hydride batteries. The phones use Li-Ion
battery only. Charger initialization, trickle charging, and constant current charging are implemented in
hardware.

Pins used for charging

CHGDET : Interrupt to AD6525 when charger is plugged.
CHG_EN : Control signal from AD6525 to charge battery.
EOC : Interrupt to AD6525 when battery is fully charged.
GATE_EN : Control signal from AD6525 to charge NiMH battery. But, not used.

TA (Travel Adaptor)
Input voltage : AC 110V ~ 240V, 50~60Hz
Output voltage : DC 5.2V( 0.2 V)
Output current : Max 800mA

Battery
Li-ion battery : Max 4.2V, Nom 3.7V
Standard battery : Capacity - 820mAh, Li-ion
- 27 -

3. TECHNICAL BRIEF

3.8 Memory (U201)

The memory is consists of 128Mbit Nor Flash Memory and 32Mbit Pseudo SRAM. It has 16 bit parallel
data bus and 22 bit address.
Software, RF calibration data, audio parameters and battery calibration data are stored in the Flash
memory.

Figure 3-13 Block Diagram of Memory.

- 28 -

3. TECHNICAL BRIEF

Table 3-8 Pin Description of U201.

A-1,A0 to A21

Address inputs

DQ0 to DQ15

Data inputs / outputs

CE1ps , CE2ps

Chip enable inputs for Pseudo SRAM

CEf1 , CEf2

Chip enable inputs for Nor Flash Memory

OE

Output enable input

WE

Write enable input

LB , UB

Data byte control inputs for Pseudo SRAM

WP/ACC

Write protect /program acceleration input for Nor Flash Memory

RESET
BYTE
RY/ BY

Hardware reset input for Nor Flash Memory

Word/Byte onput for Nor Flash Memory
Ready/Busy output for Nor Flash Memory

Vccps

power supply for Pseudo SRAM

Vccf

power supply for Nor Flash Memory

Vss

Ground

DU

Dont use

NC

Not connected

- 29 -

3. TECHNICAL BRIEF

3.9 LCD and LCD Backlight

(1) LCD Features
Display Mode : 65K Color STN LCD
Color Depth : 32(Red) * 64(Green) * 32(Blue) = 65K Color
Resolution : 128 * RGB * 160 dots for Color display
Interface : 8080-series MPU interface
Data bus : 16 bit Parallel interface
Duty ratio : 1/160 Duty for Color display
Viewing Direction : 12 o'clock
LCD Driver : S6B33B0A by SEC
Display RAM capacity : 144 x 16 x 176 = 405.504k bits for Color display
Control Signal is explained in Table 3-3.

(2) LCD Backlight

For LCD backlight illumination, there are LCD_BL and DIM_CNTL signal from AD6525.

128 x 160 LCD CONNECTOR

2V8_VMEM
VBAT
CN303

LCD_BL
LCD_CS
ADD01
DATA00
DATA02
DATA04
DATA06
DATA08
DATA10
DATA12
DATA14

R328
R329
R333
R335
R337
R340
R342
R344
R346
R348

1
2
3
4
5
6
7
8
9
10
11
12
13

1K
1K
1K
1K
1K
1K
1K
1K
1K
1K

DIM_CNTL
C313

C314

C315

27p

27p

27p

C316

C317

C318

C319

C320

C321

C322

C323

C324

C325

C326

C327

C328

C329

C330

C331

C332

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

26
25
24
23
22
21
20
19
18
17
16
15
14

C334
C333
27p

SP304

Figure 3-14 Circuit Diagram of Driver IC for LCD backlight.

- 30 -

3. TECHNICAL BRIEF

3.10 Keypad Switches and Key Backlight Illumination

(1) Keypad Switches
The key switches are metal domes, which make contact between two concentric pads on the keypad
layer of the PCB when pressed. There are 21 switches , connected in a matrix of 5 rows by 5 columns,
as shown in Figure, except for the power switch (END), which is connected independently. Functions,
the row and column lines of the keypad are connected to ports of AD6525. The columns are outputs,
while the rows are inputs and have pull-up resistors built in. When a key is pressed, the corresponding
row and column are connected together, causing the row input to go low and generate an interrupt.
The columns/rows are then scanned by AD6525 to identify the pressed key.

KEY
1

LEFT

MENU

R600
KEY_ROW1
1K
SP600

SP602

SP601

END

SP603
SELECT

UP

POWERKEY
R602
SP604

KEY_ROW2
1K
SP606

SP605
7

SP607
9

SP608
RIGHT

SEND

R614
KEY_ROW3
1K
SP609

SP611

SP610
0

STAR

SHARP

SP612
CONFIRM

DOWN

R616
KEY_ROW4
1K
SP614

SP613

SP615

SP616

SP617

CLR

R617
KEY_ROW0
1K
SP618

R618 1K
KEY_COL0
R620 1K
KEY_COL1
R621 1K
KEY_COL2
R622 1K
KEY_COL3
R623 1K
KEY_COL4

SW101

SW102

VOL_DOWN

VOL_UP
1

VR101

2 3

4
5

VR103

R118

KEY_COL1
680
VR102

2 3 5

R119

680

R120

680

KEY_ROW0
KEY_COL0

VR104

Figure 3-15 Circuit Diagram of Keypad Switches & side key

- 31 -

3. TECHNICAL BRIEF

(2) Key Backlight Illumination

There are 10 blue LEDs for key backlight illumination which are driven by KEY_BL signal from
AD6525.

KEY BACKLIGHT
VBAT

VBAT

KEY_BL1
KEY_BL2

R604
20

R605
20

R606
20

R607
20

R608
20

R609
20

R610
20

R611
20

R612
20

R613
20

Q202 IMX9T110

SP206
R230
KEY_BL
1.5K
R233

LD600 LD601 LD602 LD603 LD604

LD605 LD606 LD607 LD608 LD609

100K
R234
20

R235
20

KEY_BL1
KEY_BL2

Figure 3-16 Circuit Diagram of Key backlight illumination

- 32 -

R231 R232
20
20

SP207

3. TECHNICAL BRIEF

3.11 Microphone
The microphone is placed to KEY PCB. The audio signal is passed to VINNORP and VINNORN pins
of AD6521. The voltage supply 2V55_VAN is output from ADP3522, and is a bias voltage for the
VINNORP.
The VINNORP and VINNORN signals are A/D converted by the Voiceband ADC part of AD6521. The
digitized speech is then passed to the DSP section of AD6525 for processing (coding, interleaving
etc).
2V55_VAN

R601
1K

C600
10u

R603

C601

2K

VA600
AVL5M02-200

39p
MIC_P
C602

MIC

2
1

39p
MIC

MIC_N
R615
3.6K

C603
39p

VA601
AVL5M02-200

Figure 3-17 Circuit Diagram of Microphone.

- 33 -

3. Technical brief

3.12 Dual Mode Speaker and MIDI IC

(1) Dual Mode Speaker
There is a control signal (SPK_SEN) which is for enabling receiver or speaker because one dual mode
speaker is used for both receiver and speaker. The signal is produced by AD6525 and controls the
analog switch (U203).
The dual mode speaker is placed in the front cover and contacted to main PCB.

A. Receiver Operation
The dual mode speaker is driven by VOUTNORP and VOUTNORN of AD6521 through an analog
switch (U203) when it is used for receiver. The gain is controlled by the PGA in AD6521.

B. Speaker Operation
The dual mode speaker is driven by SPOUT1 and SPOUT2 of YMU762 (U204) through the analog
switch (U203) when it is used for loud speaker.
2V8_VMEM

R208
0
13MHZ
MIDI_RST
ADD00
RD
MIDI_CS

R211

1
4 CLK1
_RST
30
A0
31
_RD
29
5 _CS
NC
28
3

WR
MIDI_IRQ

27
26
25
24
23
22
21
20

DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
C220

R228

1000p

3.3K

C227
0.1u

HPOUT_R

11
10

HPOUT_L
EQ1

12

EQ2

13

EQ3

14

LED
MTR

2
19

_WR
_IRQ
D0
D1
D2
D3
D4
D5
D6
D7

C215
0.01u

R212
33K

R213
82K

VREF

32

IOVDD

VDD

VSS

U203
C217

NLAS4684MR2

10
NO2

39p
SPOUT1

SPK+

17

2
NO1

COM2
8

COM1

SPOUT2

SPK-

16

C223

47p

47p

NC2

C224

R215

REC_P

NC1

12

GND

10p

C226
C228
10p

C229
0.1u

REC_SPK+

7
IN1

C222

47p

IN2

18
3V3_VMIDI

SPVSS

REC_SPK-

C218
3

SPVDD 15

C230
0.1u

2V8_VMEM

V+

U204
YMU762

PLLC

C216
390p

C225
10p VA201

SPK_SEL

R216
REC_N
12

SP201 SP202
VA202

10p

C231

R217

10p

100K

Figure 3-18 Circuit Diagram of Dual Mode Speaker.

- 34 -

AVL14K02200
AVL14K02200

CN210
1
2

3. TECHNICAL BRIEF

(2) MIDI IC (YMU762, U204)

The phone uses melody IC which makes the robust joyful melody sounds.
6 signals (MIDI_RST, ADD00, RD, MIDI_CS, WR, MIDI_IRQ) from AD6525 are used to control the
melody IC.
Melody data (DATA[8:15]) is transferred to melody IC and played by the dual mode speaker.
External 3.3V LDO (U206) is used for the MIDI chip because the maximum output current of analog
amplifier in melody IC is 300mA.
2V8_VMEM

R208
0
13MHZ
MIDI_RST
ADD00
RD
MIDI_CS

R211

1
4

CLK1
_RST
30
A0
31
_RD
29
5 _CS
NC
28
3

WR
MIDI_IRQ

27
26
25
24
23
22
21
20

DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
C220

R228

1000p

3.3K

C227
0.1u

HPOUT_R

11
10

HPOUT_L
EQ1

12

EQ2

13

_WR
_IRQ
D0
D1
D2
D3
D4
D5
D6
D7

C215
0.01u

R212
33K

R213
82K
EQ3

14

LED
MTR

2
19

U204
YMU762

PLLC

VREF

SPOUT1

SPOUT2

SPK+

17

SPK-

18
3V3_VMIDI

SPVDD 15

C230
0.1u

32

IOVDD

VDD

VSS

SPVSS

C216
390p

C222

C223

47p

47p

C229
0.1u

16

3V3_VMIDI

VBAT

1
2

C219
2.2u
(1608)
C238
10u

U206 LP3981ILD-3.3
6
VOUT
VEN
VIN

BYPASS

VOUT_SE GND1
GND2

MIDI_PWR_EN

5
4
C221
0.1u

Figure 3-19 Circuit Diagram of MIDI-IC and external LDO.

- 35 -

3. TECHNICAL BRIEF

3.13 Headset Jack Interface

3-pole type ear-mic jack which has three electrodes such as Receiver+, Mic+, and GND. This type
usually supports only single-ended configuration (VOUTAUXP for headset speaker and VINAUXP for
headset mic) in the audio path.
There are two control signals for jack interface. One is JACK_DETECT which is for detecting the
headset jack and the other is HOOK_DETECT which is enabled when hook of the headset is pressed.
The pins (JACK_DETECT and HOOK_DETECT) interfaces with AD6525.
2V5_JACK

R218
C232

2V8_VMEM

2V8_VMEM

2.2K

R219 20K

HEADSET_MIC_N
0.1u
C234
0.1u
C236

R229
20K

C250
C235
39p

33u

R221

R222

3.3K

1M

C233
39p

0.1u
VIN+

HEADSET_SPK_P

C237
39p

OUT

(1608)
C251

R223
5

1M

10u

VIN- 4

VCC
GND VIN+ 3

2
U207
MAX9075EXK-T

R220

VCC

GND

OUT

C240
47p

U205
MAX9075EXK-T

5
1
3
4
2

R224
4.7
R226
4.7
C260
NA

620K

HOOK_DET

R214
330K

2V8_VMEM 2V8_VMEM

JACK_DET

VIN- 4

HEADSET_MIC_P

C239
47p

J201

VA203 VA204
Headset jack

R227
1M

AVL14K02200
AVL14K02200
SP203 SP204 SP205

Figure 3-20 Circuit Diagram of Headset Interface.

- 36 -

3. TECHNICAL BRIEF

3.14 Compass
The AMI201 is a magnetic sensor for use in electronic compasses that integrates
Two perpendicularly positioned Magneto-Impedance sensors with their controller IC in a single small
package. The AMI201 outputs linear voltages corresponding to the magnetic field strength in the
direction of each of the two sensors.
Maker : Aichi Micro Intelligent(Japan)
Part No. : AMI201
Size : 3.1X3.4X0.8(mm)
Sensing Method : Magneto-Impedance
Axis : X,Y axis
Resolution : 1 Degree
6pins
- Control Pin : 2 pin(CS,XYIN)
- Output Pin : 1 pin(OUT)
- Power Pin : 3 pins(VDD,GND1,GND2)

2V8_VMEM

U304
1

R361

COMPASS_CS
C355 1K
27p

C356
27p

GND1 GND2
CS

OUT

VDD

XYIN

6
5

R363

R364

1K
(1%)

1K
R500 (1%)
3.9K
(1%)

COMPASS_OUT

AMI201
C358
10u

C357
0.1u

R365
COMPASS_XYIN
C359 1K
27p

C360
27p

Figure 3-21 Circuit Diagram of Compass Interface.

- 37 -

4. TROUBLE SHOOTING

4. TROUBLE SHOOTING
4.1 RF Components

SW401
FL401
FL402,
FL403
U410

U401

U402
X401
Figure 4-1

Table 4-1

Reference

Description

Reference

Description

U402

RF Main Chipset

FL402

GSM SAW Filter

SW401

Mobile S/W

FL403

DCS SAW Filter

FL401

Ant. S/W

X401

VCTCXO

U401

PAM

U410

LDO

- 38 -

4. TROUBLE SHOOTING

4.2 RX Trouble
START
SS : Test mode
62 CH, 7 level setting (TCH)
62 CH, -60dBm setting (BCCH)
Spectrum analyzer setting
Oscilloscope setting

Figure 4-2

1. Check
Regulator Circuit

4
2. Check
VCTCXO Circuit

3. Check
Control
Signal

1
4. Check
Mobile SW

5. Check
Ant SW &

6. Check
Saw Filter
Circuit

7. Check
RX IQ

Redownload SW, CAL

- 39 -

4. TROUBLE SHOOTING

4.2.1 Checking Regulator Circuit

U410.3

U410.5

Figure 4-3

Check Pin 3.
Check Pin 5.

RF 2.85V O.K?

No

Pin3. High ?

No

Changing the Board

Yes

Yes

Replace U410

Regulator Circuit is OK
See next Page to check
VCTCXO

VBAT

RF2.85V
U410
5
C438

0.01u
10u

OUT
BYP

1
IN
2
GND
3
EN

CLK_ON

MIC5255-2.85BM5
10u
C457

C456

Circuit Diagram 4-1

VRF

Graph 4-1

- 40 -

6.8K
R489

4. TROUBLE SHOOTING

4.2.2 Checking VCTCXO Circuit

X401.3

X401.4

Figure 4-4

Check Pin 3.
Refer to Graph 4-4

Yes

13 MHz O.K?
No

Check Pin 4.
Refer to Graph 4-4

Yes

2.75V OK?

VCTCXO Circuit is OK
See next Page to check
ANT SW & Mobile SW

Changing X401

No

Check U202, PMIC

2V75_VTCXO
X401

R412

OUT VCONT

4
C437
2.2u
(1608)

VCC

GND

R413

100
2

AFC
C434
1000p

AD6535_AFCDAC

15K

13MHz

Circuit Diagram 4-2

Graph 4-2

Graph 4-3

- 41 -

4. TROUBLE SHOOTING

4.2.3 Checking Transceiver Control Signal

S_DATA
(TP404)
S_CLK
(TP403)
S_EN
(TP402)
RF_PWR_DWN
(TP401)

Figure 4-5

Check TP 401.

Level is High?

No

Download the SW

No

Download the SW

Yes

Check TP 402, 403,

404. Check if there is
Any Major Difference
Refer to Graph 4-5

Similar?
Yes

Control Signal is OK
See next Page to check
ANT SW & Mobile SW

Graph 4-4

Graph 4-5

- 42 -

4. TROUBLE SHOOTING

4.2.4 Checking Antenna Switch & Mobile Switch

Sw401 Pin1

FL401

ANT1
C401
1.5p

SW401 Pin2

R401

5p

R401

5p
C402
NA

C436

FL403

FL402

C426

G1
RF

G2

ANT

C433

SW401
KMS-507

C411

22p

FL401

8
ANT

C428

C424

GND1
GND2
GND3
GND4
GND5
GND6
GND7

5
EGSM_TX
3
DCS_TX
10
EGSM_RX
1
DCS_RX

VC1
VC2

C422

4
6
7
9
12
13
14

11 2
SHS-C090DR

L403

L404
figure 4-6

For these 2 test case,

No Call connection is needed

Check SW401 Pin 1,2 with

RF Cable connected

No

Open

Changing SW401

Check SW401 Pin 1,2 with

No RF Cable connected

ANT_SW2

GPO_11

ANT_SW1

GPO_9

C433
27p

Yes
No

Short

Changing SW401

C436
10p

Yes
Check C433,C436
Check whether Ant SW set
as RX mode

No

VC1 : Low
VC2 : Low

Circuit Diagram 4-3

Changing the
Board

Yes
Check RF Level of FL401
pin10 (for EGSM)
pin 1 (for DCS)

No

Pin 10 : ~ -62dBm
Pin 1 : ~ -63dBm

Changing FL401

Table 4-2

Yes
For this RF Level test case,
RX Stand alone Mode is
needed

Ant SW & Mobile SW is OK

See Next page to check
Saw Filter

- 43 -

ANT SW

VC1

VC2

DCS TX

GSM TX

EGSM,DCS
RX

4. TROUBLE SHOOTING

4.2.5 Checking SAW Filter

C422
2p

2 3 FL402
C423

FL403

FL402

C426

IN
G2 O2

27p

C423

G1 O1

B7820 5 4

L404

6.8nH

2p
C426
1.5p

2 3 FL403
1

G1 O1
IN

B7821 5 4

C428

C424

22nH

C424

G2 O2

C422

L403

C428
1.5p

Circuit Diagram 4-4

L403

L404

figure 4-7

Check RF Level of Saw

Filter Input
For EGSM : FL402.1
For DCS : FL403.1
Check RF Level of Saw
Filter Output
For EGSM : FL402.3, 402.4
For DCS : FL403.3, 403.4

For these 2 test case,

RX Stand alone mode
is needed

FL402.1:
~ -62dBm
FL403.1:
~ -63dBm

Yes

FL402.3, 402.4 :
~ -65dBm
FL403.3, 403.4 :
~ -66dBm

No

Changing C423 or FL402 for EGSM

Changing FL403 for DCS

Check the parts are

well solded
for EGSM and DCS

No

Soldering is
OK?

Yes Check the parts are

well solded
for EGSM and DCS

Saw Filter is OK
See Next page to check Rx
IQ Signal

- 44 -

No

Yes

Changing
FL402 for EGSM
FL403 for DCS

Changing
L403 or C422 or C424 for EGSM
L404 or C426 or C428 for DCS

4. TROUBLE SHOOTING

4.2.6 Checking RX IQ
C419

C421

RXQP
C419

39p
RXQN
RXIP

C421

39p
RXIN

Circuit Diagram 4-5

figure 4-8

Check C419, C421.

Check if there is
Any Major Difference
Refer to Graph 4-6

Similar?

No

Yes

Redownload the Software

And calibrate

Graph 4-6

- 45 -

Replace U402

4. TROUBLE SHOOTING

4.3 TX Trouble
START
SS : Test mode
62 CH, 7 level setting (TCH)
62 CH, -60dBm setting (BCCH)
Spectrum analyzer setting
Oscilloscope setting

1. Check
Regulator Circuit

2. Check
VCTCXO Circuit

6
3. Check
Control
Signals

1
5

4. Check
TX IQ

Figure 4-9
4

5. Check
PAM Control
Signal

6. Check
Ant SW &
Mobile SW

7. Check
Ant contect

Redownload SW, CAL

- 46 -

4. TROUBLE SHOOTING

4.3.1 Checking Regulator Circuit

U410.3

Figure 4-10

U410.5
Check Pin 3.
Check Pin 5.

RF 2.85V O.K?

Pin3. High ?

No

No

Changing the Board

Yes

Yes

Regulator Circuit is OK
See next Page to check
VCTCXO

Replace U410

VBAT

RF2.85V
U410
5
C438
0.01u
10u

OUT
BYP

1
IN
2
GND
3
EN

CLK_ON

MIC5255-2.85BM5
10u
C457

C456

Circuit Diagram 4-6

VRF

Graph 4-7

- 47 -

6.8K
R489

4. TROUBLE SHOOTING

4.3.2 Checking VCTCXO Circuit

X401.3

X401.4
figure 4-11

Check Pin 3.
Refer to Graph 4-4

Yes

13 MHz O.K?
No

Check Pin 4.
Refer to Graph 4-4

Yes

2.75V OK?

VCTCXO Circuit is OK
See next Page to check
ANT SW & Mobile SW

Changing X400

No

Check U301, PMIC

2V75_VTCXO
X401

R412

OUT VCONT

R413

AFC

100
4
C437
2.2u
(1608)

VCC

GND

C434
1000p

15K

13MHz

Circuit Diagram 4-7

Graph 4-8

Graph 4-9

- 48 -

4. TROUBLE SHOOTING

4.3.3 Checking PLL Control Signal

S_DATA
(TP404)
S_CLK
(TP403)
S_EN
(TP402)
RF_PWR_DWN
(TP401)

figure 4-12

Figure 4-12

Level is High?

Check TP 401.

No

Download the SW

No

Download the SW

Yes

Check TP 402, 403,

404. Check if there is
Any Major Difference
Refer to Graph 4-5

Similar?
Yes

Control Signal is OK
See next Page to check
ANT SW & Mobile SW

Graph 4-10

Graph 4-11

- 49 -

4. TROUBLE SHOOTING

4.3.4 Checking TX IQ
C427

C425

TXIP
C425

39p
TXIN
TXQP

C427

39p
TXQN

Circuit Diagram 4-8

figure 4-13
Check C425, C427.
Check if there is
Any Major Difference
Refer to Graph 4-12

Similar?
Yes

Redownload the Software

And calibrate

Graph 4-12

- 50 -

No

Replace U402

4. TROUBLE SHOOTING

4.3.5 Checking PAM Control Signal

PA_EN
PA_BAND

Figure 4-14

TX_RAMP

For DCS PA_BAND=High,

For GSM PA_BAND=Low

OK?

No

Change board

Yes

Check TX_RAMP and PA_EN

Check if there is
Any Major Difference or not
Refer to Graph 4-13

Similar?
Yes

Go to Next Step

Graph 4-13

- 51 -

No

Download S/W

4. TROUBLE SHOOTING

4.3.6 Checking Antenna Switch & Mobile Switch

ANT1

Sw401 Pin1

FL401

C401
1.5p
R401

5p

R401

5p

SW401 Pin2

C402

RF

G2

C433

G1

ANT

NA
SW401
KMS-507

FL403

FL402

C426

C422
C424

C428

C411

22p

FL401

8
ANT
4
6
7
9
12
13
14

GND1
GND2
GND3
GND4
GND5
GND6
GND7

5
EGSM_TX
3
DCS_TX
10
EGSM_RX
1
DCS_RX

VC1
VC2

C436

11 2
SHS-C090DR

L403

L404
figure 4-15

For the test,

TX Stand alone Mode is
needed. Refer to chapter 11
(PL=7 for GSM, PL=2 for DCS)
Check C433,C436
Check whether Ant SW
Set as TX mode
Refer to Graph 414,15
Refer to Table 4-3
Check RF Level of
FL401 Pin 5 (for
GSM) & Pin 3 (for
DCS)
Check SW401.ANT, RF
with RF Cable
connected.
Check SW401.ANT,RF
with RF Cable disconnected

Check VC1, VC2

No

Changing board

Yes

Pi n 5 : ~ 29.5 dBm
Pi n 3 : ~26. 5dBm

ANT_SW2

GPO_11

ANT_SW1

GPO_9

C433
27p

C436
10p

Circuit Diagram 4-9

No

Go to 4.3.5 Checking
PAM control signal

No

Changing SW401

Yes

Open
Yes

Short

Table 4-3
No

Changing SW401

Yes

END

- 52 -

ANT SW

VC1

VC2

DCS TX

GSM TX

EGSM,DCS
RX

4. TROUBLE SHOOTIng

Graph 4-14 GSM TX

Graph 4-15 DCS TX

- 53 -

4. TROUBLE SHOOTING

4.3.7 Checking Antenna Contact

C460

C401 R401
ANT1

ANT2

C401

C460
0

1.5p

R401

5p

C402

C402

NA

Figure 4-16

Circuit Diagram 4-10

ANT2 , GND is short?

OK?

No

Resolder C460

Yes

Check R401,
C402,C401 soldering

OK?

No

Resoldering R401,
C402,C401

No

Contact antenna

No

Change the board

Yes

Check ant contact

OK?
Yes

Tx ok?

good
Yes

END

- 54 -

4. TROUBLE SHOOTING

4.4 Power On Trouble

SETTING: Connect PIF, and set remote switch off at PIF
* Refer to Figure 4-17

START

Check Battery Voltage

> 3.35V ?

No

Charge or Change Battery

Yes
Push power-on key
and check the level change
of U202 Pin 30

No

Check the contact of power-key

or dome switch.

Yes

Check the voltage of

the following pins at U301
Pin 21 = 1.8V ?
Pin 25 = 2.75V ?
Pin 20 = 2.8V ?
Pin 3 = 2.0V ?

No

Replace U301

Yes
Logic level at pin 29 of U202
= HIGH?

No
Redownload software

Yes
THE PHONE WILL
POWER ON.

- 55 -

4. TROUBLE SHOOTING

P20: 2V8_VMEM
P3: 2V0_VRTC
P21: 1V8_VCORE

P25: 2V75_VTCXO

P29: RPWRON

P30: POWRKEY

Figure 4-17

VBAT
2V8_VMEM
C201
0.1u

CLK_ON
SIM_EN
1000p

C203
0.1u

9
10
12
6
14
4
7
13

R203
0.33

VBAT
Q201
G

D201

6
7
8

4
D4

D3

D5

D2

D6

D1

3
2

2
VMEM
VRTC
REFOUT
_RESET
MVBAT

TPCF8102

33

GND

11

GATE_EN
CHRDET

2V55_VAN
21
2V75_VTCXO
23
2V8_VMEM
2V0_VRTC

25

AGND

18

VTCXO

27

VAN

GATEDR
GATEIN
ISENSE
CHRDET
CHGEN
BATSNS
CHRIN
EOC
DGND

C202

1V8_VCORE

VCORE

TCXOEN
1
SIMEN
15
RESCAP
8
SIMVSEL

C253
10u
(1608)

VSIM

VSIM

28

VCHARGE

CUS02

VRTCIN

30
_PWRONKEY
31 ROWX
29
PWRONIN

POWERKEY
KEY_ROW0
RPWRON

10u
C252
(2012)

VBAT

VBAT

R202
100K

VBAT2

22

19

VCHARGE

NC1
NC2
NC3

20
3
26
R204 100

16
5

17
24
32

RESET
C205
0.1u

C206
100p

C208
0.22u

C211
2.2u

C209
2.2u

(1608)

(1608)

(1608)

C213
0.1u

C212 C210
0.22u 2.2u

C214
0.1u

(1608) (1608)
R205
10K

U202
ADP3522XCP-3

CHG_EN
EOC
R209
100K

Circuit Diagram 4-11

- 56 -

BAT1

C207
100p

4. TROUBLE SHOOTING

4.5 Charging Trouble

SETTING: Connect the battery (3.4 ~ 4V) and the charging adaptor(TA) to the phone

START

Charging Connector(CN310)
well-soldered?

No

Re-solder CN310.

Yes
Voltage at Pin 7 of U202
= 5.2V?

No

The charging adaptor(TA) is out of order.

Change the charging adaptor.

Yes
R203,Q201,D201
well-soldered?

No

Re-solder R203,Q201,D201.

Yes
Voltage across
D201 = ~0.3V

No

Replace D201.

Yes
Voltage across
R203 is ~160mV.

No

Replace R203.

Yes
~0.7< Voltage(Q201) < ~1.3V

No

Replace Q201

Yes
Is the battery charged ?

No

The battery may have the problem.

Change the battery and try again.

Yes
CHARGING WILL
OPERATE PROPERLY.

- 57 -

4. TROUBLE SHOOTING

D201

Q201

R203

Figure 4-18

VBAT
2V8_VMEM
C201
0.1u

CLK_ON
SIM_EN
1000p

C203
0.1u

9
10
12
6
14
4
7
13

R203
0.33

VBAT
Q201

CUS02

7
8

D5

D2

D6

D1

4
3
2

2
VMEM
VRTC
REFOUT
_RESET
MVBAT

TPCF8102

33

11

GATE_EN

GND

NC1
NC2
NC3

CHRDET
CHG_EN
EOC
R209
100K

Circuit Diagram 4-12

- 58 -

2V55_VAN
21
2V75_VTCXO
23
2V8_VMEM
2V0_VRTC

25

AGND

G
D3

18

VTCXO

27

S
D4

VAN

GATEDR
GATEIN
ISENSE
CHRDET
CHGEN
BATSNS
CHRIN
EOC
DGND

C202

1V8_VCORE

VCORE

TCXOEN
1
SIMEN
15
RESCAP
8
SIMVSEL

C253
10u
(1608)

VSIM

VSIM

28

VCHARGE

D201

VRTCIN

30
_PWRONKEY
31 ROWX
29
PWRONIN

POWERKEY
KEY_ROW0
RPWRON

10u
C252
(2012)

VBAT

R202
100K

VBAT

VBAT2

22

19

VCHARGE

20
3
26
16
5

17
24
32

C205
0.1u
C208
0.22u

C211
2.2u

C209
2.2u

(1608)

(1608)

(1608)

C213
0.1u

C212 C210
0.22u 2.2u

C214
0.1u

(1608) (1608)
R205
10K

U202
ADP3522XCP-3

BAT1

4. TROUBLE SHOOTING

4.6 LCD Trouble

START

Power is supplied to
the board?

No

Refer to
Pow er On Trouble

No

Reconne ct LCD
Module

Yes
Connection between
Module and board is OK?
Yes
CN303 is soldered well?

No

Resolder the CN303

Yes
Paths of LCD control
signals are OK?

No

Resolder
R328 ~ R349

No

The boa rd is broken.

Change the board.

Yes
Af ter changing the board,
LCD Displa y i s OK?
Yes
LCD Module i s out of order.
Change the LCD Module.

- 59 -

4. TROUBLE SHOOTING

Check soldering
around connector

R328~R349

Figure 4-19

CN303

Figure 4-20

128 x 160 LCD CONNECTOR

2V8_VMEM
VBAT
CN303

LCD_BL
LCD_CS
ADD01
DATA00
DATA02
DATA04
DATA06
DATA08
DATA10
DATA12
DATA14

R328
R329
R333
R335
R337
R340
R342
R344
R346
R348

1
2
3
4
5
6
7
8
9
10
11
12
13

1K
1K
1K
1K
1K
1K
1K
1K
1K
1K

DIM_CNTL
C313 C314 C315 C316 C317 C318 C319 C320 C321 C322
27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

C323
27p

26
25
24
23
22
21
20
19
18
17
16
15
14

R330
R334
R336
R338
R341
R343
R345
R347
R349

LCD_ID

C324 C325 C326 C327 C328 C329 C330 C331 C332

27p

27p

27p

27p

27p

27p

27p

27p

27p

C334 C335 C336 C337 C338 C339 C340 C341 C342

C333
27p

27p

27p

27p

SP304

Circuit Diagram 4-13

- 60 -

LCD_RST
WR
DATA01
DATA03
DATA05
DATA07
DATA09
DATA11
DATA13
DATA15

1K
1K
1K
1K
1K
1K
1K
1K
1K

27p

27p

27p

27p

27p

27p

C343 C344 C345 C346 C347 C348 C349 C350 C351

27p

27p

27p

27p

27p

27p

27p

27p

27p

4. TROUBLE SHOOTING

4.7 Receiver Trouble

Contact
Point

R217

Dual mode
speaker

U203

R215
R216

Figure 4-21

2V8_VMEM

U203
C217

NLAS4684MR2

10
V+

NO2

39p
2
COM2

C218
3

8
COM1

R215

NC2

NC1

GND

C224

C225

10p

10p VA201

C226
C228
10p

REC_SPK+

SP201 SP202
VA202

10p
SPK_SEL

R216
REC_N
12

CN210
1

7
IN1

12

47p

IN2

REC_P

REC_SPK-

9
NO1

C231

R217

10p

100K

Circuit Diagram 4-14

- 61 -

AVL14K02200
AVL14K02200

4. TROUBLE SHOOTING

START
Set audio part at test equipment
as PRBS or continuous w ave, not echo.
Set the audio volume max.

Does sine wave

appear
at R215, R216 ?

No

ABB is out of order.

Change the board.

Yes

SPK_SEL signal is
low?

No

Check the soldering state of

U203 and R217. Is it OK?

No

Yes

DBB is out of
order.
Change the board.

Yes

Check the contact

State of receiver. Is it
OK?

No

Replace t he
receiver

No Trouble

- 62 -

Resolder the U203

and R217.
Otherwise change it.

4. TROUBLE SHOOTING

4.8 Speaker Trouble

SETTING: Connect PIF to the phone, and Power on. Enter The engineering mode, and set
Melody on at Buzzer of BB test menu

START
Enter into Engineering Mode and
go to menu "BB test => Buzzer => Melody on"

Voltage acro ss C229

= 3.3 V?

No

Check the soldering of

U206. Is it OK?

No

Re-solder U206

Yes
Yes
Replace U206

Voltage acro ss C230

= 2.8 V?

No

Check the soldering of

U202. Is it OK?

No

Re-solder U202

Yes

Yes

Replace U202
Check the si gnal level
Of C222,C223. Are they
a f ew mV?

No

Replace U204

Yes

SPK_SEL signal is high?

No

Check the sol dering state

of U203 and R217.
Is it O K?
Yes

Yes
DBB is out of order.
Change the board.
Check the contact
State of speaker. Is it OK?

No

Replace speaker

Yes

No Trouble

- 63 -

No

Resolder the U203

and R217.
Otherwise change it.

4. TROUBLE SHOOTING

U203
R217
C223,C222
C229
C230
C206

Figure 4-22

U202

2V8_VMEM

R208
0
13MHZ
MIDI_RST
ADD00
RD
MIDI_CS

R211

1
4

CLK1
_RST
30
A0
31
_RD
29
5 _CS
NC
28
3

WR
MIDI_IRQ

27
26
25
24
23
22
21
20

DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
C220

R228

1000p

3.3K

C227
0.1u

HPOUT_R

11
10

EQ1

12

EQ2

13

_WR
_IRQ
D0
D1
D2
D3
D4
D5
D6
D7

C215
0.01u

R212
33K

HPOUT_L

R213
82K
EQ3

14

LED
MTR

2
19

U204
YMU762
SPOUT1

SPOUT2

PLLC

VREF

32

IOVDD

VDD

VSS

C216
390p

17

3V3_VMIDI

SPVSS

SPK+

SPK-

SPK-

18

SPVDD 15

C230
0.1u

SPK+

C222

C223

47p

47p

Figure 4-23

C229
0.1u

16

Circuit Diagram 4-15

2V8_VMEM

U203
C217

SPK+

NLAS4684MR2

10
V+

NO2

39p
2

9
NO1

COM2

REC_SPK-

C218

SPK-

8
COM1

47p

IN2

REC_SPK+

7
IN1

NC2

NC1

GND

C224

R215

REC_P
12

10p

C226
C228
10p

SP201 SP202
VA202

10p
SPK_SEL

R216
REC_N
12

C225
10p VA201

C231

R217

10p

100K

Circuit Diagram 4-16

- 64 -

AVL14K02200
AVL14K02200

CN210
1
2

4. TROUBLE SHOOTING

4.9 MIC Trouble

2V55_VAN

R601
1K

R601
R615
C603
C602

C600
R603
C601

C600
10u

R603

C601

2K

VA600
AVL5M02-200

39p
MIC_P
C602

MIC

2
1

39p
MIC

MIC_N
R615
3.6K

VA600

VA601

C603
39p

VA601
AVL5M02-200

Circuit Diagram 4-17

Figure 4-24

START
Yes
Check the C600
voltage is almost is
2.2(DC)

No

Check the
voltage at Pin23
of U202 is 2.55V
DC

No

Replace the
U202

Yes
Yes

Check the C601 voltage

almost 1.9V, C603
voltage a few hundred
mV

Resoldering
R601

No

Check the
soldering R603

Yes

Yes
MIC Working

Replace the MIC

- 65 -

No

Resoldering
R603

4. TROUBLE SHOOTING

4.10 Vibrator Trouble

SETTING: Enter The engineering mode, and set Vibrator on at Vibration of BB test menu

START

No

Check the
nodes of vibrator
Vibrator contack check !
Yes

Replace virator

When the vibrator works, the

signal at this point goes to 2.8V
Resolder R108

Is the
Voltage at pin 3 of U103
near 0 V ?

No

Check the soldering

of R108

No

Yes

Yes

Replace U103
Check the soldering
of R107

No

Yes

Vibrator Working

- 66 -

Resolder R107

4. TROUBLE SHOOTING

R108
R107

U103
Contact Point
C117
L101

Figure 4-25
USC0
USC1
USC2
USC3
USC4
USC5
USC6

VBAT

C117
2.2u

U103
MDC3105LT1

1
L101 100nH
2
TP120

CN104

R107
4.7

VIN

R108
1.5K

VOUT
GND

MON_RX
INDLED_G1
MON_TX
CHRDET
SLIDE
MIDI_IRQ
SPK_SEL
JACK_DET

- 67 -

C14
D12
A14
A13
E11
C12
B13
D11
D10
B12
C11
D9
B11
A11
C10
D8
A10

USC0
USC1
USC2
USC3
USC4
USC5
USC6
GPIO_0
GPIO_1
GPIO_2
GPIO_3
GPIO_4
GPIO_5
GPIO_6
GPIO_7
GPIO_8

U101
AD6525ACA-REEL

Circuit Diagram 4-18

4. TROUBLE SHOOTING

4.11 Key Backlight LED Trouble

SETTING: Connect PIF to the phone, and power on. Enter engineering mode, and set
Backlight on at BB test-Backlight menu
START
PIF Power On

Is the
Voltage at pin 5 at Q202
about 1.3 V ?

No

Check the soldering

R230,R233

Yes

No
Are all LEDs LD600-LD609
Working?

Check the soldering and

replace LEDs not working

Yes
Replace Q202, and try
again

Key backlight LED

LD609, R613
LD604, R608
LD608, R612
LD603, R607
LD607, R611
LD602, R606
LD606, R610
LD600, R604
Q202
LD605, R609
LD601, R605

- 68 -

Figure 4-26

4. TROUBLE SHOOTING

4.12 SIM Detect Trouble

Setting: Insert the SIM into J301. Connect PIF to the phone, and power on.

START

Does the SIM

supports 3V ?

No

Change the SIM. Our phone not supports 5V SIM

Yes
Voltage at Pin 1 of
J100 = 2.85V?

No

Voltage at Pin 18 of
U202 = 2.85V?

Replace U202

Yes

Yes
Check the soldering
condition of J100

No

No

Resolder J100

Yes
Check the contact
between J100 and
SIM card

No

Replace J100

Yes

Check the SIM and try

again. Does it work
properly?

No

Does it work properly

after redownloading
S/W?

Yes
The S IM is
malfunc tioned.
Change the SIM

No

Change the main board

Yes
SIM will be detected

PIN 4

Figure 4-27

PIN 1

- 69 -

4. TROUBLE SHOOTING

4.13 Ear Jack Trouble

SETTING :After Initialize SS, Test in EGSM, DCS Mode

START

Insert the earphone to the phone.

Does the audio

profile of the phone change to
the earphone mode?

No

Set the audio part of the test

equipment to echo mode.

Yes

Voltage
at Pin4 of U207
Is higher than pin3.
Right?

No

Yes

Yes

Can you hear your voice

from the earphone?

Voltage
at Pin1 of U207
= 2.8V?

Yes

Change the main board

No

No

Resolder or replace U207.

Change the earphone

and try again.

Can you hear your voice

from the earphone?
No
Yes

Change Earphone.
EARPHONE WILL
WORK PROPERLY.

Set the audio part of the test

equipment to PRBS or
continuous wave mode.

Can you hear the sound

from the earphone?

Yes
3

- 70 -

No

Resolder
R223,
R220,
J201

4. TROUBLE SHOOTING

No

Is the signal level at R224

a few tens or hundreds VAC?

Redownload software.

Yes
Does it work well?
Resolder R224 and J201.
No

Yes
1

Change the main board.

Voltage at Pin 4 of U205

= 1.5~1.9 VDC ?

No

Resolder
R226, C240

Yes
Is the signal level
across C122
a few tens or
hundreds VAC ?

No

Resolder C122

Yes
Resolder C232.
Yes
Does it work well?

No

Redownload software.

Does it work well?

No
Yes

Yes
1

- 71 -

Change
the main board.

4. TROUBLE SHOOTING

R224

J201

R220

R226

U207
U205
R223

U208

C240

C232

R223

Figure 4-28
2V5_JACK

R218
C232

2V8_VMEM

2V8_VMEM

2.2K

R219 20K

HEADSET_MIC_N
0.1u

C250

R229
20K

C234
0.1u
C236

C235
39p

33u

R221

R222

3.3K

1M

C233
39p
5

VIN- 4

HEADSET_MIC_P
0.1u

VIN+

HEADSET_SPK_P

JACK_DET

OUT

(1608)
C251

R223
1M

GND

OUT

10u

VIN- 4

C240
47p

R220

HOOK_DET

2
U205
MAX9075EXK-T

5
1
3
4
2

R224
4.7
R226
4.7

VCC
GND VIN+ 3

2
U207
MAX9075EXK-T

R214
330K

2V8_VMEM 2V8_VMEM

C237
39p

VCC

C239

C260
NA

620K

47p

J201

VA203 VA204
Headset jack

R227
1M

AVL14K02200
AVL14K02200
SP203 SP204 SP205

U102
AD6521

AFCDAC
RAMPDAC
REFCAP
REFOUT
AUXADC1
AUXADC2
AUXADC3
AUXADC4

A10
H9

TX_RAMP

A8
A7
A6
A5
B5
A4

Circuit Diagram 4-19

2V8_VMEM

AFC

R103
120K
COMPASS_OUT
BAT_TEMP

R105 1K
BOARD_TEMP
MON_VBAT

C112 C113
39p

0.1u

C115 C111

C114
10p

39p

1u
(1608)

C116

R106
82K

39p

CLOSE TO AD6521
VINAUXP
VINAUXN
VINNORP
VINNORN

H10
G10
J10
K10
C122 C123 C124
39p

NC1
NC2
NC3
NC4

39p

39p

C120

100

39p

R111

C125

100

C121

0.1u

MIC_N

39p

J6

CLOSE TO AD6521
K8
K7
K9
K6

REC_P
REC_N
HEADSET_SPK_P
C126
C129 C130
39p

Circuit Diagram 4-20

39p

0.1u

J9
B9
B6
B7

A2 DGND1
J5 DGND2

B3
J7
B8
G9

AGND4
AGND3
AGND2
AGND1

BUZZER

VOUTNORP
VOUTNORN
VOUTAUXP
VOUTAUXN

HEADSET_MIC_P
HEADSET_MIC_N
MIC_P

R109

- 72 -

4. TROUBLE SHOOTING

4.14 Compass Trouble

Remove magnetic and electronic equipment for example Speaker,Monitor etc Before You test.

- 73 -

4. TROUBLE SHOOTING

R365
(COMPASS_XYIN)

C358

COMPASS(U304)
C357(COMPASS_OUT)
R364
R500
R363

COMPASS_CS

COMPASS_XYIN
R361(COMPASS_CS)

COMPASS_OUT

Figure 4-29

2V8_VMEM

U304
1

R361

COMPASS_CS
C355 1K
27p

C356
27p

GND1 GND2
CS

OUT

VDD

XYIN

6
5

R363

R364

1K
(1%)

1K
R500 (1%)
3.9K
(1%)

COMPASS_OUT

AMI201
C358
10u

C357
0.1u

R365
COMPASS_XYIN
C359 1K
27p

C360
27p

Circuit Diagram 4-21

- 74 -

4. TROUBLE SHOOTING

Compass Engineer Mode

3. Display Angle

ENG.Mode
1
2
3
4
5
6

ENG.Mode
1
2
3
4
5
6

BB Test
RF Test
MF Mode
Trace Optio
Call timer
Fact.reset

Select

Back

Kev pad
MicSpk Test
Compass
All auto test
LED
Backlight

Select

Back

ENG.Mode
1
2
3
4
5

Use cal.sta
Fact.cal.st
Display Ang
Cal.value1
Cal.value2

Select

Test
Deg=256
|H|=260

Back

Back
4. Cal.Value1

ENG.Mode
1
2
3
4
5
6

ENG.Mode
1
2
3
4
5
6

BB Test
RF Test
MF Mode
Trace Optio
Call timer
Fact.reset

Select

Back

Kev pad
MicSpk Test
Compass
All auto test
LED
Backlight

Select

Back

ENG.Mode
1
2
3
4
5

Use cal.sta
Fact.cal.st
Display Ang
Cal.value1
Cal.value2

Select

Test
OffsetX=869
OffsetY=812
Back

Back

4. Cal.Value2

ENG.Mode
1
2
3
4
5
6

ENG.Mode
1
2
3
4
5
6

BB Test
RF Test
MF Mode
Trace Optio
Call timer
Fact.reset

Select

Back

Kev pad
MicSpk Test
Compass
All auto test
LED
Backlight

Select

Back

ENG.Mode
1
2
3
4
5

Use cal.sta
Fact.cal.st
Display Ang
Cal.value1
Cal.value2

Select

Test
GainX=218
GainY=215
CalRatio=0

Back

Back

Offset or Gain MUST NOT BE ZERO.

Write Compass Defult Cal Data, when
These are Zero

Compass Engineer Mode Description

No

Menu

Description

User.Cal.start

User Calibration.

Fact.cal.start

Factory Calibration

Display Angle

Magnetic Sensor Active

Cal.value1

Calibration Value(X,Y Offset)

Cal.value2

Calibration Value(X,Y Gain/Calibration

Ratio

- 75 -

Blank

5. DISASSEMBLY INSTRUCTION

5. DISASSEMBLY INSTRUCTION
5.1 Disassembly

- 76 -

5. DISASSEMBLY INSTRUCTION

- 77 -

5. DISASSEMBLY INSTRUCTION

- 78 -

5. DISASSEMBLY INSTRUCTION

- 79 -

6. DOWNLOAD AND CALIBRATION

6. DOWNLOAD AND CALIBRATION

6.1 Download
A. Download Setup
Figure 6-1 describes Download setup.

UART

Figure 6-1. Download Setup

- 80 -

6. DOWNLOAD AND CALIBRATION

B. Download Procedure
1. Access Flash loader program in PC and select Erase.(Dont check OWCD)

1. Select Erase

2. Check

3. Dont Check
OWCD

2. Press Start and Wait until Erase is completed.(Code ?? erase)

1. Press
Start and
Wait

- 81 -

6. DOWNLOAD AND CALIBRATION

3. Change Address and Size(Address : 18000000, Size : 0x800000), and Press Start and Wait until
Erase is completed again (Alchemy 8W8Cerase)

1. Select File

2. Press Open

4. Press Write to start Download and press

2. Wait until completion

Key to choose software (AlchemyData.mot)

1. Dont Check OWCD

- 82 -

6. DOWNLOAD AND CALIBRATION

5. Choose software
1. Select File

2. Press Open

6. Wait until converting from MOT to BIF is completed(Dont check OWCD)

2. Wait until completion

1. Dont Check OWCD

- 83 -

6. DOWNLOAD AND CALIBRATION

7. Press Start and Power on the phone using JIG remote Power on(Switch 1)

8. Wait until Sending Block is completed

- 84 -

6. DOWNLOAD AND CALIBRATION

9. Press Write to start Download and press

Key to choose software(CodeData.mot)

10. Choose software

- 85 -

6. DOWNLOAD AND CALIBRATION

11. Wait until Sending Block is completed

1. Wait Until
Sending Block
is completed

- 86 -

6. DOWNLOAD AND CALIBRATION

6.2 Calibration
A. Equipment List
Table 6-1. Calibration Equipment List
Equipment for Calibration

Type / Model

Brand

Wireless Communication Test Set

HP-8960

Agilent

RS-232 Cable and Test JIG

LG

RF Cable

LG

Power Supply

HP-66311B

Agilent

GPIB interface card

HP-GPIB

Agilent

Calibration & Final test software

LG

Test SIM Card

PC (for Software Installation)

Pentium II class above 300MHz

B. Equipment Setup

Figure 6-2.

- 87 -

6. DOWNLOAD AND CALIBRATION

Figure 6-3. The top view of Test JIG

C. Test Jig Operation

Table 6-2. Calibration Equipment List
Power Source

Description

Power Supply

usually 4.0V

Travel Adaptor

Use TA, name is TA-20G(24pin)

Table 6-3. Calibration Equipment List

Switch Number

Name

Description

Switch 1

ADI-REMOTE

In ON state, phone is awaked. It is used ADI chipset.

Switch 2

TI-REMOTE

In ON state, phone is awaked. It is used TI chipset.

Switch 3

VBAT

Power is provided for phone from battery

Switch 4

PS

Power is provided for phone from Power supply

Table 6-4. Calibration Equipment List

LED Number

Name

Description

LED 1

Power

Power is provided for Test Jig.

LED 2

TA

Indicate charging state of the phone battery

LED 3

UART

Indicate data transfer state through the UART port

LED 4

MON

Indicate data transfer state through the MON port

- 88 -

6. DOWNLOAD AND CALIBRATION

1. Connect as Fig 6-2(RS232 serial cable is connected between COM port of PC and MON port of
TEST JIG, in general)
2. Set the Power Supply 4.0V
3. Set the 3 rd , 4 th of DIP SW ON state always
4. Press the Phone power key, if the Remote ON is used, 1 st ON state

D. Procedure
1. Connect as Fig 6-2(RS232 serial cable is connected between COM port of PC and MON port of
TEST JIG, in general)
2. Power ON PC then enter into Windows 98(Remark : Windows 2000 system could be feasible)
3. Run AUTOCAL.exe, the AUTOCAL application window will be appeared.

- 89 -

7. BLOCK DIAGRAM

7. BLOCK DIAGRAM

USC(0:5)
MON_TX
MON_RX

VCHARGE

INDLED_R1

VCHARGE

VCHARGE

1
INDLED_R2

DATAIO

EN/RST/CLK

SLIDE
KEY_BL
ROW/COL

MIC

RST/CS/BL/WR

DATA(0:7)

MOTOR
DRIVER

INDLED_G2

Analog
S/W2

INDLED_G

Analog
S/W1

IO
Connector

INDICATOR
LED1
INDICATOR
LED2
VIBATOR

LCD
Connector
KEY
Connector
SIM
Connector

VSIM
VRTC

DBB
(AD6525)

VCORE VMEN

RST/CHRDET/EOC

32KHz

VTCXO
VSIM

VCORE
VMEM

GATE_EN/CHG_EN
OCS
OUT
OCS
IN

CS/
XY

Compass
(AMI201)

OUT

DATA(8:15)

PMIC
(ADP3522)

VAN

ABB
(AD6521)

ADD(0:22)

MIDI
(YMU762)

HEADSET_MIC
HEADSET_SPK

BASEBAND SERIAL PORT

VOICEBAND SERIAL PORT
AUXILIARY SERIAL PORT
MIC
SPK_SEL

LDO

JACK_DET/HOOK_DET
VMIDI
MIDI_
PWR

VBAT

DATA(0:16)

power signal
Audio Signal
Control Signal
ETC(ADDRESS,DATA,RF...)

GATE
_DR

Memory
(F128M/
S32M)

RF

Battery
(820mAh)

VCHARGE

VTCXO

VBAT
BACKUP BATT

FET

VRTC

SPK_SEL

Analog
S/W

TXIQ
RXIQ

TEMP/MVBAT

REC

SPK

WR/RD/RAM_CS/ROM_CS/LBS/UBS/

Power supply

- 90 -

8. CIRCUIT DIAGRAM

10

2V8_VMEM 2V0_VRTC
2V8_VMEM
1V8_VCORE

2V8_VMEM
C101 47n

KDS121E
PWR_HOLD

RPWRON
R102

3
1

100K

CLK_ON

D101
13MHZ
C109
NA

X101

MC-146

3
2

VBAT

C117
2.2u

R104
10M

4
1

U103
MDC3105LT1
L101 100nH

R107
4.7

TP120

VIN

GND

R108
1.5K

VOUT

USC0
USC1
USC2
USC3
USC4
USC5
USC6

C110
NA

32.768KHz

RESET

CN104

MON_RX
INDLED_G1
MON_TX
CHRDET
SLIDE
MIDI_IRQ
SPK_SEL
JACK_DET
LCD_ID
HOOK_DET
LCD_RST
COMPASS_CS
COMPASS_XYIN
CHG_EN
EOC
MIDI_RST
MIDI_PWR_EN
MIDI_CS
ROM_CS2

M14
M13
P14
P13
N12
M11

SW102

USC0
USC1
USC2
USC3
USC4
USC5
USC6

BSDO
BSOFS
BSDI
BSIFS
VSDI
VSDO
VSFS

U101
AD6525ACA-REEL

GPIO_0
GPIO_1
GPIO_2
GPIO_3
GPIO_4
GPIO_5
GPIO_6
GPIO_7
GPIO_8
GPIO_9
GPIO_10
GPIO_11
GPIO_12
GPIO_13
GPIO_14
GPIO_15
GPIO_16
GPIO_17

GPO_2
GPO_3
GPO_4
GPO_7
GPO_8
GPO_9
GPO_10
GPO_11
GPO_16
GPO_17
GPO_18
GPO_19
GPO_20
GPO_21
DISPLAYCS

VOL_UP

2 3

VR101

4
5

VR103

R118
KEY_COL1

4
680
VR102

2 3 5

R119

680

R120

680

TCK

J2
K2
K1
J3
K3
J1
H1
H2
G2
F2
F1
E2
D1
E1
D2

J14
L10
K13
K12
J13

KEY_ROW0
KEY_COL0

C4
E4
B4
A4
C3

KEYPADCOL0
KEYPADCOL1
KEYPADCOL2
KEYPADCOL3
KEYPADCOL4

MCLK
MCLKEN
RESET
ARSM
ATSM
ASDO
ASDI
ASFS

A1
G1
K5
DVDD1
DVDD2
DVDD3

REFCAP
REFOUT
AUXADC1
AUXADC2
AUXADC3
AUXADC4

BSDI
BSIFS
BSDO
BSOFS
VSDO
VSDI
VSFS

F9
E9
C9
D9
E10
D10
C10
B10

TXIP
TXIN
TXQN
TXQP
RXIP
RXIN
RXQP
RXQN

A10
H9

2V8_VMEM

AFC
TX_RAMP

A8
A7
A6
A5
B5
A4

R103
120K
COMPASS_OUT
BAT_TEMP

R105 1K
BOARD_TEMP
C112 C113
MON_VBAT
39p

0.1u

C115 C111

C114
10p

39p

1u
(1608)

R106
82K

C116
39p

CLOSE TO AD6521
VINAUXP
VINAUXN
VINNORP
VINNORN

H10
G10
J10
K10

39p 39p 39p

BUZZER

VOUTNORP
VOUTNORN
VOUTAUXP
VOUTAUXN

HEADSET_MIC_P
HEADSET_MIC_N
MIC_P

R109

C122 C123 C124

LCD_CS

C120

100

39p

R111

C125

100

C121

0.1u

MIC_N

39p

J6

CLOSE TO AD6521
K8
K7
K9
K6

REC_P
REC_N
HEADSET_SPK_P
C126
C129 C130

39p

39p 0.1u
VBAT

VSIM
VSIM

INDLED_G2
SIM_RST
SIM_EN
SIM_CLK

SP102

AFCDAC
RAMPDAC

U102
AD6521

B4
IDACOUT
A3
IDACREF

PWR_HOLD
DIM_CNTL
RF_EN
INDLED_R1
INDLED_R2
ANT_SW1
GATE_EN
ANT_SW2
PA_EN
PA_BAND
RF_PWR_DWN
S_EN
S_DATA
S_CLK

LCD_BL
KEY_BL

BB
ITXP
ITXN
QTXN
QTXP
IRXP
IRXN
QRXP
QRXN

J4
RXON
K4
TXON

R114
220K

VSIM

J100

R117
20K

4
5
6
10
9

C136
KEY_COL0
KEY_COL1
KEY_COL2
KEY_COL3
KEY_COL4

B2
TDI
B1
TDO
C2
TMS
C1
TCK

TDO_0

F3
G4
G2
G1
G3
H3
H2

M5

47n

GND1
VPP
IO
GND5
GND4

VCC
RST
CLK
GND2
GND3

R115 100

1
2
3
7
8

NA

MON_VBAT

SIM_RST
SIM_CLK
C137
1000p

C133
220n

SP104

SP101

SP103

R116
C134
0.01u

C135
0.01u

220K

C138
NA

SP105

J1
K1
P3
L6
L8
P12
L11
C13
A12
D7
B6
D3

GPIO_22
GPIO_23
GPIO_24
SIMCLK
SIMDATAOP

KEYPADROW0
KEYPADROW1
KEYPADROW2
KEYPADROW3
KEYPADROW4

TMS

D1
D2
E1
A1
C1
E2
F1
F2

A7
GPO_22
C5
GPO_23

L13
GPCS1
M12
GPCS0
A6
F4
D4
B5
A5

TDO_1
TDI

G13
G12
H12TP118
F14
F13
H11
F12
E14
E13
G11
E12
D14
D13
F11

C108

100K

47n

JTAGEN

GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
VSSRTC

VOL_DOWN

KEY_ROW0
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_ROW4

A2

E3
VPEG1

CLKOUT
CLKOUT_GATE
GPO_24
GPO_5
GPO_6
ASDI
ASDO
ASFS

D
SW101

K11

B1
GPO_0
C2
GPO_1

L12
CLKIN
B3
OSCOUT
A3
OSCIN
N14
RESET

D11
D10
B12
C11
D9
B11
A11
C10
D8
A10
C9
C7
B9
A9
B8
A8
D6
B7

VDDRTC

B14
B10
C6
D5

L2
N5
N9
N13

L9

RAMCS
ROMCS
WE
LWR
HWR
RD

R101
C107

C180
10u

DSR

J11
GPIO_21
J12
GPIO_20
H13
GPIO_19
H14
GPIO_18

B2
PWRON
G14
CLKON

C14
D12
A14
A13
E11
C12
B13

L14

2V55_VAN 1V8_VCORE 2V8_VMEM

NC1
NC2
NC3
NC4

RAM_CS
ROM_CS1
WR
LBS
UBS
RD

JTAGEN

DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15

DGND1
DGND2

GPIO_32

N6
P6
M6
N7
M7
L7
P8
N8
M8
P9
M9
P10
N10
M10
P11
N11

J9
B9
B6
B7

RD
UBS
LBS
ROM_CS1
RAM_CS
CLK_ON
ROM_CS2

AA
DATA0
DATA1
DATA2
DATA3
DATA4
DATA5
DATA6
DATA7
DATA8
DATA9
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15

A2
J5

TP111
TP112
TP113
TP114
TP115
TP116
TP117

ADD0
ADD1
ADD2
ADD3
ADD4
ADD5
ADD6
ADD7
ADD8
ADD9
ADD10
ADD11
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21
ADD22

F10
A9
J8

TDI
GND

H4
J3
J2
J4
K3
K2
K4
L4
L1
L3
L5
M1
M2
N1
P1
N2
P2
N3
M3
P4
N4
M4
P5

AVDD1
AVDD2
AVDD3

VBAT
JTAGEN

ADD00
ADD01
ADD02
ADD03
ADD04
ADD05
ADD06
ADD07
ADD08
ADD09
ADD10
ADD11
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21
ADD22

VEXT1
VEXT2
VEXT3
VEXT4

TDO_1
RPWON

WR
TDO_0
TCK
TMS
TDO_1
RPWRON
VBAT
TDI
JTAGEN

VSIM

TMS

TP101
TP102
TP103
TP104
TP105
TP106
TP107
TP108
TP109
TP110

VMEM1
VMEM2
VMEM3
VMEM4

TCK

H1
P7
K14
C8

TDO_0

47n

VCC1
VCC2
VCC3
VCC4

_F_WE

C104
47n

47n
47n

JTAG1

C102 47n C103

C106

AGND4
AGND3
AGND2
AGND1

C105

B3
J7
B8
G9

JTAG PORT

VR104

Section

Date

Designer

05/21
2004

LEE S.Y.

Checked

05/21
2004

KIM B.Y.
YOUN K.J.

Approved

05/21
2004

CHO J.G.

Sheet/
Sheets

Sign & Name

MODEL

F7100
SPFY0068901

1/4

GUIDE HOLE
OJ1

OJ2

OJ3

OJ4

Iss.
1

Notice No.

Date

Name

LG Electronics Inc.

DRAWING
NAME

MAIN

DRAWING
NO.

V1.1

LGIC(42)-A-5505-10:01

LG Electronics Inc.

- 91 -

8. CIRCUIT DIAGRAM

10

2V8_VMEM
VBAT

10K

U201
TH50VPF5783AASB
J9
VSS0
G3
VSS1
_CEF1
_CEF2
_OE
A1
_WE
NC0
A10
NC1
_BYTE
B1
NC2
B10
NC3
C1
RY_BY
NC4
F1
NC5
_WP_ACC
F6
NC6
_RESET
F9
NC7
F10
NC8
G1
NC9
G6
NC10
_LB
G10
_UB
NC11
L1
_CE1PS
NC12
L10
CE2PS
NC13
M1
NC14
DU1
M10
NC15
DU2

CLK_ON
SIM_EN

C202

C203
0.1u

1000p

9
10
12
6
14
4
7
13

R203
0.33

VBAT
Q201
S

D4

D3

D5

D2

D6

D1

D201

CUS02

4
3
2

ROM_CS2
ROM_CS1
RD
WR

2
VAN

33

GND

GATE_EN

GATE_EN

18
2V55_VAN
21
2V75_VTCXO
23
2V8_VMEM
2V0_VRTC

25

VMEM
VRTC
REFOUT
_RESET
MVBAT

CHG_EN

TP204

VTCXO

GATEDR
GATEIN
ISENSE
CHRDET
CHGEN
BATSNS
CHRIN
EOC

CHRDET

TP203

1V8_VCORE

VSIM

TCXOEN
1
SIMEN
15
RESCAP
8
SIMVSEL

C253
10u
(1608)

VSIM

VCORE

28

VCHARGE

TPCF8102
H2
F5
H3
C6
H9

19

30
_PWRONKEY
31 ROWX
29
PWRONIN

POWERKEY
KEY_ROW0
RPWRON

10u
C252
(2012)

VRTCIN

VBAT

R202
100K

AGND

C204
0.1u

ADD01
ADD02
ADD03
ADD04
ADD05
ADD06
ADD07
ADD08
ADD09
ADD10
ADD11
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21
ADD22

NC1
NC2
NC3

20
3
26
R204 100

16

RESET
C205
0.1u

C206
100p

C208
0.22u

C211
2.2u

C209
2.2u

(1608)

(1608)

(1608)

17
24
32

C213
0.1u

C212 C210
0.22u 2.2u

C207
100p

C214
0.1u

(1608) (1608)
R205
10K

27

J5
VCCF1
G5
VCCF2
J6
VCCPS

22

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21

VBAT

DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15

VBAT2

DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15

C201
0.1u

VCHARGE

G2
F2
E2
D2
F3
E3
D3
C3
C7
E7
F7
C8
D8
E8
F8
D9
G9
F4
E4
D7
E6
E9

EOC

TP202

11

J3
G4
K4
H5
H6
K7
G7
J8
K3
H4
J4
K5
J7
H7
K8
H8

TP201

2V8_VMEM

R201

DGND

2V8_VMEM

U202
ADP3522XCP-3

CHRDET

BAT1

CHG_EN
E5
C5
D5

EOC
RESET

C4
D4
J2
D6
K6 R207
G8 R210

R209
2V8_VMEM
R206
10K

LBS
UBS
RAM_CS

KEY_BL1

100K

KEY_BL2
2V8_VMEM
Q202 IMX9T110

SP206

NA
NA

R230
KEY_BL

2V8_VMEM

1.5K
R233

R231 R232
20
20

100K
R208
0

3V3_VMIDI

C
VBAT

U206 LP3981ILD-3.3
6
VOUT
VEN

2
C219
2.2u
(1608)

VIN

BYPASS

VOUT_SE GND1
GND2

C238
10u

2V8_VMEM

GND

NC

Vin VOUT

C221
0.1u

C220

2V5_JACK

C227
0.1u

R218
C232

2V8_VMEM

2V8_VMEM

C234
0.1u
C236

R229
20K

C250
C235
39p

33u

R221

R222

3.3K

1M

VIN+

JACK_DET

OUT

(1608)
C251

R223
1M

10u

VCC
GND VIN+ 3

2
U207
MAX9075EXK-T

VCC

GND

C240
47p

R220
620K

EQ3

14

D0
D1
D2
D3
D4
D5
D6
D7

LED
MTR

2
19

R213
82K

PLLC

VREF

32

IOVDD

VDD

VSS

2V8_VMEM

U203
C217

SPOUT1

SPK+

17

2
NO1

COM2
8

COM1

SPOUT2

SPK-

16

C223

47p

47p

R215

5
NC1

12

GND

10p

C226
C228
10p

C225
10p VA201

SP201 SP202
VA202

10p
SPK_SEL

R216
REC_N
12

CN210
1

NC2

C224

REC_P

C229
0.1u

REC_SPK+

7
IN1

C222

47p

IN2

18
3V3_VMIDI

SPVSS

REC_SPK-

C218
3

OUT

C231

R217

10p

100K

AVL14K02200
AVL14K02200

HOOK_DET

U205
MAX9075EXK-T

5
1
3
4
2

R224
4.7
R226
4.7
C260
NA

C239
47p

J201

Section

Date

Designer

05/21
2004

LEE S.Y.

Checked

05/21
2004

KIM B.Y.
YOUN K.J.

Approved

05/21
2004

CHO J.G.

VA203 VA204
Headset jack

R227
1M

SP203 SP204 SP205

Iss.
2

10
NO2

39p

AVL14K02200
AVL14K02200

NLAS4684MR2

1
V+

U204
YMU762

C216
390p

R214
330K

VIN- 4

13

VIN- 4

0.1u

12

EQ2

C215
0.01u

R212
33K

39p

HEADSET_MIC_P

C237
39p

EQ1

SP207

20

C233

HEADSET_SPK_P
2V8_VMEM 2V8_VMEM

HPOUT_L

R235

20

11
10

SPVDD 15

C230
0.1u

2.2K

R219 20K

HEADSET_MIC_N
0.1u

3.3K

HPOUT_R

_WR
_IRQ

R228

1000p
C255
1uF

CLK1
_RST
30
A0
31
_RD
29
5 _CS
NC

27
26
25
24
23
22
21
20

DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15

R234
1
4

28
3

WR
MIDI_IRQ

NCP563Q25T1
C254
1uF

2V5_JACK

U208
1

MIDI_PWR_EN

R211

13MHZ
MIDI_RST
ADD00
RD
MIDI_CS

Notice No.

Date

Name

Sign & Name

MODEL

LG Electronics Inc.

F7100

Sheet/
Sheets

2/4

DRAWING
NAME

DRAWING
NO.

Audio,Memory,Power

V1.1

LGIC(42)-A-5505-10:01

LG Electronics Inc.

- 92 -

8. CIRCUIT DIAGRAM

10

VBAT

VBAT

INDICATOR LED

TP301

C352

<- TO KEYPAD

1uF

CN310

VBAT

KEY_COL2
KEY_COL1
KEY_COL0
KEY_BL1

24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1

KEY_COL4
KEY_COL3
KEY_ROW4
KEY_ROW3
KEY_ROW2
KEY_ROW1
KEY_ROW0
SLIDE
POWERKEY
KEY_BL2

VA305

C304 C305

VA301 VA302 VA303 VA304

1u

1u

VA310
VA312
VA308
VA306
VA309
VA313
VA311
VA307

C306
1u

VCHARGE

28

R301
100K

27 26

CN302
MIC_N
MIC_P

I/O CONNECTOR

R306

47

R307

47

R308
R355

47
47

R302
100K

R303
100K

USC4

R311
R312
R313

47
47
47

R314

47

R315

47

R316

0.1u

USC6
USC3

0.1u

VCC

6 NO
R326

COM 5
4
C311
0.1u

NC

R339
4.7K

10K

GND
3

R331
47K

IN
1

IMX9T110 Q301

RPWRON
R351
100

RPWRON

DSR

VCHARGE

C312
27p

R352
270

39p
29

R370
10K

C370
0.1u

VBAT

C307

25

INDLED_G1
10K

VBAT
R350

47

R327

R332
47K

Q302
MAX4599EXT-T

MON_RX
USC0

47

R317

R324
10K

INDLED_R1

MON_TX
USC2
USC1

SP302 SP303

C310

C309
USC5

SML-521MUWT86
LED301

VBAT

VCHARGE

R304
100K

C371
0.1u

SP305

0
C354
1uF
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16

C308
27p

R319
270
3

R305
BAT_TEMP

2V55_VAN

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

R318
100

2V8_VMEM

2V8_VMEM

C353

47p

SP301

BOARD CONNECTOR

VCC

SML-521MUWT86
LED302

SP306

6 NO

INDLED_R2

COM

R371
10K

GND

R353
INDLED_G2

IN

C372
0.1u

NC

4
R372
4.7K

Q304
MAX4599EXT-T

R373
47K

10K
R354
47K

IMX9T110 Q303

128 x 160 LCD CONNECTOR

R374

2V8_VMEM

RPWRON
0

VBAT

CN303
LCD_BL
LCD_CS
ADD01
DATA00
DATA02
DATA04
DATA06
DATA08
DATA10
DATA12
DATA14

R328
R329
R333
R335
R337
R340
R342
R344
R346
R348

1
2
3
4
5
6
7
8
9
10
11
12
13

1K
1K
1K
1K
1K
1K
1K
1K
1K
1K

DIM_CNTL
C313

C314

C315

27p

27p

27p

C316

C317

C318

C319

C320

C321

C322

C323

C324

C325

C326

C327

C328

C329

C330

C331

C332

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

26
25
24
23
22
21
20
19
18
17
16
15
14

R330
R334
R336
R338
R341
R343
R345
R347
R349

LCD_RST
WR
DATA01
DATA03
DATA05
DATA07
DATA09
DATA11
DATA13
DATA15

1K
1K
1K
1K
1K
1K
1K
1K
1K

LCD_ID

C333
27p

C334

C335

C336

C337

C338

C339

C340

C341

C342

C343

C344

C345

C346

C347

C348

C349

C350

C351

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

27p

SP304

AICHI STEEL COMPASS

2V8_VMEM

U304
1

R361

COMPASS_CS
C355 1K
27p

C356
27p

GND1 GND2
CS

OUT

VDD

XYIN

6
5

R363

R364

1K
(1%)

1K
R500 (1%)
3.9K
(1%)

AMI201
C358
10u

Section

Date

Sign & Name

Designer

05/21
2004

LEE S.Y.

05/21

KIM B.Y.

2004

YOUN K.J.

05/21
2004

CHO J.G.

COMPASS_OUT
C357
0.1u

R365

Checked

COMPASS_XYIN
C359 1K
27p

C360
27p

Approved

Iss.
1

Notice No.

Date

Name

MODEL

LG Electronics Inc.

DRAWING
NAME

DRAWING
NO.

F7100

Sheet/
Sheets

3/4

I/O conn,LCD conn

V1.1

LGIC(42)-A-5505-10:01

LG Electronics Inc.

- 93 -

8. CIRCUIT DIAGRAM

ANT3

ANT2

ANT1

TP401

C460
0

C401

RF_PWR_DWN

TP402

C461
NA

S_EN

TP403

1.5p

S_CLK

TP404

R401

5p

S_DATA

VBAT
Closed to Pin 4

C402
GND1

NA

GND2

GND4

GND3

C403

G1

C404

C405

18p

47p

C406
22p

15K

R403

100

R404

100

TX_RAMP AD6535_PA
PA_EN

GPO_16

PA_BAND GPO_17

22

23

20

24

25

26

21
GND8

GND9

GND10

GND11

GND12

GND13

47

C410

C407

C408

C409

27p

27p

R407
130

39p

33p

GSM_OUT
9

C413

VREG
5

NA
RF3133
U401

VCC_OUT
10

5
EGSM_TX
3
DCS_TX

R406
130

VRAMP

3.9nH

C412
0.5p

R405

GSM_IN

L401
FL401

GND14

VCC1

22p

VBATT

TX_ENABLE

BAND_SELECT

GND2

C414

DCS_OUT

GND1

RF2.85V
R309

DCS_IN

R408
150

13

14

GND3

GND7

GND4
15

VC1
VC2

19

12

GND5

L402
4.7nH

18

10
EGSM_RX
1
DCS_RX

VCC2

GND6

11

7p

16

C416
2p

17

8
ANT
GND1
GND2
GND3
GND4
GND5
GND6
GND7

R402

33u

RF2.85V

C411

36

C417
R409
150

C415

1000p
13MHZ

C418
100p

10p

RXQP
C419

RF2.85V

39p

11 2

RXQN

SHS-C090DR

RXIP

22
23
24
25
26
27
28
29
30
31
32

C420

2p

2 3 FL402
C423

G1 O1

L403

IN
G2 O2

27p

B7820 5 4

22nH

C424
2p
C426
1.5p

2 3 FL403
1

RFIGN
RFIGP
RFIDN
RFIDP
RFIPN
RFIPP
GND1
GND8
GND7
GND6
GND5

G1 O1
IN

L404

G2 O2

U402
SI4205

39p

RXQN
RXIP
RXIN
TXIP
TXIN
TXQP
TXQN

RXIN

1
2
3
4
5
6
7

TXIP
C425

39p
TXIN
TXQP

RF2.85V
C427

39p

6.8nH
TXQN

B7821 5 4
ANT_SW2

RFOD
RFOG
DIAG1
DIAG2
XEN
XOUT
RXQP
GND2
GND3
GND4
VDD2

21
20
19
18
17
16
15
36
35
34
33

SDI
SCLK
_SEN
SDO
_PDN
VDD1
XIN

C422

C421
22n

14
13
12
11
10
9
8

4
6
7
9
12
13
14

C450

SW401
KMS-507

RF

G2

ANT

18p

C428

C429
0.022u

GPO_11

C430
22p

1.5p

C433
27p

C431
100p
2V75_VTCXO
ANT_SW1

GPO_9
X401

R412

C436
10p

ANT_SW1

3
4

DCS_TX

GSM_TX

RX

OUT VCONT

R413

VCC

C437
2.2u
(1608)

GND

AD6535_AFCDAC

AFC

100

ANT_SW2

C434
1000p

15K

13MHz

RF_PWR_DWN GPO_4
S_EN

GPO_19

S_CLK

GPO_21

S_DATA

GPO_20

RF2.85V
VBAT

RF2.85V
U410

R414
10K

5
C438
BOARD_TEMP
0.01u

R499

10u
C456

OUT
BYP

1
IN
2
GND
3
EN

CLK_ON

MIC5255-2.85BM5
10u
C457

Section

Date

Designer

05/21
2004

LEE S.Y.

Checked

05/21
2004

KIM B.Y.
YOUN K.J.

Approved

05/21
2004

CHO J.G.

6.8K
R489

RF BOARD TEMPERATURE

Iss.

Notice No.

- 94 -

Date

Name

Sign & Name

Sheet/

MODEL

LG Electronics Inc.

F7100

DRAWING
NAME

RF

DRAWING
NO.

V1.1

Sheets
4/4

8. CIRCUIT DIAGRAM

KEY
2

LEFT

MENU

R600
KEY_ROW1
1K
SP602

SP601

SP600

END

SP603
UP

SELECT

KEY BACKLIGHT

POWERKEY
VBAT

VBAT

R602
SP604

KEY_ROW2
1K
SP607

SP606

SP605
7

SP608
RIGHT

SEND
R604
20

R614

R605
20

R606
20

R607
20

R609
20

R608
20

R610
20

R611
20

R612
20

R613
20

KEY_ROW3
1K
SP609
STAR

SP611

SP610
SHARP

SP612
DOWN

CONFIRM

LD600 LD601 LD602 LD603 LD604

LD605 LD606 LD607 LD608 LD609

R616
KEY_ROW4
1K
SP614

SP613

SP615

SP616

SP617

KEY_BL1

CLR
KEY_BL2
R617
KEY_ROW0
1K
SP618

R618 1K
KEY_COL0
R620 1K
KEY_COL1
R621 1K
KEY_COL2
R622 1K
KEY_COL3
R623 1K
KEY_COL4

2V55_VAN

Hall Effect Switch

R601
1K

2V8_VMEM
R619 10K

C600
10u

R603

A3212EEH U600
C601

2K

VA600
AVL5M02-200

GND1

39p
MIC_P
C602

MIC

2
1

SLIDE

MIC
R615

CN600
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

MIC_N
MIC_P
KEY_COL2
KEY_COL1
KEY_COL0
KEY_BL1

C608
1u

3.6K
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16

7
4
5
6
C605
1uF

1uF

C603
39p

PGND
GND2
NC2
VDD

C604

39p
MIC_N

2V8_VMEM

NC1
2
OUTPUT
1

VA601
AVL5M02-200

KEY_COL4
KEY_COL3
KEY_ROW4
KEY_ROW3
KEY_ROW2
KEY_ROW1
KEY_ROW0
SLIDE
POWERKEY
KEY_BL2

Section

Date

Designer

04/28
2004

Sign & Name

LEE S.Y.

04/28

KIM B.Y.

2004

YOUN K.J.

C609
1u

Checked

Approved

Iss.

Notice No.

Date

Name

04/28

Sheet/
MODEL

CHO J.G.

DRAWING
NAME

F7100

Sheets

1/1

SPEY0021101
KEYPAD

2004

LG Electronics Inc.

DRAWING
NO.

Ver.1.0
LG Electronics Inc.

- 95 -

9. PCB LAYOUT

- 96 -

9. PCB LAYOUT

- 97 -

Note.

- 98 -

10. ENGINEERING MODE

10. ENGINEERING MODE

A. About Engineering Mode
Engineering mode is designed to allow a service man/engineer to view and test the basic functions
provided by a handset.

B. Access Codes
The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to
non-engineering mode operation.

C. Key Operation
Use Up and Down key to select a menu and press select key to progress the test. Pressing back
key will switch back to the original test menu.

D. Engineering Mode Menu Tree

Eng
Mode

BB
Test

RF
Test

MF
Mode

Trace
option

- 99 -

Call
Timer

Fact.
Reset

S/W
version

10. ENGINEERING MODE

10.1 BB Test [MENU 1]

Baseband Test

10.1.1 LED
This Menu is to test the indicator LED on the folder of a handset.
1) Left RED on: Red light turns on in Left indicator LED
2) Right RED on:Red light turns on in Right indicator LED
3) Left GREEN on: Green light turns on in Left indicator LED
4) Right GREEN on:Green light turns on in Right indicator LED
5) Left ORANGE on: Orange light turns on in Left indicator LED
6) Right ORANGE on: Orange light turns on in Right indicator LED
7) LED all off:All of indicator LED turns off.

10.1.2 LCD
1) Contrast value: This menu is to test Main LCD contrast.
- Contrast Value [10-50]: Change this value by up and down key.

10.1.3 Backlight
This menu is to test the LCD Backlight and Keypad Backlight.
1) Backlight on: LCD Backlight and Keypad Backlight light on at the same time.
2) Backlight off: LCD Backlight and Keypad Backlight light off at the same time.
3) Backlight value: This controls brightness of Backlight. When entering into the menu, the present
backlight-value in the phone is displayed. Use Left/Right key to adjust the level of
brightness. The value of the brightness set at last will be saved in the NVRAM.

10.1.4 Buzzer
This menu is to test the melody sound.
1) Melody on: Melody sound is played through the speaker.
2) Melody off: Melody sound is off.

10.1.5 Vibrator
This menu is to test the vibration mode.
1) Vibrator on: Vibration mode is on.
2) Vibrator off: Vibration mode is off.

- 100 -

10. ENGINEERING MODE

10.1.6 ADC (Analog to Digital Converter)

This displays the value of each ADC.
1) MVBAT ADC: Main Voltage Battery ADC
2) AUX ADC: Auxiliary ADC
3) TEMPER ADC: Temperature ADC

10.1.7 BATTERY
1) Bat Cal: This displays the value of Battery Calibration. The following menus are displayed
in order: BAT_LEV_4V, BAT_LEV_3_LIMIT, BAT_LEV_2_LIMIT,
BAT_LEV_1_LIMIT, BAT_IDLE_LI MIT, BAT_INCALL_LIMIT,
SHUT_DOWN_VOLTAGE, BAT_RECHARGE_LMT
2) TEMP Cal: This displays the value of Temperature Calibration. The following menus are
displayed in order: TEMP_HIGH_LIMIT, TEMP_HIGH_RECHARGE_LMT,
TEMP_LOW_RECHARGE_LMT, TEMP_LOW_LIMIT

10.1.8 Audio
This is a menu for setting the control register of Voiceband Baseband Codec chip.
Although the actual value can be written over, it returns to default value after switching off and on the
phone.
1) VbControl1: VbControl1 bit Register Value Setting
2) VbControl2: VbControl2 bit Register Value Setting
3) VbControl3: VbControl3 bit Register Value Setting
4) VbControl4: VbControl4 bit Register Value Setting
5) VbControl5: VbControl5 bit Register Value Setting
6) VbControl6: VbControl6 bit Register Value Setting

10.1.9 DAI (Digital Audio Interface)

This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing.
1) DAI AUDIO: DAI audio mode
2) DAI UPLINK: Speech encoder test
3) DAI DOWNLINK: Speech decoder test
4) DAI OFF: DAI mode off

- 101 -

10. ENGINEERING MODE

10.2 RF Test [MENU 2]

Radio Frequency Test

10.2.1 SAR test

This menu is to test the Specific Absorption Rate.
1) SAR test on: Phone continuously process TX only. Call-setup equipment is not required.
2) SAR test off: TX process off

10.3 MF mode [MENU 3]

This manufacturing mode is designed to do the baseband test automatically.
Selecting this menu will
process the test automatically, and phone displays the previous menu after completing the test.

10.3.1 All auto test

LED,LCD, Backlight, Vibrator, Buzzer, Key Pad, Mic&Speaker, Compass are tested in order for a
certain time.

10.3.2 LED
From Left RED LED to Right Orange LED are turned on one by one for about 1s, then off

10.3.3 Backlight
LCD Backlight and LED Backlight are on for about 1.5 seconds at the same time, then off.

10.3.4 Buzzer
This menu is to test the volume of Melody. It rings in the following sequence. Volume 1, Volume 2,
Volume 3, Volume 0 (mute), Volume 4, Volume 5.

10.3.5 Vibrator
Vibrator is on for about 1.5 seconds.

- 102 -

10. ENGINEERING MODE

10.3.6 LCD
Main LCD screen resolution tests horizontally and vertically one by one and fills the screen.

10.3.7 Key pad

When a pop-up message shows Press Any Key, you may press any keys including side keys, but not
[Soft2 Key]. If the key is working properly, name of the key is displayed on the screen. Test will be
completed in 15 seconds automatically.

10.3.8 MicSpkTest
The sound from MIC is recorded for about 3 seconds, then it is replayed on the speaker automatically

10.3.9 Compass
This Menu has all of the Compas
1) User Cal Start: Compass user Calibration Menu
2) Fact.Cal Start: Compass Factory Calibration Menu. This menu isnt used because Compass
Calibration Data is used Default Calibration Data.
3) Display Angle: This menu display Degree(DEG).
4) Cal Value1: Offset Default Calibration Data(OffsetX = 818, OffsetY=861)
5) Cal Value2:Gain/Calibration Ratio Default Calibration Data (GainX=238,GainY=226,CalRatio=0)

- 103 -

11. STAND ALONE TEST

11. STAND ALONE TEST

11.1 Introduction
This manual explains how to examine the status of RX and TX of the model.

A. Tx Test
TX test - this is to see if the transmitter of the phones is activating normally.

B. Rx Test
RX test - this is to see if the receiver of the phones is activating normally.

11.2 Setting Method

A. COM port
a. Move your mouse on the Connect button, then click the right button of the mouse and select Com
setting.
b. In the Dialog Menu, select the values as explained below.
- Port: select a correct COM port
- Baudrate: 38400
- Leave the rest as default values

B. Tx
1. Selecting Channel
- Select one of GSM or DCS Band and input appropriate channel.
2. Selecting APC
a. Select either Power level or Scaling Factor.
b. Power level
- Input appropriate value GSM (between 5~19) or DCS (between 0~15)
c. Scaling Factor
- A Ramp Factor appears on the screen.
- You may adjust the shape of the Ramp or directly input the values.

C. Rx
1. Selecting Channel
- Select one of GSM or DCS Band and input appropriate channel.
2. Gain Control Index (0~ 26) and RSSI level
- See if the value of RSSI is close to -16dBm when setting the value between 0 ~ 26 in Gain Control
Index.
- Normal phone should indicate the value of RSSI close to -16dBm.

- 104 -

11. STAND ALONE TEST

11.3 Means of Test

a. Select a COM port
b. Set the values in Tx or Rx
c. Select band and channel
d. After setting them all above, press connect button.
e. Press the start button

Figure 11-1. HW test program

- 105 -

11. STAND ALONE TEST

Figure 11-2. HW test setting

Figure 11-3. Ramping profile

- 106 -

12. AUTO CALIBRATION

12. AUTO CALIBRATION

12.1 Overview
Autocal (Auto Calibration) is the PC side Calibration tool that perform Tx ,Rx and Battery Calibration
with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable power supply).
Autocal generate calibration data by communicating with phone and measuring equipment then write it
into calibration data block of flash memory in GSM phone.

12.2 Requirements
-PC or Notebook installed with Microsoft Windows 98/ME/2000/XP
-Auto Calibration program(Autocal.exe)
-GSM Phone
-LGE PIF JIG, Serial Cable, Data Cable
-Agilent 8960(Call Setting Instrument)
-Tektronix PS2521G(Programmable Power Supply)

12.3 Menu and Settings

-File(F) Clear View: Clear Calibration Status window texts
-File(F) Save View: Save Calibration Status window texts
-File(F) Save Setting: Save Current Calibration settings to setting file(*.cal)
-File(F) Load Setting: Load saved Calibration setting
-File(F) Make BIN ALL: Make binary file after calibration finished
-File(F) Make BIN BAT.Cal only: Make binary file of battery cal data only after calibration finished
-File(F) Make & Write BIN: Make binary file after calibration finished then download it to the Flash
Memory

-View(V)
Tools: Enable or disable Tool bar
-View(V) Status: Enable or disable status bar
-Connection(C) Connect: Connect the phone with PC. This procedure checks whether the PC is
connected ag8960 or not. After that it performs sync. procedure with
phone. If the sync. procedure is successful state column on status bar
changed to SETUP, else you should disconnect phone and try again from
the beginning and also check the whole connection. All measurement is
performed at state SETUP.

-Connection(C)
Port Setting: Show COM port setting dialog and Baudrate you can change,etc.
-GPIB(G) Connect: Connect the Ag8960 GPIB card with PC.

- 107 -

12. AUTO CALIBRATION

Figure 12-1. Auto Calibration Program

-Screen Cable loss: Enter the RF cable loss GSM and DCS
-Screen GPIB(Primary address): Enter the SS(Ag8960) and PS(Tektronix PS2521G) GPIB
address
-Screen ADC Channel: Default ADC Calibration Channel
-Screen Auto Calibration Item: Default Calibration Settings about Tx, Rx, ADC and write BIN file

- 108 -

12. AUTO CALIBRATION

12.4 AGC
This procedure is for Rx calibration.
In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the result
window will show correction values per every power level and gain code and the same measure is
performed per every frequency.

12.5 APC
This procedure is for Tx calibration.
In this procedure you can get proper scale factor value and measured power level.

12.6 ADC
This procedure is for battery calibration.
You can get main Battery Config Table and temperature Config Table

12.7 Setting
check com port and cable loss. Select automatic calibration item. If you uncheck one item calibration
will stop from the unchecked item. This is useful when you want to process only one item.

12.8 How to do calibration

A. Connect cable between phone and serial port of PC.
B. Connect Ag8960 equipment and Power Supply and phone.
C. Set correct port and baud rate.
D. Press Start button. AutoCal process all calibration procedure
i. AGC EGSM
ii. AGC DCS
iii. APC EGSM
iv. APC DCS
v. ADC
E. After finished all measurement. The state is return to SETUP.
F. The Cal file will be generated and then the calibration data will be written into phone and then will be
reset.

- 109 -

Note.

- 110 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

13.1 Exploded View

- 111 -

Note.

- 112 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

13.2 Replacement Parts

<Mechanic component>

Note: This Chapter is used for reference, Part order

is ordered by SBOM standard on GCSC

- 113 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

- 114 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

13.2 Replacement Parts

<Main component>

Note: This Chapter is used for reference, Part order

is ordered by SBOM standard on GCSC

- 115 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

- 116 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

- 117 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

- 118 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

- 119 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

- 120 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

- 121 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

- 122 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

- 123 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

- 124 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

- 125 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

- 126 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

13.3 Accessories

Note: This Chapter is used for reference, Part order

is ordered by SBOM standard on GCSC

- 127 -