MUN2216, MMUN2216L,

MUN5216, DTC143TE,
DTC143TM3
Digital Transistors (BRT)
R1 = 4.7 kW, R2 = 8 kW

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NPN Transistors with Monolithic Bias

Resistor Network

PIN CONNECTIONS

This series of digital transistors is designed to replace a single

device and its external resistor bias network. The Bias Resistor
Transistor (BRT) contains a single transistor with a monolithic bias
network consisting of two resistors; a series base resistor and a base
emitter resistor. The BRT eliminates these individual components by
integrating them into a single device. The use of a BRT can reduce
both system cost and board space.
Features

PIN 1
BASE
(INPUT)

PIN 3
COLLECTOR
(OUTPUT)

R1
R2

PIN 2
EMITTER
(GROUND)

MARKING DIAGRAMS

Simplifies Circuit Design

Reduces Board Space
Reduces Component Count
S and NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC-Q101 Qualified
and PPAP Capable
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant

Symbol

Max

Unit

CollectorBase Voltage

VCBO

50

Vdc

CollectorEmitter Voltage

VCEO

50

Vdc

IC

100

mAdc

Input Forward Voltage

VIN(fwd)

30

Vdc

Input Reverse Voltage

VIN(rev)

Vdc

Collector Current Continuous

SC59
CASE 318D
STYLE 1

XXX MG
G

SOT23
CASE 318
STYLE 6

MAXIMUM RATINGS (TA = 25C)

Rating

XX MG
G

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.

XX MG
G

SC70/SOT323
CASE 419
STYLE 3

XX M

SC75
CASE 463
STYLE 1

XX M

SOT723
CASE 631AA
STYLE 1

1
XXX
M
G

= Specific Device Code

= Date Code*
= PbFree Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending
upon manufacturing location.

ORDERING INFORMATION
See detailed ordering, marking, and shipping information in
the package dimensions section on page 2 of this data sheet.

Semiconductor Components Industries, LLC, 2012

August, 2012 Rev. 0

Publication Order Number:

DTC143T/D

MUN2216, MMUN2216L, MUN5216, DTC143TE, DTC143TM3

Table 1. ORDERING INFORMATION
Part Marking

Package

Shipping

8F

SC59

3,000 / Tape & Reel

MMUN2216LT1G, SMMUN2216LT1G

A8F

SOT23

3,000 / Tape & Reel

SMMUN2216LT3G

A8F

SOT23

10,000 / Tape & Reel

MUN5216T1G

8F

SC70/SOT323

3,000 / Tape & Reel

DTC143TET1G

8F

SC75

3,000 / Tape & Reel

DTC143TM3T5G

8F

SOT723

8,000 / Tape & Reel

Device
MUN2216T1G, SMUN2216T1G

For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.

PD, POWER DISSIPATION (mW)

300
250
(1) SC75 and SC70/SOT323; Minimum Pad
(2) SC59; Minimum Pad
(3) SOT23; Minimum Pad
(4) SOT723; Minimum Pad

200
150

(1) (2) (3) (4)

100
50
0
50

25

25

50

75

100

125

150

AMBIENT TEMPERATURE (C)

Figure 1. Derating Curve

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2

MUN2216, MMUN2216L, MUN5216, DTC143TE, DTC143TM3

Table 2. THERMAL CHARACTERISTICS
Characteristic

Symbol

Max

Unit

230
338
1.8
2.7

mW

THERMAL CHARACTERISTICS (SC59) (MUN2216)

Total Device Dissipation
TA = 25C

(Note 1)
(Note 2)
(Note 1)
(Note 2)

Derate above 25C

PD

mW/C

Thermal Resistance,
Junction to Ambient

(Note 1)
(Note 2)

RqJA

540
370

C/W

Thermal Resistance,
Junction to Lead

(Note 1)
(Note 2)

RqJL

264
287

C/W

TJ, Tstg

55 to +150

246
400
2.0
3.2

mW

Junction and Storage Temperature Range

THERMAL CHARACTERISTICS (SOT23) (MUNN2216L)
Total Device Dissipation
TA = 25C

(Note 1)
(Note 2)
(Note 1)
(Note 2)

Derate above 25C

PD

mW/C

Thermal Resistance,
Junction to Ambient

(Note 1)
(Note 2)

RqJA

508
311

C/W

Thermal Resistance,
Junction to Lead

(Note 1)
(Note 2)

RqJL

174
208

C/W

TJ, Tstg

55 to +150

202
310
1.6
2.5

mW

Junction and Storage Temperature Range

THERMAL CHARACTERISTICS (SC70/SOT323) (MUN5216)
Total Device Dissipation
TA = 25C

(Note 1)
(Note 2)
(Note 1)
(Note 2)

Derate above 25C

PD

mW/C

Thermal Resistance,
Junction to Ambient

(Note 1)
(Note 2)

RqJA

618
403

C/W

Thermal Resistance,
Junction to Lead

(Note 1)
(Note 2)

RqJL

280
332

C/W

TJ, Tstg

55 to +150

200
300
1.6
2.4

mW

Junction and Storage Temperature Range

THERMAL CHARACTERISTICS (SC75) (DTC143TE)
Total Device Dissipation
TA = 25C

(Note 1)
(Note 2)
(Note 1)
(Note 2)

Derate above 25C

Thermal Resistance,
Junction to Ambient

(Note 1)
(Note 2)

Junction and Storage Temperature Range

PD

mW/C

RqJA

600
400

C/W

TJ, Tstg

55 to +150

260
600
2.0
4.8

mW

THERMAL CHARACTERISTICS (SOT723) (DTC143TM3)

Total Device Dissipation
TA = 25C

(Note 1)
(Note 2)
(Note 1)
(Note 2)

Derate above 25C

Thermal Resistance,
Junction to Ambient

(Note 1)
(Note 2)

Junction and Storage Temperature Range

1. FR4 @ Minimum Pad.
2. FR4 @ 1.0 x 1.0 Inch Pad.

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3

PD

mW/C

RqJA

480
205

C/W

TJ, Tstg

55 to +150

MUN2216, MMUN2216L, MUN5216, DTC143TE, DTC143TM3

Table 3. ELECTRICAL CHARACTERISTICS (TA = 25C, unless otherwise noted)
Characteristic

Symbol

Min

Typ

Max

100

500

1.9

50

50

160

350

0.25

0.6

0.9

0.2

4.9

Unit

OFF CHARACTERISTICS
CollectorBase Cutoff Current
(VCB = 50 V, IE = 0)

ICBO

CollectorEmitter Cutoff Current

(VCE = 50 V, IB = 0)

ICEO

EmitterBase Cutoff Current

(VEB = 6.0 V, IC = 0)

IEBO

CollectorBase Breakdown Voltage

(IC = 10 mA, IE = 0)

V(BR)CBO

CollectorEmitter Breakdown Voltage (Note 3)

(IC = 2.0 mA, IB = 0)

V(BR)CEO

nAdc
nAdc
mAdc
Vdc
Vdc

ON CHARACTERISTICS
DC Current Gain (Note 3)
(IC = 5.0 mA, VCE = 10 V)

hFE

CollectorEmitter Saturation Voltage (Note 3)

(IC = 10 mA, IB = 1.0 mA)

VCE(sat)

Input Voltage (off)

(VCE = 5.0 V, IC = 100 mA)

Vi(off)

Input Voltage (on)

(VCE = 0.2 V, IC = 10 mA)

Vi(on)

Output Voltage (on)

(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 kW)

VOL

Output Voltage (off)

(VCC = 5.0 V, VB = 0.25 V, RL = 1.0 kW)

VOH

Input Resistor

R1

3.3

4.7

6.1

Resistor Ratio

R1/R2

3. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle 2%.

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4

Vdc
Vdc
Vdc
Vdc
Vdc
kW

MUN2216, MMUN2216L, MUN5216, DTC143TE, DTC143TM3

TYPICAL CHARACTERISTICS
MUN2216, MMUN2216L, MUN5216, DTC143TE, DTC143TM3
1000

150C

25C

0.1

55C

0.01

10

20

30

40

100

55C

10

50

10

100

IC, COLLECTOR CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

Figure 2. VCE(sat) vs. IC

Figure 3. DC Current Gain

100

2.4

IC, COLLECTOR CURRENT (mA)

f = 10 kHz
IE = 0 V
TA = 25C

2.8

2.0
1.6
1.2
0.8
0.4
0

10

20

30

40

150C

55C

10

0.1
VO = 5 V
0.01

50

25C

VR, REVERSE VOLTAGE (V)

Vin, INPUT VOLTAGE (V)

Figure 4. Output Capacitance

Figure 5. Output Current vs. Input Voltage

100

Vin, INPUT VOLTAGE (V)

25C

VCE = 10 V

3.2
Cob, OUTPUT CAPACITANCE (pF)

150C

IC/IB = 10
hFE, DC CURRENT GAIN

VCE(sat), COLLECTOREMITTER
VOLTAGE (V)

10

25C
55C

1
150C
0.1

VO = 0.2 V
0

10

20

30

40

IC, COLLECTOR CURRENT (mA)

Figure 6. Input Voltage vs. Output Current

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5

50

MUN2216, MMUN2216L, MUN5216, DTC143TE, DTC143TM3

PACKAGE DIMENSIONS
SC59
CASE 318D04
ISSUE H
D

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.

HE

DIM
A
A1
b
c
D
E
e
L
HE

b
e

MILLIMETERS
NOM
MAX
1.15
1.30
0.06
0.10
0.43
0.50
0.14
0.18
2.90
3.10
1.50
1.70
1.90
2.10
0.40
0.60
2.80
3.00

STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR

MIN
1.00
0.01
0.35
0.09
2.70
1.30
1.70
0.20
2.50

A1

SOLDERING FOOTPRINT*
0.95
0.037

0.95
0.037

2.4
0.094
1.0
0.039
0.8
0.031

SCALE 10:1

mm
inches

*For additional information on our PbFree strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com
6

MIN
0.039
0.001
0.014
0.003
0.106
0.051
0.067
0.008
0.099

INCHES
NOM
0.045
0.002
0.017
0.005
0.114
0.059
0.075
0.016
0.110

MAX
0.051
0.004
0.020
0.007
0.122
0.067
0.083
0.024
0.118

MUN2216, MMUN2216L, MUN5216, DTC143TE, DTC143TM3

PACKAGE DIMENSIONS
SOT23 (TO236)
CASE 31808
ISSUE AP
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.

D
SEE VIEW C
3

HE

DIM
A
A1
b
c
D
E
e
L
L1
HE
q

c
1

0.25
q

A
L

A1

MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
0

MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64

10

STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR

L1
VIEW C

SOLDERING FOOTPRINT
0.95
0.037

0.95
0.037

2.0
0.079
0.9
0.035
SCALE 10:1

0.8
0.031

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7

mm
inches

MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
0

INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094

MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
10

MUN2216, MMUN2216L, MUN5216, DTC143TE, DTC143TM3

PACKAGE DIMENSIONS
SC70 (SOT323)
CASE 41904
ISSUE N
D

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

e1

DIM
A
A1
A2
b
c
D
E
e
e1
L
HE

HE
1

b
e

A
0.05 (0.002)

0.30
0.10
1.80
1.15
1.20
0.20
2.00

MILLIMETERS
NOM
MAX
0.90
1.00
0.05
0.10
0.70 REF
0.35
0.40
0.18
0.25
2.10
2.20
1.24
1.35
1.30
1.40
0.65 BSC
0.38
0.56
2.10
2.40

STYLE 3:
PIN 1. BASE
2. EMITTER
3. COLLECTOR

A2

MIN
0.80
0.00

A1

SOLDERING FOOTPRINT*
0.65
0.025

0.65
0.025

1.9
0.075
0.9
0.035
0.7
0.028
SCALE 10:1

mm
inches

*For additional information on our PbFree strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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8

MIN
0.032
0.000
0.012
0.004
0.071
0.045
0.047
0.008
0.079

INCHES
NOM
0.035
0.002
0.028 REF
0.014
0.007
0.083
0.049
0.051
0.026 BSC
0.015
0.083

MAX
0.040
0.004
0.016
0.010
0.087
0.053
0.055
0.022
0.095

MUN2216, MMUN2216L, MUN5216, DTC143TE, DTC143TM3

PACKAGE DIMENSIONS
SC75/SOT416
CASE 463
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.

E
2
3

b 3 PL
0.20 (0.008)

DIM
A
A1
b
C
D
E
e
L
HE

1
M

HE

0.20 (0.008) E

STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR

A
L

MILLIMETERS
MIN
NOM MAX
0.70
0.80
0.90
0.00
0.05
0.10
0.15
0.20
0.30
0.10
0.15
0.25
1.55
1.60
1.65
0.70
0.80
0.90
1.00 BSC
0.10
0.15
0.20
1.50
1.60
1.70

A1

SOLDERING FOOTPRINT*
0.356
0.014

1.803
0.071

0.787
0.031

0.508
0.020

1.000
0.039
SCALE 10:1

mm
inches

*For additional information on our PbFree strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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9

INCHES
NOM MAX
0.031 0.035
0.002 0.004
0.008 0.012
0.006 0.010
0.063 0.067
0.031 0.035
0.04 BSC
0.004 0.006 0.008
0.061 0.063 0.065
MIN
0.027
0.000
0.006
0.004
0.059
0.027

MUN2216, MMUN2216L, MUN5216, DTC143TE, DTC143TM3

PACKAGE DIMENSIONS
SOT723
CASE 631AA01
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.

X
D

b1

A
Y

E
1
2X

HE

2
2X

C
0.08 X Y

SIDE VIEW

TOP VIEW
3X
1

3X

DIM
A
b
b1
C
D
E
e
HE
L
L2

MILLIMETERS
MIN
NOM
MAX
0.45
0.50
0.55
0.15
0.21
0.27
0.25
0.31
0.37
0.07
0.12
0.17
1.15
1.20
1.25
0.75
0.80
0.85
0.40 BSC
1.15
1.20
1.25
0.29 REF
0.15
0.20
0.25

STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR

L2
BOTTOM VIEW

RECOMMENDED
SOLDERING FOOTPRINT*
2X

0.40
2X

0.27

PACKAGE
OUTLINE

1.50

3X

0.52

0.36
DIMENSIONS: MILLIMETERS

*For additional information on our PbFree strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLCs product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC
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For additional information, please contact your local
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DTC143T/D