Date: 08-12-2014

Patent Search & Analysis Report (PSAR)

Team Id

: 5779

Name

: TESTING JIG OF IGBT STACK FOR

SOLAR PCS
Part-1: Patent Search Technique Used
Patent Search Database Used:

Google drive (worldwide)

Keywords used for search:

Stack assembling and testing

Search String:

Testing of stack

Part-2: Basic data of Patent and Bibliographic

Category / Field of Invention:

Power Electronic

Invention is related to/Class of

Invention:

Testing of IGBT stack

Title of Invention:

Stack bus bar assembly with Integrated Cooling

Patent No:
Application No:
Date of Filing/Application:

US 7,952,875 B2
12/475,005
May 29, 2009

Priority Date:

Dec. 2, 2010

Publication /Journal Number - (Issue

No. of Journal in which patent is
published):
US 7,952,875 B2
Publication Date:
First Filled Country:

May 31, 2011

United States

Also Published in:

Relevant Patent / Application No:

US 2010/0302733 A1

Applicant for Patent is:

Organization

Inventor Details
1) George R. Woody
2) Terence G.Waed
3) Edward P.Yankoshi

Part-3: Technical part of patented invention

Limitation of Prior Technology/Art:
External cooling is required
Specific Problem Solved / Objective of Inventor:
A stacked bus bar assembly includes two or more bus bar A stacked bus bar assembly includes
two or more bus bar one or more power semiconductor devices bonded thereto (e.g., lGBTs,
power diodes, and the like). Each bus bar has an internal integrated cooling system including one
or more fluidchannels in communication with an inlet and an outlet. The bus bar assemblies are
stacked such that their respective inlets and outlets are aligned and a coolant may then How in
parallelthere through.
Brief about Invention:
It is desirable to reduce the complexity, mass, and volume of such electronic components while
improving their heat transfer characteristics. Typically, known bus bar assemblies typically
utilize large heat sinks or air-cooled units, thus resulting in additional components, increased
cost, and additional required space.
Key Learning Points:
In general, the present invention relates to a stacked bus bar assembly includes one or more bus
bar subassemblies, each including a plurality of bus bars having one or more power
semiconductor devices bonded thereto (e.g., IGBTs, power diodes, and the like). Each bus bar
has an internal integrated cooling system including one or more fluid channels in communication
with an inlet and an outlet. The bus bar assemblies are stacked such that their respective inlets
and outlets are aligned and coolant may then flow in parallel there through. Power devices
integrated in this Way provide improved heat dissipation, thereby reducing the cost, mass, and
volume of the resulting power component.
Summary of Invention:
A plurality of bus bar subassemblies, each comprising a plurality of bus bars having one or more
power semiconductor devices bonded thereto, and an integrated cooling system including an
inlet, an outlet, and one or more fluid channels in communication With the inlet and out
let; Wherein the plurality of bus bar assemblies are stacked such that their respective inlets and
outlets are aligned; and Wherein the plurality of bus bars in each of the plurality of bus bar
subassemblies are electrically interconnected and include a first DC bus bar, a second DC bus
bar, and an AC bus bar provided there between.
How much this invention is related with your IDP/UDP? :

50