JEDEC

STANDARD

External Visual

JESD22-B101B
(Revision of JESD22-B101A, October 2004)

AUGUST 2009

JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

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JEDEC Standard No. 22-B101B

Page 1

TEST METHOD B101B

EXTERNAL VISUAL
(From JEDEC Board Ballot JCB-09-63, formulated under the cognizance of the JC-14.1 Subcommittee
on Reliability Test Methods for Packaged Devices)

Scope

External visual inspection is an examination of the external surfaces, construction, marking, and
workmanship of a finished package or component. External visual is a noninvasive and nondestructive
test. It is functional for qualification, quality monitoring, and lot acceptance.
This test method is applicable to:

finished packages or components only (hereafter referred to as components)(components sampled

for external visual inspection must be considered physically representative of the as-shipped product;

all solid state device package types;

components having attachments as shipped (see clause 3 for definition).

This test method is not applicable to:

customer-processed components (see clause 3 for definition);

piece parts incoming to a component assembly operation, or to sub-assemblies in a manufacturing

line (WIP);

the carrier, dry bag, packing, or container used to ship components;

the orientation or loading aspects of components in carriers, (applicable to the component only);
the internal, non-viewable features of a component.

This test method does not apply to or require any inspection, measurement, or analysis other than the
procedure described in clause 5.
This test method does not preclude the use of specialized tools or equipment to inspect or measure
components for conformance to physical specifications.

Informative references

JESD22-B100, Physical Dimensions

JESD22-B114, Mark Legibility
JESD201, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy
Surface Finishes

Test Method B101B

Revision of Test Method B101-A

JEDEC Standard No. 22-B101B

Page 2

Terms and definitions

attachment: A capacitor, substrate cap, heat sink, etc. that is glued, soldered, or mechanically affixed to
the component.
carrier: A pocket tape, tray, tube or other fixture used to store and transport components.
critical sealant: A polymeric material designed to completely or partially cover, intimately adhere to,
and protect critical electrical features such as metal wirebonds, metal leadframe, metal fan-out on a
substrate, or the chip active face and diced edges.
customer-processed component: A component that has been soldered to or desoldered from a circuit
board or other mounting surface.
substrate: A ceramic block or laminate card having one or more wired layers, to which a component is
electrically connected.
WIP: Work in progress or work in process.

Apparatus

The following is a list of material needed to perform the test outlined in this standard.

Grounded and lighted workstation

Grounded wrist strap

Vacuum pickup or other suitable handling tool (tweezers, etc.)

Antistatic finger cots

Microscope or other magnifying aids

Test Method B101B

Revision of Test Method B101-A

JEDEC Standard No. 22-B101B

Page 3

Procedure

5.1

Components to be inspected shall be picked up individually and carefully handled by hand with
finger cots, or by hand using a vacuum pickup or other suitable tool.

5.2

At all times proper, ESD-free handling procedures must be followed.

5.3

Loose, dry, foreign material may be blown or vacuumed off the component surface using a clean,
filtered air stream of +/- 27 meters per second (+/- 88 feet per second) maximum velocity.

5.4

The component shall be viewed by the eyes, unaided or with low magnification (3X to 7X)

5.5

Uncertain visual observations may be verified by using a higher magnification (up to 30X).

5.6

If potential failures (per clause 6) are still suspected but not certain after step 5.5, specialized
tools or equipment may be used for further analysis and verification.

5.7

The same failure criteria (clause 6) shall apply to both the external visual inspection and to any
specialized analyses used for verification.

Failure criteria

6.1

Any dimension which is non-conforming to an applicable drawing or specification.

6.2

Any physical feature (type, material, color, finish, etc.) that is non-conforming to an applicable
drawing or specification.

6.3

Any flaw or defect that renders the part cosmetically unacceptable or mechanically unfit for use,
as defined by an applicable drawing or specification.

6.4

Contamination that renders the part cosmetically unacceptable or mechanically unfit for use, as
defined by an applicable drawing or specification.

6.5

Any specific condition that is inspected for separately by specialized equipment (for example
coplanarity or other physical dimensions) may be excluded from the external visual inspection.
See JESD22-B100 regarding Physical Dimension requirements.

6.6

No more than 5% maximum exposure of the base material that is intended to be covered by the
Lead Finish Design (i.e. dam bar trim area, lead tip trim area, and/or 0.254mm (10 mils)
maximum mold resin bleed area from peripheral leaded package body are not intended by design
to be covered by lead finish)

6.7

Failures caused by handling damage during the course of the inspection are not to be counted.

Test Method B101B

Revision of Test Method B101-A

JEDEC Standard No. 22-B101B

Page 4

Report form - External Visual

This form or an equivalent form may be used to report the results of external visual inspection.
Part Number
Description
Lot Number
Supplier
Applicable Drawing Number
Applicable Specification Number
Quantity inspected
Quantity good
Date
Inspector
Comments - failed condition
7.1

Leads

Defects List
Cracked or broken
Missing or extra
Incorrect placement or spacing (pitch)
Improperly bent, reverse-bent, twisted,
or misshapen
Non-coplanar seating
Non-parallel
Notched or creased
Improper dimensions (width, length,
thickness)
Improper foot angle and/or foot length
Improper exit locations
Metal burrs
Missing or improperly located standoff
swages
Other:

Test Method B101B

Revision of Test Method B101-A

Inspected: Yes
A/U*
Comments

No

N/A

JEDEC Standard No. 22-B101B

Page 5

Report form - External Visual (contd)

7.2

Lead Finish

Defects List
Pitted or corroded
Missing
Deeply scratched or abraded
Cracked or flaked
Extraneous material
Icicles
Lump (slump)
Bridged
Oxidized
Tin whiskers, See JESD201
Contaminated
Other:
7.3

Inspected: Yes
A/U*
Comments

No

N/A

Inspected: Yes
A/U*
Comments

No

N/A

Molding and Mold Compound

Defects List
Incomplete fill
Surface pits, craters, or pinholes
Ejector pin marks (indentations)
Top/bottom reversal (reverse mold)
Top/bottom offset (misalignment)
Cracked
Gaps, cracks, or spaces between body
and leads
Gaps, cracks, or spaces between body
and molded-in metal heat sink
Surface blisters
Surface dents (depressions)
Plastic protrusions (flash)
Missing lead 1 identifying mark
Dam bar protrusions
Dam bar intrusions
Warped
Contaminated
Other:

Test Method B101B

Revision of Test Method B101-A

JEDEC Standard No. 22-B101B

Page 6

Report form - External Visual (contd)

7.4

Critical Sealant

Defects List
Incomplete coverage
Air bubbles or voids
Surface pits, craters, or pinholes
Contaminated
Other:
7.5

No

N/A

Inspected: Yes
A/U*
Comments

No

N/A

Inspected: Yes
A/U*
Comments

No

N/A

Attachments

Defects List
Excessive gaps, cracks, or spaces in
glue joint
Solder bridging, solder balls
Missing or extra
Misplaced or mis-positioned
Poor or improper fit
Cracked or broken
Bent or warped
Contaminated
Other:
7.6

Inspected: Yes
A/U*
Comments

Marking

Defects List
Illegible characters (deformed, broken,
faint), See JESD22-B114
Missing or extra characters
Wrong
Doubled
Extraneous marks
Other:

Test Method B101B

Revision of Test Method B101-A

JEDEC Standard No. 22-B101B

Page 7

Report form - External Visual (contd)

7.7

Solder Balls

Defects List
Low volume
Missing or extra
Pitted or corroded
Smeared
Cracked or broken
Oxidized
Contaminated
Other:
7.8

Inspected: Yes
A/U*
Comments

No

N/A

Inspected: Yes
A/U*
Comments

No

N/A

Substrate

Defects List
Non-plated areas
Cracked, chipped, broken, or
otherwise damaged
Extraneous metal
Bent or warped
Contaminated
Other
*Acceptable/Unacceptable

Test Method B101B

Revision of Test Method B101-A

JEDEC Standard No. 22-B101B

Page 8

Annex A (informative) Differences between JESD22-B101B and JESD22-B101A

This table briefly describes most of the changes made to entries that appear in this standard,
JESD22-B101B, compared to its predecessor, JESD22-B101A (October 2004). If the change to a concept
involves any words added or deleted (excluding deletion of accidentally repeated words), it is included.
Some punctuation changes are not included.
Page-Clause

Description of change

1-1
1-2
2-3

In Scope, change semiconductor to Solid State Device

Add Informative Reference section, new Section 2, renumber all following sections
Remove finished packaged prior to component in three locations, since first bullet in
scope defines the term components
Specifically call out coplanarity, and add reference to JESD22-B100
Add line item for tin whiskers and add reference to JESD201
For Attachments add line item for solder bridging and solder balls, and quantify type of
gaps, cracks, and spaces to be noted
For Marking add reference to JESD22-B114

3-6
5-7
6-7
6-7

A.1

Differences between JESD22-B101A and JESD22-B101 (informative)

This table briefly describes most of the changes made to entries that appear in this standard, JESD22B101A, compared to its predecessor, JESD22-B101 (September 1987). If the change to a concept
involves any words added or deleted (excluding deletion of accidentally repeated words), it is included.
Some punctuation changes are not included.
Page-Clause

Description of change

This Revision is a complete rewrite of this specification and major changes have been made to each
section. The following is a brief list for each:
1-1
1-2
2-3
2-4
3-5
3-6

Purpose changed to Scope and completely re-written to clarify and update the use of this
specification.
Terms and Definitions section was inserted before the Apparatus section that was moved
to Section 3. All terms and definitions are new to this revision.
Apparatus added the required tools and equipment for inspecting and protecting the
samples during the execution of this specification.
Procedure section has been completely re-written to be more comprehensive.
Failure Criteria section has been completely re-written to be more comprehensive.
Report form External Visual replaced the Summary section.

Test Method B101B

Revision of Test Method B101-A

Standard Improvement Form

JEDEC JESD22B101B

The purpose of this form is to provide the Technical Committees of JEDEC with input from the industry
regarding usage of the subject standard. Individuals or companies are invited to submit comments to
JEDEC. All comments will be collected and dispersed to the appropriate committee(s).
If you can provide input, please complete this form and return to:
JEDEC
Attn: Publications Department
3103 North 10th Street Suite 240S
Arlington, VA 22201
Fax: 703.907.7583
1.

I recommend changes to the following:

Requirement, clause number
Test method number

Clause number

The referenced clause number has proven to be:

Unclear
Too Rigid
In Error
Other
2.

Recommendations for correction:

3.

Other suggestions for document improvement:

Submitted by
Name:

Phone:

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Rev. 9/02

Date: