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OptiX OSN 500 STM-1/STM-4 Multi-Service CPE Optical

Transmission System
V100R002

Product Description

Issue

01

Date

2009-01-20

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Notice
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but the statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.

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OptiX OSN 500 STM-1/STM-4 Multi-Service CPE Optical


Transmission System
Product Description

Contents

Contents
About This Document.....................................................................................................................1
1 Overview......................................................................................................................................1-1
1.1 Introduction to the OptiX OSN 500................................................................................................................1-2
1.2 Network Application.......................................................................................................................................1-3
1.3 Networking Application..................................................................................................................................1-4

2 Function........................................................................................................................................2-1
2.1 Service Type....................................................................................................................................................2-3
2.2 Capacity...........................................................................................................................................................2-3
2.2.1 Cross-Connect Capacity.........................................................................................................................2-3
2.2.2 Maximum Access Capability.................................................................................................................2-3
2.3 Ports.................................................................................................................................................................2-4
2.3.1 Service Ports...........................................................................................................................................2-4
2.3.2 NM Ports and Auxiliary Ports................................................................................................................2-5
2.4 Protection Capability.......................................................................................................................................2-5
2.5 Networking Capability....................................................................................................................................2-6
2.6 DCN Features..................................................................................................................................................2-6
2.7 Clock Features.................................................................................................................................................2-6
2.8 Ethernet Features.............................................................................................................................................2-7
2.9 OAM................................................................................................................................................................2-7
2.10 Network Management System......................................................................................................................2-7
2.11 Various Types of Power Inputs.....................................................................................................................2-8

3 System Architecture...................................................................................................................3-1
3.1 Software Architecture.....................................................................................................................................3-2
3.1.1 Overview................................................................................................................................................3-2
3.1.2 Communication Protocols......................................................................................................................3-3
3.1.3 Board Software.......................................................................................................................................3-3
3.1.4 NE Software...........................................................................................................................................3-4
3.1.5 Network Management System...............................................................................................................3-5
3.2 Hardware Structure.........................................................................................................................................3-5
3.2.1 Chassis....................................................................................................................................................3-6
3.2.2 Board......................................................................................................................................................3-6
3.2.3 External Component...............................................................................................................................3-8
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OptiX OSN 500 STM-1/STM-4 Multi-Service CPE Optical


Transmission System
Product Description
3.2.4 Fibers and Cables...................................................................................................................................3-9

4 Boards...........................................................................................................................................4-1
4.1 SL1D...............................................................................................................................................................4-2
4.1.1 Version Description................................................................................................................................4-2
4.1.2 Functions and Features...........................................................................................................................4-2
4.1.3 Working Principle and Signal Flow.......................................................................................................4-3
4.1.4 Front Panel.............................................................................................................................................4-5
4.1.5 Valid Slots..............................................................................................................................................4-5
4.1.6 References for Board Configuration......................................................................................................4-5
4.1.7 Technical Specifications........................................................................................................................4-6
4.2 SP3D................................................................................................................................................................4-7
4.2.1 Version Description................................................................................................................................4-7
4.2.2 Functions and Features...........................................................................................................................4-7
4.2.3 Working Principle and Signal Flow.......................................................................................................4-8
4.2.4 Front Panel.............................................................................................................................................4-9
4.2.5 Valid Slots............................................................................................................................................4-10
4.2.6 References for Board Configuration....................................................................................................4-10
4.2.7 Technical Specifications......................................................................................................................4-10
4.3 PL3T..............................................................................................................................................................4-11
4.3.1 Version Description..............................................................................................................................4-12
4.3.2 Functions and Features.........................................................................................................................4-12
4.3.3 Working Principle and Signal Flow.....................................................................................................4-12
4.3.4 Front Panel...........................................................................................................................................4-13
4.3.5 Valid Slots............................................................................................................................................4-14
4.3.6 References for Board Configuration....................................................................................................4-14
4.3.7 Technical Specifications......................................................................................................................4-15
4.4 EGT1.............................................................................................................................................................4-16
4.4.1 Version Description..............................................................................................................................4-16
4.4.2 Functions and Features.........................................................................................................................4-16
4.4.3 Working Principle and Signal Flow.....................................................................................................4-18
4.4.4 Front Panel...........................................................................................................................................4-19
4.4.5 Valid Slots............................................................................................................................................4-19
4.4.6 References for Board Configuration....................................................................................................4-19
4.4.7 Technical Specifications......................................................................................................................4-20
4.5 EFS8 Board...................................................................................................................................................4-21
4.5.1 Version Description..............................................................................................................................4-21
4.5.2 Functions and Features.........................................................................................................................4-21
4.5.3 Working Principle and Signal Flow.....................................................................................................4-23
4.5.4 Front Panel...........................................................................................................................................4-25
4.5.5 Valid Slots............................................................................................................................................4-25
4.5.6 References for Board Configuration....................................................................................................4-25
4.5.7 Technical Specifications......................................................................................................................4-26
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Transmission System
Product Description

Contents

4.6 ISU................................................................................................................................................................4-26
4.6.1 Version Description..............................................................................................................................4-27
4.6.2 Functions and Features.........................................................................................................................4-28
4.6.3 Working Principle and Signal Flow.....................................................................................................4-30
4.6.4 Front Panel...........................................................................................................................................4-32
4.6.5 Valid Slots............................................................................................................................................4-36
4.6.6 References for Board Configuration ...................................................................................................4-36
4.6.7 Technical Specifications......................................................................................................................4-36

5 Protection.....................................................................................................................................5-1
5.1 Equipment Level Protection............................................................................................................................5-2
5.2 Network Level Protection...............................................................................................................................5-2
5.2.1 MSP........................................................................................................................................................5-2
5.2.2 SNCP......................................................................................................................................................5-4
5.2.3 Fiber-Shared Virtual Trail Protection....................................................................................................5-5

6 Ethernet Features........................................................................................................................6-1
6.1 Application......................................................................................................................................................6-2
6.2 Protection........................................................................................................................................................6-5
6.3 Maintenance....................................................................................................................................................6-7
6.3.1 ETH-OAM.............................................................................................................................................6-8
6.3.2 Test Frame..............................................................................................................................................6-8
6.3.3 RMON....................................................................................................................................................6-9

7 Technical Specifications...........................................................................................................7-1
7.1 Specifications for the Integrated Equipment...................................................................................................7-2
7.2 Power Consumption and Weight of Boards....................................................................................................7-2
7.3 Specifications for the Clock Ports...................................................................................................................7-2
7.4 Reliability Specifications................................................................................................................................7-3
7.5 EMC Performance Specifications...................................................................................................................7-3
7.6 Safety Certification.........................................................................................................................................7-3
7.7 Environment Requirement..............................................................................................................................7-4
7.7.1 Environment for Storage........................................................................................................................7-4
7.7.2 Environment for Transportation.............................................................................................................7-6
7.7.3 Environment for Operation....................................................................................................................7-9

8 Compliant Standards.................................................................................................................8-1
9 Labels............................................................................................................................................9-1
9.1 Labels..............................................................................................................................................................9-2
9.2 Label Position..................................................................................................................................................9-3

10 Indicators.................................................................................................................................10-1
11 Board Loopback Types..........................................................................................................11-1
12 Board Configuration Parameters.........................................................................................12-1
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iii

Contents

OptiX OSN 500 STM-1/STM-4 Multi-Service CPE Optical


Transmission System
Product Description

12.1 SDH Processing Boards..............................................................................................................................12-2


12.2 PDH Processing Boards..............................................................................................................................12-3
12.3 Data Processing Board................................................................................................................................12-4
12.3.1 SDH Parameters.................................................................................................................................12-4
12.3.2 Ethernet Parameters............................................................................................................................12-6
12.4 Cross-Connect and Timing Unit.................................................................................................................12-7

A Glossary..................................................................................................................................... A-1
B Acronyms and Abbreviations.................................................................................................B-1

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Transmission System
Product Description

Figures

Figures
Figure 1-1 Appearance of the OptiX OSN 500 (48 V/60 V DC power input).................................................1-2
Figure 1-2 Appearance of the OptiX OSN 500 (110 V/220 V AC power input).................................................1-2
Figure 1-3 Slot layout...........................................................................................................................................1-2
Figure 1-4 Position of the OptiX OSN 500 in the transmission network.............................................................1-4
Figure 1-5 Chain network formed by the OptiX OSN 500 alone........................................................................1-4
Figure 1-6 Ring network formed by the OptiX OSN 500 alone..........................................................................1-5
Figure 1-7 Hybrid networking with third-party transmission equipment............................................................1-5
Figure 3-1 Software architecture..........................................................................................................................3-3
Figure 3-2 Appearance of the OptiX OSN 500 equipment (48V/60V DC).....................................................3-6
Figure 3-3 Appearance of the OptiX OSN 500 equipment (110V/220V AC).....................................................3-6
Figure 3-4 System architecture.............................................................................................................................3-6
Figure 3-5 Slot layout...........................................................................................................................................3-7
Figure 3-6 Barcode on the ISU board..................................................................................................................3-8
Figure 3-7 Appearance of the external orderwire phone......................................................................................3-9
Figure 4-1 Principle block diagram of the SL1D board.......................................................................................4-4
Figure 4-2 Front panel of the SL1D board...........................................................................................................4-5
Figure 4-3 Principle block diagram of the SP3D board.......................................................................................4-8
Figure 4-4 Front panel of the SP3D board...........................................................................................................4-9
Figure 4-5 Principle block diagram of the PL3T board.....................................................................................4-13
Figure 4-6 Front panel of the PL3T board.........................................................................................................4-14
Figure 4-7 Principle block diagram of the EGT1 board.....................................................................................4-18
Figure 4-8 Front panel of the EGT1 board.........................................................................................................4-19
Figure 4-9 Principle block diagram of the EFS8 board......................................................................................4-24
Figure 4-10 Front panel of the EFS8 board........................................................................................................4-25
Figure 4-11 Principle block diagram of the ISU board......................................................................................4-31
Figure 4-12 Front panel of the ISU board..........................................................................................................4-32
Figure 4-13 Front view of the RJ-45 interface...................................................................................................4-33
Figure 5-1 Fiber-shared virtual trail protection....................................................................................................5-6
Figure 6-1 EPL service based on port..................................................................................................................6-2
Figure 6-2 EVPL service based on shared port....................................................................................................6-3
Figure 6-3 EVPL services based on the VLAN IDs............................................................................................6-3
Figure 6-4 EVPL services based on the QinQ.....................................................................................................6-3
Figure 6-5 EPLAN service...................................................................................................................................6-4
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Figures

OptiX OSN 500 STM-1/STM-4 Multi-Service CPE Optical


Transmission System
Product Description
Figure 6-6 EVPLAN services based on the QinQ................................................................................................6-5
Figure 6-7 EVPLAN services based on the VLAN............................................................................................. 6-5
Figure 6-8 Dynamic bandwidth adjustment by using LCAS...............................................................................6-6
Figure 6-9 VC group protection by using LCAS.................................................................................................6-7
Figure 6-10 Test frame function...........................................................................................................................6-9
Figure 6-11 Application of RMON in a network.................................................................................................6-9
Figure 9-1 Labels on the OptiX OSN 500............................................................................................................9-3

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Transmission System
Product Description

Tables

Tables
Table 1-1 Board provide.......................................................................................................................................1-2
Table 2-1 Service access capacity of the OptiX OSN 500...................................................................................2-3
Table 2-2 Service interfaces provided by the OptiX OSN 500............................................................................2-4
Table 2-3 NM interfaces and auxiliary interfaces provided by the OptiX OSN 500...........................................2-5
Table 3-1 Appearance and dimensions of the boards...........................................................................................3-7
Table 3-2 Fibers and cables supported by the OptiX OSN 500...........................................................................3-9
Table 4-1 Functions and features of the SL1D board...........................................................................................4-2
Table 4-2 Optical interfaces on the front panel of the SL1D board.....................................................................4-5
Table 4-3 Specifications of the optical interfaces on the SL1D board.................................................................4-6
Table 4-4 Functions and features of the SP3D board...........................................................................................4-7
Table 4-5 Interfaces on the front panel of the SP3D board................................................................................4-10
Table 4-6 Specifications of the electrical interfaces on the SP3D board...........................................................4-10
Table 4-7 Functions and features of the PL3T board.........................................................................................4-12
Table 4-8 Interfaces on the front panel of the PL3T board................................................................................4-14
Table 4-9 Specifications of the E3/T3 electrical interface.................................................................................4-15
Table 4-10 Functions and features of the EGT1 board......................................................................................4-16
Table 4-11 Interfaces on the front panel of the EGT1 board..............................................................................4-19
Table 4-12 Specifications of the electrical interfaces on the EGT1 board.........................................................4-20
Table 4-13 Functions and features of the EFS8 board ......................................................................................4-21
Table 4-14 Interfaces on the front panel of the EFS8 board...............................................................................4-25
Table 4-15 Specifications of the electrical interfaces.........................................................................................4-26
Table 4-16 Version description of the ISU board...............................................................................................4-27
Table 4-17 Functions and features of the ISU....................................................................................................4-28
Table 4-18 Description of the front panel of the ISU board...............................................................................4-33
Table 4-19 Description of the management and auxiliary interfaces of the ISU board.....................................4-34
Table 4-20 Description of the Ethernet interface of the ISU board....................................................................4-35
Table 4-21 Description of the optical interfaces of the ISU board.....................................................................4-35
Table 4-22 Description of the E1 interfaces of the ISU board...........................................................................4-35
Table 4-23 Main parameters for configuring the ISU board..............................................................................4-36
Table 4-24 Specifications of the STM-4 optical interface on the ISU board.....................................................4-36
Table 4-25 Specifications of the STM-1 optical interface on the ISU board.....................................................4-37
Table 4-26 Specifications of the E1 Interfaces...................................................................................................4-37
Table 4-27 Specifications of the 10M/100M Ethernet services.........................................................................4-38
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Tables

OptiX OSN 500 STM-1/STM-4 Multi-Service CPE Optical


Transmission System
Product Description
Table 5-1 Parameters of linear MSP.....................................................................................................................5-2
Table 5-2 Maximum number of MSP rings supported by the OptiX OSN 500...................................................5-4
Table 5-3 Parameters of MSP ring.......................................................................................................................5-4
Table 5-4 SNCP parameters.................................................................................................................................5-5
Table 7-1 Weight, dimensions, and power consumption of the OptiX OSN 500................................................7-2
Table 7-2 Power consumption and weight of the boards on the OptiX OSN 500...............................................7-2
Table 7-3 Clock features of the OptiX OSN 500.................................................................................................7-3
Table 7-4 Timing and synchronization performance of the clock of the OptiX OSN 500..................................7-3
Table 7-5 Equipment Reliability..........................................................................................................................7-3
Table 7-6 Safety certification that the OptiX OSN 500 has passed.....................................................................7-4
Table 7-7 Climate requirements for storage.........................................................................................................7-5
Table 7-8 Density requirements for mechanical active substances during storage..............................................7-5
Table 7-9 Density requirements for chemical active substances during storage..................................................7-6
Table 7-10 Requirements for mechanical stress during storage...........................................................................7-6
Table 7-11 Climate requirements for transportation............................................................................................7-7
Table 7-12 Density requirements for mechanical active substances during transportation.................................7-7
Table 7-13 Density requirements for chemical active substances during transportation.....................................7-8
Table 7-14 Requirements of mechanical stress for transportation.......................................................................7-8
Table 7-15 Requirements for temperature and humidity......................................................................................7-9
Table 7-16 Other climate requirements................................................................................................................7-9
Table 7-17 Density requirements for mechanical active substances during operation......................................7-10
Table 7-18 Density requirements for chemical active substances during operation..........................................7-10
Table 7-19 Requirements for mechanical stress during operation.....................................................................7-11
Table 8-1 ITU-T recommendations......................................................................................................................8-1
Table 8-2 IEEE standards.....................................................................................................................................8-2
Table 8-3 IETF standards.....................................................................................................................................8-3
Table 8-4 Environment related standards.............................................................................................................8-4
Table 8-5 Safety compliance related standards....................................................................................................8-4
Table 8-6 Protection related standards.................................................................................................................8-5
Table 9-1 Labels on the equipment......................................................................................................................9-2
Table 11-1 Loopback types supported by the ISU board...................................................................................11-1
Table 11-2 Loopback types supported by the SDH board..................................................................................11-1
Table 11-3 Loopback types supported by the ISU board...................................................................................11-1
Table 11-4 Loopback types supported by the Ethernet board............................................................................11-2
Table 12-1 Mapping relation between the service type and the setting of the C2 byte......................................12-2
Table 12-2 Mapping relation between the service type and the setting of the C2 byte......................................12-3
Table 12-3 Mapping relation between the service type and the setting of the V5 byte.....................................12-4
Table 12-4 Mapping relation between the service type and the setting of the V5 byte.....................................12-5

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Transmission System
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About This Document

About This Document


Purpose
This document describes the OptiX OSN 500 in terms of network application, functions,
hardware, software architecture, features, and technical specifications, and provides an overall
introduction to the OptiX OSN 500.

Related Versions
The following table lists the product versions related to this document.
Product Name

Product Version

OptiX OSN 500

V100R002

OptiX iManager T2000

V200R007C02

Intended Audience
This document is intended for:
l

Network planning engineers

Data configuration engineers

System maintenance engineers

Organization
This document consists of the following topics.

Issue 01 (2009-01-20)

Topic

Description

1 Overview

Describes the OptiX OSN 500 equipment, and the network


positioning and network application of the OptiX OSN 500.

2 Function

Describes the functions and features of the OptiX OSN 500.


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About This Document

Topic

Description

3 System
Architecture

Describes the software architecture and hardware structure of the


OptiX OSN 500.

4 Boards

Describes the OptiX OSN 500 in terms of function, principle, front


panel, ports, and technical specifications.

5 Protection

Describes the equipment level protection and network level


protection of the OptiX OSN 500.

6 Ethernet Features

Describes the Ethernet features of the OptiX OSN 500, including


the service application, service protection, and maintenance.

7 Technical
Specifications

Describes the technical specifications of the OptiX OSN 500,


including the specifications for the integrated equipment,
specifications for the system performance, and specifications for the
boards.

8 Compliant
Standards

Describes the standards with which the OptiX OSN 500 comply.

9 Labels

Describes the labels attached on the OptiX OSN 500, including the
safety label and laser label.

10 Indicators

Describes the indicators on the OptiX OSN 500 and their meanings.

11 Board Loopback
Types

Describes the loopback types supported by the OptiX OSN 500.

12 Board
Configuration
Parameters

Describes the various parameters that can be set for SDH boards,
PDH boards, data processing boards, and cross-connect and timing
boards through the T2000.

A Glossary

Lists the terms used in this document.

B Acronyms and
Abbreviations

Lists the acronyms and abbreviations used in this document.

Conventions
Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol

Description

DANGER

Indicates a hazard with a high level of risk, which if not


avoided, will result in death or serious injury.

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Symbol

About This Document

Description

WARNING

CAUTION

Indicates a hazard with a medium or low level of risk, which


if not avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation, which if not
avoided, could result in equipment damage, data loss,
performance degradation, or unexpected results.

TIP

Indicates a tip that may help you solve a problem or save


time.

NOTE

Provides additional information to emphasize or supplement


important points of the main text.

General Conventions
The general conventions that may be found in this document are defined as follows.
Convention

Description

Times New Roman

Normal paragraphs are in Times New Roman.

Boldface

Names of files, directories, folders, and users are in


boldface. For example, log in as user root.

Italic

Book titles are in italics.

Courier New

Examples of information displayed on the screen are in


Courier New.

Command Conventions
The command conventions that may be found in this document are defined as follows.

Issue 01 (2009-01-20)

Convention

Description

Boldface

The keywords of a command line are in boldface.

Italic

Command arguments are in italics.

[]

Items (keywords or arguments) in brackets [ ] are optional.

{ x | y | ... }

Optional items are grouped in braces and separated by


vertical bars. One item is selected.

[ x | y | ... ]

Optional items are grouped in brackets and separated by


vertical bars. One item is selected or no item is selected.

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Convention

Description

{ x | y | ... }*

Optional items are grouped in braces and separated by


vertical bars. A minimum of one item or a maximum of all
items can be selected.

[ x | y | ... ]*

Optional items are grouped in brackets and separated by


vertical bars. Several items or no item can be selected.

GUI Conventions
The GUI conventions that may be found in this document are defined as follows.
Convention

Description

Boldface

Buttons, menus, parameters, tabs, window, and dialog titles


are in boldface. For example, click OK.

>

Multi-level menus are in boldface and separated by the ">"


signs. For example, choose File > Create > Folder.

Keyboard Operations
The keyboard operations that may be found in this document are defined as follows.
Format

Description

Key

Press the key. For example, press Enter and press Tab.

Key 1+Key 2

Press the keys concurrently. For example, pressing Ctrl+Alt


+A means the three keys should be pressed concurrently.

Key 1, Key 2

Press the keys in turn. For example, pressing Alt, A means


the two keys should be pressed in turn.

Mouse Operations
The mouse operations that may be found in this document are defined as follows.

Action

Description

Click

Select and release the primary mouse button without moving


the pointer.

Double-click

Press the primary mouse button twice continuously and


quickly without moving the pointer.

Drag

Press and hold the primary mouse button and move the
pointer to a certain position.

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About This Document

Update History
Updates between document issues are cumulative. Therefore, the latest document issue contains
all updates made to previous issues.

Updates in Issue 01 (2009-01-20)


Initial formal release.

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OptiX OSN 500 STM-1/STM-4 Multi-Service CPE Optical


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1 Overview

Overview

About This Chapter


This topic describes the OptiX OSN 500 equipment, and the network positioning and network
application of the OptiX OSN 500.
1.1 Introduction to the OptiX OSN 500
The OptiX OSN 500 is new-generation optical transmission equipment, which is developed by
Huawei for the access layer.
1.2 Network Application
The OptiX OSN 500 is used at the access layer of the transmission network. It can provide
STM-1/STM-4 optical interfaces and forms the entire equipment group with the other access
layer equipment, thus optimizing the Huawei OptiX product series.
1.3 Networking Application
Except for the basic principles for planning a network, you need to plan a network according to
the NE type and networking mode supported by the OptiX OSN 500. The OptiX OSN 500 can
form a network alone or with Huawei SDH equipment or third-party transmission equipment.

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1-1

OptiX OSN 500 STM-1/STM-4 Multi-Service CPE Optical


Transmission System
Product Description

1 Overview

1.1 Introduction to the OptiX OSN 500


The OptiX OSN 500 is new-generation optical transmission equipment, which is developed by
Huawei for the access layer.
Figure 1-1 shows the appearance of the OptiX OSN 500.
Figure 1-1 Appearance of the OptiX OSN 500 (48 V/60 V DC power input)

Figure 1-2 Appearance of the OptiX OSN 500 (110 V/220 V AC power input)

The OptiX OSN 500 is case-shaped equipment with a height of 1 U, and provides three slots,
as shown in Figure 1-3.
Figure 1-3 Slot layout
Slot 3

Slot 4
Slot 2 (ISU)

The lower slot is an ISU slot, and the upper two slots are extended slots. The ISU slot houses a
functional board integrating the SCC unit, cross-connect unit, clock unit, tributary unit, line unit,
and data transparent transmission unit. The ISU board is available in multiple types depending
on the functions and access capacity provided by the OptiX OSN 500. The extended slots support
the line unit, tributary unit, and data unit. Table 1-1 provides the boards supported by the OptiX
OSN 500.
Table 1-1 Board provide
Board
ISU
board

1-2

TNH1ISU
A

Description

Supported Interface

Integrates the SCC unit,


cross-connect unit,
clock unit, tributary
unit, line unit, and data
transparent
transmission unit. The
interface impedance is
120 ohms.

2xSTM-1/4 optical
interfaces

21E1 electrical
interfaces

8FE electrical
interfaces

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Valid Slots
slot 2

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Transmission System
Product Description

Board

Description

Supported Interface

Integrates the SCC unit,


cross-connect unit,
clock unit, line unit, and
tributary unit. The
interface impedance is
120 ohms.

2xSTM-1/4 optical
interfaces

21E1 electrical
interfaces

Integrates the SCC unit,


cross-connect unit,
clock unit, tributary
unit, line unit, and data
transparent
transmission unit. The
interface impedance is
75 ohms.

2xSTM-1/4 optical
interfaces

21E1 electrical
interfaces

8FE electrical
interfaces

Integrates the SCC unit,


cross-connect unit,
clock unit, line unit, and
tributary unit. The
interface impedance is
75 ohms.

2xSTM-1/4 optical
interfaces

21E1 electrical
interfaces

TNH1SL1
D

2xSTM-1 optical
interface board

2xSTM-1 optical
interfaces

slots 3 and 4

TNH1PL3
T

3xE3/T3 electrical
interface board

3xE3/T3 electrical
interfaces

slots 3 and 4

TNH1SP3
D

42xE1 electrical
interface board

42E1 electrical
interfaces

slots 3 and 4

TNH1EG
T1

1xGE Ethernet
transparent
transmission board

1GE optical interface

slots 3 and 4

TNH1EFS
8

8xFE Ethernet switch


processing board

8FE electrical
interfaces

slots 3 and 4

TNH1ISU
B

TNH1ISU
C

TNH1ISU
D

Boards
in the
extende
d slots

1 Overview

Valid Slots
slot 2

slot 2

slot 2

1.2 Network Application


The OptiX OSN 500 is used at the access layer of the transmission network. It can provide
STM-1/STM-4 optical interfaces and forms the entire equipment group with the other access
layer equipment, thus optimizing the Huawei OptiX product series.
Figure 1-4 shows the position of the OptiX OSN 500 in the transmission network.

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Figure 1-4 Position of the OptiX OSN 500 in the transmission network
OptiX 10G (Metro5000)

OptiX OSN 9500

OptiX 10G (Metro5000)

Backbone
layer

OptiX 2500+ (Metro3000)

OptiX 2500+ (Metro3000)

Convergence
layer

OptiX 155/622H (Metro1000)

OptiX 155/622H (Metro1000)


Access
layer

OptiX OSN 500


OptiX OSN 500
OptiX Metro 100

OptiX Metro 100

Switching/
Base Station

Network
terminal unit

Ethernet

1.3 Networking Application


Except for the basic principles for planning a network, you need to plan a network according to
the NE type and networking mode supported by the OptiX OSN 500. The OptiX OSN 500 can
form a network alone or with Huawei SDH equipment or third-party transmission equipment.

Independent Networking
The OptiX OSN 500 can form a chain or ring network alone. See Figure 1-5 and Figure 1-6.
Figure 1-5 Chain network formed by the OptiX OSN 500 alone

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Figure 1-6 Ring network formed by the OptiX OSN 500 alone

STM-1/STM-4 ring

Hybrid Networking with OptiX Transmission Equipment


The OptiX OSN 500 can form a network with other transmission equipment, as shown in Figure
1-7.
Figure 1-7 Hybrid networking with third-party transmission equipment
OptiX 155/622H(Metro1000)

OptiX OSN 500

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2 Function

Function

About This Chapter


The OptiX OSN 500 can access and support multiple types of services.
2.1 Service Type
The OptiX OSN 500 supports various types of services and provides abundant functions and
features, to ensure the quality and efficiency of the service transmission.
2.2 Capacity
The service capacity of the OptiX OSN 500 consists of the cross-connect capacity and the
maximum access capacity.
2.3 Ports
The OptiX OSN 500 provides service interfaces, network management (NM) interfaces, and
auxiliary interfaces.
2.4 Protection Capability
The OptiX OSN 500 provides equipment level protection and network level protection.
2.5 Networking Capability
The OptiX OSN 500 can form multiple network topologies such as the ring network and chain
network.
2.6 DCN Features
The OptiX OSN 500 supports three communication protocols and transparent transmission of
the DCC through the external clock interface, thus implementing the data communication
network (DCN).
2.7 Clock Features
The OptiX OSN 500 supports various clock functions.
2.8 Ethernet Features
The OptiX OSN 500 provides layered protection for the Ethernet services, and supports all the
protection at the SDH layer and the Ethernet service layer.
2.9 OAM
The OptiX OSN 500 provides powerful equipment maintenance and administration functions
as follows:
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2 Function

OptiX OSN 500 STM-1/STM-4 Multi-Service CPE Optical


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2.10 Network Management System


The OptiX OSN 500 adopts the T2000 as the integrated NMS.
2.11 Various Types of Power Inputs
The OptiX OSN 500 supports various types of power inputs.

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2.1 Service Type


The OptiX OSN 500 supports various types of services and provides abundant functions and
features, to ensure the quality and efficiency of the service transmission.
The OptiX OSN 500 can access the following types of services:
l

SDH service signals

PDH service signals

Ethernet service signals

2.2 Capacity
The service capacity of the OptiX OSN 500 consists of the cross-connect capacity and the
maximum access capacity.
2.2.1 Cross-Connect Capacity
The OptiX OSN 500 supports the higher-order full cross-connections of 21.25 Gbit/s or lowerorder full cross-connections of 5 Gbit/s.
2.2.2 Maximum Access Capability
The OptiX OSN 500 can access services through various interfaces.

2.2.1 Cross-Connect Capacity


The OptiX OSN 500 supports the higher-order full cross-connections of 21.25 Gbit/s or lowerorder full cross-connections of 5 Gbit/s.
The cross-connect unit of the OptiX OSN 500 is integrated on the ISU board. The cross-connect
unit is a mandatory functional unit and provides the following functions:
l

Service grooming function of the ADM equipment

Higher-order full cross-connections of 21.25 Gbit/s or lower-order full cross-connections


of 5 Gbit/s

2.2.2 Maximum Access Capability


The OptiX OSN 500 can access services through various interfaces.
Table 2-1 provides the maximum access capacity of the equipment.
Table 2-1 Service access capacity of the OptiX OSN 500

Issue 01 (2009-01-20)

Service Type

Maximum Number of Services


Supported (channel)

STM-4 standard services

STM-1 standard services

E3/T3 services

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Service Type

Maximum Number of Services


Supported (channel)

E1 services

105

Fast Ethernet (FE) services

24

Gigabit Ethernet (GE) services

2.3 Ports
The OptiX OSN 500 provides service interfaces, network management (NM) interfaces, and
auxiliary interfaces.
2.3.1 Service Ports
The services interfaces include SDH service interfaces, PDH service interfaces, and Ethernet
service interfaces.
2.3.2 NM Ports and Auxiliary Ports
The OptiX OSN 500 provides various NM interfaces and auxiliary interfaces.

2.3.1 Service Ports


The services interfaces include SDH service interfaces, PDH service interfaces, and Ethernet
service interfaces.
Table 2-2 provides the service interfaces provided by the OptiX OSN 500.
Table 2-2 Service interfaces provided by the OptiX OSN 500
Port Type

Specification

Function

Connector
Type

SDH
interface

STM-1 optical interface: S-1.1,


L-1.1 and L-1.2

Used to input/output
STM-1 optical signals.

LC

STM-4 optical interface: S-4.1


and L-4.1

Used to input/output
STM-4 optical signals.

75-ohm/120-ohm E1 electrical
interface

Used to input/output E1
electrical signals.

Anea 96

75-ohm E3/T3 electrical


interface

Used to input/output E3/


T3 electrical signals.

SMB

10/100BASE-T(X)

Used to input/output
10M/100M Ethernet
electrical signals.

RJ-45

1000BASE-SX/LX

Used to input/output
1000M Ethernet optical
signals.

LC

PDH
interface

Ethernet
interface

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2.3.2 NM Ports and Auxiliary Ports


The OptiX OSN 500 provides various NM interfaces and auxiliary interfaces.
Table 2-3 provides the NM interfaces and auxiliary interfaces provided by the OptiX OSN 500.
Table 2-3 NM interfaces and auxiliary interfaces provided by the OptiX OSN 500
Port Type

Description

Function

Connector
Type

NM
interface

Network management
interface

Used to connect the network


management system (NMS), for
example, the OptiX iManager
T2000 (T2000).

RJ-45

Alarm
input/
output
interface

Three alarm input


interfaces and one alarm
output interface

Used to connect the external


integrated alarm device or
external environment monitor
device.

RJ-45

Clock
interface

Clock input/output
interface

Used to input/output one


external clock signal.

RJ-45

Auxiliary
interface

F2 transparent data
interface

Used to transmit one transparent


data service.

RJ-45

Local modem interface/


Remote NM interface

Used to provide one remote


maintenance interface that
supports the X.25 protocol.

RJ-45

DC power interface

Used to connect the 48 V/60


V DC power supply.

four-core socket

AC power interface

Used to connect the 110 V/220


V AC power supply.

Three-phase
socket

One orderwire phone


interface

Used to provide voice


communication for operation
engineers or maintenance
engineers at different
workstations.

RJ-11b

Power
interfacea

Orderwire
phone
interface

NOTE

aThe OptiX OSN 500 supports the DC power interface and AC power interface. Each set of the
OptiX OSN 500, however, provides one of the two power interfaces only.

bThe OptiX OSN 500 uses the external orderwire phone scheme. That is, the SYNC/PHONE
interface of the ISU board on the OptiX OSN 500 is connected to the RJ-11 interface of the external
orderwire phone.

2.4 Protection Capability


The OptiX OSN 500 provides equipment level protection and network level protection.
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The OptiX OSN 500 supports 1+1 backup for the internal power module and provides the
following network level protection modes for the accessed services:
l

1+1 and 1:N (N5) linear multiplex section protection (MSP)

Multiplex section protection ring (MSP ring)

Sub-network connection protection (SNCP)

2.5 Networking Capability


The OptiX OSN 500 can form multiple network topologies such as the ring network and chain
network.
The OptiX OSN 500 supports separate and combined configuration of the following types of
NEs: terminal multiplexer (TM) and add/drop multiplexer (ADM). The OptiX OSN 500 can
form a chain or ring network by using the STM-1/STM-4 optical interfaces.
When the OptiX OSN 500 functions as the access equipment, it can network with Huawei Metro
and OSN equipment series. The OptiX OSN 500 can also network with third-party equipment.

2.6 DCN Features


The OptiX OSN 500 supports three communication protocols and transparent transmission of
the DCC through the external clock interface, thus implementing the data communication
network (DCN).
Any of the following three methods can be adopted for the OptiX OSN 500 to transparently
transmit the operation, administration and maintenance (OAM) information on the third-party
equipment, or for the third-party equipment to transparently transmit the OAM information on
the OptiX OSN 500:
l

HWECC

IP over DCC

OSI over DCC

When the DCC bytes of the third-party equipment cannot be used for transmitting the OAM
information on the OptiX OSN 500, the external clock interface of the OptiX OSN 500 can be
used to transmit the OAM information.

2.7 Clock Features


The OptiX OSN 500 supports various clock functions.
The OptiX OSN 500 supports the following clock functions:

2-6

Support of the non-synchronization status message (SSM) protocol, standard SSM


protocol, and extended SSM clock protocol

Input/output of one 120-ohm external clock source

Line clock source

Tributary clock source


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Three working modes: trace, hold-over, and free-run

Tributary retiming

2 Function

2.8 Ethernet Features


The OptiX OSN 500 provides layered protection for the Ethernet services, and supports all the
protection at the SDH layer and the Ethernet service layer.
The OptiX OSN 500 supports Ethernet private line (EPL) services, Ethernet virtual private line
(EVPL) services, Ethernet private LAN (EPLAN) services, and Ethernet virtual private LAN
(EVPLAN) services. In addition, the OptiX OSN 500 supports various Ethernet protection,
operating, and maintenance functions.

2.9 OAM
The OptiX OSN 500 provides powerful equipment maintenance and administration functions
as follows:
l

Generates visual alarms to urge the network administrators to take proper measures in the
case of an emergency.

Provides the automatic laser shutdown (ALS) function for the SDH and Ethernet singlemode optical interfaces.

Provides the function to query the parameters of the optical modules.

Uses the pluggable optical module on the optical interface board. Users can choose singlemode or multi-mode optical modules as required. This facilitates the maintenance.

Provides the orderwire function. It provides special communication channel for


maintenance personnel of different NEs.

Provides comprehensive alarms and performance events. The NMS can be used to
dynamically monitor the running status and alarms of each NE on the network.

Supports in-service upgrade of board software and NE software. Board software and field
programmable gate array (FPGA) supports remote loading, and provides the functions of
error prevention loading and resumable download.

Supports the pseudo-random binary sequence (PRBS) test function and the remote bit error
test.

Provides the press-to-collect function to collect the data of the boards on a faulty NE. This
shortens the data collection time for the service restoration.

Provides the function to selectively collect the data of the board on a faulty NE as required.
The user can cancel the data collecting process manually.

The Ethernet board provides the OAM function, which can implement automatic fault
detection, fault location, and fault isolation.

Supports natural heat dissipation.

2.10 Network Management System


The OptiX OSN 500 adopts the T2000 as the integrated NMS.
The T2000 can implement the integrated management of the entire optical transmission system
and can also provide end-to-end management function if required. The T2000 improves the
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network quality and reduces maintenance costs, thus ensuring reasonable utilization of network
resources.

2.11 Various Types of Power Inputs


The OptiX OSN 500 supports various types of power inputs.
The types of power inputs supported by the OptiX OSN 500 are:

2-8

48 V/60 V DC power

110 V/220 V AC power

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3 System Architecture

System Architecture

About This Chapter


The system architecture of the OptiX OSN 500 is described from the following aspects: software
architecture and hardware structure.
3.1 Software Architecture
3.2 Hardware Structure
The equipment hardware consists of the chassis, board, and cables.

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3 System Architecture

3.1 Software Architecture


3.1.1 Overview
The software system is of a modular design. Each module provides specific functions and works
with other modules.
3.1.2 Communication Protocols
Complete protocol stack and messages of Qx interface are described in ITU-T G.773, Q.811 and
Q.812.
3.1.3 Board Software
The board software runs on each board and it manages, monitors and controls the operation of
the board.
3.1.4 NE Software
The NE software manages, monitors and controls the board operations in the NE. In addition,
the NE software functions as a communication service unit between the T2000 and the boards,
so that the T2000 can control and manage the NE.
3.1.5 Network Management System
The NM system implements a unified management over the optical transmission network, and
maintains all OSN, SDH, Metro, DWDM NE equipment in the network.

3.1.1 Overview
The software system is of a modular design. Each module provides specific functions and works
with other modules.
The entire software is distributed in three modules including board software, NE software and
NM system.
The software resides respectively on functional boards, the SCC, and NM computer. Hierarchical
structure ensures that it is highly reliable and efficient. Each layer performs specific functions
and provides service for the upper layer.
The system software architecture is shown in Figure 3-1.
In the diagram, all modules are NE software except "Network Management System" and "Board
Software".

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Figure 3-1 Software architecture


Network Management
System

High Level
Communication Module
Network side Module

Real-time
multi-task
operating
system

Equipment Management
Module

Database
Management
Module

Communication Module
NE software

Board Software

3.1.2 Communication Protocols


Complete protocol stack and messages of Qx interface are described in ITU-T G.773, Q.811 and
Q.812.
Qx interface is mainly used to connect mediation device (MD), Q adaptation (QA) and NE (NE)
equipment through local communication network (LCN).
At present, QA is provided by NE management layer. MD and operating system (OS) are
provided by NM layer. They are connected to each other through Qx interface.
According to the Recommendations, Qx interface provided by the system is developed on the
basis of TCP/IP connectionless network layer service (CLNS1) protocol stack.
In addition, to support remote access of the NM through Modem, IP layer uses serial line internet
protocol (SLIP).

3.1.3 Board Software


The board software runs on each board and it manages, monitors and controls the operation of
the board.
It receives the command issued from the NE software and reports the board status to the NE
software through performance events and alarm.
The specific functions include:
l

Alarm management

Performance management

Configuration management

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l

Communication management

It directly controls the functional circuits in corresponding boards and implements ITU-T
compliant specific functions of the NE.

3.1.4 NE Software
The NE software manages, monitors and controls the board operations in the NE. In addition,
the NE software functions as a communication service unit between the T2000 and the boards,
so that the T2000 can control and manage the NE.
According to ITU-T M.3010, NE software is at unit management layer in telecom management
network, performing NE function (NEF), partial mediation function (MF) and OS function at
network unit layer.
Data communication function (DCF) provides communication channel between NE and other
equipment (including NM and other NEs).
l

Real-time multi-task operating system


The NE software offers real-time multi-task operating system to manage public resources
and support application programs.
It isolates the application programs from the processor and provides an application program
execution environment, which is independent of the processor hardware.

Communication module
The communication module is the interface module between NE software and board
software.
According to related protocol, communication function between the NE software and the
board software is for information exchange and maintenance of the equipment.
Through the communication, board maintenance and operation commands from the NE
software are sent to the boards. On the other hand, the state, alarm and performance events
of the board are reported to the NE software.

Network side (NS) module


The NS module is between the communication module and the equipment management
module. It converts the data format between the user operation side (at the application layer)
and the NE equipment management layer, and provides security control for the NE layer.
Functionally, the NS module is divided into the following three submodules:

Qx interface module

Command line interface module

Security management module

Equipment management module


The equipment management module is the core of the NE software for the NE management.
It includes administrator and agent.
Administrator can send NM operation commands and receive events.
Agent can respond to the NM operation commands sent by the administrator, implement
the operations of the managed object, and send up events according to the change of status
of the managed object.

High-level communication module


The high-level communication module exchanges management information among NEs
and between the NM system and the NE.

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It consists of network communication module, serial communication module and ECC


communication module.
l

Database management module


The database management module is a part of the NE software.
It includes two independent parts: data and program.
The data are organized in the form of database, including network database, alarm database,
performance database and equipment database.
The program manages and accesses the data in the database.

3.1.5 Network Management System


The NM system implements a unified management over the optical transmission network, and
maintains all OSN, SDH, Metro, DWDM NE equipment in the network.
In compliance with ITU-T Recommendations, it is an NM system that integrates standard
management information model as well as object-oriented management technology.
It exchanges information with the NE software through the communication module to monitor
and manage the network equipment.
The NM software runs on a workstation or PC, managing the equipment and the transmission
network to help to operate, maintain and manage the transmission equipment.
The management functions of the NM software include:
l

Alarm management: collects, prompts, filters, browses, acknowledges, checks, clears, and
counts in real time; fulfills alarm insertion, alarm correlation analysis and fault diagnosis.

Performance management: sets performance monitoring; browses, analyzes and prints


performance data; forecasts medium-term and long-term performance; and resets
performance register.

Configuration management: configures and manages interfaces, clocks, services, trails,


subnets and time.

Security management: provides NM user management, NE user management, NE login


management, NE login lockout, NE setting lockout and local craft terminal (LCT) access
control of the equipment.

Maintenance management: provides loopback, board resetting, automatic laser shutdown


(ALS) and optical fiber power detection, and collects equipment data to help the
maintenance personnel in troubleshooting.

3.2 Hardware Structure


The equipment hardware consists of the chassis, board, and cables.
3.2.1 Chassis
The OptiX OSN 500 is a 1U chassis with two slot layers. It provides one slot for housing the
ISU board and two extended slots, which realizes the flexible configuration.
3.2.2 Board
The board is an important part of the equipment hardware.
3.2.3 External Component
The external component of the OptiX OSN 500 is the external orderwire phone.
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3.2.4 Fibers and Cables


The fibers and cables include the fibers, power cables, service cables, clock cables, alarm cables,
and management cables.

3.2.1 Chassis
The OptiX OSN 500 is a 1U chassis with two slot layers. It provides one slot for housing the
ISU board and two extended slots, which realizes the flexible configuration.
Figure 3-2 and Figure 3-3 show the appearance of the OptiX OSN 500.
Figure 3-2 Appearance of the OptiX OSN 500 equipment (48V/60V DC)

Figure 3-3 Appearance of the OptiX OSN 500 equipment (110V/220V AC)

3.2.2 Board
The board is an important part of the equipment hardware.

System Architecture
When the OptiX OSN 500 accesses hybrid services, the system architecture can be divided into
several parts according to function, as shown in Figure 3-4.
Figure 3-4 System architecture

3-6

PDH/ Ethernet
service unit

Overhead
processing unit

Cross-connect
unit

Line unit

STM-N
optical signal

Synchronous
timing unit

Clock unit

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PDH/ Ethernet
service

System control
and
communication
unit

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Slot Layout
The OptiX OSN 500 provides three slots for housing boards, as shown in Figure 3-5. The lower
slot houses the ISU board, and the upper two slots house the extended boards.
Figure 3-5 Slot layout
Slot 3

Slot 4
Slot 2 (ISU)

Appearance and Dimensions of the Boards


Table 3-1 shows the appearance and dimensions of the ISU and extended boards.
Table 3-1 Appearance and dimensions of the boards
Boa
rd
Na
me

Description

ISU
(for
exa
mple
,
TN
H1I
SUA
)

Ap
pea
ran
ce

Boar
ds in
the
exte
nded
slots
(for
exa
mple
,
SL1
D)

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Fu
ncti
on

Integrates the SCC unit, cross-connect unit, clock unit, tributary unit, line unit,
and data transparent transmission unit.

Di
me
nsi
ons

388.4 mm (width) x 197.7 mm (depth) x 19.8 mm (height)

Ap
pea
ran
ce

Fu
ncti
on

Provides 2xSTM-1 optical interfaces.

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Boa
rd
Na
me

Description

Di
me
nsi
ons

183.8 mm (width) x 197.7 mm (depth) x 19.8 mm (height)

Description of the Barcode on the Board


The following two types of barcodes are used for the boards of the OptiX OSN 500:
l

16-bit manufacturing code + Board version + Board name + Board feature code

20-bit manufacturing code + Board version + Board name + Board feature code

The barcode for the ISU board is located on the front panel, as shown in Figure 3-6 (considering
the barcode with the 16-bit manufacturing code as an example).
Figure 3-6 Barcode on the ISU board

0322541016000239-TNH1ISUA01

Last six numbers of the BOM code


Internal code
Board version
Board name
Board feature code

3.2.3 External Component


The external component of the OptiX OSN 500 is the external orderwire phone.
Figure 3-7 shows the appearance of the external orderwire phone.

3-8

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Figure 3-7 Appearance of the external orderwire phone

EOW
LINE

PHONE

POWER

3.2.4 Fibers and Cables


The fibers and cables include the fibers, power cables, service cables, clock cables, alarm cables,
and management cables.
Table 3-2 shows the fiber jumpers and cables used by the OptiX OSN 500.
Table 3-2 Fibers and cables supported by the OptiX OSN 500
Name

Connector Type

PGND

Power
cable

Four-core socket

Appearance

Three-phase socket

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Name

Connector Type

E1 cable
(75
ohms)

Anea 96

E3/T3
cable

SMB

Fiber
jumper

LC/PC

Ethernet
cable

RJ-45

Appearance

NM
cable

Clock
cable

RJ-45

Alarm
cable
Auxiliar
y cable

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Name

Connector Type

Orderwi
re phone
cable

RJ-11

3 System Architecture

Appearance

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Boards

About This Chapter


The OptiX OSN 500 supports boards of different types.
4.1 SL1D
The SL1D board is a 2xSTM-1 optical interface board.
4.2 SP3D
The SP3D board is a 42xE1 electrical interface board.
4.3 PL3T
The PL3T board is a 3xE3/T3 electrical interface board.
4.4 EGT1
The EGT1 board is a 1xGE transparent Ethernet transmission board.
4.5 EFS8 Board
The EFS8 board is an 8xFE switch processing board.
4.6 ISU
The ISU board integrates the SCC unit, cross-connect unit, clock unit, tributary unit, line unit,
and data transparent transmission unit.

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4.1 SL1D
The SL1D board is a 2xSTM-1 optical interface board.
4.1.1 Version Description
The SL1D board is available in only one version, that is, TNH1SL1D.
4.1.2 Functions and Features
The SL1D board is used to transmit and receive 2xSTM-1 optical signals, to perform O/E
conversion for the STM-1 signals, to extract or insert overhead bytes, and to report alarms that
are generated on the line.
4.1.3 Working Principle and Signal Flow
The SL1D board consists of the O/E conversion module, E/O conversion module, data clock
recovery module, SDH overhead processing module, logic control module, and power circuit.
4.1.4 Front Panel
The front panel of the SL1D board has indicators, interfaces, barcode, and laser safety class
label.
4.1.5 Valid Slots
The SL1D board can be inserted into slot 3 or slot 4.
4.1.6 References for Board Configuration
The parameters of the SL1D board can be set on the T2000.
4.1.7 Technical Specifications
The technical specifications of the SL1D board include the optical interface specifications, board
dimensions, weight, and power consumption.

4.1.1 Version Description


The SL1D board is available in only one version, that is, TNH1SL1D.

4.1.2 Functions and Features


The SL1D board is used to transmit and receive 2xSTM-1 optical signals, to perform O/E
conversion for the STM-1 signals, to extract or insert overhead bytes, and to report alarms that
are generated on the line.
Table 4-1 provides the functions and features of the SL1D board.
Table 4-1 Functions and features of the SL1D board

4-2

Function and
Feature

Description

Basic functions

Receives and transmits 2xSTM-1 optical signals.

Specifications of
the optical
interfaces

Provides standard S-1.1, L-1.1 and L-1.2 optical interfaces.

The optical interfaces comply with the ITU-T G.957


Recommendations.

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Function and
Feature

Description

Specifications of
the optical module

Supports detection and query of the information on the optical


module.

Supports the usage and detection of the pluggable SFP optical module
for easy maintenance.

The optical interface supports the function of setting the on/off state
of the laser and the ALS function.

Service processing

Supports the processing of the VC-12, VC-3, and VC-4 services.

Overhead
processing

Supports the processing of the SOH bytes of the STM-1 signals.

Supports the transparent transmission and termination of the POH


bytes.

Supports the setting and query of the J0, J1, and C2 bytes.

Alarm and
performance event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Protection scheme

Supports two-fiber unidirectional MSP ring.

Supports linear MSP.

Supports SNCP.

Supports inloop and outloop at a port or path level.

Supports warm reset and cold reset. The warm reset does not affect
services.

Supports the query of the manufacturing information on a board.

Supports in-service loading for the FPGA.

Maintenance
features

4.1.3 Working Principle and Signal Flow


The SL1D board consists of the O/E conversion module, E/O conversion module, data clock
recovery module, SDH overhead processing module, logic control module, and power circuit.
Figure 4-1 considers 1xSTM-1 signals as an example to show the working principle of the SL1D
board.

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Figure 4-1 Principle block diagram of the SL1D board


Backplane

O/E conversion

STM-1

STM-1

Data clock
recovery
module

Cross-connect unit
SDH
overhead
processing
module

O/E conversion

Cross-connect unit

Logical
control
module

SCC unit

Fuse
+3.3 V

+3.3 V
+3.3 V

In the Transmit Direction


The overhead processing module inserts the overhead bytes into the electrical signals received
from the cross-connect units and then transmits the signals to the E/O conversion module. The
E/O conversion module converts the received STM-1 electrical signals into STM-1 optical
signals, which are then transmitted through fibers.

In the Receive Direction


The O/E conversion module converts the received STM-1 optical signals into STM-1 electrical
signals and checks for the R_LOS alarm.
The data clock recovery module recovers the clock signals, and transmits the STM-1 electrical
signals along with the clock signals to the overhead processing module. The overhead processing
module checks for the R_LOF and R_OOF alarms.
The overhead processing module also extracts overhead bytes from the received STM-1 signals
and transmits the signals to the cross-connect unit through the backplane.

Logical Control Module


The logical control module traces the clock signals and frame header signals that are received
from the active or standby cross-connect board. This module controls the laser and passes
through the orderwire and ECC bytes between the two optical interface boards that form an
ADM. This module also selects clock signals, frame header signals, and service signals from
the active or standby cross-connect board.

Power Module
The power module provides all the board modules with the required DC voltages.
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4.1.4 Front Panel


The front panel of the SL1D board has indicators, interfaces, barcode, and laser safety class
label.

Front Panel Diagram


Figure 4-2 shows the appearance of the front panel of the SL1D board.

SL1D

CLASS1
LASER
PRODUCT

STAT
SRV
LOS1
LOS2

SL1D

Figure 4-2 Front panel of the SL1D board

TX1/RX1

TX2/RX2

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware status indicator (STAT), which is red or green when it is on

Service alarm indicator (SRV), which is red, green or yellow when it is on

LOS signal indicator of optical interface 1 (LOS1), which is red when it is on

LOS signal indicator of optical interface 2 (LOS2), which is red when it is on

For details of the board indicators, see 10 Indicators.

Interfaces
Two pairs of optical interfaces are present on the front panel of the SL1D board. Table 4-2
provides the type and functions of each optical interface.
Table 4-2 Optical interfaces on the front panel of the SL1D board
Interface

Connector Type

Function

TX1/RX1

LC

Transmits and receives the first


channel of optical signals.

TX2/RX2

LC

Transmits and receives the second


channel of optical signals.

4.1.5 Valid Slots


The SL1D board can be inserted into slot 3 or slot 4.

4.1.6 References for Board Configuration


The parameters of the SL1D board can be set on the T2000.
You can use the T2000 to set the following parameters for the SL1D board:
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l

J0 byte

J1 byte

C2 byte

For details of the parameters, see 12 Board Configuration Parameters.

4.1.7 Technical Specifications


The technical specifications of the SL1D board include the optical interface specifications, board
dimensions, weight, and power consumption.

Optical Interface Specifications


Table 4-3 provides the specifications of the optical interfaces on the SL1D board.
Table 4-3 Specifications of the optical interfaces on the SL1D board
Item

Value

Rate

155,520 kbit/s

Optical interface
type

S-1.1

L-1.1

L-1.2

Operating
wavelength
range (nm)

1261 to 1360

1263 to 1360

1480 to 1580

Launched power
range (dBm)

15 to 8

5 to 0

5 to 0

Minimum
extinction ratio
(dB)

8.2

10

10

Optical receiver
sensitivity
(dBm)

28

34

34

Minimum
overload optical
power (dBm)

10

10

Laser Safety Class


The safety class of the laser on the board is Class 1. The launched optical power of the optical
interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL1D board are as follows:
l

4-6

Board dimensions: 183.8 mm (width) x 197.7 mm (depth) x 19.8 mm (height)


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l

4 Boards

Weight: 0.3 kg

Power Consumption
At the normal temperature (25), the maximum power consumption of the SL1D board is 4.12
W.

4.2 SP3D
The SP3D board is a 42xE1 electrical interface board.
4.2.1 Version Description
The SP3D board is available in two versions, that is, TNH1SP3DA and TNH1SP3DB.
4.2.2 Functions and Features
The SP3D board is used to process E1 signals and overheads, to report alarms and performance
events, and to provide maintenance functions.
4.2.3 Working Principle and Signal Flow
The SP3D board consists of the interface module, encoding/decoding module, mapping/
demapping module, logical control module, and power module.
4.2.4 Front Panel
The front panel of the SP3D board has indicators and interfaces.
4.2.5 Valid Slots
The SP3D board can be inserted into slot 3 or slot 4.
4.2.6 References for Board Configuration
The parameters of the SP3D board can be set on the T2000.
4.2.7 Technical Specifications
The technical specifications of the SP3D board include the electrical interface specifications,
board dimensions, weight, and power consumption.

4.2.1 Version Description


The SP3D board is available in two versions, that is, TNH1SP3DA and TNH1SP3DB.

4.2.2 Functions and Features


The SP3D board is used to process E1 signals and overheads, to report alarms and performance
events, and to provide maintenance functions.
Table 4-4 provides the functions and features of the SP3D board.
Table 4-4 Functions and features of the SP3D board

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Function and
Feature

Description

Service processing

Accesses and processes 42xE1 signals.

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Function and
Feature

Description

Overhead
processing

Processes POH bytes at VC-12 levels, such as J2 and V5 bytes.

Alarm and
performance event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Maintenance
functions

Supports inloop and outloop at the electrical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.

Supports the query of the manufacturing information on a board.

Supports the PRBS function.

4.2.3 Working Principle and Signal Flow


The SP3D board consists of the interface module, encoding/decoding module, mapping/
demapping module, logical control module, and power module.
Figure 4-3 considers a channel of E1 signals as an example to show the working principle of
the SP3D board.
Figure 4-3 Principle block diagram of the SP3D board
Backplane

E1
Mapping

Decoding

Cross-connect unit

Interface
module
E1

Coding

Demapping

Logical
control unit

SCC unit

Fuse

+3.3 V
Power module
Power module

Cross-connect unit

-48 V/-60 V
-48 V/-60 V

Fuse
+3.3 V backup

In the Transmit Direction


The demapping module demaps the VC-4 signals received from the cross-connect unit, extracts
the binary data signals and clock signals, and transmits them to the encoder. The encoder encodes
the received signals and outputs E1 signals to the interface board.
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In the Receive Direction


The interface module accesses the E1 signals and transmits them to the decoder. The decoder
decodes the E1 signals, extracts the nonreturn-to-zero (NRZ) data signals and clock signals, and
transmits the signals to the mapping module.
The mapping module maps the received E1 signals into a C-12, and adds POH bytes to form a
VC-12. The pointers are then processed to form a TU-12, which is then multiplexed into a VC-4.
The VC-4 signals are then transmitted to the cross-connect unit.

Logical Control Module


The logical control module implements the communication between the SCC board and other
boards. This module reports the board information, alarms and performance events to the SCC,
and receives the configuration commands delivered by the SCC board.

Power Module
The power module provides all the board modules with the required voltages.

4.2.4 Front Panel


The front panel of the SP3D board has indicators and interfaces.

Front Panel Diagram


Figure 4-4 shows the appearance of the front panel of the SP3D board.

42
22

SP3D

21
STAT
SRV

SP3D

Figure 4-4 Front panel of the SP3D board

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware status indicator (STAT), which is red or green when it is on

Service alarm indicator (SRV), which is red, green or yellow when lit

For details of the board indicators, see 10 Indicators.

Interfaces
Two 75-ohm or 120-ohm Anea 96 interfaces are present on the front panel of the SP3D board.
Table 4-5 provides the type and functions of each interface.

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Table 4-5 Interfaces on the front panel of the SP3D board


Interface

Connector Type

Function

121

Anea 96

Transmits and receives the E1 signals


over channel 1 to channel 21.

2242

Anea 96

Transmits and receives the E1 signals


over channel 22 to channel 42.

4.2.5 Valid Slots


The SP3D board can be inserted into slot 3 or slot 4.

4.2.6 References for Board Configuration


The parameters of the SP3D board can be set on the T2000.
You can use the T2000 to set the following parameters for the SP3D board:
l

J2 byte

V5 byte

Tributary loopback

Service loading indication

For details of the parameters, see 12 Board Configuration Parameters.

4.2.7 Technical Specifications


The technical specifications of the SP3D board include the electrical interface specifications,
board dimensions, weight, and power consumption.

Electrical Interface Specifications


Table 4-6 provides the specifications of the electrical interfaces on the SP3D board.
Table 4-6 Specifications of the electrical interfaces on the SP3D board
Item

Value
TNH1SP3DA

4-10

Rate

2,048 kbit/s

Access capability

42xE1

Code pattern

HDB3

Connector

Anea 96

Interface
impedance

120 ohms

TNH1SP3DB

75 ohms

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Value
TNH1SP3DA

Rate at the output


interface

TNH1SP3DB

ITU-T G0.703 compliant

Permitted
frequency
deviation at the
input interface
Attenuation
tolerance at the
input interface
Input jitter
tolerance

Mechanical Specifications
The mechanical specifications of the SP3D board are as follows:
l

Board dimensions: 183.8 mm (width) x 197.7 mm (depth) x 19.8 mm (height)

Weight: 0.85 kg

Power Consumption
At the normal temperature (25), the maximum power consumption of the SP3D board is 11.5
W.

4.3 PL3T
The PL3T board is a 3xE3/T3 electrical interface board.
4.3.1 Version Description
The PL3T board is available in only one version, that is, TNH1PL3T.
4.3.2 Functions and Features
The PL3T board is used to process E3/T3 signals and overheads, to report alarms and
performance events, and to provide maintenance functions.
4.3.3 Working Principle and Signal Flow
The PL3T board consists the interface module, encoding/decoding module, mapping/demapping
module, logical control module, and power module.
4.3.4 Front Panel
The front panel of the PL3T board has indicators and interfaces.
4.3.5 Valid Slots
The PL3T board can be inserted into slot 3 or slot 4.
4.3.6 References for Board Configuration
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The parameters of the PL3T board can be set on the T2000.


4.3.7 Technical Specifications
The technical specifications of the PL3T board include the electrical interface specifications,
board dimensions, weight, and power consumption.

4.3.1 Version Description


The PL3T board is available in only one version, that is, TNH1PL3T.

4.3.2 Functions and Features


The PL3T board is used to process E3/T3 signals and overheads, to report alarms and
performance events, and to provide maintenance functions.
Table 4-7 provides the functions and features of the PL3T board.
Table 4-7 Functions and features of the PL3T board
Function and
Feature

Description

Service processing

Accesses and processes 3xE3/T3 signals.

Overhead
processing

Supports the setting and query of all POH bytes at the VC-3 level.

Alarm and
performance event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Maintenance
functions

Supports inloop and outloop at the electrical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.

Supports the query of the manufacturing information on a board.

Supports the PRBS function.

4.3.3 Working Principle and Signal Flow


The PL3T board consists the interface module, encoding/decoding module, mapping/demapping
module, logical control module, and power module.
Figure 4-5 considers a channel of E3/T3 signals as an example to show the working principle
of the PL3T board.

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Figure 4-5 Principle block diagram of the PL3T board


Backplane

E3/T3
Decoding

Mapping

Coding

Demapping

Cross-connect unit

Interface
module
E3/T3

Logical
control unit

Fuse
+3.3 V

Cross-connect unit

SCC unit

+3.3 V
+3.3 V

In the Transmit Direction


The demapping module demaps the electrical signals received from the cross-connect unit,
extracts the data signals and clock signals, and transmits the signals to the encoder. The encoder
encodes the signals and outputs E3/T3 signals. The signals are then transmitted to the interface
board through interfaces.

In the Receive Direction


The interface module accesses the E3/T3 signals and transmits them to the decoder. The decoder
decodes the E3/T3 signals, extracts the data signals and clock signals, and transmits the signals
to the mapping/demapping module.
The mapping module maps the received E3/T3 signals into a C-3, and adds POH to form a VC-3.
The pointers are then processed to form a TU-3, which is then multiplexed into a VC-4. The
VC-4 signals are then transmitted to the cross-connect unit.

Logical Control Module


The logical control module implements the communication between other boards and the SCC
board. This module reports the board information, alarms and performance events to the SCC,
and receives the configuration commands delivered by the SCC board.

Power Module
The power module provides all the board modules with the required voltages.

4.3.4 Front Panel


The front panel of the PL3T board has indicators and interfaces.
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Front Panel Diagram


Figure 4-6 shows the appearance of the front panel of the PL3T board.

PL3T

STAT
SRV

PL3T

Figure 4-6 Front panel of the PL3T board

TX1

RX1

TX2

RX3

TX3

RX3

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware status indicator (STAT), which is red or green when it is on

Service alarm indicator (SRV), which is red, green or yellow when lit

For details of the board indicators, see 10 Indicators.

Interfaces
Three pairs of electrical interfaces are present on the front panel of the PL3T board. Table 4-8
provides the type and functions of each interface.
Table 4-8 Interfaces on the front panel of the PL3T board
Interface

Connector Type

Function

TX1TX3

SMB

Transmits the E3/T3 signals over


channel 1 to channel 3.

RX1RX3

SMB

Receives the E3/T3 signals over


channel 1 to channel 3.

4.3.5 Valid Slots


The PL3T board can be inserted into slot 3 or slot 4.

4.3.6 References for Board Configuration


The parameters of the PL3T board can be set on the T2000.
You can use the T2000 to set the following parameters for the PL3T board:
l

J1 byte

C2 byte

Tributary loopback

Service loading indication

Path service type

For details of the parameters, see 12 Board Configuration Parameters.


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4.3.7 Technical Specifications


The technical specifications of the PL3T board include the electrical interface specifications,
board dimensions, weight, and power consumption.

Electrical Interface Specifications


Table 4-9 provides the specifications of the electrical interfaces on the PL3T board.
Table 4-9 Specifications of the E3/T3 electrical interface
Item

Value

ate

34,368 kbit/s or 44,736 kbit/s

Access capability

3xE3/T3

Code pattern

HDB3 (E3) or B3ZS (T3)

Connector

SMB

Interface
impedance

75 ohms

Rate at the output


interface

ITU-T G0.703 compliant

Permitted
frequency
deviation at the
input interface
Attenuation
tolerance at the
input interface
Input jitter
tolerance

G.823 compliant (E3)


G.824 compliant (T3)

Mechanical Specifications
The mechanical specifications of the PL3T board are as follows:
l

Board dimensions: 183.8 mm (width) x 197.7 mm (depth) x 19.8 mm (height)

Weight: 0.3 kg

Power Consumption
At the normal temperature (25), the maximum power consumption of the PL3T board is 4.2
W.

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4.4 EGT1
The EGT1 board is a 1xGE transparent Ethernet transmission board.
4.4.1 Version Description
The EGT1 board is available in only one version, that is, TNH1EGT1.
4.4.2 Functions and Features
The EGT1 board supports transparent transmission of Ethernet services, LCAS, and test frames.
4.4.3 Working Principle and Signal Flow
The EGT1 board consists of the interface module, service processing module, encapsulation and
mapping module, interface conversion module, communication and control module, and power
module.
4.4.4 Front Panel
The front panel of the EGT1 board has indicators and interfaces.
4.4.5 Valid Slots
The EGT1 board can be inserted into slot 3 or slot 4.
4.4.6 References for Board Configuration
The parameters for the EGT1 board can be set on the T2000.
4.4.7 Technical Specifications
The technical specifications of the EGT1 board includes the electrical interface specifications,
board dimensions, weight, and power consumption.

4.4.1 Version Description


The EGT1 board is available in only one version, that is, TNH1EGT1.

4.4.2 Functions and Features


The EGT1 board supports transparent transmission of Ethernet services, LCAS, and test frames.
Table 4-10 provides the functions and features of the EGT1 board.
Table 4-10 Functions and features of the EGT1 board

4-16

Function and
Feature

Description

Basic functions

Transparently transmits one channel of GE signals.

Interface
specifications

The 1000Base-SX/LX Ethernet optical interfaces support autonegotiation and comply with the IEEE 802.3z standards. The hotswappable SFP optical module used by the system supports a transmission
distance up to 0.5 km (multimode optical fibers used) or 10 km (singlemode optical fibers used).

Format of service
frames

Ethernet II, IEEE 802.3, or IEEE 802.1q/p

Supports a frame length ranging from 64 bytes to 9,600 bytes.

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Product Description

Issue 01 (2009-01-20)

4 Boards

Function and
Feature

Description

Maximum uplink
bandwidth

4xVC-4

VCTRUNK

Encapsulation
format

Supports HDLC, LAPS, and GFP-F.

Mapping mode

VC-3, VC-4, VC12-Xv (X 63), VC3-Xv (X 12), and VC4-Xv (X


4)

Ethernet service

Supports EPL.

MTU

Supports the setting of the packet length (ranging from 1,518 bytes to
9,600 bytes). After the new resetting takes effect, the permissible
maximum length of the packets accessed at the IP interface depends on
the MTU settings.

MPLS

Not supported

VLAN

Supports transparent VLAN transmission.

LPT

Supports point-to-point Link State Pass Through (LPT).

Multicast

Not supported

ETH-OAM

Supports the continuity check (CC) for the multicast services, loopback
(LB) test for the unicast services, network loopback detection (LD), link
trace (LT) test, auto-negotiation, fault diagnosis, and link performance
check.

CAR

Not supported

Flow control

Supports the GE port-based IEEE 802.3x flow control.

LCAS

Dynamically increases or decreases the bandwidth and realizes the


protection function, compliant with the ITU-T G.7042
Recommendations.

Ethernet test
frame

Supports the reception and transmission of Ethernet test frames.

Ethernet
performance
monitoring
(RMON)

Supports Ethernet performance monitoring at the port level.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

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4.4.3 Working Principle and Signal Flow


The EGT1 board consists of the interface module, service processing module, encapsulation and
mapping module, interface conversion module, communication and control module, and power
module.
Figure 4-7 shows the working principle of the EGT1 board.
Figure 4-7 Principle block diagram of the EGT1 board
Backplane

GE

GE

Interface
module

Service
processing
module

Cross-connect unit
Encapsulation
/mapping
module

Interface
conversion
module
Cross-connect unit

Communication
and control
module

+3.3 V

Power module

Power
module

Fuse

SCC unit

-48 V/-60 V
-48 V/-60 V

Fuse
+3.3 V backup

In the Transmit Direction


The cross-connect unit transmits signals to the encapsulation and mapping module through the
interface conversion module for demapping and decapsulation. The service processing module
determines the routes according to the service level of the equipment. The service processing
module delimitates the frames, adds the preamble code, computes the Cyclic Redundancy Check
(CRC) code, and collects statistics for the Ethernet performance. Finally, the interface
conversion module converts the parallel signals into series signals, encodes the signals, and
transmits the signals through an Ethernet interface.

In the Receive Direction


The interface module accesses the signals from an external Ethernet device, such as the Ethernet
switch and router. The interface module then decodes the signals and converts the series signals
into parallel signals. The service processing module then delimitates the frames, strips the
preamble code, terminates the CRC code, and collects statistics for the Ethernet performance.
The encapsulation module then encapsulates the Ethernet frames in the HDLC, LAPS, or GFPF format, transmits the frames to the mapping module, which then maps the frames. Finally, the
encapsulation module transmits the frames to the cross-connect unit through the interface
conversion module.

Communication and Control Module


The communication and control module provides the communication, control, and service
configuration functions of the board.
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Power Module
The power module provides all the board modules with the required voltages.

4.4.4 Front Panel


The front panel of the EGT1 board has indicators and interfaces.

Front Panel Diagram


Figure 4-8 shows the appearance of the front panel of the EGT1 board.

EGT1

EGT1

STAT
SRV
LINK
ACT
OPM

Figure 4-8 Front panel of the EGT1 board


CLASS1
LASER
PRODUCT

TX1/RX1

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware status indicator (STAT), which is red or green when it is on

Service alarm indicator (SRV), which is red, green or yellow when lit

Connection status indicator (LINK), which is green when it is on

Data receiving and transmission indicator (ACT), which is orange when it is on

Optical power indicator (OPM), which is red, green or yellow when lit

For details of the board indicators, see 10 Indicators.

Interfaces
One GE interface is present on the front panel of the EGT1 board. Table 4-11 provides the type
and functions of the interface.
Table 4-11 Interfaces on the front panel of the EGT1 board
Interface

Connector Type

Function

TX1/RX1

LC (pluggable)

Receives and transmits GE signals.

4.4.5 Valid Slots


The EGT1 board can be inserted into slot 3 or slot 4.

4.4.6 References for Board Configuration


The parameters for the EGT1 board can be set on the T2000.
You can use the T2000 to set the following parameters for the EGT1 board:
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l

Working mode

Enable LCAS

Maximum frame length

Mapping protocol

For details of the parameters, see 12 Board Configuration Parameters.

4.4.7 Technical Specifications


The technical specifications of the EGT1 board includes the electrical interface specifications,
board dimensions, weight, and power consumption.

Electrical Interface Specifications


Table 4-12 provides the specifications of the electrical interfaces on the EGT1 board.
Table 4-12 Specifications of the electrical interfaces on the EGT1 board
Item

Value

Optical interface type

1000BASE-LX (10 km)

1000BASE-SX (0.5 km)

Fiber type

LC single-mode fiber

LC multimode fiber

Launched power range


(dBm)

9 to 3

9.5 to 0

Operating wavelength
range (nm)

1270 to 1355

770 to 860

Minimum overload
optical power (dBm)

Optical receiver
sensitivity (dBm)

19

17

Minimum extinction
ratio (dB)

Laser Safety Class


The safety class of the laser on the EGT1 board is Class 1.

Mechanical Specifications
The mechanical specifications of the EGS1 board are as follows:

4-20

Board dimensions: 183.8 mm (width) x 197.7 mm (depth) x 19.8 mm (height)

Weight: 0.6 kg

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Power Consumption
At the normal temperature (25), the maximum power consumption of the EGT1 board is 9
W.

4.5 EFS8 Board


The EFS8 board is an 8xFE switch processing board.
4.5.1 Version Description
The EFS8 board is available in only one version, that is, TNH1EFS8.
4.5.2 Functions and Features
The EFS8 board supports the transparent transmission of the Ethernet service, LCAS, and test
frames.
4.5.3 Working Principle and Signal Flow
The EFS8 board consists of the interface module, service processing module, mapping/
demapping module, interface conversion module, communications and control module, and
power module.
4.5.4 Front Panel
The front panel of the EFS8 board has the indicators, and interfaces.
4.5.5 Valid Slots
The EFS8 board can be inserted in slot 3 or slot 4.
4.5.6 References for Board Configuration
The parameters of the EFS8 board can be set on the T2000.
4.5.7 Technical Specifications
The specifications of the EFS8 board include the specifications of the electrical interfaces,
dimensions, weight, and power consumption.

4.5.1 Version Description


The EFS8 board is available in only one version, that is, TNH1EFS8.

4.5.2 Functions and Features


The EFS8 board supports the transparent transmission of the Ethernet service, LCAS, and test
frames.
Table 4-13 provides the functions and features of the EFS8 board.
Table 4-13 Functions and features of the EFS8 board

Issue 01 (2009-01-20)

Function and
Feature

Description

Basic function

Processes 8xFE signals.

Standard for the


interface

10/100BASE-T(X), in compliance with IEEE802.3u.

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Function and
Feature

Description

Service frame
format

Ethernet II, IEEE 802.3, and IEEE 802.1q/p.

Supports a frame of 64 bytes to 9,600 bytes.

Maximum uplink
bandwidth

4xVC-4

VCTRUNK

Encapsulation
format

HDLC, LAPS, GFP-F

Mapping mode

VC-3, VC12-Xv (X 63), and VC3-Xv (X 12)

EPL

Supports transparent transmission based on port.

EVPL

Supports service transmission based on port.

Supports EVPL services based on port+VLAN.

Supports EVPL services based on QinQ.

Uses the frame encapsulation formats in compliance with IEEE 802.1q


and IEEE 802.1ad.

Supports convergence based on Layer 2 and point-to-multipoint


convergence.

Supports Layer 2 switch function. Supports service switch at the client


side and SDH side.

Supports the function of self-learning the source MAC address. The


length of the MAC address table is 16 KB. The aging time of the MAC
address can be set and queried.

Supports the configuration of static MAC routes.

Supports data isolation based on VB+VLAN.

Supports the creation, deletion, and query of the VB. The maximum
number of the VBs is 1. The maximum number of logical ports for each
VB is 16.

Supports data isolation based on VB+VLAN.

Supports EVPLAN services in compliance with IEEE 802.1q and


IEEE 802.1ad.

EPLAN

EVPLAN

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MTU

Supports the setting of packet length that ranges from 1518 bytes to 9600
bytes. After the setting takes effect, the maximum length of packets that
are transmitted to the ingress of the IP network is restricted.

MPLS

Not supported

VLAN

The transparent transmission of the VLAN is supported.

LPT

The LPT in P2P or P2MP mode is supported.

Multicast

Supported

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Function and
Feature

Description

ETH-OAM

Supports the continuity check (CC) test, unicast loopback (LB) test, link
trace (LT) test, network loop detect (LD), auto-negotiation function test,
fault diagnosis, and link performance test.

QoS

Supported

Flow control

The flow control based on port in compliance with IEEE 802.3x is


supported.

LCAS

In compliance with ITU-T G.7042, the LCAS function realizes the


dynamic increase/decrease, and protection of the bandwidth.

Ethernet test
frame

Supported.

Port mirror

Supported

LAG

Supported

STP/RSTP

Supported

Ethernet
performance
monitoring
(RMON)

The RMON at the port level is supported.

Alarm and
performance
event

Provides various alarms and performance events to easily manage and


maintain the equipment.

4.5.3 Working Principle and Signal Flow


The EFS8 board consists of the interface module, service processing module, mapping/
demapping module, interface conversion module, communications and control module, and
power module.
Figure 4-9 considers a channel of FE signals as an example to show the working principle of
the EFS8 board.

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Figure 4-9 Principle block diagram of the EFS8 board


Backplane

FE
Interface
module

Service
processing
module

Cross-connect unit
Encapsulation
/Mapping
module

Interface
conversion
module

FE

Cross-connect unit

Communication
and control
module

+3.3 V
Power
module

Power
module

Fuse

SCC unit

-48 V/-60 V
-48 V/-60 V

Fuse
+3.3 V backup

In the Transmit Direction


The cross-connect unit transmits signals to the encapsulation and mapping module through the
interface conversion module for demapping and decapsulation. The service processing module
determines the service routes according to the equipment level, and classifies the flow according
to the service type and configuration requirements. Then, the service processing module
performs frame delimitation, preamble adding, CRC code computing, and Ethernet performance
count. Finally, the interface conversion module converts the parallel signals to series signals,
and transmits the series signals through an Ethernet interface.

In the Receive Direction


After accessing the Ethernet signals from external Ethernet equipment (for example, an Ethernet
switch and a router), the Ethernet interface module decodes the signals, and then coverts serial
signals to parallel signals. Then, the service processing module aligns the frames, strips the
preamble code, terminates the cyclic redundancy check (CRC) code and performs the statistics
for the Ethernet performance. The service processing module also classifies the flow according
to service type and configuration requirement. The packets in the IEEE 802.1q-compliant and
IEEE 802.1ad-compliant formats are supported. In addition, the service processing module adds
CVlan and SVlan tags for mapping and forwarding the services. Then, the encapsulation module
encapsulates the Ethernet frames in the HDLC, LAPS, or GFP-F format, transmits the frames
to the mapping/demapping module, which then maps the frames. Finally, the encapsulation
module transmits the frames to the cross-connect unit through the interface conversion module.

Communication and Control Module


The communication and control module provides the communication, control, and service
configuration functions of the board.

Power Module
The power module provides the voltages required by all the modules of the board.
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4.5.4 Front Panel


The front panel of the EFS8 board has the indicators, and interfaces.

Front Panel Diagram


Figure 4-10 shows the appearance of the front panel of the EFS8 board.

EFS8

STAT
PROG
SRV

EFS8

Figure 4-10 Front panel of the EFS8 board

Indicator
The following indicators are present on the front panel of the board:
l

Board hardware status indicator (STAT), which is green or red when it is on

Board software status indicator (PROG), which is green or red when it is on

Alarm indicator (SRV), which is red, green, or yellow when it is on

Connection status indicator, which is green when it is on. This indicator is located above
the RJ-45 connector

Data transceiving indicator, which is orange when it is on. This indicator is located above
the RJ-45 connector

For details of the board indicators, see 10 Indicators.

Interface
There are eight FE electrical interfaces on the front panel of the EFS8 board. Table 4-14 provides
the types and functions of the interfaces.
Table 4-14 Interfaces on the front panel of the EFS8 board
Interface

Connector Type

Function

14

RJ-45

Transmits and receives FE signals


over channel 1 to channel 4.

58

RJ-45

Transmits and receives FE signals


over channel 5 to channel 8.

4.5.5 Valid Slots


The EFS8 board can be inserted in slot 3 or slot 4.

4.5.6 References for Board Configuration


The parameters of the EFS8 board can be set on the T2000.
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You can set the following parameters for the EFS8 board on the T2000:
l

Working mode

Enabling LCAS

Maximum frame length

Mapping protocol

For details of the parameters, see 12 Board Configuration Parameters.

4.5.7 Technical Specifications


The specifications of the EFS8 board include the specifications of the electrical interfaces,
dimensions, weight, and power consumption.

Specifications of the Electrical Interfaces


Table 4-15 provides the specifications of the electrical interfaces on the EFS8 board.
Table 4-15 Specifications of the electrical interfaces
Item

Value

Type of the
Connector

10/100BASE-T(X)

Rate

10 Mbit/s, 100 Mbit/s

Code pattern

Manchester Encoding signal (10 Mbit/s) or MLT-3 encoding signal (100


Mbit/s)

Connector

RJ-45

Standard for the


interface

In compliance with IEEE 802.3u

Mechanical Specifications
The mechanical specifications of the EFS8 board are as follows:
l

Board dimensions: 183.8mm (width) x 197.7 mm (depth) x 19.8 mm (height)

Weight: 0.65 kg

Power Consumption
At the normal temperature (25C), the maximum power consumption of the EFS8 board is 12
W.

4.6 ISU
The ISU board integrates the SCC unit, cross-connect unit, clock unit, tributary unit, line unit,
and data transparent transmission unit.

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4.6.1 Version Description


The ISU board is available in four types: type A, type B, type C, and type D. The differences
among the four types are the support of the Ethernet interface, and the impedance of the E1
interface.
4.6.2 Functions and Features
The ISU board integrates the SCC, cross-connect (XC) unit, clock synchronous timing generator
(STG) unit, STM-1/STM-4 line unit, 10M/100M Ethernet unit, and E1 tributary unit.
4.6.3 Working Principle and Signal Flow
The ISU board consists of the SCC unit, cross-connect unit, clock unit, line unit, E1/Ethernet
service unit, auxiliary data interface, and power module.
4.6.4 Front Panel
The front panel of the ISU board has the indicators, interfaces, barcode, and laser safety class
label.
4.6.5 Valid Slots
The ISU board can be installed only in slot 2 (namely, the ISU slot).
4.6.6 References for Board Configuration
The parameters of the ISU board can be set on the T2000.
4.6.7 Technical Specifications
The specifications of the ISU board contain the specifications of the optical interfaces,
specifications of the PDH electrical interfaces, specifications of the Ethernet services, and the
dimensions, weight, and power consumption of the boards.

4.6.1 Version Description


The ISU board is available in four types: type A, type B, type C, and type D. The differences
among the four types are the support of the Ethernet interface, and the impedance of the E1
interface.
Table 4-16 provides the version description of the ISU board.
Table 4-16 Version description of the ISU board

Issue 01 (2009-01-20)

Board
Version

Supported Interface

TNH1ISU
A

2xSTM-1/4 optical interfaces

21E1 electrical interfaces

8FE electrical interfaces

TNH1ISU
B

2xSTM-1/4 optical interfaces

21E1 electrical interfaces

TNH1ISU
C

2xSTM-1/4 optical interfaces

21E1 electrical interfaces

8FE electrical interfaces

Supported
Electrical
Interface
Impedance

Supported
Optical Interface
Type

120 ohms

S-1.1, L-1.1, S-4.1,


L-4.1and LC

120 ohms

75 ohms

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Board
Version

Supported Interface

TNH1ISU
D

2xSTM-1/4 optical interfaces

21E1 electrical interfaces

Supported
Electrical
Interface
Impedance

Supported
Optical Interface
Type

75 ohms

4.6.2 Functions and Features


The ISU board integrates the SCC, cross-connect (XC) unit, clock synchronous timing generator
(STG) unit, STM-1/STM-4 line unit, 10M/100M Ethernet unit, and E1 tributary unit.
Table 4-17 provides the functions and features of the ISU board.
Table 4-17 Functions and features of the ISU
Function and
Feature

Description

Cross-connect
function

Supports the higher-order full cross-connections of 21.25 Gbit/s or


lower-order full cross-connections of 5 Gbit/s.

Supports cross-connections at the VC-4/VC-3/VC-12 level, thus


ensuring that the services can be groomed from line to line, from line
to tributary, and from tributary to tributary.

Provides two STM-1/STM-4 optical interfaces. The STM-1 optical


interfaces are displayed as the SL1D and the STM-4 optical interfaces
are displayed as the SL4D on the T2000.

Provides two synchronous timing sources for the clock unit.

Processes the section overheads and higher order path overheads.

Supports K-byte reporting, transmission and pass-through.

Provides the transparent data communication channel (DCC).

Supports the setting and querying of the J0/J1/C2 byte.

Processes AU pointers.

Supports VC-4 inloop and outloop, test of the received/transmitted


overhead bytes, test of the K-byte pass-through, and verification.

Line function

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Function and
Feature

Description

Specifications of
the optical module

The STM-4 optical interfaces are standard S-4.1 or L-4.1 optical


interfaces.

The STM-1 optical interfaces are standard S-1.1 or L-1.1 optical


interfaces.

All the optical interfaces comply with ITU-T G.957.

The optical interfaces apply the SFP optical modules and supports
the use and monitoring of the SFP modules, thus facilitating the
maintenance of the optical modules.

The optical interfaces support the function of setting the on/off state
of the laser and the ALS function.

Supports the detection and querying of the information on the optical


module.

Supports the access of 21xE1 signals at the 75/120 interfaces ohm.

Supports asynchronous mapping of E1 signals into VC-12s.

Processes the VC-12 path overheads, configures each service


channel, monitors alarms and performance events of each service
channel, and communicates with the SCC unit.

Supports inloop and outloop to test the quality of E1 services or locate


the fault, thus facilitating the maintenance.

Provides two synchronous clock sources for the clock unit.

Provides eight 10M/100M Ethernet interfaces, which are displayed


as the EFT8 on the T2000.

Supports the generic framing procedure (GFP), link access


procedure-SDH (LAPS) and high level data link control (HDLC)
encapsulation protocols. The encapsulation and mapping
granularities are VC-12s and VC-3s.

Supports Ethernet private line (EPL) transparent transmission


services.

Supports auto-negotiation and 10M/100M full-duplex


communication.

Supports link capacity adjustment scheme (LCAS) and link state pass
through (LPT) functions.

Supports the Ethernet test frame function and remote network


monitoring (RMON) function.

Tributary function

Data function

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Function and
Feature

Description

Clock function

Supports the non-SSM protocol, standard SSM protocol, and


extended SSM protocol.

Provides the synchronization clock required by each board of the


system.

Supports the three working modes: trace, hold-over, and free-run.

Supports the control of the clock source priority levels.

Supports the control of the clock source switching function.

Processes and sets the S1 byte.

Provides two 2048 KHZ or 2048 kbit/s external clock interfaces, of


which the impedance is 120 ohms.

Orderwire
interface

Provides one orderwire interface.

Function of the
SCC

Exchanges information with other boards to configure the equipment


data and collect the performance and alarm data.

Provides the standard Ethernet NM interface and RS-232 data


terminal equipment (DTE) interface, to realize management over the
equipment on the T2000.

Alarm and
performance event

Provides abundant alarms and performance events to facilitate


management and maintenance of the equipment.

Protection scheme

Supports two-fiber unidirectional MSP ring.

Supports two-fiber bidirectional MSP ring.

Supports linear MSP.

Supports SNCP.

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.

Supports the querying of the manufacturing information on the


boards.

Supports the in-service upgrade of the FPGA.

Supports the upgrading of the board software without affecting


services.

Maintenance
feature

4.6.3 Working Principle and Signal Flow


The ISU board consists of the SCC unit, cross-connect unit, clock unit, line unit, E1/Ethernet
service unit, auxiliary data interface, and power module.
Figure 4-11 shows the principle block diagram of the ISU board.

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Figure 4-11 Principle block diagram of the ISU board


Backplane
Extended board
E1 service
processing
unit

STM-1/4 optical signal


Cross-connect
unit

Line
unit

1xF2 transparent data interface


3xinput/1xoutput interface
1xorderwire phone interface

Auxiliary
data
interface

Clock
unit

Ethernet
service
processing
unit

SCC
unit

E1

FE

Other units

120 -ohm clock input/output interface

Other units
+3.3V

Power
module

Fuse

-48 V/-60 V
-48 V/-60 V
+3.3 V backup

SCC Unit
The SCC unit implements the synchronous equipment management function (SEMF) and
message communication function (MCP), and thus plays an important role in the system.
The SCC unit provides Qx and F interfaces for the management of SDH networks, such as
Ethernet and X.25 network. The unit receives the control and configuration data of all units from
the PC or workstation through these interfaces. It also provides DCC communication function
and thus can communicate with the remote NE.
In addition, the SCC unit communicates with various boards to monitor alarms of the boards
and to collect the performance parameters, and periodically transmits the data to the T2000.

Cross-Connect Unit
The cross-connect unit is the core for service grooming. The cross-connect unit can implement
the cross-connections between line and line, between line and tributary, and between tributary
and tributary within the OptiX OSN 500. The cross-connect unit supports the higher-order full
cross-connections of 21.25 Gbit/s or lower-order full cross-connections of 5 Gbit/s.
The cross-connect unit can flexibly add/drop tributary services and groom VC-12/VC-3/VC-4
services. It supports SNCP, TM or ADM configuration, and various network topologies such as
the point-to-point, chain, ring, and hybrid networks.

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Clock Unit
The clock unit locks the external clock source for system synchronization, and provides the
synchronization clock for functional units such as the line unit, tributary unit, and external clock
interface.
The clock unit may input/output a 2 MHz or 2 Mbit/s external clock. When the external clock
interface is used for DCC transparent transmission, the clock unit needs to be set to the 2 Mbit/
s mode.

Auxiliary Data Port


The auxiliary data interface is mainly used to implement part of the overhead access function
(OAF) and the DCC processing function of the MCF.
The auxiliary data interface provides one F2 transparent data interface, three alarm input
interfaces, one alarm output interface, and one orderwire interface.

Line Unit
The line unit can access two STM-1/STM-4 signals for serial/parallel conversion, clock
extraction, data restoration, overhead processing, and alarm monitoring and reporting. The line
unit also supports the signal inloop and outloop, MSP, and ALS functions.

E1 Service Processing Unit


The E1 tributary unit supports the access of 21xE1 (75-ohm or 120-ohm) services. It includes
the following modules: E1 interface circuit, coding/decoding, frame header insertion/extraction,
mapping/demapping, and logical control modules.

Ethernet Service Processing Unit


The Ethernet service unit supports the access of 8x10M/100M Ethernet service signals.

Power Module
The power module feeds DC power with the required voltage to all modules of the board.

4.6.4 Front Panel


The front panel of the ISU board has the indicators, interfaces, barcode, and laser safety class
label.

Front Panel Diagram


Figure 4-12 considers the TNH1ISUA board as an example to show the appearance of the front
panel of the ISU board.
Figure 4-12 Front panel of the ISU board
2

CLASS 1
LASER
PRODUCT

RST SYNC/PHONE F2/COM

ALARM

ETHERNET

TX1/RX1

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TX2/RX2

ISU

ISU

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RUN
ALM
LOS1
LOS2

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Table 4-18 Description of the front panel of the ISU board


No.

Silkscreen

Description

RST

Resetting button. You can perform a warm


reset on the ISU board by pressing this button.

SYNC/PHONE

One 120-ohm external clock input/output


interface, which can be used for DCC
transparent transmission.

One orderwire phone interface

F2/COM

One F2 transparent data interface,


commissioning serial interface, and X.25
interface.

ALARM

Three alarm input interfaces and one alarm


output interface.

ETHERNET

NM interface.

14

First to fourth FE interface.

58

Fifth to eighth FE interface.

TX1/RX1, TX2/RX2

Two STM-1 or STM-4 optical interfaces.

121

21xE1 interfaces, Anea 96 connector, 75ohm/120-ohm.

Indicators
The following indicators are present on the front panel of the board:
l

Running status indicator (RUN), which is green when it is on

Alarm indicator (ALM), which is red when it is on

Optical interface 1 LOS signal indicator (LOS1), which is red when it is on

Optical interface 2 LOS signal indicator (LOS1), which is red when it is on

For details of the board indicators, see 10 Indicators.

Interfaces
Figure 4-13 shows the front view of the management and auxiliary interfaces of the ISU board.
Table 4-19 provides the description of the interfaces.
Figure 4-13 Front view of the RJ-45 interface

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Table 4-19 Description of the management and auxiliary interfaces of the ISU board
Interface

Pin No.

Function

SYNC/PHONE

Undefined

Undefined

Input of the external clock

Orderwire signal 1

Orderwire signal 2

Input of the external clock

Output of the external clock

Output of the external clock

DTR signal of the modem

Data receiving over the broadcast


transparent data interface

Data transmission over the broadcast


transparent data interface

Signal ground

Data receiving over the X.25 interface

Data transmission over the X.25 interface

Data receiving over the commissioning


serial interface

Data transmission over the


commissioning serial interface

Alarm input 1 (+)

Alarm input 1 ()

Alarm input 2 (+)

Alarm input 2 ()

Alarm input 3 (+)

Alarm input 3 ()

Alarm output 1 (+)

Alarm output 1 ()

Output of the differential signal (+)

Output of the differential signal output ()

Input of the differential signal (+)

F2/COM

ALARM

ETHERNET

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Interface

4 Boards

Pin No.

Function

Input of the differential signal ()

4, 5, 7, and 8

Undefined

Figure 4-13 shows the front view of the Ethernet interface of the ISU board. Table 4-20 provides
the description of the Ethernet interfaces.
Table 4-20 Description of the Ethernet interface of the ISU board
Interface

Pin No.

Function

14 and 58

Transmission (+)

Transmission ()

Receiving (+)

Grounding

Grounding

Receiving ()

Grounding

Grounding

Table 4-21 provides the description of the optical interfaces of the ISU board.
Table 4-21 Description of the optical interfaces of the ISU board
Interface

Connector Type

Function

TX1/RX1

LC

Used to input/output 1xSTM-1/STM-4 optical


signal.

TX2/RX2

LC

Used to input/output 2xSTM-1/STM-4 optical


signals.

Table 4-22 provides the description of the E1 interfaces of the ISU board.
Table 4-22 Description of the E1 interfaces of the ISU board

Issue 01 (2009-01-20)

Interface

Connector Type

Function

121

Anea 96

Receives and transmits E1 signals over channel


1 to channel 21.

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4.6.5 Valid Slots


The ISU board can be installed only in slot 2 (namely, the ISU slot).

4.6.6 References for Board Configuration


The parameters of the ISU board can be set on the T2000.
Table 4-23 provides the main parameters that need to be set during the configuration of the ISU
board.
Table 4-23 Main parameters for configuring the ISU board
Parameter

Description

Clock source priority

The OptiX OSN 500 can be configured with the external clock
source, line clock source, tributary clock source, and internal clock
source. The priority levels of the clock sources are determined
according to the actual networking mode.

Revertive mode of the


clock source

Automatic revertive/Non-automatic revertive

Clock ID

115

Broadcast data
interface

Setting one broadcast data source and broadcast data sink for any
one of serial1serial4

Input voltage

Setting the normal voltage, overvoltage, and undervoltage of the


two power supplies

4.6.7 Technical Specifications


The specifications of the ISU board contain the specifications of the optical interfaces,
specifications of the PDH electrical interfaces, specifications of the Ethernet services, and the
dimensions, weight, and power consumption of the boards.

Specifications of the Optical Interfaces


Table 4-24 provides the description of the STM-4 optical interface of the ISU board.
Table 4-24 Specifications of the STM-4 optical interface on the ISU board

4-36

Item

Value

Rate

622080 kbit/s

Type of the connector

S-4.1

L-4.1

Operating wavelength
range (nm)

1274 to 1356

1280 to 1335

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Item

Value

Launched power range


(dBm)

15 to 8

3 to +2

Minimum extinction
ratio (dB)

8.2

10

Optical receiver
sensitivity (dBm)

28

28

Minimum overload
optical power (dBm)

Table 4-25 provides the description of the STM-1 optical interface of the ISU board.
Table 4-25 Specifications of the STM-1 optical interface on the ISU board
Item

Value

Rate

155520 kbit/s

Type of the connector

S-1.1

L-1.1

Operating wavelength
range (nm)

1261 to 1360

1263 to 1360

Launched power range


(dBm)

15 to 8

5 to 0

Minimum extinction
ratio (dB)

8.2

10

Optical receiver
sensitivity (dBm)

28

34

Minimum overload
optical power (dBm)

10

Specifications of the PDH Electrical Interfaces


Table 4-26 provides the description of the E1 interface of the ISU board.
Table 4-26 Specifications of the E1 Interfaces

Issue 01 (2009-01-20)

Item

Value

Rate

2048 kbit/s

Access capacity

21xE1

Code pattern

HDB3
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Item

Value

Connector

Anea96

Interface impedance

75 ohms/120 ohms

Bit rate at the output interface

In compliance with ITU-T G.703

Permitted frequency deviation at the input


interface
Permitted attenuation at the input interface

Specifications of the Ethernet Services


Table 4-27 provides the description of the Ethernet service interface of the ISU board.
Table 4-27 Specifications of the 10M/100M Ethernet services
Item

Value

Type of the Connector

10/100BASE-T(X)

Rate

10 Mbit/s, 100 Mbit/s

Code pattern

Manchester Encoding signal (10 Mbit/s) or


MLT-3 encoding signal (100 Mbit/s)

Connector

RJ-45

Standard for the interface

In compliance with IEEE 802.3u

Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum output optical power of the
optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the ISU board are as follows:
l

Board dimensions: 388.4 mm (width) x 197.7 mm (depth) x 19.8 mm (height)

Weight: 1.12 kg

Power Consumption
At the normal temperature (25C), the maximum power consumption of the ISU board is 21.3
W.

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5 Protection

Protection

About This Chapter


The OptiX OSN 500 supports equipment level protection and network level protection.
5.1 Equipment Level Protection
The OptiX OSN 500 supports 1+1 equipment level protection for the input power.
5.2 Network Level Protection
The OptiX OSN 500 supports network level protection modes, including MSP, SNCP, and fibershared virtual trail protection.

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5 Protection

5.1 Equipment Level Protection


The OptiX OSN 500 supports 1+1 equipment level protection for the input power.
The PIU board of the OptiX OSN 500 can access two 48 V/60 V DC power supplies at the
same time. The two power supplies function as backup for each other. When one power supply
fails, the other power supply still works normally.

5.2 Network Level Protection


The OptiX OSN 500 supports network level protection modes, including MSP, SNCP, and fibershared virtual trail protection.
5.2.1 MSP
The OptiX OSN 500 supports 1+1 MSP, 1:N (N5)MSP, two-fiber unidirectional MSP ring,
and two-fiber bidirectional MSP ring.
5.2.2 SNCP
The OptiX OSN 500 supports 512 VC-12 SNCP protection groups.
5.2.3 Fiber-Shared Virtual Trail Protection
In the fiber-shared virtual trail protection mode, the STM-1/STM-4 optical path is logically
divided into multiple lower order or higher order paths, and different protection modes (for
example, MSP, SNCP, and non-protection) are set for the path-level loops.

5.2.1 MSP
The OptiX OSN 500 supports 1+1 MSP, 1:N (N5)MSP, two-fiber unidirectional MSP ring,
and two-fiber bidirectional MSP ring.

Linear MSP
The linear MSP is mainly used in a chain network. The OptiX OSN 500 supports a maximum
of three 1+1 or 1:N (N5) linear MSPs, of which the switching time is not longer than 50 ms,
as specified in ITU-T G.841.
Table 5-1 provides the parameters of linear MSP.
Table 5-1 Parameters of linear MSP

5-2

Protecti
on
Type

Revertiv
e Mode

Switchi
ng
Protocol

Switching
Time

Default
WTR Time

Switching Conditions
(Any Condition
Triggers the
Switching.)

1+1
singleended
switchin
g

Nonrevertive

Not
required

Less than
50 ms

R_LOS

R_LOF

MS_AIS

B2_EXC

B2_SD (optional)

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5 Protection

Protecti
on
Type

Revertiv
e Mode

Switchi
ng
Protocol

Switching
Time

Default
WTR Time

Switching Conditions
(Any Condition
Triggers the
Switching.)

1+1
singleended
switchin
g

Revertive

Not
required

Less than
50 ms

600s

Forced switching

Manual switching

Exercise switching

1+1
dualended
switchin
g

Nonrevertive

APS
protocol

Less than
50 ms

Lockout of protection
switchinga

1+1
dualended
switchin
g

Revertive

APS
protocol

Less than
50 ms

600s

1:N
dualended
switchin
g

Revertive

APS
protocol

Less than
50 ms

600s

NOTE

In the case of lockout of protection switching, all the services (including the normal services and extra
services) are locked on the working channel. If the services are already switched to the protection channel,
this command forcibly restores the services to the working channel, even if the working channel is not
restored to normal. Hence, the services are not switched after the protection lockout command is issued,
if the current services run on the working channel.

Ring MSP
The OptiX OSN 500 supports the following ring MSP modes:
l

STM-1 two-fiber unidirectional MSP

STM-4 two-fiber unidirectional/bidirectional MSP

The OptiX OSN 500 supports two-fiber MS shared protection ring, of which the switching time
is less than 50 ms, as specified in ITU-T G.841.
Table 5-2 provides the maximum number of STM-1/STM-4 MSP rings supported by the OptiX
OSN 500.

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5 Protection

Table 5-2 Maximum number of MSP rings supported by the OptiX OSN 500
Protection Mode

Maximum Number of MSP Rings

STM-1 two-fiber MSP ring

Three

STM-4 two-fiber MSP ring

One

Table 5-3 provides the parameters of MSP ring.


Table 5-3 Parameters of MSP ring
Protecti
on
Type

Revertiv
e Mode

Switchi
ng
Protocol

Switching
Time

Default
WTR Time

Switching Conditions
(Any Condition
Triggers the
Switching.)

Twofiber
bidirecti
onal
MSP

Revertive

APS
protocol

Less than 50
ms

600s

R_LOS

R_LOF

MS_AIS

B2_EXC

Twofiber
unidirec
tional
MSP

Revertive

B2_SD (optional)

Forced switching

Manual switching

Exercise switching

Lockout of protection
switchinga

APS
protocol

Less than 50
ms

600s

NOTE

In the case of lockout of protection switching, all the services (including the normal services and extra
services) are locked on the working channel. If the services are already switched to the protection channel,
this command forcibly restores the services to the working channel, even if the working channel is not
restored to normal. Hence, the services are not switched after the protection lockout command is issued,
if the current services run on the working channel.

5.2.2 SNCP
The OptiX OSN 500 supports 512 VC-12 SNCP protection groups.
The OptiX OSN 500 supports VC-12, VC-3, and VC-4 SNCP, of which the protection features
meet the requirements as specified in ITU-T G.841. That is, the switching time is less than 50
ms even if more than one service switching events occur at the same time.
Table 5-4 provides the SNCP parameters.

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5 Protection

Table 5-4 SNCP parameters


Protectio
n Type

Revertiv
e Mode

Switchin
g Time

Default
WTR
Time

Switching Conditions (Any


Condition Triggers the
Switching.)

SNCP

Revertive

Less than
50 ms

600s

R_LOS

R_LOF

Less than
50 ms

AU_LOP

TU_LOP

MS_AIS

AU_AIS

TU_AIS

HP_UNEQ (optional)

HP_TIM (optional)

B2_EXC

B3_EXC (optional)

B3_SD (optional)

BIP_EXC (optional)

BIP_SD (optional)

LP_UNEQ (optional)

Nonrevertive

5.2.3 Fiber-Shared Virtual Trail Protection


In the fiber-shared virtual trail protection mode, the STM-1/STM-4 optical path is logically
divided into multiple lower order or higher order paths, and different protection modes (for
example, MSP, SNCP, and non-protection) are set for the path-level loops.
As shown in Figure 5-1, an STM-4 optical path can be logically divided into two configurations,
of which two VC-4 higher order paths is configured with MSP and the other two VC-4 paths
are configured as lower order paths and with SNCP. During this process, the fiber-shared virtual
trail protection is implemented.
NOTE

The optical paths on the shared fiber can be configured with any combination of MSP and SNCP but cannot
be configured with MSP at the same time, because one optical path can provide only one K-byte pair.

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5 Protection

Figure 5-1 Fiber-shared virtual trail protection


STM-4

SNCP/MSP

MSTP

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6 Ethernet Features

Ethernet Features

About This Chapter


The Ethernet features are described in the following aspects: service application, service
protection, and maintenance.
6.1 Application
The OptiX OSN 500 has the Ethernet access function integrated on the SDH transmission
platform. Hence, it can transmit both voice services and data services.
6.2 Protection
The OptiX OSN 500 provides LCAS, STP, RSTP, and LPT protection for the Ethernet services.
6.3 Maintenance
The OptiX OSN 500 provides various Ethernet operating and maintenance functions.

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6 Ethernet Features

6.1 Application
The OptiX OSN 500 has the Ethernet access function integrated on the SDH transmission
platform. Hence, it can transmit both voice services and data services.
The OptiX OSN 500 supports the following services:
l

EPL services

EVPL services

EPLAN services

EVPLAN services

EPL service
The EPL service realizes the point-to-point transparent transmission of the Ethernet service. As
shown in Figure 6-1, the Ethernet services of different NEs are transmitted to the destination
nodes in their respective VCTRUNKs. Thus, secure and reliable data transmission is
implemented. In addition, the Ethernet services are protected by the SDH self-healing ring
(SHR).
Figure 6-1 EPL service based on port
B

B
PORT2

VCTRUNK2

VCTRUNK2

VCTRUNK 1

VCTRUNK 1

PORT1

PORT2
POTR1

NE 1
OptiX OSN equipment

NE 2
Enterprise user

EVPL service
The OptiX OSN 500 supports EVPL services in the following two modes:
l

EVPL service based on shared port. In this mode, the services are isolated by using the
VLAN, and the bandwidth is shared.

As shown in Figure 6-2, traffic classification is performed on the services by using the VLAN
ID. In this mode, services of different departments in company A are isolated, and the two
services are transmitted in their respective VCTRUNKs.

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Figure 6-2 EVPL service based on shared port

VLAN100
PORT1
VLAN200
PORT2

VCTRUNK1

VLAN100
VLAN200
Headquarters of PORT1
company A

VCTRUNK2

Marketing department of
company A

Technical support
department of
company A
NE 1

NE 2
Enterprise user

OptiX OSN equipment

EVPL service based on shared VCTRUNK. In this mode, the OptiX OSN 500 uses the
following two methods for converging and isolating EVPL services:

Based on the VLAN ID, as shown in Figure 6-3.

Based on the QinQ, as shown in Figure 6-4.

Figure 6-3 EVPL services based on the VLAN IDs


B'

B
VLAN200

VCTRUNK

VLAN100
A

PORT1

VLAN200
VLAN100

PORT2

PORT2

NE 1

PORT1 A'

NE 2

community
Broadband

Internet
cafe

OptiX OSN
equipment

Figure 6-4 EVPL services based on the QinQ


Adding a tag
C-Aware
S-Aware

Marketing
department

Stripping a tag
S-Aware
C-Aware

PORT2

PORT2

VCTRUNK1
Technical support
department

PORT1

Marketing
department

NE 1

NE 2

PORT1 Technical support


department

Branch 2

Branch 1

Company A

OptiX OSN equipment

EPLAN service
The EPLAN service realizes the multipoint dynamic sharing. That is, the OptiX OSN 500 uses
the virtual bridge (VB) to realize the Layer 2 switching of the Ethernet data.
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6 Ethernet Features

Each board in the system has one VB, and each VB has one MAC address table. This MAC
address table is periodically updated through the self-learning function of the system. The
accessed data can be transmitted in different VCTRUNKs according to MAC address, as shown
in Figure 6-5.
Figure 6-5 EPLAN service
PORT1
VB

Branch 3

Port 1

VCTRUNK1

NE3

VCTRUNK2

PORT1

VB
PORT1

VB
VCTRUNK1
VCTRUNK1

Port 1

Port 1
NE 1

NE 2

Branch 1

Branch
Access point

Company A

OptiX OSN equipment

EVPLAN service
The EVPLAN service realizes the dynamic bandwidth sharing of multipoint services, and can
isolate different services that have the same VLAN ID. If two data services that have the same
VLAN ID need to be accessed to one node and the bandwidth needs to be dynamically shared,
the EVPLAN is used.
The OptiX OSN 500 uses the following two methods for transmitting the EVPLAN services:

6-4

Based on the QinQ, as shown in Figure 6-6.

Based on the VLAN ID, as shown in Figure 6-7.

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Figure 6-6 EVPLAN services based on the QinQ

C-Aware

S-Aware

Branch 3 PORT 1 NE3


PORT2

VCTRUNK2
C-Aware
PORT2
PORT1

VCTRUNK2

PORT2
PORT1

VCTRUNK1

VB

VCTRUNK1

Branch 3

C-Aware

VB

LSP

S-Aware

VCTRUNK1

VB

LSP

S-Aware

NE 1

NE 2

PORT 2

PORT2
PORT1

VCTRUNK2

LSP

PORT1

PORT1

PORT 2
Branch 2

Branch 1

Branch 2

Branch 1

Company A

Access point

Company B

OptiX OSN equipment

Figure 6-7 EVPLAN services based on the VLAN

PORT1
VLAN1
VCTRUNK1

VB

Branch 3 PORT1 NE3


PORT1
VLAN1
VCTRUNK1

PORT1

Branch 3

VLAN2

VB

LSP

VLAN2

LSP

NE 1

PORT2

VCTRUNK1

VB

NE 2

PORT 2

LSP

PORT1

PORT 1
Branch 2
Branch 1

Branch 1

Access point

Company A

Company B

OptiX OSN equipment

6.2 Protection
The OptiX OSN 500 provides LCAS, STP, RSTP, and LPT protection for the Ethernet services.

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6 Ethernet Features

LCAS
LCAS provides a fault-tolerant scheme, which implements protection and restoration of the
failed members. The main functions of LCAS are as follows:
l

When LCAS is applied in the virtual concatenation (VC) technology, LCAS enables the
configuration of system capacity, the increase and decrease of the concatenated VC
quantity, and the dynamic change of bearer bandwidth (services are not damaged during
the dynamic change).

LCAS implements protection and restoration of the failed members.

As shown in Figure 6-8, LCAS can dynamically add or delete members to increase or decrease
the bandwidth. Services are not interrupted during such bandwidth adjustment. LCAS can also
delete members to dynamically decrease the bandwidth.
Figure 6-8 Dynamic bandwidth adjustment by using LCAS
MSTP network
Adding a 10 Mbit/s
bandwidth
Member

Branch

Member

Headquarters

Member

Member
Branch

Headquarters
New member
MSTP

As shown in Figure 6-9, LCAS implements the protection of the Ethernet service. When certain
members fail, the failed members are automatically deleted, whereas the other members continue
to transmit the data normally. When the failed members are available again, they are
automatically restored, and the data is loaded to these members again.

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6 Ethernet Features

Figure 6-9 VC group protection by using LCAS


MSTP network
Member

Member
Branch

Headqarters
Failed member

Member

Member

Branch

Headquarters

Deleting the failed member

MSTP

STP/RSTP
The Ethernet boards support the spanning tree protocol (STP) and the rapid spanning tree
protocol (RSTP). When the STP or the RSTP is started, it logically modifies the network
topology to prevent a broadcast storm. The STP or the RSTP realizes link protection by
restructuring the topology.

LPT
LPT is a link-based protection scheme. In a network, when the active and standby ports between
routers belong to different links, the LPT function is available for protection. When the working
link becomes faulty, the LPT function shuts down the local port to notify the opposite router
that the working link is abnormal. As a result, services are switched from the active port to the
standby port and are thus protected.

6.3 Maintenance
The OptiX OSN 500 provides various Ethernet operating and maintenance functions.
6.3.1 ETH-OAM
The Ethernet board of the OptiX OSN 500 supports the ETH-OAM function, which implements
automatic fault detection, fault location, and fault isolation.
6.3.2 Test Frame
The OptiX OSN 500 supports Ethernet test frames.
6.3.3 RMON
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6 Ethernet Features

The OptiX OSN 500 supports Ethernet data statistics by using RMON.

6.3.1 ETH-OAM
The Ethernet board of the OptiX OSN 500 supports the ETH-OAM function, which implements
automatic fault detection, fault location, and fault isolation.
As a protocol based on the MAC layer, the ETH-OAM checks the Ethernet link by sending OAM
protocol packets. The ETH-OAM function enhances the method of performing Ethernet Layer
2 maintenance. It can be implemented to verify service connectivity, commission deployment
services, and locate network faults.

6.3.2 Test Frame


The OptiX OSN 500 supports Ethernet test frames.
Test frames are used to test whether the inter-NE Ethernet service is normal and to locate the
faulty node. In addition, test frames can be used to query the information on the opposite NE,
including the NE ID, NE name, port number, and VCTRUNK ID.
The transmission network includes the access network and service network, which are used to
access the services and transmit the services, respectively. When you commission the Ethernet
service during the deployment or locate a fault in the Ethernet service, you can send test frames
to test the connectivity of the SDH link in the service network. The bandwidth used for
transmitting the test frames is low and thus can be ignored. The transmission mode and quantity
of the test frames to be transmitted can be set.
As shown in Figure 6-10, when the Ethernet service between Router 1 and Router 2 is
unavailable, you can locate a fault in the Ethernet service by sending test frames between
neighboring nodes. The process of the test frame transmission is as follows:

6-8

1.

The VCTRUNK port on the data board of NE1 sends the test frame to the VCTRUNK port
on the data board of NE2.

2.

NE2 sends the response packet to NE1, after receiving the test frame.

3.

NE1 calculates the received and transmitted test frame packets. The client determines
whether the service network is normal according to the number of the transmitted and
received packets.

In the case of a bidirectional service, the service network is considered normal if the transmit
end of the test frame received the response packet.

In the case of a unidirectional service, the service network is considered normal if the
receive end of the test frame received the test frame.

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6 Ethernet Features

Figure 6-10 Test frame function


Access network

Service network

NE1

Test frame

Access network

NE2

Response frame
Router 1

Router 2
MAC

VCTRUNK

VCTRUNK

Board

MAC

Board

OptiX NE

6.3.3 RMON
The OptiX OSN 500 supports Ethernet data statistics by using RMON.
RMON can implement the calculation of the ports, configuration and query of the control
information, and analysis of the performance of the connected Ethernet section. In addition,
RMON provides a flexible performance and alarm scheme to notify the T2000 of the change in
the network performance, thus facilitating the network management.
As shown in Figure 6-11, NE A, NE B, NE C, NE D, and NE E form a network. NE E needs
to monitor the Ethernet services of NE A.
Figure 6-11 Application of RMON in a network

NE C

NE A

NE D

Ethernet port

Ethernet port

NE B

NE E

An Ethernet service exists between the target nodes NE A and NE E. The RMON function is
enabled to implement the remote monitoring between NE A and NE E. You can learn the
performance events and alarms of the services on the Ethernet board of the transmit node (NE
A) by querying the RMON performance of the corresponding Ethernet service board of NE E.
RMON implements the monitoring of the following four groups:
l

Statistics group: current performance, that is, the absolute value of the performance during
the network operation until the current moment

History group: records the periodic statistics samples in the past period of time.

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6-10

History control group: Controls the manner of obtaining the data of the history group.

Alarm group: Sets and monitors alarms of the statistics group.

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7 Technical Specifications

Technical Specifications

About This Chapter


The technical specifications of the OptiX OSN 500 include the specifications for the integrated
equipment, specifications for the system performance, and specifications for the boards.
7.1 Specifications for the Integrated Equipment
The specifications for the integrated equipment contain the dimensions and weight of the chassis.
7.2 Power Consumption and Weight of Boards
The weight and power consumption of the boards are the key hardware specifications.
7.3 Specifications for the Clock Ports
The specifications for the clock interfaces and the synchronization performance of the OptiX
OSN 500 comply with the related ITU-T standards.
7.4 Reliability Specifications
Reliability specifications of the OptiX OSN 500 include the system availability, system mean
annual failure rate, MTTR system mean repair time, and MTBF system mean fault interval.
7.5 EMC Performance Specifications
The OptiX OSN 500 is designed in accordance with the ETS300 300,386 series and ETS 300,127
standards stipulated by the European Telecommunications Standard Institute (ETSI), and has
passed EMC-related tests.
7.6 Safety Certification
The OptiX OSN 500 has received several safety certificates.
7.7 Environment Requirement
The OptiX OSN 500 requires proper environment for storage, transportation, and operation.

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7.1 Specifications for the Integrated Equipment


The specifications for the integrated equipment contain the dimensions and weight of the chassis.
Table 7-1 provides the weight, dimensions, and power consumption of the OptiX OSN 500.
Table 7-1 Weight, dimensions, and power consumption of the OptiX OSN 500
Equipment

Power
Consumption

Weight

Dimensions

OptiX OSN 500

About 46 W
(full
configuration)

About 4 kg (full
configuration)

442 mm (width) x 220 mm (depth)


x 44 mm (height) (that is, 1U)

7.2 Power Consumption and Weight of Boards


The weight and power consumption of the boards are the key hardware specifications.
Table 7-2 provides the power consumption and weight of each board on the OptiX OSN 500.
Table 7-2 Power consumption and weight of the boards on the OptiX OSN 500
Board

Power Consumption (W)

Weight (kg)

ISU

21.3

1.12

SL1D

4.12

0.3

SP3D

11.5

0.85

PL3T

4.2

0.3

EGT19

0.6

EFS8

12

0.65

7.3 Specifications for the Clock Ports


The specifications for the clock interfaces and the synchronization performance of the OptiX
OSN 500 comply with the related ITU-T standards.

Types of the Clock Ports


The OptiX OSN 500 provides external clock input/output interfaces. Table 7-3 provides the
features of the clocks.

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Table 7-3 Clock features of the OptiX OSN 500


Clock Type

Feature Description

External
synchronization
source

One 120-ohm 2048 kbit/s (G.703) or 2048 kHz (G.703) clock input

Synchronous
output

One 120-ohm 2048 kbit/s (G.703) or 2048 kHz (G.703) clock output

Timing and Synchronization Performance


The timing and synchronization performance of the OptiX OSN 500 complies with ITU-T G.
813. Table 7-4 provides the timing and synchronization performance.
Table 7-4 Timing and synchronization performance of the clock of the OptiX OSN 500
Output Jitter

Output Frequency of the


Internal Oscillator in Free-Run
Mode

Long-Term Phase Variation


(Trace Mode)

Compliant with
ITU-T G.813

Compliant with ITU-T G.813

Compliant with ITU-T G.813

7.4 Reliability Specifications


Reliability specifications of the OptiX OSN 500 include the system availability, system mean
annual failure rate, MTTR system mean repair time, and MTBF system mean fault interval.
Table 7-5 Equipment Reliability
System
Availability

Mean Annual
Repair and Return
Rate

MTTR (h)

MTBF (y)

99.99964%

1.71%

63.57

7.5 EMC Performance Specifications


The OptiX OSN 500 is designed in accordance with the ETS300 300,386 series and ETS 300,127
standards stipulated by the European Telecommunications Standard Institute (ETSI), and has
passed EMC-related tests.

7.6 Safety Certification


The OptiX OSN 500 has received several safety certificates.
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The OptiX OSN 500 has passed the safety certification as listed in Table 7-6.
Table 7-6 Safety certification that the OptiX OSN 500 has passed
Certification Item

Certification Standard

Electromagnetic
compatibility (EMC)

CISPR22 Class A
CISPR24
EN55022 Class A
EN50024
ETSI EN 300 386 Class A
GB9254 Class A
IEC 60950-1

Safety

EN 60950-1
GB4943
Laser safety

IEC60825-1
IEC60825-2

Health

ICNIRP Guideline
1999-519-EC
EN 50385
OET Bulletin 65
IEEE Std C95.1

Environment protection

RoHS

7.7 Environment Requirement


The OptiX OSN 500 requires proper environment for storage, transportation, and operation.
7.7.1 Environment for Storage
The OptiX OSN 500 requires proper environment for storage.
7.7.2 Environment for Transportation
The OptiX OSN 500 requires proper environment for transportation.
7.7.3 Environment for Operation
The OptiX OSN 500 requires proper environment for operation.

7.7.1 Environment for Storage


The OptiX OSN 500 requires proper environment for storage.

Climate
Table 7-7 provides the climate requirements for storing the OptiX OSN 500.
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Table 7-7 Climate requirements for storage


Item

Scope

Altitude

4,000 m

Air pressure

70 kPa to 106 kPa

Temperature

40C to +70C

Temperature change rate

1C/min

Relative humidity

5%100%

Solar radiation

1120 W/s2

Heat radiation

600 W/s2

Wind speed

30 m/s

Waterproof Requirement
Requirement for storing equipment at the customer site: Generally, the equipment must be stored
indoors.
There should be no water on the floor where the equipment carton is placed. The equipment
should be placed away from places where there is a possibility of water leakage, such as near
the automatic fire-fighting facilities and heating facilities.
If the equipment is stored outdoors, the following four conditions must be met:
l

The carton must be intact.

Measures must be taken in the case of rain to prevent water from entering the carton.

There should be no water on the ground where the carton is placed.

The carton must not be exposed to direct sunlight.

Biological Environment
l

Take measures to prevent the growth of microbes, such as eumycete and mycete.

Take anti-rodent measures.

The air must not contain any inflammable, electric-conductive, magnetic-conductive, or


corrosive dust particles.

Table 7-8 lists the density requirements for mechanical active substances during storage.

Air Cleanness

Table 7-8 Density requirements for mechanical active substances during storage

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Mechanical Active Substance

Content

Suspending dust

5.00 mg/m3

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Mechanical Active Substance

Content

Precipitable dust

20.0 mg/m2.h

Gravel

300 mg/m3

Table 7-9 provides the density requirements for chemical active substances during storage.

Table 7-9 Density requirements for chemical active substances during storage
Chemical Active Substance

Content

SO2

0.30 mg/m3

H2S

0.10 mg/m3

NO2

0.50 mg/m3

NH3

1.00 mg/m3

Cl2

0.10 mg/m3

HCl

0.10 mg/m3

HF

0.01 mg/m3

O3

0.05 mg/m3

Mechanical Stress
Table 7-10 provides the requirements for mechanical stress during storage.
Table 7-10 Requirements for mechanical stress during storage
Item

Sub-Item

Scope

Random vibration

Acceleration spectral
density

0.02 m2/s3

Frequency range

5 Hz to 20 Hz

10 Hz to 50
Hz

50 Hz to 100
Hz

dB/oct

+12

12

7.7.2 Environment for Transportation


The OptiX OSN 500 requires proper environment for transportation.

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Climate
Table 7-11 provides climate requirements for transportation.
Table 7-11 Climate requirements for transportation
Item

Scope

Altitude

4,000 m

Air pressure

70 kPa to 106 kPa

Temperature

40C to +70C

Temperature change rate

1C/min

Relative humidity

5% to 100%

Solar radiation

1120 W/s

Heat radiation

600 W/s

Wind speed

30 m/s

Waterproof Requirement
The following conditions are required for transportation:
l

The carton must be intact.

Take rainproof measures to prevent water from entering the carton.

There should be no water in the transportation tool.

Biological Environment
l

Prevent reproduction of microbe, such as eumycete and mycete.

Take anti-rodent measures.

The air must be free from explosive, electric-conductive, magnetic-conductive or corrosive


dust.

Table 7-12 provides the density requirements for mechanical active substances during
transportation.

Air Cleanness

Table 7-12 Density requirements for mechanical active substances during transportation

Issue 01 (2009-01-20)

Mechanical Active Substance

Content

Suspending dust

No requirement

Precipitable dust

3.0 mg/m.h

Gravel

100 mg/m

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l

Table 7-13 provides the density requirements for chemical active substances during
transportation.

Table 7-13 Density requirements for chemical active substances during transportation
Chemical Active Substance

Content

SO2

1.00 mg/m

H2S

0.50 mg/m

NOX

1.00 mg/m

NH3

3.00 mg/m

Cl2

HCl

0.50 mg/m

HF

0.03 mg/m

O3

0.10 mg/m

Mechanical Stress
Table 7-14 provides the requirements for mechanical stress during transportation.
Table 7-14 Requirements of mechanical stress for transportation
Item

Sub-Item

Scope

Random
vibration

Acceleration spectral
density

1 m/s

3 dBA

Frequency range

5 Hz to 20 Hz

20 Hz to 200 Hz

Impact response
spectrum I (sample
weight > 50 kg)

100 m/s, 11 ms, 100 times on each surface

Impact response
spectrum II (sample
weight > 50 kg)

180 m/s, 60 ms, 100 times on each surface

Weight (kg)

Height (m)

< 10

1.0

< 15

1.0

< 20

0.8

< 30

0.6

< 40

0.5

Impact

Fall-off

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Item

7 Technical Specifications

Sub-Item

Scope

< 50

0.4

< 100

0.3

> 100

0.1

NOTE
Impact response spectrum is the maximum acceleration response curve generated by the equipment that
is spurred by a specified impact. Static load is the pressure from the top, which the equipment with the
package can endure when the equipment is placed in a specific manner.

7.7.3 Environment for Operation


The OptiX OSN 500 requires proper environment for operation.

Climate
Table 7-15 and Table 7-16 provide the climate requirements for operation of the OptiX OSN
500.
Table 7-15 Requirements for temperature and humidity
Working Temperature

Relative Humidity

-5C to +55C

5%95%

NOTE
The temperature and humidity values are tested in the place 1.5 m above the floor and 0.4 m in front of
the equipment.

Table 7-16 Other climate requirements


Item

Scope

Altitude

4,000 m

Air pressure

70 kPa to 106 kPa

Temperature change rate

30C/h

Solar radiation

700 W/s

Heat radiation

600 W/s

Wind speed

5 m/s

Biological Environment
l

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Prevent reproduction of microbe, such as eumycete and mycete.


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l

Take anti-rodent measures.

The air must be free from explosive, electric-conductive, magnetic-conductive or corrosive


dust.

Table 7-17 provides the density requirements for mechanical active substances during
operation.

Air Cleanness

Table 7-17 Density requirements for mechanical active substances during operation
Mechanical Active
Substance

Content

Dust particle

3x105 particles/m

Suspending dust

0.2 mg/m

Precipitable dust

1.5 mg/m.h

Gravel

20 mg/m

Table 7-18 provides the density requirements for chemical active substances during
operation.

Table 7-18 Density requirements for chemical active substances during operation
Chemical Active Substance

Content

SO2

0.30 mg/m

H2S

0.10 mg/m

NH3

1.00 mg/m

Cl2

0.10 mg/m

HCl

0.10 mg/m

HF

0.01 mg/m

O3

0.05 mg/m

NOX

0.50 mg/m

Mechanical Stress
Table 7-19 provides the requirements for mechanical stress during operation.

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Table 7-19 Requirements for mechanical stress during operation


Item

Sub-Item

Scope

Sinusoidal
vibration

Velocity

5 mm/s

Acceleration

2 m/s

Frequency range

5 Hz to 62 Hz

62 Hz to 200 Hz

Impulse response
spectrum II

Half-sin wave, 30 m/s, 11 ms, three times


on each surface

Static load

0 kPa

Unsteady state
impact

NOTE
Impact response spectrum is the maximum acceleration response curve generated by the equipment that
is spurred by a specified impact. Static load is the pressure from the top, which the equipment with the
package can endure when the equipment is placed in a specific manner.

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8 Compliant Standards

Compliant Standards

This topic describes the standards with which the OptiX OSN 500 complies.

ITU-T Recommendations
Table 8-1 ITU-T recommendations

Issue 01 (2009-01-20)

Recommendation

Description

G0.652

Characteristics of a single-mode optical fiber cable.

G0.655

Characteristics of a non-zero dispersion-shifted single-mode optical


fiber and cable.

G0.661

Definition and test methods for the relevant generic parameters of


optical fiber amplifiers.

G0.662

Generic characteristics of optical fiber amplifier devices and subsystems.

G0.663

Application related aspects of optical fiber amplifier devices and subsystems.

G0.671

Transmission characteristics of optical components and subsystems.

G0.692

Optical interfaces for multichannel systems with optical amplifiers.

G0.702

Digital hierarchy bit rates.

G0.703

Physical/electrical characteristic of hierarchical digital interfaces.

G0.704

Synchronous frame structures used at 1544, 6312, 2048, 8448 and


44736kbit/s hierarchical levels.

G0.7041

Generic framing procedure (GFP).

G0.7042

Link capacity adjustment scheme (LCAS).

G0.707

Network node interface for the synchronous digital hierarchy (SDH).

G0.709

Interfaces for the Optical Transport Network (OTN).

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Recommendation

Description

G.774 1-5

Synchronous Digital Hierarchy (SDH) management information


model for the network element view.

G0.775

Loss of signal (LOS) and alarm indication signal (AIS) defect


detection and clearance criteria.

G0.783

Characteristics of Synchronous Digital Hierarchy (SDH) equipment


functional blocks.

G0.784

Synchronous Digital Hierarchy (SDH) management.

G0.803

Architectures of transport networks based on the Synchronous Digital


Hierarchy (SDH).

G0.811

Timing characteristics of primary reference clocks.

G0.812

Timing requirements of slave clocks suitable for use as node clocks


in synchronization networks.

G0.813

Timing characteristics of SDH equipment slave clocks (SEC).

G0.823

The control of jitter and wander within digital networks which are
based on the 2048kbit/s hierarchy.

G0.825

The control of jitter and wander within digital networks which are
based on the Synchronous Digital Hierarchy (SDH).

G0.826

Error performance parameters and objectives for international,


constant bit rate digital paths at or above the primary rate.

G0.831

Management capabilities of transport networks based on the


Synchronous Digital Hierarchy (SDH).

G0.841

Types and characteristics of SDH network protection architectures.

G0.842

Cooperation of the SDH network protection structures.

G0.957

Optical interfaces of equipments and systems relating to the


synchronous digital hierarchy.

G0.958

Digital line systems based on the synchronous digital hierarchy for


use on optical fiber cables.

M.3010

Principles for a telecommunication management network.

X.86/Y.1323

Ethernet over LAPS

IEEE Standards
Table 8-2 IEEE standards

8-2

Standard

Description

IEEE 802.17

Resilient packet ring access method and physical layer specifications


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Standard

Description

IEEE 802.1ad

Virtual Bridged Local Area Networks Amendment 4: Provider


Bridges

IEEE 802.1ag

Connectivity Fault Management

IEEE 802.1d

Media Access Control (MAC) Bridges

IEEE 802.1q

Virtual bridged local area networks

IEEE 802.3

Carrier sense multiple access with collision detection (CSMA/CD)


access method and physical layer specification

IEEE 802.3ad

Aggregation of multiple link segments

IEEE 802.3ah

Carrier sense multiple access with collision detection (CSMA/CD)


access method and physical layer specification
Amendment: media access control parameters, physical layers, and
management parameters for subscriber access networks

IEEE 802.3u

Media access control (MAC) parameters, physical Layer, medium


attachment units, and repeater for 100 Mb/s operation, type 100BaseT

IEEE 802.3x

Standards for local and metropolitan area networks: specification for


802.3 full duplex operation

IEEE 802.3z

Media access control (MAC) parameters, physical Layer, repeater and


management parameters for 1000 Mb/s operation

IETF Standards
Table 8-3 IETF standards

Issue 01 (2009-01-20)

Standard

Description

RFC 2615 (1999)

PPP (Point-to-Point Protocol) over SONET/SDH

RFC 1662 (1994)

PPP in HDLC-like Framing

RFC 1661 (1994)

The Point-to-Point Protocol (PPP)

RFC 1990

The PPP Multilink Protocol (MP)

RFC2819 (2000)

Remote Network Monitoring Management Information


Base

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Environment Related Standards


Table 8-4 Environment related standards
Standard

Description

IEC 60068-2

Basic Environmental Testing Procedures

IEC 60068-3-3

Environmental testing - Part 3: Background information - Subpart 3:


Guidance. Seismic test methods for equipments

IEC 60721-2-6

Environmental conditions appearing in nature - Earthquake vibration

IEC 60721-3-1

Classification of environmental conditions - Part 3: Classification of


groups of environmental parameters and their severities - Section 1:
Storage

IEC 60721-3-3

Classification of environmental conditions - Part 3: Classification of


groups of environmental parameters and their severities - Section 3:
Stationary use at weatherprotected locations

ETS 300 019-1-1

Environmental Engineering (EE); Environmental conditions and


environmental tests for telecommunications equipment
Part 1-1: Classification of environmental conditions; Storage

ETS 300 019-1-2

Environmental Engineering (EE); Environmental conditions and


environmental tests for telecommunications equipment; Part 1-2:
Classification of environmental conditions; Transportation

ETS 300 019-1-3

Environmental Engineering (EE); Environmental conditions and


environmental tests for telecommunications equipment; Part 1-3:
Classification of environmental conditions; Stationary use at
weatherprotected locations

NEBS GR-63-CORE

Network Equipment-Building System (NEBS) Requirements:


Physical Protection

Safety Compliance Standards


Table 8-5 Safety compliance related standards

8-4

Standard

Description

EN 60950-1

Safety of information technology equipment

IEC 60950-1

Safety of information technology equipment

IEC 60825-1

Safety of laser equipment

IEC 60825-2

Safety of laser equipment requirement of OFCS

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Protection Standards
Table 8-6 Protection related standards

Issue 01 (2009-01-20)

Standard

Description

IEC 61024-1

Protection of structures against lightning

IEC 61312-1

Protection against lightning electromagnetic impulse part I:


general principles

IEC 61000-4-5

Electromagnetic compatibility (EMC)- Part 4: Testing and


measurement techniques - Section 5: Surge immunity test

ITU-T K.11

Principles of protection against overvoltage and overcurrents

ITU-T K.20

Resistibility of telecommunication switching equipment to


overvoltages and overcurrents

ITU-T K.27

Bonding configurations and earthing inside a


telecommunication building

ITU-T K.41

Resistibility of internal interfaces of telecommunication centers


to surge overvoltages

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9 Labels

Labels

About This Chapter


Various labels, including the safety label and laser label, are attached to the OptiX OSN 500.
9.1 Labels
The ESD protection label, grounding label, and laser safety class label are attached on the OptiX
OSN 500.
9.2 Label Position
The ESD protection label and the grounding label are attached on the chassis whereas the power
warning label and laser class label are attached on the front panel of the board.

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9 Labels

9.1 Labels
The ESD protection label, grounding label, and laser safety class label are attached on the OptiX
OSN 500.
Table 9-1 provides the types and descriptions of the labels.
Table 9-1 Labels on the equipment
Label

CLASS 1
LASER
PRODUCT

9-2

Type

Description

ESD protection jack

Indicates the position


of the ESD
protection jack.

Laser safety class


label

Indicates the class of


the laser source.

Equipment
grounding label

Indicates the
grounding position.

Power warning label

This label is attached


to remind that the
relevant information
in the product
documents must be
read before operating
the power supply
because the PIU
board does not
support hot
swapping.

Product nameplate

Indicates the product


name and certificate.

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9 Labels

9.2 Label Position


The ESD protection label and the grounding label are attached on the chassis whereas the power
warning label and laser class label are attached on the front panel of the board.
Figure 9-1 Labels on the OptiX OSN 500
CLASS 1
LASER
PRODUCT

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10 Indicators

10

Indicators

This topic describes the indicators on the boards and the OptiX OSN 500 and their meanings.

Running Status Indicator (RUN)


Status

Description

Off

Indicates that the equipment is not powered on.

On for 0.5s and then off for 0.5s

Indicates that the equipment is waiting for loading


programs.

Rapidly flashing (on for 100 ms and


then off for 100 ms)

Indicates that the equipment is loading programs.

Constantly on

Indicates that the equipment is being initialized.

Slowly flashing (on for 1s and then


off for 1s)

Indicates that the equipment works normally.

NE Alarm Indicator (ALM)

Issue 01 (2009-01-20)

Status

Description

Off

Indicates that no alarm is generated on the local NE.

On for 300 ms and then off for 1s

Indicates that a minor alarm is generated on the


equipment.

On for 300 ms, off for 300 ms, and


then on for 300 ms, off for 1s

Indicates that a major alarm is generated on the


equipment.

On for 300 ms, off for 300 ms, on


for 300 ms, off for 300 ms, and then
on for 300 ms, off for 1s

Indicates that a critical alarm is generated on the


equipment.

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10 Indicators

Board Hardware Status Indicator (STAT)


Status

Description

Off

Indicates that the board is not in working state, not


created, or not powered on.

On (green)

Indicates that the board is working normally.

On (red)

Indicates that the board hardware is faulty.

Service Alarm Indicator (SRV)


Status

Description

Off

Indicates there is no service.

On (green)

Indicates that the services are normal.

On (red)

Indicates that a critical or major alarm occurs in the


service.

On (yellow)

Indicates that a minor or remote alarm occurs in the


service.

LOS Signal Indicator (LOS1/LOS2)


Status

Description

Off

Indicates that the optical interface receives the optical


signal.

On

Indicates that the optical interface does not receive any


optical signal.

Board Software Status Indicator (PROG)

10-2

Status

Description

On (green)

Indicates that the board software is loaded successfully


to the flash memory card, the FPGA program is loaded
successfully, or the board software is initialized
successfully.

On for 100 ms and off for 100 ms


repeatedly (green)

Indicates that the board software is being loaded to the


flash memory card, or the FPGA software is being
loaded to the FPGA.

On for 300 ms and off for 300 ms


repeatedly (green)

Indicates that the board software is being initiated and


is in the BIOS boot state.

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10 Indicators

Status

Description

On (red)

Indicates that the board software or FPGA program in


the flash memory card failed be to loaded or failed to
be initialized because they are lost.

Off

Indicates there is no power input.

Optical Power Indicator (OPM)


Status

Description

Flashing red rapidly (three times


every second. On for 300 ms and off
for 300 ms)

Indicates that the received optical power is excessively


high.

Flashing red slowly (once every


second. On for 300 ms and off for
700 ms)

Indicates that the received optical power is excessively


low.

Flashing yellow rapidly (three


times every second. On for 300 ms
and off for 300 ms)

Indicates that the transmitted optical power is


excessively high.

Flashing yellow slowly (once every


second. On for 300 ms and off for
700 ms)

Indicates that the transmitted optical power is


excessively low.

Off

Indicates other states, including without limitation:


l

The optical power is normal.

There is no optical module.

An improper optical module is inserted.

The E2ROM information about the optical module


cannot be read normally.

The optical fiber is disconnected or the port is


disabled.

Ethernet Port Indicator (LINK/ACT)

Issue 01 (2009-01-20)

Indicator

Status

Description

Connection status indicator


(LINK), which is green when it
is on

On

Indicates that the network cable is


properly connected to the equipment.

Off

Indicates that the network cable is not


connected to the equipment.

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10 Indicators

10-4

Indicator

Status

Description

Data receiving and


transmitting indicator (ACT),
which is orange when it is on

Flashing

Indicates that the data is being


transmitted or received.

Off

Indicates that no data is being


transmitted or received.

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11

11 Board Loopback Types

Board Loopback Types

The OptiX OSN 500 supports various board loopback types.


Table 11-1 provides the loopback types supported by the ISU board.
Table 11-1 Loopback types supported by the ISU board
Board

Module

Supported Loopback Types

ISU

Line module

Port inloop, poor outloop, VC-4 inloop, and VC-4 outloop

Tributary
module

Port inloop and port outloop

Ethernet
module

MAC inloop, MAC outloop, PHY inloop, VC-3 inloop, and


VC-3 outloop

Table 11-2 provides the loopback types supported by the SDH board.
Table 11-2 Loopback types supported by the SDH board
Board

Supported Loopback Types

SL1D

Port inloop, poor outloop, VC-4 inloop, and VC-4 outloop

Table 11-3 provides the loopback types supported by the PDH board.
Table 11-3 Loopback types supported by the ISU board
Board

Supported Loopback Types

SP3D

Port inloop and port outloop

PL3T

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11 Board Loopback Types

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Product Description

Table 11-4 provides the loopback types supported by the Ethernet board.
Table 11-4 Loopback types supported by the Ethernet board

11-2

Board

Supported Loopback Types

EGT1

MAC inloop and PHY inloop

EFS8

MAC inloop, PHY inloop, and VC-3 inloop

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12

12 Board Configuration Parameters

Board Configuration Parameters

About This Chapter


The T2000 can be used to configure various parameters for SDH boards, PDH boards, data
processing boards, and cross-connect and timing boards.
12.1 SDH Processing Boards
The parameters that can be set for the SDH processing boards include the J0 byte, J1 byte, C2
byte, and V5 byte.
12.2 PDH Processing Boards
The parameters that can be set for the PDH processing boards include the J1 byte, C2 byte, J2
byte, V5 byte, and tributary loopback.
12.3 Data Processing Board
The parameters that need be set for the data processing boards include SDH parameters, and
Ethernet parameters.
12.4 Cross-Connect and Timing Unit
The clock parameters should be set on the cross-connect and timing unit.

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12 Board Configuration Parameters

12.1 SDH Processing Boards


The parameters that can be set for the SDH processing boards include the J0 byte, J1 byte, C2
byte, and V5 byte.

J0 Byte
The transmit end uses the J0 byte to transmit the section access point identifiers in a successive
manner. In this way, the receive end learns that it is continuously connected to the specified
transmit end. The value of the J0 byte to be received is null by default.

J1 Byte
The J1 byte is the path tracing byte. The transmit end uses the J1 byte to transmit the higher
order access point identifiers in a successive manner. In this way, the receive end learns that it
is continuously connected to the specified transmit end. When the receive end detects the J1
mismatch, the corresponding VC-4 channel generates an HP_TIM alarm.
The value of the J1 byte to be received is null by default.
NOTE

The value of the J1 byte to be transmitted is " HuaWei SBS " by default. There is one space before "Huawei",
and five spaces after "SBS".

C2 Byte
The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the
VC frames and payload property. The C2 byte to be received and the C2 byte to be transmitted
must match each other. If the C2 mismatch is detected, the corresponding VC-4 channel
generates an HP_SLM alarm.
Table 12-1 provides the mapping relation between the service type and the setting of the C2
byte.
Table 12-1 Mapping relation between the service type and the setting of the C2 byte

12-2

Type of the Input Service

Setting of the C2 Byte (in Hex)

TUG structure

02

34M/45M asynchronously mapped into


a C-3

04

140M asynchronously mapped into a


C-4

12

Unequipped

00

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12 Board Configuration Parameters

12.2 PDH Processing Boards


The parameters that can be set for the PDH processing boards include the J1 byte, C2 byte, J2
byte, V5 byte, and tributary loopback.

J1 Byte
The J1 byte is the path tracing byte. The transmit end uses the J1 byte to transmit the higher
order access point identifiers in a successive manner. In this way, the receive end learns that it
is continuously connected to the specified transmit end. When the receive end detects the J1
mismatch, the corresponding VC-3 channel generates an LP_TIM alarm.
The value of the J1 byte to be received is null by default.
NOTE

The value of the J1 byte to be transmitted is " HuaWei SBS " by default. There is one space before "Huawei
SBS" and five spaces after "Huawei SBS".

C2 Byte
The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the
VC frames and payload property. The C2 byte to be received and the C2 byte to be transmitted
must match each other. If the C2 mismatch is detected, the corresponding VC-3 channel
generates an LP_SLM alarm.
Table 12-2 provides the mapping relation between the service type and the setting of the C2
byte.
Table 12-2 Mapping relation between the service type and the setting of the C2 byte
Type of the Input Service

Setting of the C2 Byte (in Hex)

TUG structure

02

34M/45M asynchronously mapped into


a C-3

04

140M asynchronously mapped into a


C-4

12

Unequipped

00

J2 Byte
The J2 byte is the VC-12 path tracing byte. The transmit end uses the J2 byte to transmit the
lower order access point identifiers in a successive manner. In this way, the receive end learns
that it is continuously connected to the specified transmit end.

V5 Byte
The V5 is the path status and signal identification byte, which is used to detect bit errors and to
indicate remote errors and failure in the lower order path. The LP_REI and LP_RDI alarms are
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12 Board Configuration Parameters

generated accordingly. Table 12-3 provides the mapping relation between the service type and
the setting of the V5 byte.
Table 12-3 Mapping relation between the service type and the setting of the V5 byte
Type of the Input Service

Setting of the V5 Byte (in Hex)

Asynchronization

02

Byte synchronization

04

HDLC/PPP mapping

0A

Unequipped or Supervisory-Unequipped

00

Equipping Indication
When a service channel just transmits the service but does not process the service, select
Unequipped or Supervisory-Unequipped.
When a service channel transmits the service and also processes the service, select EquippedUnspecific Payload.

Tributary Loopback
The tributary loopback function is used to locate faults in each service channel.
The tributary loopback is a diagnosis function. When the tributary loopback is performed, the
related service is interrupted.

Path Service Type


This parameter is set to specify the service type of the tributary path. Select E3 or T3 based on
the type of the actual path service.

12.3 Data Processing Board


The parameters that need be set for the data processing boards include SDH parameters, and
Ethernet parameters.
12.3.1 SDH Parameters
The SDH parameters that need be set for the data processing boards include the J1 byte, C2 byte,
J2 byte, and V5 byte.
12.3.2 Ethernet Parameters
The Ethernet parameters that need to be set for the Ethernet boards include the working mode
and enabling LCAS.

12.3.1 SDH Parameters


The SDH parameters that need be set for the data processing boards include the J1 byte, C2 byte,
J2 byte, and V5 byte.
12-4

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12 Board Configuration Parameters

J1 Byte
The J1 byte is the path tracing byte. The transmit end transmits the J1 byte in a successive manner.
In this way, the receive end learns that it is continuously connected to the specified transmit end.
When the receive end detects the J1 mismatch, The VC-3 channel generates an LP_TIM_VC3
alarm, and the VC-4 channel generates an HP_TIM alarm.
When the value of the J1 byte to be received is null by default, those alarms are not reported.
NOTE

In the case of the EGT1 board, EFS8 board, or the EFT8 daughter board on the ISU board, the value of the
J1 byte to be received is null by default.

C2 Byte
The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the
VC frames and payload property. The C2 byte to be received and the C2 byte to be transmitted
must match each other.
When the C2 mismatch is detected, The VC-3 channel generates an LP_SLM_VC3 alarm, and
the VC-4 channel generates an HP_SLM alarm.

J2 Byte
The J2 byte is the VC-12 path tracing byte. The transmit end uses the J2 byte to transmit the
lower order access point identifiers in a successive manner. In this way, the receive end learns
that it is continuously connected to the specified transmit end.
When the J2 mismatch is detected, the VC-12 channel generates an LP_TIM_VC12 alarm.
When the value of the J2 byte to be received is null by default, this alarm is not reported.

V5 Byte
The V5 is the path status and signal identification byte, which is used to detect bit errors and to
indicate remote errors and failure in the lower order path. The LP_REI_VC12 and
LP_RDI_VC12 alarms are generated accordingly.
When the receive end detects the V5 mismatch, the VC-12 channel generates an LP_SLM_VC12
alarm.
Table 12-4 provides the mapping relation between the service type and the setting of the V5
byte.
Table 12-4 Mapping relation between the service type and the setting of the V5 byte

Issue 01 (2009-01-20)

Type of the Input Service

Setting of the V5 Byte (in Hex)

Asynchronization

02

Byte synchronization

04

HDLC/PPP mapping

0A

GFP mapping

0D
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12 Board Configuration Parameters

Type of the Input Service

Setting of the V5 Byte (in Hex)

Unequipped or Supervisory-Unequipped

00

12.3.2 Ethernet Parameters


The Ethernet parameters that need to be set for the Ethernet boards include the working mode
and enabling LCAS.

Working Mode
Generally, the interconnected equipment must work in the same fixed working mode. If the
working modes at both ends are different, packets may be lost or the rate decreases. When the
data volume is large, services may even be interrupted.
In the case of the EGT1 board, set the working mode to auto-negotiation or 1000M full-duplex.
In the case of the EFT8 daughter board on the ISU board, set the working mode to autonegotiation or 10M/100M full-duplex.
In the case of the EFS8 board, set the working mode to auto-negotiation, 10M half-duplex, 10M
full-duplex, 100M half-duplex, or 100M full-duplex.

Enabling LCAS
This parameter is set to specify whether to enable the LCAS function.

Maximum Frame Length


For the external ports, set the maximum frame length, which is 1522-byte by default.

Mapping Protocol
The mapping protocols for the interconnected equipment must be the same.
In the case of the EGT1 board, EFS8 board, or EFT8 daughter board on the ISU board, the
following three protocols are available: HDLC, LAPS, and GFP-F. It is recommended that you
use the GFP-F by default.

Tag
This parameter is set to specify the type of the packet. The following three types are available:
Tag Aware, Access, and Hybrid.

12-6

1.

When Tag Aware is selected, the port transparently transmits the packets with tags, and
discards the packets without tags.

2.

When Access is selected, the port adds tags to the received packets without tags based on
the VLAN ID of the port, and discards the packets with tags.

3.

When Hybrid is selected, the port transparently transmits the packets with tags, or adds
tags to the packets without tags based on the default VLAN ID of the port.
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12 Board Configuration Parameters

VLAN ID
This parameter is set to specify the default VLAN ID of the port.

Port Attribute
In the case of the board that supports the QinQ function, you can set the port attribute to UNI,
S-Aware, or C-Aware.

12.4 Cross-Connect and Timing Unit


The clock parameters should be set on the cross-connect and timing unit.
Set the following parameters when synchronization status message (SSM) is not enabled and
the external clock is unavailable:
l

Reference clock source

Reference clock source level

Set the following parameters when the external clock is configured and the SSM is enabled:
l

Reference clock source

Reference clock source level

Building integrated timing supply (BITS) type

S1 byte

Threshold for selecting the clock in case of the switching protection

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A Glossary

Glossary

Numeric
1U

Standard unit of the EIA cabinet (44 mm/1.75 in.)

A
ALS

Automatic Laser Shutdown. Laser automatic shutdown means laser


automatic shutdown is permitted when the optical interface board is not
borne with services or the optical fiber is faulty. Its life can be prolonged
by decreasing the on time of the laser.

APS

Automatic Protection Switching. The ability of a network element to


detect a failed working line and switch the service to a spare (protection)
line. 1+1 APS pairs a protection line with each working line. 1:n APS
provides one protection line for every n working lines.

Asynchronizatio
n

A communication mode where transmission system payloads are not


synchronized and each network terminal runs on its own clock.

Auto-Negotiation

The rate/work mode of the communication party set as self-negotiation


is specified through negotiation according to the transmission rate of the
opposite party.

B
Backup

A method to copy the important data into a backing storage in case that
the original is damaged or corrupted.

Bit Error

An error occurs to some bits in the digital code stream after being
received, judged, and regenerated, thus damaging the quality of the
transmitted information.

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A Glossary

Ethernet

A data link level protocol comprising the OSI model's bottom two layers.
It is a broadcast networking technology that can use several different
physical media, including twisted pair cable and coaxial cable. Ethernet
usually uses CSMA/CD. TCP/IP is commonly used with Ethernet
networks.

Exercise
Switching

An operation to check if the protection switching protocol functions


normally. The protection switching is not really performed.

Extra Traffic

Unprotected traffic that is inserted on the protection channels when the


protection channels are not used for the protection of working channels.
Extra traffic is preempted when the working channels require protection.
Ring interworking on protection is considered as extra traffic.

F
Failure

A condition in which a fault persists in a component for a specific period


of time and thus this component is considered as unable to implement
its basic functions. In a failed component, a fault should be detected.

Forced Switching

This command performs ring switching from working channels to the


protection channels. This switch occurs regardless of the state of the
protection channels, unless the protection channels are satisfying a
higher priority bridge request.

Frame

A cyclic set of consecutive time slots in which the relative position of


each time slot can be identified.

Full Duplex

Pertaining to both parties that can send and receive data at the same time
on the communication link.

J
Jitter

Short waveform variations caused by vibration, voltage fluctuations,


control system instability, etc.

L
Layer

A concept used to allow the transport network functionality to be


described hierarchically as successive levels; each layer being solely
concerned with the generation and transfer of its characteristic
information.

Loopback

The fault of each path on the optical fiber can be located by setting
loopback for each path of the line. There are three kinds of loopback
modes: No loopback, Outloop, Inloop.

M
Management
Information
A-2

Signals that pass the access point.

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A Glossary

Manual
Switching

A type of protection switching. When the protection channel is efficient


and there is no higher-level switching request, this mode switches the
service from the working channel to the protection channel, thus testing
whether network still has the protection capability.

Mapping

A procedure by which tributaries are adapted into virtual containers at


the boundary of an SDH network.

MO

Managed Object. The management view of a resource within the


telecommunication environment that may be managed via the agent.
Examples of SDH managed objects are: equipment, receive port,
transmit port, power supply, plug-in card, virtual container, multiplex
section, and regenerator section.

MSP

Multiplex Section Protection. The MSP function provides the capability


for switching a signal from a working section to a protection section.

Multiplexing

A procedure by which multiple lower order path layer signals are


adapted into a higher order path or the multiple higher order path layer
signals are adapted into a multiplex section.

N
NE

Network element that contains hardware and the software running on


the hardware. Generally, one network element should contain one SCC
board at least, which manages and monitors the entire network element.
The NE software runs on the SCC board.

O
Operating
System

A functional module used to implement the functions of the operating


programs.

Optical Port

A device to allow two or more corresponding optical transmitting units


to be connected.

Output Optical
Power

The ranger of optical energy level of output signals.

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Pass-Through

The action of transmitting by a node exactly what is received by that


node for any given direction of transmission. A pass-through can be
unidirectional or bidirectional. For BLSRs, a pass-through refers to the
K1 and the K2 bytes and the protection channels. Three types of passthroughs are used in BLSRs: K byte passthrough, unidirectional full
pass-through, and bidirectional full pass-through.

Path

A transmission entity to transmit information from the source end to the


sink end, providing monitoring all the way.

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A Glossary

Pointer

An indicator whose value defines the frame offset of a virtual container


with respect to the frame reference of the transport entity on which it is
supported.

R
Regeneration

The process of receiving and reconstructing a digital signal so that the


amplitudes, waveforms and timing of its signal elements are constrained
within specified limits.

Regenerator
The regenerator section overhead comprises rows 1 to 3 of the SOH of
Section Overhead the STM-N signal.

S
SDH

Synchronous Digital Hierarchy. A hierarchical set of digital transport


structures, standardized for the transport of suitably adapted payloads
over physical transmission networks.

Section

A trail in the segment layer.

SNCP

Sub-Network Connection Protection. If the working subnet fails to be


connected or if its performance is inferior to the required level, the
connection of the working subnet is taken over by that of the protection
subnet.

SSM

Synchronization Status Message. ITU-T defines S1 byte to transmit the


network synchronization status information. It uses the lower four bits
of the multiplex section overhead S1 byte to indicate 16 types of
synchronization quality grades.

Subnet

The logical entity in the transmission network and comprises a group of


network management objects. A subnet can contain NEs and other
subnets. A subnet planning can enhance the organization of a network
view.

Synchronization
Source

A clock providing timing services to connected network elements. This


would include clocks conforming to Recommendations G.811, G.812
and G.813.

A-4

T2000

The T2000 is a subnet management system (SNMS). In the


telecommunication management network architecture, the T2000 is
located between the NE level and network level, which can supports all
NE level functions and part of the network level management functions.

Topology

T2000 topology is one part of the basic composition of the man-machine


interactive interface. The topology view clearly shows the structure of
the network, the alarms of different NEs, subnets in the network, the
communication status as well as the basic network operation status.

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Issue 01 (2009-01-20)

OptiX OSN 500 STM-1/STM-4 Multi-Service CPE Optical


Transmission System
Product Description

A Glossary

U
Unprotected

Services transmitted through an ordinary way, once a failure or


interruption occurs, the data cannot be restored for lack of protection
mechanism.

V
Virtual
Container

The information structure used to support path layer connections in the


SDH. It consists of information payload, and path overhead (POH)
information fields organized in a block frame structure which repeats
every 125 or 500 microseconds.

W
WTR Time

Issue 01 (2009-01-20)

A period of time that must elapse before a from a fault recovered


trail/connection can be used again to transport the normal traffic signal
and/or to select the normal traffic signal from.

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OptiX OSN 500 STM-1/STM-4 Multi-Service CPE Optical


Transmission System
Product Description

B Acronyms and Abbreviations

Acronyms and Abbreviations

A
ADM

Add/Drop Multiplexer

AIS

Alarm Indication Signal

APS

Automatic Protection Switch(ing)

C
CSMA

Carrier Sense Multiple Access

D
DCC

Data Communication Channels

DTE

Data Terminal Equipments

E
ECC

Embedded Control Channel

EMC

Electromagnetic Compatibility

EPL

Ethernet Private Line

ETSI

European Telecommunications Standards Institute

F
FPGA

Field Programmable Gate Array

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B Acronyms and Abbreviations

GFP

OptiX OSN 500 STM-1/STM-4 Multi-Service CPE Optical


Transmission System
Product Description

Generic Framing Procedure

H
HDLC

High Level Data Link Control

I
IEEE

Institute of Electrical and Electronics Engineers

ITU-T

International Telecommunication Union - Telecommunication


Standardization Sector

L
LAPS

Link Access Procedure-SDH

LCAS

Link Capacity Adjustment Scheme

LPT

Link State Pass Through

M
MCF

Message Communication Function

MSP

Multiplex Section Protection

MTBF

Mean Time Between Failure

MTTR

Mean Time To Repair

O
OAM

Operation And Maintenance

P
PDH

Plesiochronous Digital Hierarchy

R
RMON

Remote Network Monitoring

B-2

SDH

Synchronous Digital Hierarchy

SFP

Small Form-Factor Pluggable


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Copyright Huawei Technologies Co., Ltd.

Issue 01 (2009-01-20)

OptiX OSN 500 STM-1/STM-4 Multi-Service CPE Optical


Transmission System
Product Description

B Acronyms and Abbreviations

SNCP

Sub-Network Connection Protection

SSM

Synchronization Status Message

T
TM

Issue 01 (2009-01-20)

Terminal Multiplexer

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