Beruflich Dokumente
Kultur Dokumente
PROJECT REPORT,2014
CHAPTER 1
INTRODUCTION
Boilers are pressure vessels designed to heat water or produce steam, which
can then be used to provide space heating and/or service water heating to a building.
In most commercial building heating applications, the heating source in the boiler is a
natural gas fired burner. Oil fired burners and electric resistance heaters can be used
as well. Steam is preferred over hot water in some applications, including absorption
cooling, kitchens, laundries, sterilizers, and steam driven equipment.
Boilers have several strengths that have made them a common feature of
buildings. They have a long life, can achieve efficiencies up to 95% or greater,
provide an effective method of heating a building, and in the case of steam systems,
require little or no pumping energy. However, fuel costs can be considerable, regular
maintenance is required, and if maintenance is delayed, repair can be costly.
Boilers are often one of the largest energy users in a building. For every year
a boiler system goes unattended, boiler costs can increase approximately 10% (1).
Boiler operation and maintenance is therefore a good place to start when looking for
ways to reduce energy use and save money.
1.1 OBJECTIVE
The Objective of this project is to develop a boiler control system in order to
prevent the boiler accident due high pressure and temperature. A boiler system is an
integral component of a plant and control of liquid level ,pressure and temperature
in the drum of the boiler is a critical operational consideration. Nowadays, instead of
conventional control techniques, modern control techniques have been implemented
for a lot of industrial models practically or theoretically. In this project, we describe
the effectiveness of LabVIEW in order to provide better drum level control of
various products evolved in an industry.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
1.2 SCOPE
When a boiler is switched ON we must be always check the Temperature,
Pressure, and level of the water. Their values must be kept in track in order to avoid
major accidents such as explosion of boiler, deviation from the values set etc., Hence
the set value of pressure, temperature and the liquid level has to be maintained.
1.3 METHODOLOGY
Temperature sensors are often sensing devices embedded within some sort of
insulation. The insulation may often be for electrical purposes - to isolate the sensor
electrically. However, good electrical insulation is often also good thermal
insulation, and the presence of that insulation causes the sensor to respond tardily
when the sensor heats up. The Temperature sensor senses the temperature in the
boiler. Similarly the Pressure sensor senses the pressure level in the boiler and the
level sensor also senses the level of the liquid in the Boiler and the signal is given to
the ADC port of the micro controller.
The Analog to Digital port converts the analog to corresponding digital
values. A microcontroller (or MCU) is a computer on a chip used to control any
electronic device. The micro controller is programmed already according to our
objective .
If the water level in the boiler is lower then set value, the microcontroller turn
on the pump motor through relay driver circuit. Similarly the pressure and
temperature is lower then set value , the pressure pump(by closing soft walve) and
heater is turned on respectively. If the water level in the boiler is greater than the set
value, the microcontroller turn off the pump motor through relay driver circuit.
Similarly the pressure and temperature is higher than set value, pressure pump(by
opening solenoid valve) . Set values are given through program.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
Keeping this in mind the boiler tool kits like Control, design and Simulation
were used in order to study the dependencies of the input variables to the output
variables. LabVIEW platform provides ease of analysis at your desktop.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
CHAPTER 2
LITERATURE SURVEY
In excess of the years the require for high quality, better effectiveness and
automatic machinery have improved in the industrial region of power plants. Power
plants have need of continuous monitoring and check at frequent intervals. There are
possibilities of errors at measuring and various stages involved with human workers
and also the lack of few features of microcontrollers.
Power plant section is one of most important department in the industry.
There it is having number of boiling section. This boiling section produces the high
temperature water of the steam level temperature. This steam level temperature is
used for power generation and the steam waters are applied to the turbine section.
After the power is generated, steam waters are supplied to various plants for reuses. If
the supply of the high temperature is reduced to low temperature, it will be used for
all other plants which needs the low temperature.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
CHAPTER 3
WORKING OF BOILERS
Both gas and oil fired boilers use controlled combustion of the fuel to heat
water. The key boiler components involved in this process are the burner, combustion
chamber, heat exchanger, and controls.
BOILER AUTOMATION
PROJECT REPORT,2014
The burner mixes the fuel and oxygen together and, with the assistance of an
ignition device, provides a platform for combustion. This combustion takes place in
the combustion chamber, and the heat that it generates is transferred to the water
through the heat exchanger. Controls regulate the ignition, burner firing rate, fuel
supply, air supply, exhaust draft, water temperature, steam pressure, and boiler
pressure. Hot water produced by a boiler is pumped through pipes and delivered to
equipment throughout the building, which can include hot water coils in air handling
units, service hot water heating equipment, and terminal units. Steam boilers produce
steam that flows through pipes from areas of high pressure to areas of low pressure,
unaided by an external energy source such as a pump. Steam utilized for heating can
be directly utilized by steam using equipment or can provide heat through a heat
exchanger that supplies hot water to the equipment. The discussion of different types
of boilers, below, provides more detail on the designs of specific boiler systems.
Boilers are classified into different types based on their working pressure and
temperature, fuel type, draft method, size and capacity, and whether they condense
the water vapor in the combustion gases. Boilers are also sometimes described by
their key components, such as heat exchanger materials or tube design. These other
characteristics are discussed in the following section on Key Components of Boilers.
Two primary types of boilers include Firetube and Watertube boilers. In a Firetube
boiler, hot gases of combustion flow through a series of tubes surrounded by water.
Alternatively, in a Watertube boiler, water flows in the inside of the tubes and the hot
gases from combustion flow around the outside of the tubes. A drawing of a
watertube boiler is shown in Figure 3.2
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
Firetube boilers are more commonly available for low pressure steam or hot
water applications, and are available in sizes ranging from 500,000 to 75,000,000
BTU input (5). Watertube boilers are primarily used in higher pressure steam
applications and are used extensively for comfort heating applications. They typically
range in size from 500,000 to more than 20,000,000 BTU input (5).
Cast iron sectional boilers are another type of boiler commonly used in
commercial space heating applications. These types of boilers dont use tubes.
Instead, theyre built up from cast iron sections that have water and combustion gas
passages. The iron castings are bolted together, similar to an old steam radiator.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
The sections are sealed together by gaskets. Theyre available for producing
steam or hot water, and are available in sizes ranging from 35,000 to 14,000,000 BTU
input (2). Cast iron sectional boilers are advantageous because they can be assembled
on site, allowing them to be transported through doors and smaller openings. Their
main disadvantage is that because the sections are sealed together with gaskets, they
are prone to leakage as the gaskets age and are attacked by boiler treatment
chemicals.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
CHAPTER 4
BLOCK DIAGRAM
Max232
Power supply
Pic microcontroller
Relay to drive
Uln2003
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
The system requires a regulated +5v supply for the semiconductors and a
+12V unregulated supply for the relay. These can be delivered from the 230V
domestic supply. Before applying this to the system we must step down this high
voltage to an appropriate value. After that it should be rectified. To achieve +5 V DC
we should regulate this.All this are run in the power supply circuitry.
This ac supply goes to a center tap rectifier, which converts the ac into a
unidirectional voltage. The ripples in the resulting supply is filtered and smoothed by
a 2200micro FD/25V capacitor. The 0.1 microfarad capacitor bypasses any high
frequency noises. The resulting supply has magnitude above 17V.This voltage is
given to the regulated IC 7805.This IC provides a regulated 5V positive supply at its
3rd pin. This required input for this is more than 7.5V.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
REGULATOR IC
.
AC I/P
.
.
O/P
.
RECTIFIER
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BOILER AUTOMATION
PROJECT REPORT,2014
1. Unregulated voltage in
2. Regulated voltage out
3. Ground
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
4.1.2 Max232
It
TTL .The serial port of PC uses RS232 voltage levels ,and microcontroller uses TTL
levels. To match these voltage levels MAX232 IC is used . This IC includes a pair of
transmitter and receiver. One advantage of using MAX232 is that, no negative
voltage is required for its working. So need of dual supply is eliminated.
The MAX232 is an integrated circuit that converts signals from an RS-232
serial port to signals suitable for use in TTL compatible digital logic circuits. The
MAX232 is a dual driver/receiver and typically converts the RX, TX, CTS and RTS
signals.The drivers provide RS-232 voltage level outputs (approx. 7.5 V) from a
single + 5 V supply via on-chip charge pumps and external capacitors. This makes it
useful for implementing RS-232 in devices that otherwise do not need any voltages
outside the 0 V to + 5 V range, as power supply design does not need to be made
more complicated just for driving the RS-232 in this case.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
4.1.4 Uln2003
The ULN2001A, ULN2002A, ULN2003 and ULN2004A are high voltage,
high current darlington arrays each containing seven open collector darlington pairs
with common emitters. Each channel rated at 500mA and can withstand peak currents
of 600mA. Suppression diodes are included for inductive load driving and the inputs
are pinned opposite the outputs to simplify board layout. The four versions interface
to all common logic families.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
Design of ULN-2003
This relay driver needs a 12V power supply at the pin 9 and the pin 8 is
grounded . Pins 1 and 2 are inputs. It connected to the pin 27 and 28 respectively.
Pins 16 and 15 are connected to the relay system.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
Relay
All relays operate using the same basic principle. example will use a
commonly used 4 -pin relay. Relays have two circuits: A control circuit (shown in
GREEN) and a load circuit(shown in RED). The control circuit has a small control
coil while the load circuit has a switch. The coil controls the operation of the switch.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
BOILER AUTOMATION
PROJECT REPORT,2014
CHAPTER 5
CIRCUIT DIAGRAM
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
CHAPTER 6
CRITICAL CONTROL PARAMETERS IN BOILER
The control parameters in a boiler are:
Level control is to ensure that the right amount of water is added to the boiler
at the right time.
Low water alarm - For safe boiler operation, the low water alarm ensures that
the combustion of fuel does not continue if the water level in the boiler has
dropped to, or below a predetermined level. For automatically controlled
steam boilers, national standards usually call for two independent low level
alarms, to ensure safety. In the UK, the lower of the two alarms will 'lockout'
the burner, and manual resetting is required to bring the boiler back on line.
High water alarm - The alarm operates if the water level rises too high,
informing the boiler operator to shut off the feedwater supply. Although not
usually mandatory, the use of high level alarms is sensible as they reduce the
chance of water carryover and water hammer in the steam distribution system.
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BOILER AUTOMATION
PROJECT REPORT,2014
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BOILER AUTOMATION
PROJECT REPORT,2014
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
CHAPTER 7
EXPERIMENTAL DESCRIPTION
PIC microcontroller 16F877A of operating volt of 5V and frequency of 10MHz is
used for this project.
7.1 TEMPERATURE MEASUREMENT DESCRIPTIONS
1) Principle of Temperature: Temperature is the degree of hotness or coolness of a
body. When the temperature changes the internal resistance also changes to the
corresponding material.
2) Sensing Device: A sensor is call transducer. The output of the transducer is in the
form of voltage current, resistance, or capacitance.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
Driver Circuit
Level Sensor(high)
Level Sensor(low)
Driver Circuit
Driver Circuit
Temperature Sensor
Relay
Relay
Relay
Heater is
ON
Solenoid
valve
open
Outflow
is ON
PIC
16F877A
PC
(LAB View)
BOILER AUTOMATION
PROJECT REPORT,2014
7.2 OPERATION
Firstly level is 7.2 sensed,if it is low, the solenoid valve is open .water from
the container flows to the boiler.At this time the flow sensor shows the corresponding
flow.water gets rised in the boiler.When a maximum level is reached solenoid valve
is shut off, this max level is sensed by the coressponding level sensor. At this max
level, the boiler is ready,so the heater gets ON.Temperature gets increased when
boiling is continued. When the limit of the temperature is reahed, the outflow
solenoid valve Is ON and steam gets out.when the water level becomes below the low
level the boiler gets OFF automatically.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
CHAPTER 8
COMPONENT DESCRIPTION
8.1 TEMPERATURE SENSOR
In industry, there are different types of high temperature measurement,
according to the variety of temperature. For example, LM35 is used to measure the
temperature in the range of -55C to +150C. . The LM35 series are precision
integrate-circuit temperature sensors whose output voltage is linearly proportional to
the Celsius high temperature. The LM35 hence has an improvement more than linear
temperature sensors calibrated in Kelvin, as the user is not required to subtract a
large constant voltage from its output to obtain convenient Centigrade scaling. If we
want to measure temperature greater than 1000C we have to use Thermocouples.
features
2 Calibrated Directly in Celsius (Centigrade)
Linear + 10 mV/C Scale Factor
0.5C Ensured Accuracy (at +25C)
Rated for Full 55C to +150C Range
Suitable for Remote Applications
Low Cost Due to Wafer-Level Trimming
Operates from 4 to 30 V
Less than 60-A Current Drain
Low Self-Heating, 0.08C in Still Air
Nonlinearity Only C Typical
Low Impedance Output, 0.1 for 1 mA Load
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
Specification:
Supply Voltage
Output Voltage
Output Current
Storage Temp
+35V to -0.2V
+6V to -1.0V
10 mA
+60 0c to-180 0 C
+60 0 C to -150 0 C
+65 0 C to -150 0 C
+65 0 C to -150 0 C
TO-46 Package,
TO-92 Package
SO-8 Package
TO-202 Package
Lead Temp
TO-46 Package, (Soldering, 10 seconds)
TO-92 Package, (Soldering, 10 seconds)
TO-202 Package, (Soldering, 10 seconds)
300 0 C
260 0 C
230 0 C
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
Specification:
Working voltage
:5V-24V
Maximum current
Weight
:43 g
:130 L/min
Operating
:080
temperature
Liquid
:<120
temperature
Operating
:35%90%RH
humidity
Operating pressure :under 1.2Mpa
Store temperature
:-25+80
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
CHAPTER 9
PCB DESCRIPTION
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
This tool helps us in such a way that we can draw that circuit ; list the
functioning of the circuit in response to the best input in assimilation software after
successful simulating the circuit.
The placing and routing software does the PCB artwork in the project the design
automation tool used in orcad, which includes.
Or cad Capture:
For circuiting the diagram ,create schematic and net list.
Or cad Layout: For creating the PCB artwork the design process is of the following
steps.
1.Drawing the circuit schematic:
This is done in orcad schematic capture.It includes many libraries with
thousands of component symbol.We can select the required symbol from library and
place it on the schematic page.After placing the component symbol , the inter
connection is completing using bus tool.After drawing the schematic, the following
operations are performed.
2.Routing :
Routing is the interconnection of component using upper tracks of
required width .Before starting routing the following thinks are done.
1.Enabling/disabling required layers:
The number of layers used and enabling the artwork depends upon the
complexity of the circuit , and fabrication technology available . If the board is single
sided , enable only bottom or solder side layer, so that track will come only on one
side of the PCB If the circuit is much more complex the enable the required number
of inner layer consider the fabrication technique and cost.
Manual routing :
In this , the PCB design has to manually connect each track. This is time
consuming process , but is required some cases. On this also the software checks for
errors and reports.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
CHAPTER 10
PCB FABRICATION
Fig:10.1:PCB fabrication
A printed circuit board, or PCB, is used to mechanically support and
electrically connect electronic components using conductive pathways, tracks or
signal traces etched from copper sheets laminated onto a non-conductive substrate. It
is also referred to as printed wiring board (PWB) or etched wiring board.
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EIE DEPARTMENT
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EIE DEPARTMENT
BOILER AUTOMATION
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Laser-printed resist: Laser-print onto paper (or wax paper), heat-transfer with
an iron or modified laminator onto bare laminate, then etch.
Print onto transparent film and use as photo mask along with photo-sensitized
boards. (i.e. pre-sensitized boards), Then etch. (Alternatively, use a film photo
plotter).
Laser resist ablation: Spray black paint onto copper clad laminate, place into
CNC laser plotter. The laser raster-scans the PCB and ablates (vaporizes) the
paint where no resist is wanted. Etch. (Note: laser copper ablation is rarely
used and is considered experimental.)
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EIE DEPARTMENT
BOILER AUTOMATION
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Use a CNC-mill with a spade-shaped (i.e. 45-degree) cutter or miniature endmill to route away the undesired copper, leaving only the traces.
There are three common "subtractive" methods (methods that remove copper) used
for the production of printed circuit boards:
Silk screen printing uses etch-resistant inks to protect the copper foil.
Subsequent etching removes the unwanted copper. Alternatively, the
ink may be conductive, printed on a blank (non-conductive) board.
The latter technique is also used in the manufacture of hybrid circuits.
Photoengraving uses a photo mask and developer to selectively
remove a photo resist coating. The remaining photo resist protects the
copper foil. Subsequent etching removes the unwanted copper. The
photo mask is usually prepared with a photo plotter from data
produced
by
technician
using
CAM,
or
computer-aided
employed
to
replace
photo
tools
for
high-resolution
requirements.
PCB milling uses a two or three-axis mechanical milling system to
mill away the copper foil from the substrate. A PCB milling machine
(referred to as a 'PCB Prototype') operates in a similar way to a plotter,
receiving commands from the host software that control the position of
the milling head in the x, y, and (if relevant) z axis. Data to drive the
Prototype is extracted from files generated in PCB design software and
stored in HPGL or Gerber file format.
"Additive" processes also exist. The most common is the "semi-additive" process. In
this version, the unpatterned board has a thin layer of copper already on it. A reverse
mask is then applied. (Unlike a subtractive process mask, this mask exposes those
parts of the substrate that will eventually become the traces.)
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EIE DEPARTMENT
BOILER AUTOMATION
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Additional copper is then plated onto the board in the unmasked areas; copper
may be plated to any desired weight. Tin-lead or other surface platings are then
applied. The mask is stripped away and a brief etching step removes the now-exposed
original copper laminate from the board, isolating the individual traces. Some boards
with plated through holes but still single sided were made with a process like this.
General Electric made consumer radio sets in the late 1960s using boards like these.
10.3 ETCHING
Chemical etching is done with ferric chloride, ammonium persulfate, or
sometimes hydrochloric acid. For PTH (plated-through holes), additional steps of
electrolysis deposition are done after the holes are drilled, then copper is electroplated
to build up the thickness, the boards are screened, and plated with tin/lead. The
tin/lead becomes the resist leaving the bare copper to be etched away.
10.4 LAMINATION
Some PCBs have trace layers inside the PCB and are called multi-layer PCBs.
These are formed by bonding together separately etched thin boards.
10.5 DRILLING
Holes through a PCB are typically drilled with tiny drill bits made of solid
tungsten carbide. The drilling is performed by automated drilling machines with
placement controlled by a drill tape or drill file. These computer-generated files are
also called numerically controlled drill (NCD) files or "Excellon files". The drill file
describes the location and size of each drilled hole. These holes are often filled with
annular rings (hollow rivets) to create vias. Vias allow the electrical and thermal
connection of conductors on opposite sides of the PCB.
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EIE DEPARTMENT
BOILER AUTOMATION
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Most common laminate is epoxy filled fiberglass. Drill bit wear is partly due
to embedded glass, which is harder than steel. High drill speed necessary for cost
effective drilling of hundreds of holes per board causes very high temperatures at the
drill bit tip, and high temperatures (400-700 degrees) soften steel and decompose
(oxidize) laminate filler. Copper is softer than epoxy and interior conductors may
suffer damage during drilling.
When very small vias are required, drilling with mechanical bits is costly
because of high rates of wear and breakage. In this case, the vias may be evaporated
by lasers. Laser-drilled vias typically have an inferior surface finish inside the hole.
These holes are called micro vias.
It is also possible with controlled-depth drilling, laser drilling, or by predrilling the individual sheets of the PCB before lamination, to produce holes that
connect only some of the copper layers, rather than passing through the entire board.
These holes are called blind vias when they connect an internal copper layer to an
outer layer, or buried vias when they connect two or more internal copper layers and
no outer layers.
The walls of the holes, for boards with 2 or more layers, are made conductive
then plated with copper to form plated-through holes that electrically connect the
conducting layers of the PCB. For multilayer boards, those with 4 layers or more,
drilling typically produces a smear of the high temperature decomposition products of
bonding agent in the laminate system. Before the holes can be plated through, this
smear must be removed by a chemical de-smear process, or by plasma-etch.
Removing (etching back) the smear also reveals the interior conductors as well
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EIE DEPARTMENT
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Test
Unpopulated boards may be subjected to a bare-board test where each circuit
connection (as defined in a netlist) is verified as correct on the finished board. For
high-volume production, a Bed of nails tester, a fixture or a Rigid needle adapter is
used to make contact with copper lands or holes on one or both sides of the board to
facilitate testing. A computer will instruct the electrical test unit to apply a small
voltage to each contact point on the bed-of-nails as required, and verify that such
voltage appears at other appropriate contact points. A "short" on a board would be a
connection where there should not be one; an "open" is between two points that
should be connected but are not. For small- or medium-volume boards, flying probe
and flying-grid testers use moving test heads to make contact with the
copper/silver/gold/solder lands or holes to verify the electrical connectivity of the
board under test.
Printed Circuit Assembly
After the printed circuit board (PCB) is completed, electronic components
must be attached to form a functional printed circuit assembly or PCA (sometimes
called a "printed circuit board assembly" PCBA). In through-hole construction,
component leads are inserted in holes. In surface-mount construction, the components
are placed on pads or lands on the outer surfaces of the PCB. In both kinds of
construction, component leads are electrically and mechanically fixed to the board
with a molten metal solder.
There are a variety of soldering techniques used to attach components to a
PCB. High volume production is usually done with machine placement and bulk
wave soldering or reflow ovens, but skilled technicians are able to solder very tiny
parts (for instance 0201 packages which are 0.02 in. by 0.01 in.) by hand under a
microscope, using tweezers and a fine tip soldering iron for small volume prototypes.
Some parts are impossible to solder by hand, such as ball grid array (BGA) packages.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
BOILER AUTOMATION
PROJECT REPORT,2014
algorithms, not only to detect the failing nets, but also to isolate the faults to specific
nets, devices, and pins. When boards fail the test, technicians may desolder and
replace failed components, a task known as rework.
Protection and Packaging
PCBs intended for extreme environments often have a conformal coating,
which is applied by dipping or spraying after the components have been soldered. The
coat prevents corrosion and leakage currents or shorting due to condensation. The
earliest conformal coats were wax modern conformal coats are usually dips of dilute
solutions of silicone rubber, polyurethane, acrylic, or epoxy. Another technique for
applying a conformal coating is for plastic to be sputtered onto the PCB in a vacuum
chamber. The chief disadvantage of conformal coatings is that servicing of the board
is rendered extremely difficult.
Many assembled PCBs are static sensitive, and therefore must be placed in
antistatic bags during transport. When handling these boards, the user must be
grounded (earthed). Improper handling techniques might transmit an accumulated
static charge through the board, damaging or destroying components. Even bare
boards are sometimes static sensitive. Traces have become so fine that it's quite
possible to blow an etch off the board (or change its characteristics) with a static
charge. This is especially true on non-traditional PCBs such as MCMs and
microwave PCBs.
Design
Card dimensions and template are decided based on required circuitry and
case of the PCB. Determine the fixed components and heat sinks if required.
EIE DEPARTMENT
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Routing the signal trace. For optimal EMI performance high frequency signals
are routed in internal layers between power or ground planes as power plane
behaves as ground for AC.
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EIE DEPARTMENT
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Fabrication Techniques
The fabrication techniques used in this project can be broadly classified into:
MECHANICAL FABRICATION, consisting of mechanical designs i.e.
frame, tower, tank etc.
ELECTRICAL FABRICATION, consisting of electrical design i.e. making
PCB, soldering etc.
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EIE DEPARTMENT
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Mechanical Fabrication
For the basic frame we are using plywood cut out accordingly so as to adjust
the PCB on the top, the transformer, the main and source tank.
Electrical Fabrication
Soldering
How to Solder?
Mount components at their appropriate place; bend the leads slightly
outwards to prevent them from falling out when the board is turned over
for soldering. No cut the leads so that you may solder them easily. Apply a
small amount of flux at these components leads with the help of a
screwdriver. Now fix the bit or iron with a small amount of solder and
flow freely at the point and the P.C.B copper track at the same time. A
good solder joint will appear smooth & shiny. If all appear well, you may
continue to the next solder connections.
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EIE DEPARTMENT
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solder can
type.
enough
if
solder.
The
the
A
good
difference
between good & bad soldering is just a few seconds extra with a hot iron
applied firmly.
Precautions
Do not use a spread solder on the board, it may cause short circuit.
Position the board so that gravity tends to keep the solder where you
want it.
Do not over heat the components at the board. Excess heat may
damage the components or board.
The board should not vibrate while soldering otherwise you have a dry
or a cold joint.
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
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EIE DEPARTMENT
BOILER AUTOMATION
PROJECT REPORT,2014
CHAPTER 11
CONCLUSION
The most important aspect of any power plant is the boiler control. Several
techniques can be implemented to control the boiler in power plant. The method that
has to be used relies on varied objectives like superior quality, increased efficiency,
high profit and other such points depending upon the purpose of the company that
implies it.With the prime objective of catering to these necessities and the needs of
the industrial sector, significance has been given here to automation.
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EIE DEPARTMENT