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Kultur Dokumente
, LTD
: 407 163
WEB: http://www.winstar.com.tw
E-mail: sales@winstar.com.tw
Tel:886-4-24262208 Fax886-4-24262207
SPECIFICATION
CUSTOMER :
MODULE NO.:
WH1601A-YYH-JT#
APPROVED BY:
( FOR CUSTOMER USE ONLY )
SALES BY
VERSION
PCB VERSION:
APPROVED BY
DATE
CHECKED BY
REVISED
PAGE NO.
DATA:
PREPARED BY
SUMMARY
RECORDS OF REVISION
VERSION
DATE
0
A
2007.12.14
2008/9/12
REVISED
PAGE SUMMARY
NO.
First issue
13 Modify Character Generator
ROM Pattern
2011/10/28 15-19 Correct ST7066IC
information.
Page 2 of 29
Contents
1.Module Classification Information
2.Precautions in use of LCD Modules
3.General Specification
4.Absolute Maximum Ratings
5.Electrical Characteristics
6.Optical Characteristics
7.Interface Pin Function
8.Contour Drawing & Block Diagram
9.Function Description
10.Character Generator ROM Pattern
11.Instruction Table
12.Timing Characteristics
13.Initializing of LCM
14.Reliability
15.Backlight Information
16. Inspection specification
17. Material List of Components for RoHs
18. Recommendable storage
Page 3 of 29
JT#
Page 4 of 29
3.General Specification
Item
Dimension
Unit
16 characters x 1 Lines
mm
View area
66.0 x 16.0
mm
Active area
59.62 x 6.56
mm
Dot size
0.55 x 0.75
mm
Dot pitch
0.63 x 0.83
mm
Character size
3.07 x 6.56
mm
Character pitch
3.77 x 6.56
mm
Number of Characters
Module dimension
LCD type
Duty
1/16
View direction
6 oclock
Backlight Type
Page 5 of 29
Symbol
Min
Typ
Max
Unit
Operating Temperature
TOP
-20
+70
Storage Temperature
TST
-30
+80
Input Voltage
VI
VSS
VDD
VDD-VSS
-0.3
VDD-V0
-0.3
13
5.Electrical Characteristics
Item
Supply Voltage For Logic
Symbol
Condition
Min
Typ
Max
Unit
VDD-VSS
4.5
5.0
5.5
Ta=-20
5.6
Ta=25
4.5
Ta=70
3.7
*Note
VIH
0.7 VDD
VDD
VIL
VSS
0.6
VOH
3.9
VOL
0.4
Supply Current
IDD
VDD=5V
1.0
1.2
1.5
mA
* Note: Please design the VOP adjustment circuit on customer's main board
d d
S S
L C M
V
1 0 K
R
M
~ 2 0 K
o d u le
Page 6 of 29
6.Optical Characteristics
Item
Symbol
Condition
Min
Typ
Max
Unit
(V)
CR2
20
40
deg
(H)
CR2
-30
30
deg
CR
T rise
150
200
ms
T fall
150
200
ms
View Angle
Contrast Ratio
Response Time
N o n - s e le c te d
S e le c te d
I n te n s ity
1 0 0
N o n - s e le c te d
S e le c te d
C o n itio n
a v e
N o n - s e le c te d
a v e
C o n itio n
C o n itio n
I n t e n s i t y
1 0
C r M
a x
C r =
L o n
/ L o f f
9 0
1 0 0
V o p
D r iv in g
[ p o s itiv e
T r
V o lta g e ( V )
T f
ty p e ]
[ p o s itiv e
ty p e ]
Conditions :
Operating Voltage : Vop
Viewing Angle() : 0 0
Frame Frequency : 64 HZ
Page 7 of 29
Level
Description
VSS
0V
Ground
VDD
5.0V
VO
RS
H/L
R/W
H/L
H: Read(MPUModule) L: Write(MPUModule)
H,HL
DB0
H/L
Data bit 0
DB1
H/L
Data bit 1
DB2
H/L
Data bit 2
10
DB3
H/L
Data bit 3
11
DB4
H/L
Data bit 4
12
DB5
H/L
Data bit 5
13
DB6
H/L
Data bit 6
14
DB7
H/L
Data bit 7
15
LED +
16
LED
Page 8 of 29
6 6 .0 ( V A )
A )
2 .4 5
2 .0
1 6 -
1 5 .4 6
P 2 .5 4 * 1 5 = 3 8 .1
2 .0
1 4 .7 2
5 .4
8 .0
1 .0
s s
d d
R S
R /W
a x
2 .5
5 9 .6 2 ( A
1 0 .1 9
1 1 .4 6
7 .0
1 0 .0
0 .5
7 1 .2
H 2
1 6
B 0
B 1
6 .5 6 ( A A )
5 .0 8
2 .5
4 -
2 . 5
4 -
5 .0
3 1 .0
1 3 .0 8
P T H
1 .6
P A D
4 -
1 .0
P T H
L E D
7 5 .0
B /L
ig h
H 1
1 3 .2
H 2
8 .6
B 2
1 0
B 3
1 1
B 4
1 2
B 5
1 3
B 6
1 4
B 7
1 5
1 6
3 .7 7
3 .0 7
0 .6 3
0 .5 5
n o n - s p e c if ie d
0 .7 5
0 .8 3
T h e
6 .5 6
1 6 .0 ( V A )
2 5 .2
3 6 .0
0 .5
S I Z E
Page 9 of 29
R S
C o m
1 ~ 8
to le r a n c e
o f
d im
e n s io n
is
0 .3 m
R S
C o n tr o lle r /C o m
R /W
C o m
1 ~ 8
C o m
9 ~ 1 6
D r iv e r
P U
E
H
D
d d
V o
1 0 K ~ 2 0 K
V s s
E x te r n a l c o n tr a s t a d ju s tm
R A
S e g 1 ~ 4 0
e n t.
C h a r a c te r
D
C ir c u it
E q u iv a le n t
a n d
s e r ie s
1 6 X
o r
B 7
e r
6 8
B 0 ~ D
4 4 7 8 0
P o w
s e r ie s
o r
B ia s
8 0
lo c a te d
1 0
1 1
1 2
1 3
1 4
1 5
1 6
a d d r e s s
0 0
0 1
0 2
0 3
0 4
0 5
0 6
0 7
4 0
4 1
4 2
4 3
4 4
4 5
4 6
4 7
o d e .
2 - lin e
d is p la y
Page 10 of 29
L C D
9.Function Description
The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an
instruction register (IR) and a data register (DR).
The IR stores instruction codes, such as display clear and cursor shift, and address information for
display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from
the MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When
address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM.
By the register selector (RS) signal, these two registers can be selected.
RS
R/W
Operation
Low bits
Example: DDRAM addresses 4E
AC
(hexadecimal)
Page 11 of 29
9 10 11 12 13 14 15
00 01 02
03
04 05 06 07 40 41 42
2-Line display mode
43
44
45 46
16
47
Page 12 of 29
Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns
Table 1.
F
o r
d o t
c h a r a c t e r
h a r a c t e r
p a t t e r n s
o d e s
C
i g h
d a t a
o w
i g h
h a r a c t e r
a t t e r n s
d d r e s s
o w
d a t a
i g h
o w
o r
1 0
d o t
i g h
"
i g h
p a t t e r n (
u r s o r
p a t t e r n
h a r a c t e r
p a t t e r n (
u r s o r
p a t t e r n
p a t t e r n s
o w
i g h
h a r a c t e r
a t t e r n s
d d r e s s
o d e s
d a t a
C
(
c h a r a c t e r
h a r a c t e r
h a r a c t e r
o w
d a t a
i g h
o w
p a t t e r n
"
Page 13 of 29
h a r a c t e r
u r s o r
p a t t e r n
p p e r
4
L o w
4
b i t
L L L L
e r
L L L H
L L H
L L H
L H
L L
L H
L H
L H
L H
L L L
b i t
L L L H
L L H
L L H
L H
L L
L H
L H
L H
L H
L L L L
L L L
L L H
L H
L H
L L
L H
Page 14 of 29
L L H
L H
L H
L L
L H
11.Instruction Table
Instruction Code
Instruction
Description
RS
Execution time
(fosc=270Khz)
Clear Display
1.52ms
"00H" from AC
Return Home
Entry Mode
Set
Display
ON/OFF
Control
I/D
SH
1.52ms
37s
D=1:entire display on
0
37s
C=1:cursor on
B=1:cursor position on
Set cursor moving and
Cursor or
Display Shift
S/C
R/L
37s
Function Set
DL
37s
Set CGRAM
Address
Set DDRAM
Address
Read Busy
Flag and
Address
37s
37s
BF
AC6 AC5 AC4 AC3 AC2 AC1 AC0 operation or not can be known by
reading BF. The contents of address
counter can also be read.
0s
D7
D6
D5
D4
D3
D2
D1
D0 RAM
(DDRAM/CGRAM)
Read Data
from RAM
D7
D6
D5
D4
D3
D2
D1
D0 RAM
(DDRAM/CGRAM)
37s
dont care
Page 15 of 29
12.Timing Characteristics
12.1
Pin E
1200
ns
TPW
Pin E
140
ns
TR,TF
Pin E
25
ns
TAS
Pins: RS,RW,E
ns
TAH
Pins: RS,RW,E
10
ns
TDSW
40
ns
TH
10
ns
Page 16 of 29
TC
Pin E
1200
ns
TPW
Pin E
140
ns
TR,TF
Pin E
25
ns
TAS
Pins: RS,RW,E
ns
TAH
Pins: RS,RW,E
10
ns
TDDR
100
ns
TH
10
ns
Page 17 of 29
13.Initializing of LCM
Page 18 of 29
Page 19 of 29
14.Reliability
Content of Reliability Test (wide temperature, -20~70)
Environmental Test
Test Item
High Temperature
storage
Low Temperature
storage
High Temperature
Operation
Low Temperature
Operation
High Temperature/
Humidity Operation
Thermal shock
resistance
Content of Test
Endurance test applying the high storage temperature
for a long time.
Endurance test applying the high storage temperature
for a long time.
Endurance test applying the electric stress (Voltage &
Current) and the thermal stress to the element for a
long time.
Endurance test applying the electric stress under low
temperature for a long time.
The module should be allowed to stand at 60
,90%RH max
For 96hrs under no-load condition excluding the
polarizer,
Then taking it out and drying it at normal temperature.
The sample should be allowed stand the following 10
cycles of
operation
-20
25
70
30min
5min
1 cycle
Test Condition
80
200hrs
-30
200hrs
Note
70
200hrs
-20
200hrs
60,90%RH
96hrs
1,2
-20/70
10 cycles
Total fixed
amplitude : 15mm
Vibration
Frequency :
10~55Hz
One cycle 60 seconds
to 3 directions of
X,Y,Z for
Each 15 minutes
2
1,2
30min
Vibration test
VS=800V,RS=1.5k
CS=100pF
1 time
Page 20 of 29
15.Backlight Information
Specification
PARAMETER
SYMBOL MIN
TYP
MAX
UNIT
TEST
Supply Current
ILED
100
130
190
mA
V=4.2V
Supply Voltage
4.0
4.2
4.4
Reverse Voltage
VR
IV
135
195
CD/M2 ILED=130mA
Wave Length
565
575
585
nm
ILED=130mA
Life Time
100000
Hr.
ILED130mA
Color
Yellow Green
Luminous
Intensity
CONDITION
Note: The LED of B/L is drive by current only, drive voltage is for reference only.
drive voltage can make driving current under safety area (current between
minimum and maximum).
p in 1 5
r iv e
f r o m
p in 1 5 ,p in 1 6
R
A
B /L
K
p in 1 6
L C M
Page 21 of 29
01
02
Item
Criterion
AQL
Electrical
Testing
0.65
Black or white 2.1 White and black spots on display 0.25mm, no more than
spots on LCD
three white or black spots present.
(display only) 2.2 Densely spaced: No more than two spots or lines within 3mm
03
04
LCD black
spots, white
spots,
contamination
(non-display)
Polarizer
bubbles
Acceptable Q TY
Accept no dense
0.100.20
0.200.25
2
1
0.25
2.5
Acceptable Q TY
Accept no dense
2.5
2
As round type
Acceptable Q TY
0.20
0.200.50
0.501.00
Accept no dense
3
2
1.00
Total Q TY
0
3
Page 22 of 29
2.5
2.5
NO
Item
05
Scratches
Criterion
AQL
Symbols Define:
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
06
Chipped
glass
z: Chip thickness
y: Chip width
x: Chip length
Z1/2t
x1/8a
1/2tz2t
x1/8a
z: Chip thickness
y: Chip width
x: Chip length
Z1/2t
x1/8a
1/2tz2t
x1/8a
Page 23 of 29
2.5
NO
Item
Criterion
AQL
Symbols :
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
y: Chip width
x: Chip length
z: Chip thickness
y0.5mm
x1/8a
0 zt
06
Glass
crack
2.5
y: Chip width
x: Chip length
z: Chip thickness
y L
x1/8a
0 zt
If the chipped area touches the ITO terminal, over 2/3 of the ITO must
remain and be inspected according to electrode terminal specifications.
If the product will be heat sealed by the customer, the alignment mark
not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width
x: length
y1/3L
xa
Page 24 of 29
NO
Item
07
Cracked glass
08
09
10
Backlight
elements
Bezel
PCBCOB
Criterion
AQL
2.5
0.65
2.5
9.1 Bezel may not have rust, be deformed or have fingerprints, stains
or other contamination.
9.2 Bezel must comply with job specifications.
10.1 COB seal may not have pinholes larger than 0.2mm or
contamination.
10.2 COB seal surface may not have pinholes through to the IC.
10.3 The height of the COB should not exceed the height indicated
in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the seal
area on the PCB. And there should be no more than three
places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts, missing
parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw
hold pad, make sure it is smoothed down.
10.9 The Scraping testing standard for Copper Coating of PCB
0.65
2.5
0.65
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
2.5
X
Y
11
Soldering
X * Y<=2mm2
Page 25 of 29
2.5
2.5
2.5
0.65
NO
12
Item
General
appearance
Criterion
12.1 No oxidation, contamination, curves or, bends on interface Pin
(OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP.
12.3 No contamination, solder residue or solder balls on product.
12.4 The IC on the TCP may not be damaged, circuits.
12.5 The uppermost edge of the protective strip on the interface pin
must be present or look as if it cause the interface pin to sever.
12.6 The residual rosin or tin oil of soldering (component or chip
component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened.
12.8 Pin type must match type in specification sheet.
12.9 LCD pin loose or missing pins.
12.10 Product packaging must the same as specified on packaging
specification sheet.
12.11 Product dimension and structure must conform to product
specification sheet.
Page 26 of 29
AQL
2.5
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
0.65
Material
(Cd)
(Pb)
(Hg)
(Cr6+)
PBBs
PBDEs
Limited
Value
100
ppm
1000
ppm
1000
ppm
1000
ppm
1000
ppm
1000
ppm
Place the panel or module in the temperature 25C5C and the humidity below 65% RH
Do not place the module near organics solvents or corrosive gases.
Do not crush, shake, or jolt the module
Page 27 of 29
winstar
LCM Sample Estimate Feedback Sheet
Module Number
Page: 1
1Panel Specification
1. Panel Type
Pass
NG ,
2. View Direction
Pass
NG ,
3. Numbers of Dots
Pass
NG ,
4. View Area
Pass
NG ,
5. Active Area
Pass
NG ,
6. Operating Temperature
Pass
NG ,
7. Storage Temperature
Pass
NG ,
1. PCB Size
Pass
NG ,
2. Frame Size
Pass
NG ,
3. Materal of Frame
Pass
NG ,
4. Connector Position
Pass
NG ,
Pass
NG ,
6. Backlight Position
Pass
NG ,
7. Thickness of PCB
Pass
NG ,
NG ,
9. Height of Module
Pass
NG ,
10. Others
Pass
NG ,
1. Pitch of Connector
Pass
NG ,
Pass
NG ,
Pass
NG ,
Pass
NG ,
5. Others
Pass
NG ,
1. B/L Type
Pass
NG ,
2. B/L Color
Pass
NG ,
8. Others
2Mechanical Specification
4Backlight Specification
Pass
NG ,
5. Brightness of B/L
Pass
NG ,
Pass
NG ,
7. Others
Pass
NG ,
Go to page 2
Page 28 of 29
NG ,
winstar
Module Number
Page: 2
Pass
NG ,
2. Supply Current
Pass
NG ,
Pass
NG ,
Pass
NG ,
Pass
NG ,
Pass
NG ,
7. Interface Function
Pass
NG ,
8. LCD Uniformity
Pass
NG ,
9. ESD test
Pass
NG ,
Pass
NG ,
10. Others
6Summary
Sales signature
Customer Signature
Date
Page 29 of 29