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Description
Not to scale
Equivalent Circuit
E
38101, Rev. 1
2SA2151A
SELECTION GUIDE
Part Number
Type
hFE Rating
Packing
Range O: 50 to 100
2SA2151A*
PNP
Range P: 70 tp 140
Range Y: 90 to 180
*Specify hFE range when ordering. If no hFE range is specified, order will be fulfilled with either or both range O and range Y,
depending upon availability.
Symbol
Rating
Unit
Collector-Base Voltage
VCBO
230
Collector-Emitter Voltage
VCEO
230
Emitter-Base Voltage
VEBO
Collector Current
IC
15
Base Current
IB
PC
160
Junction Temperature
TJ
150
Storage Temperature
Tstg
55 to150
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Collector-Cutoff Current
ICBO
VCB = 230 V
10
IEBO
VEB = 6 V
10
V(BR)CEO
IC = 50 mA
230
180
Collector-Emitter Voltage
DC Current Transfer Ratio*
Collector-Emitter Saturation Voltage
Cutoff Frequency
Output Capacitance
hFE
VCE = 4 V, IC = 3 A
50
VCE(sat)
IC = 5 A, IB = 0.5 A
0.5
VCE = 12 V, IE = 0.5 A
20
MHz
VCB = 10 V, IE = 0 A, f = 1 MHz
450
pF
fT
COB
38101, Rev. 1
2SA2151A
Performance Characteristics
15
1A
700
mA
500
mA
300 m
200 m
IC (A)
100 mA
IC vs. VCE
VCE(sat) (V)
10
VCE(sat) vs. IB
50 mA
IB= 20 mA
IC= 5 A
0
2
VCE (V)
15
hFE
IC (A)
1.0
IB (A)
1.5
2.0
10
100
Typ.
100
0.5
VCE = 4 V Continuous
30C
C
25C
hFE vs. IC
125
IC vs. VBE
0.5
1000
10
VCE = 4 V Continuous
IC= 10 A
10
1.0
VBE (V)
1.5
2.0
0.01
0.1
1
IC (A)
10.00
1000
25C
100
30C
hFE vs. IC
RJA vs. t
VCE = 4 V Continuous
38101, Rev. 1
1.00
0.10
10
RJA (C/W)
hFE
125C
0.01
0.1
1
IC (A)
10
100
0.01
10
t (ms)
100
1000
2SA2151A
10
10
DC
0m
IC (A)
10.0
1.0
0.1
0.01
10
100
1000
VCE (V)
30
200
VCE = 12 V Continuous
150
W
ith
20
PC vs. TA
In
fin
ite
PC (W)
fT vs. IE
fT (MHz)
Typ.
100
10
He
at
sin
k
50
3.5
0.01
0.1
10
100
Without Heatsink
0
25
IE (A)
38101, Rev. 1
50
75
100
TA (C)
125
150
2SA2151A
XXXXXXXX
XXXXX
XXXXX
Exposed
heatsink pad
2.1 MAX
19.9 0.3
Branding
Area
5.0 MAX
3.2 0.1
9.6 0.2
6.0 0.2
13.6 0.2
5.0 0.2
1.8 0.3
14.0 0.3
2.0 0.2
15.6 0.3
+0.2
3.5
1.7 0.1
+0.2
0.6 0.1
2 0.1
+0.2
0.1
1.0
+0.2
0.1
20.0 MIN
+0.2
+0.2
2 0.1
View A
View B
5.45 0.1
Terminal dimension at lead tip
3
0.7 MAX
View A
Gate burr: 0.3 mm (max.), mold flash may appear at opposite side
Terminal core material: Cu
Terminal treatment: Ni plating and Pb-free solder dip
Leadform: 100
Package: TO-3P (M100)
Approximate weight: 6 g
Dimensions in millimeters
0.7 MAX
View B
2SA2151A
Suppliers
G746
YG6260
SC102
38101, Rev. 1
2SA2151A
The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the
latest revision of the document before use.
Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or
any other rights of Sanken or any third party which may result from its use.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures
including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device
failure or malfunction.
Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and
its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever
long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales
representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the
degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the
load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,
derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such
as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of
derating of junction temperature affects the reliability significantly.
When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically
or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance
and proceed therewith at your own responsibility.
Anti radioactive ray design is not considered for the products listed herein.
Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribution network.
The contents in this document must not be transcribed or copied without Sanken's written consent.
38101, Rev. 1