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Die Attach
Die attach is also known as die mount or die bond is the process of attaching the silicon
chip to the die pad or die cavity of the support structure. There are few types of die
attach, they are eutectic die attach, soft solder die attach, flip chip bonding, tape and other
die attach process and epoxy die attach. The die attach process that commonly used are
eutectic die attach and epoxy die attach.
The eutectic die attach process is a well-established bonding technique. This technique
has been used in the early days of semiconductors for the first transistors and integrated
circuits (IC). It is still widely used for small signal products manufactured by the millions
every day. Presently, eutectic die attach has regained importance in the field of packaging
optoelectronic components and high-power communication devices. Under high
temperature, the silicon-gold combination forms the eutectic bond. A scrub motion during
the bond process increases the strength and quality of the intermetallic connection
between the chip and substrate. For large chips, additional gold in ribbon form is used.
Because of the high temperature of the process (up to 450C), a protective forming gas
atmosphere (a nitrogen/ hydrogen combination) is needed to prevent oxidation of the lead
frame.
Epoxy die attach generally encompasses the use of other adhesives, such as polyimide- or
silicone-based materials. The adhesive is dispensed in paste form on the bond pad of the
lead frame or substrate before die placement. The wafer substrate or the silicon chip is
usually bonded to the lead frame using conductive silver or solder (tin/lead) based on
epoxy polymers. Some of the power product contain epoxy die attach material that
contain 88% - 95% lead.
The machine normally use for die attach is Die Bonder Esec 2100 SC. Die Bonder Esec
2100 SC is the most flexible 300 mm high speed platform, capable of running the smart
card tape. It is the most effortless system to run, assist and control production resulting in
a quantum leap in throughput and yield at the lowest cost of ownership.
Reference
http://electroiq.com/blog/2002/04/the-back-end-process-step-4-die-attachbrtodayschallenges/
http://www.besi.com/products-technology/product-details/product/esec-2100sc/show/#tabs-445