Groups:

Member1
email1
Grade1
Member2
email2
Grade 2
Member3
email3
Grade 3

G1
Oesting, Matthew
moesting3

G2
Boggs, Thomas
tboggs3

G3
Ivester, Julius
jivester3

G5
Kim, Choongsoon
ckim96

Jaoudi, Joseph
jjaoudi3

Giles, David
dgiles3

Larsen, Dennis
dlarsen8

McMenamin, Peter
pmcmenamin3

Collins, Michelle
mcollins44

Lumish, Jeffrey
jlumish3

Zhang, Yining
yzhang611

BGR and BMR Specifications:

CMOS Process
Baker 50 nm Table
Supply (V)
Vref (V)
Max Supply Sensitivity (ppm) within 10% of VDD
Max Temp Sensitivity (ppm @ 'C)
100 @ 37
Max Power consumption (uW)
Iref (uA)
Iref with VTHn = 10%
Iref with VTHp = 10%
Iref with R= 10%
Vref with VTHn = 10%
Vref with VTHp = 10%
Vref with R= 10%
Minumum/Maximum Supply Voltage
TCIref (ppm)
TCVref (ppm)
Power Consumption (uW)
Resistor Value (Ohm) and TCR1
Vref and Iref within temp sweep (-20 to 100 'C)
Vref and Iref within supply sweep (10% to 150%)
Power Supply Rejection Ratio (PSRR) for Vref and Iref
Startup delay

Baker 1-um Table

1.2
0.6
2000

TSMC-0.18
3.7
2.5
1000

100 @ 37
10
0.4

TSMC-0.18
1.2
0.7
1000

10 @ 37
20
3

2.4
1
2000
50 @ 26

10
2

10
2.5

Groups:
Member1
email1
Grade1
Member2
email2
Grade 2
Member3
email3
Grade 3

G6
Kani, Nickvash
nkani3

G7
Li, Man
mli76

G9
Ravichandran, Adithya
aravichandran7

G10
Biesiadecki, Todd
tbiesiadecki3

Kumar, Vachan
vkumar38

Montoya, Andrew
amontoya8

Song, Jack
jsong44

Murali, Kowshik
kmurali8

BGR and BMR Specifications:

Process
AMI-0.5
Supply (V)
Vref (V)
Max Supply Sensitivity (ppm) within 10% of VDD
Max Temp Sensitivity (ppm @ 'C)
50 @ 26
Max Power consumption (uW)
Iref (uA)
Iref with VTHn = 10%
Iref with VTHp = 10%
Iref with R= 10%
Vref with VTHn = 10%
Vref with VTHp = 10%
Vref with R= 10%
Minumum/Maximum Supply Voltage
TCIref (ppm)
TCVref (ppm)
Power Consumption (uW)
Resistor Value (Ohm) and TCR1
Vref and Iref within temp sweep (-20 to 100 'C)
Vref and Iref within supply sweep (10% to 150%)
Power Supply Rejection Ratio (PSRR) for Vref and Iref
Startup delay

Malinowski, Andrew
amalinowsk3

Paladugu, Eswar
epaladugu3

AMI-0.5
5
2.5
1000

Baker 1-um Table

3.3
1.26
1000

50 @ 50
15
1

AMI-0.35
5
1.26
1000

100 @ 37
5
0.25

2.4
0.6
500
100 @ 26

10
1

10
2.5

Instructions:
Design a beta multiplier reference (BMR) and a bandgap reference (BGR) in the fabrication processes that are indicated for your
group and try to achieve as many requested specifications as possible, or even better performance than what is specified.
Briefly show your hand calculations and design procedure in your slides.
If you cannot meet one or more of the specifications, you should explain the reason in your slides and try to get as close as possible.
Particularly for the power consumption, you should try to consume as little as possible (even better than the specs if ppossible).
Summmarize the other specifications that have been requested in a table in your slides with brief indication of the simulation method.
Every group sends in only one set of slides.
Each member of the group shoud individually send the above filled table in this Excel sheet with any additional detail that might fit.
Use this file naming convention (group x): Gx_Lastname1_Lastname2_Lastname3_Project1_ECE4430_F11.ppt
In the first slide include the name of all group members.
In the individual Excel sheet, in the space below the name of each of your group memebers, give them a grade from 1
(did not cooperate at all) to 10 (did a great job and was very effective). Feel free to add any further comments about group cooperation.
All group members are responsible for answering questions about both reference generators during the presentation.
Additional Notes:
To find temperature variation of the resistor layer that you use, either refer to the proces information or use Table 4.1 in Baker P88.