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SPECIFICATION
CUSTOMER :
MODULE NO.:
WG240128B-TMI-VZ#180
APPROVED BY:
( FOR CUSTOMER USE ONLY )
SALES BY
PCB VERSION:
APPROVED BY
VERSION
DATE
2009/10/19
DATA:
CHECKED BY
REVISED
PAGE NO.
PREPARED BY
SUMMARY
First issue
1 49
MODLE NO
RECORDS OF REVISION
VERSION
DATE
2009/10/19
REVISED
PAGE NO. SUMMARY
First issue
2 49
Contents
1.Module Classification Information
2.Precautions in use of LCD Modules
3.General Specification
4.Absolute Maximum Ratings
5.Electrical Characteristics
6.Optical Characteristics
7.Power Supply for LCD Module and Contrast Adjust
8.Counter Drawing & Block Diagram
9.Interface Pin Function
10.Display control instruction
11.Timing Characteristics
12.Reliability
13.Backlight Information
14. Inspection specification
15. Material List of Components for RoHs
16. Storage
3 49
Backlight Type
N Without backlight
A LED, Amber
R LED, Red
D EL, Green
O LED, Orange
W EL, White
G LED, Green
F CCFL, White
T LED, White
LCD Mode
B TN Positive, Gray
T FSTN Negative
N TN Negative,
G STN Positive, Gray
Y STN Positive, Yellow Green
M STN Negative, Blue
F FSTN Positive
H Transflective, W.T,6:00
G Reflective, W. T, 6:00
C Transmissive, N.T,6:00
J Reflective, W. T, 12:00
F Transmissive, N.T,12:00
B Transflective, N.T,6:00
I Transmissive, W. T, 6:00
E Transflective, N.T.12:00
L Transmissive, W.T,12:00
Special Code
K Transflective, W.T,12:00
3.General Specification
ITEM
Number of Dots:
STANDARD VALUE
UNIT
240 128
144.0104.014.3(MAX)mm
mm
View area:
114.064.0mm
mm
Active area:
107.9857.58mm
mm
Character size:
(L)0.43(W)0.43 mm
mm
Character pitch:
(L)0.45(W)0.45mm
mm
Module dimension:
LCD type:
Duty:
1/128
View direction:
Backlight:
6 oclock
LED ,White
5 49
SYMBOL
MIN.
TYP.
MAX.
UNIT
Operating Temperature
TOP
-20
+70
Storage Temperature
TST
-30
+80
Input Voltage
VI
VSS
VDD
VDD-VSS
-0.3
+7
VDD-V0
21
5.Electrical Characteristics
ITEM
Supply Voltage For Logic
SYMBOL
CONDITION
MIN.
TYP.
MAX.
UNIT
VDD-VSS
4.75
5.0
5.25
Ta=-20
21.7
Ta=25
19.5
Ta=+70
17.6
VDD-V0
VIH
0.8VDD
VDD
VIL
0.2VDD
VOH
VDD -0.3
VDD
VOL
0.3
Supply Current
IDD
VDD=5V
46
58
65
mA
* Note: Please design the VOP adjustment circuit on customer's main board
Vdd
VR
10K~20K
Vo
LCM
Module
Vee
6 49
6.Optical Characteristics
ITEM
SYMBAL CONDITION
MIN.
TYP.
MAX.
UNIT
(V)
CR 2
20
40
deg
(H)
CR 2
-30
30
deg
CR
T rise
200
300
ms
T fall
150
250
ms
View Angle
Contrast Ratio
Response Time
Definitions
View Angles
Contrast Ratio
Z
Brightness (%)
6.1
Non-selected state
Bs
Bns
Response Time
Selected Condition
Nonselected Condition
90 %
100 %
Brightness
Nonselected Condition
10 %
tr
td
Rise Time
VO
10 K
5V
LCD
MODULE
VSS
VEE ( - 16 V )
17
8 49
15.2
17.0
20.21
64.0(VA)
57.58(AA)
1 4 4 .0 0 .5
1 2 8 .0
1 1 4 .0 ( V A )
1 0 7 .9 8 ( A A )
8 .0
1 5 .0
1 8 .0 1
1 4 .3 M A X
9 .2
240*128 D O TS
1 9 0 .0 5 .0
B /L
2 0 - ? 1 .0 P T H
2 0 - ? 2 .0 P A D
4 -? 3 .5 P T H
4 -? 7 .0 P A D
1 3 8 .0
1 .6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
V ss
V dd
Vo
C /D
RD
WR
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
CE
RESET
V ee
MD2
FS1
NC
T h e n o n - s p e c ifie d to le r a n c e o f d im e n s io n is 0 .3 m m .
0 .4 5
0 .4 3
0.43
2 .0
P 2 .5 4 x 1 9 = 4 8 .2 6
0.45
1 3 .7 4
3 .0
2.5
74.0
104.0 0.5
12.0
67.6
D O T S IZ E
S C A L E 1 0 /1
9 49
CData
LP
FR
HSCP
ED
Vdd,Vss,V1,V4,V5
32K8
SRAM
Com64~128
Address Data
FS
H
L
Font 6X8 8X8
Font select
240X128 DOT
Com Driver
MD2
FS
Com1~64
80 series
or
68 series
RA6963
Controller
Com Driver
MPU
WR
RD
CE
C/D
RESET
DB0~DB7
Seg1~80
Seg81~160
Seg160~240
Seg Driver
Seg Driver
Seg Driver
(32K optional)
MD2
H
L
Column 32 40
Column select
Vdd,Vss,V2,V3,V5
Vdd,Vss
VR
10K~20K
Bias and
Power Circuit
N.V.
Generator
Vdd
Vo
Vee
10 49
Frame
(Bezel)
Symbol
Level
Description
Vss
GND
Vdd
Power supply ( +5 V )
Vo
C/D
H/L
RD
WR
DB0
H/L
DB1
H/L
DB2
H/L
10
DB3
H/L
11
DB4
H/L
12
DB5
H/L
13
DB6
H/L
14
DB7
H/L
15
CE
16
RESET
H/L
17
Vee
18
MD2
H/L
H: 32 columns ; L: 40 columns
19
FS1
H/L
20
N.C
L : Chip enable
H : Normal ; L : Initialize RA6963
Negative Voltage output( -16 V )
No connection
11 49
12 49
Note 4: When using the MSB=0 command, a Status Read must be performed.
If a status check is not carried out, the RA6963 cannot operate normally,
even after a delay time.
The hardware interrupt occurs during the address calculation period (at the
end of each line).
If a MSB=0 command is sent to the RA6963 during this period, the
RA6963 enters Wait status.
If a status check is not carried out in this state before the next command is
sent, there is the possibility that command or data will not be received.
Setting Data
When using the RA6963, first set the data, then set the command.
Note: When sending more than two data, the last datum (or last two data) is valid.
13 49
Command Definitions
14 49
The X-Adrs and Y-Adrs specify the position of the cursor. The cursor position can only be
moved by this command. Data read /write from the MPU never changes the cursor pointer.
X-Adrs and Y-Adrs are specified as follows.
15 49
RA6963 assign External character generator, when character code set 80h to FFh
in using Internal character generator. Character code 00h to 80h assign External
character generator, when External generator mode
The senior five bits define the start address in external memory of the CG RAM
area. The next eight bits represent the character code of the character. In internal
CG ROM mode, character Codes 00h to 7Fh represent the predefined internal
CG ROM characters, and codes 80h to FFh Represent the users own external
characters. In external CG RAM mode, all 256 codes from 00h to FFh can be used
to represent the users own characters. The three least significant bits indicate one
of the eight rows of eight dots that define the characters shape.
The Relationship between Display RAM Address and Offset Register
16 49
17 49
18 49
The home address and column size are defined by this command.
Set Text Home Address
The starting address in the external display RAM for text display is defined by this command.
The text home address indicates the leftmost and uppermost position.
The Relationship between Display RAM Address and Display Position
19 49
20 49
21 49
22 49
If the graphic area setting is set to match the desired number of columns on the
LCD, the addressing scheme will be automatically modified so that the start
address of each line equals the end address of the previous line +1.
23 49
The display mode is defined by this command. The display mode does not change
until the next command is sent. The logical OR, EXOR, AND of text or graphic
display can be displayed.
In internal Character Generator mode, character codes 00h to 7Fh are assigned to the
built-in Character generator ROM. The character codes 80h to FFh are automatically
assigned to the external character generator RAM.
Note: Attribute functions can only be applied to text display, since the attribute
data is placed in the graphic RAM area.
Attribute Function
The attribute operations are Reverse display, Character blink, bold and Inhibit. The
attribute data is written into the graphic area, which was defined by the Set Control
word command. Only text display is possible in Attribute Function mode; graphic
display is automatically disabled. However, the Display Mode command must be used
to turn both Text and Graphic on that in order to for the Attribute function available.
The attribute data for each character in the text area is written to the same address in
the graphic area.
The Attribute function is defined as follows.
24 49
25 49
This command is convenient for sending a full screen of data from the external
display RAM. After Setting Auto mode, a Data Write (or Read) command does not
need sent between each datum. A Data Auto Write (or Read) command must be sent
after a Set Address Pointer command. After this Command, the address pointer is
automatically incremented by 1 after each datum. In Auto mode, the RA6963 cannot
accept any other commands.
The Auto Reset command must be sent to the RA6963 after all data has been sent, to
clear Auto Mode.
Note: A Status Check for Auto Mode STA2, STA3 should be checked between sending of
each datum. Auto Reset should be performed after checking STA3=1 (STA2=1). Refer to the
following flowchart.
26 49
27 49
This command is used for writing data from the MPU to external display RAM, and
reading data from external display RAM. Data Write / Data Read should be executed
after setting address using Set Address Pointer command, The address pointer can be
automatically incremented or decremented using this command.
Note: This command is necessary for each 1-byte datum.
Refer to the following flowchart.
28 49
This command is used to transfer 1 byte of displayed data to the data stack; this byte
can be read from the MPU by data access. The logical combination of text and graphic
display data on the LCD screen can be read by this command.
The status (STA6) should be checked just after the Screen Peek command. If the
address Determined by the Set Address Pointer command is not in the graphic area,
this command is ignored and a status flag (STA6) is set.
Refer to the following flowchart.
Note: This command is available when hardware column number and software column
number are the same. Hardware column number is related to MD2 and MD3 setting. Software
column number is related to Set Text Area and Set Graphic Area command.
29 49
This command copies a single raster line of data to the graphic area.
The start point must be set using the Set Address Pointer command.
Note 1: If the attribute function is being used, this command is not available. (With Attribute
data is graphic area data.)
Note 2: With Dual-Scan, this command cannot be used (because the RA6963 cannot separate
the upper screen data and lower screen data).
Refer to the following flowchart.
Note: This command is available when hardware column number is the same.
Hardware column number is related to MD2 and MD3 setting. Software column
number is related to Set Text Area and Set Graphic Area command.
30 49
This command used to set or reset a bit of the byte specified by the address pointer.
Only one bit can be set / reset at time.
Refer to following flowchart.
31 49
The blink time of the blink functions are adjusted by this command (50h). For
example, if the frequency of the frame equals 60Hz, the blink time can be adjusted
from 0.066 second to 2 second by using software selections. The selections are listed
in the Table 6-26.
32 49
Bit0 = 0 Disable.
Bit0 = 1 Enable.
The RA6963 provides a unique function for the automatic cursor movement. After writing
(reading) each displayed datum, the cursor pointer is automatically increased/decreased by
one in the Cursor Auto-Moving mode.
10-15 CGROM Font Select
This command (70h) is a convenient function for selecting the Character Font Map.
The user can get more built-in characters from CGROM Font-01 or CGROM Font-02,
which is determined by software selections. The selections are listed in the Table 6-30.
33 49
The RA6963 has two part number - RA6963L2NA and RA6963L2NB. The
RA6963L2NA is compatible to T6963C(code 0101) and the default font is Figure
6-13 as above. The RA6963L2NB is compatible to T6963C(code 0201) and the
default font is Figure 6-14 as above.
Although RA6963 provide a extra internal command for MCU to select both font of
above, but you do not need to change the software to select the font that if you chose
the right part number.
34 49
35 49
11.Timing Characteristics
MPU Interface Timing
36 49
VDD=+5V5,GND=0V,Ta= -20 to
+70
37 49
38 49
12.RELIABILITY
Content of Reliability Test (wide temperature, -20~70
)
Environmental Test
Test Item
High Temperature
storage
Low Temperature
storage
High Temperature
Operation
Low Temperature
Operation
High Temperature/
Humidity Operation
Thermal shock
resistance
Content of Test
Endurance test applying the high storage
temperature for a long time.
Endurance test applying the high storage
temperature for a long time.
Endurance test applying the electric stress (Voltage
& Current) and the thermal stress to the element
for a long time.
Endurance test applying the electric stress under
low temperature for a long time.
The module should be allowed to stand at 60
,90%RH max
For 96hrs under no-load condition excluding the
polarizer,
Then taking it out and drying it at normal
temperature.
The sample should be allowed stand the following
10 cycles of operation
-20
25
70
30min
5min
1 cycle
Test Condition
80
200hrs
-30
200hrs
Note
2
1,2
70
200hrs
-20
200hrs
60 ,90%RH
96hrs
-20 /70
10 cycles
1,2
30min
Vibration test
VS=800V,RS=1.5k
CS=100pF
1 time
39 49
13.Backlight Information
Specification
PARAMETER
SYMBOL
MIN
TYP
MAX
UNIT
Supply Current
ILED
129.6
144
180
mA
Supply Voltage
3.4
3.5
3.6
Reverse Voltage
VR
Luminous Intensity
IV
288
TEST
CONDITION
V=3.5V
360
CD/M2
ILED=144mA
50K
Hr.
ILED=144mA
25
,50-60%RH,
Reference
only)
(Note 1)
Color
White
A
B/L
K
40 49
01
02
Item
Electrical
Testing
Criterion
AQL
2.1 White and black spots on display 0.25mm, no more than three white
Black or
white spots
or black spots present.
on LCD
2.2 Densely spaced: No more than two spots or lines within 3mm
(display only)
3.1 Round type : As following
drawing
=( x + y ) / 2
SIZE
0.10
03
LCD black
spots, white
spots,
contaminatio
n
(non-display)
2.5
Acceptable Q
TY
Accept no dense
0.10 0.20
0.20 0.25
2.5
0.25
3.2 Line type : (As following drawing)
Length
Width
Acceptable Q TY
---
L 3.0
0.02W
0.03
L 2.5
0.03W
0.05
---
0.05W
41 49
0.65
0.02
Accept no dense
2
As round type
2.5
If bubbles are visible, judge using black spot specifications, not easy to
find, must check in specify
Size
Acceptable Q TY
direction.
04
Polarizer
bubbles
NO
Item
05
Scratches
0.20
Accept no dense
0.20 0.50
0.50 1.00
1.00
Total Q TY
Criterion
Follow NO.3 LCD black spots, white spots, contamination
42 49
2.5
3
AQL
Symbols Define:
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
06
Chipped
glass
z: Chip thickness
y: Chip width
Z 1/2t
1/8a
1/8a
1/2tz
2t
x: Chip length
2.5
z: Chip thickness
y: Chip width
Z 1/2t
1/8a
1/8a
1/2tz
2t
x: Chip length
NO
Item
Criterion
43 49
AQL
Symbols :
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
y: Chip width
x: Chip length
y 0.5mm
1/8a
z: Chip thickness
0 z
06
Glass
crack
2.5
y: Chip width
y
x: Chip length
x
1/8a
z: Chip thickness
0 z
If the chipped area touches the ITO terminal, over 2/3 of the ITO
must remain and be inspected according to electrode terminal
specifications.
If the product will be heat sealed by the customer, the alignment
mark not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width
y 1/3L
NO
Item
Criterion
44 49
x: length
x
AQL
07
Cracked
glass
2.5
08
Backlight
elements
0.65
2.5
09
10
Bezel
9.1 Bezel may not have rust, be deformed or have fingerprints, stains or
other contamination.
9.2 Bezel must comply with job specifications.
10.1 COB seal may not have pinholes larger than 0.2mm or contamination.
10.2 COB seal surface may not have pinholes through to the IC.
10.3 The height of the COB should not exceed the height indicated in the
assembly diagram.
10.4 There may not be more than 2mm of sealant outside the seal area on
the PCB. And there should be no more than three places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production characteristic
PCBCOB
chart. There should be no wrong parts, missing parts or excess parts.
10.7 The jumper on the PCB should conform to the product characteristic
chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold
pad, make sure it is smoothed down.
10.9 The Scraping testing standard for Copper Coating of PCB
0.65
2.5
0.65
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
X
Y
2
X * Y<=2mm
2.5
2.5
2.5
11
Soldering
NO
Item
Criterion
45 49
2.5
0.65
AQL
12
General
appearance
46 49
2.5
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
0.65
Material
(Cd)
(Pb)
(Hg)
(Cr6+)
PBBs
PBDEs
Limited
Value
100
ppm
1000
ppm
1000
ppm
1000
ppm
1000
ppm
1000
ppm
16. Storage
1. Place the panel or module in the temperature 25C5C and the humidity below 65% RH
2. Do not place the module near organics solvents or corrosive gases.
3. Do not crush, shake, or jolt the module.
47 49
winstar
Module Number
Page: 1
1Panel Specification
Pass
NG ,
Pass
NG ,
Pass
NG ,
Pass
NG ,
5. Active Area
Pass
6. Operating Temperature Pass
7. Storage Temperature Pass
NG ,
1. Panel Type
2. View Direction
3. Numbers of Dots
4. View Area
NG ,
NG ,
8. Others
2Mechanical Specification
Pass
NG ,
Pass
NG ,
Pass
NG ,
Pass
NG ,
Pass
NG ,
Pass
NG ,
Pass
NG ,
Pass
NG ,
Pass
NG ,
Pass
NG ,
Pass
NG ,
NG ,
NG ,
Pass
NG ,
1. PCB Size
2. Frame Size
3. Materal of Frame
4. Connector Position
5. Fix Hole PositionA
6. Backlight Position
7. Thickness of PCB
8. Height of Frame to
9. PCB
Height of Module
Others
10.
3Relative Hole Size
1. Pitch of Connector
5. Others
NG ,
4Backlight Specification
1. B/L Type
Pass
NG ,
2. B/L Color
Pass
NG ,
3. B/L Driving Voltage (Reference for LED
Pass
4. Type)
B/L Driving Current
Pass
NG ,
5. Brightness of B/L
6. B/L Solder Method
Pass
NG ,
Pass
NG ,
48 49
NG ,
7. Others
Pass
NG ,
Go to page 2
winstar
Module Number
Page: 2
NG ,
Pass
NG ,
NG ,
NG ,
Pass
NG ,
Pass
NG ,
1. Input Voltage
2. Supply Current
9. ESD test
10. Others
NG ,
NG ,
NG ,
NG ,
6Summary
Sales signature
Customer Signature
Date
49 49