RAKSHA MANTRALAYA

MINISTRY OF DEFENCE

JOINT SERVICES SPECIFICATION

ON
GENERAL REQUIREMENTS FOR PRINTED WIRING BOARDS

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
MANAKIKARAN NIDESHALAYA
RAKSHA UTPADAN TATHA POORTI VIBHAG
RAKSHA MANTRALAYA, 'H' BLOCK, NIRMAN BHAWAN PO
NEW DELHI - 110 011
DIRECTORATE OF STANDARDISATION
DEPARTMENT OF PRODUCTION & SUPPLIES
MINISTRY OF DEFENCE, 'H'- BLOCK, NIRMAN BHAWAN PO
NEW DELHI - 110 011

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
RAKSHA MANTRALAYA
MINISTRY OF DEFENCE

JOINT SERVICES SPECIFICATION

ON
GENERAL REQUIREMENTS FOR PRINTED WIRING BOARDS

MANAKIKARAN NIDESHALAYA
RAKSHA UTPADAN TATHA POORTI VIBHAG
RAKSHA MANTRALAYA, 'H' BLOCK, NIRMAN BHAWAN PO
NEW DELHI - 110 011

DIRECTORATE OF STANDARDISATION
DEPARTMENT OF PRODUCTION & SUPPLIES
MINISTRY OF DEFENCE, 'H'- BLOCK, NIRMAN BHAWAN PO
NEW DELHI - 110 011

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
RECORD OF AMENDMENTS
Amendment Amendment
pertains to: Sl.No./
No. Date Para No./ Column
No.

Amended by
Authority

ii

Name & Appointment

(IN BLOCK LETTERS)

Signature
&
Date

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
CONTENTS
S.No.

Page
No.

0. FOREWORD

1. SCOPE

2. RELATED SPECIFICATIONS AND DOCUMENTS

3. INFORMATION TO BE SUPPLIED BY PURCHASER

4. ILLUSTRATIONS AND DRAWINGS

5. PATENTS

6. DEFINITIONS

7. MATERIALS, PROCESSES AND FINISHES

27

8. MARKING

27

9. PACKAGING

28

10. QUALIFICATION APPROVAL AND MAINTENANCE OF

QUALIFICATION APPROVAL PROCEDURE

28

11. BATCH ACCEPTANCE PROCEDURE

28

12. TEST PROCEDURE

29

13. TEST DETAILS

30

14. SUGGESTION FOR IMPROVEMENT

45

APPENDIX A

46

APPENDIX B

54

FIGURES

56

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JSS 52300: 1992

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0.

FOREWORD

0.1
This specification has been prepared by Electronic Components
Standardisation Organisation (LCSO) on behalf of Electronic Standardisation Sub
Committee on the authority of Standardisation Committee, Ministry Of Defence.
0.2
This specification has been approved by the Ministry of Defence and is
mandatory for use by the Defence Services.
0.3
This JSS would be used for design, manufacture, quality assurance and
procurement of the item.
0.4

This JSS supersedes JSS 52300: 1975.

0.5
Quality Assurance Authority for the item covered by this Specification is
CQA (L) for Army, DRAN for /Navy and DGAQA for Air Force. Enquiries regarding
this specification relating to airy contractual conditions should be addressed to the
Quality Assurance Authority named in the tender or contract. Other technical enquiries
should be referred to: The Officer-in-Charge
LCSO
DRDO Complex
C.V. Raman Nagar,
Bangalore-560 093
0.6

Copies of this specification can be obtained on payThe Controller

Controllerate of Quality Assurance (Electronics)
Jayachamrajendra Nagar PO
Bangalore -560 006

0.6

This specification holds good only for the supply order for which it is issued.

0.7

This specification holds good only for the supply order for which it is issued.

JSS 52300: 1992

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1.

SCOPE

1.1
This specification relates to the detailed requirements for printed wiring
boards, plated through hole consisting of 4 to 10 layers of conductor patterns on
insulating bases separated one from the other by an insulating material and
interconnected by a continuous metallic interlayer connection. It is to be used in
conjunction with JSS 52300 - General requirements for printed wiring boards.
1.2
For the purpose of interpretation or construction in case of any omissions,
conflicts, ambiguities or inconsistencies to the extent the contract consists of any or all of
the following documents, such documents shall rank in the following order of
precedence.
(a) Detailed specifications
(b) This specification and
(c) Other applicable documents
2.

RELATED SPECIFICATIONS AND DOCUMENTS

2.1

Joint Services Specifications

JSS 50101: 1996
(Revision No. 1)
Reaffirmed 2001

- Environmental test methods for Service

electronic components.

JSS 50102: 1985

Reaffirmed 2000

- General specification and procedure for

the qualification approval and
acceptance of electronic components.

JSS 52301: 1993

(Revision No. 1)
Reaffirmed 1999

- Detailed specification for printed

wiring boards, single and double-sided.

JSS 52302: 1994

(Revision No. 1)
Reaffirmed 1999

- Detailed specification for printed

wiring board, multi-layer.

JSS 51701: 1975

Reaffirmed 1999

Detailed specification for metal-clad

base material (for printed wiring boards
of thickness 0.8 mm or greater)
2

JSS 52300: 1992

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JSS 51702: 1975
Reaffirmed 1999

2.2

- Detailed specification for metal-clad

base material (for printed wiring boards
primarily for multi layer) of thickness
less than 0.8 mm

Other Specifications
IS 9938: 1981
Reaffirmed 1999

Recommended colours for PVC

insulation for wires and cables

IS 10673: 1983
Reaffirmed 1996

Sampling plans and procedures for

inspection by attributes for electronic
items.

2.3

Source of Supplies

2.3.1

Copy of the Joint Services Specifications are obtainable on payment from:The Controller
Controllerate of Quality Assurance (Electronics)
JayachamraJendra Nagar PO,
Bangalore - 560 006

2.3.2

Copies of Indian Standard are obtainable on payment from :Bureau of Indian Standards,
Manak Bhavan
9, Bahadur Shah Zafar Marg
New Delhi = 110 002
Or
their regional/branch offices.

3.

INFORMATION TO BE SUPPLIED BY THE PURCHASER

3.1

As given in the relevant details specifications.

4.

ILLUSTRATIONS AND DRAWINGS

4.1

Dimensions - Dimensions are in millimetres .

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4.2
Drawings - where drawings are quoted, they are mandatory. Copies of the
drawings are obtainable from Officer-in-Charge, LCSO, DRDO Complex, CV Raman
Nagar, Bangalore-560 093.
5.

PATENTS

5.1
Patents or design rights or copy-rights may subsist in connection with the
items defined as standards and the issue of this specification does not convey or imply
any licence to use information which is the subject of such rights.
6.

DEFINITIONS

6.1
Access Holes - A series in successive layers, each set having a common centre
or axis. These holes in a multiplayer printed board provide access to the surface of the
land in one of the layers of the board. (See figure 1)
6.2
Activating - A treatment that renders non-conductive material receptive to
electroless deposition. (Non-preferred synonyms: "Seeding", "Catalyzing" and
"Sensitizing")
6.3
Additive Process - A process for obtaining conductive patterns by the
selective deposition of conductive material on the unclad base material. (see also: "SemiAdditive Process" and "Fully-Additive Process")
6.4
Adhesion Promotion - The chemical process of preparing a plastic surface to
provide for a uniform, well-bonded metallic overplate.
6.5
Anchoring Spurs - Extensions of lands on flexible printed wiring extending
beneath the cover layer to assist in holding the lands to the base material.
6.6
hole.

Annular Ring - That portion of conductive material completely surrounding a

6.7
Arc Resistance - The resistance of a material by the effects of a high voltage,
low current arc (under prescribed conditions) passing across the surface of the material.
The resistance is stated as a measure of total elapsed time required to form a conductive
path on the surface (material carbonized by the arc).
6.8
Artwork - An accurately scaled configuration which is used to produce the
Artwork Master or Production Waster.
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6.9
Artwork Waster - An accurately-scaled (usually 1:1) pattern which is used to
produce the Production Waster.
6.10
Backplane - An interconnection device having terminals (such as solderless
wrapped connections) on one side and usually having connector receptacles on the other
side, used to provide point-to-point electrical interconnections. The point-to-point
electrical interconnections may be printed wiring. (See also "mother board")
6.11
Base Material - The insulating material upon which the conductor pattern may
be formed. The base material may be rigid or flexible. It may be a dielectric sheet or
insulated metal sheet.
6.12
Base Material Thickness - The thickness of the base material excluding metal
foil or material deposited on the surface.
6.13
Basic Dimension - A numerical value used to describe the theoretical exact
location of a feature or hole. It is the basis from which permissible variations are
established by tolerances on other dimension, in notes or by feature control symbols.
6.14
Bellow Contact - A connector contact which is a flat spring folded to provide
a uniform spring rate over the full tolerance range of the mating unit,
6.15
Bent Lead - A lead that is bent either at an approximate 45 degree angle or
when used with offset lands is formed to be in direct contact with the land.
6.16
Bifurcated Contact - A connector contact (usually a flat spring) which is
slotted lengthwise to provide additional, independently operated points of contact.
6.17
Blank - An unprocessed or partially processed piece of base material or metalclad base material cut from a sheet or panel and having the rough dimensions of a printed
board.
6.18
Bleeding - A condition in which a plated hole discharges process material or
solution from crevices or voids.
6.19
Blister - A localized swelling and separation between any of the layers of a
laminated base material or between base material and conductive foil (It is a form of
delamination).
6.20
Board Thickness - The thickness of the metal-clad base material including
conductive layer or layers. (May include additional platings and coatings depending upon
when the measurement is made).
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6.21
Bond Layer - An adhesive layer used in bonding together other discrete layers
of a multilayer printed board during laminations.
6.22
Bond Strength - The force per unit area required to separate two adjacent
layers of a board by a force perpendicular to the board surface. (See also: "Peel
Strength")
6.23
Bow - The deviation from flatness of a board characterized by a roughly
cylindrical or spherical curvature such that if the board is rectangular, its four corners are
in the same plane. (See also: "Twist")
6.24
B-staged Resin - A resin in an intermediate state of cure (The cure is normally
completed during the laminating cycle).
6.25
Bus Bar - A conduit such as a conductor on a printed board for distributing
electrical energy. (A plating Bar is a subcategory of this term)
6.26
Butter-Coat - A commonly used term to describe a higher than usual surface
resin. (See also: "Resin-rich").
6.27
Camber - The planar deflection of a flat cable or flexible laminate from a
straight line of specified length. (A flat cable or flexible laminate with camber is similar
to the curve of an unbanked race track)
6.28
Capacitive Coupling - The electrical interaction between two conductors
caused by allowances. Plated-through holes passing through internal foil planes (ground
and voltage) and thermal planes shall meet the same minimum clearance between the
plated through hole and foil or ground planes as required for spacing between internal
conductors.
6.29
Centre-to-Centre Spacing - The nominal distance between the centres of
adjacent features on any single layer of a printed board. (See also "Pitch")
6.30
Circumferential Separation - A crack (1) in the plating extending around the
entire circumference of a plated-through hole or (2) in the solder fillet around the lead
wire or (3) in the solder fillet around an eyelet or (4) at the interface between a solder
fillet and a land.
6.31

Chamfer - A broken corner to eliminate an otherwise sharp edge.

6.32
Characteristic Impedance - The ratio of voltage to current in a propagating
wave i.e. the impedance which is offered to this wave at any point of the line. (In printed
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JSS 52300: 1992

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wiring, its value depends on the width of the conductor, the distance from the conductor
to ground planets) and the dielectric constant of the media between them)
6.33
Chemical Hole Cleaning - The chemical process for cleaning conductive
surfaces exposed within a hole. (See also: "Etchback")
6.34
Clad - A condition of the base material to which a relatively thin layer or a
sheet of metal foil has been bonded to one or both of its sides e.g. a metal-clad base
material.
6.35
Clearance Hole - A hole in the conductive pattern larger than, but coaxial
with, a hole in the printed board base material.
6.36
Clinched Leads - Component leads which extend through the printed board
and are formed to effect a spring action, metal-to-metal electrical contact with the
conductive pattern prior to soldering.
6.37
Clinched-Wire Through Connection - Connection made by a wire which is
passed through a hole in a printed board and subsequently formed or clinched, in contact
with the conductive pattern on each side of the board and soldered.
6.36
Cold Solder Joint - Solder connection exhibiting poor wetting and a grayish,
porous appearance due to insufficient heat, inadequate cleaning prior to soldering or due
to excessive impurities in the solder solution.
6.39
area.

Component Density - The quantity of components on a printed board per unit

6.40
Component Lead - The solid or stranded wire or formed conductor that
extends from a component and service as a mechanical or electrical connection or both.
6.41
Component Hole A hole used for the attachment and electrical connection of
component terminations including pins and wires to the printed board.
6.42
Component Side - That side of the printed board on which most of the
components will be mounted.
6.43
Conductive Foil - A thin sheet of metal that may cover one or both sides of the
base material. (Includes conductor, lands and through connections when these
connections are an integral part of the manufacturing process)

JSS 52300: 1992

(Revision No. 1)
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6.44
Conductive Pattern - The configuration or design of the conductive material
on the base material. (Includes conductors, lands and through connections when these
connections are an integral part of the manufacturing process)
6.45

Conductor - A single conductive path in a conductive pattern.

6.46
Conductor Base Width - The conductor width at the plane of the surface of the
base material. (See also: "Conductor Width" and "Design Width of Conductor")
6.47
Conductor Layer - The total conductive pattern formed upon one side of a
single layer of base material.
6.48
Conductor Layer No.l - The first layer having a conductive pattern, of a
multilayer printed board, on or adjacent to the component side.
6.49
Conductor Side - The side in a single sided printed board containing the
conductive pattern.
6.50
Conductor Spacing - The distance between adjacent edges (not center line to
center line) of isolated conductive patterns in a conductor layer.
6.51
Conductor Thickness - The thickness of the conductor including all metallic
coatings. (It excludes non-conductive protective coating)
6.52
Conductor Width - The observable width of a conductor at any point chosen at
random on the printed board, normally viewed from vertically above unless otherwise
specified. (Imperfections for example nicks, pinholes or scratches allowable by the
relevant specification shall be ignored. (See also a "Design Width of Conductor" and
"Conductor Base Width")
6.53
Conductor to Hole Spacing - The distance between the edge of a conductor
and the edge of a supported or unsupported hole.
6.54
Conformal Coating - An insulating protective coating, which conforms to the
configuration of the object coated, applied o the completed board assembly.
6.55
Connector Area - That portion of printed wiring used or the purpose of
providing external electrical connections.
6.56
Contact Area - The common area between a conductor and connector through
which the flow of electricity takes place.

JSS 52300: 1992

(Revision No. 1)
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6.57
Contact Resistance - The electrical resistance of the metallic surfaces at their
interface in the contact area under specified conditions.
6.58
areas.

Contact Spacing - The distance between the centerlines of adjacent contact

6.59
circuit.

Continuity - An uninterrupted path for the flow of electrical current in a

6.60
Corner Mark (Crop Mark) - The mark at the corners of a printed board
artwork, the inside edges of which usually locate the borders and establish the contour of
the board.
6.61
Cover Lay, Cover Layer, Cover Coat - An outer layer(s) of insulating material
applied over the conductive pattern on the surface of the printed board.
6.62
Cracking - A condition consisting of breaks in metallic or non-metallic
coatings or both that extend through to an underlying surface.
6.63
Crazing - An internal condition occurring in the laminated base material in
which the glass fibres are separated from the resin at the weave intersections. This
condition manifests itself in the form of connected white spots or "crosses below the
surface and the base material and is usually related to mechanically induced stress.
6.64
Crazing (Conformal Coating) - A network of fine cracks on the surface or
within the conformal coating.
6.65
Crosshatching - The breaking of large conductive areas by the use of a pattern
of voids in the conductive material.
6.66
Crosstalk - The undesirable interface caused by the coupling of energy
between signal paths.
6.67
Current-carrying Capacity - The maximum current which can be carried
continuously, under specified conditions, by a conductor without causing objectionable
degradation of electrical or mechanical properties of the printed board.
6.68
Datum Reference - A defined point, line or plane used to locate the pattern or
layer for manufacturing, inspection or for both purposes.
6.69
Delamination - A separation between plies within the base material or
between the base material and the conductive foil or both.
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6.70
Dent - A smooth depression in the conductive foil which does not
significantly decrease foil thickness.
6.71
Design Midth of Conductor - The width of a conductor as delineated or noted
on the master drawing.
6.72
Device - an individual electrical element, usually in an independent body,
which cannot be further reduced without destroying its stated function.
6.73
Dewetting - A condition which results when molten solder has coated a
surface and then receded leaving irregularly shaped mounds of solder separated by areas
covered with a thin solder film, base metal is not exposed.
6.74
Dielectric Breakdown - A complete failure of a dielectric material
characterized by a disruptive electrical discharge through the material due to a sudden
and large increase in voltage.
6.75
Dielectric Constant - The ratio of the capacitance (C) of a given configuration
of electrodes with a specified dielectric to the capacitance <C) of the same electrode
configuration with a vacuum or air as the dielectric.
6.76
Dielectric Strength - The maximum voltage that a dielectric can withstand,
under specified conditions, without resulting in a voltage breakdown, (usually expressed
as volts/unit dimension)
6.77
Digitizing - Any method of reducing feature locations on a flat plane to give
digital representation of X-Y coordinates.
6.78
Dimensional Stability - A measure of dimensional change caused by such
factors as temperature, humidity, chemical treatment, age or stress (usually expressed as
(units/unit).
6.79
Dimensioned Hole - A hole in a printed board where the means of
determining location is by co-ordinate values not necessarily coinciding with the stated
grid.
6.80
Dip Soldering - A process whereby printed boards with attached components
are brought in contact with the surface of a static pool of molten solder for the purpose
of soldering the entire exposed conductive pattern and component leads in one operation.
6.81
Dissipation Factor - The Dissipation Factor is proportional to the power loss
per cycle (f) per potential gradient (E) squared per unit volume as follows :
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JSS 52300: 1992

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Diss. Fac.

6.82
sides.

power loss
----------------------------E x f x volume x constant

Double-Sided Board - A printed board with a conductive pattern on both

6.83
Drag Soldering - A process whereby supported moving printed circuit
assemblies or printed wiring assemblies are brought in contact with the surface of a static
pool of molten solder.
6.84
solder.

Dross - Oxide and other contaminants which form on the surface of molten

6.85
Dual In-Line Package (DIP) - A component which terminates in two straight
tows of pins or lead wires.
6.86
Edge-Board Connector - A connector designed specifically for making
removable and reliable interconnections between the edge board contacts on the edge or a
printed board and external wiring.
6.87
Edge-Board Contacts - A series of contacts printed on or near any edge of a
printed board and intended for mating with an edge-board connector.
6.88
Edge Definition - The fidelity of reproduction of a pattern edge relative to the
production master.
6.89
Edge Spacing - The distance of a pattern, components or both from the edges
of the printed board.
6.90
E Glass - A low alkali lime alumina borosilicate glass, noted for its good
electrical properties. (It has the following chemical formulation in percentage by mass.
B2O3 5-10%, CaO 16-25%., Al2O3 12-16%.,SiO2 52-56%, NaO2 and K2O 0-2%.,
TiO2 0-0.8%., Fe2O3 0.05-0.4%., F2 0-1.0%)
6.91
Electroless Deposition - The deposition of metal from an autocatalytic plating
solution without application of electrical current.
6.92
Electrodeposition - The deposition of a conductive material from a plating
solution with application of electrical current. (Non-preferred synonyms: "Electrolytic
deposition" and "Galvanic deposition")

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6.93
Etchant - A solution used to remove by chemical reaction, the unwanted
portion of material from a printed board.
6.94
Etchback - A process for the controlled removal of nonmetallic materials
from sidewalls of holes to a specified depth. It is used to remove resin smear and to
expose additional internal conductor surfaces.
6.95
Etch Factor - The ratio of the depth of etch (conductor thickness) to the
amount of lateral etch. (Undercut).
6.96
Etched - Etching - Printed Board - A board having a conductive pattern
farmed by the chemical removal of unwanted portions of the conductive foil.
6.97
Etching - A process wherein a printed pattern is formed by chemical, or
chemical and electrolytic removal of the unwanted portion of conductive material bonded
to a base.
6.98
Etching Indicator - A wedge shaped or other specified pattern affixed to the
conductive foil to indicate the quantity of etching.
6.99
Extraneous Copper - Unwanted copper remaining on the base material after
chemical processing.
6.100
Eyelet - A hollow tube inserted in a terminal or printed board to provide
mechanical support for component leads or electrical connection.
6.101
Fibre Exposure - A condition in which reinforced fibres within the base
material are exposed in machined, abraded or chemically - attacked areas.
6.102
Flat Cable - A cable with two or more parallel, round or flat conductors in the
same plane encapsulated by an insulating material.
6.103
Flexible Printed Circuit - A random arrangement of printed circuit and
components utilizing flexible base material with or without flexible cover layers.
6.104
Flexible Printed Miring - A random arrangement of printed wiring utilising
flexible base material with or without flexible cover layers,
6.105
Flexural Failure - A conductor failure caused by repeated flexing.
indicated by an increase of resistance measured for a specified time.

It is

6.106
Flush Conductor - A conductor whose outer surface is in the same plane as the
surface of the insulating material adjacent to the conductor.
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6.107
Flux - A chemically active compound that is capable of promoting the Metting
of metals with solder.
6.108
From-to-List - Written wiring instructions in the form of a list indicating
termination points.
6.109
Fully-Additive Process (non-preferred synonym: Fully Electroless) - An
additive process wherein the entire thickness of electrically isolated conductors is builtup by electroless metal deposition.
6.110
Fused Coating - A metallic coating (usually tin or solder alloy) which has
been melted and solidified forming a metallurgical bond to the base metal.
6.111
Fusing - The melting of a metallic coating (usually electro-deposited),
followed by solidification.
6.112
Gel Time - The time expressed in seconds, required for a resin to change its
physical state from a solid through a liquid to a solid again due to the action of thermal
input.
6.113
Glass Transition Temperature - The temperature at which an amorphous
polymer (or the amorphous regions in a partially crystalline polymer) changes from a
hard and relatively brittle condition to a viscous or rubbery condition. (This transition
generally occurs over a relatively narrow temperature range; it is not a phase transition.
In this temperature region, many physical properties undergo significant rapid changes.
Some of these properties are hardness, brittleness, thermal expansion, specific heat etc.).
6.114
Grid - An orthogonal network of two sets of parallel equidistant lines used for
locating points on a printed board,
6.115
Ground Plane - A conductor layer or portion of a conductor layer (usually a
continuous sheet of metal with suitable ground plane clearances), used as a common
reference point for circuit returns, shielding or heat sinking.
6.116
Ground Plane Clearance - Ground-plane clearance is the etched portion of a
ground plane around a plated-through or non-plated through hole that isolates the plane
from the hole.
6.117
Haloing - Mechanically induced fracturing or delaminating on or below the
surface of the base material; it is usually exhibited by a light area around holes, other
machined areas or both.

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6.118
Heat Sinking Plane - A continuous sheet of metal on or in a printed board that
functions to dissipate heat away from heat sensitive components.
6.119
the land.

Hole Breakout - A condition in which a hole is not completely surrounded by

6.120

Hole Density - The quantity of holes in a printed board per unit area.

6.121

Hole Location - The dimensional location of the center of a hole per unit area.

6.122

Hole Pattern - The arrangement of all holes in a printed board.

6.123
Hole Pull Strength - The force necessary to rupture a plated through hole
when loaded or pulled in the direction of the axis of the hole.
6.124
Hole Void - A void in the metallic deposit of a plated through hole exposing
the base material.
6.125
Immersion plating (Galvanic Displacement) - The chemical deposition of a
thin metallic coating over certain base metals by a partial displacement of the base
metals.
6.126
Inclusion - A foreign particle, metallic or non-metallic, in a conductive layer,
plating or base material.
6.127
Insulation Resistance - The electrical resistance of the insulating material
(determined under specified conditions) between any pair of contacts, conductors or
grounding devices in various combinations.
6.128
Interlayer Connection - An electrical connection between conductive patterns
in different layers of a multilayer printed board.
6.129
Internal Layer - A conductive pattern which is contained entirely within a
multilayer printed board.
6.130
Interstitial via Hole - A plated-through hole connecting two or more conductor
layers of a multilayer printed board but not extending fully through all the layers of base
material comprising the board.
6.131
lonizable Contaminants - Process residues such as flux activators, finger
prints, etching and plating salts etc. that exist as ions and when dissolved increase
electrical conductivity.
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6.132
Jumper - An electrical connection between two points on a printed board
added after the intended conductive pattern is formed.
6.133

Jumper Wire - A wire used as a Jumper.

6.134
Key - A device designed to assure that the coupling of two components can
occur in only one position.
6.135
Keying Slot - A slot in a printed board which permits the printed board to be
plugged into its matting receptacle but prevents it from being plugged into any other
receptacle.
6.136

Keyway - A general term covering both keying slot(s) and polarizing slot(s).

6.137
Laminate - A product made by bonding together two or more layers of
material.
6.136
Laminate Thickness - Thickness of the metal-clad base material, single or
double-sided, prior to any subsequent processing.
6.139
Land - A portion of a conductive pattern usually, but not exclusively, used for
the connection or attachment of components or both.
6.140

Landless Hole - A plated-through hole without a land(s).

6.141
Layer-to-Layer Spacing - The thickness of dielectric material between
adjacent layers of conductive circuitry in a multilayer printed board.
6.142
Lead Projection - The distance which a component lead protrudes through the
printed board on the side opposite from which the component is mounted.
6.143
Legend - A format of letters, numbers, symbols and patterns on the printed
board primarily used to identify component locations and orientation for convenience in
assembly and replacement operations.
6.144
Margin - The distance between the reference edge of a flat cable and the
nearest edge of the first conductor.
6.145
Marking - A method of identifying printed boards with part number, revision
letter, manufacturer's code etc.
6.146
Master Drawing - A document that shows the dimension limits or grid
locations applicable to any or all parts of a printed board (rigid or flexible) including the
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JSS 52300: 1992

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arrangement of conductive and nonconductive patterns of elements, size, type, and
location of holes and any other information necessary to describe the product to be
fabricated.
6.147
Mealing - A condition at the interface of the conformal coating and base
material; it is in the form of discrete spots or patches which reveal separation of the
conformal coating from the surface of the printed boards or from the surfaces of attached
components or from both.
6.148
Measling - An internal condition occurring in laminated base material in
which the glass fibers are separated from the resin at the weave intersection. This
condition manifests itself in the form of discrete white spots or "crosses" below the
surface of the base material and is usually related to thermally induced stress.
6.149
its sides.

Metal-clad Base Material - Base material covered with foil on one or both of

6.150
Metallization - A deposited or plated thin metallic film used for its protective
or electrical properties.
6.151
Microstrip - A type of transmission line configuration which consists of a
conductor over a parallel ground plane and separated by a dielectric.
6.152
Microsectioning - The preparation of a specimen for the microscopic
examination of the material to be examined, (usually by cutting out a cross-section
followed by encapsulation, polishing, etching, staining etc.)
6.153
Minimum annular Ring - The minimum width of metal, at the narrowest point,
between the edge of the hole and the outer edge of the land. This measurement is made
to the drilled hole on internal layers of multilayer printed boards and to the edge of the
plating on outside layers of multilayer boards and double sided boards.
6.154
Minimum Electrical Spacing - The minimum allowable distance between
adjacent conductors that is sufficient to prevent dielectric breakdown or corona or both,
between the conductors at any given voltage and altitude.
6.155
Misregistration - The lack of dimensional conformity between successively
produced features or patterns.
6.156
Module - A separable unit in a packaging scheme displaying regularity of
dimensions.

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6. 157
Mother Board - A printed board assembly used for interconnecting arrays of
plug-in electronic modules.
6.158
Mounting Hole - A hole used for the mechanical mounting of a printed board
or for the mechanical attachment of components to the printed board.
6.159
Multilayer Printed Board - The general term for completely processed printed
circuit or printed wiring configurations consisting of alternate layers of conductive
patterns and insulating materials bonded together, with conductive patterns in more than
two layers and with the conductive patterns interconnected as required. The term
includes both flexible and rigid multilayer boards.
6.160
Multilayer Printed Board, Sequentially Laminated - A multilayer board which
is formed by laminating through-hole-plated double sided or multilayer boards together.
The circuitry layers are interconnected with interstitial via holes and through connections.
6.161
Multilayer Printed Circuit Board - A part manufactured from rigid base
material upon which a completely processed printed circuit has been formed on more
than two layers, each separated by insulating material and bonded together.
6.162
Multilayer Printed Miring Board - A part manufactured from rigid base
material upon which completely processed printed wiring has been formed on more than
two layer, each separated by insulating materials and bonded together.
6.163
Nail Heading - The flared condition of copper on the inner conductor layers
of a multilayer board caused by hole drilling.
6.164
Negative - An artwork, art workmaster or production master in which the
intended conductive pattern is transparent to light and the areas to be free from
conductive material are opaque.
6.165
Negative Etchback - Etchback in which inner conductor layer of material is
recessed relative to the surrounding base material. (See Figure 12)
6.166
Negative-acting Resist - A resist which is polymerized (hardened) by light and
which, after exposure and development, remains on the surface of a laminate in those
areas which were under the transparent parts of a production master.
6.167
Nonconductive Pattern - A configuration formed by functional nonconductive
material of a printed circuit, (e.g. dielectric, resist etc.)
6.168
Nonfunctional Land - A land on internal or external layers not connected to
the conductive pattern on its layer.
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6.169
Nonpolar Solvents - Solvents which are not ionized sufficiently to be
electrically conductive and which cannot dissolve polar compounds such as inorganic
salts but can dissolve nonpolar compounds such as hydrocarbons and resins.
6.170
Nonwetting - A condition whereby a surface has contacted molten solder but
the solder has not adhered to all of the surface and base metal remains exposed.
6.171
Offset Land - A land which is intentionally not in physical contact with its
associated component hole.
6.172
Opaquer - A material that when added to the resin systems renders a laminate
sufficiently opaque so that the yarn or weave of the reinforcing material cannot be seen
with the unaided eye using either reflected or transmitted light.
6.173
Outgassing - De-aeration or other gaseous emission from a printed board
assembly (printed board, component or connection) when exposed to a reduced pressure
or heat or both
6.174
Outgrowth - The increase in conductor width at one side of a conductor
caused by plating build-up, over that delineated on the production master.
6.175
Overhang - The sum of outgrowth and undercut. (If undercut does not occur,
the overhang is the outgrowth only)
6.176
Packaging Density - Quantity of functions (components, interconnection
devices, mechanical devices) per unit volume usually expressed in qualitative terms such
as high, medium or low.
6.177
Panel - A rectangular or square base material of predetermined size intended
for or containing one or more printed boards and when required, one or more test
coupons.
6.178

Panel Plating - The plating of the entire surface of a panel (including holes).

6.179
Pattern - The configuration of conductive and non-conductive materials on a
panel or printed board. (Pattern denotes also the circuit configuration on related tools,
drawings and masters)
6.180

Pattern Plating - The selective plating of a conductive pattern.

6.181
Peel Strength - The force per unit width required to peel the conductor or foil
from the base material.
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6.182
Permanent Mask - A resist which is not removed after processing (e.g. plating
resist used in the fully additive process)
6.183
Photographic Reduction Dimension - Dimensions (e.g. the distance between
lines or between two specified points) on the artwork master to indicate to the
photographer the extent to which the artwork master is to be photographically reduced,
(The value of the dimension refers to the HI scale and must be specified)
6.184

Pin Density - The quantity of pins on a printed board per unit area.

6.185
Pinhole - A small hole occurring as an imperfection which penetrates entirely
through a layer of material.
6.186
Pit - A depression in the conductive layer that does not penetrate entirely
through it.
6.187
Pitch - The nominal distance from centre-to-centre of adjacent conductors.
(Where conductors are of equal size and spacing is uniform, the pitch is usually measured
from the reference edge of a conductor to the reference edge of the adjacent conductor)
6.188
Plate Finish (pertaining to laminating) - The finish present on the metallic
surface of metal-clad base material resulting from direct contact with the laminating press
plates without modification by any subsequent finishing process.
6.189
Plated Through Hole - A hole in which electrical connection is made between
internal or external conductive patterns or both, by the deposition of metal on the wall of
the hole.
6.190
Plated-Through Hole Structure Test - A visual examination of the metallic
conductors and plated-through holes of a printed board after the glass-plastic laminate has
been dissolved away.
6.191
Plating Bar - The temporary conductive path interconnecting areas of a
printed board to be electroplated, usually located on the panel outside of the borders of
such a board.
6.192
Plating Up - The process consisting of the electrochemical deposition of a
conductive material on the base material (surface holes etc.) after th6 base material has
been made conductive.
6.193
Plotting
- The practice of mechanically converting X-Y positional
information into a visual pattern such as artwork.
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6.194
Polarisation - A technique of eliminating symmetry within a plane so that
parts can be engaged in only one way in order to minimize the possibility of electrical
and mechanical damage or malfunction.
6.195
Polarizing Slot - A slot at the edge of a printed board, used to assure proper
insertion and location in a mating connector.
6.196
Polar Solvents - Solvents which are ionized sufficiently to be electrically
conductive and which can dissolve polar compounds such as inorganic salts but cannot
dissolve nonpolar compounds such as hydrocarbons and resins.
6.197
Positive - An artwork, artwork master or production master in which the
intended conductive pattern is opaque to light and the areas intended to be free from
conductive material are transparent.
6.198
Positive-acting Resist - A resist which is decomposed (softened) by light and
which, after exposure and development, is removed from those areas which were under
the transparent parts of a production master.
6.199
Prepreg - Sheet material (e.g. glass fabric) impregnated with a resin cured to
an intermediate stage. (B-stage resin)
6.200
Press-fit Contact - An electrical contact which can be pressed into a hole in an
insulator, printed board (with or without plated-through holes) or a metal plate.
6.201
Printed Board - The general tern) for completely processed printed circuit or
printed wiring configurations.
It includes rigid or flexible, single, double, and
multiplayer boards.
6.202
Printed Circuit - A conductive pattern comprised of printed components,
printed wiring or a combination thereof, all formed in a predetermined design and
intended to be attached to a common base. (In addition, this is a generic term used to
describe a printed board produced by any of a number of techniques)
6.203
Printed Circuit Board - A part manufactured from rigid base material upon
which a completely processed printed circuit has been formed.
6.204
Printed Component - A part such as an inductor, resistor, capacitor or
transmission line which is formed as part of the conductive pattern of the printed board.
6.205
Printed Contact - A portion of a conductive pattern formed by printing,
serving as one part of a contact system.
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6.206
Printed Miring - The conductive pattern intended to be formed on a common
base to provide point-to-point connection of discrete components but not to contain
printed components.
6.207
Printed Wiring assembly Drawing - A document that shows the printed board
(rigid or flexible), the separately manufactured components which are to be added to the
board and any other information necessary to describe the joining of these parts to
perform a specific function.
6.208
Printed Miring Board - A part manufactured from rigid base material upon
which completely processed printed wiring has been formed.
6.209
Printed Wiring Layout - A sketch that depicts the printed wiring substrate, the
physical size and location of electronic and mechanical components and the outing of
conductors that electrically interconnect components, in sufficient detail to allow the
preparation of documentation and artwork.
6.210
Production master -A 1 to 1 scale pattern which is used to produce one or
more printed boards (rigid or flexible) within the accuracy specified on the Waster
drawing.
6.210.1
Single-Image Production Waster - A production master used in the process for
making a single printed board.
6.210.2
Multiple - Image Production Master - A production master used in the process
for making two to more printed boards simultaneously.
6.211
Reference Edge - The edge of cable or conductor from which measurements
are made (Sometimes indicated by a thread, identification stripe, or printing).
Conductors are usually identified by their sequential position from the reference edge
with number one conductor closest to this edge.
6.212
Reflow Soldering - process for Joining parts by finning the mating surfaces,
placing them together, heating until the solder fuses and allowing to cool in the joined
position.
6.213

Register Mark - symbol used as a reference point to maintain registration.

6.214
Registration - The degree of conformity of the position of a pattern or a
portion thereof, with its intended position or with that of any other conductor layer of a
board.

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6.215
Repairing - The act of restoring the functional capability of a defective part
without necessarily restoring appearance, interchangeability and uniformity.
6.216
Resin Recession - The presence of voids between the barrel of the platedthrough hole and the wall of the hole, seen in micro sections of plated-through holes in
boards that have been exposed to high temperatures.
6.217
Resin-rich - Significant thickness of non-reinforced surface-layer resin of the
same composition as that within the base material.
6.218
Resin Smear - Resin transferred from the base material onto the surface or
edge of the conductive pattern normally caused by drilling.
6.219
Resin Starved area - In area in a printed board that has an insufficient amount
of resin to wet out the reinforcement completely evidenced by low gloss, dry spots or
exposed fibres.
6.220
Resist - Coating material used to mask or to protect selected area of a pattern
from the action of an etchant, solder or plating.
6.221
Resistance Soldering - Method of soldering in which a current is passed
through and heats the soldering area by contact with one or more electrodes6.222
Reverse Image - The resist pattern on a printed board used to allow for the
exposure of conductive areas for subsequent plating.
6.223
Reversion - Chemical reaction in which a polymerized material degenerates at
least partially, to a lower polymeric state or the original monomer. It is usually
accompained by significant changes in physical and mechanical properties.
6.224
Reworking - The act of repeating one or more manufacturing operations for
the purpose of improving the yield of acceptable parts.
6.225
Right-angle Edge Connector - Connector which terminates conductors at the
edge of a printed board while bringing the terminations out at right angle to the plane of
the board conductors.
6.226
Roadmap - Printed pattern of non-conductive material by which the circuitry
and components are delineated on a board to aid in service and repair of the board.
6.227
Schematic Diagram - Drawing which shows, by means of graphic symbols,
the electrical connections, components and functions of a specific circuit arrangement.
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Reaffirmed 2003
6.228
Screen Printing (non-preferred synonym: Silk Screening) A process for
transferring an image to a surface by forcing suitable media through a stencil screen with
a squeeze.
6.229
Semi-Additive Process - An additive process for obtaining conductive patterns
which combines an electroless metal deposition on an unclad substrate with
electroplating, etching or with both,
6.230
Separable Component Part - Replaceable component part, the body of which
is not chemically bonded (excluding protective, coatings, solder and potting materials) to
the base material.
6.231
Shadowing -Condition occurring during etchback in which the dielectric
material, immediately next to the foil, is incompletely removed although acceptable
etchback may have been achieved elsewhere.
6.232
Shielding, Electronic - % physical barrier usually electrically conductive
designed to reduce the interaction of electric or magnetic fields upon devices, circuits or
portions of circuits.
6.233
Signal - An electrical impulse of a predetermined voltage, current, polarity
and pulse width.
6.234
signal.

Single Conductor - An individual conductor used to transmit an impressed

6.235
Signal Plane - A conductor layer intended to carry signals rather than serve as
a ground or other fixed voltage function.
6.236
only.

Single Sided Board - A printed board with a conductive pattern on one side

6.237

Solder Plugs - Cores of solder in the plated-through holes of a printed board.

6.238
Solder Projection - An undesirable protrusion of solder from a solidified
solder joint or coating.
6.239
side.

Solder Side - The side of a printed board which is opposite to the component

6.240

Solderability - The property of a metal to be wetted by solder.

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Reaffirmed 2003
6.241
Soldering - The process of joining metallic surfaces with solder without
melting of the base material.
6.242
Solderless Wrap - A method of connecting a solid wire to a square,
rectangular or V-shaped terminal by tightly wrapping the wire around the terminal with a
special tool.
6.243
Span - The distance from the reference edge of the first conductor to the
reference edge of the last conductor, expressed in decimal inches or centimetres.
6.244
Stamped Printed Miring - Miring which is produced by die stamping and
which is bonded to an insulating base.
6.245
Step and Repeat - A method by which successive exposures of a single image
are made to produce a Multiple Image Production Master.
6.246
Step-Scale Step-Wedge - A series of regularly spaced tones ranging from
clear to black through intermediate shades of grey and used as a reference scale for
exposure control in photo fabrication.
6.247
Stripline - A type of transmission line configuration which consists of a
single narrow conductor parallel and equidistant to two parallel ground planes.
6.248
Subtractive Process - A process for obtaining conductive patterns by the
selective removal of unwanted portions of a conductive foil.
6.249
Supported Hole - A hole in a printed board that has its inside surface plated or
otherwise reinforced.
6.250
Surface Mounting - The electrical connection of components to the surface of
a conductive pattern without utilizing component holes.
6.251
Swaged Leads - Component lead wires which extend through the printed
board and are flattened or swaged so as to secure the component to the board during
manufacturing operations.
6.252
Taped Components - Components attached to a continuous tape for and in
automatic assembly.
6.253
Tenting - A printed board fabrication method of covering over plated-through
holes and the surrounding conductive pattern with a resist, usually dry film.

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JSS 52300: 1992

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Reaffirmed 2003
6.254
Test Board - A printed board suitable for determining acceptability of the
board or of a batch of boards produced with the same process so as to be representative of
the production board.
6.255
Test Coupon - A portion of a printed board or of a panel containing printed
coupons used to determine the acceptability of such a board (s).
6.256

Test Pattern - A pattern used for inspection or testing purpose.

6.257
Test Point - Special points of access to an electrical circuits used for testing
purposes.
6.258
Thermal Relief - Crosshatching to minimize blistering or warping during
soldering operations.
6.259
Thief - A racking device used in the electroplating process to provide a more
uniform current density on plated parts. ("Thieves absorb the unevenly distributed
current on irregularly shaped parts, thereby; assuring that the parts will receive an
electroplated coating of uniform thickness)
6.260
Through Connection - An electrical connection between conductive patterns
on opposite sides of an insulating base e.g. plated through hole or clinched jumper wire.
6.261

Thin Foil - A metal sheet less than 0.0178 mm thick.

6.262
Tinning - A process for the application of solder coating on component leads,
conductors and terminals to enhance solderability.
6.263
Tooling Feature - A specified physical feature on a printed board or a panel
such as a marking, hole, cut-out, notch, slot or edge used exclusively to position the
board or panel or to mount components accurately.
6.264
Tooling Holes - The general term for holes placed on a printed board or a
panel and used to aid in the manufacturing process,
6.265
Transmission Cable - Two or more transmission lines. (If the structure is flat,
it is called "flat-transmission cable" to differentiate it from a round structure such as a
jacketed ground of coaxial cables)
6.266
Transmission Line " A signal-carrying circuit composed of conductors and
dielectric material with controlled electrical characteristics used for the transmission of
high-frequency or narrow pulse type signals.
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JSS 52300: 1992

(Revision No. 1)
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6.267
Treatment Transfer - The transfer of copper foil treatment to the base material
as indicated by the presence of black, brown or red streaks after the copper has been
removed by etching,
6.268

Trim Lines - Lines which define the borders of a printed board.

6.269
True Position - The theoretically exact location of a feature or hole established
by basic dimension.
6.270
True Position Tolerance - The total diameter of permissible movement around
the true position as shown in the master drawing.
6.271
Twist - The deformation parallel to a diagonal of rectangular sheet such that
one of the corners is not in the plane containing the other three corners.
6.272
Undercut (in process) - The distance on one edge of a conductor measured
parallel to the board surface from the outer edge of the conductor including etch resists,
to the maximum point of indentation on the copper edge.
6.273
Undercut (after fabrication) - The distance on one edge of a conductor
measured parallel to the board surface from) the outer edge of the conductor excluding
overplating and coating, to the maximum point of indentation on the same edge.
6.274
Underwriters Symbol - Pt logotype authorised for placement on a product
which has been recognized (accepted) by Underwriters Laboratories, Inc, (UL).
6.275
Unsupported Hole - A hole containing no conductive material nor any other
type of reinforcement.
6.276
Via Hole - A plated-through hole used as a through connection, but in which
there is no intention to insert a component lead or other reinforcing material.
6.277

Void - The absence of substances in a localized area.

6.278
Voltage Plane - A conductor or portion of a conductor layer on or in a printed
board which is maintained at other than ground potential. It can also be used as a
common voltage source for heat sinking or for shielding.
6.279
Voltage-plane clearance - Voltage-plane clearance is the etched portion of a
voltage plane around a plated-through or non-plated through hole that isolates the voltage
plane from the hole.

26

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6.280
Wave Soldering - A process wherein printed boards are brought in contract
with the surface of continuously flowing and circulating solder.
6.281
Meave Exposure - A surface condition of base material in which the unbroken
fibres of woven glass cloth are not complete covered by resin.
6.282
Weave Texture - A surface condition of base material in which a weave
pattern of glass cloth is apparent although the unbroken fibers of the woven cloth are
completely covered with resin.
6.283
Metting - The formation of a relatively uniform, smooth, unbroken and
adjacent film of solder to a base material.
6.284
board.

Whisker - A slender acicular (needle shaped) metallic growth on a printed

6.285

Wicking - Capillary absorption of liquid along the fibres of the base material.

7.

MATERIALS, PROCESSES AND FINISHES

7.1
Where materials, processes and finishes are specified in the relevant detailed
specifications, they are mandatory, attention is drawn to the requirements in JSS 50102
that materials, processes and finishes shall not be changed significantly without prior
approval.
7.2
Workmanship, Processor and Finishes - Printed wiring boards shall be
processed in such a manner as to be uniform in quality and shall be free from dirt, oil,
corrosion, corrosive products, salts, smut, grease, finger prints, mould release agents,
foreign matter, flux residue and other defects that will affect life, serviceability or any
combination of these.
8.

MARKING

8.1
Each board shall be legibly and indelibly marked with the date,
manufacturers code and serial number. The marking shall be produced either by the
same process used in producing the conductor pattern or by use of a permanent nonnutrient ink or paint. Conductive Marking shall not be closer to the pattern than the
spacing requirement specified. All markings shall be compatible with materials and
parts, legible after all tests and in no case shall affect the board performance.

27

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
9.

PACKAGING

9.1
Printed wiring boards shall be clear dry and packed in a manner that will
afford adequate protection against corrosion, deterioration and physical damage.
Shipment Packaging (preservation, identification and picking) shall be in accordance
with the terms of the contract.
10.

QUALIFICATION APPROVAL AND MAINTENANCE OF

QUALIFICATION APPROVAL PROCEDURE

10.1
Qualification Approval and Maintenance of Qualification Approval shall be
obtained as described in JSS 50102 and in the relevant detailed specification.
10.2
Provision of Samples - The manufacturer shall, submit specimens of printed
wiring boards for which approval is desired, as specified in the relevant detailed
specification.
10.3
Grouping of Specimens - The test specimens shall be grouped as indicated in
the relevant detailed specification.
10.4
Test incidence - Initial measurements referred to in Table 4 of JSS 50101 and
in this specification as Group '0', shall be carried out immediately prior to the
commencement of tests on subsequent groups and the results shall be recorded. Each test
shall be performed in the order listed and where measurements are not required, the
results shall be recorded where tests are not applicable, this will be indicated in the
relevent detailed specification.
11.

BATCH ACCEPTANCE PROCEDURE

11.1
Batch acceptance shall be performed as described in JSS 50102 and in this
specification.
11.2
Inspection Batch - Unless otherwise specified in the relevant detailed
specification, an inspection batch shall be as specified in IS 10&73 and shall consist of
printed wiring boards of the same style produced under essentially the same conditions
and offered for inspection at one time. Each production board or panel of boards shall
incorporate the test coupons at specified. The location of the test coupons shall be not
closer to the edge of the panel than the edge of the printed wiring board. Test coupons
shall be used in performing Group A' inspection and all unused test coupons shall be
retained by the supplier, unless otherwise specified.
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JSS 52300: 1992

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11.3
100 percent Acceptance Test - These tests shall be performed as described in
the relevant detailed specifications.
11.4
Sampling Tests - Tests bracketed together within a group or subgroup are
considered as a sequence and must be performed as such using the same sample.
11.4.1
Group 'A' Tests - These tests shall be performed as described in the relevant
detailed specifications.
11.4.2
Group 'B' Tests - These tests shall be performed as described in the relevant
detailed specifications.
12.

TEST PROCEDURE

12.1
Atmospheric Condition for Testing - Unless otherwise specified, all tests shall
be performed under standard atmospheric conditions as defined in JSS 50101.
12.2
Accuracy of Test Equipment - The accuracy of test equipment shall be as
specified in the relevant test clauses.

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JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
13.

TEST DETAILS

13.1
Wherever, the terms 'as specified' occurs against the 'description' or
'requirements' it indicates that details are given in the corresponding clauses of the
relevant detailed specifications.
Test
Number
1
13.1

Title of Test
2
General
Examination

Description

Requirements

13.1.1

Visual
Examination

The boards shall be examined

visually to verify that the
dimensions, machinability, repair,
marking and workmanship are in
accordance with the applicable
requirements. Suitable light source
and magnification (approximately
3x) shall be employed. For
acceptance test, reference shall be
made to qualification approval
certificate for compliance.

13.1.1.1

Edge of the
printed Wiring
Board

The edge of the Printed Wiring

Boards shall be inspected to verify
burrs, nicks and haloing along the
edges of Printed Circuit Board.

30

The board shall be processed in such

a manner as to be uniform oil,
corrosion corrosive products salts,
grease, finger prints, mould release
agents, foreign matter and other
defects that will affect life,
serviceability and appearance (See
also clause 7). Marking shall be in
accordance with the Master Drawing
and shall be made either by the same
process used in producing the
conductor pattern or with the use of
percent ink or paint. Conductive
marking shall not be closer to the
pattern than the, spacing,
requirements, given in Appendix, 'A'.
Marking shall be legible and shall in
no case affect the performance of
board (See also clause 8). The board
shall be capable of withstanding in
all directions in required machine
operation, without cracking, splitting,
delaminating or in any other way
exhibiting adverse effects.
The burrs, nicks along the edges of
Printed Wiring Boards shall be
acceptable provided the penetration
does not reduce edge spacing more
than 50% of the edge spacing
specified in the Master Drawing. The
penetration shall not exceed 2.5 mm
if it is not mentioned in the Master
Drawing.

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
Test
Number
1
13.1.1.2

Title of Test
2
Surface
Imperfection

Description

Requirements

3
The features of the boards shall be
inspected using an optical apparatus
or aid which provides a minimum
magnification of 4X. Inspection of
Board features shall be
accomplished at a magnification of
10X.

4
Surface imperfection (such as weave
texture, haloing, scratches pits and
dents shall be acceptable if:
a) The laminate fibre is not cut.
b) The imperfection does not bridge
between conductors.
c) The dielectric spacing between the
imperfection and a conductor is not
reduce below the minimum
requirements i.e. 0.13 mm for external
conductors and 0.10 mm for internal
conductors. And the minimum laternal
width of external and internal
conductors shall not be less the 0.13
mm.

13.1.1.3

Sub-surface
Imperfection

The PWBs shall be inspected as

specified in clause 13.1.1.2

The blistering, haloing and

delamination shall be acceptable
provided:
a) Imperfection is tranclucent.
b) It does not bridge more than 25% of
the distance between conductors or
plated through holes. Not more than
one percent of the board area on each
side shall be affected.
c) Does not reduce conductor spacing
below the minimum requirements as
mentioned in clause 13.1.1.2.
d) Does not propagate as a result of
testing (such as bond strength, rework
simulation, thermal stressor thermal
shock).

13.1.1.4

Repair

The PWBs shall be inspected as

specified in clause 13.1.1.1

31

There shall be no evidence of repair

when inspected and PW shall not be
repaired.

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
Test
Number
1
13.1.2

Title of Test

Description

Requirements

2
Dimensions and
Materials

3
The dimensions of the board and
pattern shall be checked for
conformity with the Master
Drawing. The finished Printed
Wiring Board shall meet the
dimensional requirements specified
here in an on the Master Drawing.

4
The dimensions of the board and
pattern shall be specified on the
Master Drawing. The type of Material
shall be as given below and as
specified in the drawing:
a) For Single and Double sided
boards:
The metal clad laminates shall be in
accordance with JSS 51701.
b) For multiplayer boards: The metal clad laminates shall be in
accordance with JSS 51702 and of a
type specified on the relevant
Drawing. Base material shall be of
minimum 0.05 mm per sheet. Copper
cladding on external surface, shall be
at least 305 g/ m and copper cladding
on internal layers shall be at least 610
g/m.
The bonding interlayer material shall
be a pre-impregnated glass cloth.
There shall be a minimum of 0.1 mm
of dielectric material between
conductive layers of Copper in the
finished board.

13.1.2.1

Annular ring

The measurement of the annular ring

on external layers shall be made from
the inside surface (Within the hole)
of the plated hole to the outer edge of
the annular ring on the surface of the
board. On the internal layers, the
annular ring shall be measured from
the edge of the drilled hole to the
outer edge of the annular ring.
32

The annular ring shall be in

accordance with the following for the
layer(s) indicated.
External. The minimum annular ring
for an unsupported hole shall be 0.38
mm. The minimum annular ring for a
plated through hole shall be 0.13mm.

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
Test
Number
1

13.1.2.2

Title of Test

Description

Plating
Thickness

Requirements
4
Internal. The minimum annular ring
for internal terminal area on multi
layer boards shall be 0.05 mm.

Inspection for plating thickness

(conductor pattern) shall be carried
out as specified in clause 13.1.1.
Microsection inspection as
mentioned in Appendix B with a
magnification of 100X, shall be
carried out. Plating measurements
in the reported as the average of
three determinations per each side
of the hole. Isolated thick or thin
sections shall not be used for
averaging. However, isolated areas
of reduced Copper thickness shall
be measured.

The plating and coating thickness

shall conform to the requirement
specified herein:Plating Material:
Surface and through hole plating
thickness. (see also 13.5)
Electroless. Sufficient for subsequent
electro deposition.
Electrolytic. 0.03 mm (min.).
Gold

0.00125mm (min.)

Nickel

0.005 mm (min.)

Tin-Lead - 0.008 mm (min) at

the surface as
plated.
Solder
coating

0.008 mm (min.)
at the crest on the
surface as coated.

13.1.2.3

Dielectric layer

The dielectric layer thickness of the

board shall be inspected using an
optical apparatus or aid which
provides a minimum magnification
of approximately 3x.

The minimum dielectric thickness for

printed Wiring Boards shall be as
defined on the Master Drawing.

13.1.2.4

Under cutting
(For external
conductors
only)

The undercutting at the edge shall

be inspected by the method of
microsection inspection mentioned
in the Appendix 'B'.

Under cutting at each edge of the

conductors shall not exceed the total
thickness of clad and plated Copper.

33

JSS 52300: 1992

(Revision No. 1)
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Test
Number
1
13.2

Title of Test
2
Conductor
Pattern
(External
layers)

Description

Requirements

3
(a) The conductor pattern shall be
examined using an optical apparatus
or aid which pro vides a signification
of approximately 3x minimum.

(b) Conductor overhang: - The

extent of overhang on conductors
plated with gold, shall be determined
by measuring the conductor width
before and after mechanically
removing the overhang metal.
The procedure for removing gold
overhang metal, for this test shall be
as follows:Wet the board in tap water at
approximately room temperature.
While Wet brunch the board with a
brass wire brush to remove the
overhang metal Brush in the
direction of the functional line, using
moderate pressure.
The microsectioned specimen could
also be used alternatively to measure
the cross section of the pattern.
(c) Conductor Spacing The
The conductor spacing shall be as
conductor spacing shall be inspected specified on the Master Drawing.
using an optical apparatus or aid
which provides a minimum
magnification of approximately 3x.
13.2.1

Conductor
Width

The PWBs shall be inspected in

accordance with clause 13.1.1

34

The conductor width and spacing of

printed wiring boards shall meet the
minimum requirements as specified
in the Master Drawing. If nothing is
specified, it shall be in accordance
with the requirements mentioned in
(iii) in clause 13.1.1.2.

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
Test
Number
1
13.2.2

Title of Test
2
Circuit Short

Description
3
A test voltage shall be applied
between all common portions of
each conductor pattern and all
adjacent common portions of each
conductor pattern.

Requirements
4
The minimum resistance between
mutually isolated conductors shall be
2 Megaohms.

A minimum voltage 200V in the

case of manual testing is applied for
5 seconds. When automatic test
equipment is used, the minimum
applied test voltage shall be twice
the maximum rated voltage on the
boards. If maximum rated voltage
on the boards, in not specified, in
the Master Drawing, the test voltage
shall be 40 volt minimum.
13.3

Plating
Adhesion

Plating Adhesion shall be tested as

follows: A strip of pressure sensitive
cellophane adhesive tape 12.7 mm
wide and 50 mm long shall be
placed across the surface of the
conductor pattern and pressed
firmly to the conductor eliminating
air bubbles. A tab shall be left for
pulling. The tape shall be pulled
with a snap pull at an angle of
approximately 90 degree to the
board. Tape shall be applied to end
removed from three different
locations on each board tested.
Fresh tape shall be used for each
test.

13.4

Bow and Twist

There shall be no plating particles or

conductor patterns removed from the
board except for overhang. If
overhang metal breaks off and
adheres to the tape, it is an evident of
cut growth but not a plating adhesion
failure

The maximum allowable Bow and

The board shall be placed
unrestrained on a flat horizon surface Twist shall be 1.5 per cent.
with the convex surface of the panel
upward. The maximum vertical
35

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
Test
Number
1

Title of Test

Description

Requirements

3
displacement (the vertical distance
from the horizontal surface to the
maximum height of the determined
by taking the measurement and
subtracting the thickness of the board
if it is included in the height
measurement. The vertical
displacement divided by the length
of the longest side and multiplied by
100 shall be considered the
percentage Bow and Twist.

13.5

Plated through
hole

Plated through hole examination

shall be accomplished by
microsectioning using methods
given in Appendix 'B'.

Plating thickness shall be as in

13.1.2.2. Plating shall be continuous
except for allowable plating voids.

13.5.1

Vertical

The microsectioned plated through

holes in the vertical plane at the
centre of the hole shall be examined
for quality of plating at a
magnificattion of 50x to 100x.
Plating thickness shall be viewed
independently. A minimum of the
micro section containing atleast three
holes shall be prepared for each
sample tested. Measurements shall
be reported as the average of three
determinations per hole. Isolated
thick or thin sections shall not be
used for averaging.

There shall be no crack, epoxy smear

nodule or separation of conductor
interface. The plated through hole
shall not exhibit more than three
plating voides, totaling not more than
5 percent of the wall length.

13.6

Layer to Layer
Registration
(Applicable
only for
multiplayer
Boards)

Unless otherwise specified, layer to

Layer to layer registration shall be
layer conductor pattern misregistration
measured at 100x after vertical
microsectioning of two samples as
shall not exceed 0.36 mm.
detailed in clause 13.5 and as shown
in Fig. 18. One sample shall be
vertically cross sectioned parallel to
the board length and one vertically
cross sectioned perpendicular to the
board length. These microsections
36

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
Test
Number
1

Title of Test

Description

Requirements

3
shall be evaluated by difference of
centre lines of all lands of all
conductor layers shifted to extreme
positions (see fig 1). All lands
(external and internal) shall be
included in the evaluation of
registration.

13.7

Voltage Proof

The Printed Wiring boards shall be

tested as follows:The voltage shall be steadily
increased from zero to the proof
value at a rate of approximately
500V. (rms or dc) per second. Upon
completion of test, the proof voltage
shall be gradually reduced to avoid
voltage surges. When required
suitable current limiting device
shall to the value specified. The
following details shall apply
(a) Magnitude of test voltage
1000V (ac peak or dc)
(b) Duration of application 30
seconds for Qualification Approval
and 2 seconds for batch acceptance
(c) Point of application
(i)
Single sided and double
sided board. Between two
adjoining conductors of the
test pattern.
(ii) Multilayer board
Between all common points of
each common portions of each
conductor patterns of each
adjacent layer.

37

There shall be no flash over, spark

over or breakdown.

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
Test
Number
1
13.8

Title of Test
2
Insulation
Resistance

Description

Requirements

3
Unless otherwise specified, the
insulation resistance shall be
measured at 100 Vdc 10 percent.
The voltage shall be applied for the
period of 1 minute 5 seconds. The
points of measurement shall be as
follows :-

4
The insulation resistance shall be 500
Megaohms (Minimum)

(a) For Single and double sided

boards between two adjoining
conductors of the test pattern.
(b) For Multilayer boards between
conductor pattern of each layer and
the electrically insulated pattern of
each adjacent layer.
13.9

Continuity

A current of 1A shall be passed

through each conductor or group of
interconnected on the terminals at
each end of the conductor or group
of conductors. The current rating
can also be determined from the fig.
19a and 19b. The current shall not
exceed than that specified for the
smallest conductor in the circuit.

There shall be no open circuit in the

specimen The temperature rise shall
be not greater than 10 deg C over
ambient temperature.

13.10

Solderability

The test pattern shall be tested in

accordance with JSS 50101 test
number 19 procedure 2 big size A,
unless otherwise specified but at
260 to 280 deg C.

For Single sided boards the specimens

shall exhibit proper wetting of the
surface and there shall be no
separation or other forms of
degradation of the conductive
patterns. The wetting of the wall of
the plated through hole and the
associated land the wetting shall be
completed within first two seconds.
For double sided (with PTH) and
multilayer board, the specimens shall
exhibit proper wetting of the wall of
the plated through hole and the
associated land the wetting shall be
completed within first two seconds.

38

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
Test
Number
1
13.11

Title of Test

Description

2
3
Pull off strength Three holes per coupon shall be
tested. Insert wires in holes in m a
selected terminal area and solder by
hand. The wires shall not be
clinched. Subject wires to five cycles
of unsoldering and soldering by hand
after the initial hand soldering.
During the five cycles, the wires
shall be completely removed during
each unsoldering operation and
replaced during each soldering
operation. A 60W conventional
soldering iron with a tip temperature
of 232 to 260C (Max) shall be used
for the unsoldering and soldering
operation. The iron shall be applied
to the leads and not to the foil and
shall be applied only as long as it is
necessary to performs the
unsoldering or soldering operation.
Following the fifth cycle the printed
wiring board shall be clamped to the
jaws of bond tester. A pull at the rate
of 50.8 mm/minute shall be applied
to the wire (on the terminal area side
in the case of unsupported hole)
The pull shall be applied until the
specified load of 22.25 N is
reached. The tensile pull shall be
calculated using the formula.
4L
--------------------- > or = 345N/cm2
n (d22 d22)
Where L = load in N
d1 = diameter of the hole
d2 = terminal area diameter
39

Requirements
4
The specimens shall with stand a force
of 22.25N or tensile pull of 345N/cm
whichever is less. A plated shall not
be loosened. A conductor or terminal
area around an unsupported hole shall
not be loosened.

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
Test
Number
1

13.12

Title of Test

Description

Requirements

3
The load shall be applied
perpendicular to the major surface of
the terminal area until the required
force is reached of failure occurs.
Breaking of a wires pull out shall not
be considered as a failure but the
wire shall be resoldered and pulled
again.

Temperature
cycling
(Thermal
shock)

As in JSS 50501 test number 20

procedure 1 at the maximum and
minimum temperature specified
below. The transfer time shall be 5
minutes for single or double sided
boards, 2 minutes for single or
double sided boards and 2 minutes
maximum for multi layer boards.
Type Px of JSS 51701

: T65/205

Type GB, GH, GP, GR

& GT of JSS 51701

: T65/150

Type GE and GF of
JSS 51701 and 51702

: T65/125

13.12.0

Final
Measurements

On completion of test, the following

measurement shall be made

13.12.1

Visual
examination

The boards shall be visually

examined

There shall be no blistering measling,

crazing or delamination.

13.12.1.2
13.12.1.3

Continuity
Bow and twist

As in clause 13.9
As in clause 13.4

As in clause 13.9
The maximum Bow and Twist shall
be twice the that of specified in 13.4.

13.13

Climatic

The sequence of test shall be carried

out in accordance with JSS 50101 at
the severities specified. The damp
heat severity shall be H12.
40

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
Test
Number
1
13.13.1

Title of Test

Description

Requirements

2
Intermediate
Measurements

3
The following tests shall be made
subsequent to removal form the
conditioning chambers for
temperature (dry heat) and
temperature (cyclic) tests after
allowing the appropriate recovery
period specified in JSS 50101.

13.13.1.1

Visual
Examination

The board shall be visually examined There shall be no blistering measling,

crazing or delamination.

13.13.2

Temperature
(Dry Heat)

As in JSS 50101, test number 22, at

the temperature specified below:
Type PX of JSS51701 at 105 deg C
Type GB, GH, CP & GT of JSS
51701 at 150 deg C
Type GE and GF of JSS 51701 and
51702 at 125 deg C

13.13.2.1

Continuity

As in clause 13.9

As in clause 13.9

13.13.3

Damp Heat
(cyclic)

As in JSS 50101 test number 5.

13.13.4

Temperature
(Dry cold)

As in JSS 50101 test number 21 at

the temperature of (-) 65 deg C

13.13.4.1

Continuity

On completion of the test and while As in clause 13.9

the boards are still in the chamber,
the resistance and temperature of the
test pattern shall be measured and
recorded.

13.13.5

Damp Heat
(cyclic)

As in JSS 50101, test number 5

13.13.5.1

Insulation
resistance

13.13.6

Final

On completion of the final cycle, the As in clause 13.8

boards shall be removed from the
chamber. After removing surface
moisture, the insulation resistance
shall be measured as in clause 13.8
within 5 minutes.
The following measurements shall be
41

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
Test
Number
1

Title of Test

Description

Requirements

2
Measurements

3
made at the conclusion of the
sequence.

13.13.6.1

Visual
Examination

The boards shall be visually

examined.

There shall be no blistering measling,

crazing or delamination.

13.13.6.2

Voltage proof

As in clause 13.7

As in clause 13.7

13.13.6.3

Insulation
resistance

As in clause 13.8

As in clause 13.8

13.13.6.4

Continuity

As in clause 13.9

As in clause 13.9

13.13.6.5

Bow and Twist

As in clause 13.4

The maximum Warp and Twist shall

be twice the that of specified in clause
13.4

13.13.6.6

Solderability

As in clause 13.10

As in clause 13.10

13.13.6.7

Pull of strength
(Bond strength)

As in clause 13.11

As in clause 13.11

13.14

Damp heat
(steady state)

As in JSS 50501 test number 7. The

damp heat severity shall be H12.
During the test, a polarizing voltage
of 100 5V dc shall be applied
through a current limiting resistor
such that the current shall not exceed
1mA.

13.14.1

Final
measurements

The following measurements shall be

made after the completion of the
appropriate recovery period.

13.14.1.1

Visual
examination

The boards shall be visually

examined

13.14.1.2

Voltage proof

As in clause 13.7

As in clause 13.7

13.14.1.3

Insulation
Resistance

As in clause 13.8

As in clause 13.8
42

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
Test
Number
1
13.14.1.4

Title of Test

Description

Requirements

2
Continuity

As in clause 13.9

As in clause 13.9

13.14.1.5

Bow and Twist

As in clause 13.4

As in clause 13.4

13.14.1.6

Solderability

As in clause 13.10

As in clause 13.10

13.14.1.7

Pull off strength As in clause 13.11

(Bond strength)

As in clause 13.11

13.15

Thermal stress

The boards shall be conditioned at

The boards shall exhibit no measling,
121 to 149 deg C for one hour The
fractures, separation of plating and
boards shall than be floated in a
conductors, blistering or delamination
solder bath (63/37) tin lead solder
composition, maintained at 288C
6 C for a period of 10 seconds then
microsectioned and examined in
accordance with clause 13.5.

13.16

Rework
simulation
(plated through
hole)

The test specimens shall be

The micro sectioned specimens shall
conditioned at 23 deg C, 40-65% RH meet the requirements of clause 13.5
for 24 hours, prior to soldering and
unsoldering procedure.

Insert the test wires in PTH and

solder by machine or hand as
applicable. The wire shall have a
diameter of 0.5 mm smaller than the
hole diameter. The wire shall not be
clinched. Subject the wires to five
cycles by unsoldering and soldering,
by head after the initial soldering.
During each cycle the wires shall be
completely removed and allowed to
cool to ambient temperature and then
replaced and resoldered.
Apply the iron to the test wire, not to
terminal pad and it should be applied
only as long as it is necessary to
perform the unsoldering and
soldering operation. Following the
fifth cycle, observe the specimen
through microsectioning.
43

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
Test
Number
1
13.17

Title of Test

Description

Requirements

A convenient sized funnel shall

positioned over an electrolytic
beaker. The printed wiring board
shall be suspended within the
funnel. A wash solution of 75 pr
cent by volume of ACS reagent
grade isopropyl alcohol and 25 per
cent by volume of distilled water
shall be prepared, which will have
resistivity equal to or greater than
6x10 ohm/centimeters. The wash
solution shall be directed in affine
stream from a wash bottle on to
both Printed Wiring Board until 100
milli-meters of the wash solution is
collected for each 254 sq/mm of
board surface (including both sides
of the board). The time required for
the wash activity shall be a
minimum of 1 minute. It is
imperative that the initial washing
be included in the sample to be
measured for resistivity. The
resistivity of the collected wash
solution shall be measured with a
conductivity bridge or other
instrument of equivalent range and
accuracy.

The Printed Wiring Boards shall be

within the allowable limits of ionic
and other contaminants. If PUBs
require permanent ionic within the
allowable limiting ionic contaminants
prior to the application of solder
maskcoating (i.e. the resitivity shall
not be less than 2 x 10 ohm cm or
equivalent)

Cleanliness

44

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
14.

SUGGESTION FOR IMPROVEMENT

14.1

Any suggestion for improvement in this document shall be used to: The Director,
Directorate of Standardisation
Ministry of Defence
H Block
New Delhi 110 011.

45

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
APPENDIX 'A'
(Clause 13.1.1)
CONDUCTIVE PATTERN
A.0

Scope :This appendix gives detail requirements of conductive pattern.

A.1
Conductor thickness and width: The width and thickness of conductors on the
finished printed wiring board shall be determined on the basis of the current carrying
capacity required. The temperature rise shall be determined in accordance with fig. 19(a)
and 19(b).for the case of manufacture and durability in usage, conductor width and
spacing requirements shall be maximized while maintaining the minimum spacing
requirements of Table A.1. The minimum Conductor width shown on the master drawing
Shall be not less than 0.10mm.To maintain the conductor width shown on the master
drawing the line width on the production master shall be compensated for process
allowance Table A.4 of the Appendix A.
A.2
Conductor with less than 90 deg. included angle: All conductors that change
direction Where the included angle is lese than 90 deg. shall have external corners of the
conductor rounded.
A.3
Conductors: The length of a conductor between any two lands should be held
to a minimum. However, conductors which are straight lines and run in X, Y or 45deg
directions in general are preferred to aid computerized documentation for mechanized or
automated layouts.
A.4
Conductor Spacing: large spacing shall be used whenever possible and the
minimum spacing between conductors, between conductor patterns, and between
conductive materials (such as conductive marking s or mounting hardware) and
conductors shall be in accordance with Table A.1. and defined on the master drawing. To
maintain the conductor spacing shown on the master drawing, space width on the
production master shall be compensated for process allowance as shown on Table A.4 of
the Appendix. Plated-through holes passing through internal foil planes (ground and
voltage and thermal planes shall meet the same minimum clearance between the platedthrough hole and foil of ground planes as required for spacing between internal
conductors.
A.5
Edge Spacing: The minimum spacing between conductive patterns and the
edge of the printed wiring board or any adjacent conductive surface, such as supporting
structure or frames (nonmoving), shall be not less than the minimum spacing specified in
Table A.1 plur 0.38 mm, provided the edges are protected from the physical harm in the
installed assembly configuration. Printed wiring not so protected shall have a minimum
46

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
conductor to edge distance of 1.25 mm. The edge spacing requirement is not applicable to
heat sinks and ground planes. To maintain the edge spacing shown on the master
drawing, the edge spacing shall be compensated for process allowances shown in Table
A.4.
TABLE A.1: CONDUCTOR SPACING
Voltage between
conductors DC or
AC peak (volts)

Minimum spacing
Surface layers
Internal layers

0-100
101-300
301-500
Greater than 500
1/

0.13 mm
0.38 mm
0.76 mm
0.00305 mm
(per volt)

0.10 mm
0.20 mm
0.2525 mm
0.0025 mm
(per volt)

1/
for reference only, voltages greaer than 500 v should be evaluated for the
specific design application.
A.8
Large internal conductive areas (for multilayer boards only): When a
conductive area that extends beyond 25.4 mm diameter circle is used on an internal layer,
the layer should be placed areas that will breakup large conductive area but retain the
continuity and functionality of the conductor. If more than one internal layer has a large
conductive area, the layers should be located in the board to provide balanced
construction.
A.9
Interfacial connections: Interfacial connections on double sided and multilayer
printed wiring boards shall be made by use of plated-through holes only. Wires, standiff
terminals, eyelets, rivets, or pins shall not be used to provide interfacial connections.
A.10
Solder fillets and plugs: Printed wiring boards subjected to wave or dip
solderings shall be designed to facilitate flow of solder around components leads in
plated through holes and into plated-through holes without leads, so as to create a solder
plug. Careful consideration shall be given to hole-to-lead diameter clearance, hole to
board thickness rations and heat relief of metal planes to promote solder plugging. In the
event solder plugging due to natural capillary action is not possible, such as when a heat
sink is bonded directly over plated-through holes, the design shall include provision for
prevention of solder, flux or other chemical from entering the plated-through holes.
Solder may be prevented from entering the holes by profiling these holes with an
appropriate polymer plug, covering the holes with a sheet of permanent bonded material,
tenting the holes with a permanent solder mask of blocking these holes with some
47

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003
temporary techniques that will prevent solder access to the hole. All techniques must
have sufficient durability not to break up when exposed to the solder process. The printed
wiring assembly shall define the absence of such solder plug requirements. As a
minimum, solder plugs shall be required in:
(i) All electrically functional and non -functional plated through hole with a
lead is required to be surrounded 360 deg c by the solder plug, no matter what
technique for soldering is used.
(ii) Any plated -through hole without a lead, that is subject to wave or dip
soldering with the degree and percentage of hole plugging described by the
appropriate assembly of solder specification.
Solder plugs are not necessarily required in:
(i)

Any unsupported hole without a lead.

(ii) Non-functional plated-through holes (hand soldered or vapour phase

reflowed assembly)
(iii) Any electrically functional plated-through hole (without a lead) not
subjected to wave or dip soldering.
(iv) Any plated -through hole covered with permanent solder mask, other
polymeric cover layer (non conformal coating) or is already filled with an
appropriate polymer in order to prevent hole access during wave or dip
soldering.
(v) Any plated -through hole, electrically functional or not, without a lead,
where access to the hole is limited by components, heat sinks, by design
(bling vias), or where access of solder to the hole is prevented during the
solder process.
A.11
Test pints: When required by the design, test points for probing shall be
provided as part of the conductor pattern and shall be identified on the master drawing
and the assembly drawing. These "probe points" shall require that a land be available for
probing as opposed to air conductor. Vias or component lead mounting lands may be
considered as probe points provided that sufficient area is available for probing and
maintaining the integrity of the via or component lead mounting joint.
A.12
Lands: Lands shall be provided for each point of attachment of a part lead or
other electrical connection to the printed wiring board.
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A.12.1
Lands for through hole attachment: When through hole attachment is required,
all the requirements of para A.12 shall be considered in the design of the printed wiring
board except where para A.12.4 applies for the surface attachment.
A.12.2
Lands location: The lands shall completely surround and a but on the
mounting holes except where paras A.12.4 and A.14 applies.
A.12.3
Through hole land requirements: The minimum diameter of the land
surrounding an unsupported hole shall be at least 1.02 mm greater than the maximum
diameter of the hole. When eyelets or standoff terminals are used, the lands on single and
double sided boards and external layers of multilayer boards shall be so designed as to
have a minimum diameter of at least 0.51 mm greater than the maximum diameter of the
projection of the eyelet or standoff terminal flange. The minimum diameter of a land
surrounding a plated-through hole on double sided and multiplayer boards shall be
determined by considering the following:
(i)

Maximum diameter of the drilled hole.

(ii) Minimum annular ring requirements. Etch back, when required, will
reduce the insulation area that supports the internal land. The minimum
annular ring considered back allowed.
(iii) A standard fabrication allowance, determined by statistical survey, which
considers production master tooling and process variations required for
fabrication boards. (See Table A.2)
TABLE A.2 MINIMUM STANDARD FABRICATION ALLOWANCES FOR PTH
Greatest Board/
Panel dimension
Upto 305 mm
More than 305 mm

Preferred
mm

Standard
mm

Reduced producibility
mm

0.71
0.86

0.51
0.61

0.30
0.41

All lands and annular rings shall be maximized wherever feasible, consistent
with good design practice and electrical clearance requirements.
A.12.4
Lands for surface attachment: When surface attachment is required, all of the
requirements of para A.12 shall be considered in the design of the printed wiring board
except where paras A.12.1 and A.12.9 apply. The selection, design, and position of the
land geometry in relation to the part may significantly impact the solder joint. The
designer must understand the capabilities and limitation of the manufacturing and
assembly operations.
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A.12.5
Land for end capped discrete components: Discrete components when
mounted shall have their land relationship identified as shown in figure 20.
A.12.6
Land pattern for leadless chip carriers: The attachment lands for surface
mounting and leadless chip carriers should be the same width as the component terminal
plus 0.01 mm whenever possible. The land length should extend between 0.38 to 1.02
mm beyond the maximum chip carrier outling on all four sides to create a horizontal
solder fillet length equal to the vertical filler rise (See Figure 21). The design of fan-out
to interconnect the basic land pattern to other circuitry/devices is independent of wiring
density, testability, assembly; repairability land sides should be located on fixed grid
within the printed board to optimise testing. The grid should be compatible with assembly
and testing equipment so as to minimise the amount of specialised and complex
equipment necessary.
A.12.7
Lands for leaded chip carriers: The land size for ceramic and for leaded chip
carrier should match the lead configurations. 'J' shaped leads should have the land width
equal or 0.13 mm larger than the width of the lead. The land length should extend
between 0.38 to 1.02 mm beyond both sides of the foot of the 'J' pattern. Other types of
leads used for chip carriers should have the land commensurate with the lead
configuration, in order to create a horizontal solder fillet length at the toe and heel of the
lead configuration as shown in Fig. 23.
A.12.8
lands for ribbon leaded surface mounted parts: The land requirements for
mounting ribbon leaded parts, such as flat packs', 'quad packs' or small outline devices
shall preferably be rectangular. The minimum land width shall be equal to or exceed the
maximum lead width by the amount as shown in Figure 23 providing room for both
solder fillets at both the heel and toe of the ribbon lead. The minimum land width shall be
approximately one and one-half times the width of the lead or 0.13 mm, whichever is less
(See Figure 24). Flat pack termination shall be staggered to permit greater spacing
wherever possible. The centre position of ribbon leaded components should be a fixed
grid, wherever possible, to facilitate testing.
A.12.9
Land for flattened round leads: Flattened round leads shall have a land which
will provide the seating so that the heel and the terminal relationship is in accordance
with Figure 25. Leads shall be seated with no side overhang. Toe overhang is acceptable,
area is a minimum of 150 percent of the unflattened lead diameter and the overhang does
not reduce the spacing to adjacent parts to less than that specified on the assembly
drawing.
A.12.10 Lands for plated through holes (vias for board with surface attached parts) :
The minimum diameter of a land surrounding a plated-through hole on double sided and
multiplayer boards where surface attachment is used, shall be determined by considering
the following :
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(i)

Maximum diameter of the drilled hole.

(ii) Minimum annular ring. Etchback, when required, will reduce the
insulation that supports the internal land. The minimum annular ring
considered in the design shall be not less than the maximum etchback
allowed.
(iii) A standard fabrication allowance, determined by statistical survey, which
considers tooling, production master and process variation required to
fabricate boards (See Table A.3).
TABLE A.3 MINIMUM STANDARD FABRICATION ALLOWANCES FOR
SURFACE ATTACHMENT
Greatest Board/
Panel dimension
Upto 305 mm
More than 305 mm

Preferred
mm

Standard
mm

Reduced producibility
mm

0.66
0.81

0.46
0.56

0.25
0.36

All lands and annular rings shall be maximized wherever feasible, consistent
with good design practice and electrical clearance requirements.
A.13
Annular ring considerations: The minimum annular ring on external layers is
the minimum amount of Copper (at the narrowest point) between the edge of the hole and
the edge of the land after plating of the hole. The minimum annular ring on internal
layers is the minimum amount of Copper (at the narrowest point) between the edge of the
drilled hole and the edge of the land after drilling the hole.
External - The minimum annular ring for an unsupported hole shall be 0.38
mm. The minimum annular ring for a layers of the multilayer boards shall be
0.051 mm, except where the conductor joins the land the annular ring shall be
0.13 mm.
Internal - The minimum annular
shall be 0.051 mm. Etchback,
supporting the annular ring of
considered in the design shall
allowed.

ring for internal lands on multi layer boards

when required, will reduce the insulation
internal lands. The minimum annular the
be not less than the maximum etch back

A.14
Offset lands: Lands, when used in conjunction with clinched leads, may be
located adjacent to (non surrounding) the lead termination hole. The land shall have a
sufficient distance from the hole to allow clipping of the part lead prior to unsoldering the
part lead from the land.
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TABLE AS COMPOSITE BOARD DESIGN GUIDANCE
Preferred

Standard

Reduced
Producibility

Numbers of conductors layers

max. 1/

12

20

Thickness of total board (max.)

2.54

3.81

5.08

Board thickness tolerance

Thickness of dielectric (min.)

+ 10% of above nominal or 0.18 mm whichever is

greater
0.20

0.15

0.10

Internal

0.38

0.25

0.10

External

0.51

0.38

0.10

Minimum conductor width

Conductor with tolerance

Unplated

610 g/sq.m.

+ 0.10
-0.15

+ 0.05
-0.13

+ 0.025
-0.08

Unplated

305 g/sq.m

+ 0.05
-0.08

+ 0.025
-0.05

+ 0.025
-0.025

Protective plated (metallic etch

+ 0.20
resist over 610 g/sq.m of Copper) -0.15

+ 0.10
-0.10

+ 0.05
-0.05

Minimum Conductor Spacing (of

Table A.1,whichever is greater)

0.51

0.25

0.13

Internal

0.20

0.13

0.05

External

0.25

0.20

00.13

Longest board dimension 30 cm

or less

0.20

0.18

0.15

Longest Board Dimension over

30 cm.

0.25

0.23

0.20

Annular Ring plated through

Hole (min)

Feature location tolerance master

pattern material movement and
registration (rtp)

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Preferred

Standard

Reduced
Producibility

3.1

4.1

5.1

Longest board dimension 30 cm

or less

0.13

0.08

0.05

3/

Longest Board Dimension over

30 cm.

0.18

0.13

0.08

3/

Unplated hole diameter tolerance

(unilateral)

0.10

0.08

0.05

Upto 0.81

0.10

0.08

0.05

0.84 to 1.61

0.15

0.10

0.05

1.63 to 4.77

0.20

0.15

0.10

0.38 - 0.76

0.20

0.13

0.10

0.79 - 1.56

0.25

0.15

0.10

1.59 - 4.75

0.31

0.20

0.1

Internal layer

2.54

1.27

0.64

External layer

2.54

2.54

2.54

Board thickness to plated hole

diameter (maximum)
Hole location tolerance (rtp)

Plated hole diameter tolerance

(unilateral) for minimum hole
diameter to maximum board
thickness rations greater than 1.4
add 0.01

Conductor to edge of board

(min.)

1/
The number of conductor layers should be the optimum for the board function and
good producibility.
2/

See para A. 13.

3/

To be used only in extreme situations warranted by the application.

NOTE: Unless otherwise specified, all dimensions and tolerances are in mm.
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APPENDIX 'B'
(Clause 13.5)
PLATED THROUGH HOLE EXAMINATION
B.0
SCOPE - This procedure is to be used for preparing the metallographic
specimen for evaluating the plating and/or coating thickness and quality in the plated
through hole and on the prined wiring board surface. The same basic procedures may be
used for mounting and examination of other areas.
B.1

TEST SPECIMENS

B.1.1
cut the required specimens from a printed wiring board or test coupon. Allow
sufficient clearance to prevent damage to the area to be examined. It is recommended that
a minimum of one microsection containing at least three of the smallest size platedthrough holes shall be made for each specimen tested.
B.2

APPARATUS

B.2.1
The following apparatus and materials are needed to perform this test: Sample
cutter (Jeweller's saw), punch press with a relief on punch (caution may cause board
damage), router or diamond saw, mount rings, smooth flat, mounting surface, belt sander
(80 grit paper) metallograph room temperature rating, patting material emery paper, grit
numbers 180-220, 320, 400 and 600, cloth for polishing wheels, alumina 5 and 0.3
micron, polishing, lubricant, etching solution cotton swabs for clearing and etchant
application, methanol and engraver.
B.3

PROCEDURE

B.3.1
Preparation of specimen: Grind sample on 180-220 or 320 grit wheel to within
approximately 1.27 mm of final polish depth. Deburr all edges prior to mounting.
B.4

NOTES

B.4.1
Plating thickness determination should not be determined at nodules, voids,
cracks, or irregular and thin platings.
B.4.2
Plating quality observation may include the following: Blisters, laminate
voids, cracks, resin recession, plating uniformity, burre and nodules and plating voids. In
addition plating quality for multilayer PWB's may include. Inner plane bond to platedthrough hole, resin smear, glass fibre protrusion, and epoxy etchback. Some of these
conditions may be observed on the polished specimen prior to etching.
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B.4.3
Over plating the specimen with a thin layer of nickel or other hard plating,
prior to encapsulating, considerably improves sample quality and readability.
B.4.4
Diamond paste is preferred over alumina because PWB's are being evaluated
for high reliability application. A 6 micron and 1 micron diamond paste can be
substituted for the alumina pastes called out in clause B.1.5 Diamond paste substantially
reduces the risk of specimen smear or burnishing.
B.4.5
A dichromate reagent consisting of saturated solutions of potassium
dichromate and sodium chloride combined with sulphuric acid may also be etching
copper in the preaence of solder plate. It is more stable than the Ammonium
Hydrosuphide/Hydrogen peroxide etchant.

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FIGURES

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64