Beruflich Dokumente
Kultur Dokumente
MINISTRY OF DEFENCE
ON
GENERAL REQUIREMENTS FOR PRINTED WIRING BOARDS
ON
GENERAL REQUIREMENTS FOR PRINTED WIRING BOARDS
MANAKIKARAN NIDESHALAYA
RAKSHA UTPADAN TATHA POORTI VIBHAG
RAKSHA MANTRALAYA, 'H' BLOCK, NIRMAN BHAWAN PO
NEW DELHI - 110 011
DIRECTORATE OF STANDARDISATION
DEPARTMENT OF PRODUCTION & SUPPLIES
MINISTRY OF DEFENCE, 'H'- BLOCK, NIRMAN BHAWAN PO
NEW DELHI - 110 011
Amended by
Authority
ii
Signature
&
Date
Page
No.
0. FOREWORD
1. SCOPE
5. PATENTS
6. DEFINITIONS
27
8. MARKING
27
9. PACKAGING
28
28
28
29
30
45
APPENDIX A
46
APPENDIX B
54
FIGURES
56
iii
FOREWORD
0.1
This specification has been prepared by Electronic Components
Standardisation Organisation (LCSO) on behalf of Electronic Standardisation Sub
Committee on the authority of Standardisation Committee, Ministry Of Defence.
0.2
This specification has been approved by the Ministry of Defence and is
mandatory for use by the Defence Services.
0.3
This JSS would be used for design, manufacture, quality assurance and
procurement of the item.
0.4
0.5
Quality Assurance Authority for the item covered by this Specification is
CQA (L) for Army, DRAN for /Navy and DGAQA for Air Force. Enquiries regarding
this specification relating to airy contractual conditions should be addressed to the
Quality Assurance Authority named in the tender or contract. Other technical enquiries
should be referred to: The Officer-in-Charge
LCSO
DRDO Complex
C.V. Raman Nagar,
Bangalore-560 093
0.6
0.6
This specification holds good only for the supply order for which it is issued.
0.7
This specification holds good only for the supply order for which it is issued.
SCOPE
1.1
This specification relates to the detailed requirements for printed wiring
boards, plated through hole consisting of 4 to 10 layers of conductor patterns on
insulating bases separated one from the other by an insulating material and
interconnected by a continuous metallic interlayer connection. It is to be used in
conjunction with JSS 52300 - General requirements for printed wiring boards.
1.2
For the purpose of interpretation or construction in case of any omissions,
conflicts, ambiguities or inconsistencies to the extent the contract consists of any or all of
the following documents, such documents shall rank in the following order of
precedence.
(a) Detailed specifications
(b) This specification and
(c) Other applicable documents
2.
2.1
2.2
Other Specifications
IS 9938: 1981
Reaffirmed 1999
IS 10673: 1983
Reaffirmed 1996
2.3
Source of Supplies
2.3.1
Copy of the Joint Services Specifications are obtainable on payment from:The Controller
Controllerate of Quality Assurance (Electronics)
JayachamraJendra Nagar PO,
Bangalore - 560 006
2.3.2
Copies of Indian Standard are obtainable on payment from :Bureau of Indian Standards,
Manak Bhavan
9, Bahadur Shah Zafar Marg
New Delhi = 110 002
Or
their regional/branch offices.
3.
3.1
4.
4.1
PATENTS
5.1
Patents or design rights or copy-rights may subsist in connection with the
items defined as standards and the issue of this specification does not convey or imply
any licence to use information which is the subject of such rights.
6.
DEFINITIONS
6.1
Access Holes - A series in successive layers, each set having a common centre
or axis. These holes in a multiplayer printed board provide access to the surface of the
land in one of the layers of the board. (See figure 1)
6.2
Activating - A treatment that renders non-conductive material receptive to
electroless deposition. (Non-preferred synonyms: "Seeding", "Catalyzing" and
"Sensitizing")
6.3
Additive Process - A process for obtaining conductive patterns by the
selective deposition of conductive material on the unclad base material. (see also: "SemiAdditive Process" and "Fully-Additive Process")
6.4
Adhesion Promotion - The chemical process of preparing a plastic surface to
provide for a uniform, well-bonded metallic overplate.
6.5
Anchoring Spurs - Extensions of lands on flexible printed wiring extending
beneath the cover layer to assist in holding the lands to the base material.
6.6
hole.
6.7
Arc Resistance - The resistance of a material by the effects of a high voltage,
low current arc (under prescribed conditions) passing across the surface of the material.
The resistance is stated as a measure of total elapsed time required to form a conductive
path on the surface (material carbonized by the arc).
6.8
Artwork - An accurately scaled configuration which is used to produce the
Artwork Master or Production Waster.
4
6.32
Characteristic Impedance - The ratio of voltage to current in a propagating
wave i.e. the impedance which is offered to this wave at any point of the line. (In printed
6
6.40
Component Lead - The solid or stranded wire or formed conductor that
extends from a component and service as a mechanical or electrical connection or both.
6.41
Component Hole A hole used for the attachment and electrical connection of
component terminations including pins and wires to the printed board.
6.42
Component Side - That side of the printed board on which most of the
components will be mounted.
6.43
Conductive Foil - A thin sheet of metal that may cover one or both sides of the
base material. (Includes conductor, lands and through connections when these
connections are an integral part of the manufacturing process)
6.46
Conductor Base Width - The conductor width at the plane of the surface of the
base material. (See also: "Conductor Width" and "Design Width of Conductor")
6.47
Conductor Layer - The total conductive pattern formed upon one side of a
single layer of base material.
6.48
Conductor Layer No.l - The first layer having a conductive pattern, of a
multilayer printed board, on or adjacent to the component side.
6.49
Conductor Side - The side in a single sided printed board containing the
conductive pattern.
6.50
Conductor Spacing - The distance between adjacent edges (not center line to
center line) of isolated conductive patterns in a conductor layer.
6.51
Conductor Thickness - The thickness of the conductor including all metallic
coatings. (It excludes non-conductive protective coating)
6.52
Conductor Width - The observable width of a conductor at any point chosen at
random on the printed board, normally viewed from vertically above unless otherwise
specified. (Imperfections for example nicks, pinholes or scratches allowable by the
relevant specification shall be ignored. (See also a "Design Width of Conductor" and
"Conductor Base Width")
6.53
Conductor to Hole Spacing - The distance between the edge of a conductor
and the edge of a supported or unsupported hole.
6.54
Conformal Coating - An insulating protective coating, which conforms to the
configuration of the object coated, applied o the completed board assembly.
6.55
Connector Area - That portion of printed wiring used or the purpose of
providing external electrical connections.
6.56
Contact Area - The common area between a conductor and connector through
which the flow of electricity takes place.
6.59
circuit.
6.60
Corner Mark (Crop Mark) - The mark at the corners of a printed board
artwork, the inside edges of which usually locate the borders and establish the contour of
the board.
6.61
Cover Lay, Cover Layer, Cover Coat - An outer layer(s) of insulating material
applied over the conductive pattern on the surface of the printed board.
6.62
Cracking - A condition consisting of breaks in metallic or non-metallic
coatings or both that extend through to an underlying surface.
6.63
Crazing - An internal condition occurring in the laminated base material in
which the glass fibres are separated from the resin at the weave intersections. This
condition manifests itself in the form of connected white spots or "crosses below the
surface and the base material and is usually related to mechanically induced stress.
6.64
Crazing (Conformal Coating) - A network of fine cracks on the surface or
within the conformal coating.
6.65
Crosshatching - The breaking of large conductive areas by the use of a pattern
of voids in the conductive material.
6.66
Crosstalk - The undesirable interface caused by the coupling of energy
between signal paths.
6.67
Current-carrying Capacity - The maximum current which can be carried
continuously, under specified conditions, by a conductor without causing objectionable
degradation of electrical or mechanical properties of the printed board.
6.68
Datum Reference - A defined point, line or plane used to locate the pattern or
layer for manufacturing, inspection or for both purposes.
6.69
Delamination - A separation between plies within the base material or
between the base material and the conductive foil or both.
9
6.82
sides.
power loss
----------------------------E x f x volume x constant
6.83
Drag Soldering - A process whereby supported moving printed circuit
assemblies or printed wiring assemblies are brought in contact with the surface of a static
pool of molten solder.
6.84
solder.
Dross - Oxide and other contaminants which form on the surface of molten
6.85
Dual In-Line Package (DIP) - A component which terminates in two straight
tows of pins or lead wires.
6.86
Edge-Board Connector - A connector designed specifically for making
removable and reliable interconnections between the edge board contacts on the edge or a
printed board and external wiring.
6.87
Edge-Board Contacts - A series of contacts printed on or near any edge of a
printed board and intended for mating with an edge-board connector.
6.88
Edge Definition - The fidelity of reproduction of a pattern edge relative to the
production master.
6.89
Edge Spacing - The distance of a pattern, components or both from the edges
of the printed board.
6.90
E Glass - A low alkali lime alumina borosilicate glass, noted for its good
electrical properties. (It has the following chemical formulation in percentage by mass.
B2O3 5-10%, CaO 16-25%., Al2O3 12-16%.,SiO2 52-56%, NaO2 and K2O 0-2%.,
TiO2 0-0.8%., Fe2O3 0.05-0.4%., F2 0-1.0%)
6.91
Electroless Deposition - The deposition of metal from an autocatalytic plating
solution without application of electrical current.
6.92
Electrodeposition - The deposition of a conductive material from a plating
solution with application of electrical current. (Non-preferred synonyms: "Electrolytic
deposition" and "Galvanic deposition")
11
It is
6.106
Flush Conductor - A conductor whose outer surface is in the same plane as the
surface of the insulating material adjacent to the conductor.
12
13
6.120
Hole Density - The quantity of holes in a printed board per unit area.
6.121
Hole Location - The dimensional location of the center of a hole per unit area.
6.122
6.123
Hole Pull Strength - The force necessary to rupture a plated through hole
when loaded or pulled in the direction of the axis of the hole.
6.124
Hole Void - A void in the metallic deposit of a plated through hole exposing
the base material.
6.125
Immersion plating (Galvanic Displacement) - The chemical deposition of a
thin metallic coating over certain base metals by a partial displacement of the base
metals.
6.126
Inclusion - A foreign particle, metallic or non-metallic, in a conductive layer,
plating or base material.
6.127
Insulation Resistance - The electrical resistance of the insulating material
(determined under specified conditions) between any pair of contacts, conductors or
grounding devices in various combinations.
6.128
Interlayer Connection - An electrical connection between conductive patterns
in different layers of a multilayer printed board.
6.129
Internal Layer - A conductive pattern which is contained entirely within a
multilayer printed board.
6.130
Interstitial via Hole - A plated-through hole connecting two or more conductor
layers of a multilayer printed board but not extending fully through all the layers of base
material comprising the board.
6.131
lonizable Contaminants - Process residues such as flux activators, finger
prints, etching and plating salts etc. that exist as ions and when dissolved increase
electrical conductivity.
14
6.134
Key - A device designed to assure that the coupling of two components can
occur in only one position.
6.135
Keying Slot - A slot in a printed board which permits the printed board to be
plugged into its matting receptacle but prevents it from being plugged into any other
receptacle.
6.136
Keyway - A general term covering both keying slot(s) and polarizing slot(s).
6.137
Laminate - A product made by bonding together two or more layers of
material.
6.136
Laminate Thickness - Thickness of the metal-clad base material, single or
double-sided, prior to any subsequent processing.
6.139
Land - A portion of a conductive pattern usually, but not exclusively, used for
the connection or attachment of components or both.
6.140
6.141
Layer-to-Layer Spacing - The thickness of dielectric material between
adjacent layers of conductive circuitry in a multilayer printed board.
6.142
Lead Projection - The distance which a component lead protrudes through the
printed board on the side opposite from which the component is mounted.
6.143
Legend - A format of letters, numbers, symbols and patterns on the printed
board primarily used to identify component locations and orientation for convenience in
assembly and replacement operations.
6.144
Margin - The distance between the reference edge of a flat cable and the
nearest edge of the first conductor.
6.145
Marking - A method of identifying printed boards with part number, revision
letter, manufacturer's code etc.
6.146
Master Drawing - A document that shows the dimension limits or grid
locations applicable to any or all parts of a printed board (rigid or flexible) including the
15
Metal-clad Base Material - Base material covered with foil on one or both of
6.150
Metallization - A deposited or plated thin metallic film used for its protective
or electrical properties.
6.151
Microstrip - A type of transmission line configuration which consists of a
conductor over a parallel ground plane and separated by a dielectric.
6.152
Microsectioning - The preparation of a specimen for the microscopic
examination of the material to be examined, (usually by cutting out a cross-section
followed by encapsulation, polishing, etching, staining etc.)
6.153
Minimum annular Ring - The minimum width of metal, at the narrowest point,
between the edge of the hole and the outer edge of the land. This measurement is made
to the drilled hole on internal layers of multilayer printed boards and to the edge of the
plating on outside layers of multilayer boards and double sided boards.
6.154
Minimum Electrical Spacing - The minimum allowable distance between
adjacent conductors that is sufficient to prevent dielectric breakdown or corona or both,
between the conductors at any given voltage and altitude.
6.155
Misregistration - The lack of dimensional conformity between successively
produced features or patterns.
6.156
Module - A separable unit in a packaging scheme displaying regularity of
dimensions.
16
Panel Plating - The plating of the entire surface of a panel (including holes).
6.179
Pattern - The configuration of conductive and non-conductive materials on a
panel or printed board. (Pattern denotes also the circuit configuration on related tools,
drawings and masters)
6.180
6.181
Peel Strength - The force per unit width required to peel the conductor or foil
from the base material.
18
Pin Density - The quantity of pins on a printed board per unit area.
6.185
Pinhole - A small hole occurring as an imperfection which penetrates entirely
through a layer of material.
6.186
Pit - A depression in the conductive layer that does not penetrate entirely
through it.
6.187
Pitch - The nominal distance from centre-to-centre of adjacent conductors.
(Where conductors are of equal size and spacing is uniform, the pitch is usually measured
from the reference edge of a conductor to the reference edge of the adjacent conductor)
6.188
Plate Finish (pertaining to laminating) - The finish present on the metallic
surface of metal-clad base material resulting from direct contact with the laminating press
plates without modification by any subsequent finishing process.
6.189
Plated Through Hole - A hole in which electrical connection is made between
internal or external conductive patterns or both, by the deposition of metal on the wall of
the hole.
6.190
Plated-Through Hole Structure Test - A visual examination of the metallic
conductors and plated-through holes of a printed board after the glass-plastic laminate has
been dissolved away.
6.191
Plating Bar - The temporary conductive path interconnecting areas of a
printed board to be electroplated, usually located on the panel outside of the borders of
such a board.
6.192
Plating Up - The process consisting of the electrochemical deposition of a
conductive material on the base material (surface holes etc.) after th6 base material has
been made conductive.
6.193
Plotting
- The practice of mechanically converting X-Y positional
information into a visual pattern such as artwork.
19
6.214
Registration - The degree of conformity of the position of a pattern or a
portion thereof, with its intended position or with that of any other conductor layer of a
board.
21
6.235
Signal Plane - A conductor layer intended to carry signals rather than serve as
a ground or other fixed voltage function.
6.236
only.
Single Sided Board - A printed board with a conductive pattern on one side
6.237
6.238
Solder Projection - An undesirable protrusion of solder from a solidified
solder joint or coating.
6.239
side.
Solder Side - The side of a printed board which is opposite to the component
6.240
23
24
6.257
Test Point - Special points of access to an electrical circuits used for testing
purposes.
6.258
Thermal Relief - Crosshatching to minimize blistering or warping during
soldering operations.
6.259
Thief - A racking device used in the electroplating process to provide a more
uniform current density on plated parts. ("Thieves absorb the unevenly distributed
current on irregularly shaped parts, thereby; assuring that the parts will receive an
electroplated coating of uniform thickness)
6.260
Through Connection - An electrical connection between conductive patterns
on opposite sides of an insulating base e.g. plated through hole or clinched jumper wire.
6.261
6.262
Tinning - A process for the application of solder coating on component leads,
conductors and terminals to enhance solderability.
6.263
Tooling Feature - A specified physical feature on a printed board or a panel
such as a marking, hole, cut-out, notch, slot or edge used exclusively to position the
board or panel or to mount components accurately.
6.264
Tooling Holes - The general term for holes placed on a printed board or a
panel and used to aid in the manufacturing process,
6.265
Transmission Cable - Two or more transmission lines. (If the structure is flat,
it is called "flat-transmission cable" to differentiate it from a round structure such as a
jacketed ground of coaxial cables)
6.266
Transmission Line " A signal-carrying circuit composed of conductors and
dielectric material with controlled electrical characteristics used for the transmission of
high-frequency or narrow pulse type signals.
25
6.269
True Position - The theoretically exact location of a feature or hole established
by basic dimension.
6.270
True Position Tolerance - The total diameter of permissible movement around
the true position as shown in the master drawing.
6.271
Twist - The deformation parallel to a diagonal of rectangular sheet such that
one of the corners is not in the plane containing the other three corners.
6.272
Undercut (in process) - The distance on one edge of a conductor measured
parallel to the board surface from the outer edge of the conductor including etch resists,
to the maximum point of indentation on the copper edge.
6.273
Undercut (after fabrication) - The distance on one edge of a conductor
measured parallel to the board surface from) the outer edge of the conductor excluding
overplating and coating, to the maximum point of indentation on the same edge.
6.274
Underwriters Symbol - Pt logotype authorised for placement on a product
which has been recognized (accepted) by Underwriters Laboratories, Inc, (UL).
6.275
Unsupported Hole - A hole containing no conductive material nor any other
type of reinforcement.
6.276
Via Hole - A plated-through hole used as a through connection, but in which
there is no intention to insert a component lead or other reinforcing material.
6.277
6.278
Voltage Plane - A conductor or portion of a conductor layer on or in a printed
board which is maintained at other than ground potential. It can also be used as a
common voltage source for heat sinking or for shielding.
6.279
Voltage-plane clearance - Voltage-plane clearance is the etched portion of a
voltage plane around a plated-through or non-plated through hole that isolates the voltage
plane from the hole.
26
6.285
Wicking - Capillary absorption of liquid along the fibres of the base material.
7.
7.1
Where materials, processes and finishes are specified in the relevant detailed
specifications, they are mandatory, attention is drawn to the requirements in JSS 50102
that materials, processes and finishes shall not be changed significantly without prior
approval.
7.2
Workmanship, Processor and Finishes - Printed wiring boards shall be
processed in such a manner as to be uniform in quality and shall be free from dirt, oil,
corrosion, corrosive products, salts, smut, grease, finger prints, mould release agents,
foreign matter, flux residue and other defects that will affect life, serviceability or any
combination of these.
8.
MARKING
8.1
Each board shall be legibly and indelibly marked with the date,
manufacturers code and serial number. The marking shall be produced either by the
same process used in producing the conductor pattern or by use of a permanent nonnutrient ink or paint. Conductive Marking shall not be closer to the pattern than the
spacing requirement specified. All markings shall be compatible with materials and
parts, legible after all tests and in no case shall affect the board performance.
27
PACKAGING
9.1
Printed wiring boards shall be clear dry and packed in a manner that will
afford adequate protection against corrosion, deterioration and physical damage.
Shipment Packaging (preservation, identification and picking) shall be in accordance
with the terms of the contract.
10.
10.1
Qualification Approval and Maintenance of Qualification Approval shall be
obtained as described in JSS 50102 and in the relevant detailed specification.
10.2
Provision of Samples - The manufacturer shall, submit specimens of printed
wiring boards for which approval is desired, as specified in the relevant detailed
specification.
10.3
Grouping of Specimens - The test specimens shall be grouped as indicated in
the relevant detailed specification.
10.4
Test incidence - Initial measurements referred to in Table 4 of JSS 50101 and
in this specification as Group '0', shall be carried out immediately prior to the
commencement of tests on subsequent groups and the results shall be recorded. Each test
shall be performed in the order listed and where measurements are not required, the
results shall be recorded where tests are not applicable, this will be indicated in the
relevent detailed specification.
11.
11.1
Batch acceptance shall be performed as described in JSS 50102 and in this
specification.
11.2
Inspection Batch - Unless otherwise specified in the relevant detailed
specification, an inspection batch shall be as specified in IS 10&73 and shall consist of
printed wiring boards of the same style produced under essentially the same conditions
and offered for inspection at one time. Each production board or panel of boards shall
incorporate the test coupons at specified. The location of the test coupons shall be not
closer to the edge of the panel than the edge of the printed wiring board. Test coupons
shall be used in performing Group A' inspection and all unused test coupons shall be
retained by the supplier, unless otherwise specified.
28
TEST PROCEDURE
12.1
Atmospheric Condition for Testing - Unless otherwise specified, all tests shall
be performed under standard atmospheric conditions as defined in JSS 50101.
12.2
Accuracy of Test Equipment - The accuracy of test equipment shall be as
specified in the relevant test clauses.
29
TEST DETAILS
13.1
Wherever, the terms 'as specified' occurs against the 'description' or
'requirements' it indicates that details are given in the corresponding clauses of the
relevant detailed specifications.
Test
Number
1
13.1
Title of Test
2
General
Examination
Description
Requirements
13.1.1
Visual
Examination
13.1.1.1
Edge of the
printed Wiring
Board
30
Title of Test
2
Surface
Imperfection
Description
Requirements
3
The features of the boards shall be
inspected using an optical apparatus
or aid which provides a minimum
magnification of 4X. Inspection of
Board features shall be
accomplished at a magnification of
10X.
4
Surface imperfection (such as weave
texture, haloing, scratches pits and
dents shall be acceptable if:
a) The laminate fibre is not cut.
b) The imperfection does not bridge
between conductors.
c) The dielectric spacing between the
imperfection and a conductor is not
reduce below the minimum
requirements i.e. 0.13 mm for external
conductors and 0.10 mm for internal
conductors. And the minimum laternal
width of external and internal
conductors shall not be less the 0.13
mm.
13.1.1.3
Sub-surface
Imperfection
13.1.1.4
Repair
31
Title of Test
Description
Requirements
2
Dimensions and
Materials
3
The dimensions of the board and
pattern shall be checked for
conformity with the Master
Drawing. The finished Printed
Wiring Board shall meet the
dimensional requirements specified
here in an on the Master Drawing.
4
The dimensions of the board and
pattern shall be specified on the
Master Drawing. The type of Material
shall be as given below and as
specified in the drawing:
a) For Single and Double sided
boards:
The metal clad laminates shall be in
accordance with JSS 51701.
b) For multiplayer boards: The metal clad laminates shall be in
accordance with JSS 51702 and of a
type specified on the relevant
Drawing. Base material shall be of
minimum 0.05 mm per sheet. Copper
cladding on external surface, shall be
at least 305 g/ m and copper cladding
on internal layers shall be at least 610
g/m.
The bonding interlayer material shall
be a pre-impregnated glass cloth.
There shall be a minimum of 0.1 mm
of dielectric material between
conductive layers of Copper in the
finished board.
13.1.2.1
Annular ring
13.1.2.2
Title of Test
Description
Plating
Thickness
Requirements
4
Internal. The minimum annular ring
for internal terminal area on multi
layer boards shall be 0.05 mm.
0.00125mm (min.)
Nickel
0.005 mm (min.)
0.008 mm (min.)
at the crest on the
surface as coated.
13.1.2.3
Dielectric layer
13.1.2.4
Under cutting
(For external
conductors
only)
33
Title of Test
2
Conductor
Pattern
(External
layers)
Description
Requirements
3
(a) The conductor pattern shall be
examined using an optical apparatus
or aid which pro vides a signification
of approximately 3x minimum.
Conductor
Width
34
Title of Test
2
Circuit Short
Description
3
A test voltage shall be applied
between all common portions of
each conductor pattern and all
adjacent common portions of each
conductor pattern.
Requirements
4
The minimum resistance between
mutually isolated conductors shall be
2 Megaohms.
Plating
Adhesion
13.4
Title of Test
Description
Requirements
3
displacement (the vertical distance
from the horizontal surface to the
maximum height of the determined
by taking the measurement and
subtracting the thickness of the board
if it is included in the height
measurement. The vertical
displacement divided by the length
of the longest side and multiplied by
100 shall be considered the
percentage Bow and Twist.
13.5
Plated through
hole
13.5.1
Vertical
13.6
Layer to Layer
Registration
(Applicable
only for
multiplayer
Boards)
Title of Test
Description
Requirements
3
shall be evaluated by difference of
centre lines of all lands of all
conductor layers shifted to extreme
positions (see fig 1). All lands
(external and internal) shall be
included in the evaluation of
registration.
13.7
Voltage Proof
37
Title of Test
2
Insulation
Resistance
Description
Requirements
3
Unless otherwise specified, the
insulation resistance shall be
measured at 100 Vdc 10 percent.
The voltage shall be applied for the
period of 1 minute 5 seconds. The
points of measurement shall be as
follows :-
4
The insulation resistance shall be 500
Megaohms (Minimum)
Continuity
13.10
Solderability
38
Title of Test
Description
2
3
Pull off strength Three holes per coupon shall be
tested. Insert wires in holes in m a
selected terminal area and solder by
hand. The wires shall not be
clinched. Subject wires to five cycles
of unsoldering and soldering by hand
after the initial hand soldering.
During the five cycles, the wires
shall be completely removed during
each unsoldering operation and
replaced during each soldering
operation. A 60W conventional
soldering iron with a tip temperature
of 232 to 260C (Max) shall be used
for the unsoldering and soldering
operation. The iron shall be applied
to the leads and not to the foil and
shall be applied only as long as it is
necessary to performs the
unsoldering or soldering operation.
Following the fifth cycle the printed
wiring board shall be clamped to the
jaws of bond tester. A pull at the rate
of 50.8 mm/minute shall be applied
to the wire (on the terminal area side
in the case of unsupported hole)
The pull shall be applied until the
specified load of 22.25 N is
reached. The tensile pull shall be
calculated using the formula.
4L
--------------------- > or = 345N/cm2
n (d22 d22)
Where L = load in N
d1 = diameter of the hole
d2 = terminal area diameter
39
Requirements
4
The specimens shall with stand a force
of 22.25N or tensile pull of 345N/cm
whichever is less. A plated shall not
be loosened. A conductor or terminal
area around an unsupported hole shall
not be loosened.
13.12
Title of Test
Description
Requirements
3
The load shall be applied
perpendicular to the major surface of
the terminal area until the required
force is reached of failure occurs.
Breaking of a wires pull out shall not
be considered as a failure but the
wire shall be resoldered and pulled
again.
Temperature
cycling
(Thermal
shock)
: T65/205
: T65/150
Type GE and GF of
JSS 51701 and 51702
: T65/125
13.12.0
Final
Measurements
13.12.1
Visual
examination
13.12.1.2
13.12.1.3
Continuity
Bow and twist
As in clause 13.9
As in clause 13.4
As in clause 13.9
The maximum Bow and Twist shall
be twice the that of specified in 13.4.
13.13
Climatic
Title of Test
Description
Requirements
2
Intermediate
Measurements
3
The following tests shall be made
subsequent to removal form the
conditioning chambers for
temperature (dry heat) and
temperature (cyclic) tests after
allowing the appropriate recovery
period specified in JSS 50101.
13.13.1.1
Visual
Examination
13.13.2
Temperature
(Dry Heat)
13.13.2.1
Continuity
As in clause 13.9
As in clause 13.9
13.13.3
Damp Heat
(cyclic)
13.13.4
Temperature
(Dry cold)
13.13.4.1
Continuity
13.13.5
Damp Heat
(cyclic)
13.13.5.1
Insulation
resistance
13.13.6
Final
Title of Test
Description
Requirements
2
Measurements
3
made at the conclusion of the
sequence.
13.13.6.1
Visual
Examination
13.13.6.2
Voltage proof
As in clause 13.7
As in clause 13.7
13.13.6.3
Insulation
resistance
As in clause 13.8
As in clause 13.8
13.13.6.4
Continuity
As in clause 13.9
As in clause 13.9
13.13.6.5
As in clause 13.4
13.13.6.6
Solderability
As in clause 13.10
As in clause 13.10
13.13.6.7
Pull of strength
(Bond strength)
As in clause 13.11
As in clause 13.11
13.14
Damp heat
(steady state)
13.14.1
Final
measurements
13.14.1.1
Visual
examination
13.14.1.2
Voltage proof
As in clause 13.7
As in clause 13.7
13.14.1.3
Insulation
Resistance
As in clause 13.8
As in clause 13.8
42
Title of Test
Description
Requirements
2
Continuity
As in clause 13.9
As in clause 13.9
13.14.1.5
As in clause 13.4
As in clause 13.4
13.14.1.6
Solderability
As in clause 13.10
As in clause 13.10
13.14.1.7
As in clause 13.11
13.15
Thermal stress
13.16
Rework
simulation
(plated through
hole)
Title of Test
Description
Requirements
Cleanliness
44
14.1
Any suggestion for improvement in this document shall be used to: The Director,
Directorate of Standardisation
Ministry of Defence
H Block
New Delhi 110 011.
45
A.1
Conductor thickness and width: The width and thickness of conductors on the
finished printed wiring board shall be determined on the basis of the current carrying
capacity required. The temperature rise shall be determined in accordance with fig. 19(a)
and 19(b).for the case of manufacture and durability in usage, conductor width and
spacing requirements shall be maximized while maintaining the minimum spacing
requirements of Table A.1. The minimum Conductor width shown on the master drawing
Shall be not less than 0.10mm.To maintain the conductor width shown on the master
drawing the line width on the production master shall be compensated for process
allowance Table A.4 of the Appendix A.
A.2
Conductor with less than 90 deg. included angle: All conductors that change
direction Where the included angle is lese than 90 deg. shall have external corners of the
conductor rounded.
A.3
Conductors: The length of a conductor between any two lands should be held
to a minimum. However, conductors which are straight lines and run in X, Y or 45deg
directions in general are preferred to aid computerized documentation for mechanized or
automated layouts.
A.4
Conductor Spacing: large spacing shall be used whenever possible and the
minimum spacing between conductors, between conductor patterns, and between
conductive materials (such as conductive marking s or mounting hardware) and
conductors shall be in accordance with Table A.1. and defined on the master drawing. To
maintain the conductor spacing shown on the master drawing, space width on the
production master shall be compensated for process allowance as shown on Table A.4 of
the Appendix. Plated-through holes passing through internal foil planes (ground and
voltage and thermal planes shall meet the same minimum clearance between the platedthrough hole and foil of ground planes as required for spacing between internal
conductors.
A.5
Edge Spacing: The minimum spacing between conductive patterns and the
edge of the printed wiring board or any adjacent conductive surface, such as supporting
structure or frames (nonmoving), shall be not less than the minimum spacing specified in
Table A.1 plur 0.38 mm, provided the edges are protected from the physical harm in the
installed assembly configuration. Printed wiring not so protected shall have a minimum
46
Minimum spacing
Surface layers
Internal layers
0-100
101-300
301-500
Greater than 500
1/
0.13 mm
0.38 mm
0.76 mm
0.00305 mm
(per volt)
0.10 mm
0.20 mm
0.2525 mm
0.0025 mm
(per volt)
1/
for reference only, voltages greaer than 500 v should be evaluated for the
specific design application.
A.8
Large internal conductive areas (for multilayer boards only): When a
conductive area that extends beyond 25.4 mm diameter circle is used on an internal layer,
the layer should be placed areas that will breakup large conductive area but retain the
continuity and functionality of the conductor. If more than one internal layer has a large
conductive area, the layers should be located in the board to provide balanced
construction.
A.9
Interfacial connections: Interfacial connections on double sided and multilayer
printed wiring boards shall be made by use of plated-through holes only. Wires, standiff
terminals, eyelets, rivets, or pins shall not be used to provide interfacial connections.
A.10
Solder fillets and plugs: Printed wiring boards subjected to wave or dip
solderings shall be designed to facilitate flow of solder around components leads in
plated through holes and into plated-through holes without leads, so as to create a solder
plug. Careful consideration shall be given to hole-to-lead diameter clearance, hole to
board thickness rations and heat relief of metal planes to promote solder plugging. In the
event solder plugging due to natural capillary action is not possible, such as when a heat
sink is bonded directly over plated-through holes, the design shall include provision for
prevention of solder, flux or other chemical from entering the plated-through holes.
Solder may be prevented from entering the holes by profiling these holes with an
appropriate polymer plug, covering the holes with a sheet of permanent bonded material,
tenting the holes with a permanent solder mask of blocking these holes with some
47
(ii) Minimum annular ring requirements. Etch back, when required, will
reduce the insulation area that supports the internal land. The minimum
annular ring considered back allowed.
(iii) A standard fabrication allowance, determined by statistical survey, which
considers production master tooling and process variations required for
fabrication boards. (See Table A.2)
TABLE A.2 MINIMUM STANDARD FABRICATION ALLOWANCES FOR PTH
Greatest Board/
Panel dimension
Upto 305 mm
More than 305 mm
Preferred
mm
Standard
mm
Reduced producibility
mm
0.71
0.86
0.51
0.61
0.30
0.41
All lands and annular rings shall be maximized wherever feasible, consistent
with good design practice and electrical clearance requirements.
A.12.4
Lands for surface attachment: When surface attachment is required, all of the
requirements of para A.12 shall be considered in the design of the printed wiring board
except where paras A.12.1 and A.12.9 apply. The selection, design, and position of the
land geometry in relation to the part may significantly impact the solder joint. The
designer must understand the capabilities and limitation of the manufacturing and
assembly operations.
49
(ii) Minimum annular ring. Etchback, when required, will reduce the
insulation that supports the internal land. The minimum annular ring
considered in the design shall be not less than the maximum etchback
allowed.
(iii) A standard fabrication allowance, determined by statistical survey, which
considers tooling, production master and process variation required to
fabricate boards (See Table A.3).
TABLE A.3 MINIMUM STANDARD FABRICATION ALLOWANCES FOR
SURFACE ATTACHMENT
Greatest Board/
Panel dimension
Upto 305 mm
More than 305 mm
Preferred
mm
Standard
mm
Reduced producibility
mm
0.66
0.81
0.46
0.56
0.25
0.36
All lands and annular rings shall be maximized wherever feasible, consistent
with good design practice and electrical clearance requirements.
A.13
Annular ring considerations: The minimum annular ring on external layers is
the minimum amount of Copper (at the narrowest point) between the edge of the hole and
the edge of the land after plating of the hole. The minimum annular ring on internal
layers is the minimum amount of Copper (at the narrowest point) between the edge of the
drilled hole and the edge of the land after drilling the hole.
External - The minimum annular ring for an unsupported hole shall be 0.38
mm. The minimum annular ring for a layers of the multilayer boards shall be
0.051 mm, except where the conductor joins the land the annular ring shall be
0.13 mm.
Internal - The minimum annular
shall be 0.051 mm. Etchback,
supporting the annular ring of
considered in the design shall
allowed.
A.14
Offset lands: Lands, when used in conjunction with clinched leads, may be
located adjacent to (non surrounding) the lead termination hole. The land shall have a
sufficient distance from the hole to allow clipping of the part lead prior to unsoldering the
part lead from the land.
51
Standard
Reduced
Producibility
12
20
2.54
3.81
5.08
0.15
0.10
Internal
0.38
0.25
0.10
External
0.51
0.38
0.10
610 g/sq.m.
+ 0.10
-0.15
+ 0.05
-0.13
+ 0.025
-0.08
Unplated
305 g/sq.m
+ 0.05
-0.08
+ 0.025
-0.05
+ 0.025
-0.025
+ 0.10
-0.10
+ 0.05
-0.05
0.51
0.25
0.13
Internal
0.20
0.13
0.05
External
0.25
0.20
00.13
0.20
0.18
0.15
0.25
0.23
0.20
52
Standard
Reduced
Producibility
3.1
4.1
5.1
0.13
0.08
0.05
3/
0.18
0.13
0.08
3/
0.10
0.08
0.05
Upto 0.81
0.10
0.08
0.05
0.84 to 1.61
0.15
0.10
0.05
1.63 to 4.77
0.20
0.15
0.10
0.38 - 0.76
0.20
0.13
0.10
0.79 - 1.56
0.25
0.15
0.10
1.59 - 4.75
0.31
0.20
0.1
Internal layer
2.54
1.27
0.64
External layer
2.54
2.54
2.54
1/
The number of conductor layers should be the optimum for the board function and
good producibility.
2/
3/
TEST SPECIMENS
B.1.1
cut the required specimens from a printed wiring board or test coupon. Allow
sufficient clearance to prevent damage to the area to be examined. It is recommended that
a minimum of one microsection containing at least three of the smallest size platedthrough holes shall be made for each specimen tested.
B.2
APPARATUS
B.2.1
The following apparatus and materials are needed to perform this test: Sample
cutter (Jeweller's saw), punch press with a relief on punch (caution may cause board
damage), router or diamond saw, mount rings, smooth flat, mounting surface, belt sander
(80 grit paper) metallograph room temperature rating, patting material emery paper, grit
numbers 180-220, 320, 400 and 600, cloth for polishing wheels, alumina 5 and 0.3
micron, polishing, lubricant, etching solution cotton swabs for clearing and etchant
application, methanol and engraver.
B.3
PROCEDURE
B.3.1
Preparation of specimen: Grind sample on 180-220 or 320 grit wheel to within
approximately 1.27 mm of final polish depth. Deburr all edges prior to mounting.
B.4
NOTES
B.4.1
Plating thickness determination should not be determined at nodules, voids,
cracks, or irregular and thin platings.
B.4.2
Plating quality observation may include the following: Blisters, laminate
voids, cracks, resin recession, plating uniformity, burre and nodules and plating voids. In
addition plating quality for multilayer PWB's may include. Inner plane bond to platedthrough hole, resin smear, glass fibre protrusion, and epoxy etchback. Some of these
conditions may be observed on the polished specimen prior to etching.
54
55
56
57
58
59
60
61
62
63
64