317276

Product Information
meennttaall IInnffoorrm
maattiioonn SShheeeett PPrroodduucctt EEnnvviirroonnm
maattiioonn SShheeeett
PPrroodduucctt EEnnvviirroonnm
1.0
Date/Time Revision
20050628T1700
Manufacturing site
Product Number:
Malaysia
HFBR-59xxxxx; QFBR-59xxL
Product Name:
Multi-Mode LC SFF
Product Mass
Product Note:
11.4000
to
12.6000
gram (min, max)
This product (weight and materials) information applies to Multi-Mode LC SFF. RoHS compliant versions carry suffix 'Z';
Terminal Finish e3; MSL1; Qual JEDEC020C, Max Temp 260oC
Material Composition Information:

Sub
part ref
Sub-part Name
Material
Material Trade Name
Material
Mass (g)
Minimum
Material
Mass (g)
Maximum
Percent of
product(%)
Minimum
Percent of
product(%)
Maximum
SPA
Cover
Cartridge Brass tin

reflow, Tin reflow
C2600R-H, Tin
Reflow Plating
4.4100
5.1179
38.68%
40.62%
SPB
Nose
Metal
Zinc Alloy
1.4750
1.7118
12.94%
13.59%
SPC
SPD
Port plug
Silicone Rubber
Nose shield
Metal
Silicone rubber
1.4500
1.6828
12.72%
13.36%
SUS 304 1/2 H
0.9500
1.1025
8.33%
SPE
Internal shield
8.75%
SPTE
JIS G3303
0.8400
0.9748
7.37%
7.74%
SPF
PCB
Epoxy Resin, Chemical,

Metal
FR4, Ink, Copper,

Gold
0.7000
0.8124
6.14%
6.45%
SPG
Port
POLYETHERIMIDE
2300-1000
0.3600
0.4178
3.16%
3.32%
SPH
RX / TX headers
Alloy, Kovar, Glass, Ni,

Au
Alloy 42, NiCo2918,

KS 51, Electroless
Ni, Au
0.3380
0.3923
2.96%
3.11%
SPI
Encapsulant, Adhesive
Chemical
na
0.1280
0.1485
1.12%
1.18%
SPJ
Solder
Metal
solder
0.1026
0.1260
0.90%
1.00%
SPK
Flat window can
Kovar, Glass, Ni-P
NiCO2918, SCHOTT
8250, Electroless Ni
0.0780
0.0905
0.68%
0.72%
SPL
Active device
NonMetal NonPolymer
Electronic crystal
0.0114
0.0630
0.10%
0.50%
SPM
Lens
plastics
Ultem 1010-1000
0.0489
0.0567
0.43%
0.45%
SPN
Passive device
Ceramic, Metal
Alumina, Ag Thick
film, RuO2 Thick film,
Epoxy resin, Nickel,
Tin & Lead
0.0371
0.0430
0.33%
0.34%
Sub
part
Sub-part Name & Substance
Sub-part Substance CAS#
Substance Note
Substance
Mass (g)
Minimum
Substance
Mass (g)
Maximum
Percent of
Subpart(%)
Minimum
Percent of
Subpart(%)
Maximum
SPA
Cover
SPA1
Copper
7440-50-8
na
3.020246
3.658948
68.49%
71.49%
SPA2
Zinc
7440-66-6
na
1.269826
1.591514
28.79%
31.10%
SPA3
Iron
7439-89-6
na
0.000000
0.002559
0.00%
0.05%
SPA4
Lead
7439-92-1
na
0.000000
0.002559
0.00%
0.05%
SPA5
Tin
7440-31-5
na
0.000177
0.001016
0.00%
0.02%
SPA6
Copper flash
NA
na
0.000082
0.000430
0.00%
0.01%
Avago Technologies Product Stewardship
Page 1
Format rev 2.0 3 August 2006
SPB
Nose
SPB1
Zn
7440-66-6
na
1.357000
1.602223
92.00%
93.60%
SPB2
Al
7429-90-5
na
0.051625
0.070183
3.50%
4.10%
SPB3
Cu
7440-50-8
na
0.036875
0.048786
2.50%
2.85%
SPB4
Ni
7440-02-0
na
0.007375
0.017118
0.50%
1.00%
SPC
Port plug
SPC1
Octamethylcyclotetrasiloxane
556-67-2
na
1.442750
1.691177
99.50%
100.50%
SPD
Nose shield
SPD1
Iron
7439-89-6
NA
0.630230
0.801848
66.34%
72.73%
SPD2
Chromium
7440-47-3
NA
0.171000
0.220500
18.00%
20.00%
SPD3
Nickel
7440-02-0
NA
0.076000
0.115763
8.00%
10.50%
SPD4
Manganese
7439-96-5
NA
0.007220
0.022050
0.76%
2.00%
SPD5
Silicon
7440-21-3
NA
0.003800
0.011025
0.40%
1.00%
SPD6
Carbon
7440-44-0
NA
0.000665
0.000882
0.07%
0.08%
SPD7
Phosphorus
7439-96-5
NA
0.000266
0.000496
0.03%
0.05%
SPD8
Sulfur
7704-34-9
NA
0.000076
0.000331
0.01%
0.03%
SPE
Internal shield
SPE1
Iron
7439-89-6
NA
0.835800
0.971820
99.50%
99.69%
SPE2
Manganese
7439-96-5
NA
0.001915
0.002340
0.23%
0.24%
SPE3
Carbon
7440-44-0
NA
0.000000
0.000487
0.00%
0.05%
SPE4
Phosphorus
7439-96-5
NA
0.000080
0.000097
0.01%
0.01%
SPE5
Sulfur
7704-34-9
NA
0.000072
0.000088
0.01%
0.01%
SPF
PCB
SPF1
Copper
7440-50-8
na
0.333590
0.406496
47.66%
50.04%
SPF2
Fibrous Glass Fabric
65997-17-3
na
0.151144
0.184177
21.59%
22.67%
SPF3
Epoxy Resin
26265-08-7
na
0.128472
0.156550
18.35%
19.27%
SPF4
Inert Filler
NA
na
0.056301
0.068606
8.04%
8.45%
SPF5
Gold
7440-57-5
na
0.006930
0.008445
0.99%
1.04%
SPF6
Glycol Ether Solvent
111-90-0
na
0.005842
0.007119
0.83%
0.88%
SPF7
Modified Epoxy Resin
25068-38-6
na
0.005251
0.006398
0.75%
0.79%
SPF8
Pigment
1308-38-9
na
0.004229
0.005153
0.60%
0.63%
SPF9
Respirable Fibrous Glass
65997-17-3
na
0.003779
0.004604
0.54%
0.57%
SPF10
Zinc
7440-66-6
na
0.001189
0.001449
0.17%
0.18%
SPF11
Aromatic solvent
34590-94-8
na
0.001183
0.001441
0.17%
0.18%
SPF12
Photo initiator
71868-10-5
na
0.001111
0.001354
0.16%
0.17%
SPF13
N,N-Dimethylformamide
68-12-2
na
0.000378
0.000460
0.05%
0.06%
SPF14
Additive
NA
na
0.000305
0.000371
0.04%
0.05%
SPF15
Arsenic
7440-38-2
na
0.000238
0.000290
0.03%
0.04%
SPF16
Cu
7440-50-8
I/O pins
0.006843
0.008339
0.98%
1.03%
SPF17
Sn
7440-30-5
I/O pins
0.000520
0.000633
0.07%
0.08%
SPF18
7723-14-0
I/O pins
0.000026
0.000032
0.00%
0.00%
SPF19
OTHERS
Proprietary
I/O pins
0.000037
0.000045
0.01%
0.01%
SPF20
Ni
7440-02-0
I/O pins
0.000079
0.000096
0.01%
0.01%
SPF21
a1
SN/PB
7439-92-1
p/n without suffix 'Z'
0.000119
0.000144
0.02%
0.02%
Page 2
SPF21
b1
SN
7440-30-5
p/n with suffix 'Z'
0.000119
0.000144
0.02%
0.02%
SPG
Port
SPG1
Polyetherimide
61128-47-0
n.a.
0.288000
0.355121
80.00%
85.00%
SPG2
Glass
65997-17-3
n.a.
0.036000
0.104447
10.00%
25.00%
SPH
RX / TX headers
SPH1
Fe
7439-89-6
na
0.171277
0.208710
50.67%
53.21%
SPH2
Ni
7440-02-0
na
0.133467
0.162637
39.49%
41.46%
SPH3
Glass
Proprietary Information
na
0.011485
0.013995
3.40%
3.57%
SPH4
Co
7440-48-4
na
0.006660
0.008116
1.97%
2.07%
SPH5
Mn
7439-96-5
na
0.002923
0.003562
0.86%
0.91%
SPH6
Si
7440-21-3
na
0.000931
0.001135
0.28%
0.29%
SPH7
Au
7440-57-5
na
0.000842
0.001026
0.25%
0.26%
SPH8
Ag
7440-22-4
Braze Material
0.000594
0.000724
0.18%
0.18%
SPH9
7723-14-0
na
0.000525
0.000640
0.16%
0.16%
SPH10
Cu
7440-50-8
Braze Material
0.000230
0.000281
0.07%
0.07%
SPH11
7440-44-0
na
0.000156
0.000190
0.05%
0.05%
SPH12
7704-34-9
na
0.000011
0.000014
0.00%
0.00%
SPI
Encapsulant, Adhesive
SPI1
Silver
7440-22-4
na
0.070000
0.087039
54.69%
58.59%
SPI2
Modified epoxy resin
Registered
na
0.010000
0.017408
7.81%
11.72%
SPI3
Silica, Microcrystalline
Propertary
na
0.005400
0.012534
4.22%
8.44%
SPI4
Propertary
Propertary
na
0.001800
0.012325
1.41%
8.30%
SPI5
Ethanol, 2-(2-ethoxyehoxy)-,
acetate
112-15-2
na
0.004000
0.008124
3.13%
5.47%
SPI6
p-(2,3-epoxypropoxy)-N,nbis(2,3-epoxypropyl)aniline
5026-74-4
na
0.005000
0.008124
3.91%
5.47%
SPI7
Bisphenol A type epoxy resin
25068-38-6
na
0.003000
0.005803
2.34%
3.91%
SPI8
Dimethyl siloxane monotrimethoxysiloxy-terminated
472976-92-4
na
0.003000
0.004642
2.34%
3.13%
SPI9
Dimethyl siloxane,
trimethoxysilyloxy-terminated
142982-20-5
na
0.003500
0.004642
2.73%
3.13%
SPI10
Bisphenol A Epoxy
Diacrylate
Propertary
na
0.001800
0.004178
1.41%
2.81%
SPI11
Silica
7631-86-9
na
0.000500
0.002321
0.39%
1.56%
SPI12
Hydroxyethylmethacrylate
Propertary
na
0.000180
0.002089
0.14%
1.41%
SPI13
Trimethylated silica
68909-20-6
na
0.001000
0.001741
0.78%
1.17%
SPI14
Dicyanodiamide
461-58-5
na
0.000500
0.001161
0.39%
0.78%
SPI15
Polydimethylsiloxane
63148-62-9
na
0.000500
0.001161
0.39%
0.78%
SPI16
Diisopropoxy
di(ethoxyacetoacetyl)
titanate
27858-32-8
na
0.000100
0.000580
0.08%
0.39%
SPI17
Methyltrimethoxysilane
1185-55-3
na
0.000100
0.000580
0.08%
0.39%
Page 3
SPJ
Solder
SPJa1
Tin
7440-31-5
0.061560
0.088200
60.00%
70.00%
SPJa2
Lead
7439-92-1
0.030780
0.050400
30.00%
40.00%
SPJb1
Tin
7440-31-5
p/n with suffix 'Z'
0.088462
0.120708
86.22%
95.80%
SPJb2
Copper
7440-50-8
p/n with suffix 'Z'
0.003232
0.004410
3.15%
3.50%
SPJb3
Silver
7440-22-4
p/n with suffix 'Z'
0.000646
0.000882
0.63%
0.70%
SPK
Flat window can
SPK1
Fe
7439-89-6
na
0.037237
0.045375
47.74%
50.13%
SPK2
Ni
7440-02-0
na
0.024514
0.029872
31.43%
33.00%
SPK3
Co
7440-48-4
na
0.013104
0.015968
16.80%
17.64%
SPK4
Glass
Proprietary Information
na
0.002229
0.002716
2.86%
3.00%
SPK5
Mn
7439-96-5
na
0.000364
0.000444
0.47%
0.49%
SPK6
7723-14-0
na
0.000297
0.000362
0.38%
0.40%
SPK7
Si
7440-21-3
na
0.000218
0.000266
0.28%
0.29%
SPK8
7440-44-0
na
0.000036
0.000044
0.05%
0.05%
SPL
Active device
SPL1
Ga
7440-55-3
n.a.
0.010830
0.062370
95.00%
99.00%
SPL2
As
7440-38-2
n.a.
0.000057
0.000630
0.50%
1.00%
SPL3
Al
7429-90-5
n.a.
0.000057
0.000630
0.50%
1.00%
SPL4
Ag, Au
7440-22-4, 7440-57-5
die attach, wirebond
0.000057
0.000630
0.50%
1.00%
SPM
Lens
SPM1
Polyetherimide
61128-46-9
N.A
0.048656
0.057033
99.50%
100.50%
SPN
Passive device
SPN1
BaTiO3
na
N/A
0.018828
0.022943
50.76%
53.30%
SPN2
Al2O3
1344-28-1
N/A
0.008657
0.010548
23.34%
24.50%
SPN3
Cu
7440-50-8
N/A
0.003722
0.004536
10.04%
10.54%
SPN4
Ni
7440-02-0
N/A
0.001804
0.002198
4.86%
5.11%
SPN5
CERAMIC
Proprietary
N/A
0.000894
0.001042
2.41%
2.42%
SPN6
Ag
7440-22-4
N/A
0.000426
0.000520
1.15%
1.21%
SPN7
SiO2
14808-60-7
N/A
0.000337
0.000411
0.91%
0.95%
SPN8
Epoxy Resin
na
N/A
0.000098
0.000119
0.26%
0.28%
SPN9
PbO
1317-36-8
N/A
0.000091
0.000110
0.24%
0.26%
SPN10
MgO
1309-48-4
N/A
0.000072
0.000088
0.19%
0.20%
SPN11
Au
7440-57-5
N/A
0.000039
0.000045
0.10%
0.10%
SPN12
B2O3
1303-86-2
N/A
0.000035
0.000042
0.09%
0.10%
SPN13
RuO2
12036-10-1
N/A
0.000029
0.000035
0.08%
0.08%
SPN14
Others
na
proprietary
0.000020
0.000025
0.05%
0.06%
SPN15
Pd
7440-05-3
N/A
0.000007
0.000009
0.02%
0.02%
SPN16
TiW
N/A
N/A
0.000001
0.000001
0.00%
0.00%
SPN17
7440-62-2
N/A
0.000001
0.000001
0.00%
0.00%
SPN18
a1
Sn
7440-31-5
0.001360
0.001658
3.67%
3.85%
SPN18
a2
Pb
7439-92-1
0.000927
0.001129
2.50%
2.62%
SPN18
b1
Sn
7440-31-5
p/n with suffix 'Z'
0.002287
0.002787
6.17%
6.47%
Page 4
Note Percentages are calculated from mass data declared. Material Trade names are not applicalble to some common materials of
constant composition. When CAS is unavailable 9999-99-9 is assigned.
Absence of Hazardous Substances

Our material composition policy is to declare all substances intentionally added in our products. Additionally we confirm
the following regulated substances known to be in electronics are not intentionally added or knowingly present in our
semiconductor products:
Asbestos, Azo Colorants, Cadmium and its compounds, Hexavalent Chromium and its compounds, Mercury and its
compounds, Ozone Depleting Substances (CFCs, HCFCs, HBFCs, carbon tetrachloride, etc.), Tributyl Tin Oxide (TBTO),
Tributyl Tin (TBT) and Triphenyl Tin (TPT), Polychlorinate Biphenyls (PCBs), Polychlorinate Terphenyls (PCTs),
Polychloronated Naphthalenes (more than 3 chlorine atoms), Short chain Chlorinated Paraffins (SCCPs), Polybrominated
biphenyls (PBBs), Polybrominated diphenylethers (PBDEs) and Radio-active Substances
Dopants
Some of the commonly used dopant elements are toxic, but they are only required in very small amounts, well below the
one part per billion [1ppb] level. None of our devices contain these toxic materials as "free elements". All such
substances are combined during processing with other elements and become constituents of either the compoundsemiconductor materials, the semiconductor devices, or of the metal alloys that are used as contact materials.
Product Life Cycle Information

Our devices are often incorporated into printed circuit boards and then assembled with other parts into electronic
systems. In the U.S.A., end-of-life printed circuit boards (waste), are considered scrap metal by the Environmental
Protection Agency (EPA) when they are recycled (USEPA Mgt. memo, Regulatory Status of Printed Circuit Boards, August
26,1992). If any of our products are disposed of as part of a printed circuit board, the entire board assembly is treated as
scrap metal. Approved printed circuit board recycling companies either have the proper facilities or have access to
secondary metal smelters and refiners which can safely recycle scrap electronic components or assemblies.
Lead-free RoHS Compliance

Avago Technologies has a full range of lead-free products compliant with the RoHS directive. Certain product families are
exempted from lead restrictions in the RoHS Directive - these products may contain compliant lead in accordance with the
exemptions. Standard products do not contain any intentionally added RoHS substances above permitted maximum
thresholds. Product families with no lead in the table of material composition are by definition both lead-free and
compliant with RoHS lead restrictions. For product availability and compliance information, please contact Avago
Technologies distributors or Avago Technologies Sales & Marketing via RoHS.Enquiry-SPG@avagotech.com. For product
technical information (termination finish, temperature profile, product substance content etc.) please contact: Pbfree.SPG@avagotech.com
The information presented in this document is believed accurate and reliable. Data is the most current available to Avago Technologies at the
time of preparation and is issued as a matter of information only. No warranty as to accuracy or completeness is expressed or implied. The
information in this document is subject to change without notice. Copyright Avago Technologies, 2005. Reproduction, adaptation, or
translation without prior written permission is prohibited except as allowed under copyright laws.
Page 5

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Product Information

gram (min, max)

Material Composition Information:

Material Trade Name

Cartridge Brass tin

SUS 304 1/2 H

Epoxy Resin, Chemical,

FR4, Ink, Copper,

Alloy, Kovar, Glass, Ni,

Alloy 42, NiCo2918,

Flat window can

Kovar, Glass, Ni-P

Sub-part Name & Substance

Sub-part Substance CAS#

Avago Technologies Product Stewardship

Format rev 2.0 3 August 2006

Fibrous Glass Fabric

Glycol Ether Solvent

Modified Epoxy Resin

Respirable Fibrous Glass

p/n without suffix 'Z'

Avago Technologies Product Stewardship

Format rev 2.0 3 August 2006

p/n with suffix 'Z'

Modified epoxy resin

Bisphenol A type epoxy resin

Dimethyl siloxane monotrimethoxysiloxy-terminated

Avago Technologies Product Stewardship

Format rev 2.0 3 August 2006

p/n without suffix 'Z'

p/n without suffix 'Z'

p/n with suffix 'Z'

p/n with suffix 'Z'

p/n with suffix 'Z'

Flat window can

die attach, wirebond

p/n without suffix 'Z'

p/n without suffix 'Z'

p/n with suffix 'Z'

Avago Technologies Product Stewardship

Format rev 2.0 3 August 2006

Absence of Hazardous Substances

Product Life Cycle Information

Lead-free RoHS Compliance

Avago Technologies Product Stewardship

Format rev 2.0 3 August 2006

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