Beruflich Dokumente
Kultur Dokumente
a review
A. K. Suri, C. Subramanian*, J. K. Sonber and T. S. R. Ch. Murthy
Boron carbide is a strategic material, finding applications in nuclear industry, armour for
personnel and vehicle safety, rocket propellant, etc. Its high hardness makes it suitable for
grinding and cutting tools, ceramic bearing, wire drawing dies, etc. Boron carbide is
commercially produced either by carbothermic reduction of boric acid in electric furnaces or
by magnesiothermy in presence of carbon. Since many specialty applications of boron carbide
require dense bodies, its densification is of great importance. Hot pressing and hot isostatic
pressing are the main processes employed for densification. In the recent past, various
researchers have made attempts to improve the existing methods and also invent new processes
for synthesis and consolidation of boron carbide. All the techniques on synthesis and
consolidation of boron carbide are discussed in detail and critically reviewed.
Keywords: Synthesis, Densification, Boron carbide, Sintering, Hard material, Neutron absorber
Introduction
Boron carbide is a suitable material for many high
performance applications due to its attractive combination of properties such as high hardness (29?1 GPa),1
low density (2?52 gm cm23),1 high melting point
(2450uC),2 high elastic modulus (448 GPa),3 chemical
inertness,2,4 high neutron absorption cross-section (600
barns),4,5 excellent thermoelectric1,4 properties, etc. It
has found application in the form of powder, sintered
product as well as thin films. Boron carbide (also known
as black diamond) is the third hardest material after
diamond and cubic boron nitride. Its outstanding
hardness makes it a suitable abrasive powder for
lapping, polishing and water jet cutting of metals and
ceramic materials.4
Tools with boron carbide coating are used for cutting
of various alloys such as brass, stainless steel, titanium
alloys, aluminium alloys, cast iron, etc.1 In sintered
form, it is used as blasting nozzles,6 ceramic bearings
and wire drawing dies due to good wear resistance.1 The
combination of low specific weight, high hardness and
impact resistance makes it a suitable material as body
and vehicle armour. Modulus to density ratio of boron
carbide is 1?86107 m, which is higher than that of the
most of the high temperature materials and hence it
could be effectively used as a strengthening medium.7
Thin films of boron carbide find application as
protective coating in electronic industries.8,9
Boron carbide is extensively used as control
rod, shielding material and as neutron detector in
nuclear reactors due to its ability to absorb neutron
without forming long lived radionuclide.7,1017 Neutron
Materials Group, Bhabha Atomic Research Centre, Mumbai 400085, India
*Corresponding author, email csubra@barc.gov.in
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1 Phase homogeneity range in B-C phase diagram: reprinted with permission from Elsevier, J. Less Comm.
Met., 1979, 67, Fig. 2 in p. 329
Crystal structure
The most widely accepted crystal structure of boron
carbide is rhombohedral, consisting of 12-atom icosahedra located at the corners of the unit cell. Schematic
diagram of the structure of boron carbide is presented in
Fig. 2.38 The longest diagonal of the rhombohedral unit
cell contains three atom linear chain (C-B-C). Each end
member of the chain is bonded covalently to an atom of
three different icosahedra.31 In general, icosahedra
consist of 11 boron atoms and one carbon atom. The
locations of carbon atoms within different icosahedra
are not ordered relative to one another. The icosohedral
configuration is the result of a tendency to form threecentre covalent bonds due to deficiency of valence
electrons of boron.39 Two crystallographically inequivalent sites exist in the icosahedron. Six atoms
reside in two polar triangles at the opposite ends of the
icosahedron and the remaining six atoms occupy
equatorial sites. The atoms at polar sites are directly
linked to neighbouring icosahedra via strong two-centre
bonds along the cell edges. The atoms in equatorial sites
either bond directly to other icosahedra through threecentre bonds or to chain structures.40,41 Most of the
icosahedra have a B11C structure with the C atom placed
in a polar site, and a few percent have a B12 structure or
a B10C2 structure with the two C atoms placed in two
antipodal polar sites.41
Three types of three-atom chain are envisioned: C-BC, C-B-B and B-B-B. Variation in carbon concentration
changes the distribution of three-atom chains.31 B4C
(20%C) structure consists of B11C icosahedra and C-B-C
chains. As the composition becomes rich in boron,
carbon of the B11C icosahedra is retained, while one of
the carbon atoms on the C-B-C chains is replaced by
boron. Near the composition B13C2, the structure
consists of B11C icosahedra and C-B-B chains. On
further carbon reduction, some of the B11C icosahedra
are replaced by B12 icosahedra retaining the C-B-B
chain.40,42 Carbon-boron bonds present in the three
atom chains are much stronger than boron-boron bond
in icosahedra.40 The inter-icosahedra bonds are stiffer
than the intra-icosahedra bonds.43
Conflicting views still exist concerning the nature of
site occupancies. A model based on early X-ray diffraction data44,45 proposed that the B4C composition is
made up of B12 icosahedra and C-C-C chains. However
later studies38,4042,46,47 based on improved X-ray and
neutron diffraction, nuclear magnetic resonance studies,
theoretical calculations and vibrational spectra indicate
that the structure consist of B11C icosahedra and C-B-C
chains. Even among those who favour B11C icosahedra
and CBC chain model for 20 at.-% (B4C), there is
disagreement on the structural changes that occur in
boron carbides, as the carbon content is decreased
towards 13 at.-% (B13C2). Some workers46,48 propose
that carbon atoms are removed from the icosahedra to
form B12 icosahedra, while others40,42,49 propose that
carbon atom is replaced from three atom chains. Owing
to similarity of boron and carbon in electron density and
nuclear cross-section (B11 and C12), both X-ray and
neutron diffraction studies are not very successful in
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3 Composition of structure elements (B12 and B11C icosahedra, C-B-C and C-B-B chains) in boron carbide unit
cell and chainless unit cells with variation of C content: reprinted with permission from Elsevier, Solid
State Commun., 1992, 83, Fig. 4 in p. 850
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Irradiation response
Neutron irradiation of boron carbide results in extensive
intergranular cracking due to the formation of helium
bubble as per the following equation5961
7
10
1
4
:
5 B z0 n ?3 Li z2 He z2 6
MeV
(1)
Formation of these cracks, which prevent heat conduction and the atomic disorder resulting in high phonon
dispersion, decrease the thermal conductivity during
irradiation.59 The anisotropic precipitation of helium
not only changes the microstructure but degrades the
mechanical and physical properties as well. When grain
boundary cracking occurs, a large amount of trapped
helium is released simultaneously with the occurrence of
bulk swelling.62,63 Considerable amount of tritium is
produced in B4C by fast neutron irradiation, which is
retained up to 700uC even on annealing and is released
only at temperature higher than 900uC.62,64 Copeland
et al.65,66 have reported that irradiation of boron carbide
with neutron causes lattice strains due to the formation
of lithium and helium as reaction product as well as
some atomic displacements. Inui et al.67 have reported
that a complete crystalline to amorphous transition
takes place by electron irradiation with energy .2 MeV
and at temperature ,163 K. They also found that the
amorphous boron carbide remains in amorphous state
on annealing at 1273 K. They suggested a possibility,
that, in boron carbide, the individual B12 icosahedra
themselves are not destroyed by electron irradiation but
their regular spatial arrangement in the B12C3 lattice is
perturbed and is gradually put in disorder with
increasing electron dosage, resulting in an amorphous
state.67 Froment et al.59 have noticed that boron rich
B8C is more resistant to radiation damage compared to
B4C and hence becomes a possible candidate for new
absorbing materials. 11B4C is found to be very stable
after fast neutron irradiation in reactors. Dimensional
changes and thermal conductivity of 11B4C are substantially smaller than that of 10B4C.68
(2)
(3)
B2 O3 z3CO?2Bz3CO2
(4)
4BzC?B4 C
(5)
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Process kinetics
Suri et al.
5 Effect of feed composition and temperature on calculated product composition in carbothermic reduction of
1 mol B2O3 (l) as per Dacic et al.:82 reprinted with permission from Elsevier, J. Alloys Compd, 2006, 413,
Fig. 2 in p. 200
B2 O3 zC?B2 O2 zCO
(6)
B2 O3 zC?2BOzCO
(7)
(8)
(9)
step 2
4BzC?B4 C
(10)
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Table 1 Charge composition, processing conditions and product quality on synthesis of boron carbide by carbothermic
reduction*
Serial
no.
Reactants
Process parameters
Product quality
Ref. (year)
2400uC
69 (1933)
72 (1939)
79 (2004)
78 (2006)
B2O3zPC
H3BO3zcharcoal
Batch (resistance
furnace)
Batch (arc furnace)
H3BO3zPC
Batch
B2O3zPC/carbon active
Batch
Batch
Melting temperature
of charge
1470uC; HR:
100uC min21, 5 h, Ar
1470uC; HR: 100u min21,
15 h, Ar
1800uC, 20300 min, Ar
H3BO3zPC
Batch (Acheson)
.2000uC
Process type
1850uC, Ar
85 (1992)
product
conditions
and
quality
on
synthesis
of
boron
carbide
by
Serial
no.
Reactants
Process type
Process parameters
Quality of B4C
Ref. (year)
1
2
3
4
B2O3zMgzC
B2O3zMgzC
B2O3zMgzC
B2O3zMgzC
Tubular furnace
SHS
Batch
Mechanical alloying
Fine powder
Fine powder 98% pure
Boron: 74.6% Carbon: 25.2%
Submicrometre particles
93
96
95
88
5
6
7
B2O3zMgzCFibre
H3BO3zMgzC
Na2B4O7zMgzC
Combustion synthesis
SHS
Continuous
9501200uC, H2
99 (1994)
97 (2005)
94 (1958)
(2002)
(2003)
(1967)
(2006)
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Suri et al.
(11)
(12)
(13)
Table 3 Charge composition, processing conditions and product quality on synthesis of boron carbide from elements*
Serial
no.
Reactants
Process type
Process parameters
Product quality
Ref. (year)
1550uC, 4 h, Ar
BzC
MAzannealing
BzC
MAzspark plasma
sintering
Amor. boronzcarbon
black
.1200uC, 10 min
Amor. boronzgraphite
Amor. boronzCNT
Detonator: trimethyl
enetrinitramine Detonation
velocity: 6.4 km s21
1150uC, Ar
Nanoparticles
15350 nm
Articles of near
theoretical density
B4C with some
unknown peaks
95% dense pellet
of high purity boron
carbide
Sintered B4C,
disordered fine
crystalline
Nanosized particles
of crystalline B4C
110 (2007)
Amor. boronzAmor.
carbon
BzC
18002200uC, 34 h
MA for 90 h Annealing
at 1200uC
1650uC, 16 min
12
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Straight nanorods
111 (1975)
112 (2006)
106 (2004)
113 (2005)
107 (1996)
108 (2002)
Suri et al.
temperature range of 450 to 1450uC. Substrate temperature has strong influence on the process and product
quality. High substrate temperature results in poor
adhesion whereas deposition rate is low at low
temperature. Amorphous boron carbide coating can be
obtained at a low temperature of y500uC whereas
crystalline film is obtained at higher temperatures
.1100uC. Amorphous boron carbide coatings on SiC
have been obtained by CVD from CH4BCl3H2Ar
mixtures at low temperature (9001050uC) and reduced
pressure (10 kPa).119
Preparation of boron carbide fibres by the reaction of
boron halides with woven cloth of carbonisable material
in hydrogen atmosphere has been patented by Wainer
et al.120,121 Jaziehpour et al.122 have prepared boron
carbide nanorods on graphite substrate at 1400uC by
CVD using charge mixture of boron oxide, activated
carbon and sodium chloride. Shu-Fang et al.123 have
grown novel boron carbide nanoropes by CVD using ocarborane (C2H12B10) as precursor and ferrocene
(C10H10Fe) as catalyst. Karaman et al.124 have studied
the kinetics of CVD of B4C on tungsten substrate using
BCl3CH4H2 gas mixture. They proposed that two
major reactions take place during the process
1
BCl3 gz CH4 gzH2 g?
4
1
B4 C sz3HCl g
4
BCl3 gzH2 g?BHCl2 gzHCl g
(14)
(15)
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Table 4 Charge composition, processing conditions and product quality on vapour phase synthesis of boron carbide*
Serial
no.
1
2
Reactants
Process parameters
Product quality
Ref. (year)
Vapour phase
reaction
Vapour phase
reaction
BCl3zCH4
1900uC; vacuum:
5 mm of Hg
Exothermic reaction
and needs to be
ignited only by spark
plug
1075uC, 18 h
114 (1967)
117 (1977)
Whiskers length:
0.54 inch; diameter:
0.050.25 mm
Whiskers length: 50 mm;
diameter: 10 mm
Submicrometre size powder
115 (1970)
118 (1975)
130 (1996)
131,132 (1989)
133 (1965)
134 (1981)
B4C coating
135 (1968)
136 (1974)
137 (2006)
124 (2006)
Crystalline B4C
128 (1999)
Crystalline B4C
138 (1996)
139 (1990)
127 (2002)
B2H6zC2H2
Vapour phase
reaction
B2O3zCH4
BCl3zCH4zH2
BCl3zCH4zH2
Vapour phase
reaction
RF plasma
assisted synthesis
CVD
CVD
BCl3zCH4zH2
CVD
BCl3zCCl4zH2
CVD
BCl3zC3H8zH2
10
CVD
BCl3zCH4zH2
11
CVD
BCl3zCH4zH2
12
13
CVD
CVD
BCl3zCH4zH2
BCl3zCH4zH2
14
Laser CVD
BCl3zCH4zH2
15
Laser CVD
BCl3zCH4zH2
16
Laser CVD
17
Laser CVD
BCl3zCH4/
C2H4zH2
BCl3zC2H4
18
Laser CVD
BCl3zCH4zH2
19
Pulsed laser
induced CVD
Plasma enhanced
CVD
Microwave plasma
assisted CVD
C6H6zBCl3
Process
20
21
22
BCl3zCH4zH2
1650uC, 5 h; vacuum
catalyst: VCl4
Ar plasma
1350uC; Sub.: carbon
fibre
11271227uC; Sub.:
boron coated Mo,
vacuum
1550uC, 45 h, Sub.:
graphite
8501000uC, 36 h;
Sub.: graphite cloth;
vacuum: 1525 torr
1300uC,6 h; Sub.:
graphite; vacuum:
10 mm of Hg
1300uC, 3 h; Sub.:
tungsten, graphite
8001050uC, vacuum
10001400uC; Sub.:
tungsten
Laser: CO2; Sub.:
fused silica; Ar pressure:
atmospheric
Laser: CO2; Sub.:
fused silica
Laser: CO2
Laser: CO2; Sub.: fused
silica, Ar
Laser: CO2; Sub.: fused
silica,
Nd:YAG laser
C2B10H12
(orthocarborane)
BBr3zCH4zH2
11001200uC; Sub.:
Si (100)
500600uC; Sub.:
graphite
BCl3zCH4
500600uC; Sub.: Si
(100), ArzH2
1600uC, 36 h BCl3:
615 mL min21; CH4:
25 mL min21; H2:
500 mL min21
1000 to 1400uC; Sub.:
graphite, vacuum
2100uC (filament)
450uC (substrate);
Sub.: Si (100), vacuum
Room temperature;
Sub.: Si (100)
23
Supersonic plasma
jet CVD
Thermal CVD
BCl3zCH4zH2
24
BCl3zCH4zH2
25
BCl3zCH4zH2
26
Electron beam
evaporation
BzC
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129 (1997)
14 to 33 nm B4C crystals
encapsulated in graphite
B4C nanowires diameter:
18150 nm; length: 13 mm
Amor. boron carbide large
composition range (0 to
40 at.-%C
Microcrystalline film hardness:
2232 GPa
Various composition between
B4C and B13C2
140 (1999)
145 (1998)
*CVD: chemical vapour deposition; Sub.: substrate; Amor.: amorphous; RF: radio frequency.
14
116 (1969)
141 (1999)
142 (1990)
143 (1998)
144 (1992)
146 (1994)
147 (2008)
Suri et al.
by heating amine treated B2O3 fibre in inert atmosphere at 20002350uC. Cihangir et al.160 have developed a method based on sulphuric acid dehydration of
sugar to synthesise a precursor material which on
heating to temperature between 1400 and 1600uC
yields crystallised B4C and B4C/SiC composites.
Table 5156159,161167 gives the comparative summary of
studies reported on the synthesis of B4C using polymer
precursors.
(16)
(17)
Hexagonal B4C crystals with a particle size of approximately 1540 nm diameters were obtained.
Table 5 Charge composition, processing conditions and product quality on synthesis of boron carbide using polymer
precursor
Serial
no.
Polymer precursors
Temperature,
uC
Atmosphere
Holding
time, h Product quality
Ref. (year)
1
2
1300
1500
Argon
Vacuum
5
2.5
161 (2009)
162 (2006)
400800
Air
1450
Vacuum
1400
1500
Ar
Crystalline
Crystalline, micrometre
sized, free carbon: 2.38%
Crystalline (orthorhombic),
boric acid as impurity
Crystalline, free carbon
11.1 wt-%
B/C composite containing
crystalline B4C
Crystalline
1000
Ar
165 (1988)
1450
1400
Ar
Ar
48
2
1215
Vacuum
,1
1700
H2
20002350
Inert atmosphere
3
4
5
6
7
8
9
10
11
Polyvinyl borate
Reaction product of H3BO3
and citric acid
Reaction product of H3BO3
and polyvinyl alcohol
Reaction product of H3BO3
and citric acid
Solution product of H3BO3
and glucose
Condensation product of H3BO3
and 2-hydroxy benzyl alcohol (HBA)
Polyvinyl pentaborane
157 (2005)
158 (2002)
163 (2002)
164 (1999)
165 (1988)
166 (1985)
156 (1975)
159 (1974)
2010
167 (1969)
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densification 18702010uC and a slow down in densification rate 20102140uC. The surge in densification
18702010uC is attributed to the presence of oxide layer
which helps in precipitation of B4C through liquid B2O3
or due to evaporation and condensation of rapidly
evolving oxide gases (BO and CO). Slower densification
at temperatures above 2010uC is attributed to evaporation and condensation of B4C. Figure 11183 shows the
changes in weight, dimension and grain size while
sintering of boron carbide.
Densification of boron carbide without deterioration
of mechanical properties can be achieved either by using
a suitable sintering aid and/or applying the external
pressure (e.g. hot pressing, hot isostatic pressing).
Selection of the additive and the method of consolidation are generally dictated by the end use of the product
and the properties that are required. The additive by
itself or due to in situ reaction with boron carbide would
form a non volatile second phase aiding in densification
and property enhancement. Hence, selection of the
additive should be directed towards the formation of a
suitable structure providing the correct properties for
use. Recent or advanced techniques such as microwave/
spark plasma sintering, explosive compaction, etc. help
to obtain dense products without microstructural
coarsening. These techniques are presently limited to
laboratory scale only. Detailed literature survey on
pressureless sintering with or without sintering aids, hot
pressing, hot isostatic pressing, spark plasma and
microwave sintering of boron carbide are presented in
the following sessions.
Pressureless sintering
Pressureless sintering is a simple and economic process
to produce dense compacts. This operation is carried out
in two steps. In the first step green compacts with
Boron source
Carbon source
Advantage
Disadvantage
Carbothermic reduction
H3BO3 or B2O3
PC, graphite,
activated carbon
PC, graphite,
activated carbon
Boron
PC, graphite,
activated carbon
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11 Sintering of boron carbide compact: change in weight, dimension, grain size and coefcient of thermal expansion up
to 2300uC:183 reprinted with permission from Wiley-Blackwell, J. Am. Ceram. Soc., 2003, 86, (9), Fig. 8 in p. 1472
18
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B4C
B4Cz3 wt-%C (phenolic resin)
B4C
B4C
B4Cz3 wt-%C
B4Cz5 wt-%C
B4Cz7.5 wt-%C
B4Cz9 wt-%C
B4C
B4Cz4%C
B4Cz4%B
10
B4Cz4%SiC
B4Cz4%TiB2
B4C
B4Cz1 wt-%C
B4Cz3 wt-%C
B4Cz5 wt-%ZrO2
B4Cz5 wt-%TiB2
B4C
B4Cz5 wt-%TiB2
B4Cz10 wt-%TiB2
B4Cz15 wt-%TiB2
B4Cz20 wt-%TiB2
B4Cz25 wt-%TiB2
B4Cz30 wt-%TiB2
B4C
B4C
B4Cz6 wt-%C
B4C
B4Cz3 wt-%C (phenolic resin)
B4C
B4Cz(polycarbosilanez
phenolic resin510%)
D5051.33
SS: 6.64
B/C53.8 to 3.9
D5050.5 to 2
(Acheson)
B: 78%; C: 19.05%; O: 0.5%
D50<3
SS: 18.8; O: 1.23%; N: 0.4%
Carbon black: D50520 nm;
SS: 120
SiC (SS): 11.59
TiB2: D90<4
SS: 2.53
B/C: 4.32
D50(0.84
SS: 18.8
B/C53.76
2250uC,
2250uC,
2375uC,
2325uC,
2325uC,
2275uC,
2375uC,
2150uC,
2200uC,
2250uC,
2250uC,
2250uC,
2250uC,
2250uC,
2250uC,
2250uC,
2250uC,
2250uC
2250uC
h
h
h
h
h
h
h,Ar
h, Ar
h,Ar
2 h, Ar
2 h, Ar
1 h, vacuum
1 h, vacuum
1 h, vacuum
1 h, vacuum
1 h, vacuum
vacuum
1
1
1
1
1
1
2
2
2
2175uC, 15 min, Ar
B4C
B4C
D5051
SS: 12
D50(1
SS: 22
D50,5
SS: 10.5
Processing conditions
Serial
no.
90.8
95.4
93
91
90
93
82
86
90
93
96
96
98
98.5
78.6
82.5
92
93
89
86
95.5
97.7
87.0
91.392.7
98.498.6
65%
7072%
.95%
78
96
95
9495
94.095.6
Sintered
density
rth, %
B4C:
B4C:
B4C:
B4C:
B4C:
B4C:
B4C:
B4C:
B4C:
2010
10
14
17
50120
y20
y10
y5
y15
30
B4C: 28
B4C: 50
B4C: 13
SiC: ,3
B4C: 2.58 3.11
B4C: 2.262.4
Coarse
Coarse
Fine
B4C: 6
B4C: 4
B4C: 105
B4C: 28
Microstructure,
mm
Table 7 Powder details, sintering parameters and characteristics of sintered boron carbide by pressureless sintering*
22
26
29
31
29
26
23
32
1923
2125
2425
1921
1921
1820
12.025.5
Vickers
hardness,
GPa
2.2
2.6
2.8
2.85
2.9
3.05
3.4
3.2
2.913.19
KIC,
MPa m1/2
220
260
290
360
320
280
270
174
350
353
160180
Flexural
strength,
MPa
213 (2008)
193 (2006)
192 (2005)
191 (2003)
183 (2003)
190 (1987)
189 (1981)
179 (1989)
188 (2004)
186 (1988)
Ref. (year)
Suri et al.
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14
13
12
11
Serial
no.
B4Cz10
B4Cz20
B4Cz30
B4Cz40
wt-%TiO2
wt-%TiO2
wt-%TiO2
wt-%TiO2
B4Cz5 wt-%TiO2
B4Cz10 wt-%TiO2
B4Cz15 wt-%TiO2
B4Cz20 wt-%TiO2
B4C
B4C
B4C
B4Cz5 wt-%ZrO2
B4Cz10 wt-%ZrO2
B4Cz15 wt-%ZrO2
B4Cz20 wt-%ZrO2
B4Cz25 wt-%ZrO2
B4Cz30 wt-%ZrO2
B4C
B4Cz5 wt-%Ti
B4Cz10 wt-%Ti
B4Cz15 wt-%Ti
B4Cz20 wt-%Ti
B4C
B4C
B4Cz5 wt-% talc
B4Cz10 wt-% talc
B4Cz15 wt-% talc
Table 7 Continued
D5055 to 7
SS: 17
TiO2: D100(2
D50 ,1
SS: 917
TiO2: D50,2 (up to
1500uC: vacuum)
D5051
SS: 14
ZrO2z3 wt-%Y2O3
D5050.8
SS: 16
B4C: D50<1
B/C54.09
ZrO2 reactor grade
D5051.33
SS: 6.64
B/C53.8 to 3.9
Talc: 26.62%Al2O3,
47.78%SiO2, 25.6%MgO
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
h,
h,
h,
h,
h,
h,
h,
h,
h,
h,
h,
h,
h,
h,
h,
h,
h,
h,
h,
h,
h,
h,
Ar
Ar
Ar
Ar
Ar
Ar
Ar
Ar
Ar
Ar
Ar
Ar
Ar
inert
inert
inert
vacuum
inert
inert
inert
inert
inert
2160uC, 1 h, Ar
2160uC, 1 h, Ar
2160uC, 1 h, Ar
2160uC, 1 h, Ar
2190uC, 1 h, Ar (up
to 1500uC: vacuum)
2050uC,
2150uC,
2150uC,
2150uC,
2150uC,
2150uC,
2150uC,
2150uC,
2190uC,
2190uC,
2190uC,
2190uC,
2190uC,
2150uC,
2150uC,
2150uC,
2275uC,
2050uC,
2150uC,
2150uC,
2150uC,
2150uC,
Processing conditions
73
75
80
93
72
77
88
95
71
72
75
79
86
97
97
97
98
62
67
73
78
86
92
95
98
86.63
89.56
93.86
95.3
95.5
93.08
95.82
92.34
74
78
82
85
90
Sintered
density
rth, %
ZrB2
ZrB2
ZrB2
ZrB2
ZrB2
ZrB2
ZrB2
ZrB2
B4C: 10
TiB2: 5
B4C: 10
TiB2: 57
B4C
B4C,
B4C,
B4C,
B4C,
B4C,
B4C,
B4C,
B4C,
Microstructure,
mm
19
22
25
27
28
29
27
26
26
27
23
26.85
31.68
31.18
30.19
30.95
31.71
31.07
18
21
22
23
25
Vickers
hardness,
GPa
2.0
2.1
2.2
2.6
2.9
3.0
3.0
3.1
2.4
2.6
2.7
1.9
2.0
2.1
2.2
2.3
KIC,
MPa m1/2
200
300
330
400
200
300
350
420
120
190
200
205
210
220
235
260
340
50
Flexural
strength,
MPa
187 (2000)
197 (1999)
196 (2006)
221 (2008)
195 (2006)
Ref. (year)
Suri et al.
Synthesis and consolidation of boron carbide: a review
D100: submicrometre
SS: 15.0
O2: 0.98%; N2: 0.32%
FC: 0.64%
TiC: D5051.5
O: 0.53%; N: 0.10%
D5050.08
SS: 16.1
B/C: 3.57
BeC: submicrometre
B4C: D5059; SiC: D5052.5
D5050.43
SS: 15.3
O2: 2% max.
Fe: 140 ppm
Al: 50 ppm
CrB2: D5053.5
B4C
B4Cz22 vol.-%ZrO2
B4Cz28 vol.-%TiO2
B4Cz8 vol.-%Y2O3
B4C
B4Cz1 wt-%Al2O3
B4Cz2 wt-%Al2O3
B4Cz3 wt-%Al2O3
B4Cz4 wt-%Al2O3
B4Cz5 wt-%Al2O3
B4Cz1.5%TiC
B4Cz1.5%TiC
B4Cz3.0%TiC
B4Cz4.5%TiC
B4Cz6.0%TiC
B4C
B4Cz1.0 wt-%BeC
B4Cz1.0 wt-%BeC
B4Cz1.0 wt-%BeC
B4Cz10 wt-%SiCz3 wt-%Al
B4Cz25 wt-%CrB2
B4Cz27.9 wt-%CrB2
B4Cz25 wt-%CrB2
B4Cz27.9 wt-%CrB2
17
18
20
2010
D50<0.9 (B/C53.9)
(1 wt-%O2 and 0.4% N2)
Al2O3: 99.99% pure
h,
h,
h,
h,
h,
Ar
Ar
Ar
Ar
Ar
15 min,
15 min,
15 min,
15 min,
10 min,
1 h, Ar
2
2
2
2
2
2030uC, 1 h, Ar
2030uC, 1 h, Ar
2015uC, 1 h, Ar
2260uC,
2130uC,
2230uC,
2280uC,
2150uC,
2015uC,
2175uC,
2200uC,
2200uC,
2200uC,
2200uC,
ArN2
ArN2
ArN2
ArN2
Ar
2150uC, 15 min, Ar
*FC: free carbon in B4C; D50: mean particle diameter, mm; SS: specific surface area, m2 g21.
21
22
19
B4Cz0 to 30 wt-%TiO2z1
to 6 wt-%C
16
2180uC, 2 h, Ar
19002050uC, 1 h, Ar
B4C: D5050.639
SS: 19.8
Purity: 99.89%
TiO2 and C: submicrometre
D5051.6 (B/C53.9)
O2: 1.7%
ZrO2: submicrometre
TiO2: submicrometre
Y2O3: submicrometre
Processing conditions
Serial
no.
Table 7 Continued
98.1
96.3
93.3
B4C: 2050
B4C: 20
CrB2: 20
B4C: 100150
8.92
12, TiB2
18, TiB2
11, TiB2, C
8, TiB2, C
5, TiB2, C
B4C: 7.07
71.9
80.1
85.5
94.0
94
90.2
3.63
5.35
B4C:
B4C:
B4C:
B4C:
B4C:
B4C:
B4C:
B4C:
TiB2: 610
B4C: 222
Microstructure,
mm
85
92
93
96
88
86
96.3
94.9
96.6
98.1
98.4
83
98
98
97.5
Up to 99%
Sintered
density
rth, %
31
29
28
28
2731
2833
2730
Vickers
hardness,
GPa
3.7
5.8
2.7
2.6
4.0
3.7
3.23.71
KIC,
MPa m1/2
525
108
400
404
286
266
350
375
180
350513
Flexural
strength,
MPa
202 (1982)
203, 204 (2002,
2002)
201 (1977)
200 (1998)
199 (1992)
198 (2007)
216 (1996)
Ref. (year)
Suri et al.
Synthesis and consolidation of boron carbide: a review
VOL
55
NO
21
Suri et al.
13 a TEM image of pressureless sintered boron carbide with 7?9 wt-% phenolic resin at 2250uC showing graphite crystal
at triple points and b high resolution TEM image of grain boundary of same sample:209 reprinted with permission
from the Ceramic Society of Japan, J. Ceram. Soc. Jpn, 2004, 112, (5), Figs. 2 and 3 in p. S400
(18)
22
2010
VOL
55
NO
Suri et al.
(19)
Levin et al.
have found that TiO2 is reduced by
carbon originated from the carbide phase. This leads to
the formation of substoichiometric boron carbide, which
is responsible for increased rate of sintering. Addition of
40 wt-%TiO2 to B4C powder (17 m2 g21 specific area)
gives a compact of 95% TD after sintering for 1 h at
2160uC.187,197 Presence of TiB2 results in lowering of
activation energy for sintering and hence very high
(20)
(21)
Fracture toughness and flexural strength of the compacts increased from 2?1 to 3?1 MPa m1/2 and 200 to
340 MPa respectively with the increase of ZrO2 content
from 0 to 30%. Processing in vacuum and higher
temperature (2275uC) increased the hardness to
.30 GPa.221 Figure 14 presents the variation in hardness of pressureless sintered B4C with ZrO2 addition.
Hardness in the entire range of composite is y30 GPa
compared to 27 GPa for pure B4C. Backscattered image
of this sample shows a white phase containing up to
1?2%Zr distributed in B4C matrix (Fig. 15).
Fractography (Fig. 16)221 shows the mode of fracture
to be a combination of transgranular and intergranular.
The in situ reactions for the formation of carbide/
boride consume some of the carbon from boron carbide,
2010
VOL
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23
Suri et al.
24
2010
VOL
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Suri et al.
Hot pressing
In conventional sintering, the rate of densification is
very slow. Though higher densification can be achieved
at higher temperatures, it is difficult to prevent grain
2010
VOL
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25
Suri et al.
18 Vacuum hot press with front door open showing graphite heaters and insulation
26
2010
VOL
55
NO
B4C
B4C
bBzC
Amorphous BzC
aBzC
B4C
3
4
5
11
10
2010
B4Cz5.3%Mo
B4Cz5%TiCz5%Mo
B4Cz10%TiCz4.7%Mo
B4Cz15%TiCz4.5%Mo
B4Cz20%TiCz4%Mo
35
35
35
35
35
MPa,
MPa,
MPa,
MPa,
MPa,
50
50
50
50
50
65
50
40
30
65
min,
min,
min,
min,
min,
min,
min,
min,
min,
min,
Ar
Ar
Ar
Ar
Ar
Ar
Ar
Ar
Ar
Ar
Ar, 1 h, HR:
2000uC, 20 MPa,
1525uC min21
2150uC, 35 MPa,
1850uC, 35 MPa,
1850uC, 35 MPa,
1850uC, 35 MPa,
2150uC, 35 MPa,
B4Cz23.4%TiO2z5.28%
carbon black
B4C
B4Cz10%(W,Ti)C
B4Cz30%(W,Ti)C
B4Cz50%(W,Ti)C
B4C
2000uC, 50 MPa, 1 h, Ar
B4CzTiO2zC
B: D50520
FC: 1.4%
D5052.9
SS: 0.246.2
B4Cz5%B
B4Cz15%B
B4CzTiO2zC
TiO2: D50, nanosize
B4C
B4C
K
K
K
K
K
96.5
99.1
99.2
99.0
98.5
95.0
98.5
99.2
99.5
95.0
2.49 g cc21
2.42 g cc21
100
100
100
.95
.95
95.5
87
99
91
2.5 g cc21
72.4
80.2
98.5
98.4
99.6
98
K 65.1
12
12
12
12
12
1040
B4C: 3.8, TiB2
B4C: 3.4, TiB2
B4C: 3.9, TiB2
0%TiB2
5% TiB2
10%TiB2
20%TiB2
30%TiB2
40%TiB2
15 vol.-%TiB2; rest:
B4C
B4C: 610
12, TiB2, W2B5
0.51.5
,1
58
1050
22
25
24.5
23.5
29
28
26
23
21
27
30
32
34
30
28
3.40
4.25
3.75
3.60
2.5
2.8
3.9
4.5
2.60
3.1
2.8
3.2
3.1
4.0
5.0
5.1
4.6
4.3
6.1
2.53.0
239 (1979)
240 (1983)
550
695
625
550
245
400
550
690
540
190
200
870
720
815
200
350
500
630
530
400
621
240
247 (2009)
246 (2002)
244 (2000)
257 (1990)
243 (2005)
242 (1979)
179 (1989)
300400 250 (2005)
241 (2000)
Vickers
Indentation Flexural
hardness, toughness, strength,
GPa
MPa m1/2 MPa
Reference (year)
7.0
12.1
13.5
15.2
16.4
.5, a large number
of twins
23
48
32.5
6.0
Microstructure,
Sintered
density rth, % mm
Table 8 Powder details, sintering parameters and characteristics of sintered boron carbide by hot pressing*
Suri et al.
Synthesis and consolidation of boron carbide: a review
VOL
55
NO
27
28
2010
VOL
55
NO
20
19
18
17
16
15
14
13
12
B4C
B4Cz10 wt-% BN
B4Cz20 wt-% BN
B4Cz30 wt-% BN
B4Cz40 wt-% BN
B4Cz60%Al2O3
B4Cz70%Al2O3
B4Cz80%Al2O3
B4Cz90%Al2O3
B4CzAl2O3
B4CzAl2O3z5%TiC
B4CzAl2O3z10%TiC
B4CzAl2O3z15%TiC
B4CzAl2O3z20%TiC
MPa,
MPa,
MPa,
MPa,
MPa,
65
60
60
60
60
min,
min,
min,
min,
min,
2150uC,
1950uC,
1950uC,
1950uC,
1950uC,
(B4C/Al2O3518 : 1)
B4C: D5053 to 5, .95%
Al2O3: D5051 to 2, .99%
TiC: D5051 to 2, .99%
35
35
35
35
35
1700uC, 35 MPa, 1 h, Ar
B4C: D5051.0
Al2O3: D5050.2
Ar
Ar
Ar
Ar
Ar
2275uC, 28 MPa, 1 h, Ar
1900uC, 50 MPa, 1 h, Ar
1620uC
1670uC
1720uC
1820uC
1920uC
2120uC
B4C: D5050.43
CrB2: D5053.5
SizBzC
C, SS: 80; Si: D10055
B4Cz8 to 13% siloxane/
phenolic
B4C: D5050.1 to 1
B4Czsodium silicatez
magnesium nitratezFe3O4
B4C
B4Cz5%CrB2
B4Cz10%CrB2
B4Cz15%CrB2
B4Cz20%CrB2
B4Cz25%CrB2
B4Cz50%SiC
B4Cz10%CrB2
B4Cz15%CrB2
B4Cz20%CrB2
B4Cz22.5%CrB2
B4Cz25%CrB2
B4C
D50,1
B4C: 29.557%; B: 18.3
35.5%; Si: 3.87.5%; WCz
TiC: 045.3%; Co: 02.8%
Table 8 Continued
4598.4
99.5
99.2
99.0
98.5
98.1
3.53
3.65
3.77
3.86
95.5
98.7
98.9
98.7
98.5
4568
21
2.74 g cc
9799.7
86
94
95
96
98
95
99.0
99.6
99.7
99.0
99.0
98.6
2.50 g cc21
3.5 g cc21
3.6 g cc21
3.59 g cc21
3.5 g cc21
3.45 g cc21
3.2 g cc21
79.3
3.0
3.2
3.4
B4C:
B4C,
B4C:
B4C,
B4C,
25
TiB2
0.51.5, TiB2
TiB2
TiB2
B4C, nano-h-BN
B4C, SiC
B4C, SiC/C
B4C, SiC
Eutectic liquid of
CrB2zB4C
B4CTiB2W2B5
Microstructure,
Sintered
density rth, % mm
21
15
11
8
7
28
27
23
21
22.41.2
24.11.1
24.71.0
24.31.0
23.21.0
25
12
26
30
28
25
26
2.2
2.5
2.8
3.2
3.2
3.2
2.5
2.6
2.7
2.8
3.5
3.4
5.4
6.0
5.2
5.0
4.3
4.20.7
4.20.4
4.30.5
3.50.5
3.20.5
4.10.5
4.70.4
4.50.4
4.20.4
249 (1974)
234 (1996)
273 (1993)
248 (2003)
256 (2003)
245 (1986)
410
254 (2008)
420
410
360
310
53030 258 (2005)
56030
60070
55045
30034 271 (2008)
43031
44530
38629
32332
350
500
550
620
684
660
675
551
580
630
630
580
1.9
550
620
710
830
710
580
180
Vickers
Indentation Flexural
hardness, toughness, strength,
GPa
MPa m1/2 MPa
Reference (year)
Suri et al.
Synthesis and consolidation of boron carbide: a review
*FC: free carbon in B4C; HR: heating rate; CR: cooling rate; D50: mean particle diameter, mm; SS: specific surface area, m2 g21; RE: rare earth.
81.9
73.6
B4C/Cu578 : 22
B4C/Cu592 : 8
24
23
22
253 (1999)
194 (1978)
1.75 g cc21
99.6100
18252000uC, 10.3 MPa, Ar
B/C5 3.8 to 4.5; D5050.7 to 3.0
251 (2008)
156.76
97 HRA
B4C, Al8B4C7,
LaAlO3,
B4C: 12
92.5
1850uC, 20 MPa, 1 h, vacuum
21
B4Cz6%La2O3z
12%Al2O3z12%C
90 to 99%B4Cz0 to
1% BN/AlNzrest RE
oxide-Al2O3
B4Cz30%Al
Table 8 Continued
Microstructure,
Sintered
density rth, % mm
Vickers
Indentation Flexural
hardness, toughness, strength,
GPa
MPa m1/2 MPa
Reference (year)
Suri et al.
2010
VOL
55
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29
Suri et al.
lower hot pressing temperatures.242 Similar to preparation of boron carbide based cermets for nuclear
applications boron carbide rings with adequate strength
have been prepared by hot pressing technique with
y30 wt-% aluminium as binder for possible use as
neutron absorber.194 A high density B4C/Cu cermet with
70 vol.-%B4C exhibiting high thermal conductivity has
been prepared by hot pressing of Cu coated B4C
powders for the application of absorber materials in
liquid metal cooled fast breeder reactor.253 Though
boron carbide in various forms is used in nuclear
industry, literature data on the production methods is
scarce. An US patent261 explains a process for producing
B4C armour plates with improved ballistic properties by
the addition of Cr, B, or mixtures thereof.
Role of TiB2
30
2010
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Suri et al.
2010
VOL
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31
Suri et al.
32
2010
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Suri et al.
Continuous functionally graded boron carbide aluminium cermets have been prepared by spark plasma
sintering of B4C from boron and carbon followed by
infiltration of aluminium.294 This processing route
results in a material with very promising properties
and interesting microstructural features. Hardness profile of functionally graded material before and after Al
melt infiltration is shown in Fig. 25.294 A B4C/Cu graded
composite as plasma facing component for fusion
reactors with performance better than nuclear grade
graphite has been prepared by rapid self-resistance
sintering under ultra high pressure.295
Microwave processing
Microwave sintering has the advantages of uniform and
rapid heating since the energy is directly coupled into the
specimen rather than being conducted into the specimen
Conclusions
The understanding of the crystal structure of boron
carbide has been evolving over the years and even today
cannot be said to be fully elucidated. Carbothermic
reduction of boric acid has been the commercial method
for the production of boron carbide in spite of the
shortcomings. Need of the hour in carbothermic reduction is process modelling, which will greatly help in
tuning the process to achieve improved productivity and
uniform quality. Though a continuous method has been
established for the production of SiC,300 a similar
method has to be adopted for B4C also. Solgel method
appears to be a promising technique for production of
suitable fine boron carbide powders for direct consolidation. Vapour phase synthesis, still in laboratory scale,
2010
VOL
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33
Suri et al.
is an attractive process for the preparation of submicrometre sized powders, whiskers, etc. Though thermodynamic models based on Gibbs free energy
minimisation have been used to predict experimental
conditions, models based on mass transfer and kinetics
in addition are needed to understand the deposition
mechanism and the growth process. Boron carbide
based coatings by CVD methods for various semiconducting applications such as diode, transistor, thermoelectric converter, thermocouple, neutron sensors, etc.
are gaining importance and the use of boron carbide in
this field will increase manifold in the coming years. In
addition to the established uses, the future of boron
carbide will depend on the possible production of
micrometre/nanosized powders, whiskers and advanced
coating techniques to meet the varying demands.
On consolidation, the research so far has been focused
on reducing the sintering temperature, inhibit grain
growth and improve the mechanical properties. Carbon
has been the chief architect of these improvements. Additives based on carbides/borides/nitrides are also found to
be effective in obtaining a fine grained structure with
higher fracture toughness/flexural strength. Hot pressing
and HIP have remained the main densification methods
for production of pore free pure boron carbide due to their
ability to achieve near theoretical density without grain
coarsening. The process of silicon impregnation into a
sintered porous boron carbide body produces a very high
dense compact with improved mechanical properties due
to the presence of fine SiC particles. Post-hipped pressureless sintering is gaining importance for manufacture
of complex shapes with fine grains especially for armour
material. Production of nanosized particles followed by
SPS for consolidation will revolutionise the method of
B4C component manufacture. The mechanism, microstructure and properties of compacts by SPS technique are
yet to be fully understood. Various available methods of
powder production and consolidation techniques have
been exploited for fabrication of boron carbide components with tailor made properties.
B4C to be considered as high temperature structure
material should have good thermal and oxidation
resistive properties. Detailed investigations on oxidation
characteristics of B4C at high temperatures have been
carried out by Steinbruck et al.301,302 and others.303,304
Higher oxidation stability of B4C with the addition of
Zr, Cr and W borides have also been reported by Radev
et al.305 Serious efforts on oxidation prevention of boron
carbide at high temperatures and improvement of
thermal properties have not been attempted. It may be
worthwhile to investigate composites with silicides and
RE borides. With excellent dielectric properties, thermal
and chemical stability, and erosion resistance in high
intensity laser beams, BNB4C composite materials
could find a unique place for high temperature applications.306 From the point of view of application, boron
carbide has established as the material for abrasive
applications, neutron absorber and armour material. Its
use in electronic industry and high temperature applications will see a higher growth in the coming years.
A recent study regarding road map for advanced
ceramics provides guide lines for future investments.307
1. Development of innovative process technologies to
transfer new knowledge on functional and structural
properties into ceramic materials and devices.
34
2010
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References
1. F. Thevenot: Boron carbide a comprehensive review, J. Eur.
Ceram. Soc., 1990, 6, 205225.
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