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Abstract
The elasto-plastic large deformation taking place in ultrasonic wire bonding is analysed by means of 2-D and 3-D
nite element method. A special focus has been placed on how the important wire bonding parameters, such as bond
force and power, aect the contact pressure along the wire-bond pad interface. It is shown that the contact interface had
a long elliptical shape, and the maximum contact pressure occurred always at the periphery of the contact interface,
which is consistent in the current 2-D and 3-D nite element analyses. The normalised real contact area as well as
the maximum frictional energy intensity varied in a similar manner to the contact pressure, with the maximum values
occurring at the periphery of contact interface, where weld is preferentially formed in practical wire bonding. A higher
bond force does not result in a higher contact pressure, or higher frictional energy intensity, suggesting that a high bond
force is not directly correlated to better wire bondability.
2005 Elsevier Ltd. All rights reserved.
Keywords: Ultrasonic wire bonding; Wire bondability; Finite element method; Contact pressure; Frictional energy intensity
1. Introduction
Wire bonding is by far the most popular rstlevel interconnection technology used between
*
0167-6636/$ - see front matter 2005 Elsevier Ltd. All rights reserved.
doi:10.1016/j.mechmat.2005.05.007
12
20,352 brick elements and 24,551 nodes. This ensures sucient resolution and thus accuracy of
the results while maintaining a reasonable time
needed for computation. The model consisted of
a wedge tool, wire, bond pad and substrate. The
wedge tool was assumed to be a rigid body because
it is usually made of titanium carbide, which is
much harder than the Au wire. The Au wire had
a cylindrical shape of radius 25.4 lm. The bond
pad had a layered structure consisting of Au, Ni
and Cu layers and was electrolytically plated on
the FR-4 substrate that was made from glass woven fabric reinforced epoxy laminates. The dimensions and material properties of these components
are presented in Fig. 2 and Table 1 (Callister, 2003;
ASM International Handbook Committee, 1990).
The wire bonding process is carried out at 25 C
in this study. When the Au wire was being pressed
by the wedge tool toward the bond pad, there exists two contact interfaces, one between the wire
and bond pad, the other between the wire and
wedge. A typical bond forcetime history of ultrasonic wire bonding is shown in Fig. 3 (Harman,
1997; Ikeda et al., 1999), where the applied force
increases linearly in the rst few ms (Step 1), followed by a constant force for the rest of wire
bonding (Step 2). The rst step takes place only
for a very short period of time, say about 1 ms
(Ikeda et al., 1999), whereas the second step takes
up the most time of wire bonding. During the rst
step, the wire undergoes large elasto-plastic deformation under the applied force and the interface is
energy were calculated to interpret the experimental results of wire bondability. However, the nonuniform stress distribution which in turn forms
the bond along the periphery, have not been specically studied. The non-uniform stress distributions at the interface may cause non-uniform
contact pressure, uneven real contact area and frictional energy intensity, all of which aect the
bondability.
With the above ndings in mind, the objectives
of this paper are (i) to develop a 3-D and a precise
2-D models to simulate the ultrasonic wire bonding, and (ii) to investigate the bonding mechanisms
in terms of contact pressure, real contact area and
frictional energy intensity generating at the wirebond pad interface. Elasto-plastic large deformation contact analyses are performed based on the
FEM.
Load
bond wedge
l = 51um
R
13
R = 15um
Wire
Pad
Substrate
14
Table 1
Material properties used in the present analyses (Ikeda et al., 1999; Callister, 2003; ASM International Handbook Committee, 1990)
Material
Poissons ratio
Au
Ni
Cu
68.6
207
115
0.44
0.31
0.308
Eq. (1)
32.7
Bond Force
(Newton)
Ultrasound application
Fb
Bond Time
(msec)
0
Step 1
20
Step 2
15
Table 2
Material properties of FR-4 substrate (Yao and Qu, 1999)
E1 (GPa)
E2 (GPa)
E3 (GPa)
G12 (GPa)
G13 (GPa)
G23 (GPa)
m12
m32
m13
22.4
1.6
22.4
0.2
0.63
0.2
0.14
0.14
0.002
structure of the bond pad and their material properties were the same as those used in the 3-D model. A plane strain condition was assumed for the
cross-section of the structure.
3. Results and discussion
3.1. 3-D model
In the 3-D analysis, the bond force was increased linearly until it reached a plateau value,
Fb, which remained constant until the end of wire
bonding (Fig. 3). Fig. 5 shows the deformation
and von Mises stress distributions for bond forces
Fb = 0.1 and 0.2 N. At the low bond force of
0.1 N, the wire has just started to deform with high
stress concentrations taking place at the periphery
of the contact interface between the wedge and
wire, as well as between the wire and bond pad.
The minimum stress occurred in the central region
of contact interface, and there were hardly stresses
built up in the substrate underneath the bond pad.
When the bond force was increased to 0.2 N, the
stress concentrations occurred at the same contact
regions although the magnitudes of stress distribution generally increased.
The stress distributions are further studied in
more details with reference to Fig. 6, which plots
the contact pressure distribution over the whole
contact interface between the wire and bond pad
in dierent view directions. Fig. 6(a) presents a
3-D perspective view, whereas Fig. 6(b)(d) are
the 2-D views seen in the z, x and y axes, respectively. The wire-bond pad contact interface had a
long elliptical shape, with the contact width in
the lateral direction being larger in the central area
than at the wire ends (Fig. 6(b)). It is clearly seen
that the maximum contact pressure occurred at
the periphery of the contact interface, which is
consistent with the previous analysis as far as the
bond pad is suciently thick (Takahashi and
16
Fig. 5. Deformation and Mises stress (in 106 MPa) distributions at bond forces of (a) 0.1 N and (b) 0.2 N.
17
Fig. 6. Contact pressure distributions at a bond force of 0.2 N: (a) 3-D view; (b) top view; (c) view from the lateral direction and (d)
view from the wire longitudinal direction.
18
Fig. 7. SEM photographs of wedge wire bonds at dierent bond time: after (a) 0 ms, (b) 4 ms, (c) 7 ms and (d) 10 ms. After Harman
(1997).
contact region is not bonded, the maximum contact pressure at the perimeter is more important
than the average value. According to the observation that there were negligible changes in maximum contact pressure at bond forces above
0.07 N, a moderately high bond force was already
sucient to make wire bonds, and too high a bond
force is not necessarily benecial.
To verify the accuracy of 2-D model, the pressure distribution obtained from the 2-D FEM
analysis was compared with that obtained from
the 3-D FEM model. Two cross-sections at y = 0
and y = 17 lm were chosen in the 3-D model for
this purpose, representing the axis of symmetry
and the region with moderately high contact pressure, both within the main contact interface,
respectively. The contact pressures shown in
Fig. 11 indicates that the results obtained from
the 2-D and 3-D FEM analyses were almost identical in terms of both pressure distribution and
19
Fig. 8. Deformations in the wire and the corresponding contact pressure between the wire and bond pad at dierent bond forces.
14
12
bn (um)
10
8
6
4
2
0
0.00
0.05
0.10
0.15
0.20
20
determined from experiment (Tabor, 1959; Johnson, 1968). Eq. (2) was further modied (Lim
and Ashby, 1987; Ashby et al., 1991) to explain
the wear mechanisms assuming that the real contact area for plastic contact is given by
250
200
Max Contact Pressure
Average Contact Pressure
150
Ar
F
;
An F s
100
50
0
0.00
0.05
0.10
0.15
0.20
250
2-D model
3-D model at the cross-section of y=0
3-D model at the cross-section of y=17um
200
1 at l2 1=2
mx; y
100
50
0
4
x (um)
10
12
14
H0
H 0 An
1 at l2
1=2
150
DAr px; y
;
ps
DAn
where DAr and DAn are the micro real and micro
nominal contact areas at the point (x, y); and
p(x, y) is the corresponding contact pressure.
When p(x, y) > ps, m(x, y) becomes unity. For a
2-D analysis, m(x, y) can be simplied to m(x).
When H0 = 245 MPa (ASM International Handbook Committee, 1990) for the Au wire, l = 0.38
(Mayer et al., 2002), and the corresponding seizure
pressure, ps = 170 MPa.
The normalised real contact area, m(x, y) presented in Fig. 12 varied along the wire lateral
direction in a similar manner to the contact pressure shown in Fig. 8, except the very edge where
the normalised contact area consistently showed
a plateau constant for a length of 0.50.8 lm for
all bond forces studied. The plateau constant value
represents the most intimate real contact where
weld is most likely to be made. The maximum value of the normalised real contact area was almost
identical for all bond forces studied, which is consistent with the summary drawn from Fig. 10 in
that a high bond force does not necessarily mean
a large area of intimate contact. Fig. 13 summarises the real contact length, br, which increased
linearly with increasing the bond force.
1.0
0.8
0.8
m(x)
m(x)
0.6
0.4
0.2
0.6
0.4
0.2
0.0
0
10
12
0.0
14
x (um)
(a)
10
12
14
12
14
x (um)
(b)
1.0
1.0
0.8
0.8
m(x)
0.6
m(x)
21
0.4
0.6
0.4
0.2
0.2
0.0
0.0
0
10
12
14
10
x (um)
(d)
x (um)
(c)
Fig. 12. Normalised real contact area, m(x), along the wire lateral direction for dierent bond forces.
14
periphery of contact interface and the vast majority of central region remains unwelded, see Fig. 7
(Harman, 1997; Winchell and Berg, 1978). This
observation indicates that the local frictional energy intensity plays an important role in wire
bondabilty. Considering the non-uniform pressure
distribution at the contact interface, the frictional
energy intensity, Eif, in 3-D model is dened:
12
br (um)
10
8
6
4
2
0
0.00
Eif ulpx; y;
0.05
0.10
0.15
0.20
where u is the average speed due to the reciprocating motion in ultrasonic wire bonding. The average speed can be dened as u = 4bf, where b and
f refer the amplitude and frequency of vibration,
respectively. p(x, y) is the contact pressure that
can be obtained from the FEM analysis. For a
2-D model, p(x, y) can be simplied to p(x).
The friction energy intensities were calculated
for an ultrasonic frequency of 60 kHz and a vibration amplitude of 1 lm (Harman, 1997), which are
plotted for dierent bond forces as shown in
Fig. 14. The maximum frictional energy intensity
22
2 x105
1 x105
0
6
8
x (um)
10
12
4.0 x10
3.0 x10
2.0 x10
1.0 x10
0.0
14
4 x10
3 x10
2 x10
1 x10
6
8
x (um)
10
12
14
(b)
Friction energy intensity (J/m2)
(a)
6
8
x (um)
10
12
4 x10
3 x10
2 x10
1 x10
14
6
8
x (um)
10
12
14
(d)
(c)
Fig. 14. Variations of frictional energy intensity along the wire lateral direction for dierent bond forces.
An
Fig. 15 clearly shows that the total frictional energy increases linearly with bond force. It was
shown that while the total frictional energy increased consistently with bond force, the high frictional energy intensity obtained at the periphery of
contact interface did not show a similar increase.
Thus, it can be said that a high bond force is not
necessarily benecial for wire bondabilty. Instead,
too high a bond force may impair the eciency of
ultrasonic energy transfer and may cause cratering
failures (Harman, 1997). Besides the bond force,
2.5
2.0
1.5
1.0
0.5
0.0
0.00
0.05
0.10
0.15
0.20
23
entially made as shown by many experimental evidence. The total frictional energy
increased linearly with bond force, but the
high frictional energy intensity obtained at
the periphery of the contact interface did
not show a similar increase.
4. Conclusions
Acknowledgements
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