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JEDEC

STANDARD

Wire Bond Shear Test Method

JESD22-B116A
(Revision of JESD22-B116, July 1998)

AUGUST 2009

JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

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JEDEC Standards No. 22-B116A


Page 1

TEST METHOD B116A


WIRE BOND SHEAR TEST
(From JEDEC Board Ballot JCB-09-62, formulated under the cognizance of the JC-14.1 Subcommittee
on Reliability Test Methods for Packaged Devices.)

Scope

This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an
aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on preencapsulation or post-encapsulation parts. This measure of bond strength is extremely important in
determining two features:
1) the integrity of the metallurgical bond which has been formed.
2) the quality of gold and aluminum wire bonds to die or package bonding surfaces.
These test methods cover ball bonds made with small diameter (from 18 to 76 m, or from 0.7 to 3 mil) wire
and wedge bonds made with larger diameter (minimum of 3 mil) wire, of the type used in integrated circuits
and hybrid microelectronic assemblies.
These test methods can be used only when the ball height (at least 10.16 m or 0.4 mil) and diameter for ball
bonds, or the wire height (at least 1.25 mils in height at the compressed bonded area) of the wedge bond, are
large enough and adjacent interfering structures are far enough away to allow suitable placement and
clearance (above the bonding pad or leadframe post and between adjacent bonds) of the shear test chisel.
This test method may also apply to gold wedge or stitch bonds if the wire is thick enough to allow shearing
of the wire from the bonding surface without smearing similar to a shearing skip.
The wire bond shear test is destructive. It is appropriate for use in process development, process control
and/or quality assurance.

Terms and definitions

For the purposes of this standard, the following terms and definitions apply:
2.1 ball bond: The adhesion or welding of a thin wire, usually gold, to a die pad metallization, usually an
aluminum alloy, using a thermosonic wire bond process.
NOTE The ball bond includes the enlarged spherical, or nail-head, portion of the wire (provided by the flame-off and
first bonding operation in the thermal compression and thermosonic process, or both), the underlying bonding pad and
the ball bond-bonding pad intermetallic weld interface.

2.2 bond footprint (of a wedge bond): The area of the wire that has a physical bond interface (intermetallic
or recrystallized) with respect to the compressed area of the wire.

Test Method B116A


Revision of Test Method B116

JEDEC Standards No. 22-B116A


Page 2

Terms and definitions (contd)

2.3 bonding surface: Either 1) the die pad metallization or 2) the package surface metallization to which
the wire is ball-, wedge-, or stitch-bonded.
2.4 bond shear: A process in which an instrument uses a chisel-shaped tool to shear or push a ball or wedge
bond off the bond pad (see Figure 1).
NOTE The force required to cause this separation is recorded and is referred to as the bond shear force. The bond
shear force of a gold ball bond, when correlated to the diameter of the ball bond, is an indicator of the quality of the
metallurgical bond between the gold ball bond and the bond pad metallization. The bond shear force of an aluminum
wedge bond, when compared to the manufacturer's tensile strength of the wire, is an indicator of the integrity of the
weld between the aluminum wire and the bond pad or package surface metallization.

Figure 1 Bond shear set-up


2.5 bond shear codes for ball and wedge bonds (see Figure 2)
2.5.1 Type 1 - bond lift: A separation of the entire wire bond from the bonding surface with only an imprint
being left on the bonding surface and very little evidence of intermetallic formation or welding or of
disturbance of the bonding surface metallization.
NOTE A bond lift may require an assessment of the bonder settings.

2.5.2 Type 2 - bond shear: A separation of the wire bond where 1) a thin layer of the bonding surface
metallization remains with the wire bond and an impression is left in the bonding surface, 2) intermetallics
remain on the bonding surface and with the wire bond, or 3) a major portion of the wire bond remains on the
bonding surface.

Test Method B116A


Revision of Test Method B116

JEDEC Standards No. 22-B116A


Page 3

Terms and definitions (contd)

2.5 bond shear codes for ball and wedge bonds (see Figure 2) (contd)
2.5.3 Type 3 cratering: A condition under the die pad metallization in which the insulating layer (oxide
or interlayer dielectric) and the bulk material (silicon) separate or chip out.
NOTE 1 Separation interfaces that show pits or depressions in the insulating layer (not extending into the bulk) are
not considered craters.
NOTE 2 Cratering can be caused by several factors including the wire bonding operation, the post-bonding
processing, and even the act of shear testing itself.
NOTE 3 Cratering present prior to the shear test operation denotes a pre-existing condition that must be addressed.
Any bonds with preexisting cratering are invalid for this test method and shall not be included with the shear data.

2.5.4 Type 4 - arm contacts specimen (bonding surface contact): The shear tool contacts the bonding
surface to produce an invalid shear value.
NOTE This condition may be due to improper placement of the specimen, a low shear height, or instrument
malfunction. This bond shear type is an invalid result and shall be eliminated from the shear data.

2.5.5 Type 5 - shearing skip: The shear tool removes only the topmost portion of the ball or wedge bond.
NOTE This condition may be due to improper placement of the specimen, a high shear height or instrument
malfunction. This bond shear type is an invalid result and shall be eliminated from the shear data.

2.5.6 Type 6 - bond pad (or bonding surface) lift: A separation between the bonding surface metallization
and the underlying substrate or base material with evidence of bonding surface metallization remaining
attached to the ball or wedge bond.

Test Method B116A


Revision of Test Method B116

JEDEC Standards No. 22-B116A


Page 4

Terms and Definitions (contd)

2.5 Definition of Bond Shear Codes for Ball and Wedge Bonds (see Figure 2) (contd)

Wire bond separated from bonding


surface. Little or NO intermetallic
on bonding surface.

Major portion of wire bond


attached to wire.
Ball or Wedge bonding
weld area intact.

Bonding surface
intact.

TYPE 1: Bond Lift

TYPE 2: Bond Shear - Gold/Aluminum

Residual bonding surface and


substrate (bulk) material
attached to wire bond.
Bonding surface lifted taking
portion of substrate (bulk)
material.

Arm contacted bonding


surface metallization
instead of wire bond.
Bonding surface separated
from die surface.

TYPE 3: Cratering

Minor portion of wire bond


attached to wire.
Wire bond sheared too
high. Only portion of
wire bond removed.

TYPE 5: Shearing Skip

TYPE 4: Bonding Surface Contact


Underlying bonding pad, and
the ball bond-bonding pad
intermetallic weld interface
Bonding surface metallization
separated from die surface.

TYPE 6: Bonding Surface Lift

Figure 2 Bond Shear Codes


Examples shown here are for ball bonds. These same modes also apply to wedge [stitch] bonds.
Test Method B116A
Revision of Test Method B116

JEDEC Standards No. 22-B116A


Page 5

Terms and Definitions (contd)

2.6 shear tool; shear arm: A tungsten carbide, or equivalent, chisel with specific angles on the bottom and
back of the tool to ensure a shearing action.
2.7 wedge bond; stitch bond: The adhesion or weld of a thin wire, usually aluminum, to a package
bonding surface, usually a plated leadframe post or finger, using an ultrasonic wire bonding process.
NOTE The wedge bond includes the compressed (ultrasonically bonded) area of the wire and the underlying bonding
surface. For bonding to an aluminum alloy die bond pad, there is no wedge bond-bond pad intermetallic because the
two materials are of the same composition, but the two materials are recrystallized together by the ultrasonic energy of
the welding process.

Apparatus and material

The apparatus and materials required for bond shear shall be as follows:
3.1

Inspection Equipment

An optical microscope system or scanning electron microscope providing a minimum of 70X magnification.
3.2

Measurement Equipment

An optical microscope/measurement system capable of measuring the bond diameter to within 0.0001 inch
(0.1 mil).
3.3

Workholder

Fixture used to hold the part being tested parallel to the shearing plane and perpendicular to the shear tool.
The fixture shall also eliminate part movement during bond shear testing. If using a caliper controlled
workholder, place the holder so that the shear motion is against the positive stop of the caliper. This is to
ensure that the recoil movement of the caliper controlled workholder does not influence the bond shear test.
3.4

Bond Shear Equipment

The bond shear equipment must be capable of precision placement of the shearing tool (2.54m or 0.10
mil) above the substrate. The specified distance (h) above the topmost part of the bonding surface shall
ensure the shear tool does not contact the surface of the die and shall be less than the distance from the
topmost part of the bonding surface to the center line (CL) of the ball or wedge bond.
3.5

Bond Shear Tool

Required shear tool parameters include but are not limited to: flat shear face, sharp shearing edge, shearing
width of a minimum of 1.2X the bond diameter, or bond length. The shearing tool should be designed so as
to prevent ploughing and drag during testing. The tool should be clean and free of chips or other defects that
will interfere with the shearing test.

Test Method B116A


Revision of Test Method B116

JEDEC Standards No. 22-B116A


Page 6

Procedure

4.1

Calibration

Before performing the bond shear test, it must be determined that the equipment has been calibrated in
accordance with manufacturer's specifications and is presently in calibration. Recalibration is required if the
equipment is moved to another location.
4.2

Visual Examination of Bonds to be Tested After Decapsulation

If performing bond shear testing on a part which has been opened using wet chemical and/or dry etch
techniques, the bond pads shall be examined to ensure there is no absence of metallization on the bonding
surface area due to chemical etching, and wire bonds are attached to the bonding surface. Those ball or
wedge bonds on bond pads with significant chemical attack or absence of metallization shall not be used for
ball shear testing. It is possible that wire bonds on bonding surfaces without degradation from chemical
attack may not be attached to the bonding surface due to other causes (e.g., package stress). These wire
bonds are considered valid and shall be included in the shear data as a zero (0) gram value. Bonds must also
be examined to determine if adjacent interfering structures are far enough away to allow suitable placement
and clearance (above the bonding surface and between adjacent bonds) for the shear test tool.
4.3

Sample Sizes

Sample sizes shall be a minimum specified by SPC controls in effect for specific processes, or as specified in
the applicable procurement document
4.4

Measurement of the Ball Bond Diameter to Determine the Ball Bond Shear Failure Criteria

Once the bonding surfaces have been examined and before performing bond shear testing, the diameter of all
ball bonds to be tested shall be measured and recorded. For asymmetrical bonds, determine the average
using both the largest (dlarge) and the smallest (dsmall) diameter values (see Figure 3). These ball bond
diameter measurements shall be used to determine the mean, or average, diameter value. The resulting
mean, or average, ball bond diameter shall then be used to establish the failure criteria as defined in Figure 4
and Table 1. If process monitor data has established the nominal ball bond diameter, then that value may be
used to determine the failure criteria as defined in Figure 4 and Table 1.

Test Method B116A


Revision of Test Method B116

JEDEC Standards No. 22-B116A


Page 7

Procedure (contd)

4.4

Measurement of the Ball Bond Diameter to Determine the Ball Bond Shear Failure Criteria
(contd)

SYMMETRICAL

ASYMMETRICAL

Figure 3 Ball bond measurement (symmetrical vs. asymmetrical)

MINIMUM SHEAR VALUES


110

SHEAR STRENGTH (grams)

100
90

Minimum Sample Average


Minimum Individual Shear Reading

80
70
60
50
40
30

20
10
0
1.75

2.0

2.25 2.5

2.75

3.0

3.25

3.5

3.75

4.0

4.25

4.5

4.75

5.0

5.25

BALL BOND DIAMETER (mils)


Figure 4 Minimum recommended individual and average ball bond shear values
(see Table 1 for exact bond shear values)
Test Method B116A
Revision of Test Method B116

JEDEC Standards No. 22-B116A


Page 8

Procedure (contd)
Table 1 Minimum recommended individual and sample average ball bond shear values

NOTE

Diameter
(mils)
2.0

Minimum Shear Average


(grams)

Minimum Individual Shear Reading


(grams)

12.6

5.7

2.1

14.0

6.8

2.2

15.5

8.1

2.3

17.1

9.5

2.4

18.8

10.9

2.5

20.6

12.4

2.6

22.4

14.0

2.7

24.4

15.6

2.8

26.5

17.4

2.9

28.6

19.2

3.0

30.8

21.1

3.1

33.2

23.1

3.2

35.6

25.1

3.3

38.1

27.2

3.4

40.7

29.4

3.5

43.4

31.7

3.6

46.2

34.1

3.7

49.1

36.5

3.8

52.1

39.1

3.9

55.2

41.7

4.0

58.3

44.3

4.1

61.6

47.1

4.2

65.0

50.0

4.3

68.4

52.9

4.4

71.9

55.8

4.5

75.6

59.0

4.6

79.3

62.1

4.7

83.1

65.3

4.8

87.0

68.6

4.9

91.0

72.0

5.0

95.1

75.5

These shear values are applicable to gold wire ball bonds on aluminum alloy bonding surfaces

Test Method B116A


Revision of Test Method B116

JEDEC Standards No. 22-B116A


Page 9

Procedure (contd)

4.

Performing the Bond Shear Test

The bond shear equipment shall pass all self diagnostic tests before beginning the test. The bond shear
equipment and test area shall be free of excessive vibration or movement. Examine the shear tool to
verify it is in good condition and is not bent or damaged. Check the shear tool to verify it is in the up
position.
Adjust the workholder to match the part being tested. Secure the part to the workholder. Make sure the
surface of the die is parallel to the shearing plane of the shear tool. It is important that the shear tool does
not contact the surface of the die or adjacent structures during the shearing operation as this will give
incorrect high readings.
Position the part so that the bond to be tested is located adjacent to the shear tool. Lower the shear tool,
or raise the part depending upon shear equipment used, to approximately the surface from which the bond
is to be sheared but not contacting the surface (approximately the thickness of the bond above the
surface).
Position the ball bond to be tested so that the shear motion will travel perpendicular to the surface edge.
Position the wedge bond to be tested so that the shear motion will travel toward the long side of the
wedge bond and is free of any interference (i.e. shear the outside bond first and then shear toward the
sheared wedge bond). Position the shear tool within approximately one ball (for ball bonds) or wire
diameter (for wedge/stitch bonds) of the bond to be shear tested and shear the bond.
4.6

Examination of Sheared Bonds

All bonds shall be sheared in a planned/defined sequence so that later visual examination can determine
which shear values should be eliminated because of an improper shear. The bonds shall be examined
using at least 70X magnification to determine if the shear tool skipped over the bond (type 5) or the tool
scraped or plowed into the surface of the die (type 4). Type 4 and 5 defective shear conditions are invalid,
and shall be eliminated from the shear data (see Figure 2).
Sheared bonds in which a type 3 cratering condition has occurred shall be investigated further to
determine whether the cracking and/or cratering is due to the bonding process or the act of shear testing.
Cratering caused prior to the shear test operation is invalid and shall be eliminated from the shear data.
Cratering resulting from the act of shear testing shall be considered valid and included in the shear data.
4.7

Footprint Inspection of Aluminum Wedge Bonds

All wire bonding processes to both the die bond pad and the leadframe post shall have a bond footprint
inspection performed. For wires too small for bond shear testing (less than 1.25 mils in height at the
compressed bonded area), the wire shall be removed at the bond location using a small sharp blade. The
removal of the wire shall be sufficient such that the bond interface can be visually inspected and the
metallurgical bond area determined. For larger wires after bond shear testing, all devices shall be
inspected to examine the failure mode and to determine the bond footprint coverage.

Test Method B116A


Revision of Test Method B116

JEDEC Standards No. 22-B116A


Page 10

Procedure (contd)

4.8

Bond Shear Data

Data shall be maintained for each bond sheared. The data shall identify the bond (location, bond
diameter, wire material, method of bonding, and material bonded to), the shear strength, and the shear
code number.
4.9

Shear Codes

For each bond sheared, a code as defined in Figure 2 shall be recorded.

Failure criteria

The following failure criteria are not valid for devices that have undergone environmental stress testing, have been
desoldered from circuit boards, or were preconditioned prior to decapsulation (if procurement or qualification
documents required that the samples be preconditioned prior to the performing of this test method).

5.1

Failure Criteria for Ball Bonds

The recommended minimum individual and sample average bond shear values are shown in Figure 4 and
Table 1. These criteria are applicable to gold wire ball bonds on aluminum alloy bond pads. Other
material combinations may require a new set of failure criteria.
Alternate minimum bond shear values may be proposed by the supplier if supporting data justifies the
proposed minimum values.
5.2

Failure Criteria for Aluminum Wedge Bonds

The wedge bonds on a part shall be considered acceptable if the minimum shear values are equal to or
greater than the manufacturer's tensile strength of the bond wire.
In addition, the percent of the bond footprint in which bonding should occur shall be no less than 50%. If
it is necessary to control the wire bonding process using SPC for percent coverage, a Cpk value can be
calculated to this limit.

Summary

The quality level and test conditions are contained within this document unless otherwise specified in the
applicable Part Specification and/or Part Drawing.

Test Method B116A


Revision of Test Method B116

JEDEC Standards No. 22-B116A


Page 11

Annex A (informative) Differences between JESD22-B116A and JESD22-B116


This table briefly describes most of the changes made to entries that appear in this standard,
JESD22-B116A, compared to its predecessor, JESD22-B116 (July 1998). If the change to a concept
involves any words added or deleted (excluding deletion of accidentally repeated words), it is included.
Some punctuation changes are not included.
Page-Clause

Description of change

1-2

Added definition for the term bond footprint renumbered remaining clauses, editorial
changes to all definitions to meet JEDEC Style Manual.
Added note to state that a type 1 shear may require evaluation of bonder settings
Changed reference to pre-existing bond crater into a note
Changed terminology from unacceptable to invalid for shear types that should not be
included in shear test results
Added text to figure 6 that was omitted in original release of standard. Text was
incorrectly added to end of clause 2.6
Added definition for Bond Footprint
Corrected errors in Figure 3
Changed terminology from unacceptable to invalid for shear types that should not be
included in shear test results
Added statement regarding preconditioning of samples prior to performing this test
method

2-2
3-2
3-2
4-2
5-2
7-4
9-4
10 - 5

Test Method B116A


Revision of Test Method B116

JEDEC Standards No. 22-B116A


Page 12

Test Method B116A


Revision of Test Method B116

Standard Improvement Form

JEDEC JEDS22B116A

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