Beruflich Dokumente
Kultur Dokumente
General Description
Applications
Switch Mode Power Supplies
Pulse Transformer Drive
Line Drivers
Package Types(1)
8-Pin PDIP TC4423 TC4424 TC4425
NC
IN A
GND
IN B
2 TC4423 7
3 TC4424 6
4 TC4425 5
8-Pin DFN
NC
IN A 2
GND
IN B 4
TC4423
TC4424
TC4425
NC
OUT A
VDD
OUT B
NC
OUT A
VDD
OUT B
NC
OUT A
VDD
OUT B
NC
NC
NC
OUT A
OUT A
OUT A
VDD
VDD
VDD
OUT B
OUT B
OUT B
16
2
3
15
4
5
6
7
8
TC4423
TC4424
TC4425
14
13
12
11
10
9
NC
OUT A
OUT A
VDD
VDD
OUT B
OUT B
NC
NC
OUT A
OUT A
VDD
VDD
OUT B
OUT B
NC
NC
OUT A
OUT A
VDD
VDD
OUT B
OUT B
NC
DS21421E-page 1
TC4423/TC4424/TC4425
Functional Block Diagram(1)
VDD
Inverting
750 A
300 mV
Output
Non-inverting
Input
Effective
Input C = 20 pF
(Each Input)
GND
4.7V
DS21421E-page 2
TC4423/TC4424/TC4425
1.0
ELECTRICAL
CHARACTERISTICS
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, TA = +25C, with 4.5V VDD18V.
Parameters
Sym
Min
Typ
Max
Units
VIH
2.4
VIL
0.8
Input Current
IIN
VOH
VDD 0.025
Conditions
Input
0VVINVDD
Output
High Output Voltage
Low Output Voltage
VOL
0.025
ROH
2.8
ROL
3.5
IPK
IREV
>1.5
Rise Time
tR
23
35
ns
Fall Time
tF
25
35
ns
Delay Time
tD1
33
75
ns
Delay Time
tD2
38
75
ns
IS
1.5
0.15
2.5
0.25
mA
Power Supply
Power Supply Current
Note 1:
2:
DS21421E-page 3
TC4423/TC4424/TC4425
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V VDD18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
VIH
2.4
VIL
0.8
Input Current
IIN
10
+10
VOH
VDD 0.025
VOL
0.025
ROH
3.7
ROL
4.3
IPK
3.0
Latch-Up Protection
Withstand Reverse Current
IREV
>1.5
Rise Time
tR
28
60
ns
Fall Time
tF
32
60
ns
Delay Time
tD1
32
100
ns
Delay Time
tD2
38
100
ns
IS
2.0
0.2
3.5
0.3
mA
Input
0VVINVDD
Output
Power Supply
Power Supply Current
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range (C)
TA
+70
TA
40
+85
TA
40
+125
TJ
+150
TA
65
+150
JA
33.2
C/W
JA
125
C/W
JA
155
C/W
DS21421E-page 4
TC4423/TC4424/TC4425
2.0
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
100
100
4700 pF
4700 pF
80
tFALL (nsec)
tRISE (nsec)
80
3300 pF
60
2200 pF
40
1500 pF
1000 pF
20
470 pF
0
2200 pF
40
1500 pF
1000 pF
20
470 pF
0
FIGURE 2-1:
Voltage.
10
12
VDD (V)
14
16
18
10
12
VDD (V)
FIGURE 2-4:
Voltage.
5V
tFALL (nsec)
60
10V
15V
40
18
5V
60
10V
15V
40
20
20
0
100
1000
0
100
10,000
1000
CLOAD (pF)
CLOAD (pF)
FIGURE 2-2:
Load.
FIGURE 2-5:
Load.
32
10,000
100
CLOAD = 2200 pF
tRISE
tRISE
26
24
CLOAD = 2200 pF
VDD = 10V
tFALL
28
Time (nsec)
16
80
80
30
14
100
100
tRISE (nsec)
3300 pF
60
tD1
80
60
40
22
tFALL
20
18
-55
-35
FIGURE 2-3:
Temperature.
-15
tD2
20
25 45
TA (C)
65
85
105 125
FIGURE 2-6:
Amplitude.
5 6 7
Input (V)
10 11 12
DS21421E-page 5
TC4423/TC4424/TC4425
Typical Performance Curves (Continued)
50
50
CLOAD = 2200 pF
CLOAD = 2200 pF
45
tD2
Delay Time (nsec)
45
40
35
tD2
30
tD1
40
35
tD1
30
25
25
20
-55
20
4
FIGURE 2-7:
Supply Voltage.
10
12
VDD (V)
14
16
18
-35
-15
FIGURE 2-10:
Temperature.
25 45
TA (C)
65
85
105 125
1.4
TA = 25C
Both Inputs = 1
1.2
IQUIESCENT (mA)
IQUIESCENT (mA)
Both Inputs = 0
0.1
1.0
0.8
Both Inputs = 1
0.6
0.4
0.2
0.01
4
FIGURE 2-8:
Supply Voltage.
10
12
VDD (V)
14
16
18
-35
FIGURE 2-11:
Temperature.
14
-15
25 45
TA (C)
65
85
105 125
14
12
12
Worst Case
@ TJ = +150C
10
RDS(ON) ()
RDS(ON) ()
Both Inputs = 0
0.0
-55
8
6
Typical @
TA = +25C
Worst Case
@ TJ = +150C
10
8
6
Typical @
TA = +25C
2
4
10
12
VDD (V)
14
16
FIGURE 2-9:
Output Resistance
(Output High) vs. Supply Voltage.
DS21421E-page 6
18
10
12
VDD (V)
14
16
18
FIGURE 2-12:
Output Resistance
(Output Low) vs. Supply Voltage.
TC4423/TC4424/TC4425
Typical Performance Curves (Continued)
Note: Load on single output only
60
60
VDD = 18V
VDD = 18V
50
3300 pF
50
1000 pF
ISUPPLY (mA)
ISUPPLY (mA)
634 kHz
40
30
355 kHz
20
200 kHz
40
30
10,000 pF
20
100 pF
63.4 kHz
10 112.5 kHz
35.5 kHz
10
20 kHz
0
100
FIGURE 2-13:
Capacitive Load.
1000
CLOAD (pF)
10,000
1.125 MHz
40
200 kHz
634 kHz
355 kHz
0
100
FIGURE 2-14:
Capacitive Load.
1000
CLOAD (pF)
60
50
40
30
10
0
10,000
10
FIGURE 2-17:
Frequency.
120
100
Frequency (kHz)
1000
120
VDD = 6V
4700 pF
VDD = 6V
100
100
80
1.125 MHz
60
3.55 MHz
634 kHz
40
2 MHz
FIGURE 2-15:
Capacitive Load.
10,000 pF
80
2200 pF
60
1000 pF
40
100 pF
355 kHz
20
0
100
ISUPPLY (mA)
ISUPPLY (mA)
100 pF
10,000 pF
20
112.5 kHz
63.4 kHz
20 kHz
10
3300 pF
1000 pF
70
50
20
VDD = 12V
80
2 MHz
60
30
1000
90
VDD = 12V
ISUPPLY (mA)
ISUPPLY (mA)
70
100
Frequency (kHz)
FIGURE 2-16:
Frequency.
90
80
10
20
112.5 kHz
20 kHz
1000
CLOAD (pF)
10,000
0
10
FIGURE 2-18:
Frequency.
100
Frequency (kHz)
1000
DS21421E-page 7
TC4423/TC4424/TC4425
Typical Performance Curves (Continued)
10-7
8
6
4
A sec
2
10-8
8
6
4
2
10-9
10
12
14
16
18
VIN (V)
Note:
FIGURE 2-19:
DS21421E-page 8
TC4423/TC4424/TC4425
3.0
PIN DESCRIPTIONS
TABLE 3-1:
8-Pin PDIP
8-Pin
DFN
16-Pin
SOIC
(Wide)
NC
No connection
IN A
Input A
NC
GND
GND
NC
Description
No connection
Ground
Ground
No connection
IN B
Input B
NC
No connection
NC
10
OUT B
11
OUT B
12
VDD
13
VDD
14
OUT A
15
OUT A
16
NC
No connection
PAD
NC
Note 1:
3.1
Symbol
No connection
Output B
Output B
Supply input
Supply input
Output A
Output A
Inputs A and B
3.4
Ground (GND)
3.2
3.5
Outputs A and B
3.3
VDD is the bias supply input for the MOSFET driver and
has a voltage range of 4.5V to 18V. This input must be
decoupled to ground with a local ceramic capacitor.
This bypass capacitor provides a localized lowimpedance path for the peak currents that are to be
provided to the load.
DS21421E-page 9
TC4423/TC4424/TC4425
4.0
APPLICATIONS INFORMATION
VDD = 18V
VDD = 18V
1 F
WIMA
MKS-2
Input
1 F
WIMA
MKS-2
0.1 F
Ceramic
Output
CL = 1800 pF
1
2
Input
TC4424
(1/2 TC4425)
90%
Input
0V
Output
CL = 1800 pF
1
2
TC4423
(1/2 TC4425)
0.1 F
Ceramic
90%
Input
10%
18V
tD1
tF
tD2
0V
tR
90%
90%
Output
0V
FIGURE 4-1:
Time.
DS21421E-page 10
10%
18V
tD1 90%
Output
10%
10%
0V
FIGURE 4-2:
Switching Time.
10%
tR
90%
tD2
tF
10%
Non-inverting Driver
TC4423/TC4424/TC4425
5.0
PACKAGING INFORMATION
5.1
Example:
XXXXXXX
XXXXXXX
XXYYWW
NNN
TC4423
EMF
0420
256
TC4423
CPA256
0420
XXXXXXXXXXX
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
Note:
Example:
Example:
TC4423COE
0420256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week 01)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS21421E-page 11
TC4423/TC4424/TC4425
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) Saw Singulated
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
DS21421E-page 12
TC4423/TC4424/TC4425
8-Lead Plastic Dual In-line (P) 300 mil (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
n
A2
A1
B1
p
eB
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
L
c
B1
B
eB
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21421E-page 13
TC4423/TC4424/TC4425
16-Lead Plastic Small Outline (SO) Wide, 300 mil (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
p
E1
2
1
n
B
h
45
c
A2
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
h
L
c
B
MIN
.093
.088
.004
.394
.291
.398
.010
.016
0
.009
.014
0
0
A1
INCHES*
NOM
16
.050
.099
.091
.008
.407
.295
.406
.020
.033
4
.011
.017
12
12
MAX
.104
.094
.012
.420
.299
.413
.029
.050
8
.013
.020
15
15
MILLIMETERS
NOM
16
1.27
2.36
2.50
2.24
2.31
0.10
0.20
10.01
10.34
7.39
7.49
10.10
10.30
0.25
0.50
0.41
0.84
0
4
0.23
0.28
0.36
0.42
0
12
0
12
MIN
MAX
2.64
2.39
0.30
10.67
7.59
10.49
0.74
1.27
8
0.33
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-102
DS21421E-page 14
TC4423/TC4424/TC4425
6.0
REVISION HISTORY
DS21421E-page 15
TC4423/TC4424/TC4425
DS21421E-page 16
TC4423/TC4424/TC4425
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
Temperature
Range
XX
XXX
Package
PB Free
Examples:
a)
TC4423COE:
3A Dual Inverting
MOSFET Driver,
0C to +70C,
16LD SOIC package.
Device:
TC4423:
TC4424:
TC4425:
b)
C
E
V
c)
TC4423CPA:
3A Dual Inverting
MOSFET Driver,
0C to +70C,
8LD PDIP package.
Temperature Range:
=
=
=
TC4423VMF:
3A Dual Inverting
MOSFET Driver,
-40C to +125C,
8LD DFN package.
Package:
MF
= Dual, Flat, No-Lead (6x5 mm Body), 8-lead
MF713 = Dual, Flat, No-Lead (6x5 mm Body), 8-lead
(Tape and Reel)
OE
= SOIC (Wide), 16-pin
OE713 = SOIC (Wide), 16-pin (Tape and Reel)
PA
= Plastic DIP, (300 mil body), 8-lead
a)
3A Dual Non-Inverting,
MOSFET Driver,
0C to +70C,
16LD SOIC package,
Tape and Reel.
b)
PB Free:
TC4424COE713:
TC4424EPA:
= Lead-Free device *
= Blank
3A Dual Non-Inverting,
MOSFET Driver,
-40C to +85C,
8LD PDIP package.
a)
TC4425EOE:
3A Dual Complementary,
MOSFET Driver,
-40C to +85C,
16LD SOIC package.
b)
TC4425CPA:
3A Dual Complementary,
MOSFET Driver,
0C to +70C,
PDIP package.
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21421E-page 17
TC4423/TC4424/TC4425
NOTES:
DS21421E-page 18
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767962
== ISO/TS 16949 ==
2002-2012 Microchip Technology Inc.
DS21421E-page 19
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
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Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21421E-page 20
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
11/27/12