American Institute on Manufacturing Integrated Photonics

AIM Photonics
John Bowers
Associate Director, AIM Photonics
Director, Institute for Energy Efficiency
University of California, Santa Barbara
http://optoelectronics.ece.ucsb.edu/
bowers@ece.ucsb.edu
Rod Alferness, Daniel Blumenthal, John Bowers, Jim Buckwalter, Tim Cheng, Larry Coldren,
Nadir Dagli, Art Gossard, Jon Klamkin, Carl Meinhart, Chris Palmstrom, Mark Rodwell,
Clint Schow, Jon Schuler, Luke Theogarajan, Yuan Xie

IEE Seminar Series

Mike Davenport, Jared Hulme, Tin Komljenovic, Alan Liu, Jon Peters,
Daryl Spencer, Eric Stanton, Alex Spot, Sudha Srinivasan, Chong Zhang

Integrated Photonics InsItute

Post-Announcement Kick-o MeeIng
July 28, 2015

Ins$tutes for
Manufacturing Innova$on
The Na$onal Landscape

Robert S. Sco, Frost
Manufacturing Technology Oce
Oce of the Deputy Assistant
Secretary of Defense for
Manufacturing and Industrial
Base Policy (ODASD/MIBP)
U.S. Department of Defense

Impetus for the

NaIonal Network for Manufacturing
InnovaIon (NNMI) IniIaIve

U.S. Trade Balance of Advanced Technology

Swung to historic decit, lost 1/3rd of workforce

U.S. Trade Balance for Advanced Technology

Manufacturing Products ($ Billions)

11% of U.S. GDP, 12 million U.S. jobs

~ half of U.S. Exports
Nearly 20% of the worlds manufactured value added

Products invented here, now made elsewhere

labor cost o[en not the predominant factor

The AdministraIons Early Focus on the

U.S. Manufacturing Sector
I want us all to think about
new and crea$ve ways to
engage young people in science
and engineering

encourage young people to

create, build, and invent

to be makers of things, not just

consumers of things"

President Obama - 2009 NaIonal Academy

6
of Sciences Annual MeeIng

The Scale-up Gap or Missing Middle

Common terms
The valley of death
The missing Bell Labs
The industrial commons

Manufacturing Readiness Level

Basic R&D

Commercialization

2012 PresidenIal AcIons

to Establish a Network of InsItutes
Sparking this network
of innova?on across the
country, it willkeep
America leading in
manufacturing"
President Obama, March 9, 2012

President asks Congress to authorize iniRal network of up to 15
Manufacturing InnovaRon InsRtutes
President directs Agencies to work together on Pilot InsRtute,
while designing InsRtutes with input from Industry and Academia

DoD and DOE

Established InsItutes
America Makes (The NaRonal AddiRve Manufacturing InnovaRon
InsRtute)DoD-Led; Established August 2012
Power America (Next GeneraRon Power Electronics Manufacturing
InnovaRon InsRtute)DOE-Led; Announced January 2014
Digital Manufacturing & Design Innova?on Ins?tute (DMDII)DoD-Led;
Established February 2014
LIFT -- Lightweight Innova?ons for Tomorrow (Lightweight & Modern
Metals Manufacturing InsRtute)DoD-Led; Established February 2014
Ins?tute for Advanced Composites Manufacturing Innova?on (IACMI)
DOE-Led; Established January 2015
AIM Photonics American Ins?tute for Manufacturing Integrated
PhotonicsDoD-Led; Established July 2015
Flexnet (San Jose)-Flexible Hybrid Electronics DOD-Led; Established
August 2015

America Makes The NaIonal AddiIve

Manufacturing InnovaIon InsItute
Est. August 2012; Hub locaIon: Youngstown, OH
Lead: NaIonal Center for Defense Manufacturing
and Machining (NCDMM)
Regional locaIon: TechBelt Cleveland to
Pi,sburgh Corridor
53 companies, 36 universiRes & labs, 26 other organizaRons
$50M federal investment and 1:1 cost share pledged to support
development and management of the insRtute plus applied research
projects over 5 years
22 research projects underway with $13.5M federal funds plus $15M
private funds so far
Industry entrusted 14 machines to the insRtute
Strong tech transiRon, workforce educaRon &
STEM focus
Vision: Accelerate addiIve manufacturing
innovaIon and widespread adopIon by bridging
the gap between basic research and technology
development/deployment.
Government POC: Dr. Jennifer Fielding, Jennifer.elding@us.af.mil
InsRtute POC: Ed Morris, ed.morris@ncdmm.org
Website: hhps://americamakes.us/

10

Power America
Lead: North Carolina State University
ABB, Arkansas Power Electronics InternaRonal, Cree,
Deere & Company, Delphi AutomoRve, Mechatronics,
Monolith Semiconductor, Toshiba InternaRonal,
Transphorm, United Silicon Carbide, Vacon, Arizona
State University, Florida State University, University
of California-Santa Barbara, Virginia Tech, NaRonal
Renewable Energy Lab, Naval Research Lab

Mission: Develop advanced

manufacturing processes that will
enable large-scale production of
wide bandgap semiconductors,
which allow power electronics
components to be smaller, faster
and more efficient than silicon.

Government POCs: Rob Ivester, Robert.Ivester@ee.Doe.Govl

Kelly Visconti, Kelly.Visconti@EE.Doe.Gov
Website: https://www.ncsu.edu/power/

Poised to revolu$onize the energy

eciency of power control and
conversion

UCSB: Mishra

DISTRIBUTION STATEMENT A: Approved for public release; distribution is unlimited. Advanced Manufacturing Office (AMO)

Digital Manufacturing and Design

InnovaIon InsItute (DMDII)
FABRICATE

FABRICATE
FABRICATE

PRODUCT LIFECYCLE
AFTER-
SALES
SERVICE

QUALIFY

FABRICATE
DESIGN

ASSEMBLE

END OF
LIFE
REUSE
RECYCLE

SELL &
DELIVER

110010
11010010010001111011010101111010
10101101101000010100100100011110111110101011110111110100110
010101001101010101101101010100100100101001001000111101010101111011111010111110011101
10110110101010101000001101010101101101010100101001001011110101001000111101010111101111101011111011111011001110
000100101010111101010100100100011110110100010010001101010101101101010100010101011011010110100111101111101011111011111010111110110001011
101111011010011110111011010101010110010110100100011010101011011010101001001000111101010010100100100011110101111111101111101011111011111010111110111110101101011001

DATA ACROSS THE PRODUCT LIFECYCLE

DATA

INFORMATION

DECISIONS

VALUE

Est.: February 2014

Lead: UI LABS
Hub locaIon: Chicago, IL
Federal Funding: $70M
Cost Share (UILabs): $248M

Government POC: Dr. Greg Harris, gregory.a.harris81.civ@mail.mil

InsRtute POC: Dr. Dean Bartles, dbartles@uilabs.org
Website: hhp://dmdii.uilabs.org/

Over 3:1 Industry Cost Share

12

12

LIFT: Lightweight Innova$ons for Tomorrow

(Lightweight and Modern Metals Mfg)
Est. February 2014
Lead: ALMMII (American Lightweight Materials
Manuf. InnovaRon InsRtute)
Hub locaIon: Detroit Metro, Michigan
Regional locaIon: I-75 Corridor
Current number of members: 78
Federal Funding: $70M
Mission: Provide the NaIonal focus on
expanding US compeIIveness and innovaIon,
and facilitaIng the transiIon of these
capabiliIes and new technologies to the
industrial base for full-scale applicaIon.

Government POC: Johnnie Delaoch, johnnie.deloach@navy.mil

InsRtute POC: Larry Brown, lbrown@almmii.org
Website: hhp://lil.technology/

PosiIoned to expand the US Industrial

base for new products and technologies
for commercial and USG demands that
uIlize new, lightweight high-performing
metals
13

Institute for
Advanced Composites Manufacturing Innovation (IACMI)
Federal investment will catalyze a composites
ecosystem in the heart of US manufacturing
$70M - DOE

InsItute Announced
on January 9, 2015

$189M - Other*
122 - Member
Consortium

- 25%

CFRP
Production Cost

- 50%

CFRP Embodied
Energy Savings

- 75%

GHG
Avoidance

- 75%

- 50%
- 50%

6 States
Strong Leadership
5 Focus Areas

*States are significant contributors

Government POCs: Rob Ivester, Robert.Ivester@ee.Doe.Govl
Kelly Visconti, Kelly.Visconti@EE.Doe.Gov
Website: http://iacmi.org/

Jobs

Production
Capacity

American Ins$tute for Manufacturing Integrated

Photonics (AIM Photonics)
Lead: RF SUNY
Hub locaIon: Albany and Rochester, NY
Federal Funding: $110 M
ObjecIve
Develop and demonstrate innovaIve manufacturing
technologies for:
Ultra high-speed transmission of signals for the
internet and telecommunicaIons
New high-performance informaIon-processing
systems and compuIng
Sensors and imaging enabling dramaIc medical
advances in diagnosIcs, treatment, and gene
sequencing
This InsRtute will focus on developing an end-
to-end photonics ecosystem in the U.S.,
including domesRc foundry access, integrated
design tools, automated packaging, assembly
and test, and workforce development.
Government POC: Neil Supola, Neil.d.supola.civ@mail.mil
Website: hhp://manufacturing.gov/ip-imi.html

Reprinted with permission from Intel Corp

All these developments will

require cross-cuQng
disciplines of design,
manufacturing, packaging,
reliability and tes$ng. 15

Flextech: DoD InsItute #5

16

Flexible Hybrid Electronics

Manufacturing Innova$on Ins$tute
$75M federal investment over ve years

Comm
Power
Logic
Sense A, B

Government POC: Dr. Eric Forsythe,

eric.w.forsythe.civ@mail.mil
Website: hhp://manufacturing.gov/re-mii.html

Flexible Hybrid Electronics: Highly tailorable

devices on exible, stretchable substrates
that combine thinned CMOS components
with components that are added via
prinRng processes. This technology is
idenRed as exible-hybrid due to
integraRon of exible components such as
circuits, communicaRons, sensors, and power
with more sophisRcated Silicon based
processors.
Commercial

DOD Applications

Wearable
Technologies

Warfighter information
devices and sensors

Internet of Things

Unattended sensors,
vehicle borne sensors

Medical
prosthetics,
medical sensing

Warfighter Training and

performance monitoring.
Soldier medical care

Chabinyc, Cheng,

16

FlexTech

17

InsItutes in AcIve AcquisiIon

DOD-Led
RevoluRonary Fibers and TexRles Manufacturing
InnovaRon InsRtute
FOA released May 2015
InsRtute award anRcipated Nov/Dec 2015

DOE-Led
Smart Manufacturing InsRtute for Energy Eciency
FOA released September 17, 2015

Fourth DOE-led insRtute being planned

18

DoD InsItute #6

Revolu$onary Fibers and Tex$les

Manufacturing Innova$on Ins$tute
$75M federal investment over ve years
RevoluRonary Fibers and TexRles

Transportation Covers and Airbags Geosynthetics Construction

Advances in ber science have created bers with

extraordinary proper?es of strength, ame resistance, and
electrical conduc?vity. These revolu?onary bers are
composed of specialty fabrics, industrial fabrics, e-tex?les, and
advanced tex?les. They are built upon a founda?on of
synthe?c and/or mul?-material bers that have a wide-range
of applica?ons in both the defense and commercial sector that
go beyond tradi?onal wearable fabrics

Objective:

Military and Commercial Shelters

Serve as a public-private partnership between

government, academia and industry to address
manufacturing challenges from design to end products
Support an end-to-end innovation ecosystem in the U.S.
for revolutionary fibers and textiles manufacturing and
leverage domestic manufacturing facilities to develop and
scale-up manufacturing processes

Military and Commercial Smart Clothing

Provide rapid product realization opportunities, based on

robust design and simulation tools, pilot production
facilities, a collaborative infrastructure with suppliers, and
workforce development opportunities through targeted
training and curriculum programs
Government POC: Steve Luckowski,
stephen.l.luckowski.civ@mail.mil
Announcement Expected Dec 2015
Website: hhp://manufacturing.gov/rl-
mii.html

19

Building the NNMI Network:

Network Status and Growth Plans

INSTITUTES IN COMPETITION/DEVELOPMENT

Revolu?onary
Fibers &
Tex?les
Proj. Award:
December 2015

Smart Mfg.
for Energy
Eciency

LIFT
Light/Modern Metals
Detroit, MI

Topic
TBA

DMDII
Digital Mfg.
Chicago, IL
FHE MII
Flex. Hybrid Elec.
San Jose, CA

AIM Photonics
Albany &
Rochester, NY

Proj. Award TBD

ESTABLISHED INSTITUTES

Full Network Goal: 45 Regional Hubs

America Makes
Addi?ve Mfg.
Youngstown, OH

IACMI
Adv. Composites
Knoxville, TN

Other InsItutes in FY16 Planning:

Open topic competition addressing
white space between mission agency
topics
Selected topic competitions supporting Agency
mission using agency authorities and budgets

Power America
Electronics
Raleigh, NC

Dept. of Commerce Planning:

FY17-26 Central (DOC-managed)
fund proposed for remaining
insItutes, via open topic process
20

Summary:
A U.S. Game Changing Opportunity
Establish a presence, at scale, in the missing
middle of advanced manufacturing research

Create an Industrial Commons, supporRng

future manufacturing hubs, with acRve
partnering between all stakeholders
Emphasize/support longer-term investments
by industry
Combine R&D with workforce development
and training
Overarching Objec$ve: Unleash new U.S.
advanced manufacturing capabili$es and
industries for stronger global compe$$veness
and U.S. economic & na$onal security

21

The Integrated Photonics Manufacturing Institute

Investments : $ 110M Federal / $ 500M Match
Established : July 2015
Location Hub : New York
Lead : SUNY Poly
Investment

Close the Gap

MRL

Goal

Manufacturing
Readiness
Level

10

Create a national institute supporting the endtoend integrated photonics manufacturing ecosystem in the U.S. by
expanding upon a highly successful publicprivate partnership model with openaccess to worldclass shareduse
resources and capabilities

Copyright AIM Photonics 2015

AIM Photonics / Recipient Confidential, for Recipients Internal Use Only

22

The Integrated Photonics Manufacturing Institutes Core Hub

q
q
q
q

1.3M ft2 facility

cutting edge 300/450mm toolset
135k ft2 of class 1 capable cleanroom
processing capability span 65nm - 7nm

Eventual Capability Range

1

Mfg
Basics / Concepts
Identified

Prove of Concepts /
Lab Production
Environment

10

MRL Levels

Component / System / Subsystem Pilot Line Capability High Rate

Prototypes Production
Low Rate
Production
Environment
Production

q
q
q

years of proven silicon photonics results multiple DARPA & Industry projects
300mm tools provide unprecedented quality photonics
unmatched 3D stacking w/CMOS

partnerships drive continuous revitalization investments

Post S-MLD

IV-IV 65nm Si CMOS

InGaAs

300mm Si Photonics Wafer

III-V FINs

Continuously Tunable
Optical Orbital Angular Momentum Generator

Undamaged IIIV FIN

Prior | Post CMP

95nm gap in Si

Copyright AIM Photonics 2015

95nm Si3N4 Taper on

Si Waveguide

AIM Photonics / Recipient Confidential, for Recipients Internal Use Only

InP
65nm

Oxide

23

Institute Organization
Board of Directors

Director

Copyright AIM Photonics 2015

Not-for-prot
Chief ExecuIve Ocer

24

Institute Leadership

Rob Clark
Chair, Leadership Council
University of Rochester

Michael Wahs
Chief Technical Ocer
MIT

Douglas Coolbauch
Chief OperaRng Ocer
SUNY Polytechnic

Michael Liehr
Director and CEO
SUNY Polytechnic

Kim Kimerling
EducaRon & Outreach
ExecuRve, MIT

John Bowers
Deputy Director
UC Santa Barbara

Thomas Koch
Technical Review Board
Chair, University of Arizona

Rod Alferness
Outreach ExecuRve
UC Santa Barbara

Tino Treiber
Deputay Outreach ExecuRve
SUNY Polytechnic

UCSB
Financial: Jane Allen, Whitney Worthington
Industry: Jen McJanet
Events, Web, Admin: Savannah Swartz
EducaRon, Workforce Development: O Aguirre, Arica Lubin
Copyright AIM Photonics 2015

25

Government

Academic

Industry
Tier 1

Tier 1

Tier 2

Tier 2

Tier 3

Tier 3

Trade Associations & Industry Groups

Committed Participants and Supporters Not Yet Tiered

Ind
ust
ry
Ass
oci
aI
on

InsItute Business OperaIons KTMAs

Key Technology Manufacturing Areas (KTMAs)

TWG

TWG

TWG

PI &PM

PI &PM

PI &PM

PI &PM

Integrated Photonic
Sensors

Phased Array
Technologies

VHS Digital Data and

Comm. Links

TWG

Analog and RF
CommunicaIons

Product Feature/Market Roadmaps

Role of KTMAs:
Func$on like business units in a corpora$on
Bring photonic integra$on needs from dierent market applica$on segments
Use Technical Working Groups (TWGs) comprised of ins$tute partners for inputs
Each KTMA has industry, government, and academic co-leads
Select projects that serve as drivers to advance AIM Photonics manufacturing capability
AIM Photonics Proprietary

27

InsItute Business OperaIons MCEs

TWG

PI &PM

Electronic &
Photonic Design
AutomaIon (EPDA)

TWG

PI &PM

MulIProject Wafer
& Assembly (MPWA)

TWG

PI &PM

Inline Control & Test

(ICT)

TWG

PI &PM

Manufacturing Capability &

Design Plavorm Roadmaps

Manufacturing innova$on
Centers of Excellent (MCEs)

Test, Assembly &

Packaging (TAP)

Role of Manufacturing innova$on Centers

of Excellence (MCEs):

Func$on like manufacturing & design
plaforms in a corpora$on
Drive stra$ca$on/matura$on of
photonic integra$on industry ecosystem
Provide baseline capabili$es in each
manufacturing support area (i.e., for
foundry services)
Select projects that maximize synergy
across KTMAs and advance AIM
Photonics manufacturing capacity
Use Technical Working Groups (TWGs)
comprised of ins$tute partners for
inputs
Each MCE has industry, government,
and academic co-leads

28

InsItute Business OperaIons Matrix Model

Matrix Opera$onal Model:

KTMAs leverage baseline

capabili$es of MCEs, but provide
market-driven input to extend
capabili$es of MCEs
MCEs target maximum impact for
investments in each strata of the
manufacturing ecosystem by
seeking synergies across KTMAs
Coordinated advanced project
planning and project management
between KTMAs and MCEs wherever
possible
New KTMAs possible going forward

AIM Photonics Proprietary

29

Institute Stand up / 1st Year Timeline

key milestones outline

Copyright AIM Photonics 2015

AIM Photonics / Recipient Confidential, for Recipients Internal Use Only

30

Education, Workforce, and Roadmap Development

Key Updates

Education, Workforce, and Roadmap Development

Teams Represented by:

Established AIM Academy Council consisting of 10

education, industry, and economic development
experts
Dagli, York

Allan Hancock College

Berkshire Community College
iNEMI
MACOM
Education and Workforce Development (Ed-WFD)
MIT
Roadmap team completed its standup plan
Mesa Community College
Millennium Test Solutions
Written drafts of the roadmap are 67% complete
Monroe Community College
NRL
v currently circulating among experts for
NSF
feedback
Pima Community College
Promex Industries
Internal Workforce Needs Assessment Survey in
Quinsigamond Community College
preparation Future Activities
RIT
Integrated photonics technology roadmap webinars
Springfield Technical Community College
SUNY Polytechnic Institute
scheduled for 10/1 11/15
Synopsys
Third Millennium Test Solutions
All-Institute meeting at MIT on December 7-8
Univ. of Arizona
featuring:
UC Davis
A career fair
UCSB
Univ. of Rochester
Two short courses
U.S.
Army
ReleaseDirector
of the first o
Integrated
Photonics
f Workforce
Development -- M. Ofelia
A
guirre
U.S. Competitors LLC
Technology Roadmap
Needs Assessment -- Lubella LVentura
enaburg
County Community College District

A technical meeting with workshop breakouts

Professional Development -- Arica Lubin

AIM Photonics Proprietary
For Official
Use Only

31

IPC 2014 La Jolla, October 13, 2014

Columbia University
Keren Bergman
Lightwave Research Laboratory

High Radix Switch

Bowers, Alferness, Blumenthal, Schow, Saleh

Optical Switching
Khope, Saleh, Bowers and Alferness

34

EPDA Electronic Photonic Design Automation: Cheng, Xie, Schow, Dagli, Coldren,
Blumenthal, Bowers

Integration with Electronics

3D Stacking
Bump bonded

Off-ch
ip

optica

ptical tr
affic
On-chip
o

l si g n

als

Optic
al

I/O

Schow
Theogarajan
Rodwell

Photonic Plane

Memory Plane
Logic Plane

36

Aurrion, IBM
Postdeadline OFC 2015

Schow, Rodwell,

37

KTMA Project Examples

VHS Digital Datacom & Comm. Links

High radix integrated photonic switch fabric

Advanced 2.5D/3D transceiver interfaces

Chem/Bio Integrated Photonic Sensors

RF & Analog Photonics

Antenna remoIng & passive imaging

Coherent Costas loop & injecIon locking soluIons

Coldren, Klamkin, Bowers

Phased Array Technologies

Beamsteering, LIDAR, and display applicaIons

Drive massive scaling for integrated photonics
Sensors for mobile plauorms
Meinhart,
Moskovits, Bowers
Chip-scale SRS sensors
AIM Photonics Proprietary

Coldren, Bowers
38

Fully Integrated hybrid silicon free-space beam

steering source using a tunable laser phased array
2D Scanning with
- Tunable laser and grating for
- Phased array emitter for

Bowers, Coldren, Watts

1 (wavelength)

4 tunable lasers, 32 amplifiers,

32 phase shifters, 32 photodetectors

N (number of emitters)

39

Examples of Team Technology CapabiliIes

Examples of Team Technology CapabiliIes

3D
d Wafer Stack

2m
Photonics Metal 2

CMOS Metal 5

Density: ~3m pitch

Yield: CNSE has demo yields of >99.999%

Results: Demonstrated the lowest power silicon

photonic communicaRon link to date (250fJ/bit)

AIM Photonics Proprietary

5Gb/s
IL=1dB

ER=5dB

Oxide

Transmission

TOV Electronic-Photonic IntegraIon (MIT-CNSE-UCB) 0

1
q Capacitance: ~1-to-2fF/contact

MIT-CNSE-UCB

(SiPhotonics & 65nm

CMOS, TOVs with no voids)
IL=1dB

ER=5dB

Oxide
Bond

CMOS
Wafer

CMOS
Metal 1-5
Si Handle
Gate

1
Through-Oxide-Via

Transmission

TOV

Silicon
Photonics
Wafer

Photonics
Metal 1-2
Body Si
Ge

12Gb/s
41

Integrated Photonics MPWA Oering

Shared reRcle, targeted at SMEs, DoD and universiRes

Aggregator oers turn-key services

1.
2.

Designer-facing applicaRon engineer

LogisRcs and fab execuRon

Standardized process
q

Interposer with design-for-assembly and test

Pre-validated library of design elements

CustomizaRon with NRE

q

OpRmal for larger customers

AIM Photonics Proprietary

42

Epitaxial Quantum Dot Lasers

MBE: InAs/GaAs and InAs/InP: Gossard, Palmstrom,
Bowers, Liu, Norman
MOCVD: InAs/InP: Klamkin, Bowers, DenBaars, Jenny
Selvidge, Brian Cabinian
Integration with Passive Silicon Photonics
Lower threshold
Lower cost (epitaxial growth on Si)

43

Threshold Current DensiRes of Semiconductor Lasers

m

QD-lasers for lower power

44

D. Bimberg

III-V Laser Growth on Silicon

300 mm Silicon - ~$0.2 cm-2

100 mm InP - ~$4.0 cm-2

SUNY and IQE have

300 mm MOCVD today

(Photo courtesy of Dr. Jordan Lang, Yale)

CMOS processing of photonics is already happening, yet high cost and small size
of III-V wafers remains an issue.
Goal: Grow III-V lasers on larger and cheaper silicon substrates without
sacricing laser performance for lower cost and higher throughput.
[1] Bowers, John E., et al. "A Path to 300 mm Hybrid Silicon Photonic Integrated Circuits. OFC 2014

45

III-V growth on 300 mm Silicon Wafers

GaP on 300 mm Silicon using MOVPE

B. Kunert et al. NAsP III-V GmbH

69th Device Research Conference, Santa Barbara (2011)

GaAs on300 mm Silicon using MBE

Amy Liu, IQE Inc.

Low Thresholds

Uniform threshold current densities across die/wafers.

Low CW threshold (150 A/cm2)
3

40
2

30

1.5

20

1.5
1

1
0.5

10
0
0

937x4 m2
undoped
device.

0
10

100

0.5
15

200
Current (mA)

20

300

25

0
400

Counts

50
40
30
20

300

Threshold Current (mA)

60

2.5

Voltage (V)

Single Facet Power (mW)

50

Voltage (V)
Power (mW)

70

250
200

700800 m
9001000 m
4 11001200 m
2 pdoped
0undoped
1 2

150
100
50
0
4

10

12

Ridge Width (m)

10
0

500
1000
1500
2000
2
Threshold Current Density (A/cm )

Liu, Alan Y., et al. "High performance continuous wave 1.3 m quantum dot lasers on silicon."
Applied Physics Letters 104.4 (2014): 041104.

47

High Output Powers

CW powers over 100 mW routinely achieved.
Nearly 180 mW maximum CW single side output power at 20 oC from
HR coated 1130x10 m2 intrinsic active region (undoped) device.
33% differential efficiency and 18% WPE (at 150 mA)

140
120

160

100
80
60
40

Voltage (V)
Power (mW)

2.5

140
120

100

1.5

80
60

1130x10 m2.
36 mA threshold

40

0.5

20

20
0
200

300

400
500
600
700
Drive current at Pmax (mA)

800

900

0
0

Voltage (V)

Single Side Pmax (mW)

160

180
700800 m
5 9001000 m
11001200 m
pdoped
0
0 undoped
1
2

Single Facet Power (mW)

180

200

400
600
Current (mA)

800

48

High Temperature Performance

P-doping the active region improves thermal performance.[1]
Continuous wave lasing up to 119oC
(dual state lasing at high currents/temperatures).
With p-doping

Without p-doping

30

Single Facet Power (mW)

25
20

20C
30C
40C
50C
60C
70C

115C
118C
119C
120C
2

1.5

15
1

10
0.5

993x5 m2
0
0

100

0
200

200
Current (mA)

250

300

300

400

[1] Alexander, Ryan R., et al. "Systematic study of the effects of modulation p-doping on 1.3-m quantum-dot lasers."
Quantum Electronics, IEEE Journal of 43.12 (2007): 1129-1139.

49

Moores Law for Photonics

50

AIM Photonics Academy

AIM Academy Council: 10 educaRon, industry and economic development experts;

idenRfy exisRng Ed-WFD gaps and advise on new programming to ll those needs.

Models: NSF and SRC

Metrics: Deployment, adopRon, upgrades, NaRonal reach and
diversity of audience.
AIM Photonics Proprietary

51

Workforce Development

Mission: Inspire, ahract and retain community college, undergraduate,

graduate students and veterans through career transiRons to the PIC industry.
q Develop accessible career pathways with on-ramps and o-ramps for all supply
chain skill levels.
q Create transiRons between Academy programs and private sector employment
through coordinated internships, apprenRceships and hands-on experiences in
AIM and AIM-partner prototyping and manufacturing faciliRes.
AIM Photonics Proprietary

52

Foundry PICs Processes and IntegraIon

q

Wafer Fab Sources

1.

SUNY Poly 300mm Si-PICs

n

Op?onal: with 65nm CMOS

2.

Aurrion 200mm Si-PICs

3.

Innera InP-PICs

Plan: SUNY Poly IBM integrated process

q

Interposer IntegraRon
1.

SUNY Poly mulR-chip and light source integraRon

2.

Aurrion PIC integraRon

Package and Assembly

1.

Samtec

Aurrion

2.

Promex, SMEs and AIM site in Rochester

q Considering move to 300mm

FuncRonal at-Speed Test

1.

Columbia University

AIM Photonics Proprietary

q Demand based availability

Innera

q Ini?al oering is for dedicated runs

q Some customer limita?ons

53

Hybrid Silicon Record Performance

2011 Lowest waveguide loss on silicon: 0.04 dB/m Jared Bauters et al.
2012 Best reliability: >40,000 hours at 70C Srinivasan et al.
2012 Highest laser yield: 99% Srinivasan et al.
2012 Fastest Si modulator: 74 GHz Tang et al.
2013 Highest receiver capacity: 400 Gbit/s Piels et al.
2013 Largest laser array bandwidth: > 200 nm Jain et al.
2012 Highest level of integration with lasers: 164 devices Jared Hulme et al.
2014 Largest LED bandwidth: >200 nm DeGroote et al.(Ghent and UCSB)
2014 Highest temperature: 119C Alan Liu et al.
2014 Highest power: 180 mW Alan Liu et al.
2014 Lowest threshold: 2 mA Liang et al. (HP)
2014 Narrowest linewidth: 9 kHz (NEC)

Applications of Silicon Photonics

Bio-medicine
Laser machining
Atom traps
Nuclear reactors

High
Power

Low
Threshold

175 mW

Optical
interconnects
Telecom
Analog Photonics

2 mA

Highly
Reliable
40,000 hours
Telecom/Datacom
Sensors
Any high volume
manufacturing

Narrow
Linewidth
9 kHz

Low cost
164 Optical + Millions
Electrical Devices
Telecom/Datacom
Sensors

Coherent communication
Meterology
Spectroscopy
Bio-medicine
LIDAR
Microwave generation