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n = 1350 cm2/Vs
p = 480 cm2/Vs
Ln = 10-2 cm
Lp = 2 10-3 cm
ND = 1015 1/cm3
Dn
Ln
Dp
Dn
= 1016 1/cm3.
+
I o = A q ni2
2,5 pA, then for N A
Dp
L p N D Ln N A
2
I o Aqni
Lp N D
b.
What should the widths of n and p type doped areas (dn and dp) be for bulk resistances to be Rn =
1 and Rp = 0,25 , respectively? (15 points)
HINT: Rn / p =
n/ p
dn/ p
A
n/ p
dn/ p
A
ni2
;
We know p = q
N
+
n
A
p
N
ni2
n = q NDn +
p Thus p = 0,769 1/( cm) and
ND
n = 0,216 1/( cm). Inserting these into the hint equation and reorganizing it we obtain
d n / p = n / p Rn / p A . Thus dn = 0,226 cm = 2,26 mm and dp = 19,2 m. OBSERVE THE
DIFFERENCE IN LENGTHS OF n AND p TYPE DOPED REGIONS!!!!
c.
Calculate the total depletion layer thickness and capacitance without any bias voltage applied to
this junction. (10 points)
NA ND
n2
i
From V B = VT ln
2 o r VB
q
1
1
+
NA ND
= 94.5 m.
SEE THAT NEGLECTING THE WIDTH OF THE DEPLETION LAYER IN p TYPED REGION IN
PART (a) HAS NOT BEEN A GOOD IDEA!!!!
Inserting the values into C = o r
A
we obtain C = 112 pF.
w
Device
IC
(mA)
IB
(mA)
IE
(mA)
2,0
2,0
1,0
0,01
1,4
1,01
0,99
100
0,5
0,0025
1,2
0,51
0,98
200
0,8
0,08
0
0,8
IE = ( + 1) IB
IC = IB
= IC / IE
5k1
V2
V1
b.
9k1
T1
V5
100k
T2
V3
V4
9k1
4k3
-10V
I C1 = hFE
VCC (V BE1 )
= 0,93 mA. V1 = IB1*100k = 0,93 V and V2 = 1,53 V.
100k + hFE 9k1
I C 2 = hFE
9k1 * I C1 VBE 2
= 1,77 mA. V3 = -VEE + 9k1 (IC1 IB2) = -1,70 V.
9k1 + (1 + hFE )4k 3