Beruflich Dokumente
Kultur Dokumente
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Ceramic Packages
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Dual
In-Line
Pin Grid
Array
CerQuad
Flat Pack.
DIL 8
DIL 14
DIL 16
DIL 18
DIL 20
DIL 24
DIL 28
DIL 40
DIL 48
PGA 68
PGA 84
PGA 100
PGA 120
PGA 144
PGA 160
PGA 180
PGA 208
PGA 224
PGA 256
CQFP 20
CQFP 28
CQFP 44
CQFP 64
CQFP 68
CQFP 84
CQFP 100
CQFP 120
CQFP 128
CQFP 144
CQFP 160
CQFP 208
CQFP 256
Gregory.DiPendina@imag.fr
Leadless
& J-Leaded
Chip Carrier
LCC 16
LCC 20
LCC 28
LCC 32
LCC 44
LCC 68
LCC 84
Small
Outline
SOIC 8
SOIC 16
SOIC 20
SOIC 24
SOIC 28
JLCC 28
JLCC 44
JLCC 52
JLCC 68
JLCC 84
CMP annual users meeting, January 10th 2008, PARIS
Plastic Packages
(1/2)
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Leaded
QFP Family
Plastic Leaded
Chip Carrier
PLCC 20
PLCC 28
PLCC 44
PLCC 68
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Metric Quad
Flat Package
MQFP 80
MQFP 100
MQFP 128
.
.
.
MQFP 240
MQFP 256
Gregory.DiPendina@imag.fr
Thin Quad
Flat Package
Low Quad
Flat Package
Small
Outline
TQFP 32
TQFP 44
TQFP 48
.
.
.
TQFP 160
TQFP 176
LQFP 32
LQFP 44
LQFP 48
.
.
.
LQFP 160
LQFP 176
SOIC 8
SOIC 14
SOIC 16
SOIC 20
SOIC 22
SOIC 24
SOIC 28
Plastic Packages
(2/2)
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Plastic
Ball Grid Array
Fine pitch
Ball Grid Array
Quad Flat
No lead
TSSOP 20
TSSOP 24
TSSOP 28
TSSOP 38
PBGA 204
PBGA 217
PBGA 225
PBGA 250
PBGA 313
PBGA 352
PBGA 420
PBGA 456
FBGA 81
FBGA 108
FBGA 144
FBGA 160
FBGA 196
FBGA 208
FBGA 225
FBGA 256
FBGA 280
QFN 8
QFN 10
QFN 12
QFN 16
.
.
.
QFN 64
QFN 72
QFN 80
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Gregory.DiPendina@imag.fr
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STEP 1
Dummy Package
STEP 2
STEP 3
Open Cavity
Wire Bonding
STEP 4
Remolding or Lid
& Marking
Advantages:
- Open cavity packages enable smooth transfer to plastic packaging
packaging process
- Price for small quantities up to 2020-40 dies
- Open cavity process is universal and can be applied to any plastic
plastic IC package:
BGA, QFP, QFN, PLCC, SOIC, TSSOP and more
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Gregory.DiPendina@imag.fr
Package Guidelines
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Ceramic or Plastic ?
Prototyping:
CMP recommends to use ceramic packaging
Advantages: Price for small quantities
Removable lids
Flexible constraint (wire length, ground bonds, die thickness)
thickness)
Thermal, HighHigh-Reliability (Space qualification)
Low volume:
CMP recommends to choose the plastic package
Advantages:: Low cost from 20Advantages
20-40 packaging (open tool only)
Access to density solutions for low price (QFN, PBGA)
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Gregory.DiPendina@imag.fr
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Standard Rules
76 x 76
85 x 85
55 x 55
10
15
10
86
100
65
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Gregory.DiPendina@imag.fr
Cha pitr e
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Gregory.DiPendina@imag.fr
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Soon: Data sheets available for customers throught the web customer interface
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Gregory.DiPendina@imag.fr
Packaging Technologies
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CQF
.
N
F
P, Q
Wire Bonding
Sta
Mul t c ked di e
i-Stac
s
ked
die s
e
Wa f
i ng
p
m
r Bu
Flip-Chip
Di e
B
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Gregory.DiPendina@imag.fr
ump
i ng
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Gregory.DiPendina@imag.fr
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Pad opening need to be about 3 times larger than the wire diameter
diameter
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Gregory.DiPendina@imag.fr
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Gregory.DiPendina@imag.fr
FLIP CHIP
WIRE BONDING
Moderate cost
Reliability
Compatibility housings
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Gregory.DiPendina@imag.fr
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Density Solutions
CSP package => Naked die occupies 80% or more of the package
Electrical performance is enhanced due to shorter interconnections
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Gregory.DiPendina@imag.fr
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0.9 mm
DIE
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Gregory.DiPendina@imag.fr
Solder Plating
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Gregory.DiPendina@imag.fr
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Ceramic BGA
Body size: 35 mm x 35 mm
420 I/Os
Thickness: 1.8 mm
Ball pitch: 1.27 mm
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Gregory.DiPendina@imag.fr
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Organic BGA
Body size: 31 mm x 31 mm
304 I/Os
Pad size: 34 um x 108 um
Pad pitch: 78 um
Ball pitch: 1.27 mm
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Gregory.DiPendina@imag.fr
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50
40
30
20
10
0
2004
DIL
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PGA
Gregory.DiPendina@imag.fr
2005
LCC
2006
JLCC
QFN
2007
QFP
SOIC
BGA
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50
45
40
35
30
25
20
15
10
5
0
2004
2005
2006
2007
DIL
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PGA
Gregory.DiPendina@imag.fr
LCC
JLCC
QFN
QFP
SOIC
Packaging Analysis
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Gregory.DiPendina@imag.fr
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Extracted
circuits
Visual
Inspection
Naked Dies
on Sticking film
Sawing
8 or 12 Wafer
Loading in
Waffle Pack
Packaging
Plastic
Packaging
Ceramic
Packaging
Turnaround: 2 weeks
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Back lapping
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Gregory.DiPendina@imag.fr
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Antistatic Tubes:
Antistatic Bags:
Protection against the electrostatic discharge
Surface Resistance (ohms) :108-109
Antistatic Boxes:
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Gregory.DiPendina@imag.fr
cmp@imag.fr
http://cmp.imag.fr