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Electronics Cooling
14. 5 Release
Introduction to ANSYS
CFD Professional
2013 ANSYS, Inc.
Release 14.5
Introduction
This workshop models the heat dissipation from a hot electronics
component fitted to a printed circuit board (PCB) via a finned
heat sink. The PCB is fitted into a casing, which is open at the top
and bottom.
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
2
Postprocessing
Summary
Release 14.5
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
3
Postprocessing
Summary
Release 14.5
Options
In the tree expand Case Options, double-click
General and ensure that Automatic Default
Domains is switched on and Automatic
Default Interfaces is active
Set the Interface Method to One Per Domain
Pair
Click OK
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
4
Postprocessing
Summary
Release 14.5
Fluid Domains
First add a domain for the fluid region.
Right-click on Flow Analysis 1 and insert a new domain
named Fluid
Set the Location to Fluid
Set the Material to Air at 25 C
Click the Fluid Models tab
Set the heat transfer option to Thermal Energy and
turbulence option to k-Epsilon
Click OK
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
5
Postprocessing
Summary
Release 14.5
Creating Materials
CFX contains a library of many materials, but for this case we will create user materials
for the component and Printed Circuit Board (PCB).
Setup
December 12, 2013
Solving
6
Postprocessing
Summary
Release 14.5
Creating Materials
Repeat the material creation steps on the previous page to
make a new solid material, named PCBMat
Density = 1250 [kg m^-3]
Specific Heat Capacity = 1300 [J kg^-1 K^-1]
Thermal Conductivity = 0.35 [W m^-1 K^-1]
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
7
Postprocessing
Summary
Release 14.5
Solid Domains
Insert a new domain called HeatSink
Set the Location to HeatSink
Set the Domain Type to Solid Domain with the Material set to Aluminium
Click OK to create the domain
You may see some red physics warnings indicating an update to conditions is required.
These messages will go away when the Wall boundaries are created later on and can be
ignored for now.
When all 4 domains are created the Default Domain will automatically be removed from
the tree. Separate interfaces between each domain will have been automatically
created, rather than combined into a single interface
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
8
Postprocessing
Summary
Release 14.5
Energy Source
The component is generating 75 W of heat, which must be added to the simulation. To
add this energy source in CFX, a subdomain must be created
Setup
December 12, 2013
Solving
9
Postprocessing
Summary
Release 14.5
Boundary Conditions
For this case all of the heat will be extracted by the air passing over the heat exchanger. So all solid
walls will be defined using adiabatic settings. Within the simulation heat can be transferred
between all of the solid and fluid domains because interfaces have been automatically created.
Right-click on the domain called Fluid and insert a new boundary called
Walls and set the Boundary Type to Wall
Set the Location to Wall
Switch to the Boundary Details tab and check that Heat Transfer is set to
Adiabatic
Click OK
In the PCB domain rename PCB Default to PCBwalls and check that Heat
Transfer is set to Adiabatic
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
10
Postprocessing
Summary
Release 14.5
Boundary Conditions
The flow of air cooling the component will be driven by forced convection. A fan will draw air
through the upper boundary at a rate of 5 m3 min-1. This will be implemented as a mass flow outlet
using an expression. Flow into the domain will be through an opening boundary on the lower face.
The steps below explain how to set the inflow boundary.
Setup
December 12, 2013
Solving
11
Postprocessing
Summary
Release 14.5
Boundary Conditions
For the outlet boundary representing the fan, we need to convert the known volumetric flow rate
(5 m3 min-1) into a mass flow.
In the Fluid domain rename the boundary, Fluid Default, to Fan and open it for
editing
On the Basic Settings tab change the Boundary Type to Outlet
In the Boundary Details tab set the Mass and Momentum option to Mass Flow
Rate
For the mass flow rate provide the expression 5 [m^3 min^-1]*1.185 [kg m^-3].
The density of Air at 25 C is 1.185 kg m-3.
Click OK
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
12
Postprocessing
Summary
Release 14.5
Solver Control
From the tree right-click Solver Control and
select Edit
Increase the Max. Iterations to 500
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
13
Postprocessing
Summary
Release 14.5
Output Control
We are interested in the temperature
reached in the Component and so will create
a monitor to track the maximum value
Click OK
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
14
Postprocessing
Summary
Release 14.5
Setup
December 12, 2013
Solving
15
Postprocessing
Summary
Release 14.5
Opening CFD-Post
In the Project Schematic double-click on the Results cell
B3, or right-click and choose Edit, to open the
completed results in CFD-Post
The results for a simulation
with a higher ventilation rate
of 7.5 m3 min-1 are also
available in the results
folder. In CFD-Post we can
compare the two runs.
Load the second results file by
selecting File > Load Results...
and select CFX_002.res. When
CFD-Post is run from
Workbench, the option Keep
current cases loaded is active
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
16
Postprocessing
Summary
Release 14.5
Temperature
Temperature is a key variable for any electronics cooling application. So we will display it in
several locations, such as within the flow, on the surfaces of the solid region and by extracting the
maximum temperature within the component. When these plots are created they appear in the
User Locations and Plots section of the tree.
Click on
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
17
Postprocessing
Summary
Release 14.5
Temperature
To create a plot of the differences
between the two results, we will
switch on Case Comparison
Doubles click on Case Comparison in
the Outline Tree and in the details
check the box by Case Comparison
Active
The plots are shown on the next
slide. CFX_001, the lower flow rate,
is on the left-hand side.
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
18
Postprocessing
Summary
Release 14.5
Temperature
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
19
Postprocessing
Summary
Release 14.5
Temperature
In the run set up in this workshop, the maximum
temperature of the Component was monitored. We
will now calculate this value for the two simulations
along with the difference between them
Function: maxVal
Location: Component
Case: All Cases
Variable: Temperature
Click Calculate
Introduction
2013 ANSYS, Inc.
Setup
December 12, 2013
Solving
20
Postprocessing
Summary
Release 14.5